US3770598A - Electrodeposition of copper from acid baths - Google Patents
Electrodeposition of copper from acid baths Download PDFInfo
- Publication number
- US3770598A US3770598A US00219845A US3770598DA US3770598A US 3770598 A US3770598 A US 3770598A US 00219845 A US00219845 A US 00219845A US 3770598D A US3770598D A US 3770598DA US 3770598 A US3770598 A US 3770598A
- Authority
- US
- United States
- Prior art keywords
- bath
- polyethyleneimine
- present
- amount
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Abstract
Description
Claims (11)
- 2. The bath as claimed in claim 1, wherein there is also present a bath soluble polyether compound and an organic sulfide compound selected from aliphatic polysulfides and organic sulfides carrying at least one sulfonic group.
- 3. The bath as claimed in claim 2, wherein the polyethyleneimine reaction product is present in an amount within the range of about 0.1 to 1,000 milligrams per liter, the polyether compound is present in an amount within the range of about 0.01 to 5 grams per liter and the organic sulfide compound is present in an amount within the range of about 0.0005 to 0.1 grams per liter.
- 4. The bath as claimed in claim 3, wherein the reaction product is formed by the reaction of polyethyleneimine and benzyl chloride, the polyether is polypropylene glycol and the organic sulfide is HO3S(CH2)3-S-S-(CH2)3-SO3H.
- 5. The bath of claim 1, wherein the alkylating agent is benzyl chloride.
- 6. The bath of claim 1, wherein the alkylating agent is allyl bromide.
- 7. A method for electrodepositing a ductile, lustrous copper which comprises the step of electrodepositing copper from an aqueous copper plating bath containing dissolved therein a brightening amount of the reaction product of polyethyleneimine and an alkylating agent which will alkylate the nitrogen, said alkylating agent being selected from the groUp consisting of benzyl chloride, allyl bromide, propane sultone, and dimethyl sulfate, and wherein the reaction temperature for the imine and alkylating agent ranges from about room temperature to about 120*C and the reaction product is present in the bath in an amount from about 0.1 to 1,000 milligrams per liter.
- 8. The method as claimed in claim 7, wherein the plating bath also contains a bath-soluble polyether compound and an organic sulfide compound selected from aliphatic polysulfides and organic sulfide compounds carrying at least one sulfonic group.
- 9. The method as claimed in claim 8, wherein the polyethyleneimine reaction product is present in the bath in an amount within the range of about 0.1 to 1,000 milligrams per liter, the polyether compound is present in the bath in an amount within the range of about 0.01 to 5 grams per liter and the organic sulfide compound is present in the bath in an amount within the range of about 0.0005 to 1.0 grams per liter.
- 10. The method as claimed in claim 9, wherein the reaction product is formed by the reaction of polyethyleneimine and benzyl chloride, the polyether compound is polypropylene glycol, and the organic sulfide compound is HO3S-(CH2)3-S-S-(CH2)3SO3H.
- 11. The method of claim 7, wherein the alkylating agent is benzyl chloride.
- 12. The method of claim 7, wherein the alkylating agent is allyl bromide.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US21984572A | 1972-01-21 | 1972-01-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
US3770598A true US3770598A (en) | 1973-11-06 |
Family
ID=22821015
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US00219845A Expired - Lifetime US3770598A (en) | 1972-01-21 | 1972-01-21 | Electrodeposition of copper from acid baths |
Country Status (1)
Country | Link |
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US (1) | US3770598A (en) |
Cited By (114)
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---|---|---|---|---|
US4110176A (en) * | 1975-03-11 | 1978-08-29 | Oxy Metal Industries Corporation | Electrodeposition of copper |
FR2389689A1 (en) * | 1977-05-04 | 1978-12-01 | Oxy Metal Industries Corp | |
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EP0068807A2 (en) * | 1981-06-24 | 1983-01-05 | M & T Chemicals, Inc. | Acid copper electroplating baths containing brightening and levelling additives |
GB2141141A (en) * | 1983-06-10 | 1984-12-12 | Omi Int Corp | Electrodepositing copper |
DE3420999A1 (en) * | 1983-06-10 | 1984-12-13 | Omi International Corp., Warren, Mich. | AQUEOUS ACID GALVANIC COPPER BATH AND METHOD FOR GALVANICALLY DEPOSITING A GLOSSY-INPUTED COPPER COVER ON A CONDUCTIVE SUBSTRATE FROM THIS BATH |
US4555315A (en) * | 1984-05-29 | 1985-11-26 | Omi International Corporation | High speed copper electroplating process and bath therefor |
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Cited By (193)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4110176A (en) * | 1975-03-11 | 1978-08-29 | Oxy Metal Industries Corporation | Electrodeposition of copper |
FR2389689A1 (en) * | 1977-05-04 | 1978-12-01 | Oxy Metal Industries Corp | |
US4336114A (en) * | 1981-03-26 | 1982-06-22 | Hooker Chemicals & Plastics Corp. | Electrodeposition of bright copper |
FR2502648A1 (en) * | 1981-03-26 | 1982-10-01 | Hooker Chemicals Plastics Corp | ACID ELECTROLYTE FOR THE ELECTROLYTIC DEPOSITION OF COPPER, PARTICULARLY CONTAINING A PHTALOCYANINE RADICAL AND AN ADDITION PRODUCT OF AN ALKYLAMINE WITH A POLYEPICHLORHYDRINE |
EP0068807A2 (en) * | 1981-06-24 | 1983-01-05 | M & T Chemicals, Inc. | Acid copper electroplating baths containing brightening and levelling additives |
US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
EP0068807A3 (en) * | 1981-06-24 | 1984-07-25 | M & T Chemicals, Inc. | Acid copper electroplating baths containing brightening and levelling additives |
GB2141141A (en) * | 1983-06-10 | 1984-12-12 | Omi Int Corp | Electrodepositing copper |
DE3420999A1 (en) * | 1983-06-10 | 1984-12-13 | Omi International Corp., Warren, Mich. | AQUEOUS ACID GALVANIC COPPER BATH AND METHOD FOR GALVANICALLY DEPOSITING A GLOSSY-INPUTED COPPER COVER ON A CONDUCTIVE SUBSTRATE FROM THIS BATH |
US4555315A (en) * | 1984-05-29 | 1985-11-26 | Omi International Corporation | High speed copper electroplating process and bath therefor |
FR2565259A1 (en) * | 1984-05-29 | 1985-12-06 | Omi Int Corp | AQUEOUS ACID ELECTROLYTE, AND HIGH SPEED COPPER ELECTROLYTIC COATING PROCESS |
US4948474A (en) * | 1987-09-18 | 1990-08-14 | Pennsylvania Research Corporation | Copper electroplating solutions and methods |
US4786746A (en) * | 1987-09-18 | 1988-11-22 | Pennsylvania Research Corporation | Copper electroplating solutions and methods of making and using them |
US4897165A (en) * | 1988-08-23 | 1990-01-30 | Shipley Company Inc. | Electroplating composition and process for plating through holes in printed circuit boards |
EP0355804A2 (en) * | 1988-08-23 | 1990-02-28 | Shipley Company Inc. | Electroplating composition and process |
US5004525A (en) * | 1988-08-23 | 1991-04-02 | Shipley Company Inc. | Copper electroplating composition |
EP0355804A3 (en) * | 1988-08-23 | 1991-07-17 | Shipley Company Inc. | Electroplating composition and process |
US5068013A (en) * | 1988-08-23 | 1991-11-26 | Shipley Company Inc. | Electroplating composition and process |
EP0440027A2 (en) * | 1990-01-29 | 1991-08-07 | Shipley Company Inc. | Additive for acid-copper electroplating baths to increase throwing power |
EP0440027A3 (en) * | 1990-01-29 | 1991-11-06 | Shipley Company Inc. | Additive for acid-copper electroplating baths to increase throwing power |
US7138016B2 (en) | 1990-05-18 | 2006-11-21 | Semitool, Inc. | Semiconductor processing apparatus |
US7094291B2 (en) | 1990-05-18 | 2006-08-22 | Semitool, Inc. | Semiconductor processing apparatus |
US20020040679A1 (en) * | 1990-05-18 | 2002-04-11 | Reardon Timothy J. | Semiconductor processing apparatus |
US5252196A (en) * | 1991-12-05 | 1993-10-12 | Shipley Company Inc. | Copper electroplating solutions and processes |
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