US5377078A - Apparatus mounting a power semiconductor to a heat sink - Google Patents
Apparatus mounting a power semiconductor to a heat sink Download PDFInfo
- Publication number
- US5377078A US5377078A US08/009,278 US927893A US5377078A US 5377078 A US5377078 A US 5377078A US 927893 A US927893 A US 927893A US 5377078 A US5377078 A US 5377078A
- Authority
- US
- United States
- Prior art keywords
- semiconductor
- heat sink
- sheet
- support plate
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/009,278 US5377078A (en) | 1993-01-26 | 1993-01-26 | Apparatus mounting a power semiconductor to a heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/009,278 US5377078A (en) | 1993-01-26 | 1993-01-26 | Apparatus mounting a power semiconductor to a heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
US5377078A true US5377078A (en) | 1994-12-27 |
Family
ID=21736677
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/009,278 Expired - Fee Related US5377078A (en) | 1993-01-26 | 1993-01-26 | Apparatus mounting a power semiconductor to a heat sink |
Country Status (1)
Country | Link |
---|---|
US (1) | US5377078A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5883782A (en) * | 1997-03-05 | 1999-03-16 | Intel Corporation | Apparatus for attaching a heat sink to a PCB mounted semiconductor package |
US5949137A (en) * | 1997-09-26 | 1999-09-07 | Lsi Logic Corporation | Stiffener ring and heat spreader for use with flip chip packaging assemblies |
US20070047207A1 (en) * | 2005-09-01 | 2007-03-01 | Mcphee Philip S | Heat sink with twist lock mounting mechanism |
US20090168360A1 (en) * | 2008-01-02 | 2009-07-02 | Harman International Industries, Incorporated | Clamp for electrical devices |
CN102107693A (en) * | 2011-02-19 | 2011-06-29 | 奇瑞汽车股份有限公司 | Adjustable nut plate component for bodywork |
US20130083486A1 (en) * | 2011-10-04 | 2013-04-04 | Lsis Co., Ltd. | Springy clip type apparatus for fastening power semiconductor |
US20140360710A1 (en) * | 2013-06-08 | 2014-12-11 | Delta Electronics Power (Dong Guan) Co., Ltd. | Heat-dissipating assembly for electronic component |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1086003A (en) * | 1964-03-13 | 1967-10-04 | Ass Elect Ind | Mounting arrangements for electronic devices |
US3911327A (en) * | 1973-07-19 | 1975-10-07 | Ates Componenti Elettron | Mounting assembly for integrated circuits heat sink and clamp means |
DE3304952A1 (en) * | 1983-02-12 | 1984-08-16 | Philips Patentverwaltung | Heat sink for heat-emitting electrical components |
US4563725A (en) * | 1983-01-06 | 1986-01-07 | Welwyn Electronics Limited | Electrical assembly |
US4654754A (en) * | 1982-11-02 | 1987-03-31 | Fairchild Weston Systems, Inc. | Thermal link |
US4972294A (en) * | 1989-04-03 | 1990-11-20 | Motorola, Inc. | Heat sink clip assembly |
US5019942A (en) * | 1987-11-30 | 1991-05-28 | Thermalloy Incorporated | Insulating apparatus for electronic device assemblies |
US5241453A (en) * | 1991-11-18 | 1993-08-31 | The Whitaker Corporation | EMI shielding device |
-
1993
- 1993-01-26 US US08/009,278 patent/US5377078A/en not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1086003A (en) * | 1964-03-13 | 1967-10-04 | Ass Elect Ind | Mounting arrangements for electronic devices |
US3911327A (en) * | 1973-07-19 | 1975-10-07 | Ates Componenti Elettron | Mounting assembly for integrated circuits heat sink and clamp means |
US4654754A (en) * | 1982-11-02 | 1987-03-31 | Fairchild Weston Systems, Inc. | Thermal link |
US4563725A (en) * | 1983-01-06 | 1986-01-07 | Welwyn Electronics Limited | Electrical assembly |
DE3304952A1 (en) * | 1983-02-12 | 1984-08-16 | Philips Patentverwaltung | Heat sink for heat-emitting electrical components |
US5019942A (en) * | 1987-11-30 | 1991-05-28 | Thermalloy Incorporated | Insulating apparatus for electronic device assemblies |
US4972294A (en) * | 1989-04-03 | 1990-11-20 | Motorola, Inc. | Heat sink clip assembly |
US5241453A (en) * | 1991-11-18 | 1993-08-31 | The Whitaker Corporation | EMI shielding device |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5883782A (en) * | 1997-03-05 | 1999-03-16 | Intel Corporation | Apparatus for attaching a heat sink to a PCB mounted semiconductor package |
US5949137A (en) * | 1997-09-26 | 1999-09-07 | Lsi Logic Corporation | Stiffener ring and heat spreader for use with flip chip packaging assemblies |
US20070047207A1 (en) * | 2005-09-01 | 2007-03-01 | Mcphee Philip S | Heat sink with twist lock mounting mechanism |
US7394658B2 (en) | 2005-09-01 | 2008-07-01 | Harman International Industries, Incorporated | Heat sink with twist lock mounting mechanism |
US20090168360A1 (en) * | 2008-01-02 | 2009-07-02 | Harman International Industries, Incorporated | Clamp for electrical devices |
US7746653B2 (en) | 2008-01-02 | 2010-06-29 | Harman International Industries Incorporated | Clamp for electrical devices |
CN102107693A (en) * | 2011-02-19 | 2011-06-29 | 奇瑞汽车股份有限公司 | Adjustable nut plate component for bodywork |
US20130083486A1 (en) * | 2011-10-04 | 2013-04-04 | Lsis Co., Ltd. | Springy clip type apparatus for fastening power semiconductor |
US9030825B2 (en) * | 2011-10-04 | 2015-05-12 | Lsis Co., Ltd. | Springy clip type apparatus for fastening power semiconductor |
US20140360710A1 (en) * | 2013-06-08 | 2014-12-11 | Delta Electronics Power (Dong Guan) Co., Ltd. | Heat-dissipating assembly for electronic component |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: ALLIEDSIGNAL INC., NEW JERSEY Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:KALIS, ROBERT M.;REEL/FRAME:006410/0473 Effective date: 19930122 |
|
AS | Assignment |
Owner name: ALLIEDSIGNAL INC., NEW JERSEY Free format text: CHANGE OF NAME;ASSIGNOR:ALLIED-SIGNAL INC.;REEL/FRAME:006704/0091 Effective date: 19930426 |
|
AS | Assignment |
Owner name: RELM COMMUNICATIONS, INC., FLORIDA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:ALLIEDSIGNAL, INC.;REEL/FRAME:007015/0900 Effective date: 19940531 |
|
AS | Assignment |
Owner name: UJB FINANCIAL CORPORATION, PENNSYLVANIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:RELM COMMUNICATIONS, INC.;RXD, INC.;REEL/FRAME:007881/0824 Effective date: 19960227 |
|
REMI | Maintenance fee reminder mailed | ||
LAPS | Lapse for failure to pay maintenance fees | ||
FP | Lapsed due to failure to pay maintenance fee |
Effective date: 19981227 |
|
AS | Assignment |
Owner name: SUMMIT COMMERICAL/GILBERLTAR CORP., NEW YORK Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:RELM COMMUNICATIONS, INC;REEL/FRAME:009866/0152 Effective date: 19990226 |
|
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |