US5116250A - Method and apparatus for applying a coating material to a substrate - Google Patents
Method and apparatus for applying a coating material to a substrate Download PDFInfo
- Publication number
- US5116250A US5116250A US07/246,403 US24640388A US5116250A US 5116250 A US5116250 A US 5116250A US 24640388 A US24640388 A US 24640388A US 5116250 A US5116250 A US 5116250A
- Authority
- US
- United States
- Prior art keywords
- substrate
- air
- vacuum
- air duct
- coating material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 57
- 239000011248 coating agent Substances 0.000 title claims abstract description 25
- 238000000576 coating method Methods 0.000 title claims abstract description 25
- 239000000463 material Substances 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title description 4
- 238000009987 spinning Methods 0.000 claims abstract description 12
- 230000008021 deposition Effects 0.000 abstract description 7
- 230000000873 masking effect Effects 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Definitions
- This invention relates to methods and apparatus for applying a coating material such as a photoresist masking material to a substrate such as a semiconductor wafer or glass.
- Japanese utility model publication No. 60-95979 open to public inspection on Jun. 29, 1985, discloses an automated spin coater which includes an enclosure within which a spinner chuck is supported for rotation by a motor.
- the spinner chuck has a vacuum table on which a semiconductor wafer is securely held by vacuum action.
- a photoresist coating material is applied to the semiconductor wafer which is spun to coat it evenly by centrifugal forces.
- a coating material is likely to be deposited at corners of the substrate due to wind pressure. Such undesirable deposition or uneven coating on the substrate may subsequently result in the malfunction during further processing or use of the substrate and therefore, may also result in a serious decrease in the yield of acceptably coated substrates.
- an object of the invention to provide a method and apparatus for applying a coating material to a substrate, wherein an even coating can be provided over the entire surface of the substrate.
- a method for applying a coating material to a substrate comprising the steps of spinning the substrate, applying the coating material onto the surface of the substrate, and developing and guiding a flow of air over the substrate in a direction identical to the direction of rotation of the substrate.
- an apparatus for applying a coating material to a substrate which comprises an enclosure, a spinning chuck rotatably supported within the enclosure and having a vacuum table on which the substrate is securely held, means for applying the coating material onto the surface of the substrate, means for developing a flow of air over the substrate, and means for guiding the flow of air in a direction identical to the direction of rotation of the substrate.
- the air guide means includes an annular air duct disposed in surrounding and spaced relation to the spinning chuck, and a fixed disk disposed between the air duct and the spinning chuck and having a plurality of guide vanes thereon.
- the flow of air is developed by fans mounted within the air duct and guided by the guide vanes, to eliminate undesirable deposition from the end edge or periphery of the substrate.
- the flow of air may alternatively be developed by a vacuum system having vacuum lines adapted to connect the air duct with vacuum sources.
- FIG. 1 is a vertical section of a coating apparatus designed in accordance with the principles of the invention
- FIG. 2 is a schematic plan view of a semiconductive substrate, showing how a coating liquid as applied thereto flows when the substrate is rotated;
- FIG. 3 is a sectional view taken along the line III--III of FIG. 2.
- FIG. 4 is a schematic plan view of the coating apparatus with a cover removed for clarity.
- FIG. 5 is a view similar to FIG. 4, but showing a modification
- FIG. 1 there is shown a coating apparatus or automatic spin coater indicated generally by the numeral 10 and having an enclosure 12. Centrally disposed within the enclosure 12 is a spinning chuck 14 which is connected for rotation by an electric motor 16. A vacuum table 18 is fixed at its center to the spinning chuck 14 and also, coupled to a vacuum source (not shown) to thereby securely hold a square semiconductive or silicon substrate 20 thereon. Upon energization of the motor 16, the vacuum table 18, together with the semiconductive substrate 20, is rotated at a rate in the range of 1000 to 6000 rpm.
- the enclosure 12 is centrally open as at 22 through which a photoresist masking material, or other coating material is applied to the top surface of the semiconductive substrate 20 by a nozzle 24 of a conventional dispensing device. Liquid residues as radially broadcast by centrifugal forces flow out of the enclosure 12 through a drainage outlet 26.
- a coating or masking material spread to the edge of the substrate by centrifugal forces, can be ejected from the periphery of the substrate in a direction tangentially of the substrate. This provides even coating over the entire surface of the substrate. When the square substrate is used, this is not the case.
- a coating material 28 spread to the edge of the substrate 20 flows in a direction (arrow 31) opposite to the direction of rotation of the substrate (arrow 32) along its side edges and then travels in a direction as indicated by arrow 33. This results in an undesirable deposition or formation of raised portions 34 at each corner of the substrate 20 (see FIG. 3).
- an air guide assembly as indicated generally by the numeral 40.
- an annular air duct 42 is located circumferentially about and spaced from the vacuum table 18 and has diametrically opposite outlets 44,44.
- Fans 46,46 are mounted in the air duct 42 adjacent to the outlets 44,44, respectively and are driven by suitable drive means, such as electric motors (not shown) to develop adequate air flow over the substrate 20.
- suitable drive means such as electric motors (not shown) to develop adequate air flow over the substrate 20.
- a fixed disk 48 Situated between the air duct 42 and the vacuum table 18 is a fixed disk 48 on which a plurality of, preferably 15 to 16 guide vanes or fins 50.
- the fixed disk 48 is centrally open to permit access of the vacuum table 18 to the enclosure 12.
- the guide vanes 50 extend in a direction tangentially of the vacuum table 18.
- a cover 52 is provided over the guide vanes 50 and the air duct 42.
- the substrate 20 is either manually or automatically loaded centrally on the vacuum table 18 and is pulled into mating engagement with the vacuum table 18 by vacuum action.
- the photoresist masking material is then applied to the top surface of the substrate 20 by the nozzle 24.
- the motor 16 is energized to spin the vacuum table 18, together with the substrate 20 securely held thereon, in a direction as shown by arrow 53 in FIG. 4.
- a centrifugal flow component is imparted to the liquid masking material causing it to spread over the top surface of the substrate 20.
- the motors are energized to rotate the fans 46,46 to develop air flow over the substrate 20, the air flowing from the center to the end edges of the substrate 20 in a direction identical to the direction of rotation of the substrate 20 as shown by arrow 56.
- This air flow serves to eject undesirable deposition from the end edges of the substrate 20 so as to provide even coating over the entire surface of the substrate 20.
- a vacuum system 60 may alternatively be provided, in place of the fans 46,46 shown in FIG. 4.
- the vacuum system 60 includes two separate vacuum lines 61 adapted to connect the outlets 44 with two corresponding vacuum sources 62 through vacuum controllers 63. Similar air flow, as indicated by arrow 65, is developed by vacuum action so as to eject undesirable deposition from the end edges of the substrate 20.
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/792,635 US5238713A (en) | 1987-09-18 | 1991-11-15 | Spin-on method and apparatus for applying coating material to a substrate, including an air flow developing and guiding step/means |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62234054A JPH0829287B2 (en) | 1987-09-18 | 1987-09-18 | Coating method and device |
JP62-234054 | 1987-09-18 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US07/792,635 Continuation US5238713A (en) | 1987-09-18 | 1991-11-15 | Spin-on method and apparatus for applying coating material to a substrate, including an air flow developing and guiding step/means |
Publications (1)
Publication Number | Publication Date |
---|---|
US5116250A true US5116250A (en) | 1992-05-26 |
Family
ID=16964852
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US07/246,403 Expired - Lifetime US5116250A (en) | 1987-09-18 | 1988-09-19 | Method and apparatus for applying a coating material to a substrate |
Country Status (2)
Country | Link |
---|---|
US (1) | US5116250A (en) |
JP (1) | JPH0829287B2 (en) |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5211753A (en) * | 1992-06-15 | 1993-05-18 | Swain Danny C | Spin coating apparatus with an independently spinning enclosure |
US5275658A (en) * | 1991-12-13 | 1994-01-04 | Tokyo Electron Limited | Liquid supply apparatus |
US5358740A (en) * | 1992-06-24 | 1994-10-25 | Massachusetts Institute Of Technology | Method for low pressure spin coating and low pressure spin coating apparatus |
US5550063A (en) * | 1991-02-11 | 1996-08-27 | Biostar, Inc. | Methods for production of an optical assay device |
US5591264A (en) * | 1994-03-22 | 1997-01-07 | Sony Corporation | Spin coating device |
US5769945A (en) * | 1996-06-21 | 1998-06-23 | Micron Technology, Inc. | Spin coating bowl exhaust system |
US5792259A (en) * | 1995-11-27 | 1998-08-11 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus and air supply method in substrate processing apparatus |
US5861061A (en) * | 1996-06-21 | 1999-01-19 | Micron Technology, Inc. | Spin coating bowl |
US5904164A (en) * | 1997-05-23 | 1999-05-18 | Sez Semiconductor-Equipment Zubehor Fur Die Halbleiterfertigung Ag | Arrangement for treatment of wafer-shaped articles, particularly silicon wafers |
US6140253A (en) * | 1996-07-16 | 2000-10-31 | Micron Technology, Inc. | Spin coating bowl |
US6395086B1 (en) * | 1993-04-08 | 2002-05-28 | Chartered Semiconductor Manufacturing Pte Ltd | Shield for wafer station |
US6417117B1 (en) | 1996-06-21 | 2002-07-09 | Micron Technology, Inc. | Spin coating spindle and chuck assembly |
US6672318B1 (en) * | 1999-09-09 | 2004-01-06 | Mimasu Semiconductor Industry Co., Ltd. | Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanism |
CN102451824A (en) * | 2010-10-26 | 2012-05-16 | 株式会社迪思科 | Rotating cleaning device |
US20120276753A1 (en) * | 2011-04-26 | 2012-11-01 | Tokyo Electron Limited | Coating treatment apparatus, coating and developing treatment system, coating treatment method, and non-transitory recording medium having program recorded thereon for executing coating treatment method |
US9209062B1 (en) * | 2014-05-28 | 2015-12-08 | Spintrac Systems, Inc. | Removable spin chamber with vacuum attachment |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112298655A (en) * | 2019-07-24 | 2021-02-02 | 鸿富锦精密电子(成都)有限公司 | Film coating device |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2026618A1 (en) * | 1970-05-30 | 1971-12-09 | John Lysaght (Australia) Ltd., Sydney (Australien) | Removing excess coating - from upward moving strip - using applied gas jets |
JPS5376748A (en) * | 1976-12-20 | 1978-07-07 | Fujitsu Ltd | Forming method of insulation fulm |
JPS5544780A (en) * | 1978-09-27 | 1980-03-29 | Toshiba Corp | Cleaning device for semiconductor wafer |
US4510176A (en) * | 1983-09-26 | 1985-04-09 | At&T Bell Laboratories | Removal of coating from periphery of a semiconductor wafer |
US4528934A (en) * | 1981-02-16 | 1985-07-16 | Tokyo Denshi Kagaku Kabushiki Kaisha | Thin-film coating apparatus |
US4587139A (en) * | 1984-12-21 | 1986-05-06 | International Business Machines Corporation | Magnetic disk coating method and apparatus |
US4790262A (en) * | 1985-10-07 | 1988-12-13 | Tokyo Denshi Kagaku Co., Ltd. | Thin-film coating apparatus |
-
1987
- 1987-09-18 JP JP62234054A patent/JPH0829287B2/en not_active Expired - Lifetime
-
1988
- 1988-09-19 US US07/246,403 patent/US5116250A/en not_active Expired - Lifetime
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2026618A1 (en) * | 1970-05-30 | 1971-12-09 | John Lysaght (Australia) Ltd., Sydney (Australien) | Removing excess coating - from upward moving strip - using applied gas jets |
JPS5376748A (en) * | 1976-12-20 | 1978-07-07 | Fujitsu Ltd | Forming method of insulation fulm |
JPS5544780A (en) * | 1978-09-27 | 1980-03-29 | Toshiba Corp | Cleaning device for semiconductor wafer |
US4528934A (en) * | 1981-02-16 | 1985-07-16 | Tokyo Denshi Kagaku Kabushiki Kaisha | Thin-film coating apparatus |
US4510176A (en) * | 1983-09-26 | 1985-04-09 | At&T Bell Laboratories | Removal of coating from periphery of a semiconductor wafer |
US4587139A (en) * | 1984-12-21 | 1986-05-06 | International Business Machines Corporation | Magnetic disk coating method and apparatus |
US4790262A (en) * | 1985-10-07 | 1988-12-13 | Tokyo Denshi Kagaku Co., Ltd. | Thin-film coating apparatus |
Non-Patent Citations (2)
Title |
---|
Wetz, IBM Technical Disclosure Bulletin, vol. 19, No. 6, Nov. 1976, pp. 2114 2115. * |
Wetz, IBM Technical Disclosure Bulletin, vol. 19, No. 6, Nov. 1976, pp. 2114-2115. |
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5550063A (en) * | 1991-02-11 | 1996-08-27 | Biostar, Inc. | Methods for production of an optical assay device |
US5275658A (en) * | 1991-12-13 | 1994-01-04 | Tokyo Electron Limited | Liquid supply apparatus |
US5211753A (en) * | 1992-06-15 | 1993-05-18 | Swain Danny C | Spin coating apparatus with an independently spinning enclosure |
US5358740A (en) * | 1992-06-24 | 1994-10-25 | Massachusetts Institute Of Technology | Method for low pressure spin coating and low pressure spin coating apparatus |
US6395086B1 (en) * | 1993-04-08 | 2002-05-28 | Chartered Semiconductor Manufacturing Pte Ltd | Shield for wafer station |
US5591264A (en) * | 1994-03-22 | 1997-01-07 | Sony Corporation | Spin coating device |
US5792259A (en) * | 1995-11-27 | 1998-08-11 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus and air supply method in substrate processing apparatus |
US6168660B1 (en) | 1996-06-21 | 2001-01-02 | Micron Technology | Spin coating bowl |
US6511540B1 (en) | 1996-06-21 | 2003-01-28 | Micron Technology, Inc. | Spin coating spindle and chuck assembly |
US6132802A (en) * | 1996-06-21 | 2000-10-17 | Micron Technology, Inc. | Methods for exhausting a wafer coating apparatus |
US6599571B2 (en) | 1996-06-21 | 2003-07-29 | Micron Technology, Inc. | Spin coating methods |
US6162294A (en) * | 1996-06-21 | 2000-12-19 | Micron Technology, Inc. | Spin coating bowl exhaust system |
US5861061A (en) * | 1996-06-21 | 1999-01-19 | Micron Technology, Inc. | Spin coating bowl |
US6221157B1 (en) * | 1996-06-21 | 2001-04-24 | Micron Technology, Inc. | Spin coating bowl exhaust system |
US5769945A (en) * | 1996-06-21 | 1998-06-23 | Micron Technology, Inc. | Spin coating bowl exhaust system |
US6417117B1 (en) | 1996-06-21 | 2002-07-09 | Micron Technology, Inc. | Spin coating spindle and chuck assembly |
US6140253A (en) * | 1996-07-16 | 2000-10-31 | Micron Technology, Inc. | Spin coating bowl |
US5904164A (en) * | 1997-05-23 | 1999-05-18 | Sez Semiconductor-Equipment Zubehor Fur Die Halbleiterfertigung Ag | Arrangement for treatment of wafer-shaped articles, particularly silicon wafers |
US6672318B1 (en) * | 1999-09-09 | 2004-01-06 | Mimasu Semiconductor Industry Co., Ltd. | Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanism |
CN102451824A (en) * | 2010-10-26 | 2012-05-16 | 株式会社迪思科 | Rotating cleaning device |
US20120276753A1 (en) * | 2011-04-26 | 2012-11-01 | Tokyo Electron Limited | Coating treatment apparatus, coating and developing treatment system, coating treatment method, and non-transitory recording medium having program recorded thereon for executing coating treatment method |
US9162247B2 (en) * | 2011-04-26 | 2015-10-20 | Tokyo Electron Limited | Coating and development treatment system with airflow control including control unit and movable airflow control plate |
US9947534B2 (en) | 2011-04-26 | 2018-04-17 | Tokyo Electron Limited | Coating treatment method with airflow control, and non-transitory recording medium having program recorded thereon for executing coating treatment with airflow control |
US9209062B1 (en) * | 2014-05-28 | 2015-12-08 | Spintrac Systems, Inc. | Removable spin chamber with vacuum attachment |
Also Published As
Publication number | Publication date |
---|---|
JPH0829287B2 (en) | 1996-03-27 |
JPS6475075A (en) | 1989-03-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: TOKYO OHKA KOGYO CO., LTD., 150, NAKAMARUKO, NAKAH Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNORS:SAGO, HIROYOSHI;MIZUKI, HIDEYUKI;KUDO, KATSUHIKO;AND OTHERS;REEL/FRAME:004947/0440 Effective date: 19880914 Owner name: TOKYO OHKA KOGYO CO., LTD., A CORP. OF JAPAN, JAPA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SAGO, HIROYOSHI;MIZUKI, HIDEYUKI;KUDO, KATSUHIKO;AND OTHERS;REEL/FRAME:004947/0440 Effective date: 19880914 |
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STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
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Year of fee payment: 4 |
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