US3808046A - Metallising pastes - Google Patents

Metallising pastes Download PDF

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US3808046A
US3808046A US00248670A US24867072A US3808046A US 3808046 A US3808046 A US 3808046A US 00248670 A US00248670 A US 00248670A US 24867072 A US24867072 A US 24867072A US 3808046 A US3808046 A US 3808046A
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paste
glaze
metallising
oxide
replica
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US00248670A
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N Davey
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UK Atomic Energy Authority
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    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C4/00—Compositions for glass with special properties
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Definitions

  • ABSTRACT A metallising paste suitable for forming an adherent electrically-and thermally-conductive metalcontaining deposit on a ceramic surface and having one application in providing screen-printed microcircuit conductors and a further application in providing heat abstracting pads, or heat sinks," applied to the underside of microcircuit substrates, comprises a heatvaporizable liquid medium containing as powder a glaze material and a component selected from aluminum or an alloy thereof, wherein the glaze dissolves the oxide of aluminum or aluminum alloy and wets ceramic surfaces at the fusion temperature of the glaze.
  • the glaze fuses at a temperature not greater than the melting temperature of the component.
  • This invention relates to metallising pastes which 5 plained, by way of example, by reference to the followform adherent electrically-and thermally-conductive metal-containing deposits on ceramic surfaces when fired in contact therewith and to methods for forming conductive elements on ceramic surfaces with said pastes: the invention has one application in forming microcircuit conductors on ceramic substrates and a further microcircuit application in providing pads adherent to the underside of ceramic substrates for abstracting heat from the substrates by thermal conduction.
  • a metallising paste suitable for forming an adherent electrically-and thermally-conductive metal-containing deposit on a ceramic surface comprises a heat-vaporizable liquid medium containing as powder a glaze material and a component selected from aluminum or an alloy thereof, wherein the glaze dissolves the oxide of aluminum or aluminum alloy and wets ceramic surfaces at the fusion temperature of the glaze.
  • the fused glaze By dissolving the oxide of aluminum or an alloy thereof the fused glaze renders soluble at least part of the insulating oxide film known to coat the metal particles; both the electrical and thermal conductivity of the deposit are thereby substantially increased.
  • the glaze fuses at a temperature not greater than the melting temperature of the component: it has been found that if the glaze fuses at a temperature greater than the melting temperature of the component i.e. the glaze fuses after the component is molten, the conductivity of the deposit formed is lowered.
  • the preferred glaze for use with aluminium or an aluminium alloy comprises an oxide of boron: the glaze may additionally comprise an oxide of lead.
  • a suitable liquid medium for use in a metallising paste comprising aluminium or an aluminium alloy and the preferred glaze is a polymerized cyclic ketone dissolved in a solvent such as terpineol.
  • A- suitable ceramic surface for use with such an aluminium-containing metallising paste is alumina. Surfaces other than alumina which may be used include silica or alumino-silicate surfaces.
  • Aluminium alloys which may be used in pastes according to the present invention include Al/Cu and Al/Ag alloys.
  • the invention also provides a method for forming an electrically-and thermally-conducting element on and adherent to a ceramic substrate comprising forming a replica of said element on said substrate using a metallising paste as afore-defined, drying the formed replica, firing the dried replica at a temperature not less than that at which the whole of the replica fuses, whereby the replica wets the substrate and is rendered conducting, and solidifying the fired replica to form a substrateadhering electrically-and thermally-conducting element.
  • the replica may be formed on the substrate by screen-printing.
  • the invention provides a ceramic substrate having an electricallyand thermally-conducting element formed thereon by the method of the present invention.
  • a heat-vaporizable liquid medium was mixed with aluminium powder, boric oxide and lead oxide to form a paste having a consistency suitable for screenprinting microcircuitry.
  • the liquid medium was a polymerized cyclic ketone dissolved in terpineol, a suitable medium being Engelhard 4/575 (supplied by Engelhard Industries).
  • a suitable paste contained 35 ccs of liquid medium for each gms of solids consisting of 92 gms Al, 6 gms PhD and 2 gms B 0
  • the preferred particle size of the Al powder was 1-2 p. and of the lead and boric oxides was 400 mesh.
  • the paste was screenprinted onto an alumina substrate to produce a replica of a microcircuit comprising a plurality of conducting elements.
  • the substrate used was a 96% A1 0 material supplied by Worcester Porcelain Co.
  • the substrate was fired for 50 mins.
  • the molten aluminium powder formed a conductive microcircuit replica and the molten boric oxide/lead oxide wetted the substrate by interfacial reaction therewith.
  • On subsequent cooling to ambient temperature a solidified and electrically-conductive micro circuit was formed which was bonded to the substrate by the solidified mixed oxide glaze.
  • the electrical conductivity of microcircuitry formed from air-fired replicas as aforesaid is typically 20-30 mQ/square (a square being 1 mm across) compared with, for example, values of 4 mQ/square for Au, 10-15 mQ/square for Pt/Au and 60 mQ/square for Pd/Ag.
  • the metal powder in the above embodiment is Al
  • powders of Al alloys may be used, in particular powders of Al/Cu and Al/Ag alloys.
  • the invention provides heat-abstracting elements bonded to the underside of microcircuit substrates for the removal of heat therefrom.
  • Such elements usually in the form of pads and termed heat sinks, can also be deposited as paste replicas by screen-printing and converted to thermally-conducting pads by firing and subsequent solidification. It is known in the art that the dissipation of the heat generated by high density microcircuitry presents a problem: one method of substantially reducing substrate heat is to form thermally conducting elements (heat sinks) according to the present invention.
  • a metallising paste suitable for forming an adherent electrical conductor on a ceramic surface consisting essentially of a heat-vaporizable liquid medium, a glaze powder and a component in powder form selected from Al or an alloy thereof, wherein the glaze dissolves the oxide of said component and wets ceramic surfaces at the fusion temperature of the glaze.
  • a method as claimed in claim 15 wherein the component in the paste is selected from the group consisting of an Al/Cu and Al/Ag alloy.
  • liquid medium in the paste is a polymerized cyclic ketone dissolved in a solvent.
  • a method as claimed in claim 17 wherein the glaze in the paste is capable of wetting a ceramic surface selected from the group consisting of alumina, silica and aluminosilicate.
  • liquid medium in the paste is a polymerized cyclic ketone dissolved in a solvent.
  • a method as claimed in claim 22 wherein the glaze in the paste is capable of wetting a ceramic surface selected from the group consisting of alumina, silica and aluminosilicate.

Abstract

A metallising paste, suitable for forming an adherent electrically-and thermally-conductive metal-containing deposit on a ceramic surface and having one application in providing screenprinted microcircuit conductors and a further application in providing heat abstracting pads, or ''''heat sinks,'''' applied to the underside of microcircuit substrates, comprises a heatvaporizable liquid medium containing as powder a glaze material and a component selected from aluminum or an alloy thereof, wherein the glaze dissolves the oxide of aluminum or aluminum alloy and wets ceramic surfaces at the fusion temperature of the glaze. Preferably the glaze fuses at a temperature not greater than the melting temperature of the component.

Description

United States Patent [191 Davey METALLISING PASTES [75] Inventor: Norman Davey, Newbury, England [73] Assignee: United Kingdom Atomic Energy Authority, London, England 22 Filed: Apr. 28, 1972 21 Appl. No.: 248,670
[30] Foreign Application Priority Data May 10, 1971 Great Britain 14091/71 [52] US. Cl. 117/227, 117/160 R, 252/512, 252/514 [51] Int. Cl B44d l/l8 [58] Field of Search 117/227, 201, 160 R;
[4 1 Apr. 30, 1974 Primary Examiner-Cameron K. Weiffenbach Attorney, Agent, or Fi,rmLarson, Taylor and Hinds 57] ABSTRACT A metallising paste, suitable for forming an adherent electrically-and thermally-conductive metalcontaining deposit on a ceramic surface and having one application in providing screen-printed microcircuit conductors and a further application in providing heat abstracting pads, or heat sinks," applied to the underside of microcircuit substrates, comprises a heatvaporizable liquid medium containing as powder a glaze material and a component selected from aluminum or an alloy thereof, wherein the glaze dissolves the oxide of aluminum or aluminum alloy and wets ceramic surfaces at the fusion temperature of the glaze. Preferably the glaze fuses at a temperature not greater than the melting temperature of the component.
25 Claims, No Drawings METALLISING PASTES BACKGROUND OF THE INVENTION DESCRIPTION OF THE PREFERRED EMBODIMENTS The nature of the present invention is further ex- This invention relates to metallising pastes which 5 plained, by way of example, by reference to the followform adherent electrically-and thermally-conductive metal-containing deposits on ceramic surfaces when fired in contact therewith and to methods for forming conductive elements on ceramic surfaces with said pastes: the invention has one application in forming microcircuit conductors on ceramic substrates and a further microcircuit application in providing pads adherent to the underside of ceramic substrates for abstracting heat from the substrates by thermal conduction.
SUMMARY OF THE INVENTION According to the present invention a metallising paste suitable for forming an adherent electrically-and thermally-conductive metal-containing deposit on a ceramic surface comprises a heat-vaporizable liquid medium containing as powder a glaze material and a component selected from aluminum or an alloy thereof, wherein the glaze dissolves the oxide of aluminum or aluminum alloy and wets ceramic surfaces at the fusion temperature of the glaze.
By dissolving the oxide of aluminum or an alloy thereof the fused glaze renders soluble at least part of the insulating oxide film known to coat the metal particles; both the electrical and thermal conductivity of the deposit are thereby substantially increased. Preferably the glaze fuses at a temperature not greater than the melting temperature of the component: it has been found that if the glaze fuses at a temperature greater than the melting temperature of the component i.e. the glaze fuses after the component is molten, the conductivity of the deposit formed is lowered.
The preferred glaze for use with aluminium or an aluminium alloy comprises an oxide of boron: the glaze may additionally comprise an oxide of lead. A suitable liquid medium for use in a metallising paste comprising aluminium or an aluminium alloy and the preferred glaze is a polymerized cyclic ketone dissolved in a solvent such as terpineol. A- suitable ceramic surface for use with such an aluminium-containing metallising paste is alumina. Surfaces other than alumina which may be used include silica or alumino-silicate surfaces. Aluminium alloys which may be used in pastes according to the present invention include Al/Cu and Al/Ag alloys.
The invention also provides a method for forming an electrically-and thermally-conducting element on and adherent to a ceramic substrate comprising forming a replica of said element on said substrate using a metallising paste as afore-defined, drying the formed replica, firing the dried replica at a temperature not less than that at which the whole of the replica fuses, whereby the replica wets the substrate and is rendered conducting, and solidifying the fired replica to form a substrateadhering electrically-and thermally-conducting element. The replica may be formed on the substrate by screen-printing. I
In addition the invention provides a ceramic substrate having an electricallyand thermally-conducting element formed thereon by the method of the present invention.
ing embodiments thereof.
A heat-vaporizable liquid medium was mixed with aluminium powder, boric oxide and lead oxide to form a paste having a consistency suitable for screenprinting microcircuitry. The liquid medium was a polymerized cyclic ketone dissolved in terpineol, a suitable medium being Engelhard 4/575 (supplied by Engelhard Industries). A suitable paste contained 35 ccs of liquid medium for each gms of solids consisting of 92 gms Al, 6 gms PhD and 2 gms B 0 The preferred particle size of the Al powder was 1-2 p. and of the lead and boric oxides was 400 mesh. The paste was screenprinted onto an alumina substrate to produce a replica of a microcircuit comprising a plurality of conducting elements. The substrate used was a 96% A1 0 material supplied by Worcester Porcelain Co. The substrate, with replica printed thereon, was dried at between lO0-200C (to remove the vaporizable material) and was then fired in air at 830C at which temperature both the aluminium powder and the mixed boric oxide/lead oxide are molten. The substrate was fired for 50 mins. The molten aluminium powder formed a conductive microcircuit replica and the molten boric oxide/lead oxide wetted the substrate by interfacial reaction therewith. On subsequent cooling to ambient temperature a solidified and electrically-conductive micro circuit was formed which was bonded to the substrate by the solidified mixed oxide glaze. The electrical conductivity of microcircuitry formed from air-fired replicas as aforesaid is typically 20-30 mQ/square (a square being 1 mm across) compared with, for example, values of 4 mQ/square for Au, 10-15 mQ/square for Pt/Au and 60 mQ/square for Pd/Ag. Although the metal powder in the above embodiment is Al, powders of Al alloys may be used, in particular powders of Al/Cu and Al/Ag alloys.
Apart from providing microcircuit electrical conductors the invention provides heat-abstracting elements bonded to the underside of microcircuit substrates for the removal of heat therefrom. Such elements, usually in the form of pads and termed heat sinks, can also be deposited as paste replicas by screen-printing and converted to thermally-conducting pads by firing and subsequent solidification. It is known in the art that the dissipation of the heat generated by high density microcircuitry presents a problem: one method of substantially reducing substrate heat is to form thermally conducting elements (heat sinks) according to the present invention.
1 claim:
1. A metallising paste suitable for forming an adherent electrical conductor on a ceramic surface consisting essentially of a heat-vaporizable liquid medium, a glaze powder and a component in powder form selected from Al or an alloy thereof, wherein the glaze dissolves the oxide of said component and wets ceramic surfaces at the fusion temperature of the glaze.
2. A metallising paste as claimed in claim I wherein the glaze fuses at a temperature not greater than the melting temperature of the component.
3. A metallising paste as claimed in claim 1 wherein the component is selected from the group consisting of an Al/Cu and Al/Ag alloy.
4. A metallising paste as claimed in claim 1 wherein the liquid medium is a polymerized cyclic ketone dissolved in a solvent.
5. A metallising paste as claimed in claim 1 wherein the glaze is capable of wetting a ceramic surface selected from the group consisting of alumina, silica and aluminosilicate.
6. A metallising paste as claimed in claim 1 wherein the glaze comprises an oxide of boron.
7. A metallising paste as claimed in claim 6 wherein the glaze additionally comprises an oxide of lead.
8. A metallising paste as claimed in claim 1 wherein the component is Al metal.
9. A metallising paste as claimed in claim 8 wherein the glaze comprises an oxide of boron.
10. A metallising paste as claimed in claim 9 wherein the glaze additionally comprises an oxide of lead.
11. A metallising paste as claimed in claim 9 wherein the liquid medium is a polymerized cyclic ketone dissolved in a solvent.
12. A metallising paste as claimed in claim 9 wherein the glaze is capable of wetting a ceramic surface selected from the group consisting of alumina, silica and aluminosilicate.
13. A method for forming an electricallyand thermallyconducting element on and adherent to a ceramic substrate comprising forming a replica of said element on said substrate with a metallising paste as claimed in claim 1, drying the formed replica, firing the dried replica at a temperature not less than that at which the whole of the replica fuses, whereby the replica wets the substrate and is rendered conducting, and solidifying the tired replica to form a substrateadhering electrically-and thermally-conducting element.
14. A method as claimed in any of claim 13 whereby the replica is formed on the substrate by screenprinting.
15. A method as claimed in claim 13 wherein the glaze in the paste fuses at a temperature not greater than the melting temperature of the component.
16. A method as claimed in claim 15 wherein the component in the paste is selected from the group consisting of an Al/Cu and Al/Ag alloy.
17. A method as claimed in claim 15 wherein the glaze in the paste comprises an oxide of boron.
18. A method as claimed in claim 17 wherein the glaze additionally comprises an oxide of lead.
19. A method as claimed in claim 17 wherein the liquid medium in the paste is a polymerized cyclic ketone dissolved in a solvent.
20. A method as claimed in claim 17 wherein the glaze in the paste is capable of wetting a ceramic surface selected from the group consisting of alumina, silica and aluminosilicate.
21. A method as claimed in claim 15 wherein the component in the paste is Al metal.
22. A method as claimed in claim 21 wherein the glaze in the paste comprises an oxide of boron.
23. A method as claimed in claim 22 wherein the glaze additionally comprises an oxide of lead.
24. A method as claimed in claim 22 wherein the liquid medium in the paste is a polymerized cyclic ketone dissolved in a solvent.
25. A method as claimed in claim 22 wherein the glaze in the paste is capable of wetting a ceramic surface selected from the group consisting of alumina, silica and aluminosilicate.

Claims (24)

  1. 2. A metallising paste as Claimed in claim 1 wherein the glaze fuses at a temperature not greater than the melting temperature of the component.
  2. 3. A metallising paste as claimed in claim 1 wherein the component is selected from the group consisting of an Al/Cu and Al/Ag alloy.
  3. 4. A metallising paste as claimed in claim 1 wherein the liquid medium is a polymerized cyclic ketone dissolved in a solvent.
  4. 5. A metallising paste as claimed in claim 1 wherein the glaze is capable of wetting a ceramic surface selected from the group consisting of alumina, silica and aluminosilicate.
  5. 6. A metallising paste as claimed in claim 1 wherein the glaze comprises an oxide of boron.
  6. 7. A metallising paste as claimed in claim 6 wherein the glaze additionally comprises an oxide of lead.
  7. 8. A metallising paste as claimed in claim 1 wherein the component is Al metal.
  8. 9. A metallising paste as claimed in claim 8 wherein the glaze comprises an oxide of boron.
  9. 10. A metallising paste as claimed in claim 9 wherein the glaze additionally comprises an oxide of lead.
  10. 11. A metallising paste as claimed in claim 9 wherein the liquid medium is a polymerized cyclic ketone dissolved in a solvent.
  11. 12. A metallising paste as claimed in claim 9 wherein the glaze is capable of wetting a ceramic surface selected from the group consisting of alumina, silica and aluminosilicate.
  12. 13. A method for forming an electrically- and thermally-conducting element on and adherent to a ceramic substrate comprising forming a replica of said element on said substrate with a metallising paste as claimed in claim 1, drying the formed replica, firing the dried replica at a temperature not less than that at which the whole of the replica fuses, whereby the replica wets the substrate and is rendered conducting, and solidifying the fired replica to form a substrate-adhering electrically-and thermally-conducting element.
  13. 14. A method as claimed in any of claim 13 whereby the replica is formed on the substrate by screen-printing.
  14. 15. A method as claimed in claim 13 wherein the glaze in the paste fuses at a temperature not greater than the melting temperature of the component.
  15. 16. A method as claimed in claim 15 wherein the component in the paste is selected from the group consisting of an Al/Cu and Al/Ag alloy.
  16. 17. A method as claimed in claim 15 wherein the glaze in the paste comprises an oxide of boron.
  17. 18. A method as claimed in claim 17 wherein the glaze additionally comprises an oxide of lead.
  18. 19. A method as claimed in claim 17 wherein the liquid medium in the paste is a polymerized cyclic ketone dissolved in a solvent.
  19. 20. A method as claimed in claim 17 wherein the glaze in the paste is capable of wetting a ceramic surface selected from the group consisting of alumina, silica and aluminosilicate.
  20. 21. A method as claimed in claim 15 wherein the component in the paste is Al metal.
  21. 22. A method as claimed in claim 21 wherein the glaze in the paste comprises an oxide of boron.
  22. 23. A method as claimed in claim 22 wherein the glaze additionally comprises an oxide of lead.
  23. 24. A method as claimed in claim 22 wherein the liquid medium in the paste is a polymerized cyclic ketone dissolved in a solvent.
  24. 25. A method as claimed in claim 22 wherein the glaze in the paste is capable of wetting a ceramic surface selected from the group consisting of alumina, silica and aluminosilicate.
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FR (1) FR2137660B1 (en)
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US3919441A (en) * 1972-12-20 1975-11-11 Seinosuke Horiki Panel-styled calorific devices and a process for manufacturing the same
US4004052A (en) * 1974-03-08 1977-01-18 Vera Ivanovna Bystrova Process for producing non-porous coating for corundum substrates
US4039721A (en) * 1974-09-18 1977-08-02 Siemens Aktiengesellschaft Thick-layer conductor path pastes
US4047290A (en) * 1974-09-10 1977-09-13 Siemens Aktiengesellschaft Process for the production of a multi-chip wiring arrangement
US4053864A (en) * 1976-12-20 1977-10-11 Sprague Electric Company Thermistor with leads and method of making
US4278702A (en) * 1979-09-25 1981-07-14 Anthony J. Casella Method of making printed circuit board by induction heating of the conductive metal particles on a plastic substrate
GB2251677A (en) * 1991-01-09 1992-07-15 Rheinmetall Gmbh Drying thick-layer printed circuit boards
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
US5743185A (en) * 1995-01-17 1998-04-28 Mattel, Inc. Flexible thermally conductive stamp and material
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US4323483A (en) * 1979-11-08 1982-04-06 E. I. Du Pont De Nemours And Company Mixed oxide bonded copper conductor compositions
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US3207706A (en) * 1962-09-20 1965-09-21 Du Pont Resistor compositions
US3374110A (en) * 1964-05-27 1968-03-19 Ibm Conductive element, composition and method
US3413240A (en) * 1965-03-25 1968-11-26 Du Pont Compositions
US3547835A (en) * 1969-06-09 1970-12-15 Du Pont Processes of producing and applying silver compositions,and products therefrom
US3748170A (en) * 1970-09-04 1973-07-24 North American Rockwell Method of coating metal
US3711328A (en) * 1971-01-04 1973-01-16 Matsushita Electric Ind Co Ltd Resistor paste

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3919441A (en) * 1972-12-20 1975-11-11 Seinosuke Horiki Panel-styled calorific devices and a process for manufacturing the same
US4004052A (en) * 1974-03-08 1977-01-18 Vera Ivanovna Bystrova Process for producing non-porous coating for corundum substrates
US4047290A (en) * 1974-09-10 1977-09-13 Siemens Aktiengesellschaft Process for the production of a multi-chip wiring arrangement
US4039721A (en) * 1974-09-18 1977-08-02 Siemens Aktiengesellschaft Thick-layer conductor path pastes
US4053864A (en) * 1976-12-20 1977-10-11 Sprague Electric Company Thermistor with leads and method of making
US4278702A (en) * 1979-09-25 1981-07-14 Anthony J. Casella Method of making printed circuit board by induction heating of the conductive metal particles on a plastic substrate
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
US5830389A (en) * 1990-02-09 1998-11-03 Toranaga Technologies, Inc. Electrically conductive compositions and methods for the preparation and use thereof
US5853622A (en) * 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives
GB2251677A (en) * 1991-01-09 1992-07-15 Rheinmetall Gmbh Drying thick-layer printed circuit boards
US5743185A (en) * 1995-01-17 1998-04-28 Mattel, Inc. Flexible thermally conductive stamp and material

Also Published As

Publication number Publication date
FR2137660B1 (en) 1978-11-24
DE2222754A1 (en) 1972-11-30
IT958831B (en) 1973-10-30
GB1378520A (en) 1974-12-27
DE2222754C2 (en) 1982-09-16
FR2137660A1 (en) 1972-12-29

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