US3664860A - Electrolessly nickel plating on a non-metallic basis material - Google Patents
Electrolessly nickel plating on a non-metallic basis material Download PDFInfo
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- US3664860A US3664860A US883311A US3664860DA US3664860A US 3664860 A US3664860 A US 3664860A US 883311 A US883311 A US 883311A US 3664860D A US3664860D A US 3664860DA US 3664860 A US3664860 A US 3664860A
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- United States
- Prior art keywords
- nickel
- basis material
- bath
- metallic
- ascorbic acid
- Prior art date
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- 239000000463 material Substances 0.000 title claims abstract description 39
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title abstract description 72
- 229910052759 nickel Inorganic materials 0.000 title abstract description 34
- 238000007747 plating Methods 0.000 title abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 24
- 229960005070 ascorbic acid Drugs 0.000 claims abstract description 17
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 13
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims description 30
- 239000002211 L-ascorbic acid Substances 0.000 claims description 14
- 235000000069 L-ascorbic acid Nutrition 0.000 claims description 14
- -1 polypropylene Polymers 0.000 claims description 8
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 claims description 5
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 5
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 5
- 229920003002 synthetic resin Polymers 0.000 claims description 5
- 239000000057 synthetic resin Substances 0.000 claims description 5
- 239000004743 Polypropylene Substances 0.000 claims description 4
- 229920001155 polypropylene Polymers 0.000 claims description 4
- 238000000576 coating method Methods 0.000 abstract description 21
- 239000011248 coating agent Substances 0.000 abstract description 20
- 239000000126 substance Substances 0.000 abstract description 18
- 238000000151 deposition Methods 0.000 abstract description 8
- 238000009713 electroplating Methods 0.000 abstract description 8
- 230000001235 sensitizing effect Effects 0.000 abstract description 7
- 150000003839 salts Chemical class 0.000 abstract description 4
- 239000011668 ascorbic acid Substances 0.000 abstract description 3
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 abstract description 3
- 238000002203 pretreatment Methods 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 10
- 238000011282 treatment Methods 0.000 description 8
- 238000005406 washing Methods 0.000 description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 230000003213 activating effect Effects 0.000 description 6
- 239000011259 mixed solution Substances 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 229910001453 nickel ion Inorganic materials 0.000 description 5
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 description 5
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 4
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 4
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 4
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005238 degreasing Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 3
- 239000001119 stannous chloride Substances 0.000 description 3
- 235000011150 stannous chloride Nutrition 0.000 description 3
- KPZGRMZPZLOPBS-UHFFFAOYSA-N 1,3-dichloro-2,2-bis(chloromethyl)propane Chemical compound ClCC(CCl)(CCl)CCl KPZGRMZPZLOPBS-UHFFFAOYSA-N 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- QXNVGIXVLWOKEQ-UHFFFAOYSA-N Disodium Chemical compound [Na][Na] QXNVGIXVLWOKEQ-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 2
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- GQZXNSPRSGFJLY-UHFFFAOYSA-N hydroxyphosphanone Chemical compound OP=O GQZXNSPRSGFJLY-UHFFFAOYSA-N 0.000 description 2
- 229940005631 hypophosphite ion Drugs 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- IUTCEZPPWBHGIX-UHFFFAOYSA-N tin(2+) Chemical compound [Sn+2] IUTCEZPPWBHGIX-UHFFFAOYSA-N 0.000 description 2
- XXSPKSHUSWQAIZ-UHFFFAOYSA-L 36026-88-7 Chemical compound [Ni+2].[O-]P=O.[O-]P=O XXSPKSHUSWQAIZ-UHFFFAOYSA-L 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 1
- 235000011130 ammonium sulphate Nutrition 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 235000010323 ascorbic acid Nutrition 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 150000004688 heptahydrates Chemical class 0.000 description 1
- 150000004687 hexahydrates Chemical class 0.000 description 1
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000001455 metallic ions Chemical class 0.000 description 1
- 150000004682 monohydrates Chemical class 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 229940074404 sodium succinate Drugs 0.000 description 1
- ZDQYSKICYIVCPN-UHFFFAOYSA-L sodium succinate (anhydrous) Chemical compound [Na+].[Na+].[O-]C(=O)CCC([O-])=O ZDQYSKICYIVCPN-UHFFFAOYSA-L 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
Abstract
A process for depositing nickel on a non-metallic basis material from a chemical nickel plating bath containing a hypophosphite as a reducing agent to form a nickel coating on the basis material, the coating being indispensable for the practice of the subsequent electroplating, characterized in that the bath contains, as a second reducing agent, a member selected from the group consisting of 1-ascorbic acid, its salts, and any substances which will produce 1-ascorbic acid when incorporated in the bath as one of the components thereof, thereby to eliminate the sensitizing pre-treatment required for the conventional processes for chemically plating a non-metallic basis material with nickel.
Description
United States Patent Kamiya et al.
Nihon Kagaku Kizai Kabushiki Kaisha, Tokyo, Japan 22 Filed: Dec.8,l969
[21] Appl.No.: 883,311
[73] Assignee:
[30] Foreign Application Priority Data Dec. 6, 1968 Japan .,.43/89357 [52] U.S.Cl. ..117/47A, 106/1, 117/47 R, 1 17/54, 117/160 R 51 Int. Cl ..C23c 3/02 [58] Field of Search ..1 17/47 R, 47 A, 54, 160 R; 106/ l [56] References Cited UNITED STATES PATENTS 3,438,798 4/1969 Baudrand ..l17/160 R X 51 May 23,1972
Primary Examiner-Alfred L. Leavitt Assistant ExaminerJ. R. Batten, Jr. Attorney-Stevens, Davis, Miller & Mosher 5 7] ABSTRACT A process for depositing nickel on a non-metallic basis material from a chemical nickel plating bath containing a hypophosphite as a reducing agent to form a nickel coating on the basis material, the coating being indispensable for the practice of the subsequent electroplating, characterized in that the bath contains, as a second reducing agent, a member selected from the group .consisting of l-ascorbic acid, its salts, and any substances which will produce l-ascorbic acid when incorporated in the bath as one of the components thereof, thereby to eliminate the sensitizing pre-treatment required for the conventional processes for chemically plating a non-metallic basis material with nickel.
6 Claims, No Drawings ELECTROLESSLY NICKEL PLATING ON A NON- METALLIC BASIS MATERIAL This invention relates to a process for forming a preliminary metallic coating on a non'metallic substrate.
In order to electroplate a non-conductive, non-metallic basis material such as synthetic resin, glass, ceramics or the like, it is necessary to form a preliminary metallic coating on the basis material thereby making it electrically conductive for the subsequent electroplating.
Formation of such a preliminary metallic coating has generally been effected either by depositing nickel containing a small proportion of phosphorus on a surface to be coated from a conventional, chemical plating bath comprising nickel and hypophosphite ions, said nickel deposited being obtained by reducing the nickel ion with the hypophosphite ion, or by depositing copper on a surface to be coated from a conventional, chemical plating bath of copper-formalin type, said copper deposited being obtained by reducing copper ion with formalin.
More particularly, a typical conventional process for the formation of a preliminary coating comprises the steps of:
l. etching a basis material, which has previously been subjected to degreasing and other chemical treatments and, as required, mechanical treatments such as liquid honing and the like in order to effect the conditioning of the surface thereof, by immersing it in a mixed solution of chromic and hydrosulfuric acids (a basis material mechanically treated may be passed to the following step without being subjected to this etching step),
2. sensitizing the etched basis material by immersing it in a mixed solution of stannous chloride and hydrochloric acid,
3. activating the sensitized basis material by immersing it in a mixed solution of palladium chloride and hydrochloric acid, and
4. forming a preliminary metallic coating on the activated basis material by immersing it in a chemical plating bath containing nickel or copper ion and depositing the metal thereon from the bath by means of the reduction of the metallic ion, said preliminary metallic coating being useful for the subsequent electroplating because of its electric conductivity.
(It is needless to say that washing with water or with warmed water should be carried out after each of the abovementioned steps.)
The conventional chemical nickel plating baths, from which nickel may be deposited on a basis material to form a nickel coating thereon necessary fro the subsequent electroplating, generally have the following compositions:
Ammonium sulfate, g./l Succinic acid, g./l pH of bath 7.b-9.6. Temp. of bath, C 40-50 50-7 The nickel sulfate may be substituted by other soluble nickel salts, such as nickel chloride, in the amount equal to that of the sulfate, calculated as nickel.
The conventional process, when practiced, will require lots of experience in controlling the composition of the treating solution, the temperature and the immersing time used in each of the steps. Thus, even if it is carried out by workers considerably skilled in this field, it will tend to give products the metallic coating of which is deficient in tight adhesion to the basis material and uniform deposition of the metal thereon. in particular, if the treatment with a mixed solution of stannous chloride and hydrochloric acid is not conducted properly, the metallic coating to be formed will have a rough surface, no uniform brightness or brilliance and other disadvantages in addition to the previously mentioned deficiencies.
The process of this invention is characterized by the fact that the nickel-hypophosphite type chemical plating bath used contains another specific reducing agent thereby eliminating the sensitizing step and lessening the drawbacks the conventional preliminary metallic coatings have had.
The novel chemical nickel plating bath according to this invention is prepared by adding l-ascorbic acid as a second reducing agent to an aqueous solution comprising nickel ions, hypophosphite ions as a first reducing agent, and an organic acid. A non-metallic basis material which has been subjected to etching and activating treatments, is immersed in said novel bath to deposit thereon nickel containing a small proportion of phosphorus.
In the practice of the conventional, generally used, chemical nickel plating, when a non-metallic basis material with stannous ion adsorbed thereon in the sensitizing step is passed to the next activating step, the stannous ion will reduce palladium ion attached to the basis material in this step to metallic palladium. If, in this case, excess palladium ion is left unreacted on the basis material, it will be removed therefrom by the subsequent washing with water. The metallic palladium attached to the surface of the basis material will be catalytic nuclei in a nickel-reducing reaction, thereby depositing nickel on the basis material in the chemical nickel plating step. Thus, if the basis material be immersed in the plating bath after the activating treatment without the previous sensitizing treatment thereof, palladium ion will partly be carried with the basis material into the plating bath and will act as a catalyst to deposit nickel in fine particle form thereby forming on the basis material a nickel coating having a rough surface or, in some cases, decomposing the plating bath so that it is no longer usable as such. This is the reason why it is inevitable for even those considerably skilled in the art to often produce articles having a defective nickel coating, as previously mentioned.
L-ascorbic acid contained in a chemical plating bath according to this invention is considered to effect the selective reduction of palladium ion therewith prior to the commencement of the reduction of nickel ion with hypophosphite ion, thereby to prevent the palladium ion from diffusing in the plating bath. L-ascorbic acid may be contained in the bath in any desired amounts. However, the ascorbic acid used is in amounts of preferably 330 g/l, more preferably 5-20 g/l. The acid may be substituted by its salts or other substances which will produce l-ascorbic acid when added to the bath as one component thereof. The bath may be acidic or alkaline and, however, it is stable when acidic and is advantageously usable when having a pH value of 3-6, preferably 4-5.5. And the use of a bath having a pH value lower than 3 will cause the rate of depositing nickel from the bath to become lowered.
The temperature at which nickel is deposited on the basis material from the bath containing l-ascorbic acid or its equivalent as a second reducing agent, need not be varied owing to the presence of the second reducing agent in the bath and may be the same as that generally used in the conventional baths. Thus, it depends mainly upon the kind of a basis material to be plated and is generally in the range of room temperature to about 60 C, preferably about 40 to about 50 C.
This invention will be better understood by the following examples in each of which 10 pieces X 3 mm) of the plate of non-metallic basis material were used as test pieces to be plated.
EXAMPLE l Test pieces used were made of ABS (acrylonitrile-butadiene-styrene) (Plating Grade).
The test pieces were subjected to the following successive treatments:
l. Degreasing with a weak alkali,
2. Washing with water,
3. lmmersing in a treating solution for 40 minutes, the solution being prepared by adding 30 g of chromic anhydride to every 1 liter of a solution consisting of water and cone. H SO in a ratio by volume of 6 to 4 and being heated to 60 C,
4. Washing with water,
5. lmmersing, for 2 minutes, in a solution kept at room temperature and prepared by adding 0.1 g of palladium chloride and 0.1 cc of cone. BC! to 1.0 liter water,
6. Washing with water,
7. lmmersing, for 5 minutes, in a chemical plating bath at 40 C prepared by incorporating into 1.0 liter of water 20 g of nickel sulfate (heptahydrate), g of sodium hypophosphite (undecahydrate), 10 g of adipic acid and 10 g of sodium lascorbate and adjusting the pH value of the resulting solution to 6, and
8. Washing with water, in order to obtain the test pieces covered with a nickel layer or coating which is necessary for the subsequent electroplating.
(The electroplating generally is the one of copper-nickelchromium type. The compositions of baths, temperatures, current densities and the like used in the electroplating of said type are not shown here because they are not novel and can easily be determined by the skilled in the art, as required.)
The above-mentioned treatments or steps (1) to (6) are such that the conventional plating processes now in general use comprise them as a part of the steps thereof, although the treating solution used in each of the steps may vary in composition and temperature as desired.
Thus, in each of the following examples, there will be described only the steps in which operational conditions different from those used in Example 1 were used.
EXAMPLE 2 The same procedure as in Example 1 was followed except employing the test pieces made of polypropylene (Plating Grade) and the modified steps of (5') and (7') in each of which operational conditions used were different from those used in the corresponding step of Example 1. The modified steps were as follows:
5. lmmersing in a solution at 40 C, prepared by dissolving 1 gram of disodium palladium tetrachloride (Na PdCQ) in l liter of water, for 3 minutes, and
7. lmmersing, for 3 minutes, in a bath at 30 C prepared by adjusting to 8 with sodium carbonate the pH value of a solution comprising 16 g/l of nickel sulfate, 11 g/l of sodium hypophosphite, 6 g/l of citric acid, 2.5 g/l of borax and 3 g/l of l-ascorbic acid.
EXAMPLE 3 The procedure of Example 1 was repeated, but using pieces of glass as test pieces and substituting the steps (1) and (7) by modified steps (1) and (7" respectively. These modified steps were as follows:
1. Slightly roughening the surface of the test pieces by means ofliquid honing, and
7". lmmersing, for 3 minutes, in a bath at 60 C prepared by adjusting to 4 with sodium hydroxide the pH value of a solution comprising 20 g/l of nickel sulfate, 15 g/l of sodium hypophosphite, 15 g/l of sodium succinate and 30 g/l l-ascorbic acid.
EXAMPLE 4 The same procedure as in Example 1, but using test pieces made of epoxy resin and substituting the steps (1), (5), and (7) by modified ones I"), (5"), and (7"') respectively. The modified steps were shown below:
1. Slightly roughening the surface of the test pieces by means ofliquid honing,
5". lmmersing in a solution at 40 C comprising 0.3 g/l of hypophosphite and 5 g/l of l-ascorbic acid.
EXAMPLE 5 The procedure of Example I was repeated, but using test pieces made of styrol resin and replacing the steps (I), (5), and (7) by the modified ones l (5"'), and (7""), respectively. The modified steps were as follows:
1. Etching in a solution, at 40 C and an adjusted pH of 5.0, comprising 600 g/l of cone. hydrosulfuric acid, g/l of phosphoric acid, 300 g/l of water and 20 g/l of potassium dichromate, for a time length of 5 minutes,
5". lmmersing in an activating solution comprising 0.5 g/l of disodium palladium tetrachloride and 0.3 cc/] of hydrochloric acid, at room temperature for 3 minutes, and
7"". lmmersing in a chemical plating bath comprising 30 g/l of nickel chloride (hexahydrate), 10 g/l of sodium hypophosphite (monohydrate), 3 cc/l of lactic acid, 0.3 cc/l of propionic acid and 15 g/l of l-ascorbic acid, said immersion being effected at a temperature of 60 C for 2 minutes.
The 10 nickel-coated test pieces thus obtained in each of the examples, were all satisfactory in uniform coating and brilliance, without surface roughness.
The nickel-coated, ABS and polypropylene test pieces respectively obtained in Examples 1 and 2 were then electroplated with a metal such as nickel or copper. The overall metallic coating thus formed on the resinous test pieces adhered tightly thereto without causing peeling and creating blisters.
What is claimed is:
1. A process for forming a preliminary nickel coating on a non-metallic basis material comprising degreasing a non-metallic basis material with a weak alkali,
washing the degreased basis material with water,
etching the surface of the degreased basis material,
washing the etched basis material,
activating with a mixed solution of palladium chloride and HCl the etched basis material without previously sensitizing with a mixed solution of stannous chloride and HCl and then forming a preliminary nickel coating on the activated basis material by immersing the activated material in a chemical nickel plating bath, characterized in that the bath consists essentially of a second reducing agent selected from the group consisting of l-ascorbic acid and its salts,
in addition to nickel ions, hypophosphite ions as a first reducing agent, and an organic acid.
2. A process as claimed in claim 1, wherein the bath contains the second reducing agent in an amount of 330 g/l, calculated as l-ascorbic acid.
3. A process as claimed in claim 2, wherein the bath is at pH of 3-6.
4. A process as claimed in claim 3, wherein the bath is operated at a temperature of room temperature to about 60 C.
5. A process as claimed in claim 1, wherein the non-metallic basis material is a synthetic resin.
6. A process as claimed in claim 5, wherein the synthetic resin is selected from the group consisting of acrylonitrile-butadiene-styrene and polypropylene.
Claims (5)
- 2. A process as claimed in claim 1, wherein the bath contains the second reducing agent in an amount of 3- 30 g/l, calculated as l-ascorbic acid.
- 3. A process as claimed in claim 2, wherein the bath is at pH of 3- 6.
- 4. A process as claimed in claim 3, wherein the bath is operated at a temperature of room temperature to about 60* C.
- 5. A process as claimed in claim 1, wherein the non-metallic basis material is a synthetic resin.
- 6. A process as claimed in claim 5, wherein the synthetic resin is selected from the group consisting of acrylonitrile-butadiene-styrene and polypropylene.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8935768 | 1968-12-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3664860A true US3664860A (en) | 1972-05-23 |
Family
ID=13968445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US883311A Expired - Lifetime US3664860A (en) | 1968-12-06 | 1969-12-08 | Electrolessly nickel plating on a non-metallic basis material |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US3664860A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3962494A (en) * | 1971-07-29 | 1976-06-08 | Photocircuits Division Of Kollmorgan Corporation | Sensitized substrates for chemical metallization |
| US4036707A (en) * | 1975-08-29 | 1977-07-19 | Siemens Aktiengesellschaft | Method for metallizing thermosetting plastics |
| US6127052A (en) * | 1997-06-10 | 2000-10-03 | Canon Kabushiki Kaisha | Substrate and method for producing it |
| US20040017442A1 (en) * | 2002-06-27 | 2004-01-29 | Taku Hirasawa | Liquid discharge head and manufacturing method thereof |
| CN104445997A (en) * | 2014-09-09 | 2015-03-25 | 福建省飞阳光电有限公司 | Method for performing chemical nickel plating on surface of capacitive touch screen |
| US10092292B2 (en) | 2013-02-28 | 2018-10-09 | Ethicon Llc | Staple forming features for surgical stapling instrument |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3370974A (en) * | 1965-10-20 | 1968-02-27 | Ivan C. Hepfer | Electroless plating on non-conductive materials |
| US3423226A (en) * | 1965-06-28 | 1969-01-21 | Mc Donnell Douglas Corp | Plating of non-metallic bodies |
| US3437507A (en) * | 1965-07-16 | 1969-04-08 | Mc Donnell Douglas Corp | Plating of substrates |
| US3438798A (en) * | 1965-08-23 | 1969-04-15 | Arp Inc | Electroless plating process |
| US3507681A (en) * | 1967-06-02 | 1970-04-21 | Mine Safety Appliances Co | Metal plating of plastics |
| US3515649A (en) * | 1967-05-02 | 1970-06-02 | Ivan C Hepfer | Pre-plating conditioning process |
| US3597267A (en) * | 1969-02-26 | 1971-08-03 | Allied Res Prod Inc | Bath and process for chemical metal plating |
-
1969
- 1969-12-08 US US883311A patent/US3664860A/en not_active Expired - Lifetime
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3423226A (en) * | 1965-06-28 | 1969-01-21 | Mc Donnell Douglas Corp | Plating of non-metallic bodies |
| US3437507A (en) * | 1965-07-16 | 1969-04-08 | Mc Donnell Douglas Corp | Plating of substrates |
| US3438798A (en) * | 1965-08-23 | 1969-04-15 | Arp Inc | Electroless plating process |
| US3370974A (en) * | 1965-10-20 | 1968-02-27 | Ivan C. Hepfer | Electroless plating on non-conductive materials |
| US3515649A (en) * | 1967-05-02 | 1970-06-02 | Ivan C Hepfer | Pre-plating conditioning process |
| US3507681A (en) * | 1967-06-02 | 1970-04-21 | Mine Safety Appliances Co | Metal plating of plastics |
| US3597267A (en) * | 1969-02-26 | 1971-08-03 | Allied Res Prod Inc | Bath and process for chemical metal plating |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3962494A (en) * | 1971-07-29 | 1976-06-08 | Photocircuits Division Of Kollmorgan Corporation | Sensitized substrates for chemical metallization |
| US4036707A (en) * | 1975-08-29 | 1977-07-19 | Siemens Aktiengesellschaft | Method for metallizing thermosetting plastics |
| US6127052A (en) * | 1997-06-10 | 2000-10-03 | Canon Kabushiki Kaisha | Substrate and method for producing it |
| US20040017442A1 (en) * | 2002-06-27 | 2004-01-29 | Taku Hirasawa | Liquid discharge head and manufacturing method thereof |
| US6886922B2 (en) * | 2002-06-27 | 2005-05-03 | Matsushita Electric Industrial Co., Ltd. | Liquid discharge head and manufacturing method thereof |
| CN1308146C (en) * | 2002-06-27 | 2007-04-04 | 松下电器产业株式会社 | Liquid spraying nozzle and producing method thereof |
| US10092292B2 (en) | 2013-02-28 | 2018-10-09 | Ethicon Llc | Staple forming features for surgical stapling instrument |
| CN104445997A (en) * | 2014-09-09 | 2015-03-25 | 福建省飞阳光电有限公司 | Method for performing chemical nickel plating on surface of capacitive touch screen |
| CN104445997B (en) * | 2014-09-09 | 2017-02-08 | 福建省飞阳光电股份有限公司 | Method for performing chemical nickel plating on surface of capacitive touch screen |
Also Published As
| Publication number | Publication date |
|---|---|
| DE1960964A1 (en) | 1970-07-16 |
| DE1960964B2 (en) | 1972-10-12 |
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