US3496617A - Technique for curving piezoelectric ceramics - Google Patents

Technique for curving piezoelectric ceramics Download PDF

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Publication number
US3496617A
US3496617A US681467A US3496617DA US3496617A US 3496617 A US3496617 A US 3496617A US 681467 A US681467 A US 681467A US 3496617D A US3496617D A US 3496617DA US 3496617 A US3496617 A US 3496617A
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transducer
sheet
electrode
piezoelectric
posts
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US681467A
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Rufus L Cook
Jesse L Bealor Jr
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US Department of Navy
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US Department of Navy
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H04R17/04—Gramophone pick-ups using a stylus; Recorders using a stylus
    • H04R17/08—Gramophone pick-ups using a stylus; Recorders using a stylus signals being recorded or played back by vibration of a stylus in two orthogonal directions simultaneously
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/4979—Breaking through weakened portion

Definitions

  • transducer manufacture it is frequently desired to produce a transducer having a curved face.
  • Such transducers are useful to obtain desired response patterns and specified directivity patterns.
  • curved face transducers have been made by careful fitting of individual crystal elements on a suitable mounting.
  • assembly methods while compatible with laboratory use, are prohibitively time consuming and require too greatl a degree of mechanical skill to permit economical manufacture in quantities needed for universal employment in the sonar and related underwater fields.
  • the prior art in order to obtain the aforesaid directivity and response of vthe expensive and scarce transducer, frequently employed special transducer'housings or phased arrays of planarl transducers.
  • this invention has as its object the economical manufacture of a curved face piezoelectric transducer of high uniformity.
  • this invention has as its object the manufacture of a piezoelectric transducer having a curved face arrangement using an especially manufactured planiform piezoelectric element.
  • a further object of this invention is the manufacture of a curved face piezoelectric transducer, including the steps United States APatent O rice
  • FIG. 2 shows the transducer stock after dicing.
  • FIG. 3 illustrates a hypothetical edge view of the trans ducer stock in curved configuration.
  • the first step in the production of the improved transducer is the contiguous placement of an electrode stock and a rigid phenolic backing sheet.
  • the electrode may be on any suitable conducting sheet or web material such as, in one preferred embodiment, a mesh of nickel wire having a thickness of 0.002 inch.
  • the phenolic sheet is used as a mechanical stabilizing support and is non-critical in dimension. Sheets having a thickness between 0.00 and 0.031 inch have been employed successfully.
  • the electrode stock material is next wet with a layer of liquid solder to prepare the electrode to receive the piezoelectric crystal and also to affix the electrode to the phenolic sheet.
  • a bar or sheet of piezoelectric material of the desired thickness and having parallel faces with silvered surfaces is placed on this liquid solder layer.
  • the piezoelectric material may be barium or lead titanate, lead niobate, or any known electrostrictive material.
  • the solder is allowed to cure thereby bonding the electrode-phenolic sheet to the piezoelectric material.
  • the bond both mechanical and electrical, may be enhanced with the application of pressure during curingI of the solder bond. This pressure may be applied by conventional means known in the laminating arts or simply yby the application of a weight resting on the piezoelectric bar or sheet.
  • the next, or third, step in the production of the curved face transducer includes the cutting of the piezoelectricmaterial-electrode-phenolic-sheet lamina to form a plurality of posts of a specified shape which extend nearly, but not completely, through the layer of piezoelectric material,
  • This removal may be accomplished employing mechanicall means such as a sharp edged prying tool, or by the use of a chemical solvent, if desired.
  • a iiexible epoxy backing sheet is next joined to the lamina in the place formerly occupied by the rigid phenolic sheet. This joining is effected fby the use of a chemical bonding agent such as a contact cement known as Eastman 910, for example.
  • the epoxy sheet may also be formed in situ by using a liquid known as Scotch Cast 8.
  • Other known methods of providing the epoxy sheet may be employed as recognized by one proficient in the transducer art, the requirements that layer be exible, resilient, and possess a low rate of moisture absorption being the only criteria to be satisfied.
  • FIG. 2 illustrates, not to scale, the assembled, diced piezoelectric crystal 11, electrode 12, and epoxy backing sheet 13. It has been discovered that the individual posts of this assembly may be sheared apart without separation from the electrode or epoxy sheet by a slight wedging action from a tapered-angle blade. It is, of course, possible to employ other shearing devices, and for larger production runs a suitable wedging type device could be devised to separate several rows of posts at one time.
  • the diced, sheared crystal array may now be mounted on a curved form in such a fashion that individual posts project at right angles to the surface of the form, which may be a mold part. Because of their uniform thickness the opposite faces of the posts lie in a similar curve.
  • the curve may be any desired configuration including other than figures of revolution or conics.
  • a gentle yielding pressure means such as afforded by a hand, is used in the assembly. If the form or mold is not to be a permanent part of the transducer, a temporary adhesive is used between the epoxy sheet and the form. If the form is to be a permanent part of the transducer, a similar joining technique to that used in aixing the epoxy sheet to the crystal array may be used.
  • Electrodes are next applied to the two electrodes using conventional fasteners or electrical joining techniques if the device is to be completely encased.
  • the electrodes may serve as external conductors, if desired, in some applications.
  • the entire assembly may next be molded, potted, or encased in an acoustically transparent compound and shaped to fit enclosures or other environmental placements.
  • Either of the curved faces may be used as a radiator or receiver of acoustic energy and, therefore, concave or convex faced transducers may be made according to the teaching of this invention.
  • This invention results in a transducer not readily obtainable by prior art methods. These transducers are applicable to a wide range of uses and have given improved results over prior art constructions in many of these applications.
  • Uses of the device include high frequency sonar surveillance and detection devices, -bottom following devices, depth indicator devices, directional scanning systems, bottom formations determining devices, to mention a few. These results are obtained by using conventional planar stock materials and material working techniques and are demonstrably better and more uniform than the results obtained with the more costly and cumbersome prior art devices.
  • a method as in claim 1 wherein said mounting of said first electrode includes the step of adhering said first electrode and said rigid support with liquid solder.
  • a method according to claim 1 where the step of mounting said sheet of piezoelectric material includes the application of pressure sufficient to ensure mechanical and electrical bonding.
  • a method according to claim 2 where the step of mounting said sheet of piezoelectric material includes the application of pressure suicient to ensure mechanical and electrical bonding.
  • a method according to claim 1 further comprising the step of attaching conductors to said first and second electrodes before encasing the assembly.
  • a method according to claim 8 further comprising the step of attaching conductors to said first and second electrodes before encasing the assembly.

Description

Feb. 24,1970 l R, CQCK mL 3,496,611
TECHNIQUE FOR CURVIHG PIEZOELECTRIC CERAMICS ,QM /War 2y I l`=b-24..19'10l n. l.. cw( er 3,496,611
TEclmIQUE Fon conv-11N@ PIEzoELEcTnIc cEnAmIcs med Nov. e. 1967 4 2 sheets-sheet Ruf-fus 1.. 'coo/r JESSE L. BEA/.om JR.
INVENTORS U.S. Cl. 29--25.35 10 Claims ABSTRACT OF THE DISCLOSURE A method of processing a curved face piezoelectric transducer in which a diced crystal sheet with one electrode attached is formed into a curved configuration by fracturing the crystal, a second electrode is applied, and the assembly is then made rigid.
The invention described herein may be manufactured and used by or for the Government of the United States of "America for governmental purposes without the payment of any royalties thereon or therefor.
In the are of transducer manufacture it is frequently desired to produce a transducer having a curved face. Such transducers are useful to obtain desired response patterns and specified directivity patterns. In the past, such curved face transducers have been made by careful fitting of individual crystal elements on a suitable mounting. Such assembly methods, while compatible with laboratory use, are prohibitively time consuming and require too greatl a degree of mechanical skill to permit economical manufacture in quantities needed for universal employment in the sonar and related underwater fields. The prior art, in order to obtain the aforesaid directivity and response of vthe expensive and scarce transducer, frequently employed special transducer'housings or phased arrays of planarl transducers. Another problem prevalent in hand constructed curved face transducers was the lack of uniformity between units.V Although produced to-meet the same design standard, the many precision measurements and positioning steps used in the manufacture of a curved face transducer caused accumulative errors in each transducer produced, such that a considerable variation in performance between units was found to exist. Such variations cause operational problems and require lengthy calibration procedures.
The manufacture of a curved face transducer by grindlng or otherwise figuring the surface of a piezoelectric crystal array or single crystal results in a transducer of mediocre quality because of problems in maintaining the very exacting tolerances -in thickness. Further, Vany convenient grinding means is limited to easily generated curves of revolution and generally conic curves.
Considering the aforementioned state of the prior art, this invention has as its object the economical manufacture of a curved face piezoelectric transducer of high uniformity.
More particularly, this invention has as its object the manufacture of a piezoelectric transducer having a curved face arrangement using an especially manufactured planiform piezoelectric element.
A further object of this invention is the manufacture of a curved face piezoelectric transducer, including the steps United States APatent O rice FIG. 2 shows the transducer stock after dicing.
FIG. 3 illustrates a hypothetical edge view of the trans ducer stock in curved configuration.
Referring to FIG. l, which shows a fiow sheet, or block diagram, of the steps used in the practice of the method of this invention, the first step in the production of the improved transducer is the contiguous placement of an electrode stock and a rigid phenolic backing sheet. The electrode may be on any suitable conducting sheet or web material such as, in one preferred embodiment, a mesh of nickel wire having a thickness of 0.002 inch. The phenolic sheet is used as a mechanical stabilizing support and is non-critical in dimension. Sheets having a thickness between 0.00 and 0.031 inch have been employed successfully.
The electrode stock material is next wet with a layer of liquid solder to prepare the electrode to receive the piezoelectric crystal and also to affix the electrode to the phenolic sheet. A bar or sheet of piezoelectric material of the desired thickness and having parallel faces with silvered surfaces is placed on this liquid solder layer. The piezoelectric material may be barium or lead titanate, lead niobate, or any known electrostrictive material. The solder is allowed to cure thereby bonding the electrode-phenolic sheet to the piezoelectric material. The bond, both mechanical and electrical, may be enhanced with the application of pressure during curingI of the solder bond. This pressure may be applied by conventional means known in the laminating arts or simply yby the application of a weight resting on the piezoelectric bar or sheet.
The next, or third, step in the production of the curved face transducer includes the cutting of the piezoelectricmaterial-electrode-phenolic-sheet lamina to form a plurality of posts of a specified shape which extend nearly, but not completely, through the layer of piezoelectric material,
.. depths of cut ranging between 95% and 98% of the material thickness have proven satisfactory. This cutting, known in the art as dicing, may be performed with an suitable crystal working means, a circular, high-speed, diamond saw and an endless-wire cutting tool having been `2 employed by the inventors successfully. The size, shape,
and number of posts cut are determined as design parameters dependent upon directivity, frequency, and material coupling desired in the final transducer, and are' de-l termined by the spacing and configuration of the individual cuts. Such considerations are understood, normal design parameters appreciated by persons skilled in the transducer art and, of themselves, formV no direct part of this invention. l e v The next step in the practice of the method of 'the invention is the removal of the phenolic backing sheet.
of curving a planiform sheet to an aconic shaping surface.
This removal may be accomplished employing mechanicall means such as a sharp edged prying tool, or by the use of a chemical solvent, if desired.
A iiexible epoxy backing sheet is next joined to the lamina in the place formerly occupied by the rigid phenolic sheet. This joining is effected fby the use of a chemical bonding agent such as a contact cement known as Eastman 910, for example. The epoxy sheet may also be formed in situ by using a liquid known as Scotch Cast 8. Other known methods of providing the epoxy sheet may be employed as recognized by one proficient in the transducer art, the requirements that layer be exible, resilient, and possess a low rate of moisture absorption being the only criteria to be satisfied.
FIG. 2 illustrates, not to scale, the assembled, diced piezoelectric crystal 11, electrode 12, and epoxy backing sheet 13. It has been discovered that the individual posts of this assembly may be sheared apart without separation from the electrode or epoxy sheet by a slight wedging action from a tapered-angle blade. It is, of course, possible to employ other shearing devices, and for larger production runs a suitable wedging type device could be devised to separate several rows of posts at one time.
The diced, sheared crystal array may now be mounted on a curved form in such a fashion that individual posts project at right angles to the surface of the form, which may be a mold part. Because of their uniform thickness the opposite faces of the posts lie in a similar curve. The curve may be any desired configuration including other than figures of revolution or conics. A gentle yielding pressure means, such as afforded by a hand, is used in the assembly. If the form or mold is not to be a permanent part of the transducer, a temporary adhesive is used between the epoxy sheet and the form. If the form is to be a permanent part of the transducer, a similar joining technique to that used in aixing the epoxy sheet to the crystal array may be used.
v erally of the same construction as the electrode previously applied.
Electrical conductors are next applied to the two electrodes using conventional fasteners or electrical joining techniques if the device is to be completely encased. The electrodes may serve as external conductors, if desired, in some applications.
The entire assembly may next be molded, potted, or encased in an acoustically transparent compound and shaped to fit enclosures or other environmental placements.
Either of the curved faces may be used as a radiator or receiver of acoustic energy and, therefore, concave or convex faced transducers may be made according to the teaching of this invention.
This invention results in a transducer not readily obtainable by prior art methods. These transducers are applicable to a wide range of uses and have given improved results over prior art constructions in many of these applications. Uses of the device include high frequency sonar surveillance and detection devices, -bottom following devices, depth indicator devices, directional scanning systems, bottom formations determining devices, to mention a few. These results are obtained by using conventional planar stock materials and material working techniques and are demonstrably better and more uniform than the results obtained with the more costly and cumbersome prior art devices.
Obviously, other embodiments and modifications of the subject invention will readily come to the mind of one skilled in the art having the benefit of the teachings presented in the foregoing description and the drawings.
What is claimed is:
1. The method of manufacture of an improved transducer comprising the steps of:
mounting a first planar electrode on a rigid support,
mounting a sheet of piezoelectric material on said elec trode,
cutting said piezoelectric material into posts with a height slightly less than that of the thickness of the piezoelectric material,
removing the rigid support,
applying a flexible support to said first electrode,
shearing the posts apart in such a manner to leave the posts attached to the electrode and exible support, mounting the iiexible support, with posts attached, on
a suitably shaped form,
attaching a second electrode to said piezoelectric posts,
encasing said mounted posts and two-electrode assembly in an acoustically transparent medium.
2. A method as in claim 1 wherein said mounting of said first electrode includes the step of adhering said first electrode and said rigid support with liquid solder.
3. A method according to claim 1 where the step of mounting said sheet of piezoelectric material includes the application of pressure suficient to ensure mechanical and electrical bonding.
4. A method according to claim 2 where the step of mounting said sheet of piezoelectric material includes the application of pressure suicient to ensure mechanical and electrical bonding.
5. A method according to claim 1 in which said cutting includes sawing cuts of a depth between and 98% of the thickness of the piezoelectric material.
6. A method according to claim 4 in which said cutting includes sawing cuts of a depth 'between 95% and 98% of the thickness of the piezoelectric material.
7. A method according to claim 1 in which said flexible support is cemented to said first electrode.
8. A method according to claim 6 in which said flexible support is cemented to said first electrode.
9. A method according to claim 1 further comprising the step of attaching conductors to said first and second electrodes before encasing the assembly.
10. A method according to claim 8 further comprising the step of attaching conductors to said first and second electrodes before encasing the assembly.
References Cited UNITED STATES PATENTS 3,196,524 7/1965 Jamison 29-573 3,370,186 2/1968 Antonevich 3l0--8.2
JOHN F. CAMPBELL, Primary Examiner R. W. CHURCH, Assistant Examiner U.S. Cl. X.R.
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Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3663933A (en) * 1970-07-02 1972-05-16 Us Navy Protective band for bilaminar transducer with slotted spacer ring
US3691630A (en) * 1969-12-10 1972-09-19 James E Burgess Method for supporting a slow wave circuit via an array of dielectric posts
US3698051A (en) * 1970-02-06 1972-10-17 North American Rockwell Method of making an acoustical transducer
US3833825A (en) * 1973-04-11 1974-09-03 Honeywell Inc Wide-band electroacoustic transducer
US3854060A (en) * 1973-10-12 1974-12-10 Us Navy Transducer for fm sonar application
US3914846A (en) * 1972-06-15 1975-10-28 Us Navy High density InSb PV IR detectors
US3953919A (en) * 1974-01-18 1976-05-04 The Lucas Electrical Company Limited Method of manufacturing semi-conductor devices
US3979711A (en) * 1974-06-17 1976-09-07 The Board Of Trustees Of Leland Stanford Junior University Ultrasonic transducer array and imaging system
FR2520936A1 (en) * 1982-01-29 1983-08-05 Thomson Csf METHOD FOR THE COLLECTIVE MANUFACTURE OF PIEZOELECTRIC TRANSDUCERS, TRANSDUCERS OBTAINED BY THIS METHOD AND USE OF SUCH A METHOD
US4398116A (en) * 1981-04-30 1983-08-09 Siemens Gammasonics, Inc. Transducer for electronic focal scanning in an ultrasound imaging device
US4398325A (en) * 1980-06-25 1983-08-16 Commissariat A L'energie Atomique Process for producing ultrasonic transducers having complex shapes
US4564980A (en) * 1980-06-06 1986-01-21 Siemens Aktiengesellschaft Ultrasonic transducer system and manufacturing method
US4686408A (en) * 1983-12-08 1987-08-11 Kabushiki Kaisha Toshiba Curvilinear array of ultrasonic transducers
EP0150634B1 (en) * 1983-10-18 1988-06-01 Cgr Ultrasonic Transducer for ultrasonic echography provided with an array of elements forming a convex surface
EP0351015A2 (en) * 1988-07-15 1990-01-17 Koninklijke Philips Electronics N.V. A method for fabricating a piezoelectric composite transducer
US4992692A (en) * 1989-05-16 1991-02-12 Hewlett-Packard Company Annular array sensors
US5440801A (en) * 1994-03-03 1995-08-15 Composite Optics, Inc. Composite antenna
US5802195A (en) * 1994-10-11 1998-09-01 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration High displacement solid state ferroelectric loudspeaker
US5931684A (en) * 1997-09-19 1999-08-03 Hewlett-Packard Company Compact electrical connections for ultrasonic transducers
US5977691A (en) * 1998-02-10 1999-11-02 Hewlett-Packard Company Element interconnections for multiple aperture transducers
US5990598A (en) * 1997-09-23 1999-11-23 Hewlett-Packard Company Segment connections for multiple elevation transducers
US6155982A (en) * 1999-04-09 2000-12-05 Hunt; Thomas J Multiple sub-array transducer for improved data acquisition in ultrasonic imaging systems

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3196524A (en) * 1961-04-18 1965-07-27 Carrier Corp Thermoelectric cooling devices and method of making the same
US3370186A (en) * 1965-02-05 1968-02-20 Blackstone Corp Ultrasonic transducers

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3196524A (en) * 1961-04-18 1965-07-27 Carrier Corp Thermoelectric cooling devices and method of making the same
US3370186A (en) * 1965-02-05 1968-02-20 Blackstone Corp Ultrasonic transducers

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3691630A (en) * 1969-12-10 1972-09-19 James E Burgess Method for supporting a slow wave circuit via an array of dielectric posts
US3698051A (en) * 1970-02-06 1972-10-17 North American Rockwell Method of making an acoustical transducer
US3663933A (en) * 1970-07-02 1972-05-16 Us Navy Protective band for bilaminar transducer with slotted spacer ring
US3914846A (en) * 1972-06-15 1975-10-28 Us Navy High density InSb PV IR detectors
US3833825A (en) * 1973-04-11 1974-09-03 Honeywell Inc Wide-band electroacoustic transducer
US3854060A (en) * 1973-10-12 1974-12-10 Us Navy Transducer for fm sonar application
US3953919A (en) * 1974-01-18 1976-05-04 The Lucas Electrical Company Limited Method of manufacturing semi-conductor devices
US3979711A (en) * 1974-06-17 1976-09-07 The Board Of Trustees Of Leland Stanford Junior University Ultrasonic transducer array and imaging system
US4564980A (en) * 1980-06-06 1986-01-21 Siemens Aktiengesellschaft Ultrasonic transducer system and manufacturing method
US4398325A (en) * 1980-06-25 1983-08-16 Commissariat A L'energie Atomique Process for producing ultrasonic transducers having complex shapes
US4398116A (en) * 1981-04-30 1983-08-09 Siemens Gammasonics, Inc. Transducer for electronic focal scanning in an ultrasound imaging device
EP0085599A3 (en) * 1982-01-29 1983-11-02 Thomson-Csf Method for mass-manufacturing piezoelectric transducers, transducers made by this method and utilisation of this method
FR2520936A1 (en) * 1982-01-29 1983-08-05 Thomson Csf METHOD FOR THE COLLECTIVE MANUFACTURE OF PIEZOELECTRIC TRANSDUCERS, TRANSDUCERS OBTAINED BY THIS METHOD AND USE OF SUCH A METHOD
EP0085599A2 (en) * 1982-01-29 1983-08-10 Thomson-Csf Method for mass-manufacturing piezoelectric transducers, transducers made by this method and utilisation of this method
EP0150634B1 (en) * 1983-10-18 1988-06-01 Cgr Ultrasonic Transducer for ultrasonic echography provided with an array of elements forming a convex surface
US4686408A (en) * 1983-12-08 1987-08-11 Kabushiki Kaisha Toshiba Curvilinear array of ultrasonic transducers
US4734963A (en) * 1983-12-08 1988-04-05 Kabushiki Kaisha Toshiba Method of manufacturing a curvilinear array of ultrasonic transducers
EP0351015A3 (en) * 1988-07-15 1991-09-25 Koninklijke Philips Electronics N.V. A method for fabricating a piezoelectric composite transducer
EP0351015A2 (en) * 1988-07-15 1990-01-17 Koninklijke Philips Electronics N.V. A method for fabricating a piezoelectric composite transducer
US4992692A (en) * 1989-05-16 1991-02-12 Hewlett-Packard Company Annular array sensors
US5440801A (en) * 1994-03-03 1995-08-15 Composite Optics, Inc. Composite antenna
US5771027A (en) * 1994-03-03 1998-06-23 Composite Optics, Inc. Composite antenna
US5802195A (en) * 1994-10-11 1998-09-01 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration High displacement solid state ferroelectric loudspeaker
US5931684A (en) * 1997-09-19 1999-08-03 Hewlett-Packard Company Compact electrical connections for ultrasonic transducers
US5990598A (en) * 1997-09-23 1999-11-23 Hewlett-Packard Company Segment connections for multiple elevation transducers
US5977691A (en) * 1998-02-10 1999-11-02 Hewlett-Packard Company Element interconnections for multiple aperture transducers
US6155982A (en) * 1999-04-09 2000-12-05 Hunt; Thomas J Multiple sub-array transducer for improved data acquisition in ultrasonic imaging systems

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