US6037565A - Laser illuminator and optical system for disk patterning - Google Patents
Laser illuminator and optical system for disk patterning Download PDFInfo
- Publication number
- US6037565A US6037565A US08/665,275 US66527596A US6037565A US 6037565 A US6037565 A US 6037565A US 66527596 A US66527596 A US 66527596A US 6037565 A US6037565 A US 6037565A
- Authority
- US
- United States
- Prior art keywords
- laser
- spots
- array
- pulse
- producing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
Definitions
- the present invention relates to magnetic recording media, and more specifically, it relates to systems for controllably patterning magnetic recording disks.
- Magnetic recording disks are required to have areas which are controllably textured, especially areas where the transducing head is allowed to contact the disk.
- the texturing reduces the friction encountered by the head during the "spin up" allowing more rapid disk activation and reduced wear on the heads.
- the texturing is accomplished in an off line step prior to the main manufacturing which occurs in the disk sputtering system. This texturing is currently done with an abrasive grit based process and requires costly cleaning of the disk prior to insertion into the sputtering system.
- the invention uses a diffractive optic to generate thousands of appropriately distributed spots with a single laser pulse. This pattern of spots is rotated to a new position by rotating the diffractive optic and a deflecting prism or by rotating the disk itself. A mask can be used in front of the disk to precisely define the area that is marked. A laser timing system precisely fires the laser when the pattern (or disk) is rotated to the appropriate position. Using this process a complete textured pattern can be printed in a few seconds.
- This system for patterning magnetic recording media includes a laser for producing a laser beam and a beam expanding telescope for producing an expanded laser beam.
- An optical assembly is positioned to recieve the laser beam, and the assembly includes a phase plate having a binary surface relief pattern designed to produce a near-equal intensity spot array.
- the assembly also includes a lens and a deflection wedge.
- the diffraction grating, lens and deflection wedge are mounted in tandem on the inner surface of a cylindrical optical mount.
- the system includes a method to precisely determine the focal position of the focusing lens.
- An alignment disk has a central opening that is attached to the outer surface of the cylindrical mount.
- the alignment disk has 18 index holes evenly spaced along its outer perimeter, and the outer radial edge of the alignment disk includes a first set of gear teeth.
- the alignment disk is rotated by a system including a motor with a shaft connecting the motor to a gear member with a second set of gear teeth which mesh with the first set of gear teeth.
- a triggering system provides a trigger pulse to the laser when a photodiode detects a trigger beam from a light emitting diode.
- FIG. 1A shows an embodiment of the laser patterning system where the array of spots rotates to produce an annular pattern on the magnetic recording media.
- FIG. 1B shows a means for precisely focusing an array of spots.
- FIG. 2 shows the alignment disk with index holes.
- FIG. 3 shows a contiguous repetition of unit cells in x- and y-directions on the phase plate.
- FIG. 4 shows the optical pattern produced by one such Dammann grating.
- FIG. 5 shows an embodiment of the laser patterning system where the magnetic recording media rotates and the array of spots is stationary to produce an annular pattern on the magnetic recording media.
- the invention includes an illumination system that produces an annular pattern of spots.
- 10 micron diameter spots are spaced 50 ⁇ m in the radial direction and 100 ⁇ m along the arc length.
- the annulus diameter is 35 mm.
- the pattern is made by an adjoining set of annular sections each with 17.5 mm inner radius, 3 mm thickness and an arc length of 6.11 mm (20° arc length). Thus each segment consists of an array of 60 ⁇ 60 spots.
- the annulus will be completed with 18 segments.
- the illumination system comprises a laser source followed by an optical system to produce the array of spots.
- This optical system contains a specially designed phase plate to produce the desired annular array of spots.
- a deflection wedge designed to place the spot array segments at the appropriate radius.
- a beam expansion telescope is placed between the diffraction optics and the laser source to produce the required laser beam diameter to achieve a speckle size appropriate to the 10 ⁇ m spot diameter for the multiple spots in the far field.
- the illumination system will produce an array segment of 60 by 60 holes (3600) on each laser pulse.
- the assembly will be rotated by a planetary gear assembly allowing the deflection wedge (prism) to rotate the projected laser pattern systematically around the annulus. When the annulus is completed with 18 segments, the assembly will be rotated 20° per pulse.
- the laser patterning system comprises a laser 10 having an output beam 12 that is expanded with e.g., a beam expanding telescope 14 having two positive optics 16, 18.
- the expanded beam 15 then enters a rotatable optical assembly 17 comprising a specially designed phase plate 20, a focusing lens 21 and a deflection wedge 24.
- phase plate 20 introduces phase aberrations in the expanded beam 15 in a manner discussed below, to produce an array of spots on the disk 44.
- the lens focuses the wavefront, transforming at its focus the phase information imprinted on the beam by the phase plate into the desired pattern of spots.
- a motor 30 with shaft 32 turns a planetary gear train 34 which drives alignment disk 28.
- Shaft 32 may include a precision encoder to provide position information of the array of spots relative to the magnetic recording media.
- the laser 10 is triggered by triggering electronics 36 when light from a light emitting diode 38 is detected by photodiode 40 after passing through the index holes 42 (FIG. 2) of alignment disk 28.
- An opaque mask 45 may be used in front of the disc 44 to precisely define the area that is to be marked.
- the system includes a method to precisely determine the focal position of the focusing lens 21.
- a confocal reflector 43 placed at the image plane (where the magnetic recording media 44 of FIG. 1A should be placed), and a beamsplitter 90 operatively placed between the phase plate 20 and the focusing lens 21 such that light reflected from the beamsplitter 90 will pass through a shear plate 92, parallel fringes will be produced in the shear plate 92 when the reflector 43 is positioned at the focus of the lens 21.
- the reflector 43 will be precisely positioned when the fringes are aligned with the reference on the shear plate.
- a CCD camera 94 or equivalent and monitor 96 may be positioned to observe the fringes.
- the laser 10 To transmit 4 ⁇ J per pulse to 10 ⁇ m diameter spots at disk 44 (assuming a working margin of 2) will require that laser 10 provide 20 mJ per pulse.
- the laser 10 must have a pulse length of 5 to 50 ns and output pulses at a rate of 6 Hz.
- the optical system 17 is mounted onto disk 28 which is configured to slowly rotate through a complete annulus of the pattern projected onto disk 44 in 3 seconds.
- the index holes 42 of disk 28 must be precisely placed to coincide with laser fire points.
- the light emitting diode 38 and detector 40 are positioned to generate a trigger signal when the wheel rotates into correct position. This will be accomplished by rotating the rotatable optical assembly 17 at 1/3 Hz rate and precisely in time firing the laser when the assembly has appropriately rotated to the next position. This system will place the laser spots with several micron accuracy.
- the phase plate 20 is designed to produce a laser spot array on the disk 44 and consists of a contiguous repetition of unit cells 50 in x- and y-directions as shown in FIG. 3. Each unit cell in turn consists of a distribution of regions that introduce phase delays of 0 or ⁇ to the beam. Since only two values of phase delay (0 or ⁇ ) are impressed upon the beam, such a phase plate is known as a binary phase plate. The 0- ⁇ phase transition locations within each zone are chosen such that the intensities at the central m orders are nearly equal. The procedures for designing such phase plates (also known as Dammann gratings) are described elsewhere in the literature. The example shown in FIG. 3 leads to a 7 by 7 near-equal intensity spot array in the focal plane. In the actual use for disk patterning, the phase plate is designed to produce a 60 by 60 spot array.
- the separation of the spots and the size of each individual spot can be calculated as follows. If d denotes the size of each unit cell and D the size of the expanded beam, then the spots are separated by the consecutive grating orders ( ⁇ f/d).
- the spot size is determined by the diffraction limited size of the full beam (2 ⁇ f/D).
- ⁇ denotes the laser wavelength and f the focal length of the lens.
- the spot separation can be controlled by changing the size of the unit cell (d) and the spot size can be controlled by varying the beam size (D).
- the efficiency of the binary Dammann grating defined as the ratio of the amount of energy contained among the desired equal intensity spots to the total incident beam energy, is about 45%. The remainder of the incident energy is scattered into a large number of diffraction orders. This energy loss can be reduced if a multi-level phase grating is used to generate the spot array. Such a phase grating would have a continuously varying phase within each unit cell. The design and manufacturing of such gratings is more difficult and time consuming than a simple binary grating. However, for a commercial process in which many gratings would be required, it would only be necessary to design, expose and etch a negative master grating and then as many as required replica gratings could be made.
- the binary phase plate can be fabricated in fused silica using photolithographic techniques.
- the fused silica substrate is coated with photoresist.
- a binary transmission mask is prepared on a piece of acetate film. The transmitting and opaque regions correspond to 0 and ⁇ phase delay regions on the phase plate.
- the coated photoresist is exposed through this binary mask and the exposed part is developed away.
- the unexposed photoresist acts as a protective layer for fused silica during the etch step where a precise thickness of the silica substrate is removed by etching it in a buffered hydrofluoric acid solution. The required etch depth is given by ⁇ /(n-1) where n is the substrate refractive index at the operating wavelength ⁇ .
- the remaining photoresist is washed off leaving a binary etch pattern in fused silica.
- the optical pattern produced by one such Dammann grating is shown in FIG. 4.
- a single laser beam is diffracted into a 7 ⁇ 7 array of near uniform intensity beams.
- the output of the laser beam is expanded to nearly fill the 10 cm by 10 cm grating.
- the diffracted light is collected and focused by an appropriate short focal length lens producing in the far field, the pattern shown in FIG. 4.
- this pattern can be used to print 49 spots with each laser pulse.
- the magnetic recording media 44 may be rotated while the optical assembly 17 is held in a fixed position.
- a motor 30 with shaft 60 turns a planetary gear train 34 which drives the magnetic recording media 44.
- Shaft 60 may include a precision encoder to provide position information of the array of spots relative to the magnetic recording media. This precision position information is used by triggering electronics 36 to triggers laser 10 thus providing a sychronized laser pulse to the system.
- the synchronized pulse of laser light 12 is expanded by beam expanding telescope 14, passes through phase plate 20 and lens 21, and may the be deflected by deflection wedge 24 or this element may be omitted, and the beam 15 exiting focusing lens 21 may be off-set from the center of rotation of the magnetic recording media, to provide an annular array of spots on the rotating magnetic recording media.
- a shear plate may be used to precisely focus the system.
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
Description
Claims (22)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/665,275 US6037565A (en) | 1996-06-17 | 1996-06-17 | Laser illuminator and optical system for disk patterning |
TW086108219A TW463164B (en) | 1996-06-17 | 1997-06-13 | Laser illuminator and optical system for disk patterning |
PCT/US1997/010345 WO1997048519A1 (en) | 1996-06-17 | 1997-06-17 | Laser illuminator and optical system for disk patterning |
AU34880/97A AU3488097A (en) | 1996-06-17 | 1997-06-17 | Laser illuminator and optical system for disk patterning |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/665,275 US6037565A (en) | 1996-06-17 | 1996-06-17 | Laser illuminator and optical system for disk patterning |
Publications (1)
Publication Number | Publication Date |
---|---|
US6037565A true US6037565A (en) | 2000-03-14 |
Family
ID=24669446
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/665,275 Expired - Fee Related US6037565A (en) | 1996-06-17 | 1996-06-17 | Laser illuminator and optical system for disk patterning |
Country Status (4)
Country | Link |
---|---|
US (1) | US6037565A (en) |
AU (1) | AU3488097A (en) |
TW (1) | TW463164B (en) |
WO (1) | WO1997048519A1 (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020149136A1 (en) * | 2000-09-20 | 2002-10-17 | Baird Brian W. | Ultraviolet laser ablative patterning of microstructures in semiconductors |
US6518540B1 (en) | 1998-06-16 | 2003-02-11 | Data Storage Institute | Method and apparatus for providing ablation-free laser marking on hard disk media |
US20060091126A1 (en) * | 2001-01-31 | 2006-05-04 | Baird Brian W | Ultraviolet laser ablative patterning of microstructures in semiconductors |
EP1779961A1 (en) | 2005-10-31 | 2007-05-02 | Advanced Laser Separation International (ALSI) B.V. | Arrangement and method for forming one or more separated scores in a surface of a substrate |
US20080113493A1 (en) * | 2003-12-30 | 2008-05-15 | Advanced Laser Separation International B.V. | Method, Device and Diffraction Grating for Separating Semiconductor Elements Formed on a Substrate by Altering Said Diffraction Grating |
US20100142102A1 (en) * | 2008-12-04 | 2010-06-10 | Cooper Technologies Company | Low Force Low Oil Trip Mechanism |
USRE43400E1 (en) | 2000-09-20 | 2012-05-22 | Electro Scientific Industries, Inc. | Laser segmented cutting, multi-step cutting, or both |
CN102665999A (en) * | 2009-11-25 | 2012-09-12 | 浜松光子学株式会社 | Laser processing method |
JP2013039593A (en) * | 2011-08-16 | 2013-02-28 | Amada Co Ltd | Laser machining head |
US20130175243A1 (en) * | 2012-01-11 | 2013-07-11 | The Ex One Company, Llc | Laser Drilling and Trepanning Device |
US11498156B2 (en) * | 2014-07-03 | 2022-11-15 | Nippon Steel Corporation | Laser processing apparatus |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG84510A1 (en) * | 1998-03-14 | 2001-11-20 | Inst Data Storage | An apparatus and method for laser texturing a magnetic recording disk and a disk produced thereby |
US20080116182A1 (en) * | 2006-11-21 | 2008-05-22 | Palo Alto Research Center Incorporated | Multiple Station Scan Displacement Invariant Laser Ablation Apparatus |
US7928015B2 (en) | 2006-12-12 | 2011-04-19 | Palo Alto Research Center Incorporated | Solar cell fabrication using extruded dopant-bearing materials |
JP2008203434A (en) | 2007-02-19 | 2008-09-04 | Fujitsu Ltd | Scanning mechanism, method of machining material to be machined and machining apparatus |
DE202010013161U1 (en) * | 2010-07-08 | 2011-03-31 | Oerlikon Solar Ag, Trübbach | Laser processing with several beams and suitable laser optics head |
Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63281790A (en) * | 1987-05-15 | 1988-11-18 | Fujitsu Ltd | Driving mechanism for optical head for laser beam machining |
US4928132A (en) * | 1982-09-27 | 1990-05-22 | Plasmon Data Systems | Optical data storage medium |
US5029243A (en) * | 1988-09-17 | 1991-07-02 | U.S. Philips Corporation | Device for working a workpiece using laser light |
US5113286A (en) * | 1990-09-27 | 1992-05-12 | At&T Bell Laboratories | Diffraction grating apparatus and method of forming a surface relief pattern in diffraction grating apparatus |
US5195103A (en) * | 1991-05-21 | 1993-03-16 | At&T Bell Laboratories | Externally modulated laser source for array illumination |
US5243589A (en) * | 1991-06-05 | 1993-09-07 | Max-Planck-Gesellschaft Zur Foerderung Der Wissenschaften E.V. | Method for recording information in an optically readable data memory |
US5362940A (en) * | 1990-11-09 | 1994-11-08 | Litel Instruments | Use of Fresnel zone plates for material processing |
US5416298A (en) * | 1990-11-23 | 1995-05-16 | Zed Instruments Limited | Laser engraving apparatus |
US5453814A (en) * | 1994-04-13 | 1995-09-26 | Nikon Precision Inc. | Illumination source and method for microlithography |
US5463200A (en) * | 1993-02-11 | 1995-10-31 | Lumonics Inc. | Marking of a workpiece by light energy |
US5477383A (en) * | 1993-02-05 | 1995-12-19 | Apa Optics, Inc. | Optical array method and apparatus |
US5481407A (en) * | 1993-09-14 | 1996-01-02 | Litel Instruments | Apparatus and process for using Fresnel zone plate array for processing materials |
US5530641A (en) * | 1991-05-17 | 1996-06-25 | Olympus Optical Co., Ltd. | Optical recording medium having grooves and lands and/or plural pit lines, and reproducing apparatus therefor |
JPH08227521A (en) * | 1994-12-15 | 1996-09-03 | Mitsubishi Chem Corp | Texture device and texturing method |
US5571429A (en) * | 1994-02-25 | 1996-11-05 | Litel Instruments | Apparatus and process for high speed laminate processing with computer generated holograms |
US5586040A (en) * | 1995-01-27 | 1996-12-17 | International Business Machines Corporation | Process and apparatus for controlled laser texturing of magnetic recording disk |
US5595768A (en) * | 1995-11-02 | 1997-01-21 | Komag, Incorporated | Laser disk texturing apparatus |
US5739502A (en) * | 1983-12-27 | 1998-04-14 | General Electric Company | Laser intensity redistribution |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5322987A (en) * | 1992-06-10 | 1994-06-21 | Iomega Corporation | Pneumatic hub locking device for etching optical servo tracks on magnetic disks |
-
1996
- 1996-06-17 US US08/665,275 patent/US6037565A/en not_active Expired - Fee Related
-
1997
- 1997-06-13 TW TW086108219A patent/TW463164B/en active
- 1997-06-17 AU AU34880/97A patent/AU3488097A/en not_active Abandoned
- 1997-06-17 WO PCT/US1997/010345 patent/WO1997048519A1/en active Application Filing
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4928132A (en) * | 1982-09-27 | 1990-05-22 | Plasmon Data Systems | Optical data storage medium |
US5739502A (en) * | 1983-12-27 | 1998-04-14 | General Electric Company | Laser intensity redistribution |
JPS63281790A (en) * | 1987-05-15 | 1988-11-18 | Fujitsu Ltd | Driving mechanism for optical head for laser beam machining |
US5029243A (en) * | 1988-09-17 | 1991-07-02 | U.S. Philips Corporation | Device for working a workpiece using laser light |
US5113286A (en) * | 1990-09-27 | 1992-05-12 | At&T Bell Laboratories | Diffraction grating apparatus and method of forming a surface relief pattern in diffraction grating apparatus |
US5362940A (en) * | 1990-11-09 | 1994-11-08 | Litel Instruments | Use of Fresnel zone plates for material processing |
US5416298A (en) * | 1990-11-23 | 1995-05-16 | Zed Instruments Limited | Laser engraving apparatus |
US5530641A (en) * | 1991-05-17 | 1996-06-25 | Olympus Optical Co., Ltd. | Optical recording medium having grooves and lands and/or plural pit lines, and reproducing apparatus therefor |
US5195103A (en) * | 1991-05-21 | 1993-03-16 | At&T Bell Laboratories | Externally modulated laser source for array illumination |
US5243589A (en) * | 1991-06-05 | 1993-09-07 | Max-Planck-Gesellschaft Zur Foerderung Der Wissenschaften E.V. | Method for recording information in an optically readable data memory |
US5477383A (en) * | 1993-02-05 | 1995-12-19 | Apa Optics, Inc. | Optical array method and apparatus |
US5463200A (en) * | 1993-02-11 | 1995-10-31 | Lumonics Inc. | Marking of a workpiece by light energy |
US5481407A (en) * | 1993-09-14 | 1996-01-02 | Litel Instruments | Apparatus and process for using Fresnel zone plate array for processing materials |
US5571429A (en) * | 1994-02-25 | 1996-11-05 | Litel Instruments | Apparatus and process for high speed laminate processing with computer generated holograms |
US5453814A (en) * | 1994-04-13 | 1995-09-26 | Nikon Precision Inc. | Illumination source and method for microlithography |
JPH08227521A (en) * | 1994-12-15 | 1996-09-03 | Mitsubishi Chem Corp | Texture device and texturing method |
US5586040A (en) * | 1995-01-27 | 1996-12-17 | International Business Machines Corporation | Process and apparatus for controlled laser texturing of magnetic recording disk |
US5595768A (en) * | 1995-11-02 | 1997-01-21 | Komag, Incorporated | Laser disk texturing apparatus |
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6518540B1 (en) | 1998-06-16 | 2003-02-11 | Data Storage Institute | Method and apparatus for providing ablation-free laser marking on hard disk media |
USRE43400E1 (en) | 2000-09-20 | 2012-05-22 | Electro Scientific Industries, Inc. | Laser segmented cutting, multi-step cutting, or both |
US7157038B2 (en) | 2000-09-20 | 2007-01-02 | Electro Scientific Industries, Inc. | Ultraviolet laser ablative patterning of microstructures in semiconductors |
USRE43605E1 (en) | 2000-09-20 | 2012-08-28 | Electro Scientific Industries, Inc. | Laser segmented cutting, multi-step cutting, or both |
US20020149136A1 (en) * | 2000-09-20 | 2002-10-17 | Baird Brian W. | Ultraviolet laser ablative patterning of microstructures in semiconductors |
USRE43487E1 (en) | 2000-09-20 | 2012-06-26 | Electro Scientific Industries, Inc. | Laser segmented cutting |
US20060091126A1 (en) * | 2001-01-31 | 2006-05-04 | Baird Brian W | Ultraviolet laser ablative patterning of microstructures in semiconductors |
US20080113493A1 (en) * | 2003-12-30 | 2008-05-15 | Advanced Laser Separation International B.V. | Method, Device and Diffraction Grating for Separating Semiconductor Elements Formed on a Substrate by Altering Said Diffraction Grating |
US20070099439A1 (en) * | 2005-10-31 | 2007-05-03 | Advanced Laser Separation International B.V. | Arrangement and method for forming one or more separated scores in a surface of a substrate |
EP2260967A3 (en) * | 2005-10-31 | 2012-03-07 | Advanced Laser Separation International (ALSI) B.V. | Arrangement and method for forming one or more separated scores in a surface of a substrate |
US7947920B2 (en) | 2005-10-31 | 2011-05-24 | Advanced Laser Separation International B.V. | Arrangement and method for forming one or more separated scores in a surface of a substrate |
EP1779961A1 (en) | 2005-10-31 | 2007-05-02 | Advanced Laser Separation International (ALSI) B.V. | Arrangement and method for forming one or more separated scores in a surface of a substrate |
US20100142102A1 (en) * | 2008-12-04 | 2010-06-10 | Cooper Technologies Company | Low Force Low Oil Trip Mechanism |
CN102665999A (en) * | 2009-11-25 | 2012-09-12 | 浜松光子学株式会社 | Laser processing method |
CN102665999B (en) * | 2009-11-25 | 2014-12-24 | 浜松光子学株式会社 | Laser processing method |
US10322526B2 (en) | 2009-11-25 | 2019-06-18 | Hamamatsu Photonics K.K. | Laser processing method |
JP2013039593A (en) * | 2011-08-16 | 2013-02-28 | Amada Co Ltd | Laser machining head |
US20130175243A1 (en) * | 2012-01-11 | 2013-07-11 | The Ex One Company, Llc | Laser Drilling and Trepanning Device |
US9931712B2 (en) * | 2012-01-11 | 2018-04-03 | Pim Snow Leopard Inc. | Laser drilling and trepanning device |
US11498156B2 (en) * | 2014-07-03 | 2022-11-15 | Nippon Steel Corporation | Laser processing apparatus |
Also Published As
Publication number | Publication date |
---|---|
AU3488097A (en) | 1998-01-07 |
TW463164B (en) | 2001-11-11 |
WO1997048519A1 (en) | 1997-12-24 |
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