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Referenced by

Citing PatentFiling dateIssue dateOriginal AssigneeTitle
US403817131 Mar 197626 Jul 1977Battelle Memorial InstituteSupported plasma sputtering apparatus for high deposition rate over large area
US42216526 Apr 19769 Sep 1980Kabushiki Kaisha Tokuda SeisakushoSputtering device
US513000513 Dec 199014 Jul 1992Materials Research CorporationMagnetron sputter coating method and apparatus with rotating magnet cathode
USH220914 Apr -96The United States of America as represented by the Secretary of the NavyLarge area metallization pretreatment and surface activation system