US4392915A - Wafer support system - Google Patents
Wafer support system Download PDFInfo
- Publication number
- US4392915A US4392915A US06/348,625 US34862582A US4392915A US 4392915 A US4392915 A US 4392915A US 34862582 A US34862582 A US 34862582A US 4392915 A US4392915 A US 4392915A
- Authority
- US
- United States
- Prior art keywords
- gas
- vacuum chamber
- wafers
- electrode
- plasma
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B35/00—Apparatus not otherwise provided for, specially adapted for the growth, production or after-treatment of single crystals or of a homogeneous polycrystalline material with defined structure
- C30B35/005—Transport systems
Abstract
Description
Claims (13)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/348,625 US4392915A (en) | 1982-02-16 | 1982-02-16 | Wafer support system |
GB08302759A GB2115334B (en) | 1982-02-16 | 1983-02-01 | Wafer support system |
JP58022233A JPS58153335A (en) | 1982-02-16 | 1983-02-15 | Wafer supporting device and method of operating same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/348,625 US4392915A (en) | 1982-02-16 | 1982-02-16 | Wafer support system |
Publications (1)
Publication Number | Publication Date |
---|---|
US4392915A true US4392915A (en) | 1983-07-12 |
Family
ID=23368839
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US06/348,625 Expired - Fee Related US4392915A (en) | 1982-02-16 | 1982-02-16 | Wafer support system |
Country Status (3)
Country | Link |
---|---|
US (1) | US4392915A (en) |
JP (1) | JPS58153335A (en) |
GB (1) | GB2115334B (en) |
Cited By (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4526670A (en) * | 1983-05-20 | 1985-07-02 | Lfe Corporation | Automatically loadable multifaceted electrode with load lock mechanism |
EP0152555A2 (en) * | 1984-02-21 | 1985-08-28 | Plasma-Therm, Inc. | Apparatus for conveying a semiconductor wafer |
EP0179610A2 (en) * | 1984-10-24 | 1986-04-30 | Texas Instruments Incorporated | Automated single slice cassette load lock plasma reactor |
US4587002A (en) * | 1982-08-24 | 1986-05-06 | Edward Bok | Apparatus for floating transport and processing of substrate or tape |
EP0180373A2 (en) * | 1984-10-22 | 1986-05-07 | Texas Instruments Incorporated | Automated single slice powered load lock plasma reactor |
FR2574221A1 (en) * | 1984-12-05 | 1986-06-06 | Montaudon Patrick | Method and device enabling a single face of a substrate to be chemically attacked |
US4738748A (en) * | 1983-09-30 | 1988-04-19 | Fujitsu Limited | Plasma processor and method for IC fabrication |
EP0360678A1 (en) * | 1988-09-22 | 1990-03-28 | Fsi International, Inc. | Method and apparatus for controlling simultaneous etching of front and back sides of wafers |
US5248370A (en) * | 1989-05-08 | 1993-09-28 | Applied Materials, Inc. | Apparatus for heating and cooling semiconductor wafers in semiconductor wafer processing equipment |
US5269847A (en) * | 1990-08-23 | 1993-12-14 | Applied Materials, Inc. | Variable rate distribution gas flow reaction chamber |
US5443997A (en) * | 1989-05-08 | 1995-08-22 | Tsui; Chiu-Wing | Method for transferring heat to or from a semiconductor wafer using a portion of a process gas |
WO1996021943A1 (en) * | 1995-01-13 | 1996-07-18 | ZAKRYTOE AKTSIONERNOE OBSCHESTVO PROIZVODSTVENNAYA FIRMA 'Az' | Device for treating planar elements with a plasma jet |
US5647945A (en) * | 1993-08-25 | 1997-07-15 | Tokyo Electron Limited | Vacuum processing apparatus |
US5727434A (en) * | 1993-08-13 | 1998-03-17 | Ryobi America Corporation | Circular saw air table |
US5976310A (en) * | 1995-01-03 | 1999-11-02 | Applied Materials, Inc. | Plasma etch system |
US5980687A (en) * | 1997-05-20 | 1999-11-09 | Tokyo Electron Limited | Plasma processing apparatus comprising a compensating-process-gas supply means in synchronism with a rotating magnetic field |
US5994662A (en) * | 1997-05-29 | 1999-11-30 | Applied Materials, Inc. | Unique baffle to deflect remote plasma clean gases |
US6499506B2 (en) * | 2001-03-27 | 2002-12-31 | Aprion Digital Ltd. | Vacuum distribution controller apparatus |
US6508694B2 (en) | 2001-01-16 | 2003-01-21 | Speedfam-Ipec Corporation | Multi-zone pressure control carrier |
US20040083959A1 (en) * | 2001-03-13 | 2004-05-06 | Carpenter Craig M. | Chemical vapor deposition apparatuses and deposition methods |
US20040094092A1 (en) * | 2002-02-25 | 2004-05-20 | Derderian Garo J. | Apparatus for improved delivery of metastable species |
US20040134612A1 (en) * | 2003-01-09 | 2004-07-15 | Takeomi Numata | Plasma etching device |
US20050028732A1 (en) * | 2002-01-22 | 2005-02-10 | Mardian Allen P. | Chemical vapor deposition method |
US20050191416A1 (en) * | 2002-08-15 | 2005-09-01 | Cem Basceri | Methods of gas delivery for deposition processes and methods of depositing material on a substrate |
US20050199493A1 (en) * | 2003-04-30 | 2005-09-15 | Stefan Bangert | Arrangement for transporting a flat substrate in a vacuum chamber |
US7468104B2 (en) * | 2002-05-17 | 2008-12-23 | Micron Technology, Inc. | Chemical vapor deposition apparatus and deposition method |
US7615061B2 (en) | 2006-02-28 | 2009-11-10 | Arthrocare Corporation | Bone anchor suture-loading system, method and apparatus |
US20100243436A1 (en) * | 2004-08-30 | 2010-09-30 | Sung Eun Kim | Sputtering device with gas injection assembly |
EP3861571A4 (en) * | 2018-10-02 | 2022-06-08 | Utica Leaseco, LLC | Automated linear vacuum distribution valve |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3645581A (en) * | 1968-11-26 | 1972-02-29 | Ind Modular Systems Corp | Apparatus and method for handling and treating articles |
US4160690A (en) * | 1977-03-31 | 1979-07-10 | Tokyo Shibaura Electric Co., Ltd. | Gas etching method and apparatus |
US4341592A (en) * | 1975-08-04 | 1982-07-27 | Texas Instruments Incorporated | Method for removing photoresist layer from substrate by ozone treatment |
-
1982
- 1982-02-16 US US06/348,625 patent/US4392915A/en not_active Expired - Fee Related
-
1983
- 1983-02-01 GB GB08302759A patent/GB2115334B/en not_active Expired
- 1983-02-15 JP JP58022233A patent/JPS58153335A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3645581A (en) * | 1968-11-26 | 1972-02-29 | Ind Modular Systems Corp | Apparatus and method for handling and treating articles |
US4341592A (en) * | 1975-08-04 | 1982-07-27 | Texas Instruments Incorporated | Method for removing photoresist layer from substrate by ozone treatment |
US4160690A (en) * | 1977-03-31 | 1979-07-10 | Tokyo Shibaura Electric Co., Ltd. | Gas etching method and apparatus |
Non-Patent Citations (1)
Title |
---|
Microelectronic Manufacturing and Testing, 1981 (Jan.), Automated Wafer Handling and Processing, Corey Mullins, pp. 40-41. * |
Cited By (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4587002A (en) * | 1982-08-24 | 1986-05-06 | Edward Bok | Apparatus for floating transport and processing of substrate or tape |
US4526670A (en) * | 1983-05-20 | 1985-07-02 | Lfe Corporation | Automatically loadable multifaceted electrode with load lock mechanism |
US4738748A (en) * | 1983-09-30 | 1988-04-19 | Fujitsu Limited | Plasma processor and method for IC fabrication |
EP0152555A2 (en) * | 1984-02-21 | 1985-08-28 | Plasma-Therm, Inc. | Apparatus for conveying a semiconductor wafer |
US4584045A (en) * | 1984-02-21 | 1986-04-22 | Plasma-Therm, Inc. | Apparatus for conveying a semiconductor wafer |
EP0152555A3 (en) * | 1984-02-21 | 1987-12-09 | Plasma-Therm, Inc. | Apparatus for conveying a semiconductor wafer |
EP0180373A2 (en) * | 1984-10-22 | 1986-05-07 | Texas Instruments Incorporated | Automated single slice powered load lock plasma reactor |
EP0180373A3 (en) * | 1984-10-22 | 1988-04-27 | Texas Instruments Incorporated | Automated single slice powered load lock plasma reactor |
EP0179610A2 (en) * | 1984-10-24 | 1986-04-30 | Texas Instruments Incorporated | Automated single slice cassette load lock plasma reactor |
EP0179610A3 (en) * | 1984-10-24 | 1988-05-11 | Texas Instruments Incorporated | Automated single slice cassette load lock plasma reactor |
FR2574221A1 (en) * | 1984-12-05 | 1986-06-06 | Montaudon Patrick | Method and device enabling a single face of a substrate to be chemically attacked |
EP0360678A1 (en) * | 1988-09-22 | 1990-03-28 | Fsi International, Inc. | Method and apparatus for controlling simultaneous etching of front and back sides of wafers |
US5248370A (en) * | 1989-05-08 | 1993-09-28 | Applied Materials, Inc. | Apparatus for heating and cooling semiconductor wafers in semiconductor wafer processing equipment |
US5443997A (en) * | 1989-05-08 | 1995-08-22 | Tsui; Chiu-Wing | Method for transferring heat to or from a semiconductor wafer using a portion of a process gas |
US5455070A (en) * | 1990-08-23 | 1995-10-03 | Applied Materials, Inc. | Variable rate distribution gas flow reaction chamber |
US5269847A (en) * | 1990-08-23 | 1993-12-14 | Applied Materials, Inc. | Variable rate distribution gas flow reaction chamber |
US5727434A (en) * | 1993-08-13 | 1998-03-17 | Ryobi America Corporation | Circular saw air table |
US5647945A (en) * | 1993-08-25 | 1997-07-15 | Tokyo Electron Limited | Vacuum processing apparatus |
US5976310A (en) * | 1995-01-03 | 1999-11-02 | Applied Materials, Inc. | Plasma etch system |
WO1996021943A1 (en) * | 1995-01-13 | 1996-07-18 | ZAKRYTOE AKTSIONERNOE OBSCHESTVO PROIZVODSTVENNAYA FIRMA 'Az' | Device for treating planar elements with a plasma jet |
US5980687A (en) * | 1997-05-20 | 1999-11-09 | Tokyo Electron Limited | Plasma processing apparatus comprising a compensating-process-gas supply means in synchronism with a rotating magnetic field |
US5994662A (en) * | 1997-05-29 | 1999-11-30 | Applied Materials, Inc. | Unique baffle to deflect remote plasma clean gases |
US6508694B2 (en) | 2001-01-16 | 2003-01-21 | Speedfam-Ipec Corporation | Multi-zone pressure control carrier |
US20040216671A1 (en) * | 2001-03-13 | 2004-11-04 | Carpenter Craig M | Chemical vapor deposition apparatuses |
US20040083959A1 (en) * | 2001-03-13 | 2004-05-06 | Carpenter Craig M. | Chemical vapor deposition apparatuses and deposition methods |
US7378127B2 (en) | 2001-03-13 | 2008-05-27 | Micron Technology, Inc. | Chemical vapor deposition methods |
US6499506B2 (en) * | 2001-03-27 | 2002-12-31 | Aprion Digital Ltd. | Vacuum distribution controller apparatus |
US20050028732A1 (en) * | 2002-01-22 | 2005-02-10 | Mardian Allen P. | Chemical vapor deposition method |
US7229666B2 (en) | 2002-01-22 | 2007-06-12 | Micron Technology, Inc. | Chemical vapor deposition method |
US20040094092A1 (en) * | 2002-02-25 | 2004-05-20 | Derderian Garo J. | Apparatus for improved delivery of metastable species |
US7527693B2 (en) | 2002-02-25 | 2009-05-05 | Micron Technology, Inc. | Apparatus for improved delivery of metastable species |
US20040213908A1 (en) * | 2002-02-25 | 2004-10-28 | Derderian Garo J. | Deposition methods and apparatus for improved delivery of metastable species |
US7393562B2 (en) | 2002-02-25 | 2008-07-01 | Micron Technology, Inc. | Deposition methods for improved delivery of metastable species |
US7468104B2 (en) * | 2002-05-17 | 2008-12-23 | Micron Technology, Inc. | Chemical vapor deposition apparatus and deposition method |
US20050191416A1 (en) * | 2002-08-15 | 2005-09-01 | Cem Basceri | Methods of gas delivery for deposition processes and methods of depositing material on a substrate |
US7399499B2 (en) | 2002-08-15 | 2008-07-15 | Micron Technology, Inc. | Methods of gas delivery for deposition processes and methods of depositing material on a substrate |
US6902648B2 (en) * | 2003-01-09 | 2005-06-07 | Oki Electric Industry Co., Ltd. | Plasma etching device |
US20040134612A1 (en) * | 2003-01-09 | 2004-07-15 | Takeomi Numata | Plasma etching device |
US20050199493A1 (en) * | 2003-04-30 | 2005-09-15 | Stefan Bangert | Arrangement for transporting a flat substrate in a vacuum chamber |
US7837799B2 (en) * | 2003-04-30 | 2010-11-23 | Applied Materials Gmbh & Co. Kg | Arrangement for transporting a flat substrate in a vacuum chamber |
US20100243436A1 (en) * | 2004-08-30 | 2010-09-30 | Sung Eun Kim | Sputtering device with gas injection assembly |
US8899565B2 (en) * | 2004-08-30 | 2014-12-02 | Lg Display Co., Ltd. | Sputtering device with gas injection assembly |
US7615061B2 (en) | 2006-02-28 | 2009-11-10 | Arthrocare Corporation | Bone anchor suture-loading system, method and apparatus |
EP3861571A4 (en) * | 2018-10-02 | 2022-06-08 | Utica Leaseco, LLC | Automated linear vacuum distribution valve |
Also Published As
Publication number | Publication date |
---|---|
GB2115334A (en) | 1983-09-07 |
GB8302759D0 (en) | 1983-03-02 |
JPS58153335A (en) | 1983-09-12 |
GB2115334B (en) | 1985-09-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: EATON CORPORATION, 100 ERIEVIEW PLAZA, CLEVELAND, Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:ZAJAC, JOHN;REEL/FRAME:003977/0590 Effective date: 19820126 |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, PL 96-517 (ORIGINAL EVENT CODE: M170); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 4 |
|
FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, PL 96-517 (ORIGINAL EVENT CODE: M171); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 8 |
|
FEPP | Fee payment procedure |
Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
LAPS | Lapse for failure to pay maintenance fees | ||
FP | Lapsed due to failure to pay maintenance fee |
Effective date: 19950712 |
|
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |