US3763027A - Sparger - Google Patents
Sparger Download PDFInfo
- Publication number
- US3763027A US3763027A US00188028A US3763027DA US3763027A US 3763027 A US3763027 A US 3763027A US 00188028 A US00188028 A US 00188028A US 3763027D A US3763027D A US 3763027DA US 3763027 A US3763027 A US 3763027A
- Authority
- US
- United States
- Prior art keywords
- chamber
- holes
- sparger
- workpiece
- electrolyte
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (5)
- 2. The system as defined in claim 1 in which said second means includes: a baffle plate for dispersing the flow of said second plurality of streams to provide dispersed streams; and a collimating plate for collimating said dispersed streams into said third plurality of streams.
- 3. The system as defined in claim 2 in which said first chamber has an inlet opening therein for receiving said single stream of electrolyte; said system also including: pumping means for supplying said single stream to said inlet opening under pressure.
- 4. The system as defined in claim 3 also including: anode means mounted in spaced relationship from said workpiece and in the path of said second plurality of streams; and an electric power source operably connected between said workpiece and said anode means.
- 5. The system as defined in claim 4 also including masking means for defining said first plurality of preselected areas.
- 6. The system as defined in claim 5 also including means for holding said workpiece against said masking means.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US18802871A | 1971-10-12 | 1971-10-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
US3763027A true US3763027A (en) | 1973-10-02 |
Family
ID=22691481
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US00188028A Expired - Lifetime US3763027A (en) | 1971-10-12 | 1971-10-12 | Sparger |
Country Status (1)
Country | Link |
---|---|
US (1) | US3763027A (en) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4029564A (en) * | 1976-03-26 | 1977-06-14 | Electroplating Engineers Of Japan, Limited | High speed plating device for rectangular sheets |
US4033844A (en) * | 1975-11-03 | 1977-07-05 | National Semiconductor Corporation | Apparatus for selectively plating lead frames |
US4126533A (en) * | 1976-07-28 | 1978-11-21 | Lukyanchikov Viktor E | Apparatus for selective electroplating of workpieces |
US4164493A (en) * | 1978-09-05 | 1979-08-14 | General Electric Company | Polyphenylene ether resin compositions containing polypentenamer |
US4240880A (en) * | 1978-07-25 | 1980-12-23 | Sumitomo Metal Mining Co., Ltd. | Method and apparatus for selectively plating a material |
US4298446A (en) * | 1979-12-29 | 1981-11-03 | Electroplating Engineers Of Japan, Limited | Apparatus for plating |
US4358349A (en) * | 1979-05-24 | 1982-11-09 | Matsushita Electric Works, Ltd. | Method of forming electrical wiring path on insulative substrate |
US4675093A (en) * | 1985-01-31 | 1987-06-23 | Sumitomo Metal Mining Company Limited | Selectively plating apparatus for forming an annular coated area |
WO1989001536A1 (en) * | 1987-08-21 | 1989-02-23 | Sb Plating Limited | Electro-plating techniques |
US4890727A (en) * | 1988-07-27 | 1990-01-02 | Osteo-Dyne, Inc. | Method and apparatus for plating through holes in graphite composites |
US5032235A (en) * | 1988-07-27 | 1991-07-16 | The Boeing Company | Method and apparatus for plating through holes in graphite composites |
US5228966A (en) * | 1991-01-31 | 1993-07-20 | Nec Corporation | Gilding apparatus for semiconductor substrate |
US5279725A (en) * | 1992-03-18 | 1994-01-18 | The Boeing Company | Apparatus and method for electroplating a workpiece |
US5597460A (en) * | 1995-11-13 | 1997-01-28 | Reynolds Tech Fabricators, Inc. | Plating cell having laminar flow sparger |
US6358483B1 (en) | 1999-07-13 | 2002-03-19 | The Standard Oil Company | Sparger for oxygen injection into a fluid bed reactor |
US6503376B2 (en) * | 2000-09-25 | 2003-01-07 | Mitsubishi Denki Kabushiki Kaisha | Electroplating apparatus |
US6896776B2 (en) * | 2000-12-18 | 2005-05-24 | Applied Materials Inc. | Method and apparatus for electro-chemical processing |
-
1971
- 1971-10-12 US US00188028A patent/US3763027A/en not_active Expired - Lifetime
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4033844A (en) * | 1975-11-03 | 1977-07-05 | National Semiconductor Corporation | Apparatus for selectively plating lead frames |
US4029564A (en) * | 1976-03-26 | 1977-06-14 | Electroplating Engineers Of Japan, Limited | High speed plating device for rectangular sheets |
US4126533A (en) * | 1976-07-28 | 1978-11-21 | Lukyanchikov Viktor E | Apparatus for selective electroplating of workpieces |
US4240880A (en) * | 1978-07-25 | 1980-12-23 | Sumitomo Metal Mining Co., Ltd. | Method and apparatus for selectively plating a material |
US4164493A (en) * | 1978-09-05 | 1979-08-14 | General Electric Company | Polyphenylene ether resin compositions containing polypentenamer |
US4358349A (en) * | 1979-05-24 | 1982-11-09 | Matsushita Electric Works, Ltd. | Method of forming electrical wiring path on insulative substrate |
US4298446A (en) * | 1979-12-29 | 1981-11-03 | Electroplating Engineers Of Japan, Limited | Apparatus for plating |
US4675093A (en) * | 1985-01-31 | 1987-06-23 | Sumitomo Metal Mining Company Limited | Selectively plating apparatus for forming an annular coated area |
WO1989001536A1 (en) * | 1987-08-21 | 1989-02-23 | Sb Plating Limited | Electro-plating techniques |
US4890727A (en) * | 1988-07-27 | 1990-01-02 | Osteo-Dyne, Inc. | Method and apparatus for plating through holes in graphite composites |
US5032235A (en) * | 1988-07-27 | 1991-07-16 | The Boeing Company | Method and apparatus for plating through holes in graphite composites |
US5228966A (en) * | 1991-01-31 | 1993-07-20 | Nec Corporation | Gilding apparatus for semiconductor substrate |
US5279725A (en) * | 1992-03-18 | 1994-01-18 | The Boeing Company | Apparatus and method for electroplating a workpiece |
US5597460A (en) * | 1995-11-13 | 1997-01-28 | Reynolds Tech Fabricators, Inc. | Plating cell having laminar flow sparger |
US6358483B1 (en) | 1999-07-13 | 2002-03-19 | The Standard Oil Company | Sparger for oxygen injection into a fluid bed reactor |
US6503376B2 (en) * | 2000-09-25 | 2003-01-07 | Mitsubishi Denki Kabushiki Kaisha | Electroplating apparatus |
US6896776B2 (en) * | 2000-12-18 | 2005-05-24 | Applied Materials Inc. | Method and apparatus for electro-chemical processing |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: OXY METAL INDUSTRIES CORPORATION Free format text: CHANGE OF NAME;ASSIGNOR:OXY METAL FINISHING CORPORATION;REEL/FRAME:003967/0084 Effective date: 19741220 |
|
AS | Assignment |
Owner name: HOOKER CHEMICALS & PLASTICS CORP. Free format text: MERGER;ASSIGNOR:OXY METAL INDUSTRIES CORPORATION;REEL/FRAME:004075/0885 Effective date: 19801222 |
|
AS | Assignment |
Owner name: OCCIDENTAL CHEMICAL CORPORATION Free format text: CHANGE OF NAME;ASSIGNOR:HOOKER CHEMICAS & PLASTICS CORP.;REEL/FRAME:004126/0054 Effective date: 19820330 |
|
AS | Assignment |
Owner name: OMI INTERNATIONAL CORPORATION, 21441 HOOVER ROAD, Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:OCCIDENTAL CHEMICAL CORPORATION;REEL/FRAME:004190/0827 Effective date: 19830915 |
|
AS | Assignment |
Owner name: MANUFACTURERS HANOVER TRUST COMPANY, A CORP OF NY Free format text: SECURITY INTEREST;ASSIGNOR:INTERNATIONAL CORPORATION, A CORP OF DE;REEL/FRAME:004201/0733 Effective date: 19830930 |