US5433911A - Precisely aligning and bonding a glass cover plate over an image sensor - Google Patents

Precisely aligning and bonding a glass cover plate over an image sensor Download PDF

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Publication number
US5433911A
US5433911A US08/250,889 US25088994A US5433911A US 5433911 A US5433911 A US 5433911A US 25088994 A US25088994 A US 25088994A US 5433911 A US5433911 A US 5433911A
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United States
Prior art keywords
image sensor
cover plate
spacers
glass cover
carrier
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US08/250,889
Inventor
Edward J. Ozimek
Herbert J. Erhardt
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Eastman Kodak Co
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Eastman Kodak Co
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Priority to US08/250,889 priority Critical patent/US5433911A/en
Assigned to EASTMAN KODAK COMPANY reassignment EASTMAN KODAK COMPANY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ERHARDT, HERBERT J., OZIMEK, EDWARD J.
Application granted granted Critical
Publication of US5433911A publication Critical patent/US5433911A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

Definitions

  • tolerances on the order of 0.001 inch or more are commonly used for the placement of the sensor in its package as well as for the distance of separation between the cover glass and the image sensor surface.
  • the thickness of an electrically conductive adhesive between the image sensor and an insulating carrier depends upon the amount of adhesive which is dispensed, and the use of optical adhesives to attach a glass window or filter to the sensor surface is likewise dependent upon the volume applied. In some applications, it is very important that the spacing between the image sensor and the carrier and/or glass be held to within exacting tolerances. In order to place the components of an optical system to extreme tolerance values ( ⁇ 5 microns), special assembly tools and techniques are required.
  • Further features include: (1) an inverted packaging process which utilizes gravity to help contain the possible excess volume of adhesive materials; (2) the use of a transparent base material so as to visually monitor the assembly; (3) having a very flat base surface to use as a means of checking the flatness of the glass cover surface and for assuring a very accurate vertical (z-axis) distances; (4) a fixture for periodically calibrating the critical spacer element dimensions; and (5) the repeatability of the assembly process is improved so that multiple image sensors will be able to be assembled with reference to a spacer plate surface and retain the same critical dimensionality.
  • FIG. 1 shows the spacer plate 14 which the image sensor 18 (die) is placed.
  • a glass cover plate 12 On top of the image sensor 18 is placed a glass cover plate 12.
  • the bottom surface of the glass cover plate 12 which is farthest from the image sensor 18 is used as a reference plane. Its flatness (distance from the imager sensor 18) is critical as well as its parallelism to the carrier surface.

Abstract

A method of precisely aligning and fastening a glass cover plate over an image sensor includes the use of first and second sets of spacers arranged so that the glass cover plate is provided on the base plate and the image sensor is provided on the first set of spacers and spaced from a carrier mounted on the second set of spacers. An adhesive secures the glass cover plate to the image sensor as well as the image sensor to the carrier.

Description

FIELD OF THE INVENTION
The present invention relates to packaging of image sensors wherein a glass cover plate is bonded to an image sensor.
BACKGROUND OF THE INVENTION
In a typical assembly of an image sensor in its electronic package, tolerances on the order of 0.001 inch or more are commonly used for the placement of the sensor in its package as well as for the distance of separation between the cover glass and the image sensor surface. The thickness of an electrically conductive adhesive between the image sensor and an insulating carrier depends upon the amount of adhesive which is dispensed, and the use of optical adhesives to attach a glass window or filter to the sensor surface is likewise dependent upon the volume applied. In some applications, it is very important that the spacing between the image sensor and the carrier and/or glass be held to within exacting tolerances. In order to place the components of an optical system to extreme tolerance values (˜5 microns), special assembly tools and techniques are required.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide a more effective method for bonding a glass cover plate to an image sensor while maintaining exacting dimensions.
This object is achieved in a method of precisely aligning and fastening a glass cover plate over an image sensor comprising:
(a) placing a glass cover plate over a optically flat transparent spacer plate;
(b) providing a first set of spacers secured to the spacer plate and upon which are mounted the image sensor so that the image sensor is spaced from the cover plate such that the spacing is critically controlled to be within a few microns of tolerance;
(c) providing a second set of spacers spaced from the first set of spacers and mounted on the spacer plate;
(d) mounting a carrier on the second set of spacers so that it is spaced from the image sensor, the arrangement being such that the carrier surface opposed from the spacer plate surface are parallel to within less than a 1000th of a radian;
(e) dispensing an optical adhesive between the glass cover plate and the image sensor to secure the glass cover plate to the image sensor; and
(f) dispensing an electrically conductive adhesive between the image sensor and the carrier to secure the image sensor to the carrier.
It is a feature of this invention to efficiently assemble a focal plane array image sensor having critical and demanding tolerances requiring the assistance of precision fixtures. Eliminating the variability of adhesive bond line thickness by using precision spacer elements has been found to be effective. The ability to monitor the assembly process to avoid gas/particulate entrapment is extremely valuable in assuring a good optical path.
Further features include: (1) an inverted packaging process which utilizes gravity to help contain the possible excess volume of adhesive materials; (2) the use of a transparent base material so as to visually monitor the assembly; (3) having a very flat base surface to use as a means of checking the flatness of the glass cover surface and for assuring a very accurate vertical (z-axis) distances; (4) a fixture for periodically calibrating the critical spacer element dimensions; and (5) the repeatability of the assembly process is improved so that multiple image sensors will be able to be assembled with reference to a spacer plate surface and retain the same critical dimensionality.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a side elevational view of the components necessary to precisely align a glass cover plate over an image sensor; and
FIG. 2 is a schematic of a single glass block which includes first and second spacers shown in FIG. 1.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Turning first to FIG. 1, a fixture or assembly provides the components necessary for aligning and securing a glass cover plate 12 to an image sensor 18. Image sensors are frequently referred to in the art as "dies". As shown a spacer plate 14 is made of glass. Its optically flat surface is within a couple of fringes. When the glass cover plate 12 is mounted on the spacer plate 14, the resultant interference fringes will show the surface quality of the cover glass plate. Being transparent, a reverse stereo microscope can be used to closely watch the assembly as it occurs. Precision ground and lapped first and second sets of spacers 16 and 20 are mounted on the spacer plate 14 by drilling and tapping the two pieces or by attachment using an adhesive.
In FIG. 2, where the assembly components are the same as FIG. 1, they will have the same numerals. However, the first and second sets of spacer 16a and 20a are shown in FIG. 2 to be formed from a single glass block 14a. The first set of spacers 16 accommodate the glass cover plate 12. The second set of spacers 20 accommodate a carrier 22. This carrier can, depending upon the application, be conductive or non-conductive. The carrier is formed from Al2 O3 or AlN. The image sensor 18 rests on the first set of spacers 16 whereas the cover glass plate 12 directly contacts the spacer plate 14. Being able to see through the spacer plate 14 aids in the spatial positioning of the image sensor/glass cover plate (12, 18) as well as verifying the absence of entrapped gas bubbles and particulates. The optical adhesive 24 is dispensed onto the cover glass plate in sufficient quantity to fill the volume created by the first set of spacers 16. Bleedouts aid in removing excess adhesive. Once placed, curing can occur at room temperature or may be accelerated by the use of an oven. An example of the optical adhesive is Dow Corning 93-500 Space-grade encapsulant, Dow Corning Corp., Midland, Mich.
Additional spacers for the carrier/die attachment can be provided on this base or positioned on another base plate (i.e., two separate spacers). If two spacers are used, the spacer plate material need not be glass since the optical path is now blocked due to the image sensor. These spacers control the bond line thickness of the image sensor attach adhesive 26. This adhesive is electrically conductive and compliant and should be stress free so as not to distort the image sensor surface. An example of such a conductive adhesive is Zymet, Inc., ZVR-6000, E. Hanover, N.J. Positioning of the image sensor can be accomplished using the spacer elements as reference points or using optical targets on the individual pieces. If the spacers are removed sufficiently from the image sensor element, "dams" 28 could be incorporated on spacer plate 14 to prevent the flow of adhesive onto the bond pads of the carrier.
Critical dimensions include the distance of the top surface of the glass cover plate to the top of the image sensor element as well as the parallelism between the top surface of the glass cover plate and the top of the carrier. This parallelism can be held to better than 0.001 radian. Due to these demanding tolerances, assembly in a very clean environment in many cases will be essential.
Reviewing, FIG. 1 shows the spacer plate 14 which the image sensor 18 (die) is placed. On top of the image sensor 18 is placed a glass cover plate 12. In a particular application, the bottom surface of the glass cover plate 12 (see FIG. 1) which is farthest from the image sensor 18 is used as a reference plane. Its flatness (distance from the imager sensor 18) is critical as well as its parallelism to the carrier surface.
Not only will assembly according to this invention hold the dimensions within the tolerance limits, but it will also afford repeatability of the assembly process. Such a spacer, having a spacer plate, is used to meet these requirements. The process is inverted (i.e., upside-down) and components are viewable through the spacer plate during the actual assembly. Precision machined spacer "steps" maintain the required spacing accurately.
The invention has been described in detail with particular reference to certain preferred embodiments thereof, but it will be understood that variations and modifications can be effected within the spirit and scope of the invention.
PARTS LIST
10 assembly
12 glass cover plate
14 spacer plate
16 inner spacers
18 image sensor
20 outer spacers
22 insulating carrier
24 optical adhesive
26 electrically conducting adhesive
28 "dams" for blocking adhesive flow

Claims (4)

We claim:
1. A method of precisely aligning and fastening a glass cover plate over an image sensor comprising:
(a) placing a glass cover plate over a optically flat transparent spacer plate;
(b) providing a first set of spacers secured to the spacer plate and upon which is mounted the image sensor so that the image sensor is spaced from the cover plate such that the spacing is critically controlled to be within a few microns of tolerance;
(c) providing a second set of spacers spaced from the first set of spacers and mounted on the spacer plate;
(d) mounting a carrier on the second set of spacers so that it is spaced from the image sensor, the arrangement being such that the carrier surface opposed from the spacer plate surface are parallel to within less than a 1000th of a radian;
(e) dispensing an optical adhesive between the glass cover plate and the image sensor to secure the glass cover plate to the image sensor; and
(f) dispensing an electrically conductive adhesive between the image sensor and the carrier to secure the image sensor to the carrier.
2. The method of claim 1 wherein the first and second spacers are formed from the same glass block.
3. The method of claim 2 further including removing the spacers and spacer plate from the previously formed structure.
4. The method of claim 2 wherein the carrier is formed from Al2 O3 or AlN.
US08/250,889 1994-05-31 1994-05-31 Precisely aligning and bonding a glass cover plate over an image sensor Expired - Fee Related US5433911A (en)

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Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5932045A (en) * 1997-06-02 1999-08-03 Lucent Technologies Inc. Method for fabricating a multilayer optical article
EP0948059A1 (en) * 1998-02-05 1999-10-06 Asulab S.A. Positioning means in a microelectronic device and imaging device using the same
US6037655A (en) * 1998-01-12 2000-03-14 Eastman Kodak Company Linear image sensor package assembly
US6134393A (en) * 1996-09-09 2000-10-17 Scitex Corporation Ltd. Imaging device for standard camera bodies
US20030031417A1 (en) * 2001-06-29 2003-02-13 Richard Stack Method for relaxing mechanical tolerance in an opto-electronic unit
US20030062638A1 (en) * 2001-09-14 2003-04-03 Lisa Dhar Method for forming multiply patterned optical articles
US6564018B2 (en) 1996-09-09 2003-05-13 Creoscitek Corporation Ltd. Imaging device for digital photography
US20030223101A1 (en) * 2002-01-15 2003-12-04 Curtis Kevin R. System and method for bitwise readout holographic ROM
US6721076B2 (en) 2001-08-03 2004-04-13 Inphase Technologies, Inc. System and method for reflective holographic storage with associated multiplexing techniques
US6856357B1 (en) 1999-06-11 2005-02-15 Stmicroelectronics Limited Image sensor packaging
US20050059188A1 (en) * 2003-09-17 2005-03-17 Bolken Todd O. Image sensor packages and methods of fabrication
US20050279916A1 (en) * 2004-05-03 2005-12-22 Tessera, Inc. Image sensor package and fabrication method
US20060108678A1 (en) * 2002-05-07 2006-05-25 Microfabrica Inc. Probe arrays and method for making
US7112359B2 (en) 2001-08-22 2006-09-26 Inphase Technologies, Inc. Method and apparatus for multilayer optical articles
US20060266408A1 (en) * 2005-05-26 2006-11-30 Horne Stephen J Concentrator solar photovoltaic array with compact tailored imaging power units
US20070056181A1 (en) * 2005-09-13 2007-03-15 Dr. Johannes Heidenhain Gmbh Scanning unit of an optical position measuring device and optical position measuring device
US20070082179A1 (en) * 2005-10-07 2007-04-12 Wade James J Method and apparatus for forming optical articles
US20070120212A1 (en) * 2005-02-18 2007-05-31 Boettiger Ulrich C Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers
US20080085089A1 (en) * 2006-06-28 2008-04-10 Jds Uniphase Corporation Wafer Scale Method Of Manufacturing Optical Waveguide Devices And The Waveguide Devices Made Thereby
US20080105355A1 (en) * 2003-12-31 2008-05-08 Microfabrica Inc. Probe Arrays and Method for Making
US20080142000A1 (en) * 2006-12-15 2008-06-19 Sol Focus, Inc. Optic spacing nubs
US20090056790A1 (en) * 2005-05-26 2009-03-05 Solfocus, Inc. Monolithic Mirror Array
US20090107540A1 (en) * 2007-10-30 2009-04-30 Solfocus, Inc. Non-Imaging Concentrator With Spacing Nubs
US20090121300A1 (en) * 2007-11-14 2009-05-14 Micron Technology, Inc. Microelectronic imager packages and associated methods of packaging
US20110083741A1 (en) * 2009-10-01 2011-04-14 RNY Solar LLC Multiconverter system comprising spectral separating reflector assembly and methods thereof
US20150054112A1 (en) * 2013-08-01 2015-02-26 Kabushiki Kaisha Toshiba Solid-state imaging device
US9383768B1 (en) * 2014-03-28 2016-07-05 Amazon Technologies, Inc. Compressive and elastic bonding component of an electronic device
US10416192B2 (en) 2003-02-04 2019-09-17 Microfabrica Inc. Cantilever microprobes for contacting electronic components
US11262383B1 (en) 2018-09-26 2022-03-01 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making

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Cited By (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6134393A (en) * 1996-09-09 2000-10-17 Scitex Corporation Ltd. Imaging device for standard camera bodies
US6564018B2 (en) 1996-09-09 2003-05-13 Creoscitek Corporation Ltd. Imaging device for digital photography
US6156415A (en) * 1997-06-02 2000-12-05 Lucent Technologies Inc. Method for fabricating a multilayer optical article and a system having a multilayer optical article
US5932045A (en) * 1997-06-02 1999-08-03 Lucent Technologies Inc. Method for fabricating a multilayer optical article
US6037655A (en) * 1998-01-12 2000-03-14 Eastman Kodak Company Linear image sensor package assembly
EP0948059A1 (en) * 1998-02-05 1999-10-06 Asulab S.A. Positioning means in a microelectronic device and imaging device using the same
US6856357B1 (en) 1999-06-11 2005-02-15 Stmicroelectronics Limited Image sensor packaging
US6804438B2 (en) * 2001-06-29 2004-10-12 Xanoptix, Inc. Method for relaxing mechanical tolerance in an opto-electronic unit
US20030031417A1 (en) * 2001-06-29 2003-02-13 Richard Stack Method for relaxing mechanical tolerance in an opto-electronic unit
US6721076B2 (en) 2001-08-03 2004-04-13 Inphase Technologies, Inc. System and method for reflective holographic storage with associated multiplexing techniques
US7112359B2 (en) 2001-08-22 2006-09-26 Inphase Technologies, Inc. Method and apparatus for multilayer optical articles
US7001541B2 (en) 2001-09-14 2006-02-21 Inphase Technologies, Inc. Method for forming multiply patterned optical articles
US20030062638A1 (en) * 2001-09-14 2003-04-03 Lisa Dhar Method for forming multiply patterned optical articles
US6825960B2 (en) 2002-01-15 2004-11-30 Inphase Technologies, Inc. System and method for bitwise readout holographic ROM
US20030223101A1 (en) * 2002-01-15 2003-12-04 Curtis Kevin R. System and method for bitwise readout holographic ROM
US7878385B2 (en) 2002-05-07 2011-02-01 Microfabrica Inc. Probe arrays and method for making
US20060108678A1 (en) * 2002-05-07 2006-05-25 Microfabrica Inc. Probe arrays and method for making
US10416192B2 (en) 2003-02-04 2019-09-17 Microfabrica Inc. Cantilever microprobes for contacting electronic components
US10788512B2 (en) 2003-02-04 2020-09-29 Microfabrica Inc. Cantilever microprobes for contacting electronic components
US8426954B2 (en) 2003-09-17 2013-04-23 Round Rock Research, Llc Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor
US8624371B2 (en) 2003-09-17 2014-01-07 Round Rock Research, Llc Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor
US20050191787A1 (en) * 2003-09-17 2005-09-01 Bolken Todd O. Methods of fabrication of package assemblies for optically interactive electronic devices
US6995462B2 (en) * 2003-09-17 2006-02-07 Micron Technology, Inc. Image sensor packages
US8008762B2 (en) 2003-09-17 2011-08-30 Round Rock Research, Llc Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor
US20070108579A1 (en) * 2003-09-17 2007-05-17 Bolken Todd O Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor
US20050059188A1 (en) * 2003-09-17 2005-03-17 Bolken Todd O. Image sensor packages and methods of fabrication
US7169645B2 (en) 2003-09-17 2007-01-30 Micron Technology, Inc. Methods of fabrication of package assemblies for optically interactive electronic devices
US20080105355A1 (en) * 2003-12-31 2008-05-08 Microfabrica Inc. Probe Arrays and Method for Making
US20050279916A1 (en) * 2004-05-03 2005-12-22 Tessera, Inc. Image sensor package and fabrication method
US7368695B2 (en) * 2004-05-03 2008-05-06 Tessera, Inc. Image sensor package and fabrication method
US7696588B2 (en) * 2005-02-18 2010-04-13 Aptina Imaging Corporation Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers
US20070120212A1 (en) * 2005-02-18 2007-05-31 Boettiger Ulrich C Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers
US20090056790A1 (en) * 2005-05-26 2009-03-05 Solfocus, Inc. Monolithic Mirror Array
US20060266408A1 (en) * 2005-05-26 2006-11-30 Horne Stephen J Concentrator solar photovoltaic array with compact tailored imaging power units
US8063300B2 (en) * 2005-05-26 2011-11-22 Solfocus, Inc. Concentrator solar photovoltaic array with compact tailored imaging power units
US20070056181A1 (en) * 2005-09-13 2007-03-15 Dr. Johannes Heidenhain Gmbh Scanning unit of an optical position measuring device and optical position measuring device
US7596880B2 (en) * 2005-09-13 2009-10-06 Dr. Johannes Heidenhain Gmbh Scanning unit of an optical position measuring device and optical position measuring device
US20070082179A1 (en) * 2005-10-07 2007-04-12 Wade James J Method and apparatus for forming optical articles
US20080085089A1 (en) * 2006-06-28 2008-04-10 Jds Uniphase Corporation Wafer Scale Method Of Manufacturing Optical Waveguide Devices And The Waveguide Devices Made Thereby
US7512303B2 (en) 2006-06-28 2009-03-31 Jds Uniphase Corporation Wafer scale method of manufacturing optical waveguide devices and the waveguide devices made thereby
US20080142000A1 (en) * 2006-12-15 2008-06-19 Sol Focus, Inc. Optic spacing nubs
US20090107540A1 (en) * 2007-10-30 2009-04-30 Solfocus, Inc. Non-Imaging Concentrator With Spacing Nubs
US20090121300A1 (en) * 2007-11-14 2009-05-14 Micron Technology, Inc. Microelectronic imager packages and associated methods of packaging
US20110083741A1 (en) * 2009-10-01 2011-04-14 RNY Solar LLC Multiconverter system comprising spectral separating reflector assembly and methods thereof
US9165961B2 (en) * 2013-08-01 2015-10-20 Kabushiki Kaisha Toshiba Solid-state imaging device
US20150054112A1 (en) * 2013-08-01 2015-02-26 Kabushiki Kaisha Toshiba Solid-state imaging device
US9383768B1 (en) * 2014-03-28 2016-07-05 Amazon Technologies, Inc. Compressive and elastic bonding component of an electronic device
US9778696B1 (en) * 2014-03-28 2017-10-03 Amazon Technologies, Inc. Compressive and elastic bonding component of an electronic device
US11262383B1 (en) 2018-09-26 2022-03-01 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making

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