US5499123A - Active matrix liquid crystal display cell with light blocking capacitor electrode above insulating layer - Google Patents

Active matrix liquid crystal display cell with light blocking capacitor electrode above insulating layer Download PDF

Info

Publication number
US5499123A
US5499123A US08/141,880 US14188093A US5499123A US 5499123 A US5499123 A US 5499123A US 14188093 A US14188093 A US 14188093A US 5499123 A US5499123 A US 5499123A
Authority
US
United States
Prior art keywords
liquid crystal
layer
transparent electrode
insulating layer
crystal display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US08/141,880
Inventor
Hiroaki Mikoshiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vista Peak Ventures LLC
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Assigned to NEC CORPORATION reassignment NEC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MIKOSHIBA, HIROAKI
Application granted granted Critical
Publication of US5499123A publication Critical patent/US5499123A/en
Assigned to GETNER FOUNDATION LLC reassignment GETNER FOUNDATION LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NEC CORPORATION
Anticipated expiration legal-status Critical
Assigned to VISTA PEAK VENTURES, LLC reassignment VISTA PEAK VENTURES, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GETNER FOUNDATION LLC
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136213Storage capacitors associated with the pixel electrode
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509Filters, e.g. light shielding masks
    • G02F1/133512Light shielding layers, e.g. black matrix

Definitions

  • the present invention relates to an active matrix liquid crystal display cell which serves to provide a single picture element, namely, a pixel, and an active matrix liquid crystal display panel comprising a plurality of the active matrix liquid crystal display cells arranged in a matrix fashion.
  • a conventional active matrix liquid crystal display cell of the type described comprises an active switch element for driving liquid crystal, a capacitance element which stores charge for driving the liquid crystal, a pair of transparent electrodes between which the liquid crystal is filled, and a shading layer for protecting the switching active element and enhancing a contrast of light.
  • the conventional active matrix liquid crystal display panel cannot provide a bright image when the active matrix liquid crystal display cell becomes small in size for the above-mentioned purpose.
  • an active matrix liquid crystal display cell which comprises: an active switching element; first and second transparent electrodes between which the liquid crystal is filled, the first transparent electrode being connected to the switching active element for driving the liquid crystal and the second transparent electrode being positioned opposite to the first transparent electrode; a shading layer which is made of a conductive material; and an insulating layer which is interposed between the shading layer and the first transparent electrode with the shading layer partially laid under the first transparent electrode through the insulating layer.
  • the shading layer may be made of aluminum and the insulating layer may be formed by an anodic oxidation of the aluminum.
  • an active matrix liquid crystal display panel comprising a plurality of active matrix liquid crystal display cells arranged in a matrix fashion, each of the active matrix liquid crystal display cells comprising: an active switching element; first and second transparent electrodes between which the liquid crystal is filled, the first transparent electrode being connected to the switching active element for driving the liquid crystal and the second transparent electrode being positioned opposite to the first transparent electrode; a shading layer which is made of a conductive material; and an insulating layer which is interposed between the shading layer and the first transparent electrode with the shading layer partially laid under the first transparent electrode through the insulating layer.
  • FIG. 1 is a schematic vertical sectional view of a conventional active matrix liquid crystal display cell
  • FIG. 2 is a block diagram of an active matrix liquid crystal display panel according to a first embodiment of this invention
  • FIG. 3A is a plan view of an active matrix liquid crystal display cell according to a first embodiment of this invention.
  • FIG. 3B is a schematic vertical sectional view taken across A-B-C of the active matrix liquid crystal display cell illustrated in FIG. 3A;
  • FIG. 4 shows an equivalent circuit of the active matrix liquid crystal display cell illustrated in FIGS. 3A and 3B;
  • FIG. 5 is a schematic vertical sectional view of a capacitance element of an active matrix liquid crystal display cell according to a second embodiment of this invention.
  • FIG. 6 is a schematic vertical sectional view of a capacitance element of an active matrix liquid crystal display cell according to a third embodiment of this invention.
  • FIG. 7 is a schematic vertical sectional view of a modification of the capacitance element illustrated in FIG. 6;
  • FIG. 8 is a schematic vertical sectional view of a capacitance element of an active matrix liquid crystal display cell according to a fourth embodiment of this invention.
  • FIG. 9A is a plan view of an active matrix liquid crystal display cell according to a fifth embodiment of this invention.
  • FIG. 9B is a schematic vertical sectional view taken across X-Y of the active matrix liquid crystal display cell illustrated in FIG. 9A.
  • FIG. 10 shows an equivalent circuit of the active matrix liquid display cell illustrated in FIGS. 9A and 9B.
  • FIG. 1 a conventional active matrix liquid crystal display cell will first be described for a better understanding of this invention.
  • the conventional active matrix liquid crystal display cell 100 comprises a principal glass substrate 102, an opposite glass substrate 104, a transparent pixel electrode 106 deposited at the side of the principal glass substrate 102, a transparent opposite electrode 108 formed under the whole area of the opposite glass substrate 104, and a liquid crystal 110 filled between the transparent pixel electrode 106 and the transparent opposite electrode 108, an active switching element 120, a capacitance element 130, and a shading layer 140.
  • the switching active element 120 is formed by a thin-film transistor (TFT) of a bottom gate type, which consists of a gate 121, a gate insulating layer 122, an amorphous silicon layer 123, a doped amorphous silicon layer 124, a drain 125, and a source 126.
  • the gate 121 is connected to a gate bus (not shown) and the drain 125 is connected to a drain or signal bus (not shown), while the source 126 is connected to the transparent pixel electrode 106.
  • the capacitance element 130 consists of the transparent pixel electrode 106, a transparent electrode 132, and a dielectric layer 134 which is defined by a portion of the gate insulating layer 122.
  • the shading layer 140 is partially deposited under the transparent opposite electrode 108.
  • the liquid crystal 110 is also filled between the switching active element 120 and the shading layer 140, as illustrated in FIG. 1.
  • the transparent pixel electrode 106, the transparent electrode 132 and the transparent opposite electrode 108 are formed from ITO (Indium Tin Oxide) layer.
  • a plurality of the active matrix liquid crystal display cells 100 are arranged in a matrix fashion to form an active matrix liquid crystal display panel (not shown).
  • each active matrix liquid crystal display cell 100 is sometimes decreased in size into 50 ⁇ 50 micron meters.
  • the shading layer 140 since the shading layer 140 is deposited at the side of the opposite glass substrate 104, the shading layer 140 must be fully expanded to cover the whole area of the switching active element 120 and an edge portion of the transparent pixel electrode 106 in order to completely protect the switching active element 120 from light and to prevent a leak of light around the transparent electrode 132.
  • an allowance of about 10 micron meters is generally required when the opposite glass substrate 104 is positioned to be fitted to the principal glass substrate 102. Further, an overlapping of approximately 5 micron meters is required between the transparent electrode 132 and the shading layer 140. Accordingly, an allowance of about 15 micron meters is required at each side of the active matrix liquid crystal display cell 100, namely, an allowance of 30 micron meters is required at both sides of the active matrix liquid crystal display cell 100. In case of a cell of 50 ⁇ 50 micron meters, an effective pixel portion comes to be 20 ⁇ 20 micron meters. Thus, it was difficult to utilize light efficiency.
  • the capacitance element 130 is formed by the transparent pixel electrode 106 and the transparent electrode 132 both of which are made of ITO and between which the dielectric layer 134 is interposed. Since a transmittance of the each ITO layer is about 90%, it comes to be about 80% when light is transmitted through the transparent pixel electrode 106 as well as the transparent opposite electrode 108. Furthermore, since the transparent electrode 132 has a poor conductivity, it is required that the gate 121' be connected to a wiring (not shown) having low resistance. If the width of the gate 121' is 5 micron meters, the above-mentioned effective pixel portion is reduced to be 15 ⁇ 20 micron meters.
  • an active matrix liquid crystal display panel 200 comprises a plurality of active matrix liquid crystal display cells 300 which are arranged in a matrix fashion, signal buses 150, and gate buses 152.
  • each of the active matrix liquid crystal display cells 300 comprises a principal transparent glass substrate 302 having a principal surface 302a directed upwards in FIG. 3B, an opposite transparent glass substrate 304 having a lower surface 304a directed downwards in FIG. 3B, a thin-film transistor (TFT) 306 of top-gate type which is formed on the principal surface 302a, a first transparent electrode 308 connected to the TFT 306 for driving liquid crystal, a second transparent electrode 310 which is formed on the lower surface 304a and which is positioned opposite to the first transparent electrode 308, a shading layer 312 which is made of aluminum, and an insulating layer 314 which is formed by an anodic oxidation of aluminum.
  • TFT thin-film transistor
  • the shading layer 312 may alternatively be made of the other materials having a low transmittance.
  • the principal transparent glass substrate 302 and the opposite transparent glass substrate 304 are made of quartz glass.
  • the TFT 306 serves as an active switching element, which comprises a polycrystalline silicon layer 306a, a gate insulating layer 306b, a gate 306c, a drain 306d, and a source 306e.
  • the drain 306d is connected to the signal buses 150, while the gate 306c is connected to the gate buses 152.
  • a liquid crystal 316 is filled between the first transparent electrode 308 and the second transparent electrode 310.
  • the shading layer 312 has an upper and a side surfaces 312a and 312b.
  • the insulating layer 314 is formed on the upper and the side surfaces 312a and 312b by the above-mentioned anodic oxidation of aluminum.
  • the insulating layer 314 is therefore made of Al 2 O 3 .
  • the insulating layer 314 has a thickness between 100 and 200 nm.
  • an aluminum lamina is deposited in a known manner on a surface of an inter-electrodes insulating layer 315 to be patterned into the shading layer 312 having a predetermined pattern.
  • the shading layer 312 is then anodically oxidized to have the insulating layer 314 of Al 2 O 3 on its upper and side surfaces 312a and 312b.
  • the insulating layer 314 is interposed between the shading layer 312 and the first transparent electrode 308 with the shading layer 312 partially laid under the first transparent electrode 308 through the insulating layer 314.
  • a capacitance element 400 is defined by the shading layer 312, the first transparent electrode 308, and the insulating layer 314 interposed therebetween.
  • an overlapping area of the shading layer 312 and the first transparent electrode 308 need to have a width between 4 and 8 micron meters.
  • the portion where the source 306e is connected to the first transparent electrode 308 can not be covered by the shading layer 312, as illustrated in FIG. 3B. Accordingly, the source 306e serves as a shading layer at this portion.
  • two capacitance elements 400 and 410 are formed in parallel.
  • One comprises the first transparent electrode 308, the second transparent electrode 310, and the liquid crystal 316 filled therebetween, while another comprises the first transparent electrode 308, the shading layer 312, and the insulating layer 314 interposed therebetween.
  • Bias voltages V 1 and V 2 are applied to the capacitance elements 400 and 410, respectively.
  • the insulating layer 314 is formed by the anodic oxidation method, there are less defects, such as pin holes or the like, in the insulating layer 314 than that formed by the other method carried out on a lower temperature condition, for example, a plasma CVD, sputtering, or the like. Consequently, the capacitance element 410 having a large dielectric area can be fabricated with a good yield.
  • the active matrix liquid crystal display cell according to the second embodiment has a structure similar to that of the first embodiment except that the insulating layer 314 comprises primary and secondary insulating layers 314A and 314B.
  • the primary insulating layer 314A is formed by the anodic oxidation of the shading layer 312 to be made of Al 2 O 3
  • the secondary insulating layer 314B is formed by another manner, for example, plasma CVD method.
  • the primary insulating layer 314A of Al 2 O 3 is formed by the anodic oxidation of the shading layer 312 to have a thickness of 100 nm
  • the secondary insulating layer 314B of silicon nitride is formed by plasma CVD method to have a thickness of 100 nm.
  • the insulating layer 314 comprises two stacked layers, namely, primary and secondary insulating layers 314A and 314B, the above-mentioned defects, such as pin holes, in the insulating layer 314 are decreased in number, compared with the above-described first embodiment.
  • the active matrix liquid crystal display cells according to the third embodiment and the modification thereof have structures similar to that of the first and the second embodiments except that the anodic oxidation method is not used to fabricate those insulating layers.
  • a single insulating layer 314' is formed on the shading layer 312.
  • the insulating layer 314' is made of silicon nitride and formed by a plasma CVD method to have a thickness of, for example, 200 nm.
  • double insulating layers 314'A and 314'B are formed on the shading layer 312.
  • the insulating layer 314'A is made of silicon nitride and formed by a plasma CVD method to have a thickness of, for example, 100 nm.
  • the insulating layer 314'B is made of silicon oxide and formed by a sputtering to have a thickness of, for example, 100 nm.
  • the active matrix liquid crystal display cell according to the fourth embodiment has a structure similar to that of the first embodiment except that the shading layer 312 comprises double layers, one of which is a shading layer 312A of aluminum and another of which is a shading layer 312B of tantalum overlaid on the shading layer 312A.
  • the shading layer 312B of tantalum is readily oxidized by the anodic oxidation to have an insulating layer 320 of Ta 2 O 5 which has a high dielectrication. Accordingly, another insulating layer 321 of aluminum is formed on the side surfaces of the shading layer 312A.
  • the storage capacitance constant is extremely improved, compared with the above-mentioned first, second, and third embodiments.
  • the insulating layer 321 of aluminum is used to enhance a shading effect.
  • the active matrix liquid crystal display cell according to the fifth embodiment has a structure similar to that of the first embodiment except that the active matrix liquid crystal display cell further comprises an additional capacitance element.
  • the active matrix liquid crystal display cell 300' further comprises the additional capacitance element 330 which is positioned under the overlapping section of the first transparent electrode 308 and the shading layer 312 through an insulating layer 314.
  • the additional capacitance element 330 is defined by a polycrystalline silicon layer 330a, a gate insulating layer 330b, and a gate 330c.
  • the gate 330c is electrically connected to the gate buses 152.
  • the polycrystalline silicon layer 330a is connected to the polycrystalline silicon layer 306a.
  • a polycrystalline silicon lamina is, at first, formed on the principal transparent glass substrate 302.
  • the polycrystalline silicon lamina is then patterned to a predetermined shape to form a patterned polycrystalline silicon layer.
  • the gate insulating layer 330b is deposited on the patterned polycrystalline silicon layer.
  • a section of the patterned polycrystalline silicon layer overlaid by the gate 330c is doped by an ion implantation method to form the polycrystalline silicon layer 330a.
  • the additional capacitance element 330 is positioned under the overlapping section of the first transparent electrode 308 and the shading layer 312 through which light cannot pass originally. Accordingly, the additional capacitance element 330 makes it possible that the storage capacitance constant is drastically improved without deteriorating the efficent use of light.
  • the additional capacitance element 330 is also formed in parallel to the two capacitance elements 400 and 410 which were mentioned in the discussion of the first embodiment, as symbolized in FIG. 4.
  • the additional capacitance element 330 is connected between the source 306e of a transistor Q 1 and the gate 306c of a transistor Q 2 as symbolized in FIG. 10.
  • a TFT generally cannot avoid a leakage current between 0.1 pA and 1.0 pA. It is therefore desired that the constant of the storage capacitance be large enough to store a signal voltage without reduction while the active matrix liquid crystal display cell is scanned.
  • the constant of the storage capacitance of the two capacitance elements 400 and 410 is 100 pF, at the most.
  • the constant of 100 pF is not enough to store the signal voltage, as mentioned above, in view of the aforesaid leakage current of the TFT. Accordingly, it is very advantageous that the active matrix liquid crystal display cell 300' according to this embodiment comprises the additional capacitance element 330.

Abstract

In an active matrix liquid crystal display cell having a switching active element, first and second transparent electrodes between which liquid crystal is filled, and a shading layer for protecting the switching active element and enhancing a contrast of light, an insulating layer is interposed between the shading layer and the first transparent electrode with the shading layer partially laid under the first transparent electrode through the insulating layer.

Description

BACKGROUND OF THE INVENTION
The present invention relates to an active matrix liquid crystal display cell which serves to provide a single picture element, namely, a pixel, and an active matrix liquid crystal display panel comprising a plurality of the active matrix liquid crystal display cells arranged in a matrix fashion.
In the manner which will later be described more in detail, a conventional active matrix liquid crystal display cell of the type described comprises an active switch element for driving liquid crystal, a capacitance element which stores charge for driving the liquid crystal, a pair of transparent electrodes between which the liquid crystal is filled, and a shading layer for protecting the switching active element and enhancing a contrast of light.
Recently each of the active matrix liquid crystal display cells have become small in size in order to increase the numbers thereof for improving the resolution power of the active matrix liquid crystal display panel.
However, due to a structure of each active matrix liquid crystal display cell, the conventional active matrix liquid crystal display panel cannot provide a bright image when the active matrix liquid crystal display cell becomes small in size for the above-mentioned purpose.
SUMMARY OF THE INVENTION
It is therefore an object of this invention to provide an active matrix liquid crystal display cell and a panel comprising a plurality thereof which can provide a bright image, even though the active matrix liquid crystal display cell becomes small in size.
Other objects of this invention will become clear as the description proceeds.
According to an aspect of this invention, there is provided an active matrix liquid crystal display cell which comprises: an active switching element; first and second transparent electrodes between which the liquid crystal is filled, the first transparent electrode being connected to the switching active element for driving the liquid crystal and the second transparent electrode being positioned opposite to the first transparent electrode; a shading layer which is made of a conductive material; and an insulating layer which is interposed between the shading layer and the first transparent electrode with the shading layer partially laid under the first transparent electrode through the insulating layer. The shading layer may be made of aluminum and the insulating layer may be formed by an anodic oxidation of the aluminum.
According to another aspect of this invention, there is provided an active matrix liquid crystal display panel comprising a plurality of active matrix liquid crystal display cells arranged in a matrix fashion, each of the active matrix liquid crystal display cells comprising: an active switching element; first and second transparent electrodes between which the liquid crystal is filled, the first transparent electrode being connected to the switching active element for driving the liquid crystal and the second transparent electrode being positioned opposite to the first transparent electrode; a shading layer which is made of a conductive material; and an insulating layer which is interposed between the shading layer and the first transparent electrode with the shading layer partially laid under the first transparent electrode through the insulating layer.
BRIEF DESCRIPTION OF THE DRAWING
FIG. 1 is a schematic vertical sectional view of a conventional active matrix liquid crystal display cell;
FIG. 2 is a block diagram of an active matrix liquid crystal display panel according to a first embodiment of this invention;
FIG. 3A is a plan view of an active matrix liquid crystal display cell according to a first embodiment of this invention;
FIG. 3B is a schematic vertical sectional view taken across A-B-C of the active matrix liquid crystal display cell illustrated in FIG. 3A;
FIG. 4 shows an equivalent circuit of the active matrix liquid crystal display cell illustrated in FIGS. 3A and 3B;
FIG. 5 is a schematic vertical sectional view of a capacitance element of an active matrix liquid crystal display cell according to a second embodiment of this invention;
FIG. 6 is a schematic vertical sectional view of a capacitance element of an active matrix liquid crystal display cell according to a third embodiment of this invention;
FIG. 7 is a schematic vertical sectional view of a modification of the capacitance element illustrated in FIG. 6;
FIG. 8 is a schematic vertical sectional view of a capacitance element of an active matrix liquid crystal display cell according to a fourth embodiment of this invention;
FIG. 9A is a plan view of an active matrix liquid crystal display cell according to a fifth embodiment of this invention;
FIG. 9B is a schematic vertical sectional view taken across X-Y of the active matrix liquid crystal display cell illustrated in FIG. 9A; and
FIG. 10 shows an equivalent circuit of the active matrix liquid display cell illustrated in FIGS. 9A and 9B.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
Referring to FIG. 1, a conventional active matrix liquid crystal display cell will first be described for a better understanding of this invention.
In FIG. 1, the conventional active matrix liquid crystal display cell 100 comprises a principal glass substrate 102, an opposite glass substrate 104, a transparent pixel electrode 106 deposited at the side of the principal glass substrate 102, a transparent opposite electrode 108 formed under the whole area of the opposite glass substrate 104, and a liquid crystal 110 filled between the transparent pixel electrode 106 and the transparent opposite electrode 108, an active switching element 120, a capacitance element 130, and a shading layer 140.
The switching active element 120 is formed by a thin-film transistor (TFT) of a bottom gate type, which consists of a gate 121, a gate insulating layer 122, an amorphous silicon layer 123, a doped amorphous silicon layer 124, a drain 125, and a source 126. The gate 121 is connected to a gate bus (not shown) and the drain 125 is connected to a drain or signal bus (not shown), while the source 126 is connected to the transparent pixel electrode 106. The capacitance element 130 consists of the transparent pixel electrode 106, a transparent electrode 132, and a dielectric layer 134 which is defined by a portion of the gate insulating layer 122. The shading layer 140 is partially deposited under the transparent opposite electrode 108.
The liquid crystal 110 is also filled between the switching active element 120 and the shading layer 140, as illustrated in FIG. 1. In the active matrix liquid crystal display cell 100, the transparent pixel electrode 106, the transparent electrode 132 and the transparent opposite electrode 108 are formed from ITO (Indium Tin Oxide) layer.
As mentioned in the preamble of the instant specification, a plurality of the active matrix liquid crystal display cells 100 are arranged in a matrix fashion to form an active matrix liquid crystal display panel (not shown).
In order to increase numbers of the active matrix liquid crystal display cells 100 for getting an excellent resolution power of the active matrix liquid crystal display panel, each active matrix liquid crystal display cell 100 is sometimes decreased in size into 50×50 micron meters.
In such a case, two problems inevitably happens to the conventional active matrix liquid crystal display cell 100.
First, since the shading layer 140 is deposited at the side of the opposite glass substrate 104, the shading layer 140 must be fully expanded to cover the whole area of the switching active element 120 and an edge portion of the transparent pixel electrode 106 in order to completely protect the switching active element 120 from light and to prevent a leak of light around the transparent electrode 132.
However, an allowance of about 10 micron meters is generally required when the opposite glass substrate 104 is positioned to be fitted to the principal glass substrate 102. Further, an overlapping of approximately 5 micron meters is required between the transparent electrode 132 and the shading layer 140. Accordingly, an allowance of about 15 micron meters is required at each side of the active matrix liquid crystal display cell 100, namely, an allowance of 30 micron meters is required at both sides of the active matrix liquid crystal display cell 100. In case of a cell of 50×50 micron meters, an effective pixel portion comes to be 20×20 micron meters. Thus, it was difficult to utilize light efficiency.
Second, the problem lies on that the capacitance element 130 is formed by the transparent pixel electrode 106 and the transparent electrode 132 both of which are made of ITO and between which the dielectric layer 134 is interposed. Since a transmittance of the each ITO layer is about 90%, it comes to be about 80% when light is transmitted through the transparent pixel electrode 106 as well as the transparent opposite electrode 108. Furthermore, since the transparent electrode 132 has a poor conductivity, it is required that the gate 121' be connected to a wiring (not shown) having low resistance. If the width of the gate 121' is 5 micron meters, the above-mentioned effective pixel portion is reduced to be 15×20 micron meters.
Thus, in the conventional active matrix liquid crystal display cell 100, it was difficult to utilize light efficiently, when the cell 100 is made to have a minute size. As a result, an active matrix liquid crystal display panel which comprises a plurality of the cells 100 cannot provide a bright image.
Referring now to FIGS. 2, 3A, and 3B, description will proceed to an active matrix liquid crystal display cell and an active matrix liquid crystal display panel comprising a plurality of the active matrix liquid crystal display cells according to a first embodiment of this invention.
In FIG. 2, an active matrix liquid crystal display panel 200 comprises a plurality of active matrix liquid crystal display cells 300 which are arranged in a matrix fashion, signal buses 150, and gate buses 152.
As illustrated in FIGS. 3A and 3B, each of the active matrix liquid crystal display cells 300 comprises a principal transparent glass substrate 302 having a principal surface 302a directed upwards in FIG. 3B, an opposite transparent glass substrate 304 having a lower surface 304a directed downwards in FIG. 3B, a thin-film transistor (TFT) 306 of top-gate type which is formed on the principal surface 302a, a first transparent electrode 308 connected to the TFT 306 for driving liquid crystal, a second transparent electrode 310 which is formed on the lower surface 304a and which is positioned opposite to the first transparent electrode 308, a shading layer 312 which is made of aluminum, and an insulating layer 314 which is formed by an anodic oxidation of aluminum. The shading layer 312 may alternatively be made of the other materials having a low transmittance. The principal transparent glass substrate 302 and the opposite transparent glass substrate 304 are made of quartz glass. The TFT 306 serves as an active switching element, which comprises a polycrystalline silicon layer 306a, a gate insulating layer 306b, a gate 306c, a drain 306d, and a source 306e. The drain 306d is connected to the signal buses 150, while the gate 306c is connected to the gate buses 152.
A liquid crystal 316 is filled between the first transparent electrode 308 and the second transparent electrode 310.
The shading layer 312 has an upper and a side surfaces 312a and 312b. The insulating layer 314 is formed on the upper and the side surfaces 312a and 312b by the above-mentioned anodic oxidation of aluminum. The insulating layer 314 is therefore made of Al2 O3. Preferably, the insulating layer 314 has a thickness between 100 and 200 nm. In order to form the shading layer 312 and the insulating layer 314, at first, an aluminum lamina is deposited in a known manner on a surface of an inter-electrodes insulating layer 315 to be patterned into the shading layer 312 having a predetermined pattern. The shading layer 312 is then anodically oxidized to have the insulating layer 314 of Al2 O3 on its upper and side surfaces 312a and 312b.
Thus, the insulating layer 314 is interposed between the shading layer 312 and the first transparent electrode 308 with the shading layer 312 partially laid under the first transparent electrode 308 through the insulating layer 314.
With this structure, a capacitance element 400 is defined by the shading layer 312, the first transparent electrode 308, and the insulating layer 314 interposed therebetween.
As suggested by a segment D in FIG. 3A, an overlapping area of the shading layer 312 and the first transparent electrode 308 need to have a width between 4 and 8 micron meters.
In the interim, the portion where the source 306e is connected to the first transparent electrode 308 can not be covered by the shading layer 312, as illustrated in FIG. 3B. Accordingly, the source 306e serves as a shading layer at this portion.
As symbolized in FIG. 4, two capacitance elements 400 and 410 are formed in parallel. One comprises the first transparent electrode 308, the second transparent electrode 310, and the liquid crystal 316 filled therebetween, while another comprises the first transparent electrode 308, the shading layer 312, and the insulating layer 314 interposed therebetween. Bias voltages V1 and V2 are applied to the capacitance elements 400 and 410, respectively.
In this embodiment, since the insulating layer 314 is formed by the anodic oxidation method, there are less defects, such as pin holes or the like, in the insulating layer 314 than that formed by the other method carried out on a lower temperature condition, for example, a plasma CVD, sputtering, or the like. Consequently, the capacitance element 410 having a large dielectric area can be fabricated with a good yield.
Referring to FIG. 5, description will proceed to an active matrix liquid crystal display cell according to a second embodiment of this invention.
The active matrix liquid crystal display cell according to the second embodiment has a structure similar to that of the first embodiment except that the insulating layer 314 comprises primary and secondary insulating layers 314A and 314B. The primary insulating layer 314A is formed by the anodic oxidation of the shading layer 312 to be made of Al2 O3, while the secondary insulating layer 314B is formed by another manner, for example, plasma CVD method. In this embodiment, the primary insulating layer 314A of Al2 O3 is formed by the anodic oxidation of the shading layer 312 to have a thickness of 100 nm, while the secondary insulating layer 314B of silicon nitride is formed by plasma CVD method to have a thickness of 100 nm.
In this embodiment, since the insulating layer 314 comprises two stacked layers, namely, primary and secondary insulating layers 314A and 314B, the above-mentioned defects, such as pin holes, in the insulating layer 314 are decreased in number, compared with the above-described first embodiment.
Referring to FIGS. 6 and 7, description will proceed to active matrix liquid crystal display cells according to a third embodiment of this invention and a modification thereof.
The active matrix liquid crystal display cells according to the third embodiment and the modification thereof have structures similar to that of the first and the second embodiments except that the anodic oxidation method is not used to fabricate those insulating layers.
In FIG. 6, a single insulating layer 314' is formed on the shading layer 312. The insulating layer 314' is made of silicon nitride and formed by a plasma CVD method to have a thickness of, for example, 200 nm.
In FIG. 7, double insulating layers 314'A and 314'B are formed on the shading layer 312. The insulating layer 314'A is made of silicon nitride and formed by a plasma CVD method to have a thickness of, for example, 100 nm. On the other hand, the insulating layer 314'B is made of silicon oxide and formed by a sputtering to have a thickness of, for example, 100 nm.
Referring to FIG. 8, description will proceed to an active matrix liquid crystal display cell according to a fourth embodiment of this invention.
The active matrix liquid crystal display cell according to the fourth embodiment has a structure similar to that of the first embodiment except that the shading layer 312 comprises double layers, one of which is a shading layer 312A of aluminum and another of which is a shading layer 312B of tantalum overlaid on the shading layer 312A.
The shading layer 312B of tantalum is readily oxidized by the anodic oxidation to have an insulating layer 320 of Ta2 O5 which has a high dielectrication. Accordingly, another insulating layer 321 of aluminum is formed on the side surfaces of the shading layer 312A.
In this embodiment, it becomes possible that the storage capacitance constant is extremely improved, compared with the above-mentioned first, second, and third embodiments. In this example, the insulating layer 321 of aluminum is used to enhance a shading effect.
Referring to FIGS. 9A and 9B, description will proceed to an active matrix liquid crystal display cell according to a fifth embodiment of this invention.
The active matrix liquid crystal display cell according to the fifth embodiment has a structure similar to that of the first embodiment except that the active matrix liquid crystal display cell further comprises an additional capacitance element.
As illustrated in FIGS. 9A and 9B, the active matrix liquid crystal display cell 300' according to the fifth embodiment further comprises the additional capacitance element 330 which is positioned under the overlapping section of the first transparent electrode 308 and the shading layer 312 through an insulating layer 314. The additional capacitance element 330 is defined by a polycrystalline silicon layer 330a, a gate insulating layer 330b, and a gate 330c. The gate 330c is electrically connected to the gate buses 152. The polycrystalline silicon layer 330a is connected to the polycrystalline silicon layer 306a.
In order to fabricate the polycrystalline silicon layer 330a, a polycrystalline silicon lamina is, at first, formed on the principal transparent glass substrate 302. The polycrystalline silicon lamina is then patterned to a predetermined shape to form a patterned polycrystalline silicon layer. Second, the gate insulating layer 330b is deposited on the patterned polycrystalline silicon layer. Thereafter, a section of the patterned polycrystalline silicon layer overlaid by the gate 330c is doped by an ion implantation method to form the polycrystalline silicon layer 330a.
In this embodiment, the additional capacitance element 330 is positioned under the overlapping section of the first transparent electrode 308 and the shading layer 312 through which light cannot pass originally. Accordingly, the additional capacitance element 330 makes it possible that the storage capacitance constant is drastically improved without deteriorating the efficent use of light.
As symbolized in FIG. 10, the additional capacitance element 330 is also formed in parallel to the two capacitance elements 400 and 410 which were mentioned in the discussion of the first embodiment, as symbolized in FIG. 4. The additional capacitance element 330 is connected between the source 306e of a transistor Q1 and the gate 306c of a transistor Q2 as symbolized in FIG. 10.
In the meantime, a TFT generally cannot avoid a leakage current between 0.1 pA and 1.0 pA. It is therefore desired that the constant of the storage capacitance be large enough to store a signal voltage without reduction while the active matrix liquid crystal display cell is scanned.
When the active matrix liquid crystal display cell having such a TFT becomes small, in other words, is decreased in size to, for example, 50×50 micron meters, the constant of the storage capacitance of the two capacitance elements 400 and 410 is 100 pF, at the most. The constant of 100 pF is not enough to store the signal voltage, as mentioned above, in view of the aforesaid leakage current of the TFT. Accordingly, it is very advantageous that the active matrix liquid crystal display cell 300' according to this embodiment comprises the additional capacitance element 330.
While this invention has thus far been described in conjunction with only several embodiments thereof, it will readily be possible for those skilled in the art to put this invention into practice in various other manners.

Claims (14)

What is claimed is:
1. An active matrix liquid crystal display cell, comprising:
a principal transparent glass substrate having a principal surface;
an opposite transparent glass substrate having an opposite surface opposite to said principal surface with a space therebetween;
an active switching element formed on said principal surface, said active switching element having a plurality of electrodes;
an inter-electrode insulating layer formed on said principal surface for insulating said plurality of electrodes from each other;
a shading layer made of a conductive material and formed on said inter-electrode insulating layer;
a first transparent electrode formed on said inter-electrode insulation layer, said first transparent electrode having an overlapping portion overlapping a part of said shading layer and being connected to one of said plurality of electrodes;
an insulating layer interposed between said shading layer and said overlapping portion, wherein a capacitance element is defined by said shading layer, said overlapping portion, and said insulating layer interposed therebetween;
a second transparent electrode formed on said opposite surface positioned opposite to said first transparent electrode; and
a liquid crystal disposed between said first transparent electrode and said second transparent electrode, wherein said active switching element is a thin-film, top-gate transistor and said plurality of electrodes are a gate, a drain, and a source, said thin-film transistor further comprising:
a polycrystalline silicon layer formed on said principal surface to which said drain and said source are connected; and
a gate insulating layer overlaid on said polycrystalline silicon layer on which said gate is formed, whereby said gate is insulated from said polycrystalline silicon layer.
2. An active matrix liquid crystal display cell as claimed in claim 1, wherein said gate and said polycrystalline silicon layer are capacitively coupled to each other.
3. An active matrix liquid crystal display cell as claimed in claim 1, wherein said shading layer is made of aluminum and said insulating layer is formed by an anodic oxidation of said aluminum.
4. An active matrix liquid crystal display cell as claimed in claim 1, wherein said shading layer comprises tantalum and said insulating layer comprises a layer formed by an anodic oxidation of said tantalum.
5. An active matrix liquid crystal display cell as claimed in claim 1, wherein said insulating layer comprises at least two stacked layers.
6. An active matrix liquid crystal display cell as claimed in claim 5, wherein at least one of said stacked layers is formed by an anodic oxidation of said shading layer.
7. An active matrix liquid crystal display cell, comprising:
a principal transparent glass substrate having a principal surface;
an opposite transparent glass substrate having an opposite surface opposite to said principal surface with a space therebetween;
an active switching element formed on said principal surface, said active switching element having a plurality of electrodes;
an inter-electrode insulating layer formed on said principal surface for insulating said plurality of electrodes from each other;
a shading layer made of a conductive material and formed on said inter-electrode insulating layer;
a first transparent electrode formed on said inter-electrode insulation layer, said first transparent electrode having an overlapping portion overlapping a part of said shading layer and being connected to one of said plurality of electrodes;
an insulating layer interposed between said shading layer and said overlapping portion, wherein a capacitance element is defined by said shading layer, said overlapping portion, and said insulating layer interposed therebetween;
a second transparent electrode formed on said opposite surface positioned opposite to said first transparent electrode; and
a liquid crystal disposed between said first transparent electrode and said second transparent electrode, wherein said shading layer is made up of aluminum and said insulating layer is formed by an anodic oxidation of said aluminum.
8. An active matrix liquid crystal display cell, comprising:
a principal transparent glass substrate having a principal surface;
an opposite transparent glass substrate having an opposite surface opposite to said principal surface with a space therebetween;
an active switching element formed on said principal surface, said active switching element having a plurality of electrodes;
an inter-electrode insulating layer formed on said principal surface for insulating said plurality of electrodes from each other;
a shading layer made of a conductive material and formed on said inter-electrode insulating layer;
a first transparent electrode formed on said inter-electrode insulation layer, said first transparent electrode having an overlapping portion overlapping a part of said shading layer and being connected to one of said plurality of electrodes;
an insulating layer interposed between said shading layer and said overlapping portion, wherein a capacitance element is defined by said shading layer, said overlapping portion, and said insulating layer interposed therebetween;
a second transparent electrode formed on said opposite surface positioned opposite to said first transparent electrode; and
a liquid crystal disposed between said first transparent electrode and said second transparent electrode, wherein said shading layer comprises tantalum and said insulating layer comprises a layer formed by an anodic oxidation of said tantalum.
9. An active matrix liquid crystal display cell, comprising:
a principal transparent glass substrate having a principal surface;
an opposite transparent glass substrate having an opposite surface opposite to said principal surface with a space therebetween;
an active switching element formed on said principal surface, said active switching element having a plurality of electrodes;
an inter-electrode insulating layer formed on said principal surface for insulating said plurality of electrodes from each other;
a shading layer made of a conductive material and formed on said inter-electrode insulating layer;
a first transparent electrode formed on said inter-electrode insulation layer, said first transparent electrode having an overlapping portion overlapping a part of said shading layer and being connected to one of said plurality of electrodes;
an insulating layer interposed between said shading layer and said overlapping portion, wherein a capacitance element is defined by said shading layer, said overlapping portion, and said insulating layer interposed therebetween;
a second transparent electrode formed on said opposite surface positioned opposite to said first transparent electrode; and
a liquid crystal disposed between said first transparent electrode and said second transparent electrode, wherein said insulating layer comprises at least two stacked layers.
10. An active matrix liquid crystal display cell as claimed in claim 9, wherein at least one of said stacked layers is formed by an anodic oxidation of said shading layer.
11. An active matrix liquid crystal display cell, comprising:
an active switching element having a plurality of electrodes, said active switching element being located in a first layer in said active matrix liquid crystal display cell;
a shading layer made of a conductive material;
first and second transparent electrodes between which said liquid crystal is disposed, said first transparent electrode being connected to said active switching element for driving said liquid crystal and having an overlapping portion overlapping a part of said shading layer, said second transparent electrode being positioned opposite to said first transparent electrode; and
an insulating layer interposed between said shading layer and said overlapping portion, wherein a capacitance element is defined by said shading layer, said overlapping portion, and said insulating layer interposed therebetween; and said shading layer and said overlapping portion are located in a second layer in said active matrix liquid crystal display cell different from said first layer.
12. An active matrix liquid crystal display cell as claimed in claim 11, wherein said active switching element is a thin-film, top-gate transistor and said plurality of electrodes are a gate, a drain, and a source, said thin-film transistor further comprising:
a polycrystalline silicon layer to which said drain and said source are connected; and
a gate insulating layer overlaid on said polycrystalline silicon layer on which said gate is formed, whereby said gate is insulated from said polycrystalline silicon layer.
13. An active matrix liquid crystal display cell as claimed in claim 12, wherein said gate and said polycrystalline silicon layer are capacitively coupled to each other.
14. An active matrix liquid crystal display panel comprising a plurality of active matrix liquid crystal display cells arranged in a matrix fashion, each of said active matrix liquid crystal display cells comprising:
an active switching element having a plurality of electrodes, said active switching element being located in a first layer in said active matrix liquid crystal display cell;
a shading layer made of a conductive material;
first and second transparent electrodes between which said liquid crystal is disposed, said first transparent electrode being connected to said active switching element for driving said liquid crystal and having an overlapping portion overlapping a part of said shading layer, said second transparent electrode being positioned opposite to said first transparent electrode; and
an insulating layer interposed between said shading layer and said overlapping portion, wherein a capacitance element is defined by said shading layer, said overlapping portion, and said insulating layer interposed therebetween; and said shading layer and said overlapping portion are located in a second layer in said active matrix liquid crystal display cell different from said first layer.
US08/141,880 1992-10-27 1993-10-27 Active matrix liquid crystal display cell with light blocking capacitor electrode above insulating layer Expired - Lifetime US5499123A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP28803992A JP2924506B2 (en) 1992-10-27 1992-10-27 Pixel structure of active matrix liquid crystal display
JP4-288039 1992-10-27

Publications (1)

Publication Number Publication Date
US5499123A true US5499123A (en) 1996-03-12

Family

ID=17725042

Family Applications (1)

Application Number Title Priority Date Filing Date
US08/141,880 Expired - Lifetime US5499123A (en) 1992-10-27 1993-10-27 Active matrix liquid crystal display cell with light blocking capacitor electrode above insulating layer

Country Status (5)

Country Link
US (1) US5499123A (en)
EP (1) EP0604006B1 (en)
JP (1) JP2924506B2 (en)
KR (1) KR960014498B1 (en)
DE (1) DE69327571T2 (en)

Cited By (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5621555A (en) * 1993-12-31 1997-04-15 Goldstar Co., Ltd. Liquid crystal display having redundant pixel electrodes and thin film transistors and a manufacturing method thereof
US5671027A (en) * 1990-10-17 1997-09-23 Hitachi, Ltd. LCD device with TFTs in which pixel electrodes are formed in the same plane as the gate electrodes with anodized oxide films and before the deposition of the silicon gate insulator
US5706067A (en) * 1995-04-28 1998-01-06 International Business Machines Corporation Reflective spatial light modulator array
US5747830A (en) * 1995-09-14 1998-05-05 Canon Kabushiki Kaisha Semiconductor display device with a hydrogen supply and hydrogen diffusion barrier layers
US5777701A (en) * 1995-05-08 1998-07-07 Semiconductor Energy Laboratory Co., Ltd. Display device
US5781260A (en) * 1994-09-30 1998-07-14 Casio Computer Co., Ltd. Liquid crystal display device having light shading film
US5781254A (en) * 1995-08-29 1998-07-14 Lg Electronics Inc. Active matrix LCD having a non-conductive light shield layer
US5782665A (en) * 1995-12-29 1998-07-21 Xerox Corporation Fabricating array with storage capacitor between cell electrode and dark matrix
WO1999008152A1 (en) * 1997-08-12 1999-02-18 Thomson Consumer Electronics, Inc. High capacitance mirror driver cell
US5905548A (en) * 1997-02-25 1999-05-18 Sharp Kabushiki Kaisha Liquid crystal display device with large aperture ratio
US5953085A (en) * 1996-11-22 1999-09-14 Sharp Kabushiki Kaisha Liquid crystal display device having a storage capacitor
US5982460A (en) * 1996-06-25 1999-11-09 Semiconductor Energy Laboratory Co., Ltd. Electro-optical display
US5990491A (en) * 1994-04-29 1999-11-23 Semiconductor Energy Laboratory Co., Ltd. Active matrix device utilizing light shielding means for thin film transistors
US5990542A (en) * 1995-12-14 1999-11-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US6005648A (en) * 1996-06-25 1999-12-21 Semiconductor Energy Laboratory Co., Ltd. Display device
US6034747A (en) * 1995-09-27 2000-03-07 Sharp Kabushiki Kaisha Active matrix substrate and display device incorporating the same
US6115088A (en) * 1996-09-04 2000-09-05 Semiconductor Energy Laboratory Co., Ltd. Display device
US6121652A (en) * 1994-06-13 2000-09-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including active matrix circuit
US6160269A (en) * 1994-06-14 2000-12-12 Semiconductor Energy Laboratory Co., Ltd. Thin film semiconductor integrated circuit
US6225218B1 (en) 1995-12-20 2001-05-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and its manufacturing method
US6306694B1 (en) 1999-03-12 2001-10-23 Semiconductor Energy Laboratory Co., Ltd. Process of fabricating a semiconductor device
US6320224B1 (en) 1995-01-17 2001-11-20 Semiconductor Energy Laboratory Co., Ltd. Method for producing a semiconductor integrated circuit including a thin film transistor and a capacitor
US6327014B1 (en) * 1995-03-09 2001-12-04 Thomson Licensing S.A. Liquid crystal screen with enlarged viewing angle
US20010055841A1 (en) * 2000-04-17 2001-12-27 Shunpei Yamazaki Light emitting device and manufacturing method thereof
US6335772B1 (en) * 1999-05-18 2002-01-01 Sony Corporation Apparatus and method for a liquid crystal display device having an electrically-conductive light-shading layer formed on a smoothed layer
US6365915B1 (en) * 1998-03-26 2002-04-02 Sanyo Electric Co., Ltd. Thin film transistor
US6388291B1 (en) 1994-04-29 2002-05-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor integrated circuit and method for forming the same
US6410960B1 (en) 1993-05-21 2002-06-25 Semiconductor Energy Laboratory Co., Ltd. Hybrid integrated circuit component
US6436827B1 (en) 1996-11-07 2002-08-20 Semiconductor Energy Laboratory Co., Ltd. Fabrication method of a semiconductor device
US6459125B2 (en) * 1998-02-26 2002-10-01 Mitsubishi Denki Kabushiki Kaisha SOI based transistor inside an insulation layer with conductive bump on the insulation layer
US6490014B1 (en) 1997-03-28 2002-12-03 Semiconductor Energy Laboratory Co., Ltd. Active matrix liquid crystal display device having light-interruptive film over insulating film and opening of the upper insulating film
US20020195603A1 (en) * 2001-05-18 2002-12-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US6512504B1 (en) 1999-04-27 2003-01-28 Semiconductor Energy Laborayory Co., Ltd. Electronic device and electronic apparatus
US6531993B1 (en) 1999-03-05 2003-03-11 Semiconductor Energy Laboratory Co., Ltd. Active matrix type display device
US6576926B1 (en) 1999-02-23 2003-06-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and fabrication method thereof
US6576924B1 (en) 1999-02-12 2003-06-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having at least a pixel unit and a driver circuit unit over a same substrate
US20030173567A1 (en) * 1999-05-14 2003-09-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of fabricating the same
US6628363B1 (en) 1998-06-03 2003-09-30 Sanyo Electric Co., Ltd. Thin film transistor having a covered channel and display unit using the same
US20030189210A1 (en) * 2002-04-09 2003-10-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device
US6690434B1 (en) 1999-03-15 2004-02-10 Semiconductor Energy Laboratory Co., Ltd. Active matrix liquid crystal display device
US20040084673A1 (en) * 1999-07-06 2004-05-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of fabricating the same
US20040090565A1 (en) * 1992-10-08 2004-05-13 Hitachi, Ltd. LCD and projection type display using same
US6737302B2 (en) 2001-10-31 2004-05-18 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method for field-effect transistor
US6777254B1 (en) 1999-07-06 2004-08-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and fabrication method thereof
US6777716B1 (en) * 1999-02-12 2004-08-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device and method of manufacturing therefor
US6784457B2 (en) 1999-12-14 2004-08-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US6800875B1 (en) 1995-11-17 2004-10-05 Semiconductor Energy Laboratory Co., Ltd. Active matrix electro-luminescent display device with an organic leveling layer
US20040201788A1 (en) * 1995-10-16 2004-10-14 Sharp Kabushiki Kaisha Semiconductor device
US6831297B2 (en) 2001-09-26 2004-12-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US20050156174A1 (en) * 1999-05-14 2005-07-21 Semiconductor Energy Laboratory Co., Ltd. Capacitor, semiconductor device, and manufacturing method thereof
US20050200767A1 (en) * 1999-03-29 2005-09-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US6963382B1 (en) 1995-11-17 2005-11-08 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display and method of driving same
US20050282305A1 (en) * 2002-04-09 2005-12-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
US20060082568A1 (en) * 2000-06-06 2006-04-20 Semiconductor Energy Laboratory Co., Ltd. Display device and method of manufacturing the same
US20060132401A1 (en) * 2000-06-12 2006-06-22 Semiconductor Energy Laboratory Co., Ltd. Light emitting module and method of driving the same, and optical sensor
US20060220021A1 (en) * 2000-01-20 2006-10-05 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device
US20070035677A1 (en) * 1999-05-20 2007-02-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US20070064184A1 (en) * 2005-09-16 2007-03-22 Sanyo Epson Imaging Devices Corporation Liquid crystal device, method of manufacturing liquid crystal device, and electronic apparatus
US7397518B1 (en) 1997-01-17 2008-07-08 Semiconductor Energy Laboratory Co., Ltd. Active matrix liquid crystal with capacitor below disclination region
US20080315202A1 (en) * 1995-11-17 2008-12-25 Semiconductor Energy Laboratory Co., Ltd. Display device
US20090020762A1 (en) * 2002-04-15 2009-01-22 Semiconductor Energy Laboratory Co., Ltd. Display device and method of fabricating the same
US20090200611A1 (en) * 1993-10-01 2009-08-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and a method for manufacturing the same
US7821065B2 (en) * 1999-03-02 2010-10-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising a thin film transistor comprising a semiconductor thin film and method of manufacturing the same
US7964874B2 (en) 2002-04-15 2011-06-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having a protective circuit
US8120031B2 (en) 2002-05-17 2012-02-21 Semiconductor Energy Laboratory Co., Ltd. Display device including an opening formed in a gate insulating film, a passivation film, and a barrier film
US20120287365A1 (en) * 1996-01-26 2012-11-15 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal electro-optical device
US10690978B2 (en) 2018-05-28 2020-06-23 Wuhan China Star Optoelectronics Technology Co., Ltd. Array substrate, display panel, and display

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2777545B2 (en) * 1994-12-05 1998-07-16 株式会社フロンテック Active matrix liquid crystal display
JP2001125510A (en) * 1995-11-17 2001-05-11 Semiconductor Energy Lab Co Ltd Active matrix type el display device
JPH10115840A (en) * 1996-10-08 1998-05-06 Casio Comput Co Ltd Matrix type liquid crystal display device
JP3941901B2 (en) 1998-04-28 2007-07-11 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
US6313481B1 (en) 1998-08-06 2001-11-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and a method of manufacturing the same
JP4860293B2 (en) * 1999-02-12 2012-01-25 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
JP4651777B2 (en) * 1999-06-02 2011-03-16 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
US7456911B2 (en) * 2000-08-14 2008-11-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP4739510B2 (en) * 2000-12-15 2011-08-03 株式会社半導体エネルギー研究所 Semiconductor device and manufacturing method thereof
US6897477B2 (en) * 2001-06-01 2005-05-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method thereof, and display device
JP5046445B2 (en) * 2001-07-31 2012-10-10 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
JP4095518B2 (en) * 2002-10-31 2008-06-04 セイコーエプソン株式会社 Electro-optical device and electronic apparatus
JP4506133B2 (en) * 2002-10-31 2010-07-21 セイコーエプソン株式会社 Electro-optical device and electronic apparatus
JP2007108513A (en) * 2005-10-14 2007-04-26 Koninkl Philips Electronics Nv Liquid crystal display and its manufacturing method
JP4818839B2 (en) 2006-07-19 2011-11-16 株式会社 日立ディスプレイズ Liquid crystal display device and manufacturing method thereof
JP4628393B2 (en) * 2007-04-24 2011-02-09 株式会社半導体エネルギー研究所 Method for manufacturing active matrix liquid crystal display device
CN108761939A (en) * 2018-05-28 2018-11-06 武汉华星光电技术有限公司 Array substrate, display panel and display

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0136509A2 (en) * 1983-08-23 1985-04-10 Kabushiki Kaisha Toshiba Active matrix type display apparatus
JPS6442635A (en) * 1987-08-11 1989-02-14 Asahi Glass Co Ltd Active matrix type display element
EP0376437A2 (en) * 1988-08-10 1990-07-04 Sharp Kabushiki Kaisha An active matrix type liquid crystal display
EP0434161A2 (en) * 1989-12-22 1991-06-26 Koninklijke Philips Electronics N.V. Active matrix electro-optic display device with storage capacitors and projection color apparatus employing same
EP0464579A2 (en) * 1990-06-25 1992-01-08 Nec Corporation Thin film field effect transistor array for use in active matrix liquid crystal display
JPH0451121A (en) * 1990-06-18 1992-02-19 Sharp Corp Active matrix liquid crystal display device
US5132820A (en) * 1987-06-10 1992-07-21 Hitachi, Ltd. TFT active matrix liquid crystal display devices
US5162933A (en) * 1990-05-16 1992-11-10 Nippon Telegraph And Telephone Corporation Active matrix structure for liquid crystal display elements wherein each of the gate/data lines includes at least a molybdenum-base alloy layer containing 0.5 to 10 wt. % of chromium
US5177577A (en) * 1990-07-05 1993-01-05 Hitachi, Ltd. Liquid crystal display device with TFT's each including a Ta gate electrode and an anodized Al oxide film
JPH05216067A (en) * 1992-02-04 1993-08-27 Sony Corp Thin-film transistor array
US5305128A (en) * 1989-12-22 1994-04-19 North American Philips Corporation Active matrix electro-optic display device with storage capacitors and projection color apparatus employing same
US5339181A (en) * 1991-09-05 1994-08-16 Samsung Electronics Co., Ltd. Liquid crystal display comprising a storage capacitor including the closed-ended electrode for providing a current bath for circumventing break
US5414547A (en) * 1991-11-29 1995-05-09 Seiko Epson Corporation Liquid crystal display device and manufacturing method therefor

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0136509A2 (en) * 1983-08-23 1985-04-10 Kabushiki Kaisha Toshiba Active matrix type display apparatus
US5132820A (en) * 1987-06-10 1992-07-21 Hitachi, Ltd. TFT active matrix liquid crystal display devices
JPS6442635A (en) * 1987-08-11 1989-02-14 Asahi Glass Co Ltd Active matrix type display element
EP0376437A2 (en) * 1988-08-10 1990-07-04 Sharp Kabushiki Kaisha An active matrix type liquid crystal display
EP0434161A2 (en) * 1989-12-22 1991-06-26 Koninklijke Philips Electronics N.V. Active matrix electro-optic display device with storage capacitors and projection color apparatus employing same
US5305128A (en) * 1989-12-22 1994-04-19 North American Philips Corporation Active matrix electro-optic display device with storage capacitors and projection color apparatus employing same
US5162933A (en) * 1990-05-16 1992-11-10 Nippon Telegraph And Telephone Corporation Active matrix structure for liquid crystal display elements wherein each of the gate/data lines includes at least a molybdenum-base alloy layer containing 0.5 to 10 wt. % of chromium
JPH0451121A (en) * 1990-06-18 1992-02-19 Sharp Corp Active matrix liquid crystal display device
EP0464579A2 (en) * 1990-06-25 1992-01-08 Nec Corporation Thin film field effect transistor array for use in active matrix liquid crystal display
US5177577A (en) * 1990-07-05 1993-01-05 Hitachi, Ltd. Liquid crystal display device with TFT's each including a Ta gate electrode and an anodized Al oxide film
US5339181A (en) * 1991-09-05 1994-08-16 Samsung Electronics Co., Ltd. Liquid crystal display comprising a storage capacitor including the closed-ended electrode for providing a current bath for circumventing break
US5414547A (en) * 1991-11-29 1995-05-09 Seiko Epson Corporation Liquid crystal display device and manufacturing method therefor
JPH05216067A (en) * 1992-02-04 1993-08-27 Sony Corp Thin-film transistor array

Cited By (270)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5671027A (en) * 1990-10-17 1997-09-23 Hitachi, Ltd. LCD device with TFTs in which pixel electrodes are formed in the same plane as the gate electrodes with anodized oxide films and before the deposition of the silicon gate insulator
US6879358B2 (en) * 1992-10-08 2005-04-12 Hitachi, Ltd. LCD and projection type display using same
US20040090565A1 (en) * 1992-10-08 2004-05-13 Hitachi, Ltd. LCD and projection type display using same
US6410960B1 (en) 1993-05-21 2002-06-25 Semiconductor Energy Laboratory Co., Ltd. Hybrid integrated circuit component
US7863619B2 (en) 1993-10-01 2011-01-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and a method for manufacturing the same
US7615786B2 (en) 1993-10-01 2009-11-10 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor incorporating an integrated capacitor and pixel region
US8053778B2 (en) 1993-10-01 2011-11-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and a method for manufacturing the same
US20090200611A1 (en) * 1993-10-01 2009-08-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and a method for manufacturing the same
US8324693B2 (en) 1993-10-01 2012-12-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and a method for manufacturing the same
US5621555A (en) * 1993-12-31 1997-04-15 Goldstar Co., Ltd. Liquid crystal display having redundant pixel electrodes and thin film transistors and a manufacturing method thereof
US6800873B2 (en) 1994-04-29 2004-10-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
US20060284221A1 (en) * 1994-04-29 2006-12-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
US5990491A (en) * 1994-04-29 1999-11-23 Semiconductor Energy Laboratory Co., Ltd. Active matrix device utilizing light shielding means for thin film transistors
US20030116766A1 (en) * 1994-04-29 2003-06-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
US6501097B1 (en) 1994-04-29 2002-12-31 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device
US6433361B1 (en) 1994-04-29 2002-08-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor integrated circuit and method for forming the same
US7102164B2 (en) 1994-04-29 2006-09-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having a conductive layer with a light shielding part
US6388291B1 (en) 1994-04-29 2002-05-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor integrated circuit and method for forming the same
US8319715B2 (en) 1994-04-29 2012-11-27 Semiconductor Energy Laboratory Co., Ltd. Active matrix type liquid crystal display device
US7423291B2 (en) 1994-04-29 2008-09-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
US6121652A (en) * 1994-06-13 2000-09-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including active matrix circuit
US20030201435A1 (en) * 1994-06-13 2003-10-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including active matrix circuit
US7161178B2 (en) 1994-06-13 2007-01-09 Semiconductor Energy Laboratory Co., Ltd. Display device having a pixel electrode through a second interlayer contact hole in a wider first contact hole formed over an active region of display switch
US7479657B2 (en) 1994-06-13 2009-01-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including active matrix circuit
US6566684B1 (en) 1994-06-13 2003-05-20 Semiconductor Energy Laboratory Co., Ltd. Active matrix circuit having a TFT with pixel electrode as auxiliary capacitor
US6690063B2 (en) 1994-06-14 2004-02-10 Semiconductor Energy Laboratory Co., Ltd. Thin film semiconductor integrated circuit and method for forming the same
US6417057B1 (en) 1994-06-14 2002-07-09 Semiconductor Energy Laboratory Co., Ltd. Method of forming a semiconductor device having a TFT utilizing optical annealing before a gate electrode is formed
US6160269A (en) * 1994-06-14 2000-12-12 Semiconductor Energy Laboratory Co., Ltd. Thin film semiconductor integrated circuit
US5781260A (en) * 1994-09-30 1998-07-14 Casio Computer Co., Ltd. Liquid crystal display device having light shading film
US6011604A (en) * 1994-09-30 2000-01-04 Casio Computer Co., Ltd. Liquid crystal display device having light shading film
US20080246039A1 (en) * 1995-01-17 2008-10-09 Semiconductor Energy Laboratory Co., Ltd. Method for producing a semiconductor integrated circuit including a thin film transistor and a capacitor
US7687809B2 (en) 1995-01-17 2010-03-30 Semiconductor Energy Laboratory Co., Ltd Method for producing a semiconductor integrated circuit including a thin film transistor and a capacitor
US7517738B2 (en) 1995-01-17 2009-04-14 Semiconductor Energy Laboratory Co., Ltd. Method for producing a semiconductor integrated circuit including a thin film transistor and a capacitor
US6320224B1 (en) 1995-01-17 2001-11-20 Semiconductor Energy Laboratory Co., Ltd. Method for producing a semiconductor integrated circuit including a thin film transistor and a capacitor
US6327014B1 (en) * 1995-03-09 2001-12-04 Thomson Licensing S.A. Liquid crystal screen with enlarged viewing angle
US5706067A (en) * 1995-04-28 1998-01-06 International Business Machines Corporation Reflective spatial light modulator array
US7110059B2 (en) 1995-05-08 2006-09-19 Semiconductor Energy Laboratory Co., Ltd. Display device
US6219118B1 (en) * 1995-05-08 2001-04-17 Semiconductor Energy Laboratory Co., Ltd. LCD with shield film formed at overlapping portion of bus lines and pixel electrode
US7683978B2 (en) 1995-05-08 2010-03-23 Semiconductor Energy Laboratory Co., Ltd. Display device
US7190420B2 (en) * 1995-05-08 2007-03-13 Semiconductor Energy Laboratory Co., Ltd. Display device
US5777701A (en) * 1995-05-08 1998-07-07 Semiconductor Energy Laboratory Co., Ltd. Display device
US20070153169A1 (en) * 1995-05-08 2007-07-05 Semiconductor Energy Laboratory Co., Ltd. Display device
US20050099557A1 (en) * 1995-05-08 2005-05-12 Semiconductor Laboratory Co., Ltd., A Japan Corporation Display device
US5781254A (en) * 1995-08-29 1998-07-14 Lg Electronics Inc. Active matrix LCD having a non-conductive light shield layer
US5747830A (en) * 1995-09-14 1998-05-05 Canon Kabushiki Kaisha Semiconductor display device with a hydrogen supply and hydrogen diffusion barrier layers
US6034747A (en) * 1995-09-27 2000-03-07 Sharp Kabushiki Kaisha Active matrix substrate and display device incorporating the same
US7190418B2 (en) 1995-10-16 2007-03-13 Sharp Kabushiki Kaisha Semiconductor device
US20060082711A1 (en) * 1995-10-16 2006-04-20 Sharp Kabushiki Kaisha Semiconductor device
US7057691B2 (en) * 1995-10-16 2006-06-06 Sharp Kabushiki Kaisha Semiconductor device
US20040201788A1 (en) * 1995-10-16 2004-10-14 Sharp Kabushiki Kaisha Semiconductor device
US6867434B2 (en) 1995-11-17 2005-03-15 Semiconductor Energy Laboratory Co., Ltd. Active matrix electro-luminescent display with an organic leveling layer
US8203147B2 (en) 1995-11-17 2012-06-19 Semiconductor Energy Laboratory Co., Ltd. Display device
US20100060811A1 (en) * 1995-11-17 2010-03-11 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display and method of driving same
US7855381B2 (en) 1995-11-17 2010-12-21 Semiconductor Energy Laboratory Co., Ltd. Device including resin film
US7361931B2 (en) 1995-11-17 2008-04-22 Semiconductor Energy Laboratory Co., Ltd. Active matrix electro-luminescent display with an organic leveling layer
US20080315202A1 (en) * 1995-11-17 2008-12-25 Semiconductor Energy Laboratory Co., Ltd. Display device
US9213193B2 (en) 1995-11-17 2015-12-15 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display and method of driving
US7616282B2 (en) 1995-11-17 2009-11-10 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display and method of driving same
US20110147750A1 (en) * 1995-11-17 2011-06-23 Semiconductor Energy Laboratory Co., Ltd. Display device
US6800875B1 (en) 1995-11-17 2004-10-05 Semiconductor Energy Laboratory Co., Ltd. Active matrix electro-luminescent display device with an organic leveling layer
US8154697B2 (en) 1995-11-17 2012-04-10 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display and method of driving same
US6963382B1 (en) 1995-11-17 2005-11-08 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display and method of driving same
US20060001817A1 (en) * 1995-11-17 2006-01-05 Semiconductor Energy Laboratory Co., Ltd., A Japan Corporation Liquid crystal display and method of driving same
US7413937B2 (en) 1995-12-14 2008-08-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US6787887B2 (en) 1995-12-14 2004-09-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US5990542A (en) * 1995-12-14 1999-11-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US7034381B2 (en) 1995-12-14 2006-04-25 Semiconductor Energey Laboratory Co., Ltd. Semiconductor device
US7202551B2 (en) 1995-12-14 2007-04-10 Semiconductor Energy Laboratory Co., Ltd. Display device having underlying insulating film and insulating films
US20070173058A1 (en) * 1995-12-14 2007-07-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US20050023526A1 (en) * 1995-12-14 2005-02-03 Semiconductor Energy Laboratory Co., Ltd., A Japan Corporation Semiconductor device
US20060163576A1 (en) * 1995-12-14 2006-07-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor Device
US6225218B1 (en) 1995-12-20 2001-05-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and its manufacturing method
US7750476B2 (en) 1995-12-20 2010-07-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having a reliable contact
US5782665A (en) * 1995-12-29 1998-07-21 Xerox Corporation Fabricating array with storage capacitor between cell electrode and dark matrix
US20120287365A1 (en) * 1996-01-26 2012-11-15 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal electro-optical device
US8514361B2 (en) * 1996-01-26 2013-08-20 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal having common electrode
US20070182873A1 (en) * 1996-06-25 2007-08-09 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device
US5982460A (en) * 1996-06-25 1999-11-09 Semiconductor Energy Laboratory Co., Ltd. Electro-optical display
US6246453B1 (en) 1996-06-25 2001-06-12 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device
US7542103B2 (en) 1996-06-25 2009-06-02 Semiconductor Energy Laboratory Electro-optical device
US6005648A (en) * 1996-06-25 1999-12-21 Semiconductor Energy Laboratory Co., Ltd. Display device
US6097454A (en) * 1996-06-25 2000-08-01 Semiconductor Energy Laboratory Co., Ltd. Display device
US6914260B2 (en) 1996-06-25 2005-07-05 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device
US20050146667A1 (en) * 1996-06-25 2005-07-07 Semiconductor Energy Laboratory Co., Ltd., A Japan Corporation Electro-optical device
US7206053B2 (en) 1996-06-25 2007-04-17 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device
US7046313B2 (en) 1996-09-04 2006-05-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including a source line formed on interlayer insulating film having flattened surface
US8586985B2 (en) 1996-09-04 2013-11-19 Semiconductor Energy Laboratory Co., Ltd. Display device
US6421101B1 (en) 1996-09-04 2002-07-16 Semiconductor Energy Laboratory Co., Ltd. Display device including a transparent electrode pattern covering and extending along gate & source lines
US20060192201A1 (en) * 1996-09-04 2006-08-31 Semiconductor Energy Laboratory Co., Ltd. Display device
US7023502B2 (en) 1996-09-04 2006-04-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having light-shielded thin film transistor
US6115088A (en) * 1996-09-04 2000-09-05 Semiconductor Energy Laboratory Co., Ltd. Display device
US7646022B2 (en) 1996-09-04 2010-01-12 Semiconductor Energy Laboratory Co., Ltd. Display device
US20020171780A1 (en) * 1996-09-04 2002-11-21 Hongyong Zhang Display device
US20100044714A1 (en) * 1996-09-04 2010-02-25 Semiconductor Energy Laboratory Co., Ltd. Display device
US20050151891A1 (en) * 1996-09-04 2005-07-14 Semiconductor Energy Laboratory Co., Ltd., A Japan Corporation Display Device
US8536577B2 (en) 1996-09-04 2013-09-17 Semiconductor Energy Laboratory Co., Ltd. Display device
US20110163315A1 (en) * 1996-09-04 2011-07-07 Semiconductor Energy Laboratory Co., Ltd. Display device
US7863618B2 (en) * 1996-09-04 2011-01-04 Semiconductor Energy Laboratory Co., Ltd. Display device
US7470580B2 (en) 1996-11-07 2008-12-30 Semiconductor Energy Laboratory Co., Ltd. Fabrication method of a semiconductor device
US20070111511A1 (en) * 1996-11-07 2007-05-17 Semiconductor Energy Laboratory Co., Ltd. Fabrication method of a semiconductor device
US7163854B2 (en) 1996-11-07 2007-01-16 Semiconductor Energy Laboratory Co., Ltd. Fabrication method of a semiconductor device
US6436827B1 (en) 1996-11-07 2002-08-20 Semiconductor Energy Laboratory Co., Ltd. Fabrication method of a semiconductor device
US5953085A (en) * 1996-11-22 1999-09-14 Sharp Kabushiki Kaisha Liquid crystal display device having a storage capacitor
US7397518B1 (en) 1997-01-17 2008-07-08 Semiconductor Energy Laboratory Co., Ltd. Active matrix liquid crystal with capacitor below disclination region
US7898605B2 (en) 1997-01-17 2011-03-01 Semiconductor Energy Laboratory Co., Ltd. Active matrix liquid crystal with capacitor below disclination region
US8860899B2 (en) 1997-01-17 2014-10-14 Semiconductor Energy Laboratory Co., Ltd. Active matrix liquid crystal display device
US20110147758A1 (en) * 1997-01-17 2011-06-23 Semiconductor Energy Laboratory Co., Ltd. Active matrix liquid crystal display device
US8218100B2 (en) 1997-01-17 2012-07-10 Semiconductor Energy Laboratory Co., Ltd. Active matrix liquid crystal display device
US5905548A (en) * 1997-02-25 1999-05-18 Sharp Kabushiki Kaisha Liquid crystal display device with large aperture ratio
US7948571B2 (en) 1997-03-28 2011-05-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having thin film transistor with particular drain electrode structure
US20090134395A1 (en) * 1997-03-28 2009-05-28 Semiconductor Energy Laboratory Co., Ltd. Active matrix liquid crystal display device
US20030168688A1 (en) * 1997-03-28 2003-09-11 Semiconductor Energy Laboratory Co., Ltd. Active matrix liquid crystal display device
US7483089B2 (en) * 1997-03-28 2009-01-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having thin film transistor with particular drain electrode
US20110215327A1 (en) * 1997-03-28 2011-09-08 Semiconductor Energy Laboratory Co., Ltd. Active matrix liquid crystal display device
US6490014B1 (en) 1997-03-28 2002-12-03 Semiconductor Energy Laboratory Co., Ltd. Active matrix liquid crystal display device having light-interruptive film over insulating film and opening of the upper insulating film
US8248551B2 (en) 1997-03-28 2012-08-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including capacitor line parallel to source line
US8531619B2 (en) 1997-03-28 2013-09-10 Semiconductor Energy Laboratory Co., Ltd. Active matrix liquid crystal display device with overlapping conductive film and pixel electrode
WO1999008152A1 (en) * 1997-08-12 1999-02-18 Thomson Consumer Electronics, Inc. High capacitance mirror driver cell
US6069405A (en) * 1997-08-12 2000-05-30 Thomson Licensing S.A. High capacitance mirror driver cell
US6459125B2 (en) * 1998-02-26 2002-10-01 Mitsubishi Denki Kabushiki Kaisha SOI based transistor inside an insulation layer with conductive bump on the insulation layer
US6365915B1 (en) * 1998-03-26 2002-04-02 Sanyo Electric Co., Ltd. Thin film transistor
US6628363B1 (en) 1998-06-03 2003-09-30 Sanyo Electric Co., Ltd. Thin film transistor having a covered channel and display unit using the same
US7288789B2 (en) 1999-02-12 2007-10-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having thin film transistor and light-shielding film
US20050007494A1 (en) * 1999-02-12 2005-01-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing therefor
US20030201439A1 (en) * 1999-02-12 2003-10-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing the same
US6777716B1 (en) * 1999-02-12 2004-08-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device and method of manufacturing therefor
US9235095B2 (en) 1999-02-12 2016-01-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising a second organic film over a third insulating film wherein the second organic film overlaps with a channel formation region and a second conductive film
US6576924B1 (en) 1999-02-12 2003-06-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having at least a pixel unit and a driver circuit unit over a same substrate
US8994887B2 (en) 1999-02-12 2015-03-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising a second organic film over a third insulating film wherein the second organic film overlaps with a channel formation region and a second conductive film
US8896777B2 (en) 1999-02-12 2014-11-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising a spacer wherein the spacer has an opening through which a pixel electrode is connected to a first transistor
US8023042B2 (en) 1999-02-12 2011-09-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing therefor
US20100264421A1 (en) * 1999-02-23 2010-10-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and fabrication method thereof
US9910334B2 (en) 1999-02-23 2018-03-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and fabrication method thereof
US7365393B2 (en) 1999-02-23 2008-04-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and fabrication method thereof
US20070200113A1 (en) * 1999-02-23 2007-08-30 Semiconductor Energy Laboratory Co., Ltd Semiconductor device and fabrication method thereof
US8030659B2 (en) 1999-02-23 2011-10-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and fabrication method thereof
US6967129B2 (en) 1999-02-23 2005-11-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and fabrication method thereof
US8471262B2 (en) 1999-02-23 2013-06-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and fabrication method thereof
US8558241B2 (en) 1999-02-23 2013-10-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and fabrication method thereof
US7442991B2 (en) * 1999-02-23 2008-10-28 Semiconductor Energy Laboratory Co., Ltd. Display including casing and display unit
US6576926B1 (en) 1999-02-23 2003-06-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and fabrication method thereof
US8575619B2 (en) 1999-02-23 2013-11-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and fabrication method thereof
US7745829B2 (en) 1999-02-23 2010-06-29 Semiconductor Energy Laboratory Co., Ltd Semiconductor device and fabrication method thereof
US20090014724A1 (en) * 1999-02-23 2009-01-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor Device and Fabrication Method Thereof
US9431431B2 (en) 1999-02-23 2016-08-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and fabrication method thereof
US8847316B2 (en) 1999-03-02 2014-09-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing the same
US8445962B2 (en) 1999-03-02 2013-05-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing the same
US7821065B2 (en) * 1999-03-02 2010-10-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising a thin film transistor comprising a semiconductor thin film and method of manufacturing the same
US9153604B2 (en) 1999-03-02 2015-10-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing the same
US20110095312A1 (en) * 1999-03-02 2011-04-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor Device and Method of Manufacturing the Same
US6531993B1 (en) 1999-03-05 2003-03-11 Semiconductor Energy Laboratory Co., Ltd. Active matrix type display device
US6306694B1 (en) 1999-03-12 2001-10-23 Semiconductor Energy Laboratory Co., Ltd. Process of fabricating a semiconductor device
US6737304B2 (en) 1999-03-12 2004-05-18 Semiconductor Energy Laboratory Co., Ltd. Process of fabricating a semiconductor device
US7351619B2 (en) 1999-03-12 2008-04-01 Semiconductor Energy Laboratory Co., Ltd. Process of fabricating a semiconductor device
US20040197971A1 (en) * 1999-03-12 2004-10-07 Semiconductor Energy Laboratory Co., Ltd. Process of fabricating a semiconductor device
US6690434B1 (en) 1999-03-15 2004-02-10 Semiconductor Energy Laboratory Co., Ltd. Active matrix liquid crystal display device
US8093591B2 (en) 1999-03-29 2012-01-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US7633085B2 (en) 1999-03-29 2009-12-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US20050200767A1 (en) * 1999-03-29 2005-09-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US20100155732A1 (en) * 1999-03-29 2010-06-24 Semiconductor Energy Laboratory Co. Ltd. Semiconductor Device and Manufacturing Method Thereof
US6512504B1 (en) 1999-04-27 2003-01-28 Semiconductor Energy Laborayory Co., Ltd. Electronic device and electronic apparatus
US20030132900A1 (en) * 1999-04-27 2003-07-17 Semiconductor Energy Laboratory Co., Ltd. Electronic device and electronic apparatus
US8994711B2 (en) 1999-04-27 2015-03-31 Semiconductor Energy Laboratory Co., Ltd. Electronic device and electronic apparatus
US6879309B2 (en) 1999-04-27 2005-04-12 Semiconductor Energy Laboratory Co., Ltd. Electronic device and electronic apparatus
US7843407B2 (en) 1999-04-27 2010-11-30 Semiconductor Energy Laboratory Co., Ltd. Electronic device and electronic apparatus
US9837451B2 (en) 1999-04-27 2017-12-05 Semiconductor Energy Laboratory Co., Ltd. Electronic device and electronic apparatus
US9293483B2 (en) 1999-04-27 2016-03-22 Semiconductor Energy Laboratory Co. Ltd. Electronic device and electronic apparatus
US20080018566A1 (en) * 1999-04-27 2008-01-24 Semiconductor Energy Laboratory Co., Ltd. Electronic device and electronic apparatus
US7274349B2 (en) 1999-04-27 2007-09-25 Semiconductor Energy Laboratory Co., Ltd. Electronic device and electronic apparatus
US20050184936A1 (en) * 1999-04-27 2005-08-25 Semiconductor Energy Laboratory Co., Ltd. Electronic device and electronic apparatus
US7330234B2 (en) 1999-05-14 2008-02-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8314426B2 (en) 1999-05-14 2012-11-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of fabricating the same
US7696514B2 (en) 1999-05-14 2010-04-13 Semiconductor Energy Laboratory Co., Ltd. Active matrix display device having a column-like spacer
US20030173567A1 (en) * 1999-05-14 2003-09-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of fabricating the same
US20100195012A1 (en) * 1999-05-14 2010-08-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of fabricating the same
US20050156174A1 (en) * 1999-05-14 2005-07-21 Semiconductor Energy Laboratory Co., Ltd. Capacitor, semiconductor device, and manufacturing method thereof
US20080174710A1 (en) * 1999-05-14 2008-07-24 Semiconductor Energy Laboratory Co., Ltd. Capacitor, semiconductor device and manufacturing method thereof
US8502232B2 (en) 1999-05-14 2013-08-06 Semiconductor Energy Laboratory Co., Ltd. Capacitor, semiconductor device and manufacturing method thereof
US6909115B2 (en) 1999-05-14 2005-06-21 Semiconductor Energy Laboratory Co. Ltd. Semiconductor device applying to the crystalline semiconductor film
US8026518B2 (en) 1999-05-14 2011-09-27 Semiconductor Energy Laboratory Co. Ltd. Semiconductor device and method of fabricating the same
US7391055B1 (en) 1999-05-14 2008-06-24 Semiconductor Energy Laboratory Co., Ltd. Capacitor, semiconductor device and manufacturing method thereof
US6335772B1 (en) * 1999-05-18 2002-01-01 Sony Corporation Apparatus and method for a liquid crystal display device having an electrically-conductive light-shading layer formed on a smoothed layer
US7701541B2 (en) * 1999-05-20 2010-04-20 Semiconductor Energy Laboratory Co., Ltd. In-plane switching display device having electrode and pixel electrode in contact with an upper surface of an organic resin film
US20070035677A1 (en) * 1999-05-20 2007-02-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US8859353B2 (en) 1999-07-06 2014-10-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and fabrication method thereof
US9069215B2 (en) 1999-07-06 2015-06-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of fabricating the same
US20040222467A1 (en) * 1999-07-06 2004-11-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and fabrication method thereof
US20060151791A1 (en) * 1999-07-06 2006-07-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of fabricating the same
US20090322698A1 (en) * 1999-07-06 2009-12-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of fabricating the same
US8530896B2 (en) 1999-07-06 2013-09-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising a pixel unit including an auxiliary capacitor
US20090290082A1 (en) * 1999-07-06 2009-11-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor Device and Fabrication Method Thereof
US6777254B1 (en) 1999-07-06 2004-08-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and fabrication method thereof
US9786787B2 (en) 1999-07-06 2017-10-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and fabrication method thereof
US20040084673A1 (en) * 1999-07-06 2004-05-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of fabricating the same
US7605902B2 (en) 1999-07-06 2009-10-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of fabricating the same
US7173281B2 (en) 1999-07-06 2007-02-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of fabricating the same
US9395584B2 (en) 1999-07-06 2016-07-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of fabricating the same
US9343570B2 (en) 1999-07-06 2016-05-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and fabrication method thereof
US7569854B2 (en) 1999-07-06 2009-08-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and fabrication method thereof
US20090040445A1 (en) * 1999-07-06 2009-02-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of fabricating the same
US9052551B2 (en) 1999-07-06 2015-06-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of fabricating the same
US7808009B2 (en) 1999-07-06 2010-10-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of fabricating the same
US6784457B2 (en) 1999-12-14 2004-08-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US20050040400A1 (en) * 1999-12-14 2005-02-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US7851797B2 (en) 1999-12-14 2010-12-14 Semiconductor Energy Laboratory Co., Ltd. Display device including a color filter or color filters over a pixel portion and a driving circuit for driving the pixel portion
US7429751B2 (en) 2000-01-20 2008-09-30 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device
US20060220021A1 (en) * 2000-01-20 2006-10-05 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device
US7820464B2 (en) 2000-04-17 2010-10-26 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and manufacturing method thereof
US7525165B2 (en) 2000-04-17 2009-04-28 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and manufacturing method thereof
US20010055841A1 (en) * 2000-04-17 2001-12-27 Shunpei Yamazaki Light emitting device and manufacturing method thereof
US20060082568A1 (en) * 2000-06-06 2006-04-20 Semiconductor Energy Laboratory Co., Ltd. Display device and method of manufacturing the same
US7830370B2 (en) 2000-06-06 2010-11-09 Semiconductor Energy Laboratory Co., Ltd. Display device and method of manufacturing the same
US20060132401A1 (en) * 2000-06-12 2006-06-22 Semiconductor Energy Laboratory Co., Ltd. Light emitting module and method of driving the same, and optical sensor
US7515125B2 (en) 2000-06-12 2009-04-07 Semiconductor Energy Laboratory Co., Ltd. Light emitting module and method of driving the same, and optical sensor
US7253038B2 (en) 2001-05-18 2007-08-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US6828584B2 (en) 2001-05-18 2004-12-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US20050101066A1 (en) * 2001-05-18 2005-05-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US7078277B2 (en) 2001-05-18 2006-07-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US20020195603A1 (en) * 2001-05-18 2002-12-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US20090127562A1 (en) * 2001-09-26 2009-05-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor Device
US20110210333A1 (en) * 2001-09-26 2011-09-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor Device
US8183569B2 (en) 2001-09-26 2012-05-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US7465957B2 (en) 2001-09-26 2008-12-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US6831297B2 (en) 2001-09-26 2004-12-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US20050180232A1 (en) * 2001-09-26 2005-08-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US7939827B2 (en) 2001-09-26 2011-05-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8502231B2 (en) 2001-09-26 2013-08-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US7157317B2 (en) 2001-10-31 2007-01-02 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method for field-effect transistor
US7718478B2 (en) 2001-10-31 2010-05-18 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method for field-effect transistor
US20040209412A1 (en) * 2001-10-31 2004-10-21 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method for field-effect transistor
US20070111408A1 (en) * 2001-10-31 2007-05-17 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method for field-effect transistor
US8420461B2 (en) 2001-10-31 2013-04-16 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method for field-effect transistor
US20100279476A1 (en) * 2001-10-31 2010-11-04 Semiconductor Energy Laboratory Co., Ltd. Manufacturing Method for Field-Effect Transistor
US6737302B2 (en) 2001-10-31 2004-05-18 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method for field-effect transistor
US8120033B2 (en) 2002-04-09 2012-02-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
US7955975B2 (en) 2002-04-09 2011-06-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
US8835271B2 (en) 2002-04-09 2014-09-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device
US11101299B2 (en) 2002-04-09 2021-08-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device
US20030189210A1 (en) * 2002-04-09 2003-10-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device
US10854642B2 (en) 2002-04-09 2020-12-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
US10700106B2 (en) 2002-04-09 2020-06-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
US8946718B2 (en) 2002-04-09 2015-02-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
US8946717B2 (en) 2002-04-09 2015-02-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
US10083995B2 (en) 2002-04-09 2018-09-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device
US20050282305A1 (en) * 2002-04-09 2005-12-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
US10050065B2 (en) 2002-04-09 2018-08-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
US20110049522A1 (en) * 2002-04-09 2011-03-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device
US9105727B2 (en) 2002-04-09 2015-08-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
US8502215B2 (en) 2002-04-09 2013-08-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
US9666614B2 (en) 2002-04-09 2017-05-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device
US8415669B2 (en) 2002-04-09 2013-04-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device
US8008666B2 (en) 2002-04-09 2011-08-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device
US7999263B2 (en) 2002-04-09 2011-08-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
US7671369B2 (en) 2002-04-09 2010-03-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device
US7994504B2 (en) 2002-04-09 2011-08-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
US9406806B2 (en) 2002-04-09 2016-08-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
US8368072B2 (en) 2002-04-15 2013-02-05 Semiconductor Energy Labratory Co., Ltd. Display device and method of fabricating the same
US8115210B2 (en) 2002-04-15 2012-02-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device
US7964874B2 (en) 2002-04-15 2011-06-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having a protective circuit
US8709847B2 (en) 2002-04-15 2014-04-29 Semiconductor Energy Laboratory Co., Ltd. Method of fabricating display device
US20090020762A1 (en) * 2002-04-15 2009-01-22 Semiconductor Energy Laboratory Co., Ltd. Display device and method of fabricating the same
US8643021B2 (en) 2002-04-15 2014-02-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including multiple insulating films
US8120031B2 (en) 2002-05-17 2012-02-21 Semiconductor Energy Laboratory Co., Ltd. Display device including an opening formed in a gate insulating film, a passivation film, and a barrier film
US9366930B2 (en) 2002-05-17 2016-06-14 Semiconductor Energy Laboratory Co., Ltd. Display device with capacitor elements
US10133139B2 (en) 2002-05-17 2018-11-20 Semiconductor Energy Laboratory Co., Ltd. Display device
US10527903B2 (en) 2002-05-17 2020-01-07 Semiconductor Energy Laboratory Co., Ltd. Display device
US11422423B2 (en) 2002-05-17 2022-08-23 Semiconductor Energy Laboratory Co., Ltd. Display device
US20070064184A1 (en) * 2005-09-16 2007-03-22 Sanyo Epson Imaging Devices Corporation Liquid crystal device, method of manufacturing liquid crystal device, and electronic apparatus
US8264649B2 (en) * 2005-09-16 2012-09-11 Sony Corporation Liquid crystal device and method of manufacturing liquid crystal device having surface grooves and alignment film with improved thickness uniformity
US10690978B2 (en) 2018-05-28 2020-06-23 Wuhan China Star Optoelectronics Technology Co., Ltd. Array substrate, display panel, and display

Also Published As

Publication number Publication date
JPH06138484A (en) 1994-05-20
EP0604006B1 (en) 2000-01-12
KR960014498B1 (en) 1996-10-16
EP0604006A3 (en) 1994-11-23
DE69327571D1 (en) 2000-02-17
JP2924506B2 (en) 1999-07-26
DE69327571T2 (en) 2000-08-17
EP0604006A2 (en) 1994-06-29
KR940009922A (en) 1994-05-24

Similar Documents

Publication Publication Date Title
US5499123A (en) Active matrix liquid crystal display cell with light blocking capacitor electrode above insulating layer
US5982460A (en) Electro-optical display
US4759610A (en) Active matrix display with capacitive light shield
US6259200B1 (en) Active-matrix display apparatus
EP0464579B1 (en) Thin film field effect transistor array for use in active matrix liquid crystal display
US5054887A (en) Active matrix type liquid crystal display
US6376270B1 (en) Method of making an array of TFTs having an insulation layer with a low dielectric constant
KR100260359B1 (en) Lcd and method for manufacturing the same
KR100247628B1 (en) Liquid crystal display element and its manufacturing method
JP3796070B2 (en) Liquid crystal display
EP0329887B1 (en) Liquid crystal display device
US5835169A (en) Liquid crystal display device of thin film transistor and fabrication method thereof
US6326641B1 (en) Liquid crystal display device having a high aperture ratio
US20010045995A1 (en) Liquid crystal display and manufacturing method therfor
JPH08234239A (en) Display device
US5657101A (en) LCD having a thin film capacitor with two lower capacitor electrodes and a pixel electrode serving as an upper electrode
EP0468711B1 (en) Matrix-addressed type display device
KR100308853B1 (en) A storage capacitor of a liquid crystal display and a fabricating method thereof
JP2870072B2 (en) Liquid crystal display
JPH1010580A (en) Display device
JPH0827465B2 (en) Plane display
JP3901925B2 (en) Active matrix type liquid crystal display device
JPH07281211A (en) Electro-optic element

Legal Events

Date Code Title Description
AS Assignment

Owner name: NEC CORPORATION, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MIKOSHIBA, HIROAKI;REEL/FRAME:006851/0384

Effective date: 19931203

STCF Information on status: patent grant

Free format text: PATENTED CASE

FEPP Fee payment procedure

Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

FPAY Fee payment

Year of fee payment: 4

FPAY Fee payment

Year of fee payment: 8

FPAY Fee payment

Year of fee payment: 12

FEPP Fee payment procedure

Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Free format text: PAYER NUMBER DE-ASSIGNED (ORIGINAL EVENT CODE: RMPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

AS Assignment

Owner name: GETNER FOUNDATION LLC, DELAWARE

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:NEC CORPORATION;REEL/FRAME:026254/0381

Effective date: 20110418

AS Assignment

Owner name: VISTA PEAK VENTURES, LLC, TEXAS

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:GETNER FOUNDATION LLC;REEL/FRAME:045469/0164

Effective date: 20180213