US3466423A - Thermal half-select printing matrix - Google Patents

Thermal half-select printing matrix Download PDF

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Publication number
US3466423A
US3466423A US646888A US3466423DA US3466423A US 3466423 A US3466423 A US 3466423A US 646888 A US646888 A US 646888A US 3466423D A US3466423D A US 3466423DA US 3466423 A US3466423 A US 3466423A
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printing
thermal
matrix
electrically resistive
elements
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US646888A
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John L Janning
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NCR Voyix Corp
National Cash Register Co
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NCR Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33555—Structure of thermal heads characterised by type
    • B41J2/3357—Surface type resistors

Definitions

  • thermal printing matrices employed in the prior art must have an isolation diode for each electrical selection conductor that is employed in order to prevent sneak currents and to isolate one matrix element from another.
  • the thermal half-select printing matrices of the present invention eliminate the necessity of supplying an isolation diode for each electrically resistive thermal printing conductor of a thermal printing matrix.
  • Thermal half-select printing is accomplished by coincident current energization of electrically resistive thermal printing elements.
  • FIGURE 1 is a perspective view of one embodiment of the present invention, in which row andcolumn electrically resistive thermal printing conductors "are located on separate substrates.
  • FIGURE 2 is a perspective view of another embodiment of the present invention, in which row and column electrically resistive thermal printing conductors are located on a common substrate.
  • FIGURE 3 is a perspective view of an alternate electrically resistive thermal printing conductor.
  • thermal half-select printing matrices of the present invention are constructed for use with thermally sensitive record material.
  • a thin electrically insulating substrate 10 which may be of any electrically insulating material, such as silicon dioxide, which is not subject to rapid heat diffusion from a heated point on the substrate, is employed.
  • the thin electrically insulating substrate should be on the order of one thousandth of an inch thick.
  • the complete thermal printing member 11 is then mounted on a rigid support board 13.
  • Electrically resistive thermal printing conductors which are on the order of 16 thousandths to 70 thousandths of an inch wide and on the order of 4 millionths of an inch thick, and which are composed of an electrically resistive material such as tin oxide, Nichrome, rhenium, tantalum, or other such materials, are aligned into columns 12 on one side of the substrate 10 and into rows 14 on the other side of the substrate 10.
  • an electrically resistive material such as tin oxide, Nichrome, rhenium, tantalum, or other such materials
  • Coincident electrical current is supplied by the current supply means 21 and 23 and the selection grounding transistors 27 and 29, which are selectively saturated when supplied with positive voltage selection signals on their bases. For example, if an electrical current is passed through the column conductor 15 coincidentally with an electrical current through the row conductor 16, the radiated energy at the matrix location 22 due to the current in each of the conductors 15 and 16 will add, and, consequently, printing will occur on the thermally sensitive paper 31 at this location if the thermal threshold of the thermally sensitive paper is exceeded. Energization of only one conductor will not produce sufficient energy at a matrix location to exceed the thermal threshold of the thermally sensitive paper 31. At other points of the matrix, such as the matrix points 24 and 26, where only the current through either a row conductor or a column conductor generates energy, the thermal printing threshold of the heat-sensitive paper is not exceeded, and, therefore, printing does not occur at these points.
  • the thermal printing paper 31 may be placed in proximity with the exposed side of the electrically insulating film substrate 10.
  • the optimum operating characteristics are found to exist when the heat-sensitive paper 31 is positioned in its thermal printing position and the current through a column conductor is increased until printing occurs as the result of energy through the column conductor only. The current through the column conductor is then reduced by approximately 10%. The same procedure is then followed for determining the optimum operating point of a row conductor.
  • FIGURE 1 shows another embodiment of the present invention, in which row conductors 30 are secured on one side of an electrically insulating substrate 28.
  • the substrate 28 is then placed behind the non-thermally sensitive side of the thermally sensitive paper 32.
  • Column conductors 36 of an electrically resistive material are secured on one side of another electrically insulating substrate 34.
  • the substrate 34 is positioned on the front, or heat-sensitive, side of the thermally sensitive paper 32.
  • the row and column conductors may be interchanged if desired.
  • the same procedure for obtaining the optimum operating characteristics which was described in conjunction with the embodiment of FIGURE 2 may also be employed in connection with the embodiment of FIGURE 1.
  • FIGURE 3 shows an alternate electrically resistive conductor 17, which may replace the row conductors or the column conductors of the embodiments of FIGURES 1 and 2.
  • This conductor 17 consists of alternate areas 19 of an electrically conductive material, such as copper or gold, which are deposited over an electrically resistive substrate material 18, such as tin oxide, etc.
  • the deposited conductive material 19 reduces the resistance along portions of the conductor 17 in which no print is desired; therefore the total energy loss of the conductor 17 is reduced, and, in addition, printing is more accurately confined tothe desired printing areas 25.
  • External electrical connections are made to the conductive areas 37 and 39 by the conductive leads 41 and 43, respectively.
  • a thermal printing device for printing on a thermallysensitive record material comprising:
  • (c) means to selectively supply electrical current through printing elements of the first and second sets of electrically resistive printing elements, to achieve printing on a thermally-sensitive record material that is positioned adjacent the matrix of thermal printing locations in the vicinity of those thermal printing locations which are formed by an intersecting portion of a printing element of the first set and an intersecting portion of a printing element of the second set when both of the crossing printing elements at a thermal printing location are coincidentally conducting current, wherein the electrically resistive printing elements of at least one of the sets of the printing elements each comprises an electrically conductive path of alternately arranged high-resistance portions and low-resistance portions, and the high-resistance portions define the thermal printing locations of the matrix.
  • a thermal printing device for printing on a thermallysensitive record material comprising:
  • (c) means to selectively supply electrical current through printing elements of the first and second sets of electrically resistive printing elements, to achieve printing on a thermally-sensitive record material that is positioned adjacent the matrix of thermal printing locations in the vicinity of those thermal printing locations which are formed by an intersecting portion of a printing element of the first set and an intersectments crossing the first set of printing elements, to form a matrix of thermal printing locations at those portions of the printing elements which intersect, and
  • (c) means to selectively supply electrical current through printing elements of the first and second sets of electrically resistive printing elements, to achieve printing on a thermally-sensitive record material that is positioned adjacent the matrix of thermal printing locations in the vicinity of those thermal printing locations which are formed by an intersecting portion of a printing element of the first set and an intersecting portion of a printing element of the second set when both of the crossing printing elements at a thermal printing location are coincidentally conducting current, wherein the first set of electrically resistive printing elements is mounted on one side of a non-conductive substrate, and the second set of electrically resistive elements is mounted on the other side of the non-conductive substrate, and the electrically resistive printing elements of at least one of the sets of the printing elements each comprises an electrically conductive path of alternately arranged high-resistance portions and low-resistance portions, and the high-resistance portions define the thermal printing locations of the matrix.
  • a thermal printing device for printing on a thermallysensitive record material comprising:

Description

p 1969 J. L. JANNING THERMAL HALF-SELECT PRINTING MATRIX Filed June 19, 1967 INVENTOR JOHN L. JANNING BY Q 3 W44 .W W W H15 ATTORNEYS United States Patent 3,466,423 THERMAL HALF-SELECT PRINTING MATRIX John L. Janning, Dayton, Ohio, assignor to The National Cash Register Company, Dayton, Ohio, a corporation of Maryland Filed June 19, 1967, Ser. No. 646,888 Int. Cl. Hb 3/02 US. Cl. 219-216 3 Claims ABSTRACT OF THE DISCLOSURE Thermal half-select printing matrices in which printing on an adjacent heat-sensitive material occurs only at those matrix points which have coincident electrical current flowing through crossing electrically resistive thermal printing conductors which define those points.
Background of the invention Full-select thermal printing matrices employed in the prior art must have an isolation diode for each electrical selection conductor that is employed in order to prevent sneak currents and to isolate one matrix element from another. The thermal half-select printing matrices of the present invention eliminate the necessity of supplying an isolation diode for each electrically resistive thermal printing conductor of a thermal printing matrix.
Summary Thermal half-select printing is accomplished by coincident current energization of electrically resistive thermal printing elements.
Brief description of the drawing FIGURE 1 is a perspective view of one embodiment of the present invention, in which row andcolumn electrically resistive thermal printing conductors "are located on separate substrates.
FIGURE 2 is a perspective view of another embodiment of the present invention, in which row and column electrically resistive thermal printing conductors are located on a common substrate.
FIGURE 3 is a perspective view of an alternate electrically resistive thermal printing conductor.
Description of the preferred embodiments The thermal half-select printing matrices of the present invention are constructed for use with thermally sensitive record material. In the embodiment of FIGURE 2, a thin electrically insulating substrate 10, which may be of any electrically insulating material, such as silicon dioxide, which is not subject to rapid heat diffusion from a heated point on the substrate, is employed. The thin electrically insulating substrate should be on the order of one thousandth of an inch thick. The complete thermal printing member 11 is then mounted on a rigid support board 13.
Electrically resistive thermal printing conductors which are on the order of 16 thousandths to 70 thousandths of an inch wide and on the order of 4 millionths of an inch thick, and which are composed of an electrically resistive material such as tin oxide, Nichrome, rhenium, tantalum, or other such materials, are aligned into columns 12 on one side of the substrate 10 and into rows 14 on the other side of the substrate 10. When the heat-sensitive side of a thermally sensitive record material 31 is brought near the substrate 10, printing may be accomplished at a matrix location, such as 22, by coincident current energization of the crossing row and column conductors that are associated with that location. Coincident electrical current is supplied by the current supply means 21 and 23 and the selection grounding transistors 27 and 29, which are selectively saturated when supplied with positive voltage selection signals on their bases. For example, if an electrical current is passed through the column conductor 15 coincidentally with an electrical current through the row conductor 16, the radiated energy at the matrix location 22 due to the current in each of the conductors 15 and 16 will add, and, consequently, printing will occur on the thermally sensitive paper 31 at this location if the thermal threshold of the thermally sensitive paper is exceeded. Energization of only one conductor will not produce sufficient energy at a matrix location to exceed the thermal threshold of the thermally sensitive paper 31. At other points of the matrix, such as the matrix points 24 and 26, where only the current through either a row conductor or a column conductor generates energy, the thermal printing threshold of the heat-sensitive paper is not exceeded, and, therefore, printing does not occur at these points.
The thermal printing paper 31 may be placed in proximity with the exposed side of the electrically insulating film substrate 10. The optimum operating characteristics are found to exist when the heat-sensitive paper 31 is positioned in its thermal printing position and the current through a column conductor is increased until printing occurs as the result of energy through the column conductor only. The current through the column conductor is then reduced by approximately 10%. The same procedure is then followed for determining the optimum operating point of a row conductor.
FIGURE 1 shows another embodiment of the present invention, in which row conductors 30 are secured on one side of an electrically insulating substrate 28. The substrate 28 is then placed behind the non-thermally sensitive side of the thermally sensitive paper 32. Column conductors 36 of an electrically resistive material are secured on one side of another electrically insulating substrate 34. The substrate 34 is positioned on the front, or heat-sensitive, side of the thermally sensitive paper 32. As in the embodiment of FIGURE 2, the row and column conductors may be interchanged if desired. The same procedure for obtaining the optimum operating characteristics which was described in conjunction with the embodiment of FIGURE 2 may also be employed in connection with the embodiment of FIGURE 1.
FIGURE 3 shows an alternate electrically resistive conductor 17, which may replace the row conductors or the column conductors of the embodiments of FIGURES 1 and 2. This conductor 17 consists of alternate areas 19 of an electrically conductive material, such as copper or gold, which are deposited over an electrically resistive substrate material 18, such as tin oxide, etc. The deposited conductive material 19 reduces the resistance along portions of the conductor 17 in which no print is desired; therefore the total energy loss of the conductor 17 is reduced, and, in addition, printing is more accurately confined tothe desired printing areas 25. External electrical connections are made to the conductive areas 37 and 39 by the conductive leads 41 and 43, respectively.
What is claimed is:
1. A thermal printing device for printing on a thermallysensitive record material, comprising:
(a) a first set of electrically resistive printing elements,
and
(b) a second set of electrically resistive printing elements crossing the first set of printing elements, to form a matrix of thermal printing locations at those portions of the printing elements which intersect, and
(c) means to selectively supply electrical current through printing elements of the first and second sets of electrically resistive printing elements, to achieve printing on a thermally-sensitive record material that is positioned adjacent the matrix of thermal printing locations in the vicinity of those thermal printing locations which are formed by an intersecting portion of a printing element of the first set and an intersecting portion of a printing element of the second set when both of the crossing printing elements at a thermal printing location are coincidentally conducting current, wherein the electrically resistive printing elements of at least one of the sets of the printing elements each comprises an electrically conductive path of alternately arranged high-resistance portions and low-resistance portions, and the high-resistance portions define the thermal printing locations of the matrix.
2. A thermal printing device for printing on a thermallysensitive record material, comprising:
(a) a first set of electrically resistive printing elements,
and
(b) a second set of electrically resistive printing elements crossing the first set of printing elements, to form a matrix of thermal printing locations at those portions of the printing elements which intersect, and
(c) means to selectively supply electrical current through printing elements of the first and second sets of electrically resistive printing elements, to achieve printing on a thermally-sensitive record material that is positioned adjacent the matrix of thermal printing locations in the vicinity of those thermal printing locations which are formed by an intersecting portion of a printing element of the first set and an intersectments crossing the first set of printing elements, to form a matrix of thermal printing locations at those portions of the printing elements which intersect, and
(c) means to selectively supply electrical current through printing elements of the first and second sets of electrically resistive printing elements, to achieve printing on a thermally-sensitive record material that is positioned adjacent the matrix of thermal printing locations in the vicinity of those thermal printing locations which are formed by an intersecting portion of a printing element of the first set and an intersecting portion of a printing element of the second set when both of the crossing printing elements at a thermal printing location are coincidentally conducting current, wherein the first set of electrically resistive printing elements is mounted on one side of a non-conductive substrate, and the second set of electrically resistive elements is mounted on the other side of the non-conductive substrate, and the electrically resistive printing elements of at least one of the sets of the printing elements each comprises an electrically conductive path of alternately arranged high-resistance portions and low-resistance portions, and the high-resistance portions define the thermal printing locations of the matrix.
References Cited UNITED STATES PATENTS ing portion of a printing element of the second set 2,610,102 9/1952 Glilendanflel t 346-34 when both of the crossing printing elements at 21 2,686,222 8/1954 Walker et a1 0-166 X thermal printing location are coincidentally conduct- 3,145,071 8/1964 V n e 346-46 ing Current, wherein the first set of electrically 3,214,765 1 1965 Bond 340-16 sistive printing elements is mounted on one id f a 3,219,993 11/ 1965 tZ 34676 X non-conductive substrate, and the second set of elec- 35 3,312,979 4/1967 Della Torre et a1 6- trically resistive elements is mounted on the other side of the non-conductive substrate. 3. A thermal printing device for printing on a thermallysensitive record material, comprising:
(a) a first set of electrically resistive printing elements,
and (b) a second set of electrically resistive printing ele- JOSEPH V. TRUHE, Primary Examiner C. L. ALBRITTON, Assistant Examiner U.S. Cl. X.R.
US646888A 1967-06-19 1967-06-19 Thermal half-select printing matrix Expired - Lifetime US3466423A (en)

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Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3673387A (en) * 1971-02-22 1972-06-27 Emerson Electric Co Electric heaters
US3953711A (en) * 1973-11-06 1976-04-27 E.G.O. Elektro-Geraete Blanc Und Fischer Cooking units
US4202693A (en) * 1975-09-05 1980-05-13 Hoechst Aktiengesellschaft Recording material having intersecting conductive strips and apertured spacing means
EP1669295A1 (en) * 2004-12-13 2006-06-14 Seiko Instruments Inc. Method and device for thermally activating heat-sensitive adhesive sheet
US20070134039A1 (en) * 2005-12-08 2007-06-14 Ncr Corporation Dual-sided thermal printing
US20070211094A1 (en) * 2006-03-07 2007-09-13 Ncr Corporation Dual-sided thermal pharmacy script printing
US20070212146A1 (en) * 2005-12-08 2007-09-13 Dale Lyons Two-sided thermal print switch
US20070211099A1 (en) * 2006-03-07 2007-09-13 Lyons Dale R Two-sided thermal print sensing
US20070210572A1 (en) * 2006-03-07 2007-09-13 Ncr Corporation Dual-sided thermal security features
US20070213214A1 (en) * 2006-03-07 2007-09-13 Roth Joseph D Two-sided thermal wrap around label
US20070213213A1 (en) * 2006-03-07 2007-09-13 Ncr Corporation UV and thermal guard
US20070211132A1 (en) * 2006-03-07 2007-09-13 Lyons Dale R Two-sided thermal print configurations
US20070244005A1 (en) * 2006-03-07 2007-10-18 Ncr Corporation Multisided thermal media combinations
US20080316534A1 (en) * 2007-06-20 2008-12-25 Mcgarry Colman Two-sided print data splitting
US20090015647A1 (en) * 2007-07-12 2009-01-15 Rawlings Timothy W Two-side thermal printer
US20090015649A1 (en) * 2007-07-12 2009-01-15 Keeton Mark E Selective direct thermal and thermal transfer printing
US20090060606A1 (en) * 2007-08-31 2009-03-05 Ncr Corporation Controlled fold document delivery
US7839425B2 (en) 2008-09-17 2010-11-23 Ncr Corporation Method of controlling thermal printing
US8252717B2 (en) 2006-03-07 2012-08-28 Ncr Corporation Dual-sided two-ply direct thermal image element
EP3199365A4 (en) * 2014-09-24 2017-09-20 FUJIFILM Corporation Image-forming medium, method for producing image-forming medium, and image-forming method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2392822A1 (en) * 1977-06-01 1978-12-29 Eurofarad Multipoint thermal printing heads with an insulated support sheet - opt. involving polyimide or epoxy! resin coatings or panels

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US2686222A (en) * 1951-02-16 1954-08-10 Ferranti Ltd Electric signal translating and recording device
US3145071A (en) * 1961-09-11 1964-08-18 Teledyne Inc High speed thermal contact printer
US3214765A (en) * 1961-06-20 1965-10-26 Sperry Rand Corp Electronic plotter for multiple target tracking
US3219993A (en) * 1962-10-24 1965-11-23 Xerox Corp Image formation and display utilizing a thermotropically color reversible material
US3312979A (en) * 1965-02-23 1967-04-04 American Radiator & Standard Thermal recording matrix

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US2610102A (en) * 1950-12-27 1952-09-09 Gen Electric Function recorder
US2686222A (en) * 1951-02-16 1954-08-10 Ferranti Ltd Electric signal translating and recording device
US3214765A (en) * 1961-06-20 1965-10-26 Sperry Rand Corp Electronic plotter for multiple target tracking
US3145071A (en) * 1961-09-11 1964-08-18 Teledyne Inc High speed thermal contact printer
US3219993A (en) * 1962-10-24 1965-11-23 Xerox Corp Image formation and display utilizing a thermotropically color reversible material
US3312979A (en) * 1965-02-23 1967-04-04 American Radiator & Standard Thermal recording matrix

Cited By (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3673387A (en) * 1971-02-22 1972-06-27 Emerson Electric Co Electric heaters
US3953711A (en) * 1973-11-06 1976-04-27 E.G.O. Elektro-Geraete Blanc Und Fischer Cooking units
US4202693A (en) * 1975-09-05 1980-05-13 Hoechst Aktiengesellschaft Recording material having intersecting conductive strips and apertured spacing means
EP1669295A1 (en) * 2004-12-13 2006-06-14 Seiko Instruments Inc. Method and device for thermally activating heat-sensitive adhesive sheet
US20060130965A1 (en) * 2004-12-13 2006-06-22 Tatsuya Obuchi Method and device for thermally activating heat-sensitive adhesive sheet, and printer equipped with this apparatus
US20090290923A9 (en) * 2005-12-08 2009-11-26 Dale Lyons Two-sided thermal print switch
US20070134039A1 (en) * 2005-12-08 2007-06-14 Ncr Corporation Dual-sided thermal printing
US8721202B2 (en) 2005-12-08 2014-05-13 Ncr Corporation Two-sided thermal print switch
US20070212146A1 (en) * 2005-12-08 2007-09-13 Dale Lyons Two-sided thermal print switch
US7710442B2 (en) 2006-03-07 2010-05-04 Ncr Corporation Two-sided thermal print configurations
US8670009B2 (en) 2006-03-07 2014-03-11 Ncr Corporation Two-sided thermal print sensing
US20070213213A1 (en) * 2006-03-07 2007-09-13 Ncr Corporation UV and thermal guard
US20070211132A1 (en) * 2006-03-07 2007-09-13 Lyons Dale R Two-sided thermal print configurations
US20070244005A1 (en) * 2006-03-07 2007-10-18 Ncr Corporation Multisided thermal media combinations
US9024986B2 (en) 2006-03-07 2015-05-05 Ncr Corporation Dual-sided thermal pharmacy script printing
US20070211094A1 (en) * 2006-03-07 2007-09-13 Ncr Corporation Dual-sided thermal pharmacy script printing
US20070213214A1 (en) * 2006-03-07 2007-09-13 Roth Joseph D Two-sided thermal wrap around label
US8367580B2 (en) 2006-03-07 2013-02-05 Ncr Corporation Dual-sided thermal security features
US20090185021A9 (en) * 2006-03-07 2009-07-23 Lyons Dale R Two-sided thermal print configurations
US20070210572A1 (en) * 2006-03-07 2007-09-13 Ncr Corporation Dual-sided thermal security features
US20070211099A1 (en) * 2006-03-07 2007-09-13 Lyons Dale R Two-sided thermal print sensing
US8252717B2 (en) 2006-03-07 2012-08-28 Ncr Corporation Dual-sided two-ply direct thermal image element
US8222184B2 (en) 2006-03-07 2012-07-17 Ncr Corporation UV and thermal guard
US8043993B2 (en) 2006-03-07 2011-10-25 Ncr Corporation Two-sided thermal wrap around label
US8067335B2 (en) 2006-03-07 2011-11-29 Ncr Corporation Multisided thermal media combinations
US8576436B2 (en) 2007-06-20 2013-11-05 Ncr Corporation Two-sided print data splitting
US20080316534A1 (en) * 2007-06-20 2008-12-25 Mcgarry Colman Two-sided print data splitting
US20090015649A1 (en) * 2007-07-12 2009-01-15 Keeton Mark E Selective direct thermal and thermal transfer printing
US20090015647A1 (en) * 2007-07-12 2009-01-15 Rawlings Timothy W Two-side thermal printer
US8848010B2 (en) 2007-07-12 2014-09-30 Ncr Corporation Selective direct thermal and thermal transfer printing
US9056488B2 (en) 2007-07-12 2015-06-16 Ncr Corporation Two-side thermal printer
US9346285B2 (en) 2007-07-12 2016-05-24 Ncr Corporation Two-sided thermal printer
US20090060606A1 (en) * 2007-08-31 2009-03-05 Ncr Corporation Controlled fold document delivery
US8182161B2 (en) 2007-08-31 2012-05-22 Ncr Corporation Controlled fold document delivery
US8314821B2 (en) 2008-09-17 2012-11-20 Ncr Corporation Method of controlling thermal printing
US7839425B2 (en) 2008-09-17 2010-11-23 Ncr Corporation Method of controlling thermal printing
US20110063394A1 (en) * 2008-09-17 2011-03-17 Morrison Randall L Method of controlling thermal printing
EP3199365A4 (en) * 2014-09-24 2017-09-20 FUJIFILM Corporation Image-forming medium, method for producing image-forming medium, and image-forming method
US10183518B2 (en) 2014-09-24 2019-01-22 Fujifilm Corporation Image forming medium, method for producing image forming medium, and image forming method
TWI656983B (en) * 2014-09-24 2019-04-21 日商富士軟片股份有限公司 Image formation medium, method for producing image formation medium and image formation method

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GB1175658A (en) 1969-12-23

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