US20160134038A1 - Wiring member, method of manufacturing the same, method of designing the same, and electronic apparatus - Google Patents
Wiring member, method of manufacturing the same, method of designing the same, and electronic apparatus Download PDFInfo
- Publication number
- US20160134038A1 US20160134038A1 US14/874,706 US201514874706A US2016134038A1 US 20160134038 A1 US20160134038 A1 US 20160134038A1 US 201514874706 A US201514874706 A US 201514874706A US 2016134038 A1 US2016134038 A1 US 2016134038A1
- Authority
- US
- United States
- Prior art keywords
- conductive sheet
- wiring
- conductive
- metal layer
- shielding member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
- H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
- H01R12/727—Coupling devices presenting arrays of contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/79—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
Definitions
- the present invention relates to a wiring member, a method of manufacturing the same, a method of designing the same, and an electronic apparatus.
- a wiring member in which, when a shielding member is provided on a wiring substrate including plural wirings, including a signal line and a ground line, and an insulating layer that covers the plural wirings, an opening portion exposing at least a portion of the ground line is provided in the insulating layer, and the shielding member is grounded to the ground line through the opening portion (for example, see JP-A-2004-259619, JP-A-2002-329425 and JP-UM-A-04-36722.
- a wiring member including: a wiring substrate that includes a plurality of wirings including a ground line, and a first insulating layer that covers the plurality of wirings and has an opening portion exposing at least a portion of the ground line; a first conductive sheet in which a second insulating layer is provided on one surface side of the first conductive sheet and a conductive bonding layer is provided on the other surface side of the first conductive sheet, in which the conductive bonding layer is disposed, toward the wiring substrate, on the first insulating layer, and in which the conductive bonding layer is electrically connected to the ground line through the opening portion; a second conductive sheet that includes first and second connection portions capable of being electrically connected to another member, the first connection portion being disposed between a portion of the first conductive sheet and the wiring substrate so as to be electrically connected to the conductive bonding layer of the first conductive sheet; and a shielding member that is disposed on the wiring substrate, the first conductive sheet, and the second
- FIG. 1 is a perspective view showing a schematic configuration example of a wiring member according to an embodiment of the present invention and a schematic configuration example of an electronic apparatus to which the wiring member is applied;
- FIG. 2 is an exploded perspective view of the vicinity of one end of the wiring member
- FIG. 3 is a cross-sectional view taken along line E-E shown in FIG. 2 ;
- FIGS. 4A to 4C are a cross-sectional view taken along line A-A, a cross-sectional view taken along line B-B, and a cross-sectional view taken along line C-C shown in FIG. 3 , respectively;
- FIG. 5 is a plan view showing a main portion of a shielding member
- FIG. 6A is a cross-sectional view of a second conductive sheet
- FIGS. 6B to 6G are cross-sectional views showing modified examples of the second conductive sheet
- FIG. 7 is a diagram showing a process of thermally compressing a first conductive sheet on a wiring substrate using a thermal-compression press machine.
- FIG. 1 is a perspective view showing a schematic configuration example of a wiring member according to an embodiment of the present invention and a schematic configuration example of an electronic apparatus to which the wiring member is applied.
- An electronic apparatus 100 includes a first substrate 110 A including a first connector 111 A, a second substrate 110 B including a second connector 111 B, and a wiring member 1 according to the present embodiment which electrically connects the first connector 111 A and the second connector 111 B.
- the number of wiring members 1 is not limited to one, and may be two or more.
- Examples of the electronic apparatus 100 include a television receiver, an on-vehicle equipment such as a car navigation device or an audio device, an image forming apparatus such as a printer or a multifunction machine, and the like, but are not limited thereto.
- an electronic component or a power supply is mounted on the first and second substrates 110 A and 110 B.
- the wiring member 1 transmits a signal having a frequency of, for example, 10 MHz to 1 GHz or power.
- an image writing signal which is modulated on the basis of image data of cyan (C), magenta (M), yellow (Y), and black (K) colors through four wiring members 1 corresponding to CMYK is transmitted from a controller to an exposure apparatus.
- the wiring member 1 includes a wiring substrate 4 in which plural wirings are covered with an insulating layer, a shielding member 6 that covers the wiring substrate 4 , and first and second conductive sheets, to be described later, which electrically connects ground lines among the plural wirings of the wiring substrate 4 and the shielding member 6 .
- the wiring member 1 is provided with terminal portions 20 a and 20 b, from which plural wirings 2 are exposed, at both ends thereof in a longitudinal direction D.
- the terminal portions 20 a and 20 b at both ends are electrically connected to the first connector 111 A provided on the first substrate 110 A and the second connector 111 B provided on the second substrate 110 B, respectively.
- wiring member refers to a member, having flexibility, which has an elongated flat plate shape, includes plural wirings covered with an insulating layer, and has both ends in the longitudinal direction D from which wirings are exposed as terminal portions.
- ends refers to portions of the wiring member 1 in which the terminal portions 20 a and 20 b are present.
- the wiring member includes a flexible flat cable (FFC), a flexible printed circuit board (FPC) in which an element is mounted on a substrate, and the like.
- first conductive sheet refers to a sheet-shaped member having a thickness which is smaller than the width and length thereof and having conductivity.
- the first conductive sheet includes a sheet in which a metal layer is formed on one surface of an insulating layer and a conductive bonding layer is formed on the metal layer, a sheet that does not include an insulating layer or a conductive bonding layer, and a sheet which is constituted by only a metal layer.
- the phrase “second conductive sheet” as used herein refers to a sheet-shaped member having a thickness which is smaller than the width and length thereof and having conductivity.
- the second conductive sheet includes a sheet which is constituted by only a metal layer, and a sheet in which a bonding layer is formed on a metal layer.
- shielding member refers to a member that has a function of shielding noise radiated from a wiring to the outside and noise entering a wiring from the outside.
- the shielding member includes a member in which a metal layer is formed on one surface of an insulating layer and a bonding layer is formed on the metal layer, a member that does not include an insulating layer or a bonding layer, and a member which is constituted by only a metal layer.
- FIG. 2 is an exploded perspective view of the vicinity of one end of the wiring member 1 .
- FIG. 3 is a cross-sectional view taken along line E-E shown in FIG. 2 .
- FIGS. 4A to 4C are a cross-sectional view taken along line A-A, a cross-sectional view taken along line B-B, and a cross-sectional view taken along line C-C shown in FIG. 3 , respectively.
- a first conductive sheet 5 is disposed in a region in the vicinity of the end (for example, a region having an interval of equal to or less than a quarter of the total length in the longitudinal direction D with respect to the end). Meanwhile, the region in which the first conductive sheet 5 is disposed may be a region other than the region in the vicinity of the end.
- the wiring substrate 4 includes the plural wirings 2 including ground lines 2 b, and an insulating layer 3 that has an opening portion formed therein, covers the plural wirings 2 , and exposes at least portions of the ground lines 2 b.
- the wiring substrate 4 includes the plural wirings 2 which are arrayed in parallel at fixed intervals, and the insulating layer 3 that covers the plural wirings 2 .
- the wirings 2 include signal lines 2 a and the ground lines 2 b.
- the number of ground lines 2 b is two in the drawing, but may be one or three or more.
- the number of wirings 2 is six in the drawing, but is not limited to six.
- the wiring 2 is constituted by, for example, a flat plate-shaped conductor having a rectangular cross section, but may have another shape having a rounded rectangular shape or the like.
- the flat plate-shaped conductor is preferable in achieving electrical connection to the first conductive sheet 5 .
- a wiring obtained by applying gold plating to copper can be used as the wiring 2 .
- the wiring substrate 4 is formed by disposing the plural wirings 2 on one surface of an insulating layer 3 a with a bonding layer and performing pressing using a heating roll so that the plural wirings 2 are interposed between a pair of insulating layers 3 a and 3 b with a bonding layer.
- the insulating layers 3 a and 3 b can be formed of, for example, polyester terephthalate (PET).
- PET polyester terephthalate
- a groove 30 exposing the ground line 2 b is formed along the longitudinal direction D as shown in FIG. 2 .
- the groove 30 is an example of an opening portion, and may be an elongated hole, a circular hole, or the like.
- the number of opening portions may be one for one ground line 2 b.
- one opening portion may be formed in the region in the vicinity of the end, or plural opening portions may be formed in the region in the vicinity of the end along the longitudinal direction D.
- the opening portion may be positioned in a region other than the region in the vicinity of the end.
- an insulating layer 50 is provided on one surface side thereof, a conductive bonding layer 52 is provided on the other surface side, the conductive bonding layer 52 is disposed toward the wiring substrate 4 on the insulating layer 3 in which the grooves 30 of the wiring substrate 4 are formed, and the conductive bonding layer 52 is electrically connected to the ground lines 2 b through the grooves 30 .
- the first conductive sheet 5 includes the insulating layer 50 , a metal layer 51 which is provided on the insulating layer 50 , and the conductive bonding layer 52 which is provided on the metal layer 51 .
- the first conductive sheet 5 includes a first connection portion 5 a which is electrically connected to the ground lines 2 b and a second connection portion 5 b which is electrically connected to the shielding member 6 , and is disposed on the surface of the insulating layer 3 b with a bonding layer of the wiring substrate 4 including the grooves 30 .
- connector portions 5 c at two locations facing the ground lines 2 b of the first connection portion 5 a and the vicinity of the first connector portions are pressed by a thermal-compression press machine as shown in FIG. 2 , and thus the conductive bonding layer 52 is pushed into the grooves 30 as shown in FIG. 4A , and the conductive bonding layer 52 is thermally compressed on and electrically connected to the ground lines 2 b.
- a method of electrically connecting the first conductive sheet 5 to the ground lines 2 b is not limited to thermal compression, and a method using a heating roller or another method such as ultrasonic bonding may be used.
- the ultrasonic bonding is a method which is effectively used when the first conductive sheet 5 is constituted by only a metal layer or is constituted by a metal layer and a conductive bonding layer.
- a protrusion entering the groove 30 may be provided on a press surface of an upper plate of the thermal-compression press machine. Accordingly, the conductive bonding layer 52 of the first conductive sheet 5 is easily pushed into the groove 30 , and thus electrical connection to the ground line 2 b becomes more reliable.
- the shielding member 6 is directly connected to the wiring substrate 4 without using the first conductive sheet 5 , it is preferable to use the first conductive sheet 5 having characteristics in which electric resistance between the shielding member 6 and the ground line 2 b is suppressed even when the conductive sheet is bonded under the same conditions.
- the first conductive sheet 5 having characteristics in which electric resistance between the shielding member 6 and the ground line 2 b is suppressed.
- the first conductive sheet 5 having a smaller contact resistance with the ground line 2 b than the shielding member 6 or the second conductive sheet 7 that is, the first conductive sheet 5 having a larger contact area or having a higher contact degree, at the time of performing thermal compression on the ground line 2 b under the same conditions, is used.
- the first conductive sheet 5 has a thickness smaller than that of the shielding member 6 .
- the metal layer 51 of the conductive sheet 5 has stretching property higher than that of the metal layer 61 of the shielding member 6 and has a thickness smaller than that of the metal layer 61 of the shielding member 6 .
- first conductive sheet 5 has a thickness smaller than that of the second conductive sheet.
- the metal layer 51 of the first conductive sheet 5 has stretching property higher than those of conductive cloths 70 and 74 and a metal foil 72 , to be described later in FIGS. 6A to 6G , in the second conductive sheet 7 and has a thickness smaller than those of the conductive cloths 70 and 74 and the metal foil 72 .
- the first conductive sheet 5 to be used in the present embodiment has a total thickness of approximately 30 ⁇ m which is smaller than that of the shielding member 6 .
- PET having a thickness of approximately 10 ⁇ m can be used as the insulating layer 50 of the first conductive sheet 5 .
- the metal layer 51 is formed of for example, silver which has stretching property higher than that of the metal layer 61 of the shielding member 6 .
- the metal layer 51 to be used may have a thickness of, for example, approximately 0.1 ⁇ m which is smaller than that of the metal layer 61 of the shielding member 6 , and may have a surface resistance of approximately 200 m ⁇ /sq.
- the conductive bonding layer 52 to be used may be formed by mixing, for example, silver-coated copper powder in a polyester-based thermoplastic resin and may have a thickness of approximately 20 ⁇ m.
- the conductive bonding layer 52 to be used may have a bonding strength of, for example, approximately 4 N/cm (versus PET).
- first conductive sheets 5 and the position thereof in the longitudinal direction D are not particularly limited, it is preferable that the conductive sheet is provided at an end of the ground line 2 b in the longitudinal direction D in the wiring substrate 4 , and more preferably, at both ends thereof.
- the shielding member 6 can be grounded at a position close to a ground of the electronic apparatus 100 compared to a case where the conductive sheet is provided in a region other than the region in the vicinity of the end of the wiring substrate 4 , for example, in a center portion, and thus a higher shielding effect can be expected.
- the second conductive sheet 7 includes first and second connection portions capable of electrically connected to another member, and is disposed so that the first connection portion is disposed between the second connection portion 5 b of the first conductive sheet 5 and the insulating layer 3 of the wiring substrate 4 and the second connection portion is exposed from the first conductive sheet 5 . Since the insulating layer 50 is provided on one surface side of the first conductive sheet 5 , electrical connection between the first conductive sheet 5 and the shielding member 6 is not performed even when the shielding member 6 is provided on the first conductive sheet 5 in a state where the second conductive sheet 7 is not present, and thus the electrical connection therebetween is performed through the second conductive sheet 7 . In this manner, the second conductive sheet 7 has a role in performing electrical connection between the first conductive sheet 5 and the shielding member 6 , and is constituted by a sheet-like member such as a conductive cloth.
- the shielding member 6 includes an insulating layer 60 , the metal layer 61 which is provided on one surface of the insulating layer 60 , and an insulating bonding layer 62 which is partially provided on the surface of the metal layer 61 .
- the insulating layer 60 to be used may be formed of, for example, PET having a thickness of approximately 10 ⁇ m to 20 ⁇ m.
- the metal layer 61 to be used may be formed of, for example, aluminum having a thickness of approximately 10 ⁇ m to 20 ⁇ m.
- the insulating bonding layer 62 to be used may be formed of, for example, a thermosetting adhesive having a thickness of approximately 10 ⁇ m to 20 ⁇ m.
- the shielding member 6 is provided so as to cover the vicinity of the wiring substrate 4 and the first conductive sheet 5 except for the terminal portions, and is bonded to a portion of the second conductive sheet 7 which is exposed. Accordingly, an electrical connection path is formed which continues from the shielding member 6 to the second conductive sheet 7 , the first conductive sheet 5 , and the ground lines 2 b in this order.
- FIG. 5 is a plan view showing a main portion of the shielding member 6 .
- the insulating bonding layer 62 of the shielding member 6 is constituted by plural line patterns 620 which extend in a direction intersecting the longitudinal direction D so as to be parallel to each other. That is, the insulating bonding layer 62 is constituted by repetitive patterns in which the line patterns 620 are repeated in a width direction perpendicular to the longitudinal direction D.
- the patterns may be patterns other than the patterns shown in FIG. 5 because electrical conduction may be preferably allowed at the time of bonding the shielding member 6 to the exposed portion of the second conductive sheet 7 .
- the patterns may be plural line patterns which extend in the longitudinal direction D so as to be parallel to each other, dot patterns constituted by dots which having a size that does not cover the entire second connection portion 5 b, or other repetitive patterns. Further, the patterns may not be repetitive patterns insofar as electrical conduction is allowed.
- the plural line patterns 620 extending in a direction intersecting the longitudinal direction D are used as the insulating bonding layer 62 , and thus a region of the metal layer 61 which is not provided with the line patterns 620 comes into contact with the portion of the second conductive sheet 7 which is exposed, thereby allowing the metal layer 61 of the shielding member 6 to be electrically connected to the ground lines 2 b through the second conductive sheet 7 and the first conductive sheet 5 .
- the accurate positioning of the second conductive sheet 7 at the time of bonding the shielding member 6 becomes unnecessary.
- shielding characteristics are stabilized by bringing the shielding member 6 into close contact with the wiring substrate 4 by the insulating bonding layer 62 .
- FIG. 6A is a cross-sectional view of the second conductive sheet 7 according to the present embodiment.
- the second conductive sheet 7 includes a conductive cloth 70 and an adhesive layer 71 provided on one surface of the conductive cloth 70 .
- the conductive cloth 70 is formed by weaving conductive yarns that are obtained by plating the surfaces of non-conductive yarns formed of a resin such as polyester with a metal such as nickel.
- the conductive cloth 70 has a thickness of, for example, approximately 120 ⁇ m.
- the surface resistance of the conductive cloth 70 is, for example, equal to or less than 0.05 ⁇ /sq.
- a contact resistance value of the conductive cloth 70 is, for example, equal to or less than 0.01 ⁇ .
- the conductive cloth is not limited to a cloth based on a non-conductive yarn-like member like the conductive cloth 70 , and a conductive cloth using a yarn-like member which is entirely formed of a conductive metal or the like may be used.
- the adhesive layer 71 includes metal particles 71 a and an adhesive 71 b.
- the adhesive layer 71 has a thickness of, for example, approximately 50 ⁇ m.
- FIGS. 6B to 6G are cross-sectional views showing a modified example of the second conductive sheet 7 .
- the second conductive sheet 7 may be a sheet-like member having a function of performing electrical connection between the shielding member 6 and the first conductive sheet 5 having the insulating layer 50 provided on one surface side thereof, and may be, for example, sheets shown in FIGS. 6B to 6G .
- a second conductive sheet 7 shown in FIG. 6B includes a metal foil 72 having plural embossments 72 a provided therein, and an adhesive layer 73 which is provided on a surface on the side where the embossments 72 a of the metal foil 72 protrude.
- a second conductive sheet 7 shown in FIG. 6C includes a metal foil 72 having plural embossments 72 b provided therein, and an adhesive layer 71 which is provided on a surface on the opposite side to the side where the embossments 72 b of the metal foil 72 protrude.
- the adhesive layer 71 includes metal particles 71 a and an adhesive 71 b.
- a second conductive sheet 7 shown in FIG. 6D includes a metal foil 72 and an adhesive layer 71 which is provided on one surface of the metal foil 72 .
- the adhesive layer 71 includes metal particles 71 a and an adhesive 71 b.
- a second conductive sheet 7 shown in FIG. 6E is constituted by a conductive cloth 74 .
- the conductive cloth 74 includes conductive yarns 74 a that are obtained by plating the surfaces of non-conductive yarns formed of a resin such as polyester with a metal such as nickel, metal particles 74 b, and an adhesive 74 c.
- a second conductive sheet 7 shown in FIG. 6F includes a metal foil 72 such as an aluminum foil, and adhesive layers 71 provided on both surfaces of the metal foil 72 .
- the adhesive layer 71 includes metal particles 71 a and an adhesive 71 b.
- a second conductive sheet 7 shown in FIG. 6G includes a metal foil 72 such as a copper foil, and an adhesive layer 75 , constituted by a non-conductive adhesive, which is provided on one surface of the metal foil 72 .
- the metal foils 72 and the conductive cloths 70 and 74 in FIGS. 6A to 6G are examples of metal layers.
- a layer formed by metal vapor deposition may be used instead of the metal foil 72 .
- noise characteristics in a case where the size of the first conductive sheet 5 is changed are measured.
- the size of the first conductive sheet 5 is, for example, the length of a diagonal line.
- the noise characteristics may be noise characteristics in a single wiring member 1 , or may be noise characteristics in a state where the wiring member is embedded in an electronic apparatus. Meanwhile, the size of the first conductive sheet 5 may be a length in the longitudinal direction D or an area.
- the size of the first conductive sheet 5 which satisfies a noise standard value required for an electronic apparatus having the wiring member mounted thereon is selected from measurement results.
- a cutout window is opened in a region corresponding to the end of the insulating layer 3 b with a bonding layer by punching or the like, and the insulating layer 3 a with a bonding layer having the plural wirings 2 formed thereon and the insulating layer 3 b with a bonding layer covering the plural wirings 2 are bonded to each other by a heating roller.
- the wiring substrate 4 is formed.
- the first conductive sheet 5 having a size selected in the method of designing a wiring member is prepared.
- the second conductive sheet 7 is disposed in a region in the vicinity of each of the terminal portions 20 a and 20 b.
- the prepared first conductive sheet 5 is disposed in a region in the vicinity of each of the terminal portions 20 a and 20 b.
- the first conductive sheet 5 is bonded to the surface of the insulating layer 3 b by performing thermal compression on a region including a connector portion 5 c under conditions of a temperature of 120° C., a pressure of 0.5 MPa to 1 MPa, and a time of 5 seconds to 10 seconds, and the conductive bonding layer 52 is brought into contact with the ground line 2 b so as to be electrically connected thereto.
- the thermal compression may be performed on a region including at least the connector portion 5 c, and may be performed over a wide range including the entirety of the first conductive sheet 5 and the second conductive sheet 7 .
- the entirety except for the terminal portions 20 a and 20 b of the wiring substrate 4 having the first conductive sheet 5 and the second conductive sheet 7 disposed thereon is covered with the shielding member 6 , and the shielding member 6 is bonded to the first conductive sheet 5 , the second conductive sheet 7 , and the wiring substrate 4 by a heating roller. In this manner, the wiring member 1 is formed.
- the sizes of the first conductive sheets 5 are different from each other in accordance with the noise characteristics required for an electronic apparatus on which the wiring members are mounted.
- a heating roller is generally used (for example, see paragraph [0038] of JP-A-2002-329425 and FIG. 5D of JP-UM-A-04-36722).
- a method of performing thermal compression using a heating roller in a state where the first conductive sheet is disposed on the wiring substrate or in a state where the shielding member is disposed on the first conductive sheet is considered.
- the heating roller since pressure is applied while relatively moving the wiring member and the heating roller, the first conductive sheet is not likely to sufficiently follow the concavo-convex shape of the opening portion due to a cause such as a change in pressure applied to the first conductive sheet in association with the relative movement, and it is difficult to obtain a desired bonding state (connection impedance), and thus a higher shielding effect is not obtained.
- connection impedance between the first conductive sheet 5 and the ground line is easily reduced by, for example, using a thermal compression press machine 200 capable of applying pressure in a stopped state as shown in FIG. 7 , or the like, compared to a case where the thermal compression of a first conductive sheet is performed using a heating roller.
- the thermal compression press machine 200 includes an upper plate 201 , a lower plate 202 , and an elastic member 203 which is disposed on the lower plate 202 . It is preferable that the elastic member 203 is constituted by, for example, sponge having a hardness of approximately 30 .
- a shielding structure that is expected to be capable of exhibiting a noise reduction effect in such specific frequencies is desired.
- a structure is adopted in which a shielding member and a conductive tape are wound around a wiring substrate, and a conductive holding member holding the wiring substrate is provided at the position of the conductive tape, and the holding member is fixed to a sheet metal box, for example, as in a configuration disclosed in JP-A-2013-175375, and a method of setting the length of the shielding member to be a length corresponding to a specific frequency desired to be suppressed is considered.
- the length of the shielding member itself is set to be a length corresponding to a specific frequency desired to be suppressed, an optimized noise suppression effect can be expected with respect to a specific frequency component.
- noise characteristics deteriorate at frequencies other than the specific frequency.
- the wiring member 1 that is expected to be mounted on an electronic apparatus, when the plural wiring members 1 having different sizes of the first conductive sheets 5 are provided from others, the designing of the wiring member becomes easier than in a case where the plural wiring members having different sizes of the first conductive sheets 5 are prepared by oneself.
- the shielding member 6 that does not include a bonding layer may be used insofar as the shielding member can be disposed in proximity to the wiring substrate 4 without using an adhesive by covering the vicinity of the wiring substrate 4 , or the like.
- the shielding member 6 may be provided only on a side where the first conductive sheet 5 is provided.
- the shielding member may be provided only in a region in the vicinity of an end, or may be provided in a region other than the region in the vicinity of the end.
- a conductive bonding layer may be entirely or partially formed on the surface of the metal layer 61 as a bonding layer.
- the first conductive sheet 5 may be entirely or partially covered with the shielding member 6 . Further, the first conductive sheet 5 may be configured so as not be entirely covered with the shielding member 6 . However, when at least a portion of the first conductive sheet is covered with the shielding member 6 , the overlapping portion thereof has a double shielding function, and thus noise can be suppressed compared to a case where the entire first conductive sheet is covered, which leads to a preferable result from the viewpoint of suppressing noise.
Abstract
Description
- This application is based on and claims priority under 35 U.S.C. 119 from Japanese Patent Application No. 2014-226482 filed on Nov. 6, 2014.
- 1. Technical Field
- The present invention relates to a wiring member, a method of manufacturing the same, a method of designing the same, and an electronic apparatus.
- 2. Background Art
- Hitherto, there has been known a wiring member in which, when a shielding member is provided on a wiring substrate including plural wirings, including a signal line and a ground line, and an insulating layer that covers the plural wirings, an opening portion exposing at least a portion of the ground line is provided in the insulating layer, and the shielding member is grounded to the ground line through the opening portion (for example, see JP-A-2004-259619, JP-A-2002-329425 and JP-UM-A-04-36722.
- According to an aspect of the invention, there is provided a wiring member including: a wiring substrate that includes a plurality of wirings including a ground line, and a first insulating layer that covers the plurality of wirings and has an opening portion exposing at least a portion of the ground line; a first conductive sheet in which a second insulating layer is provided on one surface side of the first conductive sheet and a conductive bonding layer is provided on the other surface side of the first conductive sheet, in which the conductive bonding layer is disposed, toward the wiring substrate, on the first insulating layer, and in which the conductive bonding layer is electrically connected to the ground line through the opening portion; a second conductive sheet that includes first and second connection portions capable of being electrically connected to another member, the first connection portion being disposed between a portion of the first conductive sheet and the wiring substrate so as to be electrically connected to the conductive bonding layer of the first conductive sheet; and a shielding member that is disposed on the wiring substrate, the first conductive sheet, and the second conductive sheet and is electrically connected to the second connection portion of the second conductive sheet.
- Exemplary embodiments of the present invention will de described in detail based on the following figures, wherein:
-
FIG. 1 is a perspective view showing a schematic configuration example of a wiring member according to an embodiment of the present invention and a schematic configuration example of an electronic apparatus to which the wiring member is applied; -
FIG. 2 is an exploded perspective view of the vicinity of one end of the wiring member; -
FIG. 3 is a cross-sectional view taken along line E-E shown inFIG. 2 ;FIGS. 4A to 4C are a cross-sectional view taken along line A-A, a cross-sectional view taken along line B-B, and a cross-sectional view taken along line C-C shown inFIG. 3 , respectively; -
FIG. 5 is a plan view showing a main portion of a shielding member; -
FIG. 6A is a cross-sectional view of a second conductive sheet, andFIGS. 6B to 6G are cross-sectional views showing modified examples of the second conductive sheet; and -
FIG. 7 is a diagram showing a process of thermally compressing a first conductive sheet on a wiring substrate using a thermal-compression press machine. - Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. Meanwhile, in each drawing, components having substantially the same function are denoted by the same reference numerals and signs, and a repeated description will be omitted. Meanwhile, the scales and shapes of the drawing include portions emphasized in order to facilitate the understanding of features of the present invention, and are not necessarily the same as the scales and shapes of actual members.
-
FIG. 1 is a perspective view showing a schematic configuration example of a wiring member according to an embodiment of the present invention and a schematic configuration example of an electronic apparatus to which the wiring member is applied. - An
electronic apparatus 100 includes afirst substrate 110A including afirst connector 111A, asecond substrate 110B including asecond connector 111B, and awiring member 1 according to the present embodiment which electrically connects thefirst connector 111A and thesecond connector 111B. The number ofwiring members 1 is not limited to one, and may be two or more. - Examples of the
electronic apparatus 100 include a television receiver, an on-vehicle equipment such as a car navigation device or an audio device, an image forming apparatus such as a printer or a multifunction machine, and the like, but are not limited thereto. - For example, an electronic component or a power supply is mounted on the first and
second substrates wiring member 1 transmits a signal having a frequency of, for example, 10 MHz to 1 GHz or power. When theelectronic apparatus 100 is an image forming apparatus, for example, an image writing signal which is modulated on the basis of image data of cyan (C), magenta (M), yellow (Y), and black (K) colors through fourwiring members 1 corresponding to CMYK is transmitted from a controller to an exposure apparatus. - The
wiring member 1 includes awiring substrate 4 in which plural wirings are covered with an insulating layer, ashielding member 6 that covers thewiring substrate 4, and first and second conductive sheets, to be described later, which electrically connects ground lines among the plural wirings of thewiring substrate 4 and theshielding member 6. In addition, thewiring member 1 is provided withterminal portions plural wirings 2 are exposed, at both ends thereof in a longitudinal direction D. Theterminal portions first connector 111A provided on thefirst substrate 110A and thesecond connector 111 B provided on thesecond substrate 110B, respectively. - The phrase “wiring member” as used herein refers to a member, having flexibility, which has an elongated flat plate shape, includes plural wirings covered with an insulating layer, and has both ends in the longitudinal direction D from which wirings are exposed as terminal portions. The term “ends” as used herein refers to portions of the
wiring member 1 in which theterminal portions -
FIG. 2 is an exploded perspective view of the vicinity of one end of thewiring member 1.FIG. 3 is a cross-sectional view taken along line E-E shown inFIG. 2 .FIGS. 4A to 4C are a cross-sectional view taken along line A-A, a cross-sectional view taken along line B-B, and a cross-sectional view taken along line C-C shown inFIG. 3 , respectively. - As shown in
FIG. 2 , in thewiring member 1, a firstconductive sheet 5 is disposed in a region in the vicinity of the end (for example, a region having an interval of equal to or less than a quarter of the total length in the longitudinal direction D with respect to the end). Meanwhile, the region in which the firstconductive sheet 5 is disposed may be a region other than the region in the vicinity of the end. - The
wiring substrate 4 includes theplural wirings 2 includingground lines 2 b, and aninsulating layer 3 that has an opening portion formed therein, covers theplural wirings 2, and exposes at least portions of theground lines 2 b. Specifically, thewiring substrate 4 includes theplural wirings 2 which are arrayed in parallel at fixed intervals, and theinsulating layer 3 that covers theplural wirings 2. - The
wirings 2 includesignal lines 2 a and theground lines 2 b. The number ofground lines 2 b is two in the drawing, but may be one or three or more. The number ofwirings 2 is six in the drawing, but is not limited to six. Thewiring 2 is constituted by, for example, a flat plate-shaped conductor having a rectangular cross section, but may have another shape having a rounded rectangular shape or the like. The flat plate-shaped conductor is preferable in achieving electrical connection to the firstconductive sheet 5. For example, a wiring obtained by applying gold plating to copper can be used as thewiring 2. - The
wiring substrate 4 is formed by disposing theplural wirings 2 on one surface of aninsulating layer 3 a with a bonding layer and performing pressing using a heating roll so that theplural wirings 2 are interposed between a pair ofinsulating layers insulating layers insulating layer 3 b on the upper side, agroove 30 exposing theground line 2 b is formed along the longitudinal direction D as shown inFIG. 2 . - The
groove 30 is an example of an opening portion, and may be an elongated hole, a circular hole, or the like. The number of opening portions may be one for oneground line 2 b. Alternatively, one opening portion may be formed in the region in the vicinity of the end, or plural opening portions may be formed in the region in the vicinity of the end along the longitudinal direction D. The opening portion may be positioned in a region other than the region in the vicinity of the end. - In the first
conductive sheet 5, an insulatinglayer 50 is provided on one surface side thereof, aconductive bonding layer 52 is provided on the other surface side, theconductive bonding layer 52 is disposed toward thewiring substrate 4 on the insulatinglayer 3 in which thegrooves 30 of thewiring substrate 4 are formed, and theconductive bonding layer 52 is electrically connected to theground lines 2 b through thegrooves 30. - Specifically, the first
conductive sheet 5 includes the insulatinglayer 50, ametal layer 51 which is provided on the insulatinglayer 50, and theconductive bonding layer 52 which is provided on themetal layer 51. - As shown in
FIG. 2 , the firstconductive sheet 5 includes afirst connection portion 5 a which is electrically connected to theground lines 2 b and asecond connection portion 5 b which is electrically connected to the shieldingmember 6, and is disposed on the surface of the insulatinglayer 3 b with a bonding layer of thewiring substrate 4 including thegrooves 30. In addition,connector portions 5 c at two locations facing theground lines 2 b of thefirst connection portion 5 a and the vicinity of the first connector portions are pressed by a thermal-compression press machine as shown inFIG. 2 , and thus theconductive bonding layer 52 is pushed into thegrooves 30 as shown inFIG. 4A , and theconductive bonding layer 52 is thermally compressed on and electrically connected to theground lines 2 b. - Meanwhile, a method of electrically connecting the first
conductive sheet 5 to theground lines 2 b is not limited to thermal compression, and a method using a heating roller or another method such as ultrasonic bonding may be used. The ultrasonic bonding is a method which is effectively used when the firstconductive sheet 5 is constituted by only a metal layer or is constituted by a metal layer and a conductive bonding layer. In addition, a protrusion entering thegroove 30 may be provided on a press surface of an upper plate of the thermal-compression press machine. Accordingly, theconductive bonding layer 52 of the firstconductive sheet 5 is easily pushed into thegroove 30, and thus electrical connection to theground line 2 b becomes more reliable. - Compared to a configuration in which the shielding
member 6 is directly connected to thewiring substrate 4 without using the firstconductive sheet 5, it is preferable to use the firstconductive sheet 5 having characteristics in which electric resistance between the shieldingmember 6 and theground line 2 b is suppressed even when the conductive sheet is bonded under the same conditions. In addition, compared to a configuration in which the shieldingmember 6 is connected to thewiring substrate 4 through only the secondconductive sheet 7 without using the firstconductive sheet 5, it is preferable to use the firstconductive sheet 5 having characteristics in which electric resistance between the shieldingmember 6 and theground line 2 b is suppressed. Specifically, the firstconductive sheet 5 having a smaller contact resistance with theground line 2 b than the shieldingmember 6 or the secondconductive sheet 7, that is, the firstconductive sheet 5 having a larger contact area or having a higher contact degree, at the time of performing thermal compression on theground line 2 b under the same conditions, is used. For example, it is preferable that the firstconductive sheet 5 has a thickness smaller than that of the shieldingmember 6. In addition, it is preferable that themetal layer 51 of theconductive sheet 5 has stretching property higher than that of themetal layer 61 of the shieldingmember 6 and has a thickness smaller than that of themetal layer 61 of the shieldingmember 6. Further, it is preferable that firstconductive sheet 5 has a thickness smaller than that of the second conductive sheet. In addition, it is preferable that themetal layer 51 of the firstconductive sheet 5 has stretching property higher than those ofconductive cloths metal foil 72, to be described later inFIGS. 6A to 6G , in the secondconductive sheet 7 and has a thickness smaller than those of theconductive cloths metal foil 72. - Specifically, the first
conductive sheet 5 to be used in the present embodiment has a total thickness of approximately 30 μm which is smaller than that of the shieldingmember 6. For example, PET having a thickness of approximately 10 μm can be used as the insulatinglayer 50 of the firstconductive sheet 5. Themetal layer 51 is formed of for example, silver which has stretching property higher than that of themetal layer 61 of the shieldingmember 6. In addition, themetal layer 51 to be used may have a thickness of, for example, approximately 0.1 μm which is smaller than that of themetal layer 61 of the shieldingmember 6, and may have a surface resistance of approximately 200 mΩ/sq. Theconductive bonding layer 52 to be used may be formed by mixing, for example, silver-coated copper powder in a polyester-based thermoplastic resin and may have a thickness of approximately 20 μm. Theconductive bonding layer 52 to be used may have a bonding strength of, for example, approximately 4 N/cm (versus PET). - Although the number of first
conductive sheets 5 and the position thereof in the longitudinal direction D are not particularly limited, it is preferable that the conductive sheet is provided at an end of theground line 2 b in the longitudinal direction D in thewiring substrate 4, and more preferably, at both ends thereof. The shieldingmember 6 can be grounded at a position close to a ground of theelectronic apparatus 100 compared to a case where the conductive sheet is provided in a region other than the region in the vicinity of the end of thewiring substrate 4, for example, in a center portion, and thus a higher shielding effect can be expected. - The second
conductive sheet 7 includes first and second connection portions capable of electrically connected to another member, and is disposed so that the first connection portion is disposed between thesecond connection portion 5 b of the firstconductive sheet 5 and the insulatinglayer 3 of thewiring substrate 4 and the second connection portion is exposed from the firstconductive sheet 5. Since the insulatinglayer 50 is provided on one surface side of the firstconductive sheet 5, electrical connection between the firstconductive sheet 5 and the shieldingmember 6 is not performed even when the shieldingmember 6 is provided on the firstconductive sheet 5 in a state where the secondconductive sheet 7 is not present, and thus the electrical connection therebetween is performed through the secondconductive sheet 7. In this manner, the secondconductive sheet 7 has a role in performing electrical connection between the firstconductive sheet 5 and the shieldingmember 6, and is constituted by a sheet-like member such as a conductive cloth. - The shielding
member 6 includes an insulatinglayer 60, themetal layer 61 which is provided on one surface of the insulatinglayer 60, and an insulatingbonding layer 62 which is partially provided on the surface of themetal layer 61. The insulatinglayer 60 to be used may be formed of, for example, PET having a thickness of approximately 10 μm to 20 μm. Themetal layer 61 to be used may be formed of, for example, aluminum having a thickness of approximately 10 μm to 20 μm. The insulatingbonding layer 62 to be used may be formed of, for example, a thermosetting adhesive having a thickness of approximately 10 μm to 20 μm. - The shielding
member 6 is provided so as to cover the vicinity of thewiring substrate 4 and the firstconductive sheet 5 except for the terminal portions, and is bonded to a portion of the secondconductive sheet 7 which is exposed. Accordingly, an electrical connection path is formed which continues from the shieldingmember 6 to the secondconductive sheet 7, the firstconductive sheet 5, and theground lines 2 b in this order. -
FIG. 5 is a plan view showing a main portion of the shieldingmember 6. The insulatingbonding layer 62 of the shieldingmember 6 is constituted byplural line patterns 620 which extend in a direction intersecting the longitudinal direction D so as to be parallel to each other. That is, the insulatingbonding layer 62 is constituted by repetitive patterns in which theline patterns 620 are repeated in a width direction perpendicular to the longitudinal direction D. The patterns may be patterns other than the patterns shown inFIG. 5 because electrical conduction may be preferably allowed at the time of bonding the shieldingmember 6 to the exposed portion of the secondconductive sheet 7. For example, the patterns may be plural line patterns which extend in the longitudinal direction D so as to be parallel to each other, dot patterns constituted by dots which having a size that does not cover the entiresecond connection portion 5 b, or other repetitive patterns. Further, the patterns may not be repetitive patterns insofar as electrical conduction is allowed. - The
plural line patterns 620 extending in a direction intersecting the longitudinal direction D are used as the insulatingbonding layer 62, and thus a region of themetal layer 61 which is not provided with theline patterns 620 comes into contact with the portion of the secondconductive sheet 7 which is exposed, thereby allowing themetal layer 61 of the shieldingmember 6 to be electrically connected to theground lines 2 b through the secondconductive sheet 7 and the firstconductive sheet 5. In addition, the accurate positioning of the secondconductive sheet 7 at the time of bonding the shieldingmember 6 becomes unnecessary. In addition, shielding characteristics are stabilized by bringing the shieldingmember 6 into close contact with thewiring substrate 4 by the insulatingbonding layer 62. -
FIG. 6A is a cross-sectional view of the secondconductive sheet 7 according to the present embodiment. The secondconductive sheet 7 includes aconductive cloth 70 and anadhesive layer 71 provided on one surface of theconductive cloth 70. - The
conductive cloth 70 is formed by weaving conductive yarns that are obtained by plating the surfaces of non-conductive yarns formed of a resin such as polyester with a metal such as nickel. Theconductive cloth 70 has a thickness of, for example, approximately 120 μm. The surface resistance of theconductive cloth 70 is, for example, equal to or less than 0.05 Ω/sq. A contact resistance value of theconductive cloth 70 is, for example, equal to or less than 0.01Ω. Meanwhile, the conductive cloth is not limited to a cloth based on a non-conductive yarn-like member like theconductive cloth 70, and a conductive cloth using a yarn-like member which is entirely formed of a conductive metal or the like may be used. - The
adhesive layer 71 includesmetal particles 71 a and an adhesive 71 b. Theadhesive layer 71 has a thickness of, for example, approximately 50 μm. -
FIGS. 6B to 6G are cross-sectional views showing a modified example of the secondconductive sheet 7. The secondconductive sheet 7 may be a sheet-like member having a function of performing electrical connection between the shieldingmember 6 and the firstconductive sheet 5 having the insulatinglayer 50 provided on one surface side thereof, and may be, for example, sheets shown inFIGS. 6B to 6G . - A second
conductive sheet 7 shown inFIG. 6B includes ametal foil 72 havingplural embossments 72 a provided therein, and anadhesive layer 73 which is provided on a surface on the side where theembossments 72 a of themetal foil 72 protrude. - A second
conductive sheet 7 shown inFIG. 6C includes ametal foil 72 havingplural embossments 72 b provided therein, and anadhesive layer 71 which is provided on a surface on the opposite side to the side where theembossments 72 b of themetal foil 72 protrude. Theadhesive layer 71 includesmetal particles 71 a and an adhesive 71 b. - A second
conductive sheet 7 shown inFIG. 6D includes ametal foil 72 and anadhesive layer 71 which is provided on one surface of themetal foil 72. Theadhesive layer 71 includesmetal particles 71 a and an adhesive 71 b. - A second
conductive sheet 7 shown inFIG. 6E is constituted by aconductive cloth 74. Theconductive cloth 74 includes conductive yarns 74 a that are obtained by plating the surfaces of non-conductive yarns formed of a resin such as polyester with a metal such as nickel,metal particles 74 b, and an adhesive 74 c. - A second
conductive sheet 7 shown inFIG. 6F includes ametal foil 72 such as an aluminum foil, andadhesive layers 71 provided on both surfaces of themetal foil 72. Theadhesive layer 71 includesmetal particles 71 a and an adhesive 71 b. - A second
conductive sheet 7 shown inFIG. 6G includes ametal foil 72 such as a copper foil, and anadhesive layer 75, constituted by a non-conductive adhesive, which is provided on one surface of themetal foil 72. Meanwhile, the metal foils 72 and theconductive cloths FIGS. 6A to 6G are examples of metal layers. For example, a layer formed by metal vapor deposition may be used instead of themetal foil 72. - Next, an example of a method of designing a wiring member will be described.
- (1) Measurement of Noise Characteristics
- First, noise characteristics in a case where the size of the first
conductive sheet 5 is changed are measured. The size of the firstconductive sheet 5 is, for example, the length of a diagonal line. The noise characteristics may be noise characteristics in asingle wiring member 1, or may be noise characteristics in a state where the wiring member is embedded in an electronic apparatus. Meanwhile, the size of the firstconductive sheet 5 may be a length in the longitudinal direction D or an area. - (2) Selection of Size of First Conductive Sheet
- Next, the size of the first
conductive sheet 5 which satisfies a noise standard value required for an electronic apparatus having the wiring member mounted thereon is selected from measurement results. - Next, an example of a method of manufacturing the
wiring member 1 will be described. - (1) Formation of Wiring Substrate
- First, a cutout window is opened in a region corresponding to the end of the insulating
layer 3 b with a bonding layer by punching or the like, and the insulatinglayer 3 a with a bonding layer having theplural wirings 2 formed thereon and the insulatinglayer 3 b with a bonding layer covering theplural wirings 2 are bonded to each other by a heating roller. - Next, a portion of the insulating
layer 3 b which covers theground line 2 b is peeled along the longitudinal direction D. In this manner, thewiring substrate 4 is formed. - (2) Arrangement of First and Second Conductive Sheets
- Next, the first
conductive sheet 5 having a size selected in the method of designing a wiring member is prepared. - Next, the second
conductive sheet 7 is disposed in a region in the vicinity of each of theterminal portions conductive sheet 5 is disposed in a region in the vicinity of each of theterminal portions conductive sheet 5 is bonded to the surface of the insulatinglayer 3 b by performing thermal compression on a region including aconnector portion 5 c under conditions of a temperature of 120° C., a pressure of 0.5 MPa to 1 MPa, and a time of 5 seconds to 10 seconds, and theconductive bonding layer 52 is brought into contact with theground line 2 b so as to be electrically connected thereto. The thermal compression may be performed on a region including at least theconnector portion 5 c, and may be performed over a wide range including the entirety of the firstconductive sheet 5 and the secondconductive sheet 7. - (3) Covering with Shielding Member
- The entirety except for the
terminal portions wiring substrate 4 having the firstconductive sheet 5 and the secondconductive sheet 7 disposed thereon is covered with the shieldingmember 6, and the shieldingmember 6 is bonded to the firstconductive sheet 5, the secondconductive sheet 7, and thewiring substrate 4 by a heating roller. In this manner, thewiring member 1 is formed. - When the
plural wiring members 1 are manufactured, the sizes of the firstconductive sheets 5 are different from each other in accordance with the noise characteristics required for an electronic apparatus on which the wiring members are mounted. - (1) Reduction in Connection Impedance Between First Conductive Sheet and Ground
- Line
- In addition, when a sheet-like member is thermally compressed on a wiring member such as an FFC, a heating roller is generally used (for example, see paragraph [0038] of JP-A-2002-329425 and
FIG. 5D of JP-UM-A-04-36722). For this reason, also in a structure of the present embodiment in which a first conductive sheet is interposed between a wiring substrate and a shielding member, a method of performing thermal compression using a heating roller in a state where the first conductive sheet is disposed on the wiring substrate or in a state where the shielding member is disposed on the first conductive sheet is considered. - However, in the case of the heating roller, since pressure is applied while relatively moving the wiring member and the heating roller, the first conductive sheet is not likely to sufficiently follow the concavo-convex shape of the opening portion due to a cause such as a change in pressure applied to the first conductive sheet in association with the relative movement, and it is difficult to obtain a desired bonding state (connection impedance), and thus a higher shielding effect is not obtained.
- Consequently, in the present embodiment, when the first conductive sheet is thermally bonded, connection impedance between the first
conductive sheet 5 and the ground line is easily reduced by, for example, using a thermalcompression press machine 200 capable of applying pressure in a stopped state as shown inFIG. 7 , or the like, compared to a case where the thermal compression of a first conductive sheet is performed using a heating roller. The thermalcompression press machine 200 includes anupper plate 201, alower plate 202, and anelastic member 203 which is disposed on thelower plate 202. It is preferable that theelastic member 203 is constituted by, for example, sponge having a hardness of approximately 30. - (2) Suppression of Deterioration in Noise Characteristics
- In a wiring member mounted on an electronic apparatus, noise having frequencies corresponding to harmonic components of a signal waveform to be transferred tends to be generated. Consequently, a shielding structure that is expected to be capable of exhibiting a noise reduction effect in such specific frequencies is desired. As such a structure, a structure is adopted in which a shielding member and a conductive tape are wound around a wiring substrate, and a conductive holding member holding the wiring substrate is provided at the position of the conductive tape, and the holding member is fixed to a sheet metal box, for example, as in a configuration disclosed in JP-A-2013-175375, and a method of setting the length of the shielding member to be a length corresponding to a specific frequency desired to be suppressed is considered.
- However, when the length of the shielding member itself is set to be a length corresponding to a specific frequency desired to be suppressed, an optimized noise suppression effect can be expected with respect to a specific frequency component. However, as a result of a change in the length of the shielding member itself, there is a concern that noise characteristics deteriorate at frequencies other than the specific frequency.
- Consequently, in the present embodiment, it is possible not only to expect a noise reduction effect at a specific frequency by changing the size of the first
conductive sheet 5 rather than the size of the shieldingmember 6, but also to suppress a deterioration in noise characteristics at frequencies other than the specific frequency compared to a case where the length of the shieldingmember 6 itself is changed. - In addition, regarding the
wiring member 1 that is expected to be mounted on an electronic apparatus, when theplural wiring members 1 having different sizes of the firstconductive sheets 5 are provided from others, the designing of the wiring member becomes easier than in a case where the plural wiring members having different sizes of the firstconductive sheets 5 are prepared by oneself. - Regarding the shielding
member 6, the shieldingmember 6 that does not include a bonding layer may be used insofar as the shielding member can be disposed in proximity to thewiring substrate 4 without using an adhesive by covering the vicinity of thewiring substrate 4, or the like. In addition, the shieldingmember 6 may be provided only on a side where the firstconductive sheet 5 is provided. In addition, it is preferable that the shieldingmember 6 covers theentire wiring substrate 4 except for the vicinity of theterminal portions wiring substrate 4, but a configuration in which the shielding member covers the vicinity of only a portion of thewiring substrate 4 may also be adopted. For example, the shielding member may be provided only in a region in the vicinity of an end, or may be provided in a region other than the region in the vicinity of the end. In addition, a conductive bonding layer may be entirely or partially formed on the surface of themetal layer 61 as a bonding layer. - The first
conductive sheet 5 may be entirely or partially covered with the shieldingmember 6. Further, the firstconductive sheet 5 may be configured so as not be entirely covered with the shieldingmember 6. However, when at least a portion of the first conductive sheet is covered with the shieldingmember 6, the overlapping portion thereof has a double shielding function, and thus noise can be suppressed compared to a case where the entire first conductive sheet is covered, which leads to a preferable result from the viewpoint of suppressing noise. - Meanwhile, an embodiment of the present invention is not limited to the above-described embodiment, and can be modified and implemented in various ways without departing from the scope of the present invention.
- In addition, some of components in the embodiment may be omitted without departing from the scope of the present invention. In the flow of the embodiment, steps may be added, deleted, changed, or switched.
- The foregoing description of the exemplary embodiments of the present invention has been provided for the purpose of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise forms disclosed. Obviously, many modifications and variations will be apparent to practitioners skilled in the art. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, thereby enabling others skilled in the art to understand the invention for various embodiments and with the various modifications as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the following claims and there equivalents.
Claims (19)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014-226482 | 2014-11-06 | ||
JP2014226482A JP5741759B1 (en) | 2014-11-06 | 2014-11-06 | Wiring member, manufacturing method and design method thereof, and electronic device |
Publications (2)
Publication Number | Publication Date |
---|---|
US20160134038A1 true US20160134038A1 (en) | 2016-05-12 |
US9629234B2 US9629234B2 (en) | 2017-04-18 |
Family
ID=53537042
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/874,706 Active US9629234B2 (en) | 2014-11-06 | 2015-10-05 | Wiring member for shielding noise, and method of manufacturing, method of designing, and electronic apparatus thereof |
Country Status (3)
Country | Link |
---|---|
US (1) | US9629234B2 (en) |
JP (1) | JP5741759B1 (en) |
CN (1) | CN105591259B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9576699B2 (en) | 2014-11-06 | 2017-02-21 | Fuji Xerox Co., Ltd. | Wiring member, method of manufacturing the same, method of designing the same, and electronic apparatus |
US20210273378A1 (en) * | 2018-09-19 | 2021-09-02 | Autonetworks Technologies, Ltd. | Wiring member |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6812205B2 (en) * | 2016-11-08 | 2021-01-13 | 矢崎総業株式会社 | Wire Harness |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3459879A (en) * | 1967-05-29 | 1969-08-05 | Hughes Aircraft Co | Flexible multiflat conductor characteristic impedance cable |
US3582532A (en) * | 1969-11-26 | 1971-06-01 | Walter A Plummer | Shielded jacket assembly for flat cables |
US3612744A (en) * | 1969-02-27 | 1971-10-12 | Hughes Aircraft Co | Flexible flat conductor cable of variable electrical characteristics |
US3700825A (en) * | 1970-10-01 | 1972-10-24 | Int Computers Ltd | Circuit interconnecting cables and methods of making such cables |
US3757029A (en) * | 1972-08-14 | 1973-09-04 | Thomas & Betts Corp | Shielded flat cable |
US4287385A (en) * | 1979-09-12 | 1981-09-01 | Carlisle Corporation | Shielded flat cable |
US5008490A (en) * | 1990-01-19 | 1991-04-16 | Thomas & Betts Corporation | Strippable electrically shielded cable |
US6969807B1 (en) * | 2004-07-20 | 2005-11-29 | Advanced Flexible Circuits Co., Ltd. | Planar type flexible cable with shielding structure |
US20110036615A1 (en) * | 2004-12-01 | 2011-02-17 | Molex Incorporated | Flexible flat circuitry |
US20140325995A1 (en) * | 2013-05-03 | 2014-11-06 | Rolls-Royce Plc | Composite structure |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0436722U (en) | 1990-07-25 | 1992-03-27 | ||
JP2002329425A (en) | 2001-04-27 | 2002-11-15 | Dainippon Printing Co Ltd | Shielding material for flat cable and flat cable with shield |
JP2003151371A (en) * | 2001-11-08 | 2003-05-23 | Sumitomo Wiring Syst Ltd | Flat cable with shield layer |
JP4095469B2 (en) | 2003-02-26 | 2008-06-04 | 日立電線株式会社 | Shielding material-coated flexible flat cable and manufacturing method thereof |
JP4100385B2 (en) * | 2004-09-22 | 2008-06-11 | セイコーエプソン株式会社 | Multilayer structure forming method, wiring board manufacturing method, and electronic device manufacturing method |
JP5490032B2 (en) * | 2011-02-07 | 2014-05-14 | 信越ポリマー株式会社 | Method for manufacturing conductive pattern forming substrate and conductive pattern forming substrate |
JP2013175375A (en) | 2012-02-27 | 2013-09-05 | Ricoh Co Ltd | Wiring shield device, wiring shield method, electronic apparatus, and image processing device |
US9576699B2 (en) | 2014-11-06 | 2017-02-21 | Fuji Xerox Co., Ltd. | Wiring member, method of manufacturing the same, method of designing the same, and electronic apparatus |
-
2014
- 2014-11-06 JP JP2014226482A patent/JP5741759B1/en active Active
-
2015
- 2015-10-05 US US14/874,706 patent/US9629234B2/en active Active
- 2015-11-05 CN CN201510745704.6A patent/CN105591259B/en active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3459879A (en) * | 1967-05-29 | 1969-08-05 | Hughes Aircraft Co | Flexible multiflat conductor characteristic impedance cable |
US3612744A (en) * | 1969-02-27 | 1971-10-12 | Hughes Aircraft Co | Flexible flat conductor cable of variable electrical characteristics |
US3582532A (en) * | 1969-11-26 | 1971-06-01 | Walter A Plummer | Shielded jacket assembly for flat cables |
US3700825A (en) * | 1970-10-01 | 1972-10-24 | Int Computers Ltd | Circuit interconnecting cables and methods of making such cables |
US3757029A (en) * | 1972-08-14 | 1973-09-04 | Thomas & Betts Corp | Shielded flat cable |
US4287385A (en) * | 1979-09-12 | 1981-09-01 | Carlisle Corporation | Shielded flat cable |
US5008490A (en) * | 1990-01-19 | 1991-04-16 | Thomas & Betts Corporation | Strippable electrically shielded cable |
US6969807B1 (en) * | 2004-07-20 | 2005-11-29 | Advanced Flexible Circuits Co., Ltd. | Planar type flexible cable with shielding structure |
US20110036615A1 (en) * | 2004-12-01 | 2011-02-17 | Molex Incorporated | Flexible flat circuitry |
US20140325995A1 (en) * | 2013-05-03 | 2014-11-06 | Rolls-Royce Plc | Composite structure |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9576699B2 (en) | 2014-11-06 | 2017-02-21 | Fuji Xerox Co., Ltd. | Wiring member, method of manufacturing the same, method of designing the same, and electronic apparatus |
US20210273378A1 (en) * | 2018-09-19 | 2021-09-02 | Autonetworks Technologies, Ltd. | Wiring member |
US11710928B2 (en) * | 2018-09-19 | 2023-07-25 | Autonetworks Technologies, Ltd. | Wiring member |
Also Published As
Publication number | Publication date |
---|---|
JP2016091862A (en) | 2016-05-23 |
CN105591259B (en) | 2018-07-13 |
CN105591259A (en) | 2016-05-18 |
JP5741759B1 (en) | 2015-07-01 |
US9629234B2 (en) | 2017-04-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN206893832U (en) | Electronic building brick, electronic equipment and electronic system | |
TWI409985B (en) | Flat cable | |
JP2004095566A (en) | Shield film, shielded flexible printed wiring board, and their manufacturing methods | |
US8648668B2 (en) | Electrical impedance precision control of signal transmission line for circuit board | |
US9345134B2 (en) | Printed wiring board | |
US9629234B2 (en) | Wiring member for shielding noise, and method of manufacturing, method of designing, and electronic apparatus thereof | |
JP5794445B2 (en) | How to connect and fix high-frequency transmission lines | |
US9576699B2 (en) | Wiring member, method of manufacturing the same, method of designing the same, and electronic apparatus | |
JP2003086907A (en) | Shielded flexible printed wiring board | |
JP4295794B2 (en) | Shield flexible printed wiring board | |
WO2014185992A1 (en) | Connector | |
US20170188459A1 (en) | Method for manufacturing multilayer circuit board, and multilayer circuit board | |
JP5741758B1 (en) | Manufacturing method and design method of wiring member | |
JP5945801B2 (en) | Flexible printed wiring board and method for manufacturing flexible printed wiring board | |
JP6313124B2 (en) | Wiring board | |
JP5741757B1 (en) | Wiring member and electronic device | |
JPH08130351A (en) | Multilayer flexible wiring board | |
JP5904354B2 (en) | Flexible printed wiring board with shield, manufacturing method thereof, and electronic device | |
JP6520544B2 (en) | Flat cable | |
WO2009119305A1 (en) | Circuit board | |
JP3188816U (en) | Flexible substrate | |
KR101217099B1 (en) | Flexible flat cable | |
TWI476788B (en) | Flexible standard cable and circuit board integrated cable structure | |
JP5194084B2 (en) | Earth strap | |
JP6406453B2 (en) | Resin substrate, resin substrate manufacturing method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: FUJI XEROX CO., LTD., JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TOMIKAWA, ICHIRO;ASAYA, YASUMASA;REEL/FRAME:036725/0874 Effective date: 20150911 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 4 |
|
AS | Assignment |
Owner name: FUJIFILM BUSINESS INNOVATION CORP., JAPAN Free format text: CHANGE OF NAME;ASSIGNOR:FUJI XEROX CO., LTD.;REEL/FRAME:058287/0056 Effective date: 20210401 |