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Referenced by

Citing PatentFiling dateIssue dateOriginal AssigneeTitle
US400808425 Apr 197515 Feb 1977Fuji Photo Film Co., Ltd.Metallic image forming material
US414289220 May 19776 Mar 1979International Business Machines CorporationMethod of reducing the defect density in a positive-working photoresist layer using a salt of imidazolinium
US419712528 Dec 19778 Apr 1980Teijin LimitedProcess of making photosensitive resin printing plates
US423339517 Jan 197911 Nov 1980Hoechst AktiengesellschaftPhotopolymerizable transfer material
US42872888 Feb 19791 Sep 1981Rhone-Poulenc-GraphicLithographic plate of tin-plated steel and method of manufacture
US43567225 Nov 19802 Nov 1982The Secretary of State for Social Services in Her Britannic Majesty's Government of the United Kingdom of Great Britain and Northern IrelandApparatus for testing a liquid sample
US462967925 Feb 198616 Dec 1986Mitsubishi Rayon Company Ltd.Tetrazole compound-containing photopolymerizable resin composition
US47569946 Jun 198612 Jul 1988Sekisui Kagaku Kogyo Kabushiki KaishaPhotocurable resin composition having excellent adhesion to the surface of a substrate
US49802632 Mar 198925 Dec 1990Fuji Photo Film Co., Ltd.Light-sensitive diazo resin composition with polyurethane and compound having ureido, thioureido, urethane, or thiourethane unit
US502851313 Apr 19892 Jul 1991Hitachi, Ltd.
Hitachi Chemical Co., Ltd.
Process for producing printed circuit board
US72205202 Jun 200622 May 2007Fujifilm Electronic Materials U.S.A., Inc.Photosensitive resin compositions
US73995722 Jun 200615 Jul 2008Fujifilm Electronic Materials U.S.A., Inc.Pretreatment compositions
US740773122 Mar 20065 Aug 2008Fujifilm Electronic Materials U.S.A., Inc.Photosensitive resin compositions
US79231934 Nov 200512 Apr 2011Agfa Graphics NVPhotopolymerizable composition