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| US4007477 | 30 Dec 1974 | 8 Feb 1977 | The Lucas Electrical Company Limited | Assembly of a recessed heat sink and a semiconductor device sealed within the recess in the heat sink and thermally connected to the heat sink |
| US4057825 | 1 Jul 1976 | 8 Nov 1977 | Hitachi, Ltd. | Semiconductor device with composite metal heat-radiating plate onto which semiconductor element is soldered |
| US4215360 | 9 Nov 1978 | 29 Jul 1980 | General Motors Corporation | Power semiconductor device assembly having a lead frame with interlock members |
| US4532539 | 26 Jul 1982 | 30 Jul 1985 | Robert Bosch GmbH | Solid-state diode-rectifier and heat sink structure |
