US5851102A - Device and method for positioning a notched wafer - Google Patents
Device and method for positioning a notched wafer Download PDFInfo
- Publication number
- US5851102A US5851102A US08/931,549 US93154997A US5851102A US 5851102 A US5851102 A US 5851102A US 93154997 A US93154997 A US 93154997A US 5851102 A US5851102 A US 5851102A
- Authority
- US
- United States
- Prior art keywords
- wafer
- rotary stage
- positioning
- center
- shaped notch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
Definitions
- the present invention relates to an improved device and method for positioning a notched wafer on a rotary inspection table of a wafer surface inspecting device which uses a laser to detect microscopic foreign substances resting on the wafer surface.
- semiconductor manufacturing process In manufacturing high-quality, high-performance semiconductor devices such as LSIs (hereinafter referred to as a "semiconductor manufacturing process"), reduction of "yield" due to presence of microscopic foreign substances on a wafer surface has become an increasingly serious problem along with increasing tendencies toward micronization of circuit patterns and an increase in the number of layers to be connected by wiring. Thus, a technique for directly or indirectly inspecting a wafer surface during the semiconductor manufacturing process is now essential in the semiconductor manufacturing process.
- a laser-type wafer surface inspecting device which, while rotating the wafer, irradiates a laser beam onto the wafer surface for optically scanning the surface from the center to outer periphery of the wafer.
- the center of the wafer be accurately positioned at (i.e., aligned with) the rotational center of a rotary inspection table or stage of the device.
- the present invention provides an improved notched wafer positioning device which comprises: a rotary stage rotatable with a wafer placed thereon, the wafer having a V-shaped notch formed in a predetermined location of an outer periphery thereof; at least three positioning pins provided outwardly of the outer periphery of the wafer placed on the rotary stage and movable into contact with the wafer; a detector for monitoring the outer periphery of the wafer that is rotated by rotation of the rotary stage, so as to detect an angular position of the V-shaped notch of the wafer on the rotary stage and eccentricity of the wafer relative to a rotational center of the rotary stage; and a controller for positioning the V-shaped notch of the wafer at a location corresponding to a predetermined one of the positioning pins on the basis of the angular position of the V-shaped notch detected by the detector and for moving each of the positioning pins into contact with the wafer on the basis of
- a precise positioning operation using the at least three positioning pins, to locate the center of the wafer at the rotational center of the rotary stage should be performed or not.
- one of the positioning pins is caused to fit into the V-shaped notch of the wafer on the basis of the detected angular position of the notch and then the precise positioning of the wafer can be performed using the other two positioning pins.
- This arrangement eliminates the conventional need for placing the wafer on the rotary stage while properly positioning the V-shaped notch and permits precise positioning after the wafer has been placed on the rotary stage. Further, because the angular position of the V-shaped notch on the rotary stage has been detected, it is possible to easily recognize every varying position of the wafer surface even when a laser wafer surface inspects the wafer surface while rotating the wafer.
- FIG. 1A is a schematic plan view of a rotary inspection stage in a notched wafer positioning device according to a preferred embodiment of the present invention
- FIG. 1B is a side view of the rotary inspection stage
- FIGS. 2A and 2B are schematic views of the rotary inspection stage, showing a manner in which a precise positioning operation is performed in the preferred embodiment.
- FIG. 1A is a plan view of a rotary inspection stage in a notched wafer positioning device according to a preferred embodiment of the present invention which is applied to a wafer surface inspecting device
- FIG. 1B is a side view of the rotary inspection stage.
- the rotary inspection stage 1 is driven to rotate by means of a motor 2.
- An encoder 3 is attached to the motor 2, which allows a user to recognize a sequentially changing angular position of the rotary inspection stage 1 on the basis of output signals from the encoder 3.
- a chucking section (not shown) which, by suction, sticks to a surface of a notched wafer 4 to thereby fix the wafer 4 on the stage 1.
- the notched wafer 4 contained in a wafer cassette is delivered to the rotary inspection stage 1 by means of a handling arm or otherwise, and then positioned on the stage 1 in such a manner that the center of the notched wafer 4 lies at or is aligned with the rotational axis of the rotary inspection stage 1.
- the handling arm capable of providing a very high positioning accuracy, it is extremely difficult to accurately position the center of the notched wafer 4 at the rotational axis of the rotary inspection stage 1.
- the preferred embodiment of the present invention employs an eccentricity detector 5, having a positioning pin 61, to detect how much the center of the wafer 4 placed on the rotary inspection stage 1 is offset or deviates from the rotational center of the stage 1 (i.e., eccentricity of the wafer relative to the rotational center of the rotary inspection stage 1) as well as an angular position, on the stage 1, of a V-shaped notch 41 formed in a predetermined location of the wafer's outer periphery.
- the eccentricity detector 5 includes a light source 51, and a CCD (Charge Coupled Device) linear sensor 52, opposed to the light source 51 with the notched wafer 4 interposed therebetween, for receiving illuminating light from the light source 51.
- the CCD linear sensor 52 continuously detects the outer periphery of the rotating wafer 4. In this manner, it is possible to detect every changing position of the V-shaped notch 41 of the wafer 4 and also detect how much the center of the wafer 4 on the rotary inspection stage 1 is offset from the rotational center axis of the stage 1.
- solid line represents the wafer 4 when its center lies exactly at the rotational center 0 of the rotary stage 1
- phantom line 4' represents the wafer 4 when its center 0' is offset rightward from the rotational center 0.
- the positioning pin 61 is movable into contact with the outer periphery of the notched wafer 4 to position the center of the wafer 4 at the rotational center of the rotary inspection stage 1, in conjunction with two positioning pins 62 and 63 provided on a positioning device 7. Namely, when a detected eccentricity of the notched wafer 4 is within a predetermined tolerance, the wafer surface inspecting device detects microscopic foreign substances on the wafer surface without performing a precise wafer positioning operation of the invention. However, when the detected eccentricity of the notched wafer 4 is greater than the predetermined tolerance, the precise wafer positioning operation of the invention is performed; that is, the eccentricity detector 5 and positioning device 7 are moved gradually toward the rotary inspection stage 1.
- the positioning pin 61 of the eccentricity detector 5 is moved in the direction of arrow X (i.e., leftward in FIG. 1), while the positioning device 7, i.e., the positioning pins 62 and 63 on the positioning device 7 are moved in an opposite direction to arrow X (i.e., rightward in FIG. 1).
- the positioning device 7 is moved rightward and stopped at a particular position determined by the rotational center of the rotary stage 1 and the radius of the wafer 4, to thereby position the wafer 4.
- the particular position determined by the rotational center of the rotary stage 1 and the radius of the wafer 4 is where the distance, from the rotational center of the stage 1, of each of the positioning pins 62 and 63 equals the radius of the wafer 4.
- the eccentricity detector 5 is driven to move in the direction of arrow X along a line connecting between the rotational center 0 of the rotary stage 1 and the positioning pin 61 so that the movement of the detector 5 in the X direction causes the pin 61 to move toward the rotational center 0.
- the positioning device 7 is driven to move in the opposite direction to arrow X so that the pins 62 and 63 are caused to move in parallel into contact with the outer periphery of the wafer 4.
- the angular position of the rotary inspection stage 1 is controlled in such a manner that the positioning pin 61 of the eccentricity detector 5 is fitted in the notched portion 41 of the wafer 4.
- the positioning pin 61 of the eccentricity detector 5 and the positioning pins 62 and 63 of the positioning device 7 are brought into contact with the wafer 4 at three separate points along the outer periphery of the notched wafer 4. Because the positioning pin 61 of the eccentricity detector 5 is fitted in the V-shaped notch 41, the notched wafer 4 can be accurately positioned at the rotational center of the inspection stage 1 against sliding displacement in the circumferential direction of the wafer 4. It should be obvious that during the positioning control through the movement of the positioning pins 61 to 63, the notched wafer 4 is released from the suction force from the chucking section so as to be able to move freely relative to the rotary inspection stage 1.
- the positioning control according to the above-described embodiment may be applied to notched wafers 4 of various different sizes rather than those of a same size. In this case, it is only necessary that the respective positions of or distance between the positioning pins 62 and 63 be varied depending on the size of each wafer to be inspected.
- the eccentricity detector 5 has the positioning pin 61
- a positioning pin 61 need not necessarily be provided on the detector 5 if accurate relative positional relationships between the positioning pins 61 to 63 and the eccentricity detector 5 are known in advance.
- the provision of the positioning pin 61 on the eccentricity detector 5 advantageously eliminates a need for arithmetic operations to determine the relative positional relationships, because precise positioning can be easily conducted once the positioning pin 61 comes into fitting engagement with the V-shaped notch 41.
- the notched wafer positioning device arranged in the above-mentioned manner permits accurate positioning of a notched wafer such that the center of the wafer lies at the center of the rotary stage of the laser-type wafer surface inspecting device.
Abstract
Description
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8266695A JPH1089904A (en) | 1996-09-17 | 1996-09-17 | V-notch wafer positioning device |
JP8-266695 | 1996-09-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
US5851102A true US5851102A (en) | 1998-12-22 |
Family
ID=17434408
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/931,549 Expired - Fee Related US5851102A (en) | 1996-09-17 | 1997-09-16 | Device and method for positioning a notched wafer |
Country Status (2)
Country | Link |
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US (1) | US5851102A (en) |
JP (1) | JPH1089904A (en) |
Cited By (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5980195A (en) * | 1996-04-24 | 1999-11-09 | Tokyo Electron, Ltd. | Positioning apparatus for substrates to be processed |
US6032512A (en) * | 1998-06-02 | 2000-03-07 | Taiwan Semiconductor Manufacturing Co. Ltd. | Wafer centering device and method of using |
US6052913A (en) * | 1997-07-15 | 2000-04-25 | Tokyo Electron Limited | Positioning device and positioning method |
US6085967A (en) * | 1998-12-28 | 2000-07-11 | Eastman Kodak Company | Method of registrably aligning fabricated wafers preceding bonding |
US6188323B1 (en) * | 1998-10-15 | 2001-02-13 | Asyst Technologies, Inc. | Wafer mapping system |
US6275742B1 (en) * | 1999-04-16 | 2001-08-14 | Berkeley Process Control, Inc. | Wafer aligner system |
US6301797B1 (en) * | 1998-06-04 | 2001-10-16 | Seagate Technology Llc | Recognizing and compensating for disk shift in computer disk drives |
US6309163B1 (en) * | 1997-10-30 | 2001-10-30 | Applied Materials, Inc. | Wafer positioning device with storage capability |
DE10045203A1 (en) * | 2000-09-13 | 2002-04-04 | Infineon Technologies Ag | Test device and method for determining a notch or cam position on disks |
US6425280B1 (en) * | 1999-07-30 | 2002-07-30 | International Business Machines Corporation | Wafer alignment jig for wafer-handling systems |
US20020125448A1 (en) * | 2001-03-06 | 2002-09-12 | Samsung Electronics Co., Ltd. | Multi-functioned wafer aligner |
US20030025919A1 (en) * | 2001-07-16 | 2003-02-06 | Ilya Chizhov | System and method for finding the center of rotation of an R-theta stage |
US20030031549A1 (en) * | 2001-07-13 | 2003-02-13 | Berger Alexander J. | Alignment of semiconductor wafers and other articles |
US20040150814A1 (en) * | 2002-11-29 | 2004-08-05 | Nidek Co., Ltd. | Inspecting device for semiconductor wafer |
US6789436B2 (en) * | 2001-01-25 | 2004-09-14 | Leica Microsystems Jena Gmbh | Method and arrangement for transporting and inspecting semiconductor substrates |
US20050078312A1 (en) * | 2001-11-14 | 2005-04-14 | Yoshiki Fukuzaki | Wafer positioning method and apparatus, processing system, and method for positioning wafer seat rotating axis of wafer positioning apparatus |
US20050248754A1 (en) * | 2004-05-05 | 2005-11-10 | Chun-Sheng Wang | Wafer aligner with WEE (water edge exposure) function |
US20060102289A1 (en) * | 2004-11-15 | 2006-05-18 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus, substrate processing method, substrate position correcting apparatus, and substrate position correcting method |
US20090249880A1 (en) * | 2008-04-07 | 2009-10-08 | Tech Semiconductor Singapore Pte Ltd | Real-time detection of wafer shift/slide in a chamber |
US7717661B1 (en) | 2006-05-25 | 2010-05-18 | N&K Technology, Inc. | Compact multiple diameters wafer handling system with on-chuck wafer calibration and integrated cassette-chuck transfer |
CN102087985B (en) * | 2009-12-03 | 2013-03-13 | 无锡华润上华半导体有限公司 | Wafer defect detecting method |
CN104370075A (en) * | 2013-08-14 | 2015-02-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Positioning device used for turnplate, turnplate mechanism and etching equipment |
CN106597812A (en) * | 2016-11-29 | 2017-04-26 | 张家港晋宇达电子科技有限公司 | Silicon chip feeding and calibrating device for photoetching machine and silicon chip feeding and calibrating method |
CN108987330A (en) * | 2018-07-20 | 2018-12-11 | 长江存储科技有限责任公司 | A kind of one chip cleaning machine and its chuck |
CN109616433A (en) * | 2018-12-03 | 2019-04-12 | 上海华力微电子有限公司 | A kind of wafer rotational speed measuring device and monitoring method |
CN112051708A (en) * | 2020-09-15 | 2020-12-08 | 青岛天仁微纳科技有限责任公司 | Centering feeding device and nano-imprinting equipment |
US20220138922A1 (en) * | 2020-10-30 | 2022-05-05 | Disco Corporation | Notch detecting method |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5022793B2 (en) * | 2007-07-02 | 2012-09-12 | 日東電工株式会社 | Method for detecting defect position of semiconductor wafer |
JP5449239B2 (en) * | 2010-05-12 | 2014-03-19 | 東京エレクトロン株式会社 | Substrate processing apparatus, substrate processing method, and storage medium storing program |
JP5572575B2 (en) | 2010-05-12 | 2014-08-13 | 東京エレクトロン株式会社 | Substrate positioning apparatus, substrate processing apparatus, substrate positioning method, and storage medium storing program |
CN103604335B (en) * | 2013-11-28 | 2017-01-25 | 重庆长安汽车股份有限公司 | Inspection device for three-way catalyst assembly of automobile |
Citations (6)
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US4685206A (en) * | 1984-12-05 | 1987-08-11 | Nippon Kogaku K. K. | Positioning apparatus for a circular substrate |
JPS63266850A (en) * | 1987-04-24 | 1988-11-02 | Nikon Corp | Positioning device for circular substrate |
US4887904A (en) * | 1985-08-23 | 1989-12-19 | Canon Kabushiki Kaisha | Device for positioning a semi-conductor wafer |
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US5125791A (en) * | 1989-05-23 | 1992-06-30 | Cybeg Systems, Inc. | Semiconductor object pre-aligning method |
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-
1996
- 1996-09-17 JP JP8266695A patent/JPH1089904A/en active Pending
-
1997
- 1997-09-16 US US08/931,549 patent/US5851102A/en not_active Expired - Fee Related
Patent Citations (6)
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US4685206A (en) * | 1984-12-05 | 1987-08-11 | Nippon Kogaku K. K. | Positioning apparatus for a circular substrate |
US4938654A (en) * | 1985-05-17 | 1990-07-03 | Schram Richard R | Automated wafer inspection system |
US4887904A (en) * | 1985-08-23 | 1989-12-19 | Canon Kabushiki Kaisha | Device for positioning a semi-conductor wafer |
JPS63266850A (en) * | 1987-04-24 | 1988-11-02 | Nikon Corp | Positioning device for circular substrate |
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Cited By (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6158946A (en) * | 1996-04-24 | 2000-12-12 | Tokyo Electron Limited | Positioning apparatus for substrates to be processed |
US6203268B1 (en) * | 1996-04-24 | 2001-03-20 | Tokyo Electron Limited | Positioning apparatus for substrates to be processed |
US5980195A (en) * | 1996-04-24 | 1999-11-09 | Tokyo Electron, Ltd. | Positioning apparatus for substrates to be processed |
US6052913A (en) * | 1997-07-15 | 2000-04-25 | Tokyo Electron Limited | Positioning device and positioning method |
US6309163B1 (en) * | 1997-10-30 | 2001-10-30 | Applied Materials, Inc. | Wafer positioning device with storage capability |
US6032512A (en) * | 1998-06-02 | 2000-03-07 | Taiwan Semiconductor Manufacturing Co. Ltd. | Wafer centering device and method of using |
US6301797B1 (en) * | 1998-06-04 | 2001-10-16 | Seagate Technology Llc | Recognizing and compensating for disk shift in computer disk drives |
US6405449B1 (en) * | 1998-06-04 | 2002-06-18 | Seagate Technology, Llc | Recognizing and compensating for disk shift in computer disk drives |
US6188323B1 (en) * | 1998-10-15 | 2001-02-13 | Asyst Technologies, Inc. | Wafer mapping system |
US6085967A (en) * | 1998-12-28 | 2000-07-11 | Eastman Kodak Company | Method of registrably aligning fabricated wafers preceding bonding |
US6275742B1 (en) * | 1999-04-16 | 2001-08-14 | Berkeley Process Control, Inc. | Wafer aligner system |
US6425280B1 (en) * | 1999-07-30 | 2002-07-30 | International Business Machines Corporation | Wafer alignment jig for wafer-handling systems |
DE10045203A1 (en) * | 2000-09-13 | 2002-04-04 | Infineon Technologies Ag | Test device and method for determining a notch or cam position on disks |
DE10045203C2 (en) * | 2000-09-13 | 2002-08-01 | Infineon Technologies Ag | Test device and method for determining a notch or cam position on disks |
US20030160971A1 (en) * | 2000-09-13 | 2003-08-28 | Thomas Krause | Testing device and method for establishing the position of a notch or bump on a disk |
US6710887B2 (en) * | 2000-09-13 | 2004-03-23 | Infineon Technologies Ag | Testing device and method for establishing the position of a notch or bump on a disk |
US7028565B2 (en) | 2001-01-25 | 2006-04-18 | Leica Microsystems Jena Gmbh | Method and arrangement for transporting and inspecting semiconductor substrates |
US6789436B2 (en) * | 2001-01-25 | 2004-09-14 | Leica Microsystems Jena Gmbh | Method and arrangement for transporting and inspecting semiconductor substrates |
US20020125448A1 (en) * | 2001-03-06 | 2002-09-12 | Samsung Electronics Co., Ltd. | Multi-functioned wafer aligner |
US6943364B2 (en) * | 2001-03-06 | 2005-09-13 | Samsung Electronics Co., Ltd. | Multi-functioned wafer aligner |
US20050004701A1 (en) * | 2001-07-13 | 2005-01-06 | Berger Alexander J. | Alignment of semiconductor wafers and other articles |
US7052229B2 (en) * | 2001-07-13 | 2006-05-30 | Tru-Si Technologies Inc. | Alignment of semiconductor wafers and other articles |
US6948898B2 (en) * | 2001-07-13 | 2005-09-27 | Tru-Si Technologies, Inc. | Alignment of semiconductor wafers and other articles |
US20030031549A1 (en) * | 2001-07-13 | 2003-02-13 | Berger Alexander J. | Alignment of semiconductor wafers and other articles |
US6747746B2 (en) | 2001-07-16 | 2004-06-08 | Therma-Wave, Inc. | System and method for finding the center of rotation of an R-theta stage |
US20030025919A1 (en) * | 2001-07-16 | 2003-02-06 | Ilya Chizhov | System and method for finding the center of rotation of an R-theta stage |
US20050078312A1 (en) * | 2001-11-14 | 2005-04-14 | Yoshiki Fukuzaki | Wafer positioning method and apparatus, processing system, and method for positioning wafer seat rotating axis of wafer positioning apparatus |
US7315373B2 (en) * | 2001-11-14 | 2008-01-01 | Rorze Corporation | Wafer positioning method and device, wafer process system, and wafer seat rotation axis positioning method for wafer positioning device |
US6963394B2 (en) * | 2002-11-29 | 2005-11-08 | Nidek Co., Ltd. | Inspecting device for semiconductor wafer |
US20040150814A1 (en) * | 2002-11-29 | 2004-08-05 | Nidek Co., Ltd. | Inspecting device for semiconductor wafer |
US20050248754A1 (en) * | 2004-05-05 | 2005-11-10 | Chun-Sheng Wang | Wafer aligner with WEE (water edge exposure) function |
US20060102289A1 (en) * | 2004-11-15 | 2006-05-18 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus, substrate processing method, substrate position correcting apparatus, and substrate position correcting method |
US7547181B2 (en) * | 2004-11-15 | 2009-06-16 | Dainippon Screen Mfg. Co., Ltd. | Substrate position correcting method and apparatus using either substrate radius or center of rotation correction adjustment sum |
US7717661B1 (en) | 2006-05-25 | 2010-05-18 | N&K Technology, Inc. | Compact multiple diameters wafer handling system with on-chuck wafer calibration and integrated cassette-chuck transfer |
US20090249880A1 (en) * | 2008-04-07 | 2009-10-08 | Tech Semiconductor Singapore Pte Ltd | Real-time detection of wafer shift/slide in a chamber |
US7750819B2 (en) * | 2008-04-07 | 2010-07-06 | Tech Semiconductor Singapore Pte Ltd | Real-time detection of wafer shift/slide in a chamber |
CN102087985B (en) * | 2009-12-03 | 2013-03-13 | 无锡华润上华半导体有限公司 | Wafer defect detecting method |
CN104370075A (en) * | 2013-08-14 | 2015-02-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Positioning device used for turnplate, turnplate mechanism and etching equipment |
CN106597812A (en) * | 2016-11-29 | 2017-04-26 | 张家港晋宇达电子科技有限公司 | Silicon chip feeding and calibrating device for photoetching machine and silicon chip feeding and calibrating method |
CN108987330A (en) * | 2018-07-20 | 2018-12-11 | 长江存储科技有限责任公司 | A kind of one chip cleaning machine and its chuck |
CN108987330B (en) * | 2018-07-20 | 2024-03-12 | 长江存储科技有限责任公司 | Single-chip cleaning machine and chuck thereof |
CN109616433A (en) * | 2018-12-03 | 2019-04-12 | 上海华力微电子有限公司 | A kind of wafer rotational speed measuring device and monitoring method |
CN112051708A (en) * | 2020-09-15 | 2020-12-08 | 青岛天仁微纳科技有限责任公司 | Centering feeding device and nano-imprinting equipment |
US20220138922A1 (en) * | 2020-10-30 | 2022-05-05 | Disco Corporation | Notch detecting method |
US11935227B2 (en) * | 2020-10-30 | 2024-03-19 | Disco Corporation | Notch detecting method |
Also Published As
Publication number | Publication date |
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JPH1089904A (en) | 1998-04-10 |
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