US3905827A - Etchant rinse method - Google Patents

Etchant rinse method Download PDF

Info

Publication number
US3905827A
US3905827A US518564A US51856474A US3905827A US 3905827 A US3905827 A US 3905827A US 518564 A US518564 A US 518564A US 51856474 A US51856474 A US 51856474A US 3905827 A US3905827 A US 3905827A
Authority
US
United States
Prior art keywords
rinse
rinse water
water
ions
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US518564A
Inventor
Daniel L Goffredo
Jr John Alfred Dunkelberger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chemcut Corp
Original Assignee
Chemcut Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US190136A external-priority patent/US3871914A/en
Application filed by Chemcut Corp filed Critical Chemcut Corp
Priority to US518564A priority Critical patent/US3905827A/en
Application granted granted Critical
Publication of US3905827A publication Critical patent/US3905827A/en
Assigned to CHEMCUT CORPORATION A CORP. OF DE reassignment CHEMCUT CORPORATION A CORP. OF DE ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: CHEMCUT CORPORATION, A CORP. OF PA
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/70Treatment of water, waste water, or sewage by reduction
    • C02F1/705Reduction by metals
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02Cleaning by the force of jets or sprays
    • B08B3/022Cleaning travelling work
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/08Apparatus, e.g. for photomechanical printing surfaces
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/26Cleaning or polishing of the conductive pattern
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2101/00Nature of the contaminant
    • C02F2101/10Inorganic compounds
    • C02F2101/20Heavy metals or heavy metal compounds
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2103/00Nature of the water, waste water, sewage or sludge to be treated
    • C02F2103/34Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32
    • C02F2103/346Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32 from semiconductor processing, e.g. waste water from polishing of wafers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736Methods for applying liquids, e.g. spraying
    • H05K2203/075Global treatment of printed circuits by fluid spraying, e.g. cleaning a conductive pattern using nozzles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0766Rinsing, e.g. after cleaning or polishing a conductive pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1509Horizontally held PCB
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S210/00Liquid purification or separation
    • Y10S210/902Materials removed
    • Y10S210/911Cumulative poison
    • Y10S210/912Heavy metal

Definitions

  • the present invention is directed toward providing an apparatus and method whereby recycling of the rinse water is possible without building up an undesir-- able level of copper concentration in the rinse water. and whereby the rinse water is not contaminated by copper. so that the same may be discharged into cow ventional sewage lines. streams. etc. without producing damaging environmental effects.
  • a portion of the rinse water being delivered to spray nozzles passes from the reservoir of rinse water to and through a particulate material (preferably aluminum turnings). and the rinse water is dispersed therethrough. eventually being returned to the rinse reservoir.
  • a chemical replacement of copper ions in the rinse is effected, by replace ment with aluminum ions. with the copper ions being reduced to metallic copper, and with the aluminum being oxidized and flowing into solution in the rinse water.
  • the rinse water thus accumulates an aluminum ion concentration, which may periodically be discharged as desired. without producing undesirable environmental effects.
  • FIG. I is a transverse sectional view through the several components of a rinsing apparatus of this invelr tion.
  • FIG. 2 is a longitudinal sectional view through a por tion of the rinsing apparatus illustrated in FIG. I. and illustrating the manner in which the rinse is sprayed onto printed circuit boards or the like passing through a rinse chamber from an etching chamber or the like.
  • an upstream chamber It is il lustrated. as comprising an etching chamber. or if de sired. a chamber for first physically removing etchant from printed circuit boards II or the like conveyed therethrough. by means other than water spraying.
  • the printed circuit board It for which this apparatus has been developed. is then delivered into a rinsing chainber I2, passing along a plurality of driven rollers I3. which rotate in a clockwise direction as viewed in the illustration of FIG. 2. for movement of the printed cir cult board II in the direction of the arrow l-l of FIG. 2. through the chamber 12 for e ⁇ entual discharge through the outlet [3 thereof. to a drying station or the like.
  • the board 1]. upon its delivery to the chamber 12 may have residual components of an etching acid. such as ferric chloride thereon. that has been used to etch unmasked copper portions of the printed boards. and such residual etchant thus contains a certain copper content.
  • an etching acid such as ferric chloride thereon.
  • the board ll then passes between upper and lower circuit sets of spray nozzles 15 and I6, that are supplied with water under pressure. for spraying the board I I through a certain /.one such as that indicated in FIG. 2. with the zones of spray of the nozzles combining transverscly of the machine, in order to completely spray a board ll carried therebetween. as will be more clearly apparent with reference to the illustration of FIG. I.
  • the upper spray nozzles 15 are connected to rinse water header 1?
  • the lower spray nozzles lb are each connected to a lower rinse water header [8. with the headers l7 and 18 being supplied with rinse water from a common delivery line 20.
  • Rinse water 21 is delivered from a chamber 22. by a pump 23. or other suitable device. which receives the rinse water 21 at a lower inlet 24 thereof. and delivers the same through an outlet line 25, with the pump 23 being driven by an electrical motor 26 or the like disposed outwardly of the chamber 22, but connected to the pump 23 through a rotatable shaft 27 that passes into the chamber 22 from outside thereof. to drive the sub merged pump 23.
  • Rinse water is thus delivered through the line 25, out wardly of the chamber 22. with the delivery line 25 being bifurcated at the piping tcc 2). with some of the rinse water being delivered to the spray nozzles I5 and 16. through the line 20. and some of the rinse water being delivered through a replacement chamber 28. and back into the reservoir 22 through a return line 30. selectively openable upon actuation of a switch SI or the like. as desired. whereby rinse water is delivered to the replacement chamber 28, as a parallel loop to that delivered to the spray nozzles 15 and lo. Thus. rinse water enters the replacement chamber 28. being delivered thereto by a suitable piping line 32, and passing through a generally open shut-off switch 33. entering the replacement chamber 28. through the bottom 34 thereof, at a central opening thereof, for passage outwardly of a plurality of holes 35, or other suitable perforations in the outer surface of a hollow cylindrical upstanding standpipe 36. as illustrated in H6. l.
  • a removable tank 37 is provided, inwardly of the replacement chamber 28, the bottom of which has a blind hole therein for facilitating the disposition of the tank 37 over the standpipe 36, and with the sides of the blind hole 38 in the tank 37 facilitating the passage inwardly of rinse water into the interior 40 of the tank. as such rinse water passes through perforations 35 of the standpipe 36.
  • the tank 37 is constructed as a basket. with the outer cylindrical surface 4
  • the outer surface of the tank 4] is spaced inwardly of the inner surface of the chamber 28, to form an annular void therein, for passage of water upwardly, inasmuch as the water is under pressure from the pump 23, and with the water thus being redelivered through the line 3" as aforesaid. into the chamber 22.
  • the tank 37 is also provided with a handle 43 whereby the same may readily be grasped and removed from its position over the standpipe 36. upon opening the lid 44 of the chamber 28. whenever the concentration of copper within the aluminum turnings necessitates replacement of the tank 37, or of the turnings carried therein.
  • the dissolved copper content within the rinse is chemically replaced with aluminum from the aluminum turnings, and the copper ions removed from the rinse are reduced to metallic copper and aluminum is oxidized, going into solution in the rinse water.
  • the water reservoir thus remains extremely low in copper ion concentration. but will progressively increase in aluminum ion concentration.
  • the rinsc water 21 therein may be discharged to sewage or the like, without causing contamination of sewage lines, waterways, or the like.
  • the herein discussed invention is significant in that it provides a simple and low cost means of eliminating objectionable copper ions from etchant rinse water. Accordingly. a highly desirable anti-pollution feature is encompassed by the present invention, which replaces copper ion concentration in rinse water with more acceptable aluminum ions.
  • Another feature of this invention is that the process permits continuous replacement of copper ions in the rinse water, by permitting continuous removal, by displacement reactions onto the aluminum surfaces of the particles within the tank 37. It will, however, be appar' ent that the parallel loop arrangement illustrated in FIG. I is not to be construed as limiting, in that rinse water 21 from the tank 22 may pass serially first to the tank 37. and then to the spray nozzles 15 and 16. if desired. or the converse.
  • a method of removing residual chemical etchant from articles such as printed circuit boards and the like that have been subjected to etching of copper portions thereof. comprising the steps of conveying etched articles along a predetermined path, spraying the articles with a water rinse during their conveyance along the path and thereby accumulating a significant concentration of copper ions in the rinse water. collecting the rinse water in a reservoir, providing a tank of particulate material.
  • the particulate material comprises aluminum particles for replacement of copper ions in the rinse water with aluminum ions.
  • rinse water delivered to the tank is pumped thereto from the reservoir concurrently with pumping of rinse water for spraying. through a common bifurcated delivery line. and wherein rinse water is delivered directly to the reservoir following the ion exchange.

Abstract

Residual etchant, such as acid and the like remaining on articles such as printed circuit boards that have been etched, contains a metallic chemical component, such as copper. When this residual etchant is rinsed from the articles (such as printed circuit boards), it contaminates the water of the rinse. The chemical replacement of copper ions in the rinse with aluminum ions by passing the rinse through a basket filled with aluminum turnings, and recycling the rinse thus passed back for reuse at the rinsing station continuously renders the rinsing water free of copper, to permit periodic discharge of the rinse water to sewage or the like.

Description

Goffredo et a1.
1 1 ETCHANT RINSE METHOD [751 Inventors: Daniel L. Goffredo, Riverton. N.J.;
John Alfred Dunkelberger, Jr., Centre Hall. Pa.
1731 Assignee: Chemcut Corporation, State College, Pa
|22| Filed: (Jet. 29, 1974 l21| Appl No: 518,564
Related U.S. Application Data [621 Division of Ser. No. 191L136. ()cL 18 19714 |52| 1.1.8. Cl. 134/13; 134/10; 156/19; 210/38 [51] Int. (1. mm B08B 3/02; 130813 3/10; B08B 7/04 [51%] Field of Search r. 134/10 l3 109,1ll l31 134/151 199.83; 156/19, 345; 210/38 287, 433:75/109 101 BE; 204/32 R 35 R [Sfil References Cited UNITED STATES PATENTS 2440134 4/194H Zademach et a1. .1 134/111 X 3.081774 3/1963 Benton et a! 1. 134/151 X 1451 Sept. 16, 1975 Primary Exumim'rS. Leon Bashore Assistant Exuminm-Marc L. Caroff Alturney, Agent or Firm Paul & Paul [57 I ABSTRACT Residual etchant, such as acid and the like remaining on articles such as printed circuit boards that have been etched, contains a metallic chemical component, such as copper. When this residual etchant is rinsed from the articles (such as printed circuit boards), it c ntaminates the water of the rinse. The chemical replacement of copper ions in the rinse with aluminum ions by passing the rinse through a basket filled with aluminum turnings. and recycling the rinse thus passed back for reuse at the rinsing station continuously renders the rinsing water free of copper, to permit periodic discharge of the rinse water to sewage or the like.
4 Claims, 2 Drawing Figures PATENTEU 3 905 827 SHEET 1 [IF 2 ETCHAN'I RINSE METHOD This is a division of application Scr. No. 190.136 filed Oct. I8. I97].
BACKGROUND OF THE INVENTION In the art of etching printed circuit. boards and the like. it has been commonplace to rinse acid etchants from the printed circuit boards. for purposes ofcleaning" the acid from the boards. in order that the boards may be subsequently handled by personnel. and also to assure the termination of the etching process. on cop per components of the board. Such washing or rinsing has conventionally been done by spraying the boards with a water rinse. and either contmuously or periodi cally replacing the water rinse. with used water rinse being discharged to sewage or the like. However. such used water rinse in accordance with the above mentioned prior art techniques has contained copper ions therein. and such has been found to cause undesirable ecological effects upon streams. waterways and the like. into which the used rinse eventually finds its way from sewage.
Furthermore. the copper contained within the acid rinsed off the boards in accordance with these prior art techniques has been permanently lost.
SUMMARY OF THE INVENIION The present invention is directed toward providing an apparatus and method whereby recycling of the rinse water is possible without building up an undesir-- able level of copper concentration in the rinse water. and whereby the rinse water is not contaminated by copper. so that the same may be discharged into cow ventional sewage lines. streams. etc. without producing damaging environmental effects. A portion of the rinse water being delivered to spray nozzles passes from the reservoir of rinse water to and through a particulate material (preferably aluminum turnings). and the rinse water is dispersed therethrough. eventually being returned to the rinse reservoir. During its passage through the aluminum turnings. a chemical replacement of copper ions in the rinse is effected, by replace ment with aluminum ions. with the copper ions being reduced to metallic copper, and with the aluminum being oxidized and flowing into solution in the rinse water. The rinse water thus accumulates an aluminum ion concentration, which may periodically be discharged as desired. without producing undesirable environmental effects.
Accordingly. it is a primary object of this invention to provide a novel method of treating etchant rinse wa* ter.
It is a further object of this invention to provide a novel method of replacing copper ions in etchant rinse water with aluminum ions.
It is another object of this invention to provide a novel apparatus for rinsing etchant reactants from articles that have been etched. wherein such apparatus involvcs chemical replacement ofunwanted metallic ions in the rinse medium.
Other objects and advantages of the present invention will be readily apparent to those skilled in the art from a reading ofthe following bricfdescriptions of the drawing figures. detailed description of the preferred embodiment. and the appended claims.
Til
IN THE DRAWINGS FIG. I is a transverse sectional view through the several components of a rinsing apparatus of this invelr tion.
FIG. 2 is a longitudinal sectional view through a por tion of the rinsing apparatus illustrated in FIG. I. and illustrating the manner in which the rinse is sprayed onto printed circuit boards or the like passing through a rinse chamber from an etching chamber or the like.
Referring to the drawings in detail. reference is first made to FIG. 2. wherein an upstream chamber It) is il lustrated. as comprising an etching chamber. or if de sired. a chamber for first physically removing etchant from printed circuit boards II or the like conveyed therethrough. by means other than water spraying. The printed circuit board It for which this apparatus has been developed. is then delivered into a rinsing chainber I2, passing along a plurality of driven rollers I3. which rotate in a clockwise direction as viewed in the illustration of FIG. 2. for movement of the printed cir cult board II in the direction of the arrow l-l of FIG. 2. through the chamber 12 for e\entual discharge through the outlet [3 thereof. to a drying station or the like.
The board 1]. upon its delivery to the chamber 12 may have residual components of an etching acid. such as ferric chloride thereon. that has been used to etch unmasked copper portions of the printed boards. and such residual etchant thus contains a certain copper content.
The board ll then passes between upper and lower circuit sets of spray nozzles 15 and I6, that are supplied with water under pressure. for spraying the board I I through a certain /.one such as that indicated in FIG. 2. with the zones of spray of the nozzles combining transverscly of the machine, in order to completely spray a board ll carried therebetween. as will be more clearly apparent with reference to the illustration of FIG. I. The upper spray nozzles 15 are connected to rinse water header 1?, and the lower spray nozzles lb are each connected to a lower rinse water header [8. with the headers l7 and 18 being supplied with rinse water from a common delivery line 20. After spraying of the board II with rinse water passing through the nozzles 15 and If), the rinse water 21 drops into a reservoir 22. and such rinse water 21 and the reservoir 22 now has a slight concentration of copper ions therein. Rinse water 21 is delivered from a chamber 22. by a pump 23. or other suitable device. which receives the rinse water 21 at a lower inlet 24 thereof. and delivers the same through an outlet line 25, with the pump 23 being driven by an electrical motor 26 or the like disposed outwardly of the chamber 22, but connected to the pump 23 through a rotatable shaft 27 that passes into the chamber 22 from outside thereof. to drive the sub merged pump 23.
Rinse water is thus delivered through the line 25, out wardly of the chamber 22. with the delivery line 25 being bifurcated at the piping tcc 2). with some of the rinse water being delivered to the spray nozzles I5 and 16. through the line 20. and some of the rinse water being delivered through a replacement chamber 28. and back into the reservoir 22 through a return line 30. selectively openable upon actuation of a switch SI or the like. as desired. whereby rinse water is delivered to the replacement chamber 28, as a parallel loop to that delivered to the spray nozzles 15 and lo. Thus. rinse water enters the replacement chamber 28. being delivered thereto by a suitable piping line 32, and passing through a generally open shut-off switch 33. entering the replacement chamber 28. through the bottom 34 thereof, at a central opening thereof, for passage outwardly of a plurality of holes 35, or other suitable perforations in the outer surface of a hollow cylindrical upstanding standpipe 36. as illustrated in H6. l.
A removable tank 37 is provided, inwardly of the replacement chamber 28, the bottom of which has a blind hole therein for facilitating the disposition of the tank 37 over the standpipe 36, and with the sides of the blind hole 38 in the tank 37 facilitating the passage inwardly of rinse water into the interior 40 of the tank. as such rinse water passes through perforations 35 of the standpipe 36. The tank 37 is constructed as a basket. with the outer cylindrical surface 4| thereof also being perforate, and with the basket being filled with a particu late material such as aluminum turnings whereby the rinse water 2] delivered through the line 32 will pass through the aluminum turnings, to be discharged through the tank 37, but passing through perforations in the outer wall 41 thereof. It will be noted that the outer surface of the tank 4] is spaced inwardly of the inner surface of the chamber 28, to form an annular void therein, for passage of water upwardly, inasmuch as the water is under pressure from the pump 23, and with the water thus being redelivered through the line 3" as aforesaid. into the chamber 22.
The tank 37 is also provided with a handle 43 whereby the same may readily be grasped and removed from its position over the standpipe 36. upon opening the lid 44 of the chamber 28. whenever the concentration of copper within the aluminum turnings necessitates replacement of the tank 37, or of the turnings carried therein.
It will be apparent from all of the foregoing, that during the passage of the rinse water through the aluminum turnings within the tank 37, the dissolved copper content within the rinse is chemically replaced with aluminum from the aluminum turnings, and the copper ions removed from the rinse are reduced to metallic copper and aluminum is oxidized, going into solution in the rinse water. The water reservoir thus remains extremely low in copper ion concentration. but will progressively increase in aluminum ion concentration. Upon the reservoir 22 achieving an objectionable level of aluminum ion concentration, the rinsc water 21 therein may be discharged to sewage or the like, without causing contamination of sewage lines, waterways, or the like.
The herein discussed invention is significant in that it provides a simple and low cost means of eliminating objectionable copper ions from etchant rinse water. Accordingly. a highly desirable anti-pollution feature is encompassed by the present invention, which replaces copper ion concentration in rinse water with more acceptable aluminum ions.
While displacement reactions themselves are previously known, for removing copper from solution generally. and wherein such processes are generally known as cementation". in the mining industry, for example,
the use of replacement ions to resolve a heretofore dif ficult pollution problem for the etching industry. and particularly for the industry relating to the etching of printed circuit boards is highly desirable.
It will also be apparent that other types of chemical replacement may be effected. in lieu of using aluminum particles within the tank 37. For example, iron filings, magnesium. or any other metal above copper in the electromotive series. or any other substance that will effect the desired ion exchange. preferably with regard to its adaptability to achieving the other desired ends of this invention as set forth herein, may be utilized within the tank 37, if desired, for replacement of copper ions with iron ions in the solution.
Another feature of this invention is that the process permits continuous replacement of copper ions in the rinse water, by permitting continuous removal, by displacement reactions onto the aluminum surfaces of the particles within the tank 37. it will, however, be appar' ent that the parallel loop arrangement illustrated in FIG. I is not to be construed as limiting, in that rinse water 21 from the tank 22 may pass serially first to the tank 37. and then to the spray nozzles 15 and 16. if desired. or the converse.
It will be apparent from the foregoing that various modifications may be made in the details of construction of the apparatus of this invention. as well as in the method of use thereof, all within the spirit and scope of the appended claims.
What is claimed is:
l. A method of removing residual chemical etchant from articles such as printed circuit boards and the like that have been subjected to etching of copper portions thereof. comprising the steps of conveying etched articles along a predetermined path, spraying the articles with a water rinse during their conveyance along the path and thereby accumulating a significant concentration of copper ions in the rinse water. collecting the rinse water in a reservoir, providing a tank of particulate material. which material is capable of replacing copper ions in the rinse with its own ions, continuously delivering rinse water from the reservoir simultaneously to the tank for transfer through the particulate material wherein the ion replacement is effected and for spraying the articles, and continuously recycling rinse water that has been subjected to the ion exchange to the reservoir, for reuse in spraying.
2. The method of claim 1, wherein the particulate material comprises aluminum particles for replacement of copper ions in the rinse water with aluminum ions.
3. The method of claim 2, wherein rinse water delivered to the tank is pumped thereto from the reservoir concurrently with pumping of rinse water for spraying. through a common bifurcated delivery line. and wherein rinse water is delivered directly to the reservoir following the ion exchange.
4. The method of claim 1, wherein the rinse water is periodically discharged to a sewage line and replaced as the ion concentration of the replacing ions from the particulate material in the rinse water reaches a predetermined level.

Claims (4)

1. A METHOD OF REMOVING RESIDUAL CHEMICAL ETCHANT FROM ARTICLES SUCH AS PRINTED CIRCUIT BOARDS AND THE LIKE THAT HAVE BEEN SUBJECTED TO ETCHING OF COPPER PORTIONS THEREOF, COMPRISING THE STEPS OF CONVEYING ETCHED ARTICLES AONG A PREDETERMINED PATH, SPRAYING THE ARTICLES WITH A WATER RINSE DURING THEIR CONVEYANCE ALONG THE PATH AND THEREVY ACCUMULATING A SIGNIFCANT CONCENTRATION OF COPPER IONS IN THE RINSE WATER, COLLECTING THE RINSE WATER IN A RESERVOIR, PROVIDING A TANK OF PARTICULATE MATERIAL, WHICH MATERIAL IS CAPABLE OF REPLACING COPPER IONS IN THE RINSE WITH ITS OWN IONS, CONTINUOUSLY DELIV-
2. The method of claim 1, wherein the particulate material comprises aluminum particles for replacement of copper ions in the rinse water with aluminum ions.
3. The method of claim 2, wherein rinse water delivered to the tank is pumped thereto from the reservoir concurrently with pumping of rinse water for spraying, through a common bifurcated delivery line, and wherein rinse water is delivered directly to the reservoir following the ion exchange.
4. The method of claim 1, wherein the rinse water is periodically discharged to a sewage line and replaced as the ion concentration of the replacing ions from the particulate material in the rinse water reaches a predetermined level.
US518564A 1971-10-18 1974-10-29 Etchant rinse method Expired - Lifetime US3905827A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US518564A US3905827A (en) 1971-10-18 1974-10-29 Etchant rinse method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US190136A US3871914A (en) 1971-10-18 1971-10-18 Etchant rinse apparatus
US518564A US3905827A (en) 1971-10-18 1974-10-29 Etchant rinse method

Publications (1)

Publication Number Publication Date
US3905827A true US3905827A (en) 1975-09-16

Family

ID=26885811

Family Applications (1)

Application Number Title Priority Date Filing Date
US518564A Expired - Lifetime US3905827A (en) 1971-10-18 1974-10-29 Etchant rinse method

Country Status (1)

Country Link
US (1) US3905827A (en)

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4060447A (en) * 1976-03-29 1977-11-29 Philip A. Hunt Chemical Corporation Process for etching of metal
US4249939A (en) * 1980-01-03 1981-02-10 The Dow Chemical Company Method of disposing of spent organic complexing solutions containing cuprous halides
US4294434A (en) * 1980-01-24 1981-10-13 Durkee Richard G Heavy metal removal apparatus
US4304599A (en) * 1980-01-24 1981-12-08 Durkee Richard G Heavy metal removal process
US4329210A (en) * 1980-03-28 1982-05-11 Robert W. Becker Method of regenerating etchant and recovering etched metal
US4481236A (en) * 1983-05-02 1984-11-06 General Motors Corporation Life extension of catalyst predip baths
US4532887A (en) * 1983-05-02 1985-08-06 General Motors Corporation Life extension of catalyst predip baths
DE3543286A1 (en) * 1985-04-23 1986-10-23 Schering AG, 1000 Berlin und 4709 Bergkamen METHOD FOR METALLIZING SURFACES OF FLAT OBJECTS
US4783249A (en) * 1987-06-26 1988-11-08 Napco, Inc. Electroplating apparatus with self-contained rinse water treatment
US4885036A (en) * 1986-07-01 1989-12-05 Digital Equipment Corporation On-line filtration of potassium permanganate
WO1991003329A1 (en) * 1989-08-28 1991-03-21 Chemcut Corporation Process and apparatus for fluid treatment of articles
US5019273A (en) * 1990-04-30 1991-05-28 Midwest Printed Circuits Services, Inc. Method for recovery of heavy metals from highly concentrated wastewater solutions
US5133873A (en) * 1991-02-22 1992-07-28 Miles Inc. Process for removal of copper ions from aqueous effluent
US5135654A (en) * 1984-04-30 1992-08-04 Kdf Fluid Treatment, Inc. Method for treating fluids
US5314623A (en) * 1984-04-30 1994-05-24 Kdf Fluid Treatment, Inc. Method for treating fluids
US5472618A (en) * 1994-02-07 1995-12-05 Great Western Chemical Company Method for recovering metals from solutions
US5524780A (en) * 1995-01-31 1996-06-11 Applied Electroless Concepts Inc. Control of regeneration of ammoniacal copper etchant
WO1997006895A1 (en) 1995-08-11 1997-02-27 Atotech Usa, Inc. Fluid delivery apparatus and method
WO1998031475A1 (en) 1997-01-21 1998-07-23 Atotech Usa, Inc. Fluid delivery apparatus and method
US6168663B1 (en) 1995-06-07 2001-01-02 Eamon P. McDonald Thin sheet handling system cross-reference to related applications
DE3924263C2 (en) * 1988-12-07 2002-07-18 Chemcut Corp Method and device for the electrolytic removal of protective layers from metal layers
US6971125B2 (en) 2002-08-02 2005-12-06 Mattson Jr Roy W Antimicrobial whirlpool bathtub
US7146659B2 (en) 2002-08-02 2006-12-12 Mattson Jr Roy W Hydromassage antimicrobial whirlpool bathtub
US20140231381A1 (en) * 2011-09-30 2014-08-21 3M Innovative Properties Company Methods of Continuously Wet Etching A Patterned Substrate
CN106871650A (en) * 2017-03-22 2017-06-20 无锡市卡德姆机械科技有限公司 Possesses the copper strips spreading for cooling frame that automatic sensing water under high pressure washes away cleaning function
CN107755383A (en) * 2016-08-23 2018-03-06 张鹏镇 Street litter bin cleaning vehicle
CN109133497A (en) * 2018-08-02 2019-01-04 深圳市华星光电技术有限公司 Liquid waste treating apparatus and method for treating waste liquid
US20200179991A1 (en) * 2018-12-05 2020-06-11 Iwt S.R.L. System for treating wash waste liquid, adapted for application in a continuous tunnel washing machine in the field of preclinical pharmaceutical research

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2440134A (en) * 1943-07-20 1948-04-20 Metalwash Machinery Co Apparatus for treating articles
US3082774A (en) * 1961-02-08 1963-03-26 Ct Circuits Inc Etching machine
US3255106A (en) * 1963-11-20 1966-06-07 Union Tank Car Co Water conditioning system
US3431921A (en) * 1966-08-10 1969-03-11 Colight Inc Apparatus for chemical etching
US3603329A (en) * 1968-11-06 1971-09-07 Brown Eng Co Inc Apparatus for manufacturing printed circuits
US3658470A (en) * 1969-06-16 1972-04-25 Industrial Filter Pump Mfg Co Metal ion recovery system
US3705061A (en) * 1971-03-19 1972-12-05 Southern California Chem Co In Continuous redox process for dissolving copper

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2440134A (en) * 1943-07-20 1948-04-20 Metalwash Machinery Co Apparatus for treating articles
US3082774A (en) * 1961-02-08 1963-03-26 Ct Circuits Inc Etching machine
US3255106A (en) * 1963-11-20 1966-06-07 Union Tank Car Co Water conditioning system
US3431921A (en) * 1966-08-10 1969-03-11 Colight Inc Apparatus for chemical etching
US3603329A (en) * 1968-11-06 1971-09-07 Brown Eng Co Inc Apparatus for manufacturing printed circuits
US3658470A (en) * 1969-06-16 1972-04-25 Industrial Filter Pump Mfg Co Metal ion recovery system
US3705061A (en) * 1971-03-19 1972-12-05 Southern California Chem Co In Continuous redox process for dissolving copper

Cited By (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4060447A (en) * 1976-03-29 1977-11-29 Philip A. Hunt Chemical Corporation Process for etching of metal
US4147581A (en) * 1976-03-29 1979-04-03 Philip A. Hunt Chemical Corp. Etching of metal
US4249939A (en) * 1980-01-03 1981-02-10 The Dow Chemical Company Method of disposing of spent organic complexing solutions containing cuprous halides
US4294434A (en) * 1980-01-24 1981-10-13 Durkee Richard G Heavy metal removal apparatus
US4304599A (en) * 1980-01-24 1981-12-08 Durkee Richard G Heavy metal removal process
US4329210A (en) * 1980-03-28 1982-05-11 Robert W. Becker Method of regenerating etchant and recovering etched metal
US4481236A (en) * 1983-05-02 1984-11-06 General Motors Corporation Life extension of catalyst predip baths
US4532887A (en) * 1983-05-02 1985-08-06 General Motors Corporation Life extension of catalyst predip baths
US5599454A (en) * 1984-04-30 1997-02-04 Kdf Fluid Treatment, Inc. Method for treating fluids
US5951869A (en) * 1984-04-30 1999-09-14 Kdf Fluid Treatment, Inc. Method for treating fluids
US5833859A (en) * 1984-04-30 1998-11-10 Kdf Fluid Treatment, Inc. Method for treating fluids
US5433856A (en) * 1984-04-30 1995-07-18 Kdf Fluid Treatment, Inc. Method for treating fluids
US5135654A (en) * 1984-04-30 1992-08-04 Kdf Fluid Treatment, Inc. Method for treating fluids
US5510034A (en) * 1984-04-30 1996-04-23 Kdf Fluid Treatment, Inc. Method for treating fluids
US5275737A (en) * 1984-04-30 1994-01-04 Kdf Fluid Treatment, Inc. Method for treating fluids
US5314623A (en) * 1984-04-30 1994-05-24 Kdf Fluid Treatment, Inc. Method for treating fluids
DE3543286A1 (en) * 1985-04-23 1986-10-23 Schering AG, 1000 Berlin und 4709 Bergkamen METHOD FOR METALLIZING SURFACES OF FLAT OBJECTS
US4885036A (en) * 1986-07-01 1989-12-05 Digital Equipment Corporation On-line filtration of potassium permanganate
US4783249A (en) * 1987-06-26 1988-11-08 Napco, Inc. Electroplating apparatus with self-contained rinse water treatment
DE3924263C2 (en) * 1988-12-07 2002-07-18 Chemcut Corp Method and device for the electrolytic removal of protective layers from metal layers
WO1991003329A1 (en) * 1989-08-28 1991-03-21 Chemcut Corporation Process and apparatus for fluid treatment of articles
GB2245226B (en) * 1989-08-28 1993-05-26 Chemcut Corp Process and apparatus for fluid treatment of articles
US5002616A (en) * 1989-08-28 1991-03-26 Chemcut Corporation Process and apparatus for fliud treatment of articles
GB2245226A (en) * 1989-08-28 1992-01-02 Chemcut Corp Process and apparatus for fluid treatment of articles
DE4091546C2 (en) * 1989-08-28 1999-01-21 Chemcut Corp Method and device for treating objects with fluids
US5019273A (en) * 1990-04-30 1991-05-28 Midwest Printed Circuits Services, Inc. Method for recovery of heavy metals from highly concentrated wastewater solutions
US5133873A (en) * 1991-02-22 1992-07-28 Miles Inc. Process for removal of copper ions from aqueous effluent
US5679259A (en) * 1994-02-07 1997-10-21 Great Western Chemical Company Method for recovering metals from solutions
US5472618A (en) * 1994-02-07 1995-12-05 Great Western Chemical Company Method for recovering metals from solutions
US5524780A (en) * 1995-01-31 1996-06-11 Applied Electroless Concepts Inc. Control of regeneration of ammoniacal copper etchant
US6168663B1 (en) 1995-06-07 2001-01-02 Eamon P. McDonald Thin sheet handling system cross-reference to related applications
US6045874A (en) * 1995-08-11 2000-04-04 Atotech Usa, Inc. Fluid delivery method
US5904773A (en) * 1995-08-11 1999-05-18 Atotech Usa, Inc. Fluid delivery apparatus
US5614264A (en) * 1995-08-11 1997-03-25 Atotech Usa, Inc. Fluid delivery apparatus and method
WO1997006895A1 (en) 1995-08-11 1997-02-27 Atotech Usa, Inc. Fluid delivery apparatus and method
WO1998031475A1 (en) 1997-01-21 1998-07-23 Atotech Usa, Inc. Fluid delivery apparatus and method
US7203977B2 (en) 2002-08-02 2007-04-17 Roy W. Mattson, Jr. Fill and drain jetted hydromassage antimicrobial water vessel
US7146659B2 (en) 2002-08-02 2006-12-12 Mattson Jr Roy W Hydromassage antimicrobial whirlpool bathtub
US6971125B2 (en) 2002-08-02 2005-12-06 Mattson Jr Roy W Antimicrobial whirlpool bathtub
US20140231381A1 (en) * 2011-09-30 2014-08-21 3M Innovative Properties Company Methods of Continuously Wet Etching A Patterned Substrate
US9301397B2 (en) * 2011-09-30 2016-03-29 3M Innovative Properties Company Methods of continuously wet etching a patterned substrate
CN107755383A (en) * 2016-08-23 2018-03-06 张鹏镇 Street litter bin cleaning vehicle
CN106871650A (en) * 2017-03-22 2017-06-20 无锡市卡德姆机械科技有限公司 Possesses the copper strips spreading for cooling frame that automatic sensing water under high pressure washes away cleaning function
CN109133497A (en) * 2018-08-02 2019-01-04 深圳市华星光电技术有限公司 Liquid waste treating apparatus and method for treating waste liquid
US20200179991A1 (en) * 2018-12-05 2020-06-11 Iwt S.R.L. System for treating wash waste liquid, adapted for application in a continuous tunnel washing machine in the field of preclinical pharmaceutical research
US11648592B2 (en) * 2018-12-05 2023-05-16 Iwt S.R.L. System for treating wash waste liquid, adapted for application in a continuous tunnel washing machine in the field of preclinical pharmaceutical research

Similar Documents

Publication Publication Date Title
US3905827A (en) Etchant rinse method
US3871914A (en) Etchant rinse apparatus
US4371422A (en) Continuous processing of printed circuit boards
IE41425B1 (en) Etching process and apparatus
US20100166625A1 (en) System and method for wastewater treatment
EP0560208B1 (en) Method and apparatus for cleaning metal articles and apparatus for rinsing metal articles
JP3357473B2 (en) Electroplating method
JPS5871397A (en) Method and apparatus for removing and recovering treating agent adhered to object
CA2268903C (en) Apparatus and method for recovering photoresist developers and strippers
US4427019A (en) Chemical process apparatus
JP2002515318A (en) Apparatus and method for recovering photoresist developer and film stripper
JPH0448872Y2 (en)
DE2311327C3 (en) Device for treating relief printing plates made of photosensitive synthetic resin panels
JP4035165B2 (en) Film peeling method
JPH03503071A (en) Etching method and equipment for copper-containing products
US4611554A (en) Method and device for the treatment of printed circuit boards
DE2610032C3 (en) Device for cleaning the surface of copper-clad layers of printed circuit boards
EP0357349A1 (en) Air knife
US2381183A (en) Apparatus for and method of rustproofing
JPH05217988A (en) Washing device
KR910007568B1 (en) Article washing method
JPH05255894A (en) Resist electrodeposition coating applicator onto planar workpiece
JPH0971882A (en) Device for treating metallic thin sheet
JPH02310989A (en) Method and apparatus for cleaning of painted board
TWI458861B (en) Surface Treatment of Copper in Copper Process Cleaning Solution

Legal Events

Date Code Title Description
AS Assignment

Owner name: CHEMCUT CORPORATION A CORP. OF DE

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:CHEMCUT CORPORATION, A CORP. OF PA;REEL/FRAME:004058/0145

Effective date: 19821006