US5945605A - Sensor assembly with sensor boss mounted on substrate - Google Patents
Sensor assembly with sensor boss mounted on substrate Download PDFInfo
- Publication number
- US5945605A US5945605A US08/974,005 US97400597A US5945605A US 5945605 A US5945605 A US 5945605A US 97400597 A US97400597 A US 97400597A US 5945605 A US5945605 A US 5945605A
- Authority
- US
- United States
- Prior art keywords
- substrate
- sensor
- die
- boss
- sensor die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/145—Housings with stress relieving means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/04—Means for compensating for effects of changes of temperature, i.e. other than electric compensation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Child & Adolescent Psychology (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
Description
Claims (23)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/974,005 US5945605A (en) | 1997-11-19 | 1997-11-19 | Sensor assembly with sensor boss mounted on substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/974,005 US5945605A (en) | 1997-11-19 | 1997-11-19 | Sensor assembly with sensor boss mounted on substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
US5945605A true US5945605A (en) | 1999-08-31 |
Family
ID=25521460
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/974,005 Expired - Lifetime US5945605A (en) | 1997-11-19 | 1997-11-19 | Sensor assembly with sensor boss mounted on substrate |
Country Status (1)
Country | Link |
---|---|
US (1) | US5945605A (en) |
Cited By (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6150681A (en) * | 1998-07-24 | 2000-11-21 | Silicon Microstructures, Inc. | Monolithic flow sensor and pressure sensor |
US6207470B1 (en) * | 1997-09-18 | 2001-03-27 | Abb Kent Taylor S.P.A. | Method for manufacturing a pressure-measuring device equipped with a resonating element |
US6467977B2 (en) * | 2000-12-19 | 2002-10-22 | Hewlett-Packard Company | Media weight sensor using a resonant piezoelectric element |
US20020168267A1 (en) * | 2001-05-10 | 2002-11-14 | Yoshiaki Hironaka | Reciprocating pump |
US6485205B2 (en) * | 2000-12-19 | 2002-11-26 | Hewlett-Packard Company | Media weight sensor using an acoustic resonator |
WO2002094456A1 (en) * | 2001-05-22 | 2002-11-28 | Joerg Lahann | Fabrication of microdevices for separation of biomolecules in an electrical field |
US6573124B1 (en) * | 1999-05-03 | 2003-06-03 | Hughes Electronics Corp. | Preparation of passivated chip-on-board electronic devices |
US20040041254A1 (en) * | 2002-09-04 | 2004-03-04 | Lewis Long | Packaged microchip |
US20040041248A1 (en) * | 2002-09-04 | 2004-03-04 | Kieran Harney | Packaged microchip with isolation |
US20040096357A1 (en) * | 2002-11-15 | 2004-05-20 | Arun Majumdar | Composite sensor membrane |
US20040119143A1 (en) * | 2002-12-19 | 2004-06-24 | Karpman Maurice S. | Packaged microchip with isolator having selected modulus of elasticity |
US20040152211A1 (en) * | 2002-11-15 | 2004-08-05 | The Regents Of The University Of California | System and method for multiplexed biomolecular analysis |
WO2004109770A2 (en) * | 2003-06-05 | 2004-12-16 | Oticon A/S | Through wafer via process and amplifier with through wafer via |
US20050014388A1 (en) * | 2001-07-27 | 2005-01-20 | Akio Takahashi | Polyparaxylylene film, production method therefor and semiconductor device |
US20050056870A1 (en) * | 2002-12-19 | 2005-03-17 | Karpman Maurice S. | Stress sensitive microchip with premolded-type package |
US20050255448A1 (en) * | 2004-05-13 | 2005-11-17 | Arun Majumdar | System for amplifying optical detection of cantilever deflection |
US20050252301A1 (en) * | 2002-11-06 | 2005-11-17 | Metallux Ag | Pressure sensor |
US7166911B2 (en) | 2002-09-04 | 2007-01-23 | Analog Devices, Inc. | Packaged microchip with premolded-type package |
US20070222009A1 (en) * | 2006-03-24 | 2007-09-27 | Infineon Technologies Sensonor As | Integrated Pedestal Mount for MEMS Structure |
US20080006092A1 (en) * | 2006-02-27 | 2008-01-10 | Sebastiano Brida | Stress isolated pressure sensing die |
US20080016683A1 (en) * | 2006-02-27 | 2008-01-24 | Auxitrol S.A. | Stress isolated pressure sensing die, sensor assembly inluding said die and methods for manufacturing said die and said assembly |
US20080018608A1 (en) * | 2006-07-18 | 2008-01-24 | Bogdan Serban | Data input device |
US20080110269A1 (en) * | 2006-11-13 | 2008-05-15 | Carsten Strietzel | Diaphragm vacuum measuring cell and method for the production of such measuring cell |
US20080157298A1 (en) * | 2006-06-29 | 2008-07-03 | Analog Devices, Inc. | Stress Mitigation in Packaged Microchips |
US20090000428A1 (en) * | 2007-06-27 | 2009-01-01 | Siemens Medical Solution Usa, Inc. | Photo-Multiplier Tube Removal Tool |
US20090067137A1 (en) * | 2007-09-07 | 2009-03-12 | Kla-Tencor Corporation | High Density In-Package Microelectronic Amplifier |
US20090071260A1 (en) * | 2007-09-19 | 2009-03-19 | Speldrich Jamie W | Pressure sensor stress isolation pedestal |
US7591186B1 (en) * | 2008-05-15 | 2009-09-22 | Honeywell International Inc. | Conductive seals and method for fabricating the same |
US20100050739A1 (en) * | 2008-08-29 | 2010-03-04 | Jesse Nachlas | Sintered and bonded multilayer sensor |
CN101228422B (en) * | 2005-03-10 | 2010-09-01 | 北美泰密克汽车公司 | Media isolated absolute pressure sensor |
WO2011153387A1 (en) * | 2010-06-04 | 2011-12-08 | Delphi Technologies, Inc. | Multiple hydraulic circuit pressure sensor |
US8297127B2 (en) | 2011-01-07 | 2012-10-30 | Honeywell International Inc. | Pressure sensor with low cost packaging |
US20130042694A1 (en) * | 2011-08-19 | 2013-02-21 | Kulite Semiconductor Products, Inc. | Flat covered leadless pressure sensor assemblies suitable for operation in extreme environments |
US9384912B2 (en) | 2013-08-07 | 2016-07-05 | Abb S.P.A. | Circuit breaker |
WO2017050582A1 (en) * | 2015-09-23 | 2017-03-30 | Endress+Hauser Gmbh+Co. Kg | Pressure measuring device |
CN106560912A (en) * | 2015-10-05 | 2017-04-12 | 朗姆研究公司 | Substrate Holder Having Integrated Temperature Measurement Electrical Devices |
US20170108390A1 (en) * | 2014-01-30 | 2017-04-20 | Hitachi Automotive Systems, Ltd. | Mechanical Quantity Measuring Device and Sensor Unit |
US9676614B2 (en) | 2013-02-01 | 2017-06-13 | Analog Devices, Inc. | MEMS device with stress relief structures |
EP3205998A1 (en) * | 2016-02-11 | 2017-08-16 | Rosemount Aerospace Inc. | Open diaphragm harsh environment pressure sensor |
RU2630710C2 (en) * | 2012-06-19 | 2017-09-12 | Росемоунт Инк. | Pressure difference meter equipped with sensor |
US20180245997A1 (en) * | 2017-02-28 | 2018-08-30 | Rosemount Inc. | Joint for brittle materials |
US10131538B2 (en) | 2015-09-14 | 2018-11-20 | Analog Devices, Inc. | Mechanically isolated MEMS device |
US10167189B2 (en) | 2014-09-30 | 2019-01-01 | Analog Devices, Inc. | Stress isolation platform for MEMS devices |
WO2019123853A1 (en) * | 2017-12-20 | 2019-06-27 | 株式会社鷺宮製作所 | Pressure sensor |
CN111795770A (en) * | 2020-05-19 | 2020-10-20 | 北京航空航天大学 | Pressure probe for measuring fluid pulse dynamic pressure |
CN112050996A (en) * | 2019-06-06 | 2020-12-08 | 泰科电子连接解决方案有限责任公司 | Pressure sensor assembly with protective pressure feature |
US10870273B2 (en) | 2017-07-18 | 2020-12-22 | Hewlett-Packard Development Company, L.P. | Dies including strain gauge sensors and temperature sensors |
US11289444B2 (en) * | 2019-12-13 | 2022-03-29 | General Electric Company | Sensor systems and methods for providing sensor systems |
US11417611B2 (en) | 2020-02-25 | 2022-08-16 | Analog Devices International Unlimited Company | Devices and methods for reducing stress on circuit components |
CN115235515A (en) * | 2022-09-20 | 2022-10-25 | 南京新力感电子科技有限公司 | Sensor and preparation method thereof |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4382247A (en) * | 1980-03-06 | 1983-05-03 | Robert Bosch Gmbh | Pressure sensor |
US5067491A (en) * | 1989-12-08 | 1991-11-26 | Becton, Dickinson And Company | Barrier coating on blood contacting devices |
US5257547A (en) * | 1991-11-26 | 1993-11-02 | Honeywell Inc. | Amplified pressure transducer |
US5273939A (en) * | 1991-03-09 | 1993-12-28 | Robert Bosch Gmbh | Method of assembling micromechanical sensors |
US5483994A (en) * | 1995-02-01 | 1996-01-16 | Honeywell, Inc. | Pressure transducer with media isolation and negative pressure measuring capability |
US5515732A (en) * | 1992-09-01 | 1996-05-14 | Rosemount Inc. | Capacitive pressure sensor and reference with stress isolating pedestal |
US5635649A (en) * | 1991-04-22 | 1997-06-03 | Hitachi, Ltd. | Multi-function differential pressure sensor with thin supporting base |
-
1997
- 1997-11-19 US US08/974,005 patent/US5945605A/en not_active Expired - Lifetime
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4382247A (en) * | 1980-03-06 | 1983-05-03 | Robert Bosch Gmbh | Pressure sensor |
US5067491A (en) * | 1989-12-08 | 1991-11-26 | Becton, Dickinson And Company | Barrier coating on blood contacting devices |
US5273939A (en) * | 1991-03-09 | 1993-12-28 | Robert Bosch Gmbh | Method of assembling micromechanical sensors |
US5635649A (en) * | 1991-04-22 | 1997-06-03 | Hitachi, Ltd. | Multi-function differential pressure sensor with thin supporting base |
US5257547A (en) * | 1991-11-26 | 1993-11-02 | Honeywell Inc. | Amplified pressure transducer |
US5515732A (en) * | 1992-09-01 | 1996-05-14 | Rosemount Inc. | Capacitive pressure sensor and reference with stress isolating pedestal |
US5483994A (en) * | 1995-02-01 | 1996-01-16 | Honeywell, Inc. | Pressure transducer with media isolation and negative pressure measuring capability |
Cited By (84)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6207470B1 (en) * | 1997-09-18 | 2001-03-27 | Abb Kent Taylor S.P.A. | Method for manufacturing a pressure-measuring device equipped with a resonating element |
US6150681A (en) * | 1998-07-24 | 2000-11-21 | Silicon Microstructures, Inc. | Monolithic flow sensor and pressure sensor |
US6573124B1 (en) * | 1999-05-03 | 2003-06-03 | Hughes Electronics Corp. | Preparation of passivated chip-on-board electronic devices |
US6467977B2 (en) * | 2000-12-19 | 2002-10-22 | Hewlett-Packard Company | Media weight sensor using a resonant piezoelectric element |
US6485205B2 (en) * | 2000-12-19 | 2002-11-26 | Hewlett-Packard Company | Media weight sensor using an acoustic resonator |
US6742994B2 (en) * | 2001-05-10 | 2004-06-01 | Kioritz Corporation | Reciprocating pump with malfunction detecting apparatus |
US20020168267A1 (en) * | 2001-05-10 | 2002-11-14 | Yoshiaki Hironaka | Reciprocating pump |
WO2002094456A1 (en) * | 2001-05-22 | 2002-11-28 | Joerg Lahann | Fabrication of microdevices for separation of biomolecules in an electrical field |
US20050014388A1 (en) * | 2001-07-27 | 2005-01-20 | Akio Takahashi | Polyparaxylylene film, production method therefor and semiconductor device |
US6946405B2 (en) * | 2001-07-27 | 2005-09-20 | Hitachi, Ltd. | Polyparaxylylene film, production method therefor and semiconductor device |
US20040041254A1 (en) * | 2002-09-04 | 2004-03-04 | Lewis Long | Packaged microchip |
US20040041248A1 (en) * | 2002-09-04 | 2004-03-04 | Kieran Harney | Packaged microchip with isolation |
US6768196B2 (en) | 2002-09-04 | 2004-07-27 | Analog Devices, Inc. | Packaged microchip with isolation |
US7166911B2 (en) | 2002-09-04 | 2007-01-23 | Analog Devices, Inc. | Packaged microchip with premolded-type package |
US20050252301A1 (en) * | 2002-11-06 | 2005-11-17 | Metallux Ag | Pressure sensor |
US7162925B2 (en) * | 2002-11-06 | 2007-01-16 | Metallux Ag | Pressure sensor with monolithic body and circuit-bearing membrane attached thereto |
WO2004046690A2 (en) * | 2002-11-15 | 2004-06-03 | The Regents Of The University Of California | Composite sensor membrane |
US20080278731A1 (en) * | 2002-11-15 | 2008-11-13 | The Regents Of The University Of California | Composite sensor membrane |
WO2004046690A3 (en) * | 2002-11-15 | 2004-10-21 | Univ California | Composite sensor membrane |
US20040152211A1 (en) * | 2002-11-15 | 2004-08-05 | The Regents Of The University Of California | System and method for multiplexed biomolecular analysis |
US7344678B2 (en) * | 2002-11-15 | 2008-03-18 | The Regents Of The University Of California | Composite sensor membrane |
US20040096357A1 (en) * | 2002-11-15 | 2004-05-20 | Arun Majumdar | Composite sensor membrane |
US20040119143A1 (en) * | 2002-12-19 | 2004-06-24 | Karpman Maurice S. | Packaged microchip with isolator having selected modulus of elasticity |
US6946742B2 (en) | 2002-12-19 | 2005-09-20 | Analog Devices, Inc. | Packaged microchip with isolator having selected modulus of elasticity |
US20050056870A1 (en) * | 2002-12-19 | 2005-03-17 | Karpman Maurice S. | Stress sensitive microchip with premolded-type package |
WO2004109770A3 (en) * | 2003-06-05 | 2005-02-03 | Oticon As | Through wafer via process and amplifier with through wafer via |
WO2004109770A2 (en) * | 2003-06-05 | 2004-12-16 | Oticon A/S | Through wafer via process and amplifier with through wafer via |
US20050255448A1 (en) * | 2004-05-13 | 2005-11-17 | Arun Majumdar | System for amplifying optical detection of cantilever deflection |
CN101228422B (en) * | 2005-03-10 | 2010-09-01 | 北美泰密克汽车公司 | Media isolated absolute pressure sensor |
US7475597B2 (en) | 2006-02-27 | 2009-01-13 | Auxitrol S.A. | Stress isolated pressure sensing die |
US20080006092A1 (en) * | 2006-02-27 | 2008-01-10 | Sebastiano Brida | Stress isolated pressure sensing die |
EP1826543A3 (en) * | 2006-02-27 | 2008-05-14 | Auxitrol S.A. | Stress isolated pressure sensing die |
US7661318B2 (en) | 2006-02-27 | 2010-02-16 | Auxitrol S.A. | Stress isolated pressure sensing die, sensor assembly inluding said die and methods for manufacturing said die and said assembly |
US20080016683A1 (en) * | 2006-02-27 | 2008-01-24 | Auxitrol S.A. | Stress isolated pressure sensing die, sensor assembly inluding said die and methods for manufacturing said die and said assembly |
US20070222009A1 (en) * | 2006-03-24 | 2007-09-27 | Infineon Technologies Sensonor As | Integrated Pedestal Mount for MEMS Structure |
US20100013067A9 (en) * | 2006-06-29 | 2010-01-21 | Analog Devices, Inc. | Stress Mitigation in Packaged Microchips |
US20080157298A1 (en) * | 2006-06-29 | 2008-07-03 | Analog Devices, Inc. | Stress Mitigation in Packaged Microchips |
US20090230521A2 (en) * | 2006-06-29 | 2009-09-17 | Analog Devices, Inc. | Stress Mitigation in Packaged Microchips |
US8344487B2 (en) | 2006-06-29 | 2013-01-01 | Analog Devices, Inc. | Stress mitigation in packaged microchips |
US20080018608A1 (en) * | 2006-07-18 | 2008-01-24 | Bogdan Serban | Data input device |
US8063886B2 (en) * | 2006-07-18 | 2011-11-22 | Iee International Electronics & Engineering S.A. | Data input device |
US7536915B2 (en) * | 2006-11-13 | 2009-05-26 | Inficon Gmbh | Diaphragm vacuum measuring cell and method for the production of such measuring cell |
WO2008058406A1 (en) * | 2006-11-13 | 2008-05-22 | Inficon Gmbh | Diaphragm vacuum measuring cell, and method for producing such a cell |
US20080110269A1 (en) * | 2006-11-13 | 2008-05-15 | Carsten Strietzel | Diaphragm vacuum measuring cell and method for the production of such measuring cell |
US20090000428A1 (en) * | 2007-06-27 | 2009-01-01 | Siemens Medical Solution Usa, Inc. | Photo-Multiplier Tube Removal Tool |
US7626827B2 (en) * | 2007-09-07 | 2009-12-01 | Kla-Tencor Corporation | High density in-package microelectronic amplifier |
US20090067137A1 (en) * | 2007-09-07 | 2009-03-12 | Kla-Tencor Corporation | High Density In-Package Microelectronic Amplifier |
US20090071260A1 (en) * | 2007-09-19 | 2009-03-19 | Speldrich Jamie W | Pressure sensor stress isolation pedestal |
US7647835B2 (en) * | 2007-09-19 | 2010-01-19 | Honeywell International Inc. | Pressure sensor stress isolation pedestal |
US7591186B1 (en) * | 2008-05-15 | 2009-09-22 | Honeywell International Inc. | Conductive seals and method for fabricating the same |
US20100050739A1 (en) * | 2008-08-29 | 2010-03-04 | Jesse Nachlas | Sintered and bonded multilayer sensor |
WO2011153387A1 (en) * | 2010-06-04 | 2011-12-08 | Delphi Technologies, Inc. | Multiple hydraulic circuit pressure sensor |
US8297127B2 (en) | 2011-01-07 | 2012-10-30 | Honeywell International Inc. | Pressure sensor with low cost packaging |
US20130042694A1 (en) * | 2011-08-19 | 2013-02-21 | Kulite Semiconductor Products, Inc. | Flat covered leadless pressure sensor assemblies suitable for operation in extreme environments |
US8656784B2 (en) * | 2011-08-19 | 2014-02-25 | Kulite Semiconductor Products, Inc. | Flat covered leadless pressure sensor assemblies suitable for operation in extreme environments |
RU2630710C2 (en) * | 2012-06-19 | 2017-09-12 | Росемоунт Инк. | Pressure difference meter equipped with sensor |
US9676614B2 (en) | 2013-02-01 | 2017-06-13 | Analog Devices, Inc. | MEMS device with stress relief structures |
US9384912B2 (en) | 2013-08-07 | 2016-07-05 | Abb S.P.A. | Circuit breaker |
US10481023B2 (en) * | 2014-01-30 | 2019-11-19 | Hitachi Automotive Systems, Ltd. | Mechanical quantity measuring device and sensor unit |
US20170108390A1 (en) * | 2014-01-30 | 2017-04-20 | Hitachi Automotive Systems, Ltd. | Mechanical Quantity Measuring Device and Sensor Unit |
US10759659B2 (en) | 2014-09-30 | 2020-09-01 | Analog Devices, Inc. | Stress isolation platform for MEMS devices |
US10167189B2 (en) | 2014-09-30 | 2019-01-01 | Analog Devices, Inc. | Stress isolation platform for MEMS devices |
US10131538B2 (en) | 2015-09-14 | 2018-11-20 | Analog Devices, Inc. | Mechanically isolated MEMS device |
WO2017050582A1 (en) * | 2015-09-23 | 2017-03-30 | Endress+Hauser Gmbh+Co. Kg | Pressure measuring device |
CN110571180A (en) * | 2015-10-05 | 2019-12-13 | 朗姆研究公司 | Substrate holder with integrated temperature measurement electrical device |
CN110571180B (en) * | 2015-10-05 | 2023-08-04 | 朗姆研究公司 | Substrate holder with integrated temperature measuring electrical device |
CN106560912B (en) * | 2015-10-05 | 2019-08-30 | 朗姆研究公司 | Substrate holder with integrated temperature measurement electric device |
CN106560912A (en) * | 2015-10-05 | 2017-04-12 | 朗姆研究公司 | Substrate Holder Having Integrated Temperature Measurement Electrical Devices |
US10101234B2 (en) | 2016-02-11 | 2018-10-16 | Rosemount Aerospace, Inc. | Open diaphragm harsh environment pressure sensor |
EP3205998A1 (en) * | 2016-02-11 | 2017-08-16 | Rosemount Aerospace Inc. | Open diaphragm harsh environment pressure sensor |
US10551261B2 (en) * | 2017-02-28 | 2020-02-04 | Rosemount Inc. | Joint for brittle materials |
CN108500412A (en) * | 2017-02-28 | 2018-09-07 | 罗斯蒙特公司 | Connector for fragile material |
US20180245997A1 (en) * | 2017-02-28 | 2018-08-30 | Rosemount Inc. | Joint for brittle materials |
CN108500412B (en) * | 2017-02-28 | 2021-05-14 | 罗斯蒙特公司 | Joint for brittle materials |
US10870273B2 (en) | 2017-07-18 | 2020-12-22 | Hewlett-Packard Development Company, L.P. | Dies including strain gauge sensors and temperature sensors |
US11712887B2 (en) | 2017-07-18 | 2023-08-01 | Hewlett-Packard Development Company L.P. | Dies including strain gauge sensors and temperature sensors |
WO2019123853A1 (en) * | 2017-12-20 | 2019-06-27 | 株式会社鷺宮製作所 | Pressure sensor |
CN111465831A (en) * | 2017-12-20 | 2020-07-28 | 株式会社鹭宫制作所 | Pressure sensor |
CN112050996A (en) * | 2019-06-06 | 2020-12-08 | 泰科电子连接解决方案有限责任公司 | Pressure sensor assembly with protective pressure feature |
US11289444B2 (en) * | 2019-12-13 | 2022-03-29 | General Electric Company | Sensor systems and methods for providing sensor systems |
US11417611B2 (en) | 2020-02-25 | 2022-08-16 | Analog Devices International Unlimited Company | Devices and methods for reducing stress on circuit components |
CN111795770B (en) * | 2020-05-19 | 2021-07-16 | 北京航空航天大学 | Pressure probe for measuring fluid pulse dynamic pressure |
CN111795770A (en) * | 2020-05-19 | 2020-10-20 | 北京航空航天大学 | Pressure probe for measuring fluid pulse dynamic pressure |
CN115235515A (en) * | 2022-09-20 | 2022-10-25 | 南京新力感电子科技有限公司 | Sensor and preparation method thereof |
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