US5194933A - Semiconductor device using insulation coated metal substrate - Google Patents

Semiconductor device using insulation coated metal substrate Download PDF

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Publication number
US5194933A
US5194933A US07/767,801 US76780191A US5194933A US 5194933 A US5194933 A US 5194933A US 76780191 A US76780191 A US 76780191A US 5194933 A US5194933 A US 5194933A
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United States
Prior art keywords
insulation
metal substrate
coated metal
sealing material
semiconductor device
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Expired - Fee Related
Application number
US07/767,801
Inventor
Masahide Miyagi
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Fuji Electric Co Ltd
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Fuji Electric Co Ltd
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Publication date
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Assigned to FUJI ELECTRIC CO., LTD. A CORP. OF JAPAN reassignment FUJI ELECTRIC CO., LTD. A CORP. OF JAPAN ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: MIYAGI, MASAHIDE
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0597—Resist applied over the edges or sides of conductors, e.g. for protection during etching or plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

A semiconductor device using an insulation coated metal substrate includes semiconductor elements supported on an insulation coated metal substrate which is made of a metal substrate and an insulation layer disposed on the metal substrate, a wiring of a metallic foil formed on the insulation layer and connected to the semiconductor elements, an insulative sealing material covering the semiconductor elements and the wiring, and a solid insulation with a larger specific inductive capacity than that of the sealing material which is interposed between an edge part of the wiring and the sealing material.

Description

BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor device using an insulation coated metal substrate in which semiconductor elements are supported on the insulation coated metal substrate and the semiconductor elements are connected to a wiring made of a metal foil on the substrate.
Lately, remarkable development of electronic equipment has appeared and higher density integration and light-weight miniaturization are rapidly promoted. As a leading semiconductor device in the development, power modules which are widely used in inverters and others of motor controls and air conditioners are known.
FIG. 6 shows a common three-phase inverter circuit used for motor control. In FIG. 6, IGBTs are main circuit switching elements. In this example, six IGBTs are connected between a dc main electric power V by three-phase bridge coupling. A motor 9 is driven by a three-phase ac output of the inverter. A high speed diode 8 for transferring a current is connected to each IGBT 7 in reverse-parallel. A drive circuit 6 for driving IGBT 7 is provided for each IGBT. A drive electric power 10 is a dc electric power for the drive circuit 6. Such a circuit is actually assembled as shown in FIG. 7.
FIG. 7 shows a conventional package structure for a semiconductor device. In FIG. 7, a metal base plate 13 for heat radiation, a resin case 15 fixed by an adhesive so as to surround the base plate 13, and a case cover 16 for closing an upper opening of the case 15 constitute a container of the package, in which an assembly of module circuits comprised of semiconductor elements 12 mounted on insulation coated metal substrates 11 is incorporated and further a sealing resin 4 for sealing the interior of the container is filled. An external lead terminal 14 is extracted from the circuit assembly.
The power module is made up with a plurality of semiconductor elements which are supported on a substrate and connected with the wirings provided on the substrate. Previously, an insulated substrate made of a ceramic material such as Al2 O3 has been used and a relatively thick copper base has been soldered to the substrate for the purpose of thermal radiation and the semiconductor elements have been fixed onto the copper base. However, to ensure higher density integration and light-weight miniaturization, an insulation coated metal substrate has been often used in which an aluminum plate with an excellent heat radiation efficiency is used as the substrate, an insulation layer which comprises an organic insulation is formed on this aluminum plate, copper foil of several tens of μm in thickness is deposited on the insulation layer and the wiring is formed according to an appropriate patterning.
In case of the insulation coated metal substrate of such power module, an organic material which forms the insulation layer is apt to deteriorate due to corona discharge when a high voltage is applied irrespective of mounted elements and circuit structure and, if the voltage is continuously applied, dielectric breakdown will be finally caused. It is known from the measurement that the corona discharge starting voltage of the substrate alone is 400 to 600V. And it is known from the investigation that the portion where the corona was generated is an edge part of the wiring pattern which comprises copper foil (see a closed dot line E in FIG. 2 or 3). It appears that this is because the field concentrates to be increased at the edge of the copper pattern. For example, when a voltage of 200 V is applied to a metal substrate with an insulation layer of 100 μm thickness, a large electric field of 2 kV/mm is applied to the substrate and the electric field concentrates to the edge of the copper pattern. As a measure, it can be considered that, for example as shown in FIG. 2, the edge part A of the pattern of Cu foil 3 formed on an aluminum substrate 1 via an insulation layer 2 made of an organic material is covered with a sealing material 4 such as molded resin so that the edge part may not be exposed to air and the corona discharge starting voltage may be increased. However, a preventive effect of this sealing material against deterioration of insulation was insufficient.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a semiconductor device using an insulation coated metal substrate, which is capable of eliminating the above-mentioned disadvantages and preventing deterioration due to corona discharge even when a high voltage is applied.
To attain the object, the present invention provides a semiconductor device in which semiconductor elements are supported on an insulation coated metal substrate which is made up by depositing an insulation layer on a metal substrate and forming wiring of a metal foil on the insulation layer, the semiconductor elements are connected to the wiring of the metal foil, the semiconductor elements and the wiring are covered with an insulative sealing material, and a solid insulation with a larger specific inductive capacity than that of the sealing material is interposed between the edge part of the wiring pattern of the wiring of the metal foil and the sealing material.
The semiconductor device in accordance with the present invention is effective in that the sealing material is made of epoxy resin and the solid insulation is made of epoxy melamine-based resin or the sealing material is made of epoxy resin and the solid insulation is made of ferrite.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a cross sectional view of the edge part of the wiring of the semiconductor device according to an embodiment of the present invention;
FIG. 2 is a cross sectional view of the edge part of the wiring of the conventional semiconductor device;
FIG. 3 is an equivalent circuit diagram shown in FIG. 2;
FIG. 4 is an equivalent circuit diagram shown in FIG. 1;
FIG. 5 is a cross sectional view of the edge part of the wiring of the semiconductor device according to another embodiment of the present invention;
FIG. 6 is a circuit diagram showing a common three-phase inverter used for motor control; and
FIG. 7 is a view showing conventional package structure of the semiconductor device.
DETAILED DESCRIPTION OF THE INVENTION
The present invention will be described with reference to the accompanying drawings.
First, the principle of the present invention will be described with reference to FIGS. 1 to 4. Assuming, in FIG. 2, that a point on the interface of the sealing material 4 and the insulation layer 2 is B, and a point just below point A and a point just below point B on the interface of the insulation layer 2 and the metal substrate 1 are respectively C and D, capacitor C1 is located between points A and C, capacitor C2 between points A and B, and capacitor C1a between points B and D as shown in the equivalent circuit of FIG. 3. On the other hand, if a portion from the edge part of the wiring pattern 3 to the exposed surface of the insulation layer 2 is covered with the solid insulation 5 as shown in FIG. 1 (present invention), the equivalent circuit will be as shown in FIG. 4. It is assumed that voltage V2 is applied to capacitor C2 and voltage V1a to capacitor C1a in FIG. 3 and voltage V3 is applied to capacitor C3 and voltage V1b to capacitor C1b in FIG. 4. Voltage VEmax applied to wiring 3 will be as shown below: ##EQU1##
The potential generated at capacitors C2 and C3 when the voltage VEmax is applied is as shown below.
For capacitor C.sub.2 ; E.sub.2 =V.sub.Emax -V.sub.2       (1)
For capacitor C.sub.3 ; E.sub.3 =V.sub.Emax -V.sub.3       (2)
The discharge is commenced from a certain specified level of the generated potential. Thus, in case that the solid insulation 5 is interposed, the relationship of E3 >E2 should be established to enable discharging at a larger potential than that in case only the sealing material 4 is provided. In order to establish the relationship, specific inductive capacity ε3 of the solid insulations need be larger than specific inductive capacity ε2 of the sealing material 4 since V2 >V3 must be established from equations (1) and (2), C2 <C3 because V is inverse proportional to C, and C is proportional to specific inductive capacity ε.
Next, the preferred embodiments of the present invention will be described in detail with reference to FIGS. 1 and 5.
As shown in FIG. 1, copper foil 3 having 30 to 100 μm thickness is deposited on an insulation coated metal substrate made up by covering an aluminum substrate 1 having 1 to 3 mm thickness with an insulation layer 2 having 80 to 150 μm thickness made of an organic insulation material, and a wiring pattern is formed by etching. Semiconductor elements are fixed onto the wiring 3 or the insulation layer 2 and their electrodes are connected via conductors to the wiring 3. A solid insulation 5 such as epoxy melamine-based resin of specific inductive capacity ε=4.8 which has a thickness of 10 to 50 μm is formed over all the exposed surface of the insulation layer 2 by printing or the like so as to cover the edge part A of all the wiring 3 made of copper foil. In addition, a sealing material 4 is formed on the solid insulation and the wiring by injection-molding epoxy resin of ε<4.2 in a thickness of several hundreds of μm. Other structure is the same as that of a conventional device, and therefore the description will be omitted.
Separately, another semiconductor device using ferrite of ε=9.5 as the solid insulation 5 was made. As a result, in any case, the corona discharge starting voltage was improved to 1.2 kV or over though it was 0.4 to 1.0 kV for the molded sealing material.
FIG. 5 shows another embodiment of the present invention. In this case, though only the edge part A of all the wiring 3 is covered with the solid insulation 5, an improvement of the corona discharge starting voltage was similarly observed.
The present invention allows the corona discharge starting voltage of the insulation layer of the insulation coated metal substrate to be improved by covering the edge part of the wiring pattern with the solid insulation having a higher specific inductive capacity than that of the sealing material provided over the edge part. Epoxy melamine-based resin or ferrite can be effectively used as such solid insulation having a high specific inductive capacity when the sealing material is made of epoxy resin.

Claims (5)

What is claimed is:
1. A semiconductor device using an insulation coated metal substrate, comprising:
an insulation coated metal substrate formed of a metal substrate and an insulation layer disposed on said metal substrate;
a wiring pattern of metallic foil formed on a surface of said insulation layer;
semiconductor elements supported on said insulation coated metal substrate and connected to wiring pattern of said metallic foil;
an insulating sealing material covering said semiconductor elements and said wiring pattern; and
a solid insulation having a larger specific inductive capacity than that of said sealing material, said solid insulation being interposed between an edge part of said wiring pattern of metallic foil and said sealing material.
2. A semiconductor device using an insulation coated metal substrate in accordance with claim 1, wherein said sealing material is epoxy resin and said solid insulation is epoxy melamine-based resin.
3. A semiconductor device using an insulation coated metal substrate in accordance with claim 2, wherein said sealing material is epoxy resin and said solid insulation is ferrite.
4. A semiconductor device using an insulation coated metal substrate in accordance with claim 1, wherein said solid insulation is formed over all of the surface of the insulation layer exposed by said wiring pattern and over an edge part of said wiring pattern.
5. A semiconductor device using an insulation coated metal substrate in accordance with claim 1, wherein said solid insulation has a specific inductive capacity of approximately 4.8 and said insulating sealing material has a specific inductive capacity of less than 4.2.
US07/767,801 1990-10-05 1991-09-20 Semiconductor device using insulation coated metal substrate Expired - Fee Related US5194933A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP26796190 1990-10-05
JP2-267961 1990-10-05

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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5605863A (en) * 1990-08-31 1997-02-25 Texas Instruments Incorporated Device packaging using heat spreaders and assisted deposition of wire bonds
US5825146A (en) * 1996-05-31 1998-10-20 Aisin Aw Co., Ltd. Motor drive device
US5847467A (en) * 1990-08-31 1998-12-08 Texas Instruments Incorporated Device packaging using heat spreaders and assisted deposition of wire bonds
WO2000007417A1 (en) * 1998-07-31 2000-02-10 Kulicke & Soffa Holdings, Inc. Low-impedance high-density deposited-on-laminate structures having reduced stress
US6131278A (en) * 1995-01-25 2000-10-17 International Business Machines Corporation Metal substrate having an IC chip and carrier mounting
US6166411A (en) * 1999-10-25 2000-12-26 Advanced Micro Devices, Inc. Heat removal from SOI devices by using metal substrates
US6227723B1 (en) * 1999-06-30 2001-05-08 Kyocera Corporation Substrate for mounting an optical component and optical module provided with the same
WO2002097880A2 (en) * 2001-05-25 2002-12-05 eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG Power semiconductor module and method for the production of a power semiconductor module
DE10135348A1 (en) * 2001-07-20 2003-01-30 Abb Research Ltd Method for manufacturing. semiconductor modules, or structures for them, or semiconductor elements for HV
WO2005096374A1 (en) * 2004-03-15 2005-10-13 Siemens Aktiengesellschaft Electronic product comprising an electrical component and a cast mass for electrical insulation of the component and method for production of the product
US20050237636A1 (en) * 2004-04-22 2005-10-27 Eastman Kodak Company Adjustable mount for cylindrical lens
US10854524B2 (en) 2017-02-03 2020-12-01 Abb Schweiz Ag Power semiconductor module

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5408128A (en) * 1993-09-15 1995-04-18 International Rectifier Corporation High power semiconductor device module with low thermal resistance and simplified manufacturing
DE4340847A1 (en) * 1993-11-26 1995-06-01 Optosys Gmbh Berlin Chip module with chip on substrate material
JPH09148373A (en) * 1995-11-21 1997-06-06 Murata Mfg Co Ltd Radio communication module
EP2302676A1 (en) * 2009-09-29 2011-03-30 ABB Technology AG High power semiconductor device

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JPH01232792A (en) * 1988-03-11 1989-09-18 Mitsubishi Cable Ind Ltd Circuit board

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US4443655A (en) * 1981-11-27 1984-04-17 Unitrode Corporation Extruded semiconductor package and fabrication method
JPS59198740A (en) * 1983-04-25 1984-11-10 Mitsubishi Electric Corp Resin seal type semiconductor compound element
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JPH07112041B2 (en) * 1986-12-03 1995-11-29 シャープ株式会社 Method for manufacturing semiconductor device

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US4528064A (en) * 1980-12-08 1985-07-09 Sony Corporation Method of making multilayer circuit board
US4677252A (en) * 1983-03-26 1987-06-30 Sony Corporation Circuit board
JPH01232792A (en) * 1988-03-11 1989-09-18 Mitsubishi Cable Ind Ltd Circuit board

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5847467A (en) * 1990-08-31 1998-12-08 Texas Instruments Incorporated Device packaging using heat spreaders and assisted deposition of wire bonds
US5605863A (en) * 1990-08-31 1997-02-25 Texas Instruments Incorporated Device packaging using heat spreaders and assisted deposition of wire bonds
US6150716A (en) * 1995-01-25 2000-11-21 International Business Machines Corporation Metal substrate having an IC chip and carrier mounting
US6131278A (en) * 1995-01-25 2000-10-17 International Business Machines Corporation Metal substrate having an IC chip and carrier mounting
US5825146A (en) * 1996-05-31 1998-10-20 Aisin Aw Co., Ltd. Motor drive device
US6323435B1 (en) 1998-07-31 2001-11-27 Kulicke & Soffa Holdings, Inc. Low-impedance high-density deposited-on-laminate structures having reduced stress
WO2000007417A1 (en) * 1998-07-31 2000-02-10 Kulicke & Soffa Holdings, Inc. Low-impedance high-density deposited-on-laminate structures having reduced stress
US6227723B1 (en) * 1999-06-30 2001-05-08 Kyocera Corporation Substrate for mounting an optical component and optical module provided with the same
US6166411A (en) * 1999-10-25 2000-12-26 Advanced Micro Devices, Inc. Heat removal from SOI devices by using metal substrates
WO2002097880A2 (en) * 2001-05-25 2002-12-05 eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG Power semiconductor module and method for the production of a power semiconductor module
DE10125697A1 (en) * 2001-05-25 2002-12-05 Eupec Gmbh & Co Kg Power semiconductor module and method for producing a power semiconductor module
WO2002097880A3 (en) * 2001-05-25 2003-09-25 Eupec Gmbh & Co Kg Power semiconductor module and method for the production of a power semiconductor module
DE10125697B4 (en) 2001-05-25 2019-01-03 Infineon Technologies Ag Power semiconductor module and method for manufacturing a power semiconductor module
DE10135348A1 (en) * 2001-07-20 2003-01-30 Abb Research Ltd Method for manufacturing. semiconductor modules, or structures for them, or semiconductor elements for HV
WO2005096374A1 (en) * 2004-03-15 2005-10-13 Siemens Aktiengesellschaft Electronic product comprising an electrical component and a cast mass for electrical insulation of the component and method for production of the product
US20050237636A1 (en) * 2004-04-22 2005-10-27 Eastman Kodak Company Adjustable mount for cylindrical lens
US10854524B2 (en) 2017-02-03 2020-12-01 Abb Schweiz Ag Power semiconductor module

Also Published As

Publication number Publication date
GB2249670B (en) 1994-06-22
DE4133199C2 (en) 2002-01-31
GB9121080D0 (en) 1991-11-13
GB2249670A (en) 1992-05-13
DE4133199A1 (en) 1992-05-14

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