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Referenced by

Citing PatentFiling dateIssue dateOriginal AssigneeTitle
US39331875 Mar 197420 Jan 1976Stromberg-Carlson CorporationControlled epoxy dispensing technique as related to transistor chip bonding
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US479850221 Aug 198717 Jan 1989Lily CorporationCorner grouting nozzle
US492510016 Aug 198915 May 1990American National Can CompanyMethods and apparatus for injection molding and injection blow molding multi-layer articles, and articles made thereby
US49709851 May 198920 Nov 1990Slautterback CorporationApparatus for tailing reduction in hot-melt dispensing of droplet patterns
US50372853 Aug 19906 Aug 1991American National Can CompanyApparatus for injection molding and injection blow molding multi-layer articles
US506291916 Apr 19905 Nov 1991Grafotec Kotterer GmbHMethod and an apparatus for bonding together at least two running lengths of material
US552304518 Nov 19944 Jun 1996American National Can CompanyMethods for injection molding and blow-molding multi-layer plastic articles
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US568375217 May 19954 Nov 1997Kimberly-Clark Worldwide, Inc.Apparatus and methods for selectively controlling a spray of liquid to form a distinct pattern
US585377229 May 199629 Dec 1998American National Can CompanyMethods and apparatus for injection molding and injection blow molding multi-layer articles, and the articles made thereby
US596855831 May 199619 Oct 1999American National CanApparatus for injection molding and injection blow molding multi-layer articles
US603700914 Apr 199514 Mar 2000Kimberly-Clark Worldwide, Inc.Method for spraying adhesive
US612996016 Mar 199910 Oct 2000Pechiney Plastic Packaging, Inc.Methods and apparatus for injection molding and injection blow molding multi-layer plastic and the articles made thereby
US619404129 May 199627 Feb 2001American National Can CompanyMethods and apparatus for injection molding and injection blow molding multi-layer articles, and the articles made thereby
US633276715 Mar 200025 Dec 2001Pechiney Emballage Flexible EuropeApparatus for injection molding multi-layer articles