US2742413A - Bright copper plating bath - Google Patents
Bright copper plating bath Download PDFInfo
- Publication number
- US2742413A US2742413A US348581A US34858153A US2742413A US 2742413 A US2742413 A US 2742413A US 348581 A US348581 A US 348581A US 34858153 A US34858153 A US 34858153A US 2742413 A US2742413 A US 2742413A
- Authority
- US
- United States
- Prior art keywords
- bath
- copper
- thiourea
- plating bath
- copper plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 title claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title description 32
- 229910052802 copper Inorganic materials 0.000 title description 32
- 239000010949 copper Substances 0.000 title description 32
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 26
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 13
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 claims description 8
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 8
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 claims description 8
- LRFVTYWOQMYALW-UHFFFAOYSA-N 9H-xanthine Chemical compound O=C1NC(=O)NC2=C1NC=N2 LRFVTYWOQMYALW-UHFFFAOYSA-N 0.000 claims description 7
- HTKFORQRBXIQHD-UHFFFAOYSA-N allylthiourea Chemical compound NC(=S)NCC=C HTKFORQRBXIQHD-UHFFFAOYSA-N 0.000 claims description 5
- 229960001748 allylthiourea Drugs 0.000 claims description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 4
- 235000010299 hexamethylene tetramine Nutrition 0.000 claims description 4
- 239000004312 hexamethylene tetramine Substances 0.000 claims description 4
- 229960004011 methenamine Drugs 0.000 claims description 4
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 4
- 229940075420 xanthine Drugs 0.000 claims description 3
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 2
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 claims 1
- WCYWZMWISLQXQU-UHFFFAOYSA-N methyl Chemical class [CH3] WCYWZMWISLQXQU-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 description 10
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- RYYVLZVUVIJVGH-UHFFFAOYSA-N caffeine Chemical compound CN1C(=O)N(C)C(=O)C2=C1N=CN2C RYYVLZVUVIJVGH-UHFFFAOYSA-N 0.000 description 6
- 239000000945 filler Substances 0.000 description 6
- 150000003585 thioureas Chemical class 0.000 description 6
- 229910017464 nitrogen compound Inorganic materials 0.000 description 5
- IPCRBOOJBPETMF-UHFFFAOYSA-N N-acetylthiourea Chemical compound CC(=O)NC(N)=S IPCRBOOJBPETMF-UHFFFAOYSA-N 0.000 description 4
- -1 methylthiourea Chemical class 0.000 description 4
- YAPQBXQYLJRXSA-UHFFFAOYSA-N theobromine Chemical compound CN1C(=O)NC(=O)C2=C1N=CN2C YAPQBXQYLJRXSA-UHFFFAOYSA-N 0.000 description 4
- LPHGQDQBBGAPDZ-UHFFFAOYSA-N Isocaffeine Natural products CN1C(=O)N(C)C(=O)C2=C1N(C)C=N2 LPHGQDQBBGAPDZ-UHFFFAOYSA-N 0.000 description 3
- 229960001948 caffeine Drugs 0.000 description 3
- VJEONQKOZGKCAK-UHFFFAOYSA-N caffeine Natural products CN1C(=O)N(C)C(=O)C2=C1C=CN2C VJEONQKOZGKCAK-UHFFFAOYSA-N 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- ZFXYFBGIUFBOJW-UHFFFAOYSA-N theophylline Chemical compound O=C1N(C)C(=O)N(C)C2=C1NC=N2 ZFXYFBGIUFBOJW-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 2
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 2
- 235000011130 ammonium sulphate Nutrition 0.000 description 2
- 239000001166 ammonium sulphate Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 125000000623 heterocyclic group Chemical group 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 150000002830 nitrogen compounds Chemical class 0.000 description 2
- 229960004559 theobromine Drugs 0.000 description 2
- 229960000278 theophylline Drugs 0.000 description 2
- KQJQICVXLJTWQD-UHFFFAOYSA-N N-Methylthiourea Chemical compound CNC(N)=S KQJQICVXLJTWQD-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910001651 emery Inorganic materials 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 150000003222 pyridines Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Definitions
- the acid copper bath in so far makes a favorable exception on the baths, that it has some filling action, in other words, partially fills up gaps, pits and other unevennesses in the surface so that one aimed at improving the filling action of the copper bath, while maintaining other favorable properties such as the capacity to deposit a soft coating on the metal, etc.
- objects are electrolytically provided with a copper deposit with the aid of an acid bath by using a bath con taining the combination of a water-soluble derivative of thiourea and a water-soluble heterocyclic nitrogen compound.
- the invention extends to the preparation of an acid copper bath containing the combination of thiourea or a added tothe-bath in combination with the heterocyclic nitrogen compounds allyl thiourea is preferred as well"
- the invention is elucidated by the followingsiexarnpleszi' I Example I V
- This bath was brought at a temperature of 30 C. and was kept in motion by blowing in a current of air.
- the anode was of copper.
- As the cathode a 50 cm. long iron tube with a diameter of 3.5 cm. and a wall thickness of 2 mm.
- the cathode current density of the main treatment in 1 the acid copper bath according to the invention was adjusted to 8 a./dm. and in 20 minutes 32; of copper was deposited on the tube.
- the copper layer was soft and lustrous, and the numerous unevennesses originally present on the surface of the tube, had substantially disappeared after the electro-deposition of the copper in the above-described bath.
- Example III An acid copper bath of the following composition was prepared:
- a bright copper plating bath comprising copper sulfate, sulfuric acid, a brightener in proportion of 5 to mg. per liter of solution, said brightener being selected from the group consisting of thiourea, allylthiourea and acetylthiourea, and a filler selected from the group consisting of xanthine and its methyl homologues, hexamethylene tetramine, pyridine and morpholine.
- a bath according to claim 1, wherein said brightener is allylthiourea.
- a bath according to claim 1, wherein said brightener is acetylthiourea.
- a bath according to claim 1 hexamethylene tetramine.
Description
Unitedtsratesfi Patent Claims priority, application Netherlands July5j1952 9 Claims. (ClIZM -SZ) The electrolytic deposition of copper is an operation. whichds appliedv very frequently.- in the. metal industry and is carried out either to embellish the surface of the treatedwbjects or to increase the corrosion resistance thereof," while the electro-de'posited" copper als'o serves as a base for a further treatment such-as the electrolytic depositionof nickel. ln'pra'ctice hig'hdemands are made on the appearance of the treated objects'so' that theseup" till now had to be ground and polished in an earlier-or later stageofthe'treatment which entails a number of operations, of whiehithe cost connect'ed therewith form a greatpart of the total cost of the surface:treatment,.theelectrolytic deposition of copper formsa-part of I Mdstelectfolyti'ci baths have the property that they do not fill up unevennesses in -the' metalsurface such as scratches and-the like but rather accentuate them, .and especially the baths for the electro-deposition of bright metal layers, from which a very fine crystalline metal deposit is precipitated, have the property that they, besides covering the uneven metal surface with a bright metal layer, also cover the unevennesses only with a thin layer, due to which the latter, although lustrous, remain visible in an undiminished degree.
It has now been found that the acid copper bath in so far makes a favorable exception on the baths, that it has some filling action, in other words, partially fills up gaps, pits and other unevennesses in the surface so that one aimed at improving the filling action of the copper bath, while maintaining other favorable properties such as the capacity to deposit a soft coating on the metal, etc.
It has been proposed to meet the above-described need by adding an organic substance to the copper bath. It is known e. g. from the U. S. P. 1,903,860 to add thiourea or a water-soluble derivative of thiourea, such as methylthiourea, to metal baths. It has been found, however, that the copper coating which is precipitated from the copper baths thus prepared, is very hard, so that it easily springs off on bending and moreover has a very small lustrous range which is considered as a very serious drawback of these baths. Moreover, the action of a copper bath containing exclusively thiourea as an organic compound decreases very soon. 7
It has now been found that a soft copper layer is obtained if the combination of thiourea or a water-soluble derivative of thiourea and a water-soluble heterocyclic nitrogen compound is added to an acid copper bath. The bath thus prepared displays moreover an excellent filling capacity and has a wide lustrous range.
According to the invention objects, particularly metal objects, are electrolytically provided with a copper deposit with the aid of an acid bath by using a bath con taining the combination of a water-soluble derivative of thiourea and a water-soluble heterocyclic nitrogen compound.
The invention extends to the preparation of an acid copper bath containing the combination of thiourea or a added tothe-bath in combination with the heterocyclic nitrogen compounds allyl thiourea is preferred as well" I 2,742,413 Patented Apr. 17,1956
water-soluble "derivative of thiourea and a water-soluble heterocyclic"nitrogencompound, as well'as to objects electrolyticallyprovided with a copper layer with the aidbf are bath:
Of themvatensoluble hetero'cyclic nitrogen compounds which are*used'in combinatiomwith thiourea or a watersoluble iderivative' of thiourea in theacid copper bath,
compoundsioflthe :xanthine group, particularly-the methyl 1 nonro1ogues'; --sueh as caffeine (l,3;7-trimethylxanthine),-
theophyllirie (1,3-dimethylxanthine) and" theobromine (3,f7-'dimethy1xanthine) are preferred," as well as hexa-=- methylene itetr'ami'ne; morpholine' and pyridine; as well as the ring systems, containing the pyridine nucleus,-=such as quinoline.
Of the'water-soluble thiourea derivatives -which are as acetylthiourea, ,while the thiourea itself, possible;
still exceeds in activity, these two. above-mentioned thiourea derivatives.
The invention is elucidated by the followingsiexarnpleszi' I Example I V Am -"acid copper batha of the following composition was preparedt cuso s aq.... a.;-fi.. ==a..a..agr/l 200 HaSQt. g. /Lt... ,Thiourea g 10 Pyridine mg./l 40 This bath was brought at a temperature of 30 C. and was kept in motion by blowing in a current of air. The anode was of copper. As the cathode a 50 cm. long iron tube with a diameter of 3.5 cm. and a wall thickness of 2 mm. was connected after it having been subjected as a short pretreatment in a cyanidic copper bath to a socalled copper strike" in which a copper layer of very slight thickness was deposited on the outer wall and on a small part of the inner surface adjacent to the ends. The cathode current density of the main treatment in 1 the acid copper bath according to the invention was adjusted to 8 a./dm. and in 20 minutes 32; of copper was deposited on the tube. The copper layer was soft and lustrous, and the numerous unevennesses originally present on the surface of the tube, had substantially disappeared after the electro-deposition of the copper in the above-described bath.
' Example II An acid copper bath of the following composition was prepared: 7
015045 aq g./l. 250 H2804 ..g./l 2,0 Ammonium sulphate g./l 20 Acetyl thiourea mg./1 20 Caffeine rng./l 50 In this bath an iron plate of 4.5 x 25 dm. was provided with a copper layer at a bath temperature of 25 C. and
Example III An acid copper bath of the following composition was prepared:
Copper fiuoborate ..g./l 400 Fluoboric acid g./l 50 Thiourea mg./l 12 Hexamethylene tetramine mg./l 800 An acid copper bath of the following composition was prepared:
CuSO4.5 aq g./l 250 H2804 g./l 20 Ammonium sulphate g./l 20 Allyl thiourea mg./l 20 Morpholine mg./l 45 A number of small iron plates of 6 x 6 cm. (thickness 0.2 cm.) which had been ground with emery beforehand were provided with a copper layer during 40 minutes at 26 C. in the above-mentioned bath which was kept in motion with air. The cathode current density amounted to 6 a./dm. and the duration of the treatment was 35 minutes. The thickness of the layer was 4211.,
but it is more important that nothing could be seen anymore of the grinding scratches originally present.
What is claimed is:
1. A bright copper plating bath comprising copper sulfate, sulfuric acid, a brightener in proportion of 5 to mg. per liter of solution, said brightener being selected from the group consisting of thiourea, allylthiourea and acetylthiourea, and a filler selected from the group consisting of xanthine and its methyl homologues, hexamethylene tetramine, pyridine and morpholine.
2. A bath according to claim 1, wherein said brightener is thiourea.
3. A bath according to claim 1, wherein said brightener is allylthiourea.
4. A bath according to claim 1, wherein said brightener is acetylthiourea.
5. A bath according to claim 1, wherein said filler is xanthine.
6. A bath according to claim 1, caffeine.
7. A bath according to claim 1, theobromine.
8. A bath according to claim 1, theophylline.
9. A bath according to claim 1, hexamethylene tetramine.
wherein said filler is wherein said filler is wherein said filler is wherein said filler is References Cited in the file of this patent UNITED STATES PATENTS 2,391,289 Beaver Dec. 18, 1945 2,700,020 Pierce Jan. 18, 1955 FOREIGN PATENTS 461,186 Canada Nov. 22, 1949
Claims (1)
1. A BRIGHT COPPER PLATING BATH COMPRISING COPPER SULFATE, SULFURIC ACID, A BRIGHTENER IN PORPORTION OF 5 TO 50 MG. PER LITER OF SOLUTION, SAID BRIGHTENER BEING SELECTED FROM THE GROUP CONSISTING OF THIOUREA, ALLYLTHIOUREA AND ACETYL.THIOUREA, AND A FILLER SELECTED FROM THE GROUP CONSISTING OF XANTHINE AND ITS METHYL HOMOLOGUES, HEXAMETHYLENE TETRAMINE, PYRIDINE AND MORPHOLINE.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL2742412X | 1952-07-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US2742413A true US2742413A (en) | 1956-04-17 |
Family
ID=19875526
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US348582A Expired - Lifetime US2742412A (en) | 1952-07-05 | 1953-04-13 | Electrolytic deposition of copper |
| US348581A Expired - Lifetime US2742413A (en) | 1952-07-05 | 1953-04-13 | Bright copper plating bath |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US348582A Expired - Lifetime US2742412A (en) | 1952-07-05 | 1953-04-13 | Electrolytic deposition of copper |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US2742412A (en) |
| BE (1) | BE518440A (en) |
| DE (2) | DE940860C (en) |
| NL (4) | NL81606C (en) |
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3075899A (en) * | 1958-04-26 | 1963-01-29 | Dehydag Gmbh | Baths for the production of metal electroplates |
| US4009087A (en) * | 1974-11-21 | 1977-02-22 | M&T Chemicals Inc. | Electrodeposition of copper |
| EP0952242A1 (en) * | 1998-04-21 | 1999-10-27 | Applied Materials, Inc. | Electro deposition chemistry |
| US20020113039A1 (en) * | 1999-07-09 | 2002-08-22 | Mok Yeuk-Fai Edwin | Integrated semiconductor substrate bevel cleaning apparatus and method |
| US6478937B2 (en) | 2001-01-19 | 2002-11-12 | Applied Material, Inc. | Substrate holder system with substrate extension apparatus and associated method |
| US6551484B2 (en) | 1999-04-08 | 2003-04-22 | Applied Materials, Inc. | Reverse voltage bias for electro-chemical plating system and method |
| US6571657B1 (en) | 1999-04-08 | 2003-06-03 | Applied Materials Inc. | Multiple blade robot adjustment apparatus and associated method |
| US6576110B2 (en) | 2000-07-07 | 2003-06-10 | Applied Materials, Inc. | Coated anode apparatus and associated method |
| US20030146102A1 (en) * | 2002-02-05 | 2003-08-07 | Applied Materials, Inc. | Method for forming copper interconnects |
| US6610189B2 (en) | 2001-01-03 | 2003-08-26 | Applied Materials, Inc. | Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature |
| US20030201166A1 (en) * | 2002-04-29 | 2003-10-30 | Applied Materials, Inc. | method for regulating the electrical power applied to a substrate during an immersion process |
| US20030201184A1 (en) * | 1999-04-08 | 2003-10-30 | Applied Materials, Inc. | Method and associated apparatus for tilting a substrate upon entry for metal deposition |
| US20040020780A1 (en) * | 2001-01-18 | 2004-02-05 | Hey H. Peter W. | Immersion bias for use in electro-chemical plating system |
| US20040200725A1 (en) * | 2003-04-09 | 2004-10-14 | Applied Materials Inc. | Application of antifoaming agent to reduce defects in a semiconductor electrochemical plating process |
| US20040206628A1 (en) * | 2003-04-18 | 2004-10-21 | Applied Materials, Inc. | Electrical bias during wafer exit from electrolyte bath |
| US6808612B2 (en) | 2000-05-23 | 2004-10-26 | Applied Materials, Inc. | Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio |
| US20050092601A1 (en) * | 2003-10-29 | 2005-05-05 | Harald Herchen | Electrochemical plating cell having a diffusion member |
| US20050092602A1 (en) * | 2003-10-29 | 2005-05-05 | Harald Herchen | Electrochemical plating cell having a membrane stack |
| US6913680B1 (en) | 2000-05-02 | 2005-07-05 | Applied Materials, Inc. | Method of application of electrical biasing to enhance metal deposition |
| US20060102467A1 (en) * | 2004-11-15 | 2006-05-18 | Harald Herchen | Current collimation for thin seed and direct plating |
| US20060175201A1 (en) * | 2005-02-07 | 2006-08-10 | Hooman Hafezi | Immersion process for electroplating applications |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE962489C (en) * | 1954-02-10 | 1957-04-25 | Dehydag Gmbh | Saver pickling agent to protect metals when treated with acidic agents |
| DE1007592B (en) * | 1955-01-19 | 1957-05-02 | Dehydag Gmbh | Bath for the production of galvanic metal coatings |
| US2853443A (en) * | 1956-04-25 | 1958-09-23 | Westinghouse Electric Corp | Addition agent for acid copper electrolytes |
| BE565994A (en) * | 1957-04-16 | |||
| US2931760A (en) * | 1957-09-25 | 1960-04-05 | Leon R Westbrook | Acid copper plating |
| US3770599A (en) * | 1971-05-24 | 1973-11-06 | Oxy Metal Finishing Corp | Acid zinc plating baths |
| US4474649A (en) * | 1982-06-21 | 1984-10-02 | Asarco Incorporated | Method of thiourea addition of electrolytic solutions useful for copper refining |
| JPH02232391A (en) * | 1988-12-21 | 1990-09-14 | Internatl Business Mach Corp <Ibm> | Additive plating bath and method thereof |
| US6565729B2 (en) * | 1998-03-20 | 2003-05-20 | Semitool, Inc. | Method for electrochemically depositing metal on a semiconductor workpiece |
| TWI223678B (en) * | 1998-03-20 | 2004-11-11 | Semitool Inc | Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper |
| US20100140098A1 (en) * | 2008-05-15 | 2010-06-10 | Solopower, Inc. | Selenium containing electrodeposition solution and methods |
| JP2017503929A (en) * | 2013-11-25 | 2017-02-02 | エンソン インコーポレイテッド | Copper electrodeposition |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2391289A (en) * | 1941-09-15 | 1945-12-18 | Jr John F Beaver | Bright copper plating |
| CA461186A (en) * | 1949-11-22 | John Franklin Beaver, Jr. | Bright copper plating | |
| US2700020A (en) * | 1952-06-02 | 1955-01-18 | Houdaille Hershey Corp | Plating copper |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA477508A (en) * | 1951-10-02 | Brown Henry | Electrodeposition of nickel from acid baths | |
| DE104111C (en) * | ||||
| US2196588A (en) * | 1937-05-26 | 1940-04-09 | Du Pont | Electroplating |
| US2315802A (en) * | 1940-04-20 | 1943-04-06 | Harshaw Chem Corp | Nickel plating |
| US2389179A (en) * | 1941-02-21 | 1945-11-20 | Udylite Corp | Electrodeposition of metals |
| US2489538A (en) * | 1941-05-24 | 1949-11-29 | Gen Motors Corp | Electrodeposition of copper |
| US2355505A (en) * | 1941-10-03 | 1944-08-08 | Purdue Research Foundation | Electrodeposition of bright zinc |
| US2462870A (en) * | 1942-07-09 | 1949-03-01 | Gen Motors Corp | Electrodeposition of copper |
| US2472393A (en) * | 1944-09-25 | 1949-06-07 | American Steel & Wire Co | Process and bath for copper coating ferrous metal |
| BE504701A (en) * | 1950-07-17 |
-
0
- NL NLAANVRAGE7413473,A patent/NL170871B/en unknown
- NL NLAANVRAGE7106028,A patent/NL170870B/en unknown
- NL NL84048D patent/NL84048C/xx active
- BE BE518440D patent/BE518440A/xx unknown
- NL NL81606D patent/NL81606C/xx active
-
1952
- 1952-07-30 DE DEN5864A patent/DE940860C/en not_active Expired
- 1952-07-30 DE DEN5865A patent/DE962129C/en not_active Expired
-
1953
- 1953-04-13 US US348582A patent/US2742412A/en not_active Expired - Lifetime
- 1953-04-13 US US348581A patent/US2742413A/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA461186A (en) * | 1949-11-22 | John Franklin Beaver, Jr. | Bright copper plating | |
| US2391289A (en) * | 1941-09-15 | 1945-12-18 | Jr John F Beaver | Bright copper plating |
| US2700020A (en) * | 1952-06-02 | 1955-01-18 | Houdaille Hershey Corp | Plating copper |
Cited By (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3075899A (en) * | 1958-04-26 | 1963-01-29 | Dehydag Gmbh | Baths for the production of metal electroplates |
| US4009087A (en) * | 1974-11-21 | 1977-02-22 | M&T Chemicals Inc. | Electrodeposition of copper |
| US6610191B2 (en) | 1998-04-21 | 2003-08-26 | Applied Materials, Inc. | Electro deposition chemistry |
| US6350366B1 (en) | 1998-04-21 | 2002-02-26 | Applied Materials, Inc. | Electro deposition chemistry |
| EP0952242A1 (en) * | 1998-04-21 | 1999-10-27 | Applied Materials, Inc. | Electro deposition chemistry |
| US6113771A (en) * | 1998-04-21 | 2000-09-05 | Applied Materials, Inc. | Electro deposition chemistry |
| US20030205474A1 (en) * | 1998-04-21 | 2003-11-06 | Applied Materials, Inc. | Electro deposition chemistry |
| US20030201184A1 (en) * | 1999-04-08 | 2003-10-30 | Applied Materials, Inc. | Method and associated apparatus for tilting a substrate upon entry for metal deposition |
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Also Published As
| Publication number | Publication date |
|---|---|
| NL170870B (en) | |
| NL81606C (en) | |
| BE518440A (en) | |
| NL84048C (en) | |
| US2742412A (en) | 1956-04-17 |
| DE940860C (en) | 1956-03-29 |
| NL170871B (en) | |
| DE962129C (en) | 1957-04-18 |
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