US20160201994A1 - Carrier with heat dissipation structure - Google Patents
Carrier with heat dissipation structure Download PDFInfo
- Publication number
- US20160201994A1 US20160201994A1 US14/594,181 US201514594181A US2016201994A1 US 20160201994 A1 US20160201994 A1 US 20160201994A1 US 201514594181 A US201514594181 A US 201514594181A US 2016201994 A1 US2016201994 A1 US 2016201994A1
- Authority
- US
- United States
- Prior art keywords
- heat dissipation
- heat
- carrier
- main body
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 48
- 239000012530 fluid Substances 0.000 claims abstract description 22
- 238000010521 absorption reaction Methods 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 6
- 239000005060 rubber Substances 0.000 claims abstract description 5
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 4
- 239000004020 conductor Substances 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000007788 liquid Substances 0.000 abstract description 13
- 238000009825 accumulation Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
- F28F13/182—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing especially adapted for evaporator or condenser surfaces
-
- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G17/00—Structural details; Housings
- G04G17/08—Housings
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/163—Wearable computers, e.g. on a belt
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/04—Supports for telephone transmitters or receivers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/3827—Portable transceivers
- H04B1/385—Transceivers carried on the body, e.g. in helmets
- H04B2001/3861—Transceivers carried on the body, e.g. in helmets carried in a hand or on fingers
Definitions
- the present invention relates generally to a carrier with heat dissipation structure, and more particularly to a carrier with heat dissipation structure, which is applicable to wearable intelligent mobile device for dissipating heat.
- the intelligent wearable device is equipped with various electronic components such as touch screen and satellite positioning chip. Therefore, the intelligent watch is connectable to other mobile devices via Bluetooth or network. Moreover, a SIN card can be inserted into the intelligent watch to access to 3G or 4G network and make phone calls. In operation, the intelligent watch will generate heat. In addition, the entire intelligent watch is designed with a fully sealed structure for achieving waterproof effect. Under such circumstance, the heat generated by the electronic components in the intelligent watch can be hardly dissipated outward. As a result, the heat will accumulate in the interior of the watch.
- the watchband of the conventional intelligent watch for a user to wear can be made of metal material, leather, rubber, plastic or the like material. All these material can hardly effectively conduct the heat generated by the intelligent watch outward to dissipate the heat. Moreover, the watchband must be flexible for a user to conveniently wear. Therefore, it is impossible to combine an inflexible heat dissipation component (such as heat pipe or vapor chamber) with the watchband for dissipation heat.
- an inflexible heat dissipation component such as heat pipe or vapor chamber
- the intelligent watch is often overheated to cause deterioration of execution efficiency of the intelligent watch or even shutdown of the intelligent watch. Accordingly, it has become a critical issue how to solve the heat dissipation problem of the intelligent watch and various intelligent wearable devices.
- the carrier is applicable to an intelligent mobile device to effectively solve the heat accumulation problem of the intelligent mobile device.
- the carrier with heat dissipation structure of the present invention includes a main body.
- the main body is made of silicone or rubber material.
- the main body has a chamber having a capillary structure.
- a working fluid is contained in the chamber.
- At least one support section protrudes from a wall face of the chamber.
- the main body has at least one heat absorption section and a heat dissipation section.
- the heat dissipation section extends from at least one end of the heat absorption section.
- the carrier of the present invention is flexible.
- the carrier has an internal chamber for vapor-liquid circulation and heat exchange of the working fluid. Accordingly, the heat dissipation efficiency of the intelligent mobile device correspondingly assembled with the carrier is greatly enhanced.
- FIG. 1 is a perspective view of a first embodiment of the carrier with heat dissipation structure of the present invention
- FIG. 2 is a sectional view of the first embodiment of the carrier with heat dissipation structure of the present invention
- FIG. 3 is a perspective sectional view of a second embodiment of the carrier with heat dissipation structure of the present invention.
- FIG. 4 is a perspective exploded view of a third embodiment of the carrier with heat dissipation structure of the present invention.
- FIG. 5 is a sectional view of a fourth embodiment of the carrier with heat dissipation structure of the present invention.
- FIG. 6 is a perspective exploded view of a fifth embodiment of the carrier with heat dissipation structure of the present invention.
- FIG. 1 is a perspective view of a first embodiment of the carrier with heat dissipation structure of the present invention.
- FIG. 2 is a sectional view of the first embodiment of the carrier with heat dissipation structure of the present invention.
- the carrier with heat dissipation structure of the present invention includes a main body 11 .
- the main body 11 is made of silicone or rubber material.
- the main body 11 has a chamber 111 having a capillary structure 113 .
- a working fluid 2 is contained in the chamber 111 .
- a support section 111 a protrudes from a wall face of the chamber 111 .
- the main body 11 has at least one heat absorption section 112 and a heat dissipation section 114 .
- the heat dissipation section 114 extends from at least one end of the heat absorption section 112 .
- the capillary structure 113 is selected from a group consisting of mesh body, fiber body and metal wire braided body.
- the support section 111 a is composed of multiple ribs (columns, points, blocks) 1111 arranged at intervals. At least one passage 1112 is formed between the ribs 1111 .
- the passage 1112 serves as the passage of the vapor working fluid 2 in vapor-liquid circulation.
- the main body 11 is made by means of injection molding (in-mold injection) or other methods.
- the internal chamber 111 of the main body 11 is totally vacuumed and sealed to enclose the support section 111 a and the capillary structure 113 .
- the chamber 111 serves as a space for vapor-liquid circulation of the working fluid 2 .
- the carrier with heat dissipation structure of the present invention can be combined with at least one intelligent mobile device.
- the intelligent mobile device When the intelligent mobile device generates heat, the heat absorption section 112 of the main body 11 of the wearable carrier can absorb the heat.
- the working fluid 2 in the chamber 111 at the heat absorption section 112 is heated and evaporated into vapor.
- the vapor working fluid 2 spreads within the chamber 111 to transfer heat to the heat dissipation section 114 .
- the vapor working fluid 2 in the chamber 111 at the heat dissipation section 114 is cooled and condensed into liquid working fluid 2 .
- the capillary structure 113 sucks the liquid working fluid 2 , whereby the liquid working fluid 2 flows back to the heat absorption section 112 under the capillary attraction of the capillary structure 113 for next vapor-liquid circulation and heat exchange.
- the intelligent mobile device with the carrier with heat dissipation structure of the present invention is wearable by a user.
- the carrier with heat dissipation structure of the present invention provides heat dissipation effect for the intelligent mobile device to prevent the heat from accumulating in the intelligent mobile device. Accordingly, the heat dissipation efficiency of the intelligent mobile device is enhanced.
- FIG. 3 is a perspective sectional view of a second embodiment of the carrier with heat dissipation structure of the present invention.
- the second embodiment is partially identical to the first embodiment in structure and thus will not be repeatedly described hereinafter.
- the second embodiment is different from the first embodiment in that in the second embodiment, the support section 111 a is composed of multiple raised bodies 1113 arranged at intervals. At least one transverse passage 1112 and at least one longitudinal passage 1112 are formed between the raised bodies 1113 .
- the passages 1112 serve as the passages of the vapor working fluid 2 in vapor-liquid circulation (as shown in FIG. 2 ).
- FIG. 4 is a perspective exploded view of a third embodiment of the carrier with heat dissipation structure of the present invention.
- the third embodiment is partially identical to the first embodiment in structure and thus will not be repeatedly described hereinafter.
- the third embodiment is different from the first embodiment in that in the third embodiment, the main body 11 further has a rest section 12 .
- the rest section 12 has a periphery defining a receiving space 121 .
- the heat absorption section 112 is disposed in the receiving space 121 .
- At least one intelligent mobile device 4 is correspondingly connected and assembled in the receiving space 121 .
- the intelligent mobile device 4 is, but not limited to, an intelligent watch for illustration purposes only.
- the intelligent mobile device 4 is received in the receiving space 121 of the rest section 12 and attached to the heat absorption section 112 of the main body 11 . Accordingly, the heat generated by the intelligent mobile device 4 is absorbed by the heat absorption section 112 of the main body 11 and dissipated from the heat dissipation section 114 . Therefore, the heat accumulation problem of the intelligent mobile device 4 can be solved.
- FIG. 5 is a sectional view of a fourth embodiment of the carrier with heat dissipation structure of the present invention.
- the fourth embodiment is partially identical to the first embodiment in structure and thus will not be repeatedly described hereinafter.
- the fourth embodiment is different from the first embodiment in that in the fourth embodiment, the chamber 111 of the main body 11 further has a coating 5 therein.
- the coating 5 is disposed on a surface of the chamber 111 .
- the coating 5 serves to enhance the condensation efficiency of the working fluid 2 in the chamber 111 (as shown in FIG. 2 ) and help in collecting the condensed working fluid 2 .
- FIG. 6 is a perspective exploded view of a fifth embodiment of the carrier with heat dissipation structure of the present invention.
- the fifth embodiment is partially identical to the first embodiment in structure and thus will not be repeatedly described hereinafter.
- the fifth embodiment is different from the first embodiment in that in the fifth embodiment further includes a heat conductor 3 .
- the heat conductor 3 is inlaid in the heat absorption section 112 of the main body 11 .
- the heat conductor 3 has a first face 31 and a second face 32 .
- the first face 31 of the heat conductor 3 is exposed to outer side of the main body 11 .
- the second face 32 faces the chamber 111 of the main body 11 .
- the capillary structure 113 extends to a position adjacent to the heat conductor 3 .
- the heat conductor 3 is selected from a group consisting of a heat pipe, a vapor chamber and a graphite sheet. In this embodiment, the heat conductor 3 is, but not limited to, a graphite sheet for illustration
- the heat conductor 3 inlaid in the heat absorption section 112 of the main body 11 is directly attached to the intelligent mobile device 4 .
- the first face 31 of the heat conductor 3 can directly absorb the heat generated by the intelligent mobile device 4 and conduct the heat to the main body 11 .
- the second face 32 of the heat conductor 3 serves to conduct the heat into the chamber 111 , whereby the working fluid 2 in the chamber 111 of the main body 11 at the heat absorption section 112 is evaporated to spread to the heat dissipation section 114 . Then the vapor working fluid 2 at the heat dissipation section 114 is cooled and condensed into liquid working fluid 2 .
- the capillary structure 113 then sucks the liquid working fluid 2 , whereby the liquid working fluid 2 flows back to the heat conductor 3 under the capillary attraction of the capillary structure 113 for next vapor-liquid circulation. Accordingly, the heat generated by the intelligent mobile device 4 can be dissipated.
Abstract
A carrier with heat dissipation structure includes a main body. The main body is made of silicone or rubber material. The main body has a chamber having a capillary structure. A working fluid is contained in the chamber. At least one support section protrudes from a wall face of the chamber. The main body has at least one heat absorption section and a heat dissipation section. The heat dissipation section extends from at least one end of the heat absorption section. The carrier of the present invention is flexible. The carrier has an internal chamber for vapor-liquid circulation and heat exchange of the working fluid. Accordingly, the heat dissipation efficiency of the intelligent mobile device correspondingly assembled with the carrier is greatly enhanced.
Description
- 1. Field of the Invention
- The present invention relates generally to a carrier with heat dissipation structure, and more particularly to a carrier with heat dissipation structure, which is applicable to wearable intelligent mobile device for dissipating heat.
- 2. Description of the Related Art
- Various multifunction mobile devices have been developed, including mobile phones, tablets and even intelligent wearable devices such as watches, necklaces and fingerings. Along with the addition of more and more functions, the intelligent wearable device is equipped with various electronic components such as touch screen and satellite positioning chip. Therefore, the intelligent watch is connectable to other mobile devices via Bluetooth or network. Moreover, a SIN card can be inserted into the intelligent watch to access to 3G or 4G network and make phone calls. In operation, the intelligent watch will generate heat. In addition, the entire intelligent watch is designed with a fully sealed structure for achieving waterproof effect. Under such circumstance, the heat generated by the electronic components in the intelligent watch can be hardly dissipated outward. As a result, the heat will accumulate in the interior of the watch.
- The watchband of the conventional intelligent watch for a user to wear can be made of metal material, leather, rubber, plastic or the like material. All these material can hardly effectively conduct the heat generated by the intelligent watch outward to dissipate the heat. Moreover, the watchband must be flexible for a user to conveniently wear. Therefore, it is impossible to combine an inflexible heat dissipation component (such as heat pipe or vapor chamber) with the watchband for dissipation heat.
- As a result, the intelligent watch is often overheated to cause deterioration of execution efficiency of the intelligent watch or even shutdown of the intelligent watch. Accordingly, it has become a critical issue how to solve the heat dissipation problem of the intelligent watch and various intelligent wearable devices.
- It is therefore a primary object of the present invention to provide a carrier with heat dissipation structure. The carrier is applicable to an intelligent mobile device to effectively solve the heat accumulation problem of the intelligent mobile device.
- To achieve the above and other objects, the carrier with heat dissipation structure of the present invention includes a main body. The main body is made of silicone or rubber material. The main body has a chamber having a capillary structure. A working fluid is contained in the chamber. At least one support section protrudes from a wall face of the chamber. The main body has at least one heat absorption section and a heat dissipation section. The heat dissipation section extends from at least one end of the heat absorption section. The carrier of the present invention is flexible. The carrier has an internal chamber for vapor-liquid circulation and heat exchange of the working fluid. Accordingly, the heat dissipation efficiency of the intelligent mobile device correspondingly assembled with the carrier is greatly enhanced.
- The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:
-
FIG. 1 is a perspective view of a first embodiment of the carrier with heat dissipation structure of the present invention; -
FIG. 2 is a sectional view of the first embodiment of the carrier with heat dissipation structure of the present invention; -
FIG. 3 is a perspective sectional view of a second embodiment of the carrier with heat dissipation structure of the present invention; -
FIG. 4 is a perspective exploded view of a third embodiment of the carrier with heat dissipation structure of the present invention; -
FIG. 5 is a sectional view of a fourth embodiment of the carrier with heat dissipation structure of the present invention; and -
FIG. 6 is a perspective exploded view of a fifth embodiment of the carrier with heat dissipation structure of the present invention. - Please refer to
FIGS. 1 and 2 .FIG. 1 is a perspective view of a first embodiment of the carrier with heat dissipation structure of the present invention.FIG. 2 is a sectional view of the first embodiment of the carrier with heat dissipation structure of the present invention. According to the first embodiment, the carrier with heat dissipation structure of the present invention includes amain body 11. - The
main body 11 is made of silicone or rubber material. Themain body 11 has achamber 111 having acapillary structure 113. A workingfluid 2 is contained in thechamber 111. Asupport section 111 a protrudes from a wall face of thechamber 111. - The
main body 11 has at least oneheat absorption section 112 and aheat dissipation section 114. Theheat dissipation section 114 extends from at least one end of theheat absorption section 112. - The
capillary structure 113 is selected from a group consisting of mesh body, fiber body and metal wire braided body. - The
support section 111 a is composed of multiple ribs (columns, points, blocks) 1111 arranged at intervals. At least onepassage 1112 is formed between theribs 1111. Thepassage 1112 serves as the passage of thevapor working fluid 2 in vapor-liquid circulation. - The
main body 11 is made by means of injection molding (in-mold injection) or other methods. Theinternal chamber 111 of themain body 11 is totally vacuumed and sealed to enclose thesupport section 111 a and thecapillary structure 113. Thechamber 111 serves as a space for vapor-liquid circulation of the workingfluid 2. - The carrier with heat dissipation structure of the present invention can be combined with at least one intelligent mobile device. When the intelligent mobile device generates heat, the
heat absorption section 112 of themain body 11 of the wearable carrier can absorb the heat. At this time, the workingfluid 2 in thechamber 111 at theheat absorption section 112 is heated and evaporated into vapor. Thevapor working fluid 2 spreads within thechamber 111 to transfer heat to theheat dissipation section 114. Thevapor working fluid 2 in thechamber 111 at theheat dissipation section 114 is cooled and condensed into liquid workingfluid 2. Thecapillary structure 113 sucks the liquid workingfluid 2, whereby the liquid workingfluid 2 flows back to theheat absorption section 112 under the capillary attraction of thecapillary structure 113 for next vapor-liquid circulation and heat exchange. The intelligent mobile device with the carrier with heat dissipation structure of the present invention is wearable by a user. Moreover, the carrier with heat dissipation structure of the present invention provides heat dissipation effect for the intelligent mobile device to prevent the heat from accumulating in the intelligent mobile device. Accordingly, the heat dissipation efficiency of the intelligent mobile device is enhanced. - Please now refer to
FIG. 3 , which is a perspective sectional view of a second embodiment of the carrier with heat dissipation structure of the present invention. The second embodiment is partially identical to the first embodiment in structure and thus will not be repeatedly described hereinafter. The second embodiment is different from the first embodiment in that in the second embodiment, thesupport section 111 a is composed of multiple raisedbodies 1113 arranged at intervals. At least onetransverse passage 1112 and at least onelongitudinal passage 1112 are formed between the raisedbodies 1113. Thepassages 1112 serve as the passages of thevapor working fluid 2 in vapor-liquid circulation (as shown inFIG. 2 ). - Please now refer to
FIG. 4 , which is a perspective exploded view of a third embodiment of the carrier with heat dissipation structure of the present invention. The third embodiment is partially identical to the first embodiment in structure and thus will not be repeatedly described hereinafter. The third embodiment is different from the first embodiment in that in the third embodiment, themain body 11 further has arest section 12. Therest section 12 has a periphery defining a receivingspace 121. Theheat absorption section 112 is disposed in the receivingspace 121. At least one intelligentmobile device 4 is correspondingly connected and assembled in the receivingspace 121. - In this embodiment, the intelligent
mobile device 4 is, but not limited to, an intelligent watch for illustration purposes only. The intelligentmobile device 4 is received in the receivingspace 121 of therest section 12 and attached to theheat absorption section 112 of themain body 11. Accordingly, the heat generated by the intelligentmobile device 4 is absorbed by theheat absorption section 112 of themain body 11 and dissipated from theheat dissipation section 114. Therefore, the heat accumulation problem of the intelligentmobile device 4 can be solved. - Please now refer to
FIG. 5 , which is a sectional view of a fourth embodiment of the carrier with heat dissipation structure of the present invention. The fourth embodiment is partially identical to the first embodiment in structure and thus will not be repeatedly described hereinafter. The fourth embodiment is different from the first embodiment in that in the fourth embodiment, thechamber 111 of themain body 11 further has acoating 5 therein. Thecoating 5 is disposed on a surface of thechamber 111. Thecoating 5 serves to enhance the condensation efficiency of the workingfluid 2 in the chamber 111 (as shown inFIG. 2 ) and help in collecting the condensed workingfluid 2. - Please now refer to
FIG. 6 , which is a perspective exploded view of a fifth embodiment of the carrier with heat dissipation structure of the present invention. The fifth embodiment is partially identical to the first embodiment in structure and thus will not be repeatedly described hereinafter. The fifth embodiment is different from the first embodiment in that in the fifth embodiment further includes aheat conductor 3. Theheat conductor 3 is inlaid in theheat absorption section 112 of themain body 11. Theheat conductor 3 has afirst face 31 and asecond face 32. Thefirst face 31 of theheat conductor 3 is exposed to outer side of themain body 11. Thesecond face 32 faces thechamber 111 of themain body 11. Thecapillary structure 113 extends to a position adjacent to theheat conductor 3. Theheat conductor 3 is selected from a group consisting of a heat pipe, a vapor chamber and a graphite sheet. In this embodiment, theheat conductor 3 is, but not limited to, a graphite sheet for illustration purposes only. - In this embodiment, the
heat conductor 3 inlaid in theheat absorption section 112 of themain body 11 is directly attached to the intelligentmobile device 4. Thefirst face 31 of theheat conductor 3 can directly absorb the heat generated by the intelligentmobile device 4 and conduct the heat to themain body 11. Thesecond face 32 of theheat conductor 3 serves to conduct the heat into thechamber 111, whereby the workingfluid 2 in thechamber 111 of themain body 11 at theheat absorption section 112 is evaporated to spread to theheat dissipation section 114. Then thevapor working fluid 2 at theheat dissipation section 114 is cooled and condensed intoliquid working fluid 2. Thecapillary structure 113 then sucks theliquid working fluid 2, whereby theliquid working fluid 2 flows back to theheat conductor 3 under the capillary attraction of thecapillary structure 113 for next vapor-liquid circulation. Accordingly, the heat generated by the intelligentmobile device 4 can be dissipated. - The present invention has been described with the above embodiments thereof and it is understood that many changes and modifications in the above embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.
Claims (7)
1. A carrier with heat dissipation structure comprising a main body, the main body being made of silicone or rubber material, the main body having a chamber having a capillary structure, a working fluid being contained in the chamber, a support section protruding from a wall face of the chamber, the main body having at least one heat absorption section and a heat dissipation section, the heat dissipation section extending from at least one end of the heat absorption section.
2. The carrier with heat dissipation structure as claimed in claim 1 , wherein the capillary structure is selected from a group consisting of mesh body, fiber body and metal wire braided body.
3. The carrier with heat dissipation structure as claimed in claim 1 , wherein the main body further has a rest section correspondingly assembled with the heat absorption section, the rest section having a receiving space, whereby at least one intelligent mobile device can be correspondingly connected and assembled in the receiving space.
4. The carrier with heat dissipation structure as claimed in claim 1 , wherein the support section is composed of multiple ribs arranged at intervals.
5. The carrier with heat dissipation structure as claimed in claim 1 , further comprising a heat conductor inlaid in the heat absorption section of the main body, the heat conductor having a first face and a second face, the first face being exposed to outer side of the main body, the second face facing the chamber of the main body, the capillary structure extending to a position adjacent to the second face of the heat conductor, the heat conductor being selected from a group consisting of a heat pipe, a vapor chamber and a graphite sheet.
6. The carrier with heat dissipation structure as claimed in claim 1 , wherein the support section is composed of multiple raised bodies arranged at intervals.
7. The carrier with heat dissipation structure as claimed in claim 1 , wherein the chamber of the main body further has a coating therein.
Priority Applications (1)
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US14/594,181 US20160201994A1 (en) | 2015-01-12 | 2015-01-12 | Carrier with heat dissipation structure |
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US14/594,181 US20160201994A1 (en) | 2015-01-12 | 2015-01-12 | Carrier with heat dissipation structure |
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US20160201994A1 true US20160201994A1 (en) | 2016-07-14 |
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US14/594,181 Abandoned US20160201994A1 (en) | 2015-01-12 | 2015-01-12 | Carrier with heat dissipation structure |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150350392A1 (en) * | 2014-05-27 | 2015-12-03 | Lg Electronics Inc. | Watch type mobile terminal |
US11248852B2 (en) * | 2020-07-06 | 2022-02-15 | Dell Products L.P. | Graphite thermal cable and method for implementing same |
US20230030019A1 (en) * | 2021-07-27 | 2023-02-02 | Asia Vital Components Co., Ltd. | Heat pipe structure |
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US6749013B2 (en) * | 1997-12-25 | 2004-06-15 | The Furukawa Electric Co., Ltd. | Heat sink |
US20070151710A1 (en) * | 2005-12-30 | 2007-07-05 | Touzov Igor V | High throughput technology for heat pipe production |
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US20150350392A1 (en) * | 2014-05-27 | 2015-12-03 | Lg Electronics Inc. | Watch type mobile terminal |
US9826073B2 (en) * | 2014-05-27 | 2017-11-21 | Lg Electronics Inc. | Watch type mobile terminal |
US11248852B2 (en) * | 2020-07-06 | 2022-02-15 | Dell Products L.P. | Graphite thermal cable and method for implementing same |
US20230030019A1 (en) * | 2021-07-27 | 2023-02-02 | Asia Vital Components Co., Ltd. | Heat pipe structure |
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Legal Events
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AS | Assignment |
Owner name: ASIA VITAL COMPONENTS CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SHEN, CHING-HANG;REEL/FRAME:034678/0590 Effective date: 20150112 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |