US3328273A - Electro-deposition of copper from acidic baths - Google Patents
Electro-deposition of copper from acidic baths Download PDFInfo
- Publication number
- US3328273A US3328273A US572201A US57220166A US3328273A US 3328273 A US3328273 A US 3328273A US 572201 A US572201 A US 572201A US 57220166 A US57220166 A US 57220166A US 3328273 A US3328273 A US 3328273A
- Authority
- US
- United States
- Prior art keywords
- copper
- bath
- compounds
- baths
- liter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US572201A US3328273A (en) | 1966-08-15 | 1966-08-15 | Electro-deposition of copper from acidic baths |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US572201A US3328273A (en) | 1966-08-15 | 1966-08-15 | Electro-deposition of copper from acidic baths |
Publications (1)
Publication Number | Publication Date |
---|---|
US3328273A true US3328273A (en) | 1967-06-27 |
Family
ID=24286792
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US572201A Expired - Lifetime US3328273A (en) | 1966-08-15 | 1966-08-15 | Electro-deposition of copper from acidic baths |
Country Status (1)
Country | Link |
---|---|
US (1) | US3328273A (en) |
Cited By (104)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3542655A (en) * | 1968-04-29 | 1970-11-24 | M & T Chemicals Inc | Electrodeposition of copper |
FR2079372A1 (en) * | 1970-02-12 | 1971-11-12 | Udylite Corp | |
US3715289A (en) * | 1971-02-08 | 1973-02-06 | Stauffer Chemical Co | Brightener composition for acid copper electroplating baths |
US3725220A (en) * | 1972-04-27 | 1973-04-03 | Lea Ronal Inc | Electrodeposition of copper from acidic baths |
US3743584A (en) * | 1970-06-06 | 1973-07-03 | Schering Ag | Acid bright copper plating bath |
US3770598A (en) * | 1972-01-21 | 1973-11-06 | Oxy Metal Finishing Corp | Electrodeposition of copper from acid baths |
FR2210673A1 (en) * | 1972-12-14 | 1974-07-12 | M & T Chemicals Inc | |
US3940320A (en) * | 1972-12-14 | 1976-02-24 | M & T Chemicals Inc. | Electrodeposition of copper |
US3956084A (en) * | 1972-12-14 | 1976-05-11 | M & T Chemicals Inc. | Electrodeposition of copper |
US3956079A (en) * | 1972-12-14 | 1976-05-11 | M & T Chemicals Inc. | Electrodeposition of copper |
US3956078A (en) * | 1972-12-14 | 1976-05-11 | M & T Chemicals Inc. | Electrodeposition of copper |
US3956120A (en) * | 1972-12-14 | 1976-05-11 | M & T Chemicals Inc. | Electrodeposition of copper |
US3966565A (en) * | 1972-12-14 | 1976-06-29 | M & T Chemicals Inc. | Electrodeposition of copper |
US4009087A (en) * | 1974-11-21 | 1977-02-22 | M&T Chemicals Inc. | Electrodeposition of copper |
US4014760A (en) * | 1974-11-21 | 1977-03-29 | M & T Chemicals Inc. | Electrodeposition of copper |
US4036711A (en) * | 1975-12-18 | 1977-07-19 | M & T Chemicals Inc. | Electrodeposition of copper |
US4036710A (en) * | 1974-11-21 | 1977-07-19 | M & T Chemicals Inc. | Electrodeposition of copper |
FR2476151A1 (en) * | 1980-02-19 | 1981-08-21 | Oxy Metal Industries Corp | ELECTROLYTIC COPPER DEPOSITION BATHS, CONTAINING A SUBSTITUTED RADICAL PHTHALOCYANIN SHINE COMPOUND |
US4334966A (en) * | 1981-05-19 | 1982-06-15 | Mcgean Chemical Company, Inc. | Method of copper plating gravure cylinders |
US4336114A (en) * | 1981-03-26 | 1982-06-22 | Hooker Chemicals & Plastics Corp. | Electrodeposition of bright copper |
EP0068807A2 (en) * | 1981-06-24 | 1983-01-05 | M & T Chemicals, Inc. | Acid copper electroplating baths containing brightening and levelling additives |
US4374709A (en) * | 1980-05-01 | 1983-02-22 | Occidental Chemical Corporation | Process for plating polymeric substrates |
EP0107109A2 (en) * | 1982-09-30 | 1984-05-02 | LeaRonal, Inc. | Electrolytic copper plating solutions and a method for their application |
US4469564A (en) * | 1982-08-11 | 1984-09-04 | At&T Bell Laboratories | Copper electroplating process |
GB2141141A (en) * | 1983-06-10 | 1984-12-12 | Omi Int Corp | Electrodepositing copper |
DE3420999A1 (en) * | 1983-06-10 | 1984-12-13 | Omi International Corp., Warren, Mich. | AQUEOUS ACID GALVANIC COPPER BATH AND METHOD FOR GALVANICALLY DEPOSITING A GLOSSY-INPUTED COPPER COVER ON A CONDUCTIVE SUBSTRATE FROM THIS BATH |
US4540473A (en) * | 1983-11-22 | 1985-09-10 | International Business Machines Corporation | Copper plating bath having increased plating rate, and method |
DE3518193A1 (en) * | 1984-05-29 | 1985-12-05 | Omi International Corp., Warren, Mich. | ELECTROLYTE CONTAINING AQUEOUS ACID COPPER AND A METHOD FOR GALVANICALLY DEPOSITING COPPER USING THIS ELECTROLYTE |
US4673469A (en) * | 1984-06-08 | 1987-06-16 | Mcgean-Rohco, Inc. | Method of plating plastics |
US4786746A (en) * | 1987-09-18 | 1988-11-22 | Pennsylvania Research Corporation | Copper electroplating solutions and methods of making and using them |
WO1989007162A1 (en) * | 1988-01-27 | 1989-08-10 | Jct Controls Limited | Electrochemical processes |
US4897165A (en) * | 1988-08-23 | 1990-01-30 | Shipley Company Inc. | Electroplating composition and process for plating through holes in printed circuit boards |
US4948474A (en) * | 1987-09-18 | 1990-08-14 | Pennsylvania Research Corporation | Copper electroplating solutions and methods |
US5004525A (en) * | 1988-08-23 | 1991-04-02 | Shipley Company Inc. | Copper electroplating composition |
US5024736A (en) * | 1988-05-25 | 1991-06-18 | Raschig Ag | Process for electroplating utilizing disubstituted ethane sulfonic compounds as electroplating auxiliaries and electroplating auxiliaries containing same |
US5068013A (en) * | 1988-08-23 | 1991-11-26 | Shipley Company Inc. | Electroplating composition and process |
US5252196A (en) * | 1991-12-05 | 1993-10-12 | Shipley Company Inc. | Copper electroplating solutions and processes |
US5328589A (en) * | 1992-12-23 | 1994-07-12 | Enthone-Omi, Inc. | Functional fluid additives for acid copper electroplating baths |
US5417841A (en) * | 1990-08-03 | 1995-05-23 | Mcgean-Rohco, Inc. | Copper plating of gravure rolls |
US5730854A (en) * | 1996-05-30 | 1998-03-24 | Enthone-Omi, Inc. | Alkoxylated dimercaptans as copper additives and de-polarizing additives |
US5985126A (en) * | 1996-07-15 | 1999-11-16 | Semitool, Inc. | Semiconductor plating system workpiece support having workpiece engaging electrodes with distal contact part and dielectric cover |
EP1118696A1 (en) * | 1998-09-03 | 2001-07-25 | Ebara Corporation | Method for plating substrate and apparatus |
EP1126512A2 (en) * | 1998-08-11 | 2001-08-22 | Ebara Corporation | Wafer plating method and apparatus |
US6354916B1 (en) | 2000-02-11 | 2002-03-12 | Nu Tool Inc. | Modified plating solution for plating and planarization and process utilizing same |
US6358388B1 (en) * | 1996-07-15 | 2002-03-19 | Semitool, Inc. | Plating system workpiece support having workpiece-engaging electrodes with distal contact-part and dielectric cover |
US6413403B1 (en) | 2000-02-23 | 2002-07-02 | Nutool Inc. | Method and apparatus employing pad designs and structures with improved fluid distribution |
US6454926B1 (en) | 1997-09-30 | 2002-09-24 | Semitool Inc. | Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areas |
US6478936B1 (en) | 2000-05-11 | 2002-11-12 | Nutool Inc. | Anode assembly for plating and planarizing a conductive layer |
US20020175080A1 (en) * | 2001-03-23 | 2002-11-28 | Ivo Teerlinck | Multi-step method for metal deposition |
US6497800B1 (en) | 2000-03-17 | 2002-12-24 | Nutool Inc. | Device providing electrical contact to the surface of a semiconductor workpiece during metal plating |
US20020194716A1 (en) * | 1996-07-15 | 2002-12-26 | Berner Robert W. | Modular semiconductor workpiece processing tool |
EP1308540A1 (en) * | 2001-10-02 | 2003-05-07 | Shipley Co. L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
US6565729B2 (en) | 1998-03-20 | 2003-05-20 | Semitool, Inc. | Method for electrochemically depositing metal on a semiconductor workpiece |
US20030141194A1 (en) * | 1998-03-20 | 2003-07-31 | Chen Linlin | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
US6610190B2 (en) | 2000-11-03 | 2003-08-26 | Nutool, Inc. | Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate |
US6612915B1 (en) | 1999-12-27 | 2003-09-02 | Nutool Inc. | Work piece carrier head for plating and polishing |
US6638411B1 (en) * | 1999-01-26 | 2003-10-28 | Ebara Corporation | Method and apparatus for plating substrate with copper |
US20030230491A1 (en) * | 2001-01-17 | 2003-12-18 | Basol Bulent M. | Method and system monitoring and controlling film thickness profile during plating and electroetching |
US20040007478A1 (en) * | 1998-12-01 | 2004-01-15 | Basol Bulent M. | Electroetching system and process |
US6695962B2 (en) | 2001-05-01 | 2004-02-24 | Nutool Inc. | Anode designs for planar metal deposits with enhanced electrolyte solution blending and process of supplying electrolyte solution using such designs |
US20040038052A1 (en) * | 2002-08-21 | 2004-02-26 | Collins Dale W. | Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces |
US20040052930A1 (en) * | 2000-04-27 | 2004-03-18 | Bulent Basol | Conductive structure fabrication process using novel layered structure and conductive structure fabricated thereby for use in multi-level metallization |
US6709562B1 (en) | 1995-12-29 | 2004-03-23 | International Business Machines Corporation | Method of making electroplated interconnection structures on integrated circuit chips |
US20040074775A1 (en) * | 2002-10-21 | 2004-04-22 | Herdman Roderick Dennis | Pulse reverse electrolysis of acidic copper electroplating solutions |
US20040108136A1 (en) * | 2002-12-04 | 2004-06-10 | International Business Machines Corporation | Structure comprising a barrier layer of a tungsten alloy comprising cobalt and/or nickel |
US6776892B1 (en) | 1997-09-30 | 2004-08-17 | Semitool, Inc. | Semiconductor plating system workpiece support having workpiece engaging electrode with pre-conditioned contact face |
US20040168926A1 (en) * | 1998-12-01 | 2004-09-02 | Basol Bulent M. | Method and apparatus to deposit layers with uniform properties |
US20040187731A1 (en) * | 1999-07-15 | 2004-09-30 | Wang Qing Min | Acid copper electroplating solutions |
US6802946B2 (en) | 2000-12-21 | 2004-10-12 | Nutool Inc. | Apparatus for controlling thickness uniformity of electroplated and electroetched layers |
US6806186B2 (en) | 1998-02-04 | 2004-10-19 | Semitool, Inc. | Submicron metallization using electrochemical deposition |
US20040211657A1 (en) * | 2003-04-11 | 2004-10-28 | Ingelbrecht Hugo Gerard Eduard | Method of purifying 2,6-xylenol and method of producing poly(arylene ether) therefrom |
US6811675B2 (en) | 1998-03-20 | 2004-11-02 | Semitool, Inc. | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
US20040229456A1 (en) * | 1995-12-29 | 2004-11-18 | International Business Machines | Electroplated interconnection structures on integrated circuit chips |
US20040249177A1 (en) * | 2003-06-04 | 2004-12-09 | Shipley Company, L.L.C. | Leveler compounds |
US20040266193A1 (en) * | 2000-02-23 | 2004-12-30 | Jeffrey Bogart | Means to improve center-to edge uniformity of electrochemical mechanical processing of workpiece surface |
US20050006244A1 (en) * | 2000-05-11 | 2005-01-13 | Uzoh Cyprian E. | Electrode assembly for electrochemical processing of workpiece |
US20050016868A1 (en) * | 1998-12-01 | 2005-01-27 | Asm Nutool, Inc. | Electrochemical mechanical planarization process and apparatus |
US20050040049A1 (en) * | 2002-09-20 | 2005-02-24 | Rimma Volodarsky | Anode assembly for plating and planarizing a conductive layer |
US20050092611A1 (en) * | 2003-11-03 | 2005-05-05 | Semitool, Inc. | Bath and method for high rate copper deposition |
JP2005136433A (en) * | 2004-12-15 | 2005-05-26 | Internatl Business Mach Corp <Ibm> | Electroplated interconnection structure on integrated circuit chip |
US20050133379A1 (en) * | 1998-12-01 | 2005-06-23 | Basol Bulent M. | System for electropolishing and electrochemical mechanical polishing |
US20060006073A1 (en) * | 2004-02-27 | 2006-01-12 | Basol Bulent M | System and method for electrochemical mechanical polishing |
US20060070885A1 (en) * | 1999-09-17 | 2006-04-06 | Uzoh Cyprian E | Chip interconnect and packaging deposition methods and structures |
US20060118425A1 (en) * | 2000-04-19 | 2006-06-08 | Basol Bulent M | Process to minimize and/or eliminate conductive material coating over the top surface of a patterned substrate |
US20060131177A1 (en) * | 2000-02-23 | 2006-06-22 | Jeffrey Bogart | Means to eliminate bubble entrapment during electrochemical processing of workpiece surface |
US20070051635A1 (en) * | 2000-08-10 | 2007-03-08 | Basol Bulent M | Plating apparatus and method for controlling conductor deposition on predetermined portions of a wafer |
US20070131563A1 (en) * | 2003-04-14 | 2007-06-14 | Asm Nutool, Inc. | Means to improve center to edge uniformity of electrochemical mechanical processing of workpiece surface |
US7264698B2 (en) | 1999-04-13 | 2007-09-04 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US20070267297A1 (en) * | 2006-05-17 | 2007-11-22 | Akolkar Rohan N | Electroplating Chemistries and Methods of Forming Interconnections |
US20080237048A1 (en) * | 2007-03-30 | 2008-10-02 | Ismail Emesh | Method and apparatus for selective electrofilling of through-wafer vias |
US7438788B2 (en) | 1999-04-13 | 2008-10-21 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US7476304B2 (en) | 2000-03-17 | 2009-01-13 | Novellus Systems, Inc. | Apparatus for processing surface of workpiece with small electrodes and surface contacts |
US20090020437A1 (en) * | 2000-02-23 | 2009-01-22 | Basol Bulent M | Method and system for controlled material removal by electrochemical polishing |
US20090065365A1 (en) * | 2007-09-11 | 2009-03-12 | Asm Nutool, Inc. | Method and apparatus for copper electroplating |
JP2009065207A (en) * | 2008-12-10 | 2009-03-26 | Internatl Business Mach Corp <Ibm> | Electroplated interconnection structure on integrated circuit chip |
US20090277801A1 (en) * | 2006-07-21 | 2009-11-12 | Novellus Systems, Inc. | Photoresist-free metal deposition |
US20100224501A1 (en) * | 2000-08-10 | 2010-09-09 | Novellus Systems, Inc. | Plating methods for low aspect ratio cavities |
JP2010206212A (en) * | 2010-04-22 | 2010-09-16 | Internatl Business Mach Corp <Ibm> | Electroplating interconnection structure on integrated circuit chip |
US20110054397A1 (en) * | 2006-03-31 | 2011-03-03 | Menot Sebastien | Medical liquid injection device |
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CN111748087A (en) * | 2020-07-20 | 2020-10-09 | 中国科学院大学温州研究院(温州生物材料与工程研究所) | Dye modified PEG and application thereof in acid bright copper plating |
US10982343B2 (en) * | 2017-11-09 | 2021-04-20 | Atotech Deutschland Gmbh | Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate |
USRE49202E1 (en) | 2004-11-12 | 2022-09-06 | Macdermid Enthone Inc. | Copper electrodeposition in microelectronics |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2424887A (en) * | 1941-10-11 | 1947-07-29 | Houdaille Hershey Corp | Method and electrolyte for the electrodeposition of metals |
US2707166A (en) * | 1952-05-26 | 1955-04-26 | Udylite Corp | Electrodeposition of copper from an acid bath |
US2707167A (en) * | 1952-05-26 | 1955-04-26 | Udylite Corp | Electrodeposition of copper from an acid bath |
US2738318A (en) * | 1954-12-28 | 1956-03-13 | Udylite Res Corp | Electrodeposition of copper from an acid bath |
US2805194A (en) * | 1955-07-18 | 1957-09-03 | Dayton Bright Copper Company | Bright copper plating |
US2805193A (en) * | 1955-07-18 | 1957-09-03 | John F Beaver | Bright copper plating |
US2882209A (en) * | 1957-05-20 | 1959-04-14 | Udylite Res Corp | Electrodeposition of copper from an acid bath |
US2931760A (en) * | 1957-09-25 | 1960-04-05 | Leon R Westbrook | Acid copper plating |
US3081240A (en) * | 1959-06-06 | 1963-03-12 | Debydag Deutsche Hydrierwerke | Acid copper electroplating baths |
-
1966
- 1966-08-15 US US572201A patent/US3328273A/en not_active Expired - Lifetime
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2424887A (en) * | 1941-10-11 | 1947-07-29 | Houdaille Hershey Corp | Method and electrolyte for the electrodeposition of metals |
US2707166A (en) * | 1952-05-26 | 1955-04-26 | Udylite Corp | Electrodeposition of copper from an acid bath |
US2707167A (en) * | 1952-05-26 | 1955-04-26 | Udylite Corp | Electrodeposition of copper from an acid bath |
US2738318A (en) * | 1954-12-28 | 1956-03-13 | Udylite Res Corp | Electrodeposition of copper from an acid bath |
US2805194A (en) * | 1955-07-18 | 1957-09-03 | Dayton Bright Copper Company | Bright copper plating |
US2805193A (en) * | 1955-07-18 | 1957-09-03 | John F Beaver | Bright copper plating |
US2882209A (en) * | 1957-05-20 | 1959-04-14 | Udylite Res Corp | Electrodeposition of copper from an acid bath |
US2931760A (en) * | 1957-09-25 | 1960-04-05 | Leon R Westbrook | Acid copper plating |
US3081240A (en) * | 1959-06-06 | 1963-03-12 | Debydag Deutsche Hydrierwerke | Acid copper electroplating baths |
Cited By (183)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3542655A (en) * | 1968-04-29 | 1970-11-24 | M & T Chemicals Inc | Electrodeposition of copper |
FR2079372A1 (en) * | 1970-02-12 | 1971-11-12 | Udylite Corp | |
US3743584A (en) * | 1970-06-06 | 1973-07-03 | Schering Ag | Acid bright copper plating bath |
US3715289A (en) * | 1971-02-08 | 1973-02-06 | Stauffer Chemical Co | Brightener composition for acid copper electroplating baths |
US3770598A (en) * | 1972-01-21 | 1973-11-06 | Oxy Metal Finishing Corp | Electrodeposition of copper from acid baths |
US3725220A (en) * | 1972-04-27 | 1973-04-03 | Lea Ronal Inc | Electrodeposition of copper from acidic baths |
US3966565A (en) * | 1972-12-14 | 1976-06-29 | M & T Chemicals Inc. | Electrodeposition of copper |
US3940320A (en) * | 1972-12-14 | 1976-02-24 | M & T Chemicals Inc. | Electrodeposition of copper |
US3956084A (en) * | 1972-12-14 | 1976-05-11 | M & T Chemicals Inc. | Electrodeposition of copper |
US3956079A (en) * | 1972-12-14 | 1976-05-11 | M & T Chemicals Inc. | Electrodeposition of copper |
US3956078A (en) * | 1972-12-14 | 1976-05-11 | M & T Chemicals Inc. | Electrodeposition of copper |
US3956120A (en) * | 1972-12-14 | 1976-05-11 | M & T Chemicals Inc. | Electrodeposition of copper |
FR2210673A1 (en) * | 1972-12-14 | 1974-07-12 | M & T Chemicals Inc | |
US4009087A (en) * | 1974-11-21 | 1977-02-22 | M&T Chemicals Inc. | Electrodeposition of copper |
US4014760A (en) * | 1974-11-21 | 1977-03-29 | M & T Chemicals Inc. | Electrodeposition of copper |
US4036710A (en) * | 1974-11-21 | 1977-07-19 | M & T Chemicals Inc. | Electrodeposition of copper |
US4036711A (en) * | 1975-12-18 | 1977-07-19 | M & T Chemicals Inc. | Electrodeposition of copper |
FR2476151A1 (en) * | 1980-02-19 | 1981-08-21 | Oxy Metal Industries Corp | ELECTROLYTIC COPPER DEPOSITION BATHS, CONTAINING A SUBSTITUTED RADICAL PHTHALOCYANIN SHINE COMPOUND |
US4374709A (en) * | 1980-05-01 | 1983-02-22 | Occidental Chemical Corporation | Process for plating polymeric substrates |
US4336114A (en) * | 1981-03-26 | 1982-06-22 | Hooker Chemicals & Plastics Corp. | Electrodeposition of bright copper |
US4334966A (en) * | 1981-05-19 | 1982-06-15 | Mcgean Chemical Company, Inc. | Method of copper plating gravure cylinders |
EP0068807A2 (en) * | 1981-06-24 | 1983-01-05 | M & T Chemicals, Inc. | Acid copper electroplating baths containing brightening and levelling additives |
US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
EP0068807A3 (en) * | 1981-06-24 | 1984-07-25 | M & T Chemicals, Inc. | Acid copper electroplating baths containing brightening and levelling additives |
US4469564A (en) * | 1982-08-11 | 1984-09-04 | At&T Bell Laboratories | Copper electroplating process |
EP0107109A2 (en) * | 1982-09-30 | 1984-05-02 | LeaRonal, Inc. | Electrolytic copper plating solutions and a method for their application |
EP0107109A3 (en) * | 1982-09-30 | 1984-07-25 | Learonal, Inc. | Electrolytic copper plating solutions and a method for their application |
FR2547836A1 (en) * | 1983-06-10 | 1984-12-28 | Omi Int Corp | PROCESS FOR THE ELECTROLYTIC DEPOSITION OF COPPER USING AN ELECTROLYTE CONTAINING IN PARTICULAR A SUBSTITUTED PHTALOCYANINE COMPOUND AND A REACTIONAL POLYETHYLENEIMINE ALKYL PRODUCT |
DE3421017A1 (en) * | 1983-06-10 | 1984-12-13 | Omi International Corp., Warren, Mich. | METHOD FOR GALVANIC DEPOSITION OF A TECHNICAL COPPER COVER |
GB2141141A (en) * | 1983-06-10 | 1984-12-12 | Omi Int Corp | Electrodepositing copper |
DE3420999A1 (en) * | 1983-06-10 | 1984-12-13 | Omi International Corp., Warren, Mich. | AQUEOUS ACID GALVANIC COPPER BATH AND METHOD FOR GALVANICALLY DEPOSITING A GLOSSY-INPUTED COPPER COVER ON A CONDUCTIVE SUBSTRATE FROM THIS BATH |
US4540473A (en) * | 1983-11-22 | 1985-09-10 | International Business Machines Corporation | Copper plating bath having increased plating rate, and method |
DE3518193A1 (en) * | 1984-05-29 | 1985-12-05 | Omi International Corp., Warren, Mich. | ELECTROLYTE CONTAINING AQUEOUS ACID COPPER AND A METHOD FOR GALVANICALLY DEPOSITING COPPER USING THIS ELECTROLYTE |
US4673469A (en) * | 1984-06-08 | 1987-06-16 | Mcgean-Rohco, Inc. | Method of plating plastics |
US4948474A (en) * | 1987-09-18 | 1990-08-14 | Pennsylvania Research Corporation | Copper electroplating solutions and methods |
US4786746A (en) * | 1987-09-18 | 1988-11-22 | Pennsylvania Research Corporation | Copper electroplating solutions and methods of making and using them |
GB2214520A (en) * | 1988-01-27 | 1989-09-06 | Jct Controls Ltd | Electrochemical processes using independently controlled voltages in alternation |
WO1989007162A1 (en) * | 1988-01-27 | 1989-08-10 | Jct Controls Limited | Electrochemical processes |
US5024736A (en) * | 1988-05-25 | 1991-06-18 | Raschig Ag | Process for electroplating utilizing disubstituted ethane sulfonic compounds as electroplating auxiliaries and electroplating auxiliaries containing same |
US4897165A (en) * | 1988-08-23 | 1990-01-30 | Shipley Company Inc. | Electroplating composition and process for plating through holes in printed circuit boards |
EP0355804A2 (en) * | 1988-08-23 | 1990-02-28 | Shipley Company Inc. | Electroplating composition and process |
US5004525A (en) * | 1988-08-23 | 1991-04-02 | Shipley Company Inc. | Copper electroplating composition |
EP0355804A3 (en) * | 1988-08-23 | 1991-07-17 | Shipley Company Inc. | Electroplating composition and process |
US5068013A (en) * | 1988-08-23 | 1991-11-26 | Shipley Company Inc. | Electroplating composition and process |
US5417841A (en) * | 1990-08-03 | 1995-05-23 | Mcgean-Rohco, Inc. | Copper plating of gravure rolls |
US5252196A (en) * | 1991-12-05 | 1993-10-12 | Shipley Company Inc. | Copper electroplating solutions and processes |
DE4343946C2 (en) * | 1992-12-23 | 1998-10-29 | Enthone Omi Inc | Galvanic copper bath and process for the galvanic deposition of copper |
US5328589A (en) * | 1992-12-23 | 1994-07-12 | Enthone-Omi, Inc. | Functional fluid additives for acid copper electroplating baths |
US6946716B2 (en) | 1995-12-29 | 2005-09-20 | International Business Machines Corporation | Electroplated interconnection structures on integrated circuit chips |
US20040229456A1 (en) * | 1995-12-29 | 2004-11-18 | International Business Machines | Electroplated interconnection structures on integrated circuit chips |
US6709562B1 (en) | 1995-12-29 | 2004-03-23 | International Business Machines Corporation | Method of making electroplated interconnection structures on integrated circuit chips |
US20060017169A1 (en) * | 1995-12-29 | 2006-01-26 | International Business Machines Corporation | Electroplated interconnection structures on integrated circuit chips |
US5730854A (en) * | 1996-05-30 | 1998-03-24 | Enthone-Omi, Inc. | Alkoxylated dimercaptans as copper additives and de-polarizing additives |
US20050061675A1 (en) * | 1996-07-15 | 2005-03-24 | Bleck Martin C. | Semiconductor plating system workpiece support having workpiece-engaging electrodes with distal contact part and dielectric cover |
US6358388B1 (en) * | 1996-07-15 | 2002-03-19 | Semitool, Inc. | Plating system workpiece support having workpiece-engaging electrodes with distal contact-part and dielectric cover |
US7074246B2 (en) | 1996-07-15 | 2006-07-11 | Semitool, Inc. | Modular semiconductor workpiece processing tool |
US6663762B2 (en) | 1996-07-15 | 2003-12-16 | Semitool, Inc. | Plating system workpiece support having workpiece engaging electrode |
US20020194716A1 (en) * | 1996-07-15 | 2002-12-26 | Berner Robert W. | Modular semiconductor workpiece processing tool |
US5985126A (en) * | 1996-07-15 | 1999-11-16 | Semitool, Inc. | Semiconductor plating system workpiece support having workpiece engaging electrodes with distal contact part and dielectric cover |
US6936153B1 (en) | 1997-09-30 | 2005-08-30 | Semitool, Inc. | Semiconductor plating system workpiece support having workpiece-engaging electrode with pre-conditioned contact face |
US6776892B1 (en) | 1997-09-30 | 2004-08-17 | Semitool, Inc. | Semiconductor plating system workpiece support having workpiece engaging electrode with pre-conditioned contact face |
US6454926B1 (en) | 1997-09-30 | 2002-09-24 | Semitool Inc. | Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areas |
US20030029732A1 (en) * | 1997-09-30 | 2003-02-13 | Ritzdorf Thomas L. | Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areas |
US7144805B2 (en) | 1998-02-04 | 2006-12-05 | Semitool, Inc. | Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density |
US6806186B2 (en) | 1998-02-04 | 2004-10-19 | Semitool, Inc. | Submicron metallization using electrochemical deposition |
US20060208272A1 (en) * | 1998-02-04 | 2006-09-21 | Semitool, Inc. | Method for filling recessed micro-structures with metallization in the production of a microelectronic device |
US7332066B2 (en) | 1998-03-20 | 2008-02-19 | Semitool, Inc. | Apparatus and method for electrochemically depositing metal on a semiconductor workpiece |
US6932892B2 (en) | 1998-03-20 | 2005-08-23 | Semitool, Inc. | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
US6811675B2 (en) | 1998-03-20 | 2004-11-02 | Semitool, Inc. | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
US6565729B2 (en) | 1998-03-20 | 2003-05-20 | Semitool, Inc. | Method for electrochemically depositing metal on a semiconductor workpiece |
US6632345B1 (en) | 1998-03-20 | 2003-10-14 | Semitool, Inc. | Apparatus and method for electrolytically depositing a metal on a workpiece |
US20040035710A1 (en) * | 1998-03-20 | 2004-02-26 | Semitool, Inc. | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
US6638410B2 (en) | 1998-03-20 | 2003-10-28 | Semitool, Inc. | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
US20040035708A1 (en) * | 1998-03-20 | 2004-02-26 | Semitool, Inc. | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
US20040040857A1 (en) * | 1998-03-20 | 2004-03-04 | Semitool, Inc. | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
US20030141194A1 (en) * | 1998-03-20 | 2003-07-31 | Chen Linlin | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
US7115196B2 (en) | 1998-03-20 | 2006-10-03 | Semitool, Inc. | Apparatus and method for electrochemically depositing metal on a semiconductor workpiece |
US6919013B2 (en) | 1998-03-20 | 2005-07-19 | Semitool, Inc. | Apparatus and method for electrolytically depositing copper on a workpiece |
US20040092065A1 (en) * | 1998-03-20 | 2004-05-13 | Semitool, Inc. | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
EP1126512A2 (en) * | 1998-08-11 | 2001-08-22 | Ebara Corporation | Wafer plating method and apparatus |
EP1126512A4 (en) * | 1998-08-11 | 2007-10-17 | Ebara Corp | Wafer plating method and apparatus |
US20060144714A1 (en) * | 1998-08-11 | 2006-07-06 | Akihisa Hongo | Substrate plating method and apparatus |
EP1118696A4 (en) * | 1998-09-03 | 2007-10-17 | Ebara Corp | Method for plating substrate and apparatus |
EP1118696A1 (en) * | 1998-09-03 | 2001-07-25 | Ebara Corporation | Method for plating substrate and apparatus |
US7204924B2 (en) | 1998-12-01 | 2007-04-17 | Novellus Systems, Inc. | Method and apparatus to deposit layers with uniform properties |
US7425250B2 (en) | 1998-12-01 | 2008-09-16 | Novellus Systems, Inc. | Electrochemical mechanical processing apparatus |
US20050016868A1 (en) * | 1998-12-01 | 2005-01-27 | Asm Nutool, Inc. | Electrochemical mechanical planarization process and apparatus |
US20050133379A1 (en) * | 1998-12-01 | 2005-06-23 | Basol Bulent M. | System for electropolishing and electrochemical mechanical polishing |
US7578923B2 (en) | 1998-12-01 | 2009-08-25 | Novellus Systems, Inc. | Electropolishing system and process |
US7427337B2 (en) | 1998-12-01 | 2008-09-23 | Novellus Systems, Inc. | System for electropolishing and electrochemical mechanical polishing |
US20040168926A1 (en) * | 1998-12-01 | 2004-09-02 | Basol Bulent M. | Method and apparatus to deposit layers with uniform properties |
US20080099344A9 (en) * | 1998-12-01 | 2008-05-01 | Basol Bulent M | Electropolishing system and process |
US20040007478A1 (en) * | 1998-12-01 | 2004-01-15 | Basol Bulent M. | Electroetching system and process |
US6638411B1 (en) * | 1999-01-26 | 2003-10-28 | Ebara Corporation | Method and apparatus for plating substrate with copper |
US20040050711A1 (en) * | 1999-01-26 | 2004-03-18 | Koji Mishima | Method and apparatus for plating substrate with copper |
US7438788B2 (en) | 1999-04-13 | 2008-10-21 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US7264698B2 (en) | 1999-04-13 | 2007-09-04 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US20040187731A1 (en) * | 1999-07-15 | 2004-09-30 | Wang Qing Min | Acid copper electroplating solutions |
US20060070885A1 (en) * | 1999-09-17 | 2006-04-06 | Uzoh Cyprian E | Chip interconnect and packaging deposition methods and structures |
US6612915B1 (en) | 1999-12-27 | 2003-09-02 | Nutool Inc. | Work piece carrier head for plating and polishing |
US6354916B1 (en) | 2000-02-11 | 2002-03-12 | Nu Tool Inc. | Modified plating solution for plating and planarization and process utilizing same |
US20020061715A1 (en) * | 2000-02-11 | 2002-05-23 | Nu Tool Inc. | Modified plating solution for plating and planarization and process utilizing same |
US7141146B2 (en) | 2000-02-23 | 2006-11-28 | Asm Nutool, Inc. | Means to improve center to edge uniformity of electrochemical mechanical processing of workpiece surface |
US6413403B1 (en) | 2000-02-23 | 2002-07-02 | Nutool Inc. | Method and apparatus employing pad designs and structures with improved fluid distribution |
US20040266193A1 (en) * | 2000-02-23 | 2004-12-30 | Jeffrey Bogart | Means to improve center-to edge uniformity of electrochemical mechanical processing of workpiece surface |
US7378004B2 (en) | 2000-02-23 | 2008-05-27 | Novellus Systems, Inc. | Pad designs and structures for a versatile materials processing apparatus |
US20060131177A1 (en) * | 2000-02-23 | 2006-06-22 | Jeffrey Bogart | Means to eliminate bubble entrapment during electrochemical processing of workpiece surface |
US6413388B1 (en) | 2000-02-23 | 2002-07-02 | Nutool Inc. | Pad designs and structures for a versatile materials processing apparatus |
US20090020437A1 (en) * | 2000-02-23 | 2009-01-22 | Basol Bulent M | Method and system for controlled material removal by electrochemical polishing |
US6497800B1 (en) | 2000-03-17 | 2002-12-24 | Nutool Inc. | Device providing electrical contact to the surface of a semiconductor workpiece during metal plating |
US20030217932A1 (en) * | 2000-03-17 | 2003-11-27 | Homayoun Talieh | Device providing electrical contact to the surface of a semiconductor workpiece during processing |
US7311811B2 (en) | 2000-03-17 | 2007-12-25 | Novellus Systems, Inc. | Device providing electrical contact to the surface of a semiconductor workpiece during processing |
US20030070930A1 (en) * | 2000-03-17 | 2003-04-17 | Homayoun Talieh | Device providing electrical contact to the surface of a semiconductor workpiece during metal plating and method of providing such contact |
US20040195111A1 (en) * | 2000-03-17 | 2004-10-07 | Homayoun Talieh | Device providing electrical contact to the surface of a semiconductor workpiece during processing |
US7329335B2 (en) | 2000-03-17 | 2008-02-12 | Novellus Systems, Inc. | Device providing electrical contact to the surface of a semiconductor workpiece during processing |
US7491308B2 (en) | 2000-03-17 | 2009-02-17 | Novellus Systems, Inc. | Method of making rolling electrical contact to wafer front surface |
US7282124B2 (en) | 2000-03-17 | 2007-10-16 | Novellus Systems, Inc. | Device providing electrical contact to the surface of a semiconductor workpiece during processing |
US20030209445A1 (en) * | 2000-03-17 | 2003-11-13 | Homayoun Talieh | Device providing electrical contact to the surface of a semiconductor workpiece during processing |
US7476304B2 (en) | 2000-03-17 | 2009-01-13 | Novellus Systems, Inc. | Apparatus for processing surface of workpiece with small electrodes and surface contacts |
US20050269212A1 (en) * | 2000-03-17 | 2005-12-08 | Homayoun Talieh | Method of making rolling electrical contact to wafer front surface |
US20030209425A1 (en) * | 2000-03-17 | 2003-11-13 | Homayoun Talieh | Device providing electrical contact to the surface of a semiconductor workpiece during processing |
US7309413B2 (en) | 2000-03-17 | 2007-12-18 | Novellus Systems, Inc. | Providing electrical contact to the surface of a semiconductor workpiece during processing |
US20060118425A1 (en) * | 2000-04-19 | 2006-06-08 | Basol Bulent M | Process to minimize and/or eliminate conductive material coating over the top surface of a patterned substrate |
US6974769B2 (en) | 2000-04-27 | 2005-12-13 | Asm Nutool, Inc. | Conductive structure fabrication process using novel layered structure and conductive structure fabricated thereby for use in multi-level metallization |
US20040052930A1 (en) * | 2000-04-27 | 2004-03-18 | Bulent Basol | Conductive structure fabrication process using novel layered structure and conductive structure fabricated thereby for use in multi-level metallization |
US6478936B1 (en) | 2000-05-11 | 2002-11-12 | Nutool Inc. | Anode assembly for plating and planarizing a conductive layer |
US6773576B2 (en) | 2000-05-11 | 2004-08-10 | Nutool, Inc. | Anode assembly for plating and planarizing a conductive layer |
US20030015435A1 (en) * | 2000-05-11 | 2003-01-23 | Rimma Volodarsky | Anode assembly for plating and planarizing a conductive layer |
US20050006244A1 (en) * | 2000-05-11 | 2005-01-13 | Uzoh Cyprian E. | Electrode assembly for electrochemical processing of workpiece |
US7195696B2 (en) | 2000-05-11 | 2007-03-27 | Novellus Systems, Inc. | Electrode assembly for electrochemical processing of workpiece |
US7754061B2 (en) | 2000-08-10 | 2010-07-13 | Novellus Systems, Inc. | Method for controlling conductor deposition on predetermined portions of a wafer |
US8236160B2 (en) | 2000-08-10 | 2012-08-07 | Novellus Systems, Inc. | Plating methods for low aspect ratio cavities |
US20070051635A1 (en) * | 2000-08-10 | 2007-03-08 | Basol Bulent M | Plating apparatus and method for controlling conductor deposition on predetermined portions of a wafer |
US20100224501A1 (en) * | 2000-08-10 | 2010-09-09 | Novellus Systems, Inc. | Plating methods for low aspect ratio cavities |
US6942780B2 (en) | 2000-11-03 | 2005-09-13 | Asm Nutool, Inc. | Method and apparatus for processing a substrate with minimal edge exclusion |
US20030209429A1 (en) * | 2000-11-03 | 2003-11-13 | Basol Bulent M. | Method and apparatus for processing a substrate with minimal edge exclusion |
US20060006060A1 (en) * | 2000-11-03 | 2006-01-12 | Basol Bulent M | Method and apparatus for processing a substrate with minimal edge exclusion |
US6610190B2 (en) | 2000-11-03 | 2003-08-26 | Nutool, Inc. | Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate |
US7435323B2 (en) | 2000-12-21 | 2008-10-14 | Novellus Systems, Inc. | Method for controlling thickness uniformity of electroplated layers |
US6802946B2 (en) | 2000-12-21 | 2004-10-12 | Nutool Inc. | Apparatus for controlling thickness uniformity of electroplated and electroetched layers |
US20030230491A1 (en) * | 2001-01-17 | 2003-12-18 | Basol Bulent M. | Method and system monitoring and controlling film thickness profile during plating and electroetching |
US6866763B2 (en) | 2001-01-17 | 2005-03-15 | Asm Nutool. Inc. | Method and system monitoring and controlling film thickness profile during plating and electroetching |
US6863795B2 (en) * | 2001-03-23 | 2005-03-08 | Interuniversitair Microelektronica Centrum (Imec) | Multi-step method for metal deposition |
US20020175080A1 (en) * | 2001-03-23 | 2002-11-28 | Ivo Teerlinck | Multi-step method for metal deposition |
US6695962B2 (en) | 2001-05-01 | 2004-02-24 | Nutool Inc. | Anode designs for planar metal deposits with enhanced electrolyte solution blending and process of supplying electrolyte solution using such designs |
EP1308540A1 (en) * | 2001-10-02 | 2003-05-07 | Shipley Co. L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
US20040104124A1 (en) * | 2001-10-02 | 2004-06-03 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
US6736954B2 (en) | 2001-10-02 | 2004-05-18 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
US20060182879A1 (en) * | 2002-08-21 | 2006-08-17 | Collins Dale W | Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces |
US20040038052A1 (en) * | 2002-08-21 | 2004-02-26 | Collins Dale W. | Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces |
US7025866B2 (en) | 2002-08-21 | 2006-04-11 | Micron Technology, Inc. | Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces |
US20050040049A1 (en) * | 2002-09-20 | 2005-02-24 | Rimma Volodarsky | Anode assembly for plating and planarizing a conductive layer |
US20040074775A1 (en) * | 2002-10-21 | 2004-04-22 | Herdman Roderick Dennis | Pulse reverse electrolysis of acidic copper electroplating solutions |
US20080237053A1 (en) * | 2002-12-04 | 2008-10-02 | International Business Machines Corporation | Structure comprising a barrier layer of a tungsten alloy comprising cobalt and/or nickel |
US20040108136A1 (en) * | 2002-12-04 | 2004-06-10 | International Business Machines Corporation | Structure comprising a barrier layer of a tungsten alloy comprising cobalt and/or nickel |
US20040211657A1 (en) * | 2003-04-11 | 2004-10-28 | Ingelbrecht Hugo Gerard Eduard | Method of purifying 2,6-xylenol and method of producing poly(arylene ether) therefrom |
US20070131563A1 (en) * | 2003-04-14 | 2007-06-14 | Asm Nutool, Inc. | Means to improve center to edge uniformity of electrochemical mechanical processing of workpiece surface |
US20040249177A1 (en) * | 2003-06-04 | 2004-12-09 | Shipley Company, L.L.C. | Leveler compounds |
US7128822B2 (en) | 2003-06-04 | 2006-10-31 | Shipley Company, L.L.C. | Leveler compounds |
US20050092611A1 (en) * | 2003-11-03 | 2005-05-05 | Semitool, Inc. | Bath and method for high rate copper deposition |
US7648622B2 (en) | 2004-02-27 | 2010-01-19 | Novellus Systems, Inc. | System and method for electrochemical mechanical polishing |
US20060006073A1 (en) * | 2004-02-27 | 2006-01-12 | Basol Bulent M | System and method for electrochemical mechanical polishing |
USRE49202E1 (en) | 2004-11-12 | 2022-09-06 | Macdermid Enthone Inc. | Copper electrodeposition in microelectronics |
JP2005136433A (en) * | 2004-12-15 | 2005-05-26 | Internatl Business Mach Corp <Ibm> | Electroplated interconnection structure on integrated circuit chip |
JP4551206B2 (en) * | 2004-12-15 | 2010-09-22 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Electroplated interconnect structures on integrated circuit chips. |
US20110054397A1 (en) * | 2006-03-31 | 2011-03-03 | Menot Sebastien | Medical liquid injection device |
US7338585B2 (en) * | 2006-05-17 | 2008-03-04 | Intel Corporation | Electroplating chemistries and methods of forming interconnections |
US20070267297A1 (en) * | 2006-05-17 | 2007-11-22 | Akolkar Rohan N | Electroplating Chemistries and Methods of Forming Interconnections |
US7947163B2 (en) | 2006-07-21 | 2011-05-24 | Novellus Systems, Inc. | Photoresist-free metal deposition |
US20090280243A1 (en) * | 2006-07-21 | 2009-11-12 | Novellus Systems, Inc. | Photoresist-free metal deposition |
US20090277801A1 (en) * | 2006-07-21 | 2009-11-12 | Novellus Systems, Inc. | Photoresist-free metal deposition |
US8500985B2 (en) | 2006-07-21 | 2013-08-06 | Novellus Systems, Inc. | Photoresist-free metal deposition |
US20080237048A1 (en) * | 2007-03-30 | 2008-10-02 | Ismail Emesh | Method and apparatus for selective electrofilling of through-wafer vias |
US20090065365A1 (en) * | 2007-09-11 | 2009-03-12 | Asm Nutool, Inc. | Method and apparatus for copper electroplating |
JP2009065207A (en) * | 2008-12-10 | 2009-03-26 | Internatl Business Mach Corp <Ibm> | Electroplated interconnection structure on integrated circuit chip |
JP2010206212A (en) * | 2010-04-22 | 2010-09-16 | Internatl Business Mach Corp <Ibm> | Electroplating interconnection structure on integrated circuit chip |
CN102703939A (en) * | 2012-06-07 | 2012-10-03 | 上海交通大学 | Stress relieving agent for copper methane sulfonate electroplate liquid and use method thereof |
CN102703938A (en) * | 2012-06-07 | 2012-10-03 | 上海交通大学 | Stress relieving agent for copper sulfate electroplate liquid |
CN102703939B (en) * | 2012-06-07 | 2014-12-24 | 上海交通大学 | Stress relieving agent for copper methane sulfonate electroplate liquid and use method thereof |
CN102703938B (en) * | 2012-06-07 | 2015-04-22 | 上海交通大学 | Stress relieving agent for copper sulfate electroplate liquid |
US10982343B2 (en) * | 2017-11-09 | 2021-04-20 | Atotech Deutschland Gmbh | Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate |
CN111748087A (en) * | 2020-07-20 | 2020-10-09 | 中国科学院大学温州研究院(温州生物材料与工程研究所) | Dye modified PEG and application thereof in acid bright copper plating |
CN111748087B (en) * | 2020-07-20 | 2022-06-21 | 国科温州研究院(温州生物材料与工程研究所) | Dye modified PEG and application thereof in acid bright copper plating |
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