US20160193703A1 - Method of manufacturing a heat-transfer structure - Google Patents
Method of manufacturing a heat-transfer structure Download PDFInfo
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- US20160193703A1 US20160193703A1 US15/053,067 US201615053067A US2016193703A1 US 20160193703 A1 US20160193703 A1 US 20160193703A1 US 201615053067 A US201615053067 A US 201615053067A US 2016193703 A1 US2016193703 A1 US 2016193703A1
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- raised features
- metallic
- forming
- substrate
- features
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D53/00—Making other particular articles
- B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D53/00—Making other particular articles
- B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
- B21D53/022—Making the fins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D53/00—Making other particular articles
- B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
- B21D53/04—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers of sheet metal
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- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
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- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
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Definitions
- thermal interface materials are often composites of thermally conductive particles dispersed in a thermally insulating organic matrix (e.g., adhesive or grease).
- the thermal conductivity of such composites is limited by the relatively low concentration of particles, as often needed to assure proper viscosity, and, by the thermal resistance of particle-particle contacts. Additionally, air-filled voids, which have poor thermal conductivity, can accumulate in the organic matrix, thereby decreasing the overall thermal conductivity of the TIM.
- Soft metals such as Indium, or other soft materials, such as graphite, are also sometimes used as thermal interface materials. Although the thermal conductivity of these materials is higher than the composite materials, they have limited ability to comply with non-planar or irregular surfaces. Some of these soft materials are susceptible to corrosion, and, can have low melting points. All of these limitations can restrict reliability, applicability and assembly options.
- FIGS. 14A-14I present plan views of selected stages of an example embodiment of manufacturing an apparatus of the disclosure, e.g., as in FIG. 13 ;
- the metallic deformable raised features 110 are configured to be compressed at least one selected dimension (e.g., a height) by at least about 1 percent as compared to the pre-deformed shape. In other preferred embodiments the metallic deformable raised features 110 are configured to be compressed in the at least one selected dimension 115 by at least about 5 percent and in some cases at least about 25 percent.
- the individual raised features 110 are millimeter-size or smaller structures. That is, each of the metallic deformable raised features 110 have at least one second dimension 120 (e.g., a width, height or thickness) of about 1 millimeter or less. Millimeter-sized raised features can advantageously comply (e.g., make close contact) with the irregular surface or rough surface of some components and thereby improve heat transfer between components. Millimeter-sized raised features also advantageously require lower amounts of compressive force to deform than larger-sized raised features 110 , thereby reducing the risk of damaging components of the apparatus 100 when the raised features 110 are compressed.
- second dimension 120 e.g., a width, height or thickness
- Millimeter-sized raised features can advantageously comply (e.g., make close contact) with the irregular surface or rough surface of some components and thereby improve heat transfer between components. Millimeter-sized raised features also advantageously require lower amounts of compressive force to deform than larger-sized raised features 110 , thereby reducing the risk of damaging components of the apparatus 100 when the raised features
- the apparatus further includes an electrical device 145 .
- the electrical device 145 can be a circuit board.
- the device can have at least two components 130 , 132 that contact each other at interfacial surface 125 , 127 and the heat-transfer structure 105 is located between interfacial surfaces 125 , 127 .
- Example embodiments of components 130 , 132 include a heat sink or a heat source (e.g., an integrated circuit).
- the substrate 220 is a deformable metallic substrate made of the same metal or different metal as the raised features 110 .
- an example substrate 220 can be a planar metal foil having a thickness 235 in the range of about 10 to 1000 microns.
- the substrate 220 can be curved or have other non-planar shapes.
- Compression in the at least one dimension 115 can occur by bending or buckling of the shape of the raised features 110 , or by other modes of changing the shape of the raised features 110 .
- the raised features 110 can be specially designed to have shapes and dimensions that facilitate the efficient compression of the raised features 110 with a minimum of applied deforming pressure 305 .
- the selection of the shape and dimension of the raised features 110 , the spacing between raised features 110 and the types of material used to form the raised features 110 are all newly discovered result-effective variables to control the manner and extent to which the raised features 110 are compressed for a given applied pressure 305 to facilitate heat transfer.
- the compressed dimension 115 is parallel to the direction 140 of heat flow. This can facilitate compressed ones of the raised features 110 to form a continuous phase of metal directly thermally and physically linking one surface 125 of a component 130 to a second surface 127 of a second component 132 along the heat transfer direction 140 . Having the metal of the compressed raised features 110 as the predominant continuous phase in the direction of heat flow 140 facilitates heat transfer between the components 130 , 132 . This is in contrast to traditional TIMs, where the organic matrix with relatively poor heat conductivity, is the predominate continous phase in the direction of heat flow.
- raised features 110 can be formed on both of the interfacial surfaces 125 , 127 of the components 130 , 132 .
- one surface 127 could be the surface of a heat sink 132
- the other surface 125 could be the lid of a packaged integrated circuit.
- the raised features 110 on the respective interfacial surfaces 125 , 127 can be staggered such that the raised features 110 (e.g., the array 170 of raised features 110 ) on one surface 125 interdigitate with the raised features 110 (e.g., the arrays 170 , 171 of raised features 110 ) on another surface 127 when the deforming pressure is applied.
- the raised features 110 can have the same or different structures (e.g., same or different height, shapes etc. . . . ) on either or both of the two surface 125 , 127 .
- the raised features 110 can have a tapered shape.
- raised features can be cone-shaped.
- Raised features with a tapered shape can advantageously require a lower amount of deforming pressure to be compressed than a similar-sized non-tapered raised feature 110 .
- the reduced pressure needed to compress raised features with a tapered shape results from the smaller amount of material that needs to be compressed as compared to non-tapered shapes (e.g., smaller amount of material moves during a plastic deformation than in a non-tapered raised feature of the same maximum width).
- a cone-shaped raised feature 110 having a base diameter 152 of 1 mm and height 150 of 2 mm.
- the raised features 110 can be an array 170 of electroplated posts.
- Such raised features 110 are inexpensive to form and manufacturing can be scaled-up to produce large numbers of heat-transfer structures 105 .
- such raised features 110 can also be formed on a broad variety of surfaces, including directly on the surface 125 of a component 130 , if desired.
- raised features 110 configured as electroplated posts can be fabricated to have high aspect ratios (e.g., height 150 to diameter 152 ratio of about 5:1 or greater, or, in the range of about 5:1 to 10:1).
- Metals such as silver and copper can be electroplated using existing manufacturing processes.
- electroplated posts comprising multiple layers of different metals can be formed.
- each one of the raised features 110 can have substantially the same height 150 (e.g., the same height within 10 percent). In other embodiments, however, there can be at least two groups of raised features having different heights. Such an embodiment is depicted in the perspective view of FIG. 8 , where the raised features 110 within a group 810 have the same height 815 , while the raised features 110 within a second group 820 have a second height 825 the second heights 825 being at least about 10 percent greater than the first heights 815 .
- An array 170 of raised features 110 having groups 810 , 820 with different heights 815 , 825 can help minimize the total applied pressure required to achieve the desired level of conformity to an irregular component surface.
- the tallest group 830 of raised features 110 would compress first. In cases where there are relatively few numbers of raised features 110 in such groups 830 the applied deforming pressure required for compression would be very low. Thus for a given amount of applied pressure, the achievable compression would be larger compared to an array 170 of raised features 110 of uniform height.
- the next tallest group 820 of raised features 110 would begin to compress. This would increase the pressure required to incrementally improve conformity to the irregular surface of a component, but would beneficially increase the total number of thermal points of contact with the surface. This approach would work especially well when heat from hot-spots in a component need to be dissipated or when the component surface exhibits a high degree of irregularity.
- the curved raised features 110 are symmetrically curved.
- the curved raised features 110 can be asymmetrically curved.
- An asymmetrical curve can help further reduce the deforming pressure required to achieve compression of the raised features 110 .
- the curved raised features 110 can be a right-angled cone ( FIG. 9D ), or, asymmetric concave cone ( FIG. 9E ).
- FIG. 5 shows substantially pyramidal-shaped raised features 110 that are asymmetrically curved.
- another embodiment of the apparatus 100 comprises a metallic planar substrate 220 having a front surface 225 and back surface 230 , the back surface 225 being opposite the front surface 225 .
- the apparatus 100 further comprises at least one array 170 (and in some cases two arrays) 170 , 250 ) of metallic raised features 110 located directly on each of the surfaces 225 , 230 .
- the method 1200 comprises (step 1210 ) providing a heat-transfer structure 105 on a surface 125 of a first component 130 of an electrical device 145 , wherein the heat-transfer structure 105 includes metallic deformable raised features 110 .
- the method 1200 also comprises (step 1220 ) pressing a second component 132 of the electrical device 145 towards the surface 125 such that the heat-transfer structure 105 is located in-between the first component 130 and the second component 132 , such that at least a portion 154 ( FIG. 1A ) of the metallic deformable raised features 110 are deformed to reduce heights 115 ( FIG. 3 ) thereof by at least about 1 percent as compared to the heights 115 ( FIG. 1A ) of the raised features 110 before the pressing.
- forming the raised features on a substrate surface in step 1320 could include the wire bonding step 1322 or the electroplating step 1324 .
- raised features 110 configured as posts could be formed on a surface 210 of a metal substrate 220 via the wire bonding or electroplating steps, 1322 , 1324 .
- forming the raised features includes a cavity casting process (step 1330 ).
- Cavity casting can have advantages that include low-cost processing and the ability to use with all types of metals.
- the cavity casting process (step 1330 ) includes a step 1332 of forming a mold.
- the mold has a cavity which replicates a shape of the raised features. Forming the mold can include forming a model of the raised features. In some cases the mold also replicates a substrate that interconnects the raised features.
- the cavity casting process (step 1330 ) also includes a step 1334 of placing metal into the cavity to thereby form the raised features. In some cases a liquid metal is placed in the mold in step 1334 and then allowed to cool.
- FIG. 15B shows the base structure 1505 after depositing a seed layer 1515 on the molded side 1520 in accordance with step 1346 .
- FIG. 15C shows the base structure 1505 after electroplating one or more metals (e.g. copper or silver) on the molded side 1510 , and in the present example, on the seed layer 1515 , to form the metal raised features 1540 .
- FIG. 15D shows the raised features 1520 after being separated from the base structure 1505 in accordance with step 1348 . For instance a wax base structure 1505 could be melted away to achieve separation in step 1348 .
- the seed layer 1515 can be retained as part of the raised features 1520 . In other cases the seed layer 1515 is removed from the raised features 1520 using conventional chemical of thermal processes.
Abstract
Method of manufacture, comprising forming a heat-transfer structure. Forming the heat-transfer structure includes forming a metallic planar substrate having a front surface and a back surface, the back surface being opposite the front surface. Forming the heat-transfer structure also includes forming an array of metallic raised features located directly on each of the front and back surfaces. Respective portions of the raised features are configured to be mechanically bend or buckle plastically deformable via a compressive force applied between a first substrate and a second substrate.
Description
- This application is a continuation of U.S. patent application Ser. No. 14/491,360 filed on Sep. 19, 2014, to Roger Scott Kempers et al., entitled “A HEAT-TRANSFER STRUCTURE,” which has been allowed and which, in turn, is a continuation of U.S. patent application Ser. No. 12/143,594 filed on Jun. 20, 2008 to Roger Scott Kempers et al., entitled “A HEAT-TRANSFER STRUCTURE,” which has issued as U.S. Pat. No. 8,963,323 on Feb. 24, 2015. The above applications are commonly assigned with the present invention and incorporated herein by reference.
- The present disclosure is directed, in general, to an apparatus that comprises a thermal interface material and methods of manufacture thereof.
- Conventional thermal interface materials (TIMs) are often composites of thermally conductive particles dispersed in a thermally insulating organic matrix (e.g., adhesive or grease). The thermal conductivity of such composites is limited by the relatively low concentration of particles, as often needed to assure proper viscosity, and, by the thermal resistance of particle-particle contacts. Additionally, air-filled voids, which have poor thermal conductivity, can accumulate in the organic matrix, thereby decreasing the overall thermal conductivity of the TIM. Soft metals, such as Indium, or other soft materials, such as graphite, are also sometimes used as thermal interface materials. Although the thermal conductivity of these materials is higher than the composite materials, they have limited ability to comply with non-planar or irregular surfaces. Some of these soft materials are susceptible to corrosion, and, can have low melting points. All of these limitations can restrict reliability, applicability and assembly options.
- One embodiment method of manufacture, comprising forming a heat-transfer structure. Forming the heat-transfer structure includes forming a metallic planar substrate having a front surface and a back surface, the back surface being opposite the front surface. Forming the heat-transfer structure also includes forming an array of metallic raised features located directly on each of the front and back surfaces. Respective portions of the raised features are configured to be mechanically bend or buckle plastically deformable via a compressive force applied between a first substrate and a second substrate. One or more of the metallic raised features has a surface singularity therein prior to the mechanical bend or the buckle plastic deformation produced by the compressive force.
- Another embodiment is another method of manufacture, comprising forming a heat-transfer structure. Forming the heat-transfer structure includes forming a metallic planar substrate having a front surface and a back surface, the back surface being opposite the front surface. Forming the heat-transfer structure also includes forming an array of metallic raised features located directly on each of the front and back surfaces. Respective portions of the raised features are configured to be mechanically bend or buckle plastically deformable via a compressive force applied between a first substrate and a second substrate, wherein the compressive force produces a compressive pressure in a range of 0.7 to 4.2 MPa.
- The embodiments of the disclosure are best understood from the following detailed description, when read with the accompanying FIGUREs. Corresponding or like numbers or characters indicate corresponding or like structures. Various features may not be drawn to scale and may be arbitrarily increased or reduced in size for clarity of discussion. Reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which:
-
FIGS. 1A-1B present cross-sectional views of example apparatuses of the disclosure before compression; -
FIG. 2 presents a cross-sectional view of an example apparatus of the disclosure before compression; -
FIG. 3 presents a cross-sectional view of the example apparatus shown inFIG. 1A after compression; -
FIGS. 4-11 shows perspective or cross-sectional views of example raised features of the apparatus of the disclosure; -
FIG. 12 presents a flow diagram of selected steps in an example method of using an apparatus of the disclosure, e.g., as inFIGS. 1A-3 . -
FIG. 13 presents a flow diagram of selected steps in an example method of manufacturing an apparatus of the disclosure, e.g., as inFIGS. 1A-12 ; -
FIGS. 14A-14I present plan views of selected stages of an example embodiment of manufacturing an apparatus of the disclosure, e.g., as inFIG. 13 ; and -
FIGS. 15A-15D present cross-sectional views of selected stages of an example embodiment of manufacturing an apparatus of the disclosure, e.g., as inFIG. 13 . -
FIGS. 1A and 1B shows cross-sectional views of anexample apparatuses 100. Theapparatus 100 comprises a heat-transfer structure 105 having designed metallic deformable raisedfeatures 110. The metallic deformable raisedfeatures 110 are configured to be compressed in at least onedimension 115 as compared to a pre-deformed shape, such as the pre-deformed shape of the raisedfeature 110 depicted inFIG. 1A . - Generally, for greater amounts of compression there is improved heat-transfer. However, greater amounts of compressive force are required to achieve greater degrees of compression which could inadvertently damage components of the
apparatus 100. Therefore the amount of compression in the at least onedimension 115 is carefully balanced between the benefit of improved heat transfer versus damaging the apparatus. In some preferred embodiments the metallic deformable raisedfeatures 110 are configured to be compressed at least one selected dimension (e.g., a height) by at least about 1 percent as compared to the pre-deformed shape. In other preferred embodiments the metallic deformable raisedfeatures 110 are configured to be compressed in the at least one selecteddimension 115 by at least about 5 percent and in some cases at least about 25 percent. - In some preferred embodiments, the individual raised
features 110 are millimeter-size or smaller structures. That is, each of the metallic deformable raisedfeatures 110 have at least one second dimension 120 (e.g., a width, height or thickness) of about 1 millimeter or less. Millimeter-sized raised features can advantageously comply (e.g., make close contact) with the irregular surface or rough surface of some components and thereby improve heat transfer between components. Millimeter-sized raised features also advantageously require lower amounts of compressive force to deform than larger-sized raisedfeatures 110, thereby reducing the risk of damaging components of theapparatus 100 when the raisedfeatures 110 are compressed. - The term designed, as used herein, refers to the raised
features 110 as having one or more solid shapes that are intentionally-created according to the principles and by procedures described herein. The raisedfeatures 110 are designed to mechanically deform and thereby comply with non-uniformities of theinterface surfaces components apparatus 100, while maintaining a continuous thermal path across a direction 140 of heat flow. For instance, the raisedfeatures 110 are designed to physically contact bothsurfaces surfaces FIG. 1A or whether one or both or thesurfaces - For clarity, certain design aspects are presented as a single element in example raised features. It should be understood, however, that some preferred embodiments of the raised features 110 can combine multiple design aspects in a single structure.
- In some embodiments the apparatus further includes an
electrical device 145. For example, when theapparatus 100 is a remote radio head, base station, computer or other part of a telecommunication system, theelectrical device 145 can be a circuit board. The device can have at least twocomponents interfacial surface transfer structure 105 is located betweeninterfacial surfaces components - The raised features 110 of the present disclosure are designed to be mechanically compressed by a deforming pressure that is sufficient to cause compression of the raised features (e.g., by least by at least about 1 percent). However, the deforming pressure typically is carefully adjusted to avoid compressing or otherwise deforming or damaging the
components apparatus 100 which may also experience the deforming pressure. For example,components transfer structure 105 could be damaged if the deforming pressure is excessive. - The term raised, as used herein, means that the metallic material that the raised features 110 are made of is non-coplanar with a
surface 125 that the raised features 110 are located on. For example, in some embodiments, the metallic deformable raisedfeatures 110 can be located, and in some cases formed directly, on asurface 125 of acomponent 130 of theapparatus 100. - In other embodiments, such as illustrated in the cross-sectional view present in
FIG. 2 , the raised features 110 can be located, and in some cases formed directly, on one ormore surfaces substrate 220 which is also part of the heat-transfer structure 105, and not a separate component of the apparatus. In such embodiments, theapparatus 100 can consist of only the heat-transfer structure 105 comprising the raised features 110 andsubstrate 220, or, can further include other components (not shown) similar to that depicted inFIG. 1A . In some embodiments, the raised features 110 can be located on one or both of thesurfaces first side 225 and an oppositesecond side 230 of aplanar substrate 220. In some cases, thesubstrate 220 is a deformable metallic substrate made of the same metal or different metal as the raised features 110. For instance, anexample substrate 220 can be a planar metal foil having athickness 235 in the range of about 10 to 1000 microns. However, in other embodiments, to further facilitate conformance to the surface of a component, thesubstrate 220 can be curved or have other non-planar shapes. - In some cases, the
second dimension 120 can be the same as thefirst dimension 115. For example, the first andsecond dimension height 150 of the raised features which can be about 1 millimeters or less. In other cases, such as depicted inFIG. 1A , thesecond dimension 120 can correspond to awidth 152 of the raisedfeature 110. In some cases, when the raisedfeature 110 does not have a uniform width 152 (e.g. the width of the raised feature is tapered) at least one portion of the width (e.g., thewidth 154 at thetops 156 of the raised features 110) is about 1 millimeters or less. In still other cases, thesecond dimension 120 can correspond to a thickness of the raisedfeature 110. For example, as discussed below in the context ofFIG. 9 , when the raisedfeature 110 is hollow, thesecond dimension 120 can correspond to a thickness of an outer wall of the raisedfeature 110. -
FIG. 3 shows a cross-sectional view of theexample apparatus 100 presented inFIG. 1A after the metallic deformable raisedfeatures 110 have been compressed in the at least onedimension 115. For example, a deformingpressure 305 can be applied to the raised features 110 by bringing a surface of asecond component 132 in contact with tops 156 (FIG. 1A ) of the raised features 110, and pressing thesecond component 132 of theapparatus 110 towards thefirst component 130 that the raised features 110 are located on. - Compression in the at least one
dimension 115 can occur by bending or buckling of the shape of the raised features 110, or by other modes of changing the shape of the raised features 110. As further discussed below, the raised features 110 can be specially designed to have shapes and dimensions that facilitate the efficient compression of the raised features 110 with a minimum of applied deformingpressure 305. In particular, the selection of the shape and dimension of the raised features 110, the spacing between raisedfeatures 110 and the types of material used to form the raised features 110 are all newly discovered result-effective variables to control the manner and extent to which the raised features 110 are compressed for a given appliedpressure 305 to facilitate heat transfer. - In some preferred embodiments, the
compressed dimension 115 is parallel to the direction 140 of heat flow. This can facilitate compressed ones of the raised features 110 to form a continuous phase of metal directly thermally and physically linking onesurface 125 of acomponent 130 to asecond surface 127 of asecond component 132 along the heat transfer direction 140. Having the metal of the compressed raisedfeatures 110 as the predominant continuous phase in the direction of heat flow 140 facilitates heat transfer between thecomponents - As illustrated in
FIG. 1A , prior to compression, the raised features 110, can be discrete structures that do not directly contact each other. As illustrated inFIG. 3 , compression in the onedimension 115 can result in a simultaneous increase in another dimension 310 of the raisedfeature 110 that is substantially perpendicular to thecompressed dimension 115 and applied deformingpressure 305. For some embodiments, such as illustrated inFIG. 3 , after compression, the raised features 110 can be sufficiently enlarged or increased in the other dimension 310 to physically contact laterally adjacent raised features 110. The lateral contact between adjacent raisedfeatures 110 can also advantageously facilitate heat transfer. For instance, the lateral contact between adjacent one of the raised features 110 can help to dissipate heat away from a localized area of high heat generation (e.g., a hot-spot) within acomponent - As illustrated in
FIGS. 1 and 3 , thesurfaces components component surfaces non-planar surface 127 of acomponent 132 of theapparatus 100. For instance, the raised features 110 can be designed to be tall enough such that, after being compressed, they provide a continuous phase of metal physically and thermally linking thesurfaces components array 170 of raisedfeatures 110 facilitate compliant linking acrossirregular surfaces - In some cases, such as when both of the
interfacial surfaces components surface 132 is highly irregular, it can be especially advantageous to use a heat-transfer structure 105 such as depicted inFIG. 2 . A heat-transfer structure 105 having dual-sided raised features 110 (e.g., raisedfeatures 110 on bothsides irregular surfaces features 110 on one of thesides substrate 220, or on one component 130). In other cases, however, raisedfeatures 110 formed directly on theirregular surface 130 such as shown inFIG. 1A can provide the desired conformity to thesurface 130. - In still other cases, raised
features 110 can be formed on both of theinterfacial surfaces components surface 127 could be the surface of aheat sink 132, and theother surface 125 could be the lid of a packaged integrated circuit. In some such embodiments, such as shown inFIG. 1B , the raised features 110 on the respectiveinterfacial surfaces array 170 of raised features 110) on onesurface 125 interdigitate with the raised features 110 (e.g., thearrays 170, 171 of raised features 110) on anothersurface 127 when the deforming pressure is applied. The raised features 110 can have the same or different structures (e.g., same or different height, shapes etc. . . . ) on either or both of the twosurface - As further illustrated in
FIGS. 1A and 3 , in some embodiments, an adhesive orthermal grease 160 can be located between adjacent one of the metallic deformable raised features 110. In some cases, the adhesive 160 can helps to hold thecomponents 130, 132 (e.g., thermally coupledcomponents 130, 132) together. In some cases, thethermal grease 160, such as a thixotropic grease can improve heat transfer performance by reducing or eliminating air pockets between theinterfacial surfaces 125, 127 (e.g., thesurfaces thermal grease 160 can freely move between the raised features 110. For instance, there can be a continuous phase of adhesive orthermal grease 160 in adirection 315 perpendicular to thecompressed dimension 115. In other cases there can be discrete regions of adhesive orthermal grease 160 between the raised features 110. - The metal or metals that the raised features 110 and
optional substrate 220 are made of can be carefully selected to meet criterion applicable to the application of the heat-transfer structure 105. Sometimes, to minimize the thermal resistance across theinterfacial surfaces components apparatus 100 to ensure that the heat-transfer structures 105 does not melt or creep. Examples of low-modulus (e.g., bulk modulus), high-thermal-conductivity metals which are resistant to oxidation and corrosion include silver, copper, aluminum, tin, lead, nickel, indium or alloys thereof. - In some preferred embodiments, the raised features 110 can have a tapered shape. For instance, as illustrated in
FIG. 1A in some embodiments raised features can be cone-shaped. Raised features with a tapered shape can advantageously require a lower amount of deforming pressure to be compressed than a similar-sized non-tapered raisedfeature 110. The reduced pressure needed to compress raised features with a tapered shape results from the smaller amount of material that needs to be compressed as compared to non-tapered shapes (e.g., smaller amount of material moves during a plastic deformation than in a non-tapered raised feature of the same maximum width). Consider as an example a cone-shaped raisedfeature 110 having abase diameter 152 of 1 mm andheight 150 of 2 mm. Some embodiments of the cone-shaped raisedfeature 110 can require a deformingpressure 305 of about 0.7 MPa to achieve a 50 percent reduction inheight 150. In comparison a non-tapered raisedfeature 110, such as a cylindrically shaped post, of the same height and diameter equal to thebase diameter 152, can require about 6 times or greater deforming pressure (e.g., to achieve a 50 percent reduction in height 150). Nevertheless, there can still be cases where a raisedfeature 110 having a non-tapered shaped (e.g., a post) is preferred because the thermal resistance through a cone can be higher than for a cylinder. - To illustrate additional design aspects,
FIGS. 4-11 present perspective or cross-sectional views of some example embodiments of the metallic deformable raised features 110. For clarity, the same reference numbers as used inFIGS. 1-3 are used to depict analogous aspects of the structures depicted inFIGS. 4-11 . -
FIG. 4 shows a perspective view of an example embodiment of theapparatus 100, where the heat-transfer structure includes a two-dimensional array 170 of raised features 110. Similar to the embodiment shown inFIG. 2 , the metallic deformable raisedfeatures 110 are located on one side 225 (e.g., a first side) and an opposite side 230 (e.g., a second side) of a planar deformablemetallic substrate 220. To facilitate a conformal contour to the irregular surface of one component, the locations of the raised features 110 on theopposite side 230 are staggered with respect to locations of raisedfeatures 110 on oneside 225. By staggering the locations of the raised features 110 on the twosides 225, 230 a twodimension array 170 of raisedfeatures 110 is formed on bothsides FIG. 3 ) to achieve the desired compression. - As further illustrated in
FIG. 4 some embodiments of the heat-transfer structures 105 can includeopenings 410 in thesubstrate 220, theopenings 410 can be located between the locations of the raised features 110 on thesubstrate 220. Theopenings 410 can extend from oneside 225 to theother side 230 of thesubstrate 220. Theopenings 410 can advantageously allow the flow of adhesive or grease 160 (FIG. 1A or 3 ) between the upper andlower surfaces components lateral direction 315 as well as along the direction of heat flow 140. -
FIG. 5 shows a perspective view of another example embodiment of theapparatus 100 having a heat-transfer structure 105 with a two-dimensional array 170 of raised features 110. Thesubstrate 220 also has an array 505 ofopenings 510 interspersed between the raised features 110 which are located on oneside 225 of thesubstrate 220. The array 505 ofopenings 510 in thesubstrate 220 can facilitate the uniform dispersal of adhesive or thermal grease 160 (FIGS. 1A and 3 ) when the raised features 110 are compressed. For instance, an array 505 ofopenings 510 could allow adhesive 160 to flow easily and fill voids more effectively along theinterfacial surfaces components 130, 132 (FIG. 3 ). - As further illustrated in
FIG. 5 , some embodiments of the raised features 110 can be configured as a uniformly distributed two-dimensional array 170. In other cases, however, thearray 170 of raisedfeatures 110 can be randomly distributed. The raised features 110 depicted inFIG. 5 are substantially pyramidal-shaped. However, a variety of other shapes such as posts, cones, or loops could be similarly arranged as a two-dimensional array 170. - The shapes of the raised features 110 can be selected based on a balance between ease of manufacture and providing efficient heat transfer when compressed.
- For example, as shown in the perspective view of
FIG. 6 , the raised features 110 can be anarray 170 of posts, formed for example, as stud bumps using a wire bonding machine. Such raisedfeatures 110 have the advantage of being easy and inexpensive to form using existing manufacturing processes. Aluminum and gold, both highly thermally conductive metals, are commonly used in wire bonding equipment, although copper and other metals can be used. Moreover, such raisedfeatures 110 can be formed on a broad variety of surfaces, including directly on thesurface 125 of acomponent 130, if desired. - As another example, as shown in the cross-sectional view of
FIG. 7 , the raised features 110 can be anarray 170 of electroplated posts. Such raisedfeatures 110 are inexpensive to form and manufacturing can be scaled-up to produce large numbers of heat-transfer structures 105. Moreover, such raisedfeatures 110 can also be formed on a broad variety of surfaces, including directly on thesurface 125 of acomponent 130, if desired. Moreover, raisedfeatures 110 configured as electroplated posts can be fabricated to have high aspect ratios (e.g.,height 150 todiameter 152 ratio of about 5:1 or greater, or, in the range of about 5:1 to 10:1). Metals such as silver and copper can be electroplated using existing manufacturing processes. Additionally, electroplated posts comprising multiple layers of different metals can be formed. For instance, the raised features 110 depicted inFIG. 7 can be configured as posts comprising acopper layer 710 andthinner tin layer 720. Raised features configured as multilayered posts (e.g., that are posts with multiple electroplated metal layers) can take advantage of the material properties of different metals, e.g., the high thermal conductivity of copper and the ductility of tin. - In some embodiments, such as shown in
FIG. 7 , each one of the raised features 110 can have substantially the same height 150 (e.g., the same height within 10 percent). In other embodiments, however, there can be at least two groups of raised features having different heights. Such an embodiment is depicted in the perspective view ofFIG. 8 , where the raised features 110 within agroup 810 have thesame height 815, while the raised features 110 within asecond group 820 have asecond height 825 thesecond heights 825 being at least about 10 percent greater than thefirst heights 815. - An
array 170 of raisedfeatures 110 havinggroups different heights tallest group 830 of raisedfeatures 110 would compress first. In cases where there are relatively few numbers of raisedfeatures 110 insuch groups 830 the applied deforming pressure required for compression would be very low. Thus for a given amount of applied pressure, the achievable compression would be larger compared to anarray 170 of raisedfeatures 110 of uniform height. Once a certain level of compression is achieved, the nexttallest group 820 of raisedfeatures 110 would begin to compress. This would increase the pressure required to incrementally improve conformity to the irregular surface of a component, but would beneficially increase the total number of thermal points of contact with the surface. This approach would work especially well when heat from hot-spots in a component need to be dissipated or when the component surface exhibits a high degree of irregularity. - In some embodiments, such as illustrated in the perspective view of
FIG. 9A-9C one or more of the raised features 110 can be hollow. Although hollow cones are depicted inFIGS. 9A-9C , any of the other shapes of the raised features 110 discussed herein could be configured as hollow structures. In some cases when the raisedfeature 110 is hollow, the second dimension 120 (FIG. 1A ) can correspond to a thickness 910 of anouter wall 915 of the raised feature 110 (FIG. 9A ). - One advantage of using hollow raised features 110 is that they can require significantly
less pressure 305 to compress than equivalent solid raised features of the same size. Less pressure for compression is required because the thickness 910 ofwalls 915 of hollow raisedfeatures 110 can be made thinner than the over allthickness 152 of the raised feature. In addition, hollow raisedfeatures 110 can be compacted into a smaller lateral area because thewalls 915 can move either towards the exterior or towards the interior of the hollow raisedfeature 110 when a deformingpressure 305 is applied. In some case, however, solid raisedfeatures 110 may be preferred because they contain more metal than hollow raised features 110, and consequently, can provide a more efficient heat transfer path. - In some embodiments, one or more of the raised
feature 110 have a curve surface 925 (FIG. 9B, 9C, 9E ) along the at least onedimension 115 that the raisedfeature 110 is configured to be compressed in. One advantage of such curved raisedfeatures 110 is that such structures can require significantly less pressure to compress than substantial equivalent non-curved raisedfeature 110. For instance, when a deforming pressure is applied to a curved raisedfeature 110, it will more easily bend than the equivalent non-curved raised feature. - To further illustrate some of the above-described embodiments, consider an
example array 170 of raisedfeatures 110 configured as hollow copper cones, such as shown inFIG. 9A . Each cone has abase diameter 152 of about 1 mm andheight 150 of about 2 mm, and awall 915 thickness 910 of about 50 microns. The deforming pressure required to compress theheight 150 by 75 percent is only about 17 percent of the pressure required to compress asimilar array 170 of the same-sized but solid copper cones. Thepressure 305 required to similarly compress asimilar array 170 of raisedfeatures 110 configured as hollow convex copper cones, such as shown inFIG. 9B , is about 15 percent of that required for the solid cones. Thepressure 305 required to similarly compress asimilar array 170 of raisedfeatures 110 configured as hollow concave copper cones, such as shown inFIG. 9C , is about 7 percent of that required for the solid cones. An additional benefit in configuring the raised features 110 as hollow concave cones is that, when the deforming pressure is applied, this shape can facilitate the flow of excess adhesive or thermal grease 160 (FIG. 1A ,FIG. 3 ) away from areas of nearest contact between components to areas which could benefit from additional adhesive orgrease 160. - In some cases, such as shown in
FIGS. 9B and 9C , the curved raisedfeatures 110 are symmetrically curved. In other cases, the curved raisedfeatures 110 can be asymmetrically curved. An asymmetrical curve can help further reduce the deforming pressure required to achieve compression of the raised features 110. For example, the curved raisedfeatures 110 can be a right-angled cone (FIG. 9D ), or, asymmetric concave cone (FIG. 9E ). As a further example,FIG. 5 shows substantially pyramidal-shaped raisedfeatures 110 that are asymmetrically curved. -
FIGS. 10A and 10B present perspective and cross-section view of example raisedfeatures 110 having asingularity 1010. Theterm singularity 1010 as used herein refers to any sharp discontinuity in the smoothness or shape surface of the raisedfeature 110 along the at least onedimension 115 to be compressed. In some embodiments, one or more of the raised features 110 have asingularity 1010 along the at least onedimension 115. The presence of thesingularity 1010 can help to reduce the deformingpressure 305 required to achieve compression of the raised features 110. For example when the deformingpressure 305 is applied, the first bend in the raisedfeature 110 can occur in the vicinity of thesingularity 110. In the example raisedfeature 110 shown inFIG. 10A , thesingularity 1010 is a configured as a caldera. In the example raisedfeature 110 shown inFIG. 10B , thesingularity 1010 is located at the point where acone 1020 andinverted cone 1030 portions of the raisedfeature 110 are connected. In still other embodiments the singularity can be a sharp inward (e.g., a crimp) or outward (e.g., a bump) indentation in the other wise smooth surface of the raised feature, or a bump. - In still other embodiments of the
apparatus 100, the raised features 110 can be configured as fins and be arranged as a one-dimensional array 170 of fins. Such an embodiment is depicted in the perspective view ofFIG. 11 , where each of the raised features 110 is a fin. Similar to that discussed above for the two-dimensional arrays 170, The thickness of the fins, the spacing between fins and the curvature of the fins can all be adjusted to change the properties of the heat-transfer structure 105. For instance, as illustrated inFIG. 11 , to minimize the amount of pressure that has to be applied to achieve compression the fins can be curved. A curved fin can require less pressure to compress as compared to a straight fin because a bending mode of compression will be induced over a buckling mode of compression. Raised features 110 configured as fins can be arranged to collapse onto an adjacent fin, when a compression pressure is applied, thereby creating an additional path for heat transfer, similar to that discussed above in the context ofFIG. 3 . In some cases, cross-cuts that are singularities can be made perpendicular to the length of the fin to facilitate local conformity to irregular surface of a component. - Referring again to
FIGS. 1A and 3 , another embodiment of theapparatus 100 comprises afirst substrate 130 having afirst surface 125 and asecond substrate 132 havingsecond surface 127 facing thefirst surface 125. Theapparatus 100 also comprises anarray 170 of metallic raisedfeatures 110 being located on thefirst surface 125, each raisedfeature 110 being in contact with thefirst surface 125 to thesecond surface 127, aportion 156 of the raised features 110 being deformed via acompressive force 305. - In some embodiments there can be two
arrays 170, 171 on each of thesurfaces 125, 127 (FIG. 1B ). In some embodiments, the metallic deformable raisedfeatures 110 provide physical connections between portions of a region 172 (FIG. 1A ) of thefirst surface 125 and thesecond surface 127, wherein theregion 172 of thefirst surface 127 is non-planar. In some embodiments, the each of the metallic raisedfeatures 110 form a continuous phase of metal directly linking the first and second surfaces, 125, 127. In some embodiments, thearray 170 is a two-dimensional array of cones, posts (e.g., raisedfeatures 110 configured as posts or cones). In some embodiments, the metallic raisedfeatures 110 are fins (e.g.,FIG. 11 ). In some embodiments the each metallic raisedfeature 110 includes twometal layers 710, 720 (e.g.,FIG. 7 ), eachmetal layer features 110 has substantially thesame height 115. In some embodiments, the metallic deformable raisedfeatures 110 are hollow (e.g.,FIG. 9A-9C ). In some embodiments, there are at least twogroups features 110 having twodifferent heights 815, 825 (e.g.,FIG. 8 ). In some embodiments, one or more of the metallic raisedfeatures 110 has a curved surface 925 (FIG. 9 ) or a singularity 1010 (FIG. 10 ). In some embodiments, eachsubstrate - Referring again to
FIG. 2 , another embodiment of theapparatus 100 comprises a metallicplanar substrate 220 having afront surface 225 andback surface 230, theback surface 225 being opposite thefront surface 225. Theapparatus 100 further comprises at least one array 170 (and in some cases two arrays) 170, 250) of metallic raisedfeatures 110 located directly on each of thesurfaces apparatus 100FIG. 2 can further comprise a first substrate 130 (e.g., a first integrated circuit) having afirst surface 125 and a second substrate 132 (e.g., a second integrated circuit) having asecond surface 127, each of the first andsecond surfaces arrays - Another embodiment of the disclosure is a method of using an apparatus.
FIG. 12 presents a flow diagram of selected step in anexample method 1200 of using anapparatus 1200, such as theapparatus 100 inFIGS. 1A-3 . With continuing reference toFIGS. 1A-3 , themethod 1200 comprises astep 1210 of providing a heat-transfer structure 105 on asurface 125 of afirst component 130 of anelectrical device 145. The heat-transfer structure 105 includes metallic deformable raised features 110. - Any of the embodiments of the raised features 110 can be provided in
step 1210. The raised features 110 are configured to be compressed in at least onedimension 115 as compared to a pre-deformed shape (e.g., shapes such as presented inFIG. 1A, 1B or 2 ). In some preferred embodiments each of the raised features 110 have at least onesecond dimension 120 of about 1 millimeters or less. - In some cases providing the raised features 110 in
step 1210 can include forming the raised features on one or bothinterfacial surfaces components step 1210 can include placing a pre-formed heat-transfer structure such as shown inFIG. 2 , on one of theinterfacial surfaces - The
method 1200 also comprises astep 1220 of pressing asecond component 132 of theelectrical device 145 towards thefirst component 130 such that the heat-transfer structure 105 is located in-between thefirst component 130 and thesecond component 132 and the raised features 110 are compressed in the at least one dimension by at least about 1 percent as compared to before thefirst component 130 and the saidcomponent 132 are contacted to each other. For example, in some embodiments thepressing step 1220 includes imparting a deforming pressure of at least about 0.7 mPa. - In cases such as shown in
FIG. 1B , when thesecond component 132 also has a second heat-transfer structure 105 located on asurface 127, thepressing step 1220 can compress the raised features 110 located on bothsurfaces FIG. 2 where the heat-transfer structure 105 includes raised features 110 on one or bothsides substrate 220, thepressing step 1220 can compress the raised features 110 located on bothsides - Some embodiments of the method further include a
step 1230 of fastening together the twocomponents fastening step 1230 can be achieved using mechanical clamps to hold thecomponents fastening step 1230 can be achieved by locating an adhesive 160 between the raised features 110 prior to thepressing step 1220. - With continuing reference to
FIGS. 1A and 12 , in another embodiment of themethod 1200 comprises (step 1210) providing a heat-transfer structure 105 on asurface 125 of afirst component 130 of anelectrical device 145, wherein the heat-transfer structure 105 includes metallic deformable raised features 110. As shown inFIG. 3 themethod 1200 also comprises (step 1220) pressing asecond component 132 of theelectrical device 145 towards thesurface 125 such that the heat-transfer structure 105 is located in-between thefirst component 130 and thesecond component 132, such that at least a portion 154 (FIG. 1A ) of the metallic deformable raisedfeatures 110 are deformed to reduce heights 115 (FIG. 3 ) thereof by at least about 1 percent as compared to the heights 115 (FIG. 1A ) of the raised features 110 before the pressing. - Another embodiment is a method of manufacturing an apparatus.
FIG. 13 presents a flow diagram of selected steps in an example method 1300 of manufacturing an apparatus and its parts, such as shown inFIGS. 1A-11 . - With continuing reference to
FIGS. 1A-11 , the method 1300 includes forming a heat-transfer structure 105 (step 1305), including a step 1310 of forming metallic deformable raised features 110. - In some cases, forming the raised features 110 (step 1310) includes a step 1315 of forming the raised features 110 on one or
more surfaces components apparatus 100. In some cases, forming the raised features 110 (step 1310) includes a step 1320 of forming on one ormore surfaces substrate 220 that is part of the heat-transfer structure 105. - Any of the embodiments of the apparatus described herein can be manufactured by the method. As discussed above, in some preferred embodiments, the raised features 110 are configured to be compressed in at least one
dimension 115 by at least 1 percent and have at least onesecond dimension 120 of about 1 millimeters or less. - In some cases, forming the raised features 110 on a surface in step 1315 includes a wire bonding step 1322 to form raised
feature 110 directly on acomponent surface 125. For example raisedfeatures 110 configured as posts such as depicted inFIG. 4 can be formed by stud bumping in accordance with step 1322. One skilled in the art would be familiar with the wire bonding processes and the other types of shapes of raisedfeatures 110 that could be produced by wire bonding. For instance, raised features having loops could be formed in step 1322. - In some cases, forming the raised features 110 on a surface in step 1315 includes an electroplating step 1324 to form raised
feature 110 directly on acomponent surface 125. One skilled in the art would be familiar with the electroplating processes that could be used to form raised features. For example one or more metals could be electroplated through openings in a photoresist layer located on acomponent surface 125 to form raisedfeatures 110 configured as single-layer or multilayered posts, such as depicted inFIG. 7 . - In some cases, forming the raised features on a substrate surface in step 1320 could include the wire bonding step 1322 or the electroplating step 1324. For example, raised
features 110 configured as posts could be formed on asurface 210 of ametal substrate 220 via the wire bonding or electroplating steps, 1322, 1324. - In some cases, forming the raised features (step 1310) includes a cavity casting process (step 1330). Cavity casting can have advantages that include low-cost processing and the ability to use with all types of metals. The cavity casting process (step 1330) includes a step 1332 of forming a mold. The mold has a cavity which replicates a shape of the raised features. Forming the mold can include forming a model of the raised features. In some cases the mold also replicates a substrate that interconnects the raised features. The cavity casting process (step 1330) also includes a step 1334 of placing metal into the cavity to thereby form the raised features. In some cases a liquid metal is placed in the mold in step 1334 and then allowed to cool. In other cases metal particles can be placed in the mold and then heated to liquefy the metal while in the cavity and then allowed to cool. The cavity casting process (step 1330) further includes a step 1336 of separating the raised features from the mold. In some cases, the separating step 1336 results in destruction of the mold, while in other cases, the mold is re-useable. For instance, the separating step 1336 may include heating in an oven such that a wax or polymer (e.g., thermoplastic or thermoset polymer) mold is melted or burned away. The separating step 1336 may include cleaning steps such as chemical or plasma cleaning to remove all of the mold material.
- With continuing reference to
FIG. 13 ,FIGS. 14A-14I present plan views of selected stages of an example cavity casting process in accordance with step 1330.FIG. 14A-14E show different stages in the step 1332 of forming a mold.FIG. 14A show amodel 1405 fabricated to match the target shape of the raised features. For example, themodel 1405 can be fabricated using a wide variety of technologies, such as three-dimensional printing or machining of polymer or wax materials. Such technologies are especially effective at fabricating a wide variety of shapes and sizes including shapes with ultra-high aspect ratios (e.g., raised features with height ratios of about 10 or greater).FIG. 14B shows the formation of afirst mold 1410 including forming acavity 1415 which replicates a shape of the raised features. For instance, themodel 1405 can be used to makefirst molds 1410 using a room-temperature vulcanization of silicone rubber.FIG. 14C shows themold 1410 after removing themodel 1405 from the first mold. -
FIG. 14D shows thefirst mold 1410 being used to make a second model 1420 (e.g., sacrificial second model such as a wax copy of the first model 1405) which is then removed from the mold 1410 (FIG. 14E ). Thesecond model 1420 is used to form a second investment mold 1425 (FIG. 14F ) having acavity 1430 which replicates a shape of the raised features. Thesecond model 1420 is then removed from thesecond mold 1425 by destroying thesecond model 1420. For example thesecond model 1420 can be melted or burnt out of thecavity 1430 to provide an empty cavity 1430 (FIG. 14G ). Thesecond mold 1425 can then be used to make the raised feature 1435 using an investment-casting process such illustrated inFIGS. 14H-14I . For instance ametal 1440 can be placed in thecavity 1430 in accordance with step 1334 (FIG. 14H ). The raised features 1445 can then be removed from thesecond mold 1420 in accordance with step 1336 (FIG. 14I ). - For some raised features with complex shapes or some two-dimensional arrays of raised features, it can be difficult to remove the
model 1405 from themold 1410 without destroying one or both of themodel 1405 or themold 1410. In such cases, thefirst model 1405 can be used directly to form the second investment mold 1425 (FIG. 14F ) instead of using thesecond model 1420. - As further illustrated in
FIG. 13 , in some cases, forming the raised features (step 1310) includes an electroplate casting process (step 1340). The electroplate casting process (step 1340) includes a step 1342 of molding a base structure to have a molded side that models a shape of the raised features. The electroplate casting process (step 1340) also includes a step 1344 of electroplating one or more metals on the molded side to thereby form the raised features. In some cases to facilitate electroplating step 1344 there can be a step 1346 of depositing a seed layer on the molded side prior to electroplating. Depositing the seed layer in step 1346 can include applying a conductive paint via brushing, spraying or other well-known application techniques, or, depositing a conductive layer via physical vapor deposition processes. For example, an electrically conductive paint can be applied to the molded side. The electroplate casting process (step 1340) further includes a step 1348 of separating the raised features from the base structure, similar to that described for step 1336. -
FIGS. 15A-15D present cross-sectional views of selected stages of an example electroplate casting process in accordance withstep 1340. Theelectroplate casting process 1340 is particularly useful for making raised features configured as two-dimensional arrays of hollow cones or other shapes, although solid raised features could also be made by thisprocess 1340. With continuing reference toFIG. 13 ,FIG. 15A shows abase structure 1505 after forming a moldedside 1510, in accordance with step 1342, to have a molded side that models a shape of the raised features. For instance the same three-dimensional printing of plastic or wax materials as used to form the model 1405 (FIG. 14 ) could be used here to form the moldedside 1510.FIG. 15B shows thebase structure 1505 after depositing aseed layer 1515 on the moldedside 1520 in accordance with step 1346.FIG. 15C shows thebase structure 1505 after electroplating one or more metals (e.g. copper or silver) on the moldedside 1510, and in the present example, on theseed layer 1515, to form the metal raised features 1540.FIG. 15D shows the raisedfeatures 1520 after being separated from thebase structure 1505 in accordance with step 1348. For instance awax base structure 1505 could be melted away to achieve separation in step 1348. As illustrated inFIG. 15D , in some cases theseed layer 1515 can be retained as part of the raised features 1520. In other cases theseed layer 1515 is removed from the raisedfeatures 1520 using conventional chemical of thermal processes. - Returning to
FIG. 13 , illustrated are a number of options steps to complete the formation of the raised features (step 1310) and heat-transfer structure. For instance, there can be a trimmingstep 1350 to, remove excess metal structures (e.g., substrate or handle structures) from the raised features, or, a machining step 1352 to further shape the raised features. The raised features can be covered with a protective coating (e.g., benzimidazole) in step 1355, to prevent oxidation of the metal or metals that the raised features are composed of. Preferably the coating is thin enough (e.g., about one to ten molecular layers) so as not to increase the thermal resistance of the raised feature. An annealing step 1360 can be performed to advantageously reduce the modulus of the raised features. For example, the modulus of electroplated copper posts can be reduced by annealing at 400° C. or higher. Forming the heat-transfer structure (step 1305) can further include a step 1370 of placing adhesive orthermal grease 160 between raised features 110. - One skilled in the art would be familiar with other steps in the manufacture of the apparatus, depending on the apparatus's particular configuration (e.g., remote radio head, base station, computer or other part of a telecommunication system). For instance, the method 1300 can include a step 1375 forming an electronic device (e.g., a circuit board) of the apparatus. Forming the device (step 1375) can include forming components of the device in step 1380. One of ordinary skill in the art would be familiar with the steps 1380 to manufacture electronic device components (e.g., a heat sink or integrated circuit). In cases where the heat-transfer structure is formed directly onto one or more components, forming the raised features (step 1310) can be part of forming the components (step 1380).
- Some embodiments of method 1300 can further include coupling the device components together with the heat-transfer structure located there-between in step 1385. The coupling step 1385 can include any of the embodiments of the method of
use 1200 such as described above in the context ofFIG. 12 and accompanying text. - With continuing reference to
FIG. 13 , in another embodiment of the method, forming a heat-transfer structure 105 (step 1305) includes (step 1310) including forming a twodimensional array 170 of pressure deformable metallic raisedfeatures 110 on a substantiallyplanar substrate surface 125. Thearray 170 can include a property selected for the group consisting of: (A) the raised features are hollow (e.g.,FIG. 9 ); (B) the raised features are electroplated (e.g.,FIG. 7 ); and (c) afirst group 810 of the raised features 110 have afirst height 815 and asecond group 820 of the raised features 110 have a different second height 825 (e.g.,FIG. 8 ). - In some embodiments, of the method, the raised features 110 are metal plated. In some embodiments the
method 1200 further includes placing adhesive orthermal grease 160 between the metallic deformable raised features 110. In some embodiments themethod 1200 further includes heat annealing the metallic deformable raisedfeatures 110 to reduce the modulus of the metallic deformable raised features 110. - Although the embodiments have been described in detail, those of ordinary skill in the art should understand that they could make various changes, substitutions and alterations herein without departing from the scope of the disclosure.
Claims (20)
1. A method of manufacture, comprising:
forming a heat-transfer structure, including:
forming a metallic planar substrate having a front surface and a back surface, the back surface being opposite the front surface; and
forming an array of metallic raised features located directly on each of the front and back surfaces, wherein respective portions of the raised features are configured to be mechanically bend or buckle plastically deformable via a compressive force applied between a first substrate and a second substrate, wherein one or more of the metallic raised features has a surface singularity therein prior to the mechanical bend or the buckle plastic deformation produced by the compressive force.
2. The method of claim 1 , wherein the one or more surface singularities are configured as caldera.
3. The method of claim 2 , wherein the metallic raised features are hollow.
4. The method of claim 2 , wherein there are at least two groups of the metallic raised features having two different heights.
5. The method of claim 2 , wherein
the first substrate is a first integrated circuit having a first surface; and
the second substrate is a second integrated circuit having a second surface, each of the first and second surfaces being in direct physical contact with deformable ones of the raised features of one of the arrays.
6. The method of claim 2 , wherein the mechanically deformable metallic raised features provide physical connections between portions of a region of the first surface and the second surface, wherein the region of the first surface is non-planar.
7. The method of claim 2 , wherein the one or more surface singularities are in a vicinity of initial locations of the mechanical bend or the buckle plastic deformation.
8. The method of claim 1 , wherein the metallic raised features include a first cone-shaped portion and a second inverted cone-shaped portion and the surface singularity is located at a connection point between the first cone-shaped portion and the second inverted cone-shaped portion.
9. The method of claim 1 , wherein the metallic raised features include a plurality of merged cone-shaped features and the surface singularities are located at discontinuous merger points between adjacent one of the merged cone-shaped features.
10. The method of claim 9 , wherein the metallic raised features are cones.
11. The method of claim 1 , wherein the surface singularities are located at cross-cut points in the length of the metallic raised feature.
12. The method of claim 11 , wherein the metallic raised features are fins.
13. The method of claim 11 , wherein the metallic raised features are posts.
14. The method of claim 1 , wherein forming the metallic raised features includes metal plating the metallic raised features onto the front and back surfaces
15. The method of claim 1 , wherein forming the metallic raised features includes wire bonding the metallic raised features onto the front and back surfaces.
16. The method of claim 1 , wherein forming the metallic raised features includes cavity cast the metallic raised features onto the front and back surfaces.
17. The method of claim 1 , further including placing adhesive or thermal grease between the metallic deformable raised features.
18. The method of claim 1 , further including heat annealing the metallic raised features to reduce the modulus of the metallic raised features.
19. A method of manufacture, comprising:
forming a heat-transfer structure, including:
forming a metallic planar substrate having a front surface and a back surface, the back surface being opposite the front surface; and
forming an array of metallic raised features located directly on each of the front and back surfaces, wherein respective portions of the raised features are configured to be mechanically bend or buckle plastically deformable via a compressive force applied between a first substrate and a second substrate, wherein the compressive force produces a compressive pressure in a range of 0.7 to 4.2 MPa.
20. The method of claim 19 , wherein each of the metallic raised features form a continuous phase of metal directly connecting the first surface and the second surface.
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- 2009-06-18 CN CN201610084865.XA patent/CN105702643A/en active Pending
- 2009-06-18 EP EP09767080.6A patent/EP2323848A4/en not_active Withdrawn
- 2009-06-18 JP JP2011514616A patent/JP2011525052A/en active Pending
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- 2009-06-18 KR KR1020117001214A patent/KR101323877B1/en active IP Right Grant
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2014
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US11032942B2 (en) | 2013-09-27 | 2021-06-08 | Alcatel Lucent | Structure for a heat transfer interface and method of manufacturing the same |
US9956640B2 (en) | 2014-12-12 | 2018-05-01 | Digital Alloys Incorporation | Methods for printing three-dimensional objects |
US10029406B2 (en) | 2014-12-12 | 2018-07-24 | Digital Alloys Incorporated | Systems for printing three-dimensional objects |
US10086467B2 (en) | 2014-12-12 | 2018-10-02 | Digital Alloys Incorporated | Additive manufacturing of metallic structures |
US10335889B2 (en) | 2014-12-12 | 2019-07-02 | Digital Alloys Incorporated | Systems for printing three-dimensional objects |
US11813690B2 (en) | 2014-12-12 | 2023-11-14 | Relativity Space, Inc. | Systems for printing three-dimensional objects |
US11853033B1 (en) | 2019-07-26 | 2023-12-26 | Relativity Space, Inc. | Systems and methods for using wire printing process data to predict material properties and part quality |
Also Published As
Publication number | Publication date |
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JP2015073118A (en) | 2015-04-16 |
CN105702643A (en) | 2016-06-22 |
JP2011525052A (en) | 2011-09-08 |
JP6158161B2 (en) | 2017-07-05 |
US9308571B2 (en) | 2016-04-12 |
WO2009154767A3 (en) | 2010-04-01 |
KR20110038674A (en) | 2011-04-14 |
KR101323877B1 (en) | 2013-10-30 |
EP2323848A4 (en) | 2014-02-26 |
EP2323848A2 (en) | 2011-05-25 |
US20150014841A1 (en) | 2015-01-15 |
CN102066109A (en) | 2011-05-18 |
US8963323B2 (en) | 2015-02-24 |
WO2009154767A2 (en) | 2009-12-23 |
US20090315173A1 (en) | 2009-12-24 |
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