This application is a continuation of application Ser. No. 474,586, filed Feb. 22, 1983.

The invention relates to a semiconductor rectifier, and more particularly to a button-type rectifier with a cooling plate.

BACKGROUND

German Pat. No. 15 89 555 describes a semiconductor rectifier in which a semiconductor terminal has two parts. The second part of the terminal has a substantially larger diameter than does the first part. A mass of synthetic resin forms an outermost jacket and takes the form of a truncated cone. The synthetic resin jacket must be fabricated by transfer molding.

THE INVENTION

It is an object to provide a semiconductor rectifier which can be readily made, is totally encapsulated, and can be easily fitted into a cooling plate, while being protected in all aspects from environmental influences or damage.

Briefly, a cooling plate has an opening stamped therein which has a rim or ridge which is drawn out in a direction transverse to the major direction of the cooling plate to form a projecting rim or beam or collar. The rim or bead or collar may be short, and form a seating surface for a surrounding jacket. The semiconductor, secured to a terminal in form of a post or bolt, is press-fitted into the opening, and the space between the surrounding jacket and the semiconductor, including the upper edge of the collar or bead or rim, is filled with a resin compound, totally encapsulating the semiconductor, and a portion of a second terminal emanating centrally from the semiconductor. The collar may, however, also be drawn up parallel to the semiconductor, and the post sufficiently enlarged in the press-fitted area to form a clearance space between the semiconductor chip and the post which, then, can be filled with the resin compound, so that, again, the space between the semiconductor and the surrounding jacket, now formed by the rim or bead, is completely filled. The rim or bead can be extended in either direction, for example partly upwardly, partly downwardly--with respect to the axial extent of the semiconductor, and in relation to the plane of the cooling plate, so that the semiconductor is seated either essentially coplanar with the major extent of the cooling plate or, for example, within an end portion of the cooling rim or plate, not necessarily coincident with its major extent.

The semiconductor rectifier according to the invention has the advantage over the prior art that the synthetic resin mass can be poured by filling the space within a sheath or a cylindrical jacket, or the portion of the passage protruding beyond the bolt or socket-like second part of the first terminal, or by filling a conically opened portion of the cooling plate, respectively, to form an easily made and wholly encapsulated rectifier-cooling plate combination.

DRAWING

Three exemplary embodiments of the semiconductor rectifier according to the invention are shown in the drawing and explained in detail in the following description. Shown are:

FIG. 1, an axial section taken through the first exemplary embodiment;

FIG. 2, an axial section taken through the second exemplary embodiment; and

FIG. 3, an axial section taken through the third exemplary embodiment.

DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

FIG. 1 shows a semiconductor rectifier formed, substantially, in a rotationally symmetrical manner, having a semiconductor chip 10 and two connector terminals 11 and 12, which are each soldered to a respective one of the two main surfaces of the semiconductor chip 10. The first terminal 11 thereby forms a bolt-like, solid metal base, which comprises a first part 11a soldered to the semiconductor chip 10 and a second part 11b which is provided with knurling. The second terminal 12 is a headed wire. The head part 12a of this headed wire is soldered to the semiconductor chip 10. A synthetic resin mass 13 is furthermore provided, which covers the rim of the semiconductor chip 10, the first part 11a of the first terminal 11 and portions of the second terminal 12. The second part 11b of the first connector terminal 11 which is provided with knurling is pressed into a cooling plate 14 serving to cool the rectifier; in the vicinity of this second part 11b, the cooling plate forms, an upwardly extending bead, or rim, or collar 14a with a passage therethrough which extends over the entire second part 11b. The free end 14b of the bead or collar 14a covers that portion of the second part 11b which adjoins the first part 11a. For limiting flow of the synthetic resin mass 13 in the radial direction, a sheath 15 in the form of a cylindrical jacket is provided, which is fitted over the outer circumference of the bead 14a. The synthetic resin mass 13 extends outward in the axial direction over the head part 12a of the second terminal 12. The wire-like part 12b of the second terminal 12 is provided with a strain relief 12c.

Embodiment of FIG. 2:

Again, it is a semiconductor rectifier embodied in a substantially rotationally symmetrical manner, having a semiconductor chip 10 and two connector terminals 11 and 12, each being soldered to a respective one of the two main surfaces of the seamiconductor chip 10 and the first of which forms a bolt-like, solid metal base 11. The first terminals 11 again comprises a first part 11a which is soldered to the semiconductor chip 10 and a second part 11b which is provided with knurling. The second part 11b, however, in comparison with the exemplary embodiment of FIG. 1, has a substantially larger diameter than does the first part 11a. The second connector terminals 12 is again embodied as a head wire. The headed portion 12a of this headed wire is soldered to the semiconductor chip 10. A synthetic resin mass 13 is also provided once again, covering the rim of the semiconductor chip 10, the first part 11a of the first terminals 11 and portions of the second terminal 12. The second part 11b provided with knurling is again pressed into an opening in cooling plate 14. However, the bead 14a protrudes in form of an upwardly extending sleeve-like rim or collar the second part 11b in the direction toward the first part 11a, and simultaneously serves to define the radial extent of synthetic resin mass 13 in the radial direction. The synthetic resin mass 13 and the rim 14a here extend outward in the axial direction beyond the head part 12a of the second terminal 12. The wire-like part 12b of the second terminal 12 is provided with a strain relief 12c.

Embodiment of FIG. 3:

The rotationally symmetrical semiconductor rectifier shown in FIG. 3 includes a semiconductor chip 10 and two terminals 11 and 12, which are each soldered to one of the two main surfaces of the semiconductor chip 10. The first connecting terminal 11 forms a bolt-like, solid metal base, which comprises a first part 11a welded to the semiconductor chip 10 and a second part 11b provided with knurling. The second part 11b has a larger diameter than does the first part 11a. A synthetic resin mass 13 is provided, which covers the rim of the semiconductor chip 10, the first part 11a of the first terminal 11 and portions of the second terminal 12. In accordance with the invention, the second part 11b is pressed into a cooling plate 114 serving to cool the rectifier. The cooling plate 114 is shaped to form a cylindrical jacket or collar 114a in the vicinity of the second part 11b, then makes a transition to a conically opened portion 114b which serves as a boundary for the synthetic resin mass 13; finally, after making a first bend 115 and a second bend 116, the cooling plate makes a transition to a flat zone 114c. The second connector terminal 12 is a headed wire and the head portion 12a of this head wire is soldered to the semiconductor chip 10. The synthetic resin mass 13 extends outward in the axial direction beyond the head part 12a of the terminal 12.

In all three exemplary embodiments, a surface-protecting layer comprising a cover paint can be applied to the rim of the semiconductor chip 10 and to the surface areas of the two connector terminals 11, 12 which adjoin the semiconductor chip 10; this surface-protecting layer is then covered by the synthetic resin mass 13.