|
| US3940320 | 21 Nov 1974 | 24 Feb 1976 | M & T Chemicals Inc. | Electrodeposition of copper |
| US3956078 | 21 Nov 1974 | 11 May 1976 | M & T Chemicals Inc. | Electrodeposition of copper |
| US3956079 | 21 Nov 1974 | 11 May 1976 | M & T Chemicals Inc. | Electrodeposition of copper |
| US3956084 | 21 Nov 1974 | 11 May 1976 | M & T Chemicals Inc. | Electrodeposition of copper |
| US3956120 | 21 Nov 1974 | 11 May 1976 | M & T Chemicals Inc. | Electrodeposition of copper |
| US3966565 | 21 Nov 1974 | 29 Jun 1976 | M & T Chemicals Inc. | Electrodeposition of copper |
| US4014760 | 17 Feb 1976 | 29 Mar 1977 | M & T Chemicals Inc. | Electrodeposition of copper |
| US4036710 | 24 Dec 1975 | 19 Jul 1977 | M & T Chemicals Inc. | Electrodeposition of copper |
| US4036711 | 17 Sep 1976 | 19 Jul 1977 | M & T Chemicals Inc. | Electrodeposition of copper |
| US4316778 | 24 Sep 1980 | 23 Feb 1982 | RCA Corporation | Method for the manufacture of recording substrates for capacitance electronic discs |
| US4336114 | 26 Mar 1981 | 22 Jun 1982 | Hooker Chemicals & Plastics Corp. | Electrodeposition of bright copper |
| US4376685 | 24 Jun 1981 | 15 Mar 1983 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
| US4551212 | 11 Mar 1985 | 5 Nov 1985 | RCA Corporation | Bath and process for the electrodeposition of micromachinable copper and additive for said bath |
| US4673467 | 2 Sep 1986 | 16 Jun 1987 | CBS Inc. | Method of manufacturing fine-grained copper substrate for optical information carrier |
| US5252196 | 5 Dec 1991 | 12 Oct 1993 | Shipley Company Inc. | Copper electroplating solutions and processes |
| US5328589 | 23 Dec 1992 | 12 Jul 1994 | Enthone-OMI, Inc. | Functional fluid additives for acid copper electroplating baths |
| US5985126 | 30 Sep 1997 | 16 Nov 1999 | Semitool, Inc. | Semiconductor plating system workpiece support having workpiece engaging electrodes with distal contact part and dielectric cover |
| US6358388 | 16 Nov 1999 | 19 Mar 2002 | Semitool, Inc. | Plating system workpiece support having workpiece-engaging electrodes with distal contact-part and dielectric cover |
| US6391209 | 25 May 2000 | 21 May 2002 | Mykrolis Corporation | Regeneration of plating baths |
| US6454926 | 30 Sep 1997 | 24 Sep 2002 | Semitool Inc. | Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areas |
| US6565729 | 7 Dec 2000 | 20 May 2003 | Semitool, Inc. | Method for electrochemically depositing metal on a semiconductor workpiece |
| US6596148 | 30 Aug 2000 | 22 Jul 2003 | Mykrolis Corporation | Regeneration of plating baths and system therefore |
| US6632345 | 23 Oct 2000 | 14 Oct 2003 | Semitool, Inc. | Apparatus and method for electrolytically depositing a metal on a workpiece |
| US6638410 | 22 Nov 2002 | 28 Oct 2003 | Semitool, Inc. | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
| US6663762 | 19 Mar 2002 | 16 Dec 2003 | Semitool, Inc. | Plating system workpiece support having workpiece engaging electrode |
| US6776892 | 14 Mar 2000 | 17 Aug 2004 | Semitool, Inc. | Semiconductor plating system workpiece support having workpiece engaging electrode with pre-conditioned contact face |
| US6806186 | 23 Mar 2001 | 19 Oct 2004 | Semitool, Inc. | Submicron metallization using electrochemical deposition |
| US6811675 | 20 Jun 2001 | 2 Nov 2004 | Semitool, Inc. | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
| US6887364 | 17 Oct 2002 | 3 May 2005 | TI Group Automotive Systems Limited | Method for manufacturing a multiple walled tube |
| US6919013 | 3 Feb 2003 | 19 Jul 2005 | Semitool, Inc. | Apparatus and method for electrolytically depositing copper on a workpiece |
| US6932892 | 27 Oct 2003 | 23 Aug 2005 | Semitool, Inc. | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
| US6936153 | 30 Sep 1997 | 30 Aug 2005 | Semitool, Inc. | Semiconductor plating system workpiece support having workpiece-engaging electrode with pre-conditioned contact face |
| US6942779 | 2 May 2002 | 13 Sep 2005 | Mykrolis Corporation | Method and system for regenerating of plating baths |
| US7025866 | 21 Aug 2002 | 11 Apr 2006 | Micron Technology, Inc. | Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces |
| US7074246 | 28 May 2002 | 11 Jul 2006 | Semitool, Inc. | Modular semiconductor workpiece processing tool |
| US7115196 | 27 Feb 2003 | 3 Oct 2006 | Semitool, Inc. | Apparatus and method for electrochemically depositing metal on a semiconductor workpiece |
| US7144805 | 1 Jul 2004 | 5 Dec 2006 | Semitool, Inc. | Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density |
| US7247229 | 18 Oct 2002 | 24 Jul 2007 | ELTECH Systems Corporation | Coatings for the inhibition of undesirable oxidation in an electrochemical cell |
| US7332066 | 7 Feb 2005 | 19 Feb 2008 | Semitool, Inc. | Apparatus and method for electrochemically depositing metal on a semiconductor workpiece |
| US7786303 | 9 Nov 2004 | 31 Aug 2010 | Atotech Deutschland GmbH | Acidic bath for electrolytically depositing a copper deposit containing halogenated or pseudohalogenated monomeric phenazinium compounds |
| US7872130 | 9 Dec 2003 | 18 Jan 2011 | Atotech Deutschland GmbH | Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit |
| US8137447 | 25 Jun 2009 | 20 Mar 2012 | C. Uyemura & Co., Ltd. | Electroless plating solution, method for electroless plating using the same and method for manufacturing circuit board |
| US8197583 | 14 Nov 2011 | 12 Jun 2012 | C. Uyemura & Co., Ltd. | Electroless plating solution, method for electroless plating using the same and method for manufacturing circuit board |
