US5168926A - Heat sink design integrating interface material - Google Patents

Heat sink design integrating interface material Download PDF

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Publication number
US5168926A
US5168926A US07/766,425 US76642591A US5168926A US 5168926 A US5168926 A US 5168926A US 76642591 A US76642591 A US 76642591A US 5168926 A US5168926 A US 5168926A
Authority
US
United States
Prior art keywords
adhesive
heat sink
recess
rails
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US07/766,425
Inventor
Jeff Watson
Charles Ruff
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Intel Corp
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Intel Corp
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Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Priority to US07/766,425 priority Critical patent/US5168926A/en
Assigned to INTEL CORPORATION, A CORP. OF DE reassignment INTEL CORPORATION, A CORP. OF DE ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: RUFF, CHARLES, WATSON, JEFF
Priority to JP4273570A priority patent/JPH05206343A/en
Application granted granted Critical
Publication of US5168926A publication Critical patent/US5168926A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a method and assembly for a heat sink that is attached to an electrical device.
  • Heat sinks are commonly used to remove heat from electrical devices mounted to electronic circuit boards. Most heat sinks have a plurality of fins that provide a large surface area, so that the heat can be efficiently removed by natural or forced convection. The heat is typically generated by integrated circuits that are housed within chip carriers mounted to printed circuit boards. A heat sink is typically mounted directly to the chip carrier to minimize the conductive path between the integrated circuit and the sink.
  • the heat sink is attached by mounting the chip carrier onto a flat surface of the heat sink.
  • a sheet of thermally conductive adhesive film is placed between the flat surface of the heat sink and the chip carrier.
  • the adhesive film is then heated while the chip carrier and heat sink are pressed together, wherein the adhesive bonds the two pieces together.
  • a uniform pressure is applied to the members by a spring loaded fixture, to ensure a uniform bonding layer and to prevent shifting during cure.
  • Another conventional method of attachment utilizes mechanical fasteners and a thermally conductive grease. It would be desirable to have a heat sink and a method of attaching the heat sink to an electrical device, without having to use an external fixture or pressure.
  • the present invention is a method and assembly for a heat sink that is attached to a chip carrier.
  • the heat sink has a plurality of fins extending from the first surface of a plate and a pair of rails extending from a second opposite surface of the plate.
  • the rails are constructed to contain and restrain the heat sink on the chip carrier.
  • the heat sink also has a recess and a pair of support surfaces between the rails, to control the adhesive bond line thickness without fixturing or pressure.
  • a thermally conductive adhesive is applied into the center of the recess.
  • the chip carrier is then placed on the support surfaces between the rails.
  • the rails prevent the carrier from shifting while the adhesive is curing. Mounting the carrier on the support surface pushes the adhesive throughout the recess.
  • the adhesive is allowed to cure, wherein the heat sink is bonded to the chip carrier.
  • the adhesive is of the type that allows the heat sink to be connected after the chip carrier is soldered to a circuit board.
  • the recess provides a means for accurately controlling the bond line thickness of the adhesive.
  • the resulting assembly has a uniform bonding area with a predictable thermally conductive path and a known bond strength.
  • FIG. 1 is a side view of a heat sink of the present invention
  • FIG. 2 is a top view of FIG. 2;
  • FIG. 3 is a top view of the heat sink of FIG. 1, showing an adhesive applied to the heat sink;
  • FIG. 4 is a side view showing a chip carrier attached to the heat sink.
  • FIGS. 1 and 2 show a heat sink 10 of the present invention.
  • the heat sink 10 is typically constructed from a light thermally conductive material.
  • the heat sink 10 can have a plurality of fins 12 extending from the first surface 14 of a plate 16.
  • the fins 12 are located so that heat can be removed from the heat sink 10.
  • the fins 12 provide a large surface area, so that the heat sink 10 has a large rate of heat transfer.
  • the chip carrier 28 typically contains an integrated chip which produces heat. The chip carrier 28 is placed between the rails 20 which prevent rotation and lateral, while the carrier 28 is being bonded to the heat sink 10.
  • the rails 20 may extend around the periphery of the heat sink 10, so that the chip carrier 28 can be laterally restrained in two axis.
  • the pair of rails 20 shown allow the heat sink 10 to be extruded and cut, resulting in a product 10 that can be economically mass produced.
  • the chip carrier 28 is pushed down between the rails 20 until the bottom of the carrier seats on the support surfaces 22.
  • the adhesive 26 can be initially applied to cover the recess 24, or the adhesive 26 can be dispensed as a mound in the center of the heat sink 10, as shown in FIG. 3.
  • the adhesive 26 is then squeezed and flows throughout the recess 24, when the carrier 28 is pushed onto the support surfaces 22.
  • the volume of adhesive 26 supplied can be equal to the volume of the recess 24, so that there are no air gaps between the chip carrier 28 and the heat sink 10 throughout the recess 24.
  • the adhesive 26 should also cure at ambient temperatures and without pressure.
  • the adhesive 26 is preferably a thermally conductive epoxy that is deformable in the uncured state. No additional equipment, such as an oven or clamp is required to assemble the present invention.
  • the carrier 28 is left in place until the adhesive 26 has cured, wherein the heat sink 10 is bonded to the carrier 28 to create a carrier subassembly 30.
  • the room cured adhesive allows the heat sink 10 to be attached to a chip carrier 28, after the carrier 28 is soldered to a circuit board.
  • the recess 24 provides a means to create a bonding interface between a chip carrier 28 and heat sink 10, that is constant and uniform for every subassembly 30.
  • the recess 24 should be deep enough so that the adhesive 26 can flow throughout the recess area, but shallow enough to create a short thermal path between the chip carrier 28 and the heat sink 10.

Abstract

A method and assembly for a heat sink that is attached to a chip carrier. The heat sink has a plurality of fins extending from the first surface of a plate and a pair of rails extending from a second opposite surface of the plate. The rails are constructed to contain and restrain the heat sink on the chip carrier. The heat sink also has a recess and a pair of support surfaces between the rails. To attach the chip carrier to the heat sink, a thermally conductive adhesive is applied into the center of the recess. The chip carrier is then placed on the support surfaces between the rails. Mounting the carrier on the support surface pushes the adhesive throughout the recess. The adhesive cures at room temperature, wherein the heat sink is bonded to the chip carrier.

Description

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a method and assembly for a heat sink that is attached to an electrical device.
2. Description of Related Art
Heat sinks are commonly used to remove heat from electrical devices mounted to electronic circuit boards. Most heat sinks have a plurality of fins that provide a large surface area, so that the heat can be efficiently removed by natural or forced convection. The heat is typically generated by integrated circuits that are housed within chip carriers mounted to printed circuit boards. A heat sink is typically mounted directly to the chip carrier to minimize the conductive path between the integrated circuit and the sink.
The heat sink is attached by mounting the chip carrier onto a flat surface of the heat sink. A sheet of thermally conductive adhesive film is placed between the flat surface of the heat sink and the chip carrier. The adhesive film is then heated while the chip carrier and heat sink are pressed together, wherein the adhesive bonds the two pieces together. A uniform pressure is applied to the members by a spring loaded fixture, to ensure a uniform bonding layer and to prevent shifting during cure. Another conventional method of attachment utilizes mechanical fasteners and a thermally conductive grease. It would be desirable to have a heat sink and a method of attaching the heat sink to an electrical device, without having to use an external fixture or pressure.
SUMMARY OF THE INVENTION
The present invention is a method and assembly for a heat sink that is attached to a chip carrier. The heat sink has a plurality of fins extending from the first surface of a plate and a pair of rails extending from a second opposite surface of the plate. The rails are constructed to contain and restrain the heat sink on the chip carrier. The heat sink also has a recess and a pair of support surfaces between the rails, to control the adhesive bond line thickness without fixturing or pressure.
To attach the chip carrier to the heat sink, a thermally conductive adhesive is applied into the center of the recess. The chip carrier is then placed on the support surfaces between the rails. The rails prevent the carrier from shifting while the adhesive is curing. Mounting the carrier on the support surface pushes the adhesive throughout the recess. The adhesive is allowed to cure, wherein the heat sink is bonded to the chip carrier. The adhesive is of the type that allows the heat sink to be connected after the chip carrier is soldered to a circuit board. The recess provides a means for accurately controlling the bond line thickness of the adhesive. The resulting assembly has a uniform bonding area with a predictable thermally conductive path and a known bond strength.
Therefore, it is an object of this invention to provide a method of attaching a chip carrier to a heat sink that creates a uniform bond line thickness of adhesive, thereby creating a predictable thermally conductive path and a known bond strength for all assemblies.
It is also an object of this invention to provide a heat sink that allows the heat sink to be attached to a chip carrier without movement during the curing process.
It is also an object of this invention to provide a method of attaching a chip carrier to a heat sink that utilizes a thermally conductive adhesive.
It is also an object of this invention to provide a method of attaching a heat sink to a chip carrier after the carrier is soldered to a circuit board.
BRIEF DESCRIPTION OF THE DRAWINGS
The objects and advantages of the present invention will become more readily apparent to those skilled in the art after reviewing the following detailed description and accompanying drawings, wherein:
FIG. 1 is a side view of a heat sink of the present invention;
FIG. 2 is a top view of FIG. 2;
FIG. 3 is a top view of the heat sink of FIG. 1, showing an adhesive applied to the heat sink;
FIG. 4 is a side view showing a chip carrier attached to the heat sink.
DETAILED DESCRIPTION OF THE DRAWINGS
Referring to the drawings more particularly by reference numbers, FIGS. 1 and 2 show a heat sink 10 of the present invention. The heat sink 10 is typically constructed from a light thermally conductive material. The heat sink 10 can have a plurality of fins 12 extending from the first surface 14 of a plate 16. The fins 12 are located so that heat can be removed from the heat sink 10. The fins 12 provide a large surface area, so that the heat sink 10 has a large rate of heat transfer.
Extending from a second surface 18 of the plate 16 are a pair of rails 20, that run along the length of the heat sink, as shown in FIG. 2. Between the rails 20 are a pair of support surfaces 22 and a recess 24. As shown in FIGS. 3 and 4, an adhesive 26 can be dispensed into the recess 24 and a chip carrier 28 or other electrical device can be placed onto the heat sink 10. The chip carrier 28 typically contains an integrated chip which produces heat. The chip carrier 28 is placed between the rails 20 which prevent rotation and lateral, while the carrier 28 is being bonded to the heat sink 10. Although two rails 20 extending down the sides of the heat sink 10 are shown, it is to be understood that the rails 20 may extend around the periphery of the heat sink 10, so that the chip carrier 28 can be laterally restrained in two axis. The pair of rails 20 shown allow the heat sink 10 to be extruded and cut, resulting in a product 10 that can be economically mass produced.
The chip carrier 28 is pushed down between the rails 20 until the bottom of the carrier seats on the support surfaces 22. The adhesive 26 can be initially applied to cover the recess 24, or the adhesive 26 can be dispensed as a mound in the center of the heat sink 10, as shown in FIG. 3. The adhesive 26 is then squeezed and flows throughout the recess 24, when the carrier 28 is pushed onto the support surfaces 22. The volume of adhesive 26 supplied can be equal to the volume of the recess 24, so that there are no air gaps between the chip carrier 28 and the heat sink 10 throughout the recess 24. The adhesive 26 should also cure at ambient temperatures and without pressure. The adhesive 26 is preferably a thermally conductive epoxy that is deformable in the uncured state. No additional equipment, such as an oven or clamp is required to assemble the present invention.
The carrier 28 is left in place until the adhesive 26 has cured, wherein the heat sink 10 is bonded to the carrier 28 to create a carrier subassembly 30. The room cured adhesive allows the heat sink 10 to be attached to a chip carrier 28, after the carrier 28 is soldered to a circuit board. The recess 24 provides a means to create a bonding interface between a chip carrier 28 and heat sink 10, that is constant and uniform for every subassembly 30. The recess 24 should be deep enough so that the adhesive 26 can flow throughout the recess area, but shallow enough to create a short thermal path between the chip carrier 28 and the heat sink 10.
While certain exemplary embodiments have been described and shown in the accompanying drawings, it is to be understood that such embodiments are merely illustrative of and not restrictive on the broad invention, and that this invention not be limited to the specific constructions and arrangements shown and described, since various other modifications may occur to those ordinarily skilled in the art.

Claims (6)

What is claimed is:
1. An electronic assembly, comprising:
a housing block having a plate with a plurality of fins extending from a first surface of said plate and a pair of rails extending from an opposite second surface of said plate, said plate further having a pair of support surfaces essentially perpendicular to said rails and a recess between said support surfaces;
an electrical device mounted onto said support surfaces between said rails of said housing block; and,
an adhesive that completely fills said recess and does not extend past said support surface, wherein said recess controls said adhesive thickness.
2. The electronic assembly as recited in claim 1, wherein said adhesive is a thermally conductive epoxy.
3. The electronic assembly as recited in claim 2, wherein said electrical device is a chip carrier that contains an integrated circuit.
4. A method for controlling the thickness of an adhesive that couples an electronic device to a heat sink, comprising the steps of:
providing an electrical device;
providing a housing block having a plate with a plurality of fins extending from a first surface of said plate and a pair of rails extending from an opposite second surface of said plate, said plate further having a pair of support surfaces essentially perpendicular to said rails and a recess between said support surfaces, said recess having a predetermined volume;
applying an adhesive onto said recess of said housing block, said applied adhesive having a volume that approximates said volume of said recess;
placing said electrical device onto said support surfaces of said housing block, such that said adhesive completely fills said recess; and,
curing said adhesive such that said electrical device is attached to said housing block.
5. The method as recited in claim 4 wherein said adhesive is a thermally conductive epoxy that cures at ambient temperature and pressure.
6. The method as recited in claim 5, wherein said electrical device is a chip carrier that contains an integrated circuit.
US07/766,425 1991-09-25 1991-09-25 Heat sink design integrating interface material Expired - Lifetime US5168926A (en)

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US07/766,425 US5168926A (en) 1991-09-25 1991-09-25 Heat sink design integrating interface material
JP4273570A JPH05206343A (en) 1991-09-25 1992-09-18 Heat sink, electronic assembly and its assembly method

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Cited By (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5285108A (en) * 1991-06-21 1994-02-08 Compaq Computer Corporation Cooling system for integrated circuits
US5287249A (en) * 1993-07-07 1994-02-15 Global Win Technology Co., Ltd. Fin assembly for an integrated circuit
US5352991A (en) * 1993-08-12 1994-10-04 Motorola, Inc. Power amplifier assembly
US5394936A (en) * 1993-03-12 1995-03-07 Intel Corporation High efficiency heat removal system for electric devices and the like
US5473511A (en) * 1994-05-05 1995-12-05 Ford Motor Company Printed circuit board with high heat dissipation
US5557501A (en) * 1994-11-18 1996-09-17 Tessera, Inc. Compliant thermal connectors and assemblies incorporating the same
US5560423A (en) * 1994-07-28 1996-10-01 Aavid Laboratories, Inc. Flexible heat pipe for integrated circuit cooling apparatus
US5594623A (en) * 1994-09-21 1997-01-14 Hewlett-Packard Co Method and apparatus for attaching a heat sink and a fan to an integrated circuit package
US5615735A (en) * 1994-09-29 1997-04-01 Hewlett-Packard Co. Heat sink spring clamp
US5653280A (en) * 1995-11-06 1997-08-05 Ncr Corporation Heat sink assembly and method of affixing the same to electronic devices
US5689752A (en) * 1996-01-23 1997-11-18 Minnesota Mining And Manufacturing Company Processing apparatus, method, and system for photosensitive materials
US5841244A (en) * 1997-06-18 1998-11-24 Northrop Grumman Corporation RF coil/heat pipe for solid state light driver
US5852339A (en) * 1997-06-18 1998-12-22 Northrop Grumman Corporation Affordable electrodeless lighting
US5897917A (en) * 1996-06-21 1999-04-27 Thermalloy, Inc. Pre-application of grease to heat sinks with a protective coating
US6059116A (en) * 1996-06-21 2000-05-09 Thermalloy, Inc. Heat sink packaging devices
US6063253A (en) * 1996-01-23 2000-05-16 3M Innovative Properties Company Apparatus and method for electroplating a metal onto a substrate
US6131278A (en) * 1995-01-25 2000-10-17 International Business Machines Corporation Metal substrate having an IC chip and carrier mounting
US6143076A (en) * 1996-06-21 2000-11-07 Thermalloy Inc. Applicator head
US6167948B1 (en) 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
US6205654B1 (en) 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
US6230789B1 (en) * 1998-07-08 2001-05-15 Foxconn Precision Componment Co., Ltd Heat dissipating device and method making the same
US6239974B1 (en) 1998-07-06 2001-05-29 Intel Corporation Electrical assembly that includes a heat sink which is attached to a substrate by a clip
US6257327B1 (en) * 1997-08-15 2001-07-10 Intel Corporation Heat sink including pedestal
US6275381B1 (en) * 1998-12-10 2001-08-14 International Business Machines Corporation Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof
US20010019913A1 (en) * 1998-08-20 2001-09-06 David J. Llapitan Retention mechanism for an electrical assembly
US6339875B1 (en) * 1996-04-08 2002-01-22 Heat Technology, Inc. Method for removing heat from an integrated circuit
US6381136B1 (en) 1996-09-30 2002-04-30 Intel Corporation Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges
US6396701B1 (en) * 1999-11-12 2002-05-28 Fujitsu Limited Semiconductor unit and cooling device
US6462408B1 (en) 2001-03-27 2002-10-08 Staktek Group, L.P. Contact member stacking system and method
US6545351B1 (en) 1998-07-21 2003-04-08 Intel Corporation Underside heat slug for ball grid array packages
US6608763B1 (en) 2000-09-15 2003-08-19 Staktek Group L.P. Stacking system and method
US20040017656A1 (en) * 2002-07-26 2004-01-29 Intel Corporation Heat sink and package surface design
US20040042178A1 (en) * 2002-09-03 2004-03-04 Vadim Gektin Heat spreader with surface cavity
US6708757B2 (en) * 2000-02-28 2004-03-23 Epcos Ag Heat sink module and an arrangment of heat sink modules
US6752204B2 (en) * 2001-09-18 2004-06-22 Intel Corporation Iodine-containing thermal interface material
US20040118579A1 (en) * 2002-12-19 2004-06-24 3M Innovative Properties Company Flexible heat sink
US20040125570A1 (en) * 2002-12-16 2004-07-01 Amber Glenn M. System for loading a heat sink mechanism independently of clamping load on electrical device
US20040155325A1 (en) * 2000-10-04 2004-08-12 Intel Corporation Die-in heat spreader microelectronic package
US6935420B1 (en) 2004-06-16 2005-08-30 Hon Hai Precision Ind. Co., Ltd. Heat dissipation assembly
US20050243520A1 (en) * 2004-04-28 2005-11-03 Kentaro Tomioka Pump and electronic device having the pump
US20050243518A1 (en) * 2004-04-28 2005-11-03 Yukihiko Hata Heat-receiving apparatus and electronic equipment
US20050264996A1 (en) * 2004-06-01 2005-12-01 Kentaro Tomioka Pump, cooling unit and electronic apparatus including cooling unit
US20050265001A1 (en) * 2004-05-31 2005-12-01 Tomonori Saito Cooling system and projection-type image display apparatus using the same
US6992893B2 (en) * 2003-01-10 2006-01-31 Hewlett-Packard Development Company, L.P. Heat sink attachment
US7026708B2 (en) 2001-10-26 2006-04-11 Staktek Group L.P. Low profile chip scale stacking system and method
US7033861B1 (en) 2005-05-18 2006-04-25 Staktek Group L.P. Stacked module systems and method
US7053478B2 (en) 2001-10-26 2006-05-30 Staktek Group L.P. Pitch change and chip scale stacking system
US7081373B2 (en) 2001-12-14 2006-07-25 Staktek Group, L.P. CSP chip stack with flex circuit
US20060185836A1 (en) * 2005-02-24 2006-08-24 Scott Garner Thermally coupled surfaces having controlled minimum clearance
US7180167B2 (en) 2001-10-26 2007-02-20 Staktek Group L. P. Low profile stacking system and method
US7202555B2 (en) 2001-10-26 2007-04-10 Staktek Group L.P. Pitch change and chip scale stacking system and method
USRE39628E1 (en) 1999-05-05 2007-05-15 Stakick Group, L.P. Stackable flex circuit IC package and method of making same
US7256484B2 (en) 2001-10-26 2007-08-14 Staktek Group L.P. Memory expansion and chip scale stacking system and method
US20070217161A1 (en) * 2006-03-16 2007-09-20 Foxconn Technology Co., Ltd. Heat sink having protective device for thermal interface material spread thereon
US7273089B2 (en) 2003-05-26 2007-09-25 Kabushiki Kaisha Toshiba Electronic apparatus having a heat-radiating unit for radiating heat of heat-generating components
US7310458B2 (en) 2001-10-26 2007-12-18 Staktek Group L.P. Stacked module systems and methods
US7309914B2 (en) 2005-01-20 2007-12-18 Staktek Group L.P. Inverted CSP stacking system and method
US7335975B2 (en) 2001-10-26 2008-02-26 Staktek Group L.P. Integrated circuit stacking system and method
US7371609B2 (en) 2001-10-26 2008-05-13 Staktek Group L.P. Stacked module systems and methods
US7417310B2 (en) 2006-11-02 2008-08-26 Entorian Technologies, Lp Circuit module having force resistant construction
US7485951B2 (en) 2001-10-26 2009-02-03 Entorian Technologies, Lp Modularized die stacking system and method
US7524703B2 (en) 2001-10-26 2009-04-28 Entorian Technologies, Lp Integrated circuit stacking system and method
US7542304B2 (en) 2003-09-15 2009-06-02 Entorian Technologies, Lp Memory expansion and integrated circuit stacking system and method
FR2926170A1 (en) * 2008-01-08 2009-07-10 Valeo Equip Electr Moteur Rotating electric machine i.e. alternator, for motor vehicle, has support and cover that are arranged such that dissipator remains placed in housing of support, in case of accidental disintegration of dissipator from support
US20090268409A1 (en) * 2008-04-28 2009-10-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation assembly
US20090279276A1 (en) * 2008-05-08 2009-11-12 Toyota Jidosha Kabushiki Kaisha Electronic component
USRE41039E1 (en) 2000-01-13 2009-12-15 Entorian Technologies, Lp Stackable chip package with flex carrier
US7656678B2 (en) 2001-10-26 2010-02-02 Entorian Technologies, Lp Stacked module systems
US7719098B2 (en) 2001-10-26 2010-05-18 Entorian Technologies Lp Stacked modules and method
US20100246133A1 (en) * 2009-03-31 2010-09-30 Apple Inc. Method and apparatus for distributing a thermal interface material
US20120125589A1 (en) * 2010-11-22 2012-05-24 Samsung Electro-Mechanics Co., Ltd. Heat sink
US11134591B2 (en) * 2019-12-20 2021-09-28 Astec International Limited Circuit board assemblies for electronic devices
US11375639B2 (en) 2018-06-03 2022-06-28 Tcpoly Inc. Additive manufactured multi-layer thermally conductive parts

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100886808B1 (en) * 2002-02-19 2009-03-04 페어차일드코리아반도체 주식회사 Power semiconductor module assembling unit having heat sink
JP2017199829A (en) * 2016-04-28 2017-11-02 日産自動車株式会社 Power module structure
JP2020072101A (en) * 2018-10-29 2020-05-07 京セラ株式会社 Power unit, method of manufacturing the same, electric device having power unit, and heat sink
JP2020072094A (en) * 2018-10-29 2020-05-07 京セラ株式会社 Power unit, method of manufacturing the same, and electric device having power unit

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4092697A (en) * 1976-12-06 1978-05-30 International Business Machines Corporation Heat transfer mechanism for integrated circuit package
US4360141A (en) * 1980-09-02 1982-11-23 Kensrue Milo M Holder for welding seam back-up tape
US4415025A (en) * 1981-08-10 1983-11-15 International Business Machines Corporation Thermal conduction element for semiconductor devices
JPS607155A (en) * 1983-06-24 1985-01-14 Mitsubishi Electric Corp Heat dissipating device for electronic part
US4603374A (en) * 1984-07-03 1986-07-29 Motorola, Inc. Packaging module for a semiconductor wafer
US4605058A (en) * 1985-04-01 1986-08-12 The Staver Company, Inc. Heat dissipating retainer for electronic package
JPS6355966A (en) * 1986-08-26 1988-03-10 Nec Corp Heat radiator of integrated circuit module
US4771365A (en) * 1987-10-30 1988-09-13 Honeywell Inc. Passive cooled electronic chassis
JPS6431443A (en) * 1987-07-27 1989-02-01 Nec Corp Semiconductor device
JPS6459841A (en) * 1987-08-31 1989-03-07 Matsushita Electric Ind Co Ltd Semiconductor device
US4833567A (en) * 1986-05-30 1989-05-23 Digital Equipment Corporation Integral heat pipe module
US4888637A (en) * 1988-01-15 1989-12-19 Chrysler Motors Corporation Multiple semiconductor heat sink/mounting assembly
JPH0249457A (en) * 1988-08-10 1990-02-19 Mitsubishi Electric Corp Semiconductor device
US5028984A (en) * 1988-11-04 1991-07-02 International Business Machines Corporation Epoxy composition and use thereof

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4092697A (en) * 1976-12-06 1978-05-30 International Business Machines Corporation Heat transfer mechanism for integrated circuit package
US4360141A (en) * 1980-09-02 1982-11-23 Kensrue Milo M Holder for welding seam back-up tape
US4415025A (en) * 1981-08-10 1983-11-15 International Business Machines Corporation Thermal conduction element for semiconductor devices
JPS607155A (en) * 1983-06-24 1985-01-14 Mitsubishi Electric Corp Heat dissipating device for electronic part
US4603374A (en) * 1984-07-03 1986-07-29 Motorola, Inc. Packaging module for a semiconductor wafer
US4605058A (en) * 1985-04-01 1986-08-12 The Staver Company, Inc. Heat dissipating retainer for electronic package
US4833567A (en) * 1986-05-30 1989-05-23 Digital Equipment Corporation Integral heat pipe module
JPS6355966A (en) * 1986-08-26 1988-03-10 Nec Corp Heat radiator of integrated circuit module
JPS6431443A (en) * 1987-07-27 1989-02-01 Nec Corp Semiconductor device
JPS6459841A (en) * 1987-08-31 1989-03-07 Matsushita Electric Ind Co Ltd Semiconductor device
US4771365A (en) * 1987-10-30 1988-09-13 Honeywell Inc. Passive cooled electronic chassis
US4888637A (en) * 1988-01-15 1989-12-19 Chrysler Motors Corporation Multiple semiconductor heat sink/mounting assembly
JPH0249457A (en) * 1988-08-10 1990-02-19 Mitsubishi Electric Corp Semiconductor device
US5028984A (en) * 1988-11-04 1991-07-02 International Business Machines Corporation Epoxy composition and use thereof

Non-Patent Citations (8)

* Cited by examiner, † Cited by third party
Title
"Low Profile Heat Sink", IBM Technical Disclosure Bulletin, vol. 28, No. 12, May 1986, pp. 5172-5173.
"Stock-On Heat Sink", Research Disclosure, No. 270, Oct., 1986, 27014.
Almquist et al., "Spring-Clip Mounted Extruded Aluminum Heat Sink", IBM Technical Disclosure Bulletin, vol. 23, No. 12, May 1981, p. 5303.
Almquist et al., Spring Clip Mounted Extruded Aluminum Heat Sink , IBM Technical Disclosure Bulletin, vol. 23, No. 12, May 1981, p. 5303. *
Cunavelis et al., "External Module Heat Sink Fastened To Board", IBM Technical Disclosure Bulletin, vol. 14, No. 1, Jun. 1971, p. 182.
Cunavelis et al., External Module Heat Sink Fastened To Board , IBM Technical Disclosure Bulletin, vol. 14, No. 1, Jun. 1971, p. 182. *
Low Profile Heat Sink , IBM Technical Disclosure Bulletin, vol. 28, No. 12, May 1986, pp. 5172 5173. *
Stock On Heat Sink , Research Disclosure, No. 270, Oct., 1986, 27014. *

Cited By (109)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5285108A (en) * 1991-06-21 1994-02-08 Compaq Computer Corporation Cooling system for integrated circuits
US6205654B1 (en) 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
US5394936A (en) * 1993-03-12 1995-03-07 Intel Corporation High efficiency heat removal system for electric devices and the like
US5287249A (en) * 1993-07-07 1994-02-15 Global Win Technology Co., Ltd. Fin assembly for an integrated circuit
US5352991A (en) * 1993-08-12 1994-10-04 Motorola, Inc. Power amplifier assembly
US5473511A (en) * 1994-05-05 1995-12-05 Ford Motor Company Printed circuit board with high heat dissipation
US5560423A (en) * 1994-07-28 1996-10-01 Aavid Laboratories, Inc. Flexible heat pipe for integrated circuit cooling apparatus
US5594623A (en) * 1994-09-21 1997-01-14 Hewlett-Packard Co Method and apparatus for attaching a heat sink and a fan to an integrated circuit package
US5615735A (en) * 1994-09-29 1997-04-01 Hewlett-Packard Co. Heat sink spring clamp
US5557501A (en) * 1994-11-18 1996-09-17 Tessera, Inc. Compliant thermal connectors and assemblies incorporating the same
US6131278A (en) * 1995-01-25 2000-10-17 International Business Machines Corporation Metal substrate having an IC chip and carrier mounting
US6150716A (en) * 1995-01-25 2000-11-21 International Business Machines Corporation Metal substrate having an IC chip and carrier mounting
US5653280A (en) * 1995-11-06 1997-08-05 Ncr Corporation Heat sink assembly and method of affixing the same to electronic devices
US5689752A (en) * 1996-01-23 1997-11-18 Minnesota Mining And Manufacturing Company Processing apparatus, method, and system for photosensitive materials
US6063253A (en) * 1996-01-23 2000-05-16 3M Innovative Properties Company Apparatus and method for electroplating a metal onto a substrate
US6339875B1 (en) * 1996-04-08 2002-01-22 Heat Technology, Inc. Method for removing heat from an integrated circuit
US5897917A (en) * 1996-06-21 1999-04-27 Thermalloy, Inc. Pre-application of grease to heat sinks with a protective coating
US6143076A (en) * 1996-06-21 2000-11-07 Thermalloy Inc. Applicator head
US6059116A (en) * 1996-06-21 2000-05-09 Thermalloy, Inc. Heat sink packaging devices
US6381136B1 (en) 1996-09-30 2002-04-30 Intel Corporation Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges
US6167948B1 (en) 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
US5852339A (en) * 1997-06-18 1998-12-22 Northrop Grumman Corporation Affordable electrodeless lighting
US5841244A (en) * 1997-06-18 1998-11-24 Northrop Grumman Corporation RF coil/heat pipe for solid state light driver
US6257327B1 (en) * 1997-08-15 2001-07-10 Intel Corporation Heat sink including pedestal
US6239974B1 (en) 1998-07-06 2001-05-29 Intel Corporation Electrical assembly that includes a heat sink which is attached to a substrate by a clip
US6230789B1 (en) * 1998-07-08 2001-05-15 Foxconn Precision Componment Co., Ltd Heat dissipating device and method making the same
US6545351B1 (en) 1998-07-21 2003-04-08 Intel Corporation Underside heat slug for ball grid array packages
US6722908B2 (en) 1998-08-20 2004-04-20 Intel Corporation Retention mechanism for an electrical assembly
US20010019913A1 (en) * 1998-08-20 2001-09-06 David J. Llapitan Retention mechanism for an electrical assembly
US6585534B2 (en) 1998-08-20 2003-07-01 Intel Corporation Retention mechanism for an electrical assembly
US20030096524A1 (en) * 1998-08-20 2003-05-22 Llapitan David J. Retention mechanism for an electrical assembly
US6275381B1 (en) * 1998-12-10 2001-08-14 International Business Machines Corporation Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof
US6444496B1 (en) 1998-12-10 2002-09-03 International Business Machines Corporation Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof
USRE39628E1 (en) 1999-05-05 2007-05-15 Stakick Group, L.P. Stackable flex circuit IC package and method of making same
US6396701B1 (en) * 1999-11-12 2002-05-28 Fujitsu Limited Semiconductor unit and cooling device
USRE41039E1 (en) 2000-01-13 2009-12-15 Entorian Technologies, Lp Stackable chip package with flex carrier
US6708757B2 (en) * 2000-02-28 2004-03-23 Epcos Ag Heat sink module and an arrangment of heat sink modules
US6608763B1 (en) 2000-09-15 2003-08-19 Staktek Group L.P. Stacking system and method
US20040155325A1 (en) * 2000-10-04 2004-08-12 Intel Corporation Die-in heat spreader microelectronic package
US6462408B1 (en) 2001-03-27 2002-10-08 Staktek Group, L.P. Contact member stacking system and method
US6806120B2 (en) 2001-03-27 2004-10-19 Staktek Group, L.P. Contact member stacking system and method
US6752204B2 (en) * 2001-09-18 2004-06-22 Intel Corporation Iodine-containing thermal interface material
US7495334B2 (en) 2001-10-26 2009-02-24 Entorian Technologies, Lp Stacking system and method
US7180167B2 (en) 2001-10-26 2007-02-20 Staktek Group L. P. Low profile stacking system and method
US7719098B2 (en) 2001-10-26 2010-05-18 Entorian Technologies Lp Stacked modules and method
US7656678B2 (en) 2001-10-26 2010-02-02 Entorian Technologies, Lp Stacked module systems
US7626273B2 (en) 2001-10-26 2009-12-01 Entorian Technologies, L.P. Low profile stacking system and method
US7606048B2 (en) 2001-10-26 2009-10-20 Enthorian Technologies, LP Integrated circuit stacking system
US7595550B2 (en) 2001-10-26 2009-09-29 Entorian Technologies, Lp Flex-based circuit module
US7586758B2 (en) 2001-10-26 2009-09-08 Entorian Technologies, Lp Integrated circuit stacking system
US7572671B2 (en) 2001-10-26 2009-08-11 Entorian Technologies, Lp Stacked module systems and methods
US7524703B2 (en) 2001-10-26 2009-04-28 Entorian Technologies, Lp Integrated circuit stacking system and method
US7485951B2 (en) 2001-10-26 2009-02-03 Entorian Technologies, Lp Modularized die stacking system and method
US7371609B2 (en) 2001-10-26 2008-05-13 Staktek Group L.P. Stacked module systems and methods
US7335975B2 (en) 2001-10-26 2008-02-26 Staktek Group L.P. Integrated circuit stacking system and method
US7026708B2 (en) 2001-10-26 2006-04-11 Staktek Group L.P. Low profile chip scale stacking system and method
US7310458B2 (en) 2001-10-26 2007-12-18 Staktek Group L.P. Stacked module systems and methods
US7053478B2 (en) 2001-10-26 2006-05-30 Staktek Group L.P. Pitch change and chip scale stacking system
US7256484B2 (en) 2001-10-26 2007-08-14 Staktek Group L.P. Memory expansion and chip scale stacking system and method
US7094632B2 (en) 2001-10-26 2006-08-22 Staktek Group L.P. Low profile chip scale stacking system and method
US7202555B2 (en) 2001-10-26 2007-04-10 Staktek Group L.P. Pitch change and chip scale stacking system and method
US7081373B2 (en) 2001-12-14 2006-07-25 Staktek Group, L.P. CSP chip stack with flex circuit
US7193310B2 (en) 2001-12-14 2007-03-20 Stuktek Group L.P. Stacking system and method
US20040017656A1 (en) * 2002-07-26 2004-01-29 Intel Corporation Heat sink and package surface design
US6757170B2 (en) * 2002-07-26 2004-06-29 Intel Corporation Heat sink and package surface design
US6870736B2 (en) 2002-07-26 2005-03-22 Intel Corporation Heat sink and package surface design
US20040218354A1 (en) * 2002-07-26 2004-11-04 Intel Corporation Heat sink and package surface design
US20040042178A1 (en) * 2002-09-03 2004-03-04 Vadim Gektin Heat spreader with surface cavity
US7242583B2 (en) * 2002-12-16 2007-07-10 Paricon Technologies, Corporation System for loading a heat sink mechanism independently of clamping load on electrical device
US20040125570A1 (en) * 2002-12-16 2004-07-01 Amber Glenn M. System for loading a heat sink mechanism independently of clamping load on electrical device
US20050077618A1 (en) * 2002-12-19 2005-04-14 3M Innovative Properties Company Flexible heat sink
US6919504B2 (en) * 2002-12-19 2005-07-19 3M Innovative Properties Company Flexible heat sink
US20040118579A1 (en) * 2002-12-19 2004-06-24 3M Innovative Properties Company Flexible heat sink
US7399919B2 (en) 2002-12-19 2008-07-15 3M Innovative Properties Company Flexible heat sink
US6992893B2 (en) * 2003-01-10 2006-01-31 Hewlett-Packard Development Company, L.P. Heat sink attachment
US7273089B2 (en) 2003-05-26 2007-09-25 Kabushiki Kaisha Toshiba Electronic apparatus having a heat-radiating unit for radiating heat of heat-generating components
US20070230120A1 (en) * 2003-05-26 2007-10-04 Yukihiko Hata Electronic Apparatus Having a Heat-Radiating Unit for Radiating Heat of Heat-Generating Components
US7542304B2 (en) 2003-09-15 2009-06-02 Entorian Technologies, Lp Memory expansion and integrated circuit stacking system and method
US7280357B2 (en) 2004-04-28 2007-10-09 Kabushiki Kaisha Toshiba Pump and electronic device having the pump
US20050243518A1 (en) * 2004-04-28 2005-11-03 Yukihiko Hata Heat-receiving apparatus and electronic equipment
US7548425B2 (en) 2004-04-28 2009-06-16 Kabushiki Kaisha Toshiba Heat-Receiving apparatus and electronic equipment
US7301771B2 (en) * 2004-04-28 2007-11-27 Kabushiki Kaisha Toshiba Heat-receiving apparatus and electronic equipment
US20050243520A1 (en) * 2004-04-28 2005-11-03 Kentaro Tomioka Pump and electronic device having the pump
US7275833B2 (en) 2004-05-31 2007-10-02 Kabushiki Kaisha Toshiba Cooling system and projection-type image display apparatus using the same
US20050265001A1 (en) * 2004-05-31 2005-12-01 Tomonori Saito Cooling system and projection-type image display apparatus using the same
US20050264996A1 (en) * 2004-06-01 2005-12-01 Kentaro Tomioka Pump, cooling unit and electronic apparatus including cooling unit
CN100358134C (en) * 2004-06-16 2007-12-26 富准精密工业(深圳)有限公司 Heat dissipation assembly and protective cover for heat conducting media
US6935420B1 (en) 2004-06-16 2005-08-30 Hon Hai Precision Ind. Co., Ltd. Heat dissipation assembly
US7309914B2 (en) 2005-01-20 2007-12-18 Staktek Group L.P. Inverted CSP stacking system and method
US20060185836A1 (en) * 2005-02-24 2006-08-24 Scott Garner Thermally coupled surfaces having controlled minimum clearance
US7033861B1 (en) 2005-05-18 2006-04-25 Staktek Group L.P. Stacked module systems and method
US7323364B2 (en) 2005-05-18 2008-01-29 Staktek Group L.P. Stacked module systems and method
US7554807B2 (en) * 2006-03-16 2009-06-30 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink having protective device for thermal interface material spread thereon
US20070217161A1 (en) * 2006-03-16 2007-09-20 Foxconn Technology Co., Ltd. Heat sink having protective device for thermal interface material spread thereon
US7804985B2 (en) 2006-11-02 2010-09-28 Entorian Technologies Lp Circuit module having force resistant construction
US7417310B2 (en) 2006-11-02 2008-08-26 Entorian Technologies, Lp Circuit module having force resistant construction
FR2926170A1 (en) * 2008-01-08 2009-07-10 Valeo Equip Electr Moteur Rotating electric machine i.e. alternator, for motor vehicle, has support and cover that are arranged such that dissipator remains placed in housing of support, in case of accidental disintegration of dissipator from support
US20090268409A1 (en) * 2008-04-28 2009-10-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation assembly
US7813132B2 (en) * 2008-04-28 2010-10-12 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation assembly
US20090279276A1 (en) * 2008-05-08 2009-11-12 Toyota Jidosha Kabushiki Kaisha Electronic component
US8446727B2 (en) * 2008-05-08 2013-05-21 Toyota Jidosha Kabushiki Kaisha Electronic component
US20100246133A1 (en) * 2009-03-31 2010-09-30 Apple Inc. Method and apparatus for distributing a thermal interface material
US7961469B2 (en) * 2009-03-31 2011-06-14 Apple Inc. Method and apparatus for distributing a thermal interface material
US20110228482A1 (en) * 2009-03-31 2011-09-22 Apple Inc. Method and apparatus for distributing a thermal interface material
US8564955B2 (en) 2009-03-31 2013-10-22 Apple Inc. Coupling heat sink to integrated circuit chip with thermal interface material
US20120125589A1 (en) * 2010-11-22 2012-05-24 Samsung Electro-Mechanics Co., Ltd. Heat sink
US11375639B2 (en) 2018-06-03 2022-06-28 Tcpoly Inc. Additive manufactured multi-layer thermally conductive parts
US11134591B2 (en) * 2019-12-20 2021-09-28 Astec International Limited Circuit board assemblies for electronic devices
US11622476B2 (en) 2019-12-20 2023-04-04 Astec International Limited Circuit board assemblies for electronic devices

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