US20150280824A1 - Lighting apparatuses and led modules for both illumination and optical communication - Google Patents
Lighting apparatuses and led modules for both illumination and optical communication Download PDFInfo
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- US20150280824A1 US20150280824A1 US14/735,572 US201514735572A US2015280824A1 US 20150280824 A1 US20150280824 A1 US 20150280824A1 US 201514735572 A US201514735572 A US 201514735572A US 2015280824 A1 US2015280824 A1 US 2015280824A1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V33/00—Structural combinations of lighting devices with other articles, not otherwise provided for
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/11—Arrangements specific to free-space transmission, i.e. transmission through air or vacuum
- H04B10/114—Indoor or close-range type systems
- H04B10/116—Visible light communication
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
- H04B10/516—Details of coding or modulation
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
- H04B10/572—Wavelength control
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
- H05B45/37—Converter circuits
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
- F21Y2105/12—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
- F21Y2113/10—Combination of light sources of different colours
- F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present disclosure relates generally to optical communication and array-type light-emitting devices.
- LEDs Light emitting diodes
- They generally comprise an active layer of semiconductor material sandwiched between two oppositely-doped cladding layers. When a bias is applied across the cladding layers, electrons and holes are injected into the active layer where electrons and holes recombine to generate photons, or light. Recent advances in LEDs have resulted in highly efficient light sources that surpass the efficiency of filament-based light sources, providing light with equal or greater brightness in relation to input power.
- white light can be produced by combining the light from red, green and blue LEDs or combining the light from blue and yellow LEDs.
- white light can be produced by combining the light from red, green and blue LEDs or combining the light from blue and yellow LEDs.
- the other way to produce white light is using yellow phosphor, polymer or dye to downconvert portion of the light from a blue LED into yellow light.
- a white LED is seemly produced because it simultaneously emits both blue and yellow light, which combine to provide white light.
- LEDs Since white LEDs are developed, LEDs have widely used because of their high durability, longevity, portability, low power consumption, absence of harmful substances such as mercury, and so forth. Often-seen applications of LEDs include white light illumination, indicator lights, vehicle signal and illuminating light, LCD backlight modules, projector light sources, outdoor displays, and so forth. Nevertheless, other applications might use LEDs to replace their light sources.
- Embodiments of the present invention disclose a lighting apparatus capable of simultaneously providing illumination and data transmission to a receiver.
- the lighting apparatus comprises an LED module and a modulator.
- the LED module comprises a plurality of LED cells connected as an LED chain having two conductive pads. The light emitted from the LED module is visible.
- the modulator provides driving current to the LED module to transmit data.
- Embodiments of the present invention disclose an LED module, comprising LEDs and conductive pads.
- a first group of the LED cells is connected as a first LED chain, driven for illumination.
- a second group of the LED cells is connected as a second LED chain for data transmission.
- the conductive pads include a first pair of conductive pads connected to the first LED chain and a second pair of conductive pads connected to the second LED chain.
- FIG. 1 illustrates a broadcast system
- FIG. 2 exemplifies light apparatus 12 a
- FIG. 3 shows the waveform of driving current I IN that a modem provides to the LED module of FIG. 2 ;
- FIG. 4 demonstrates a cross section view of LED cells 8 a ( 1 , 1 ) and 8 a ( 1 , 2 ), cutting along the dotted line AA′ in FIG. 2 ;
- FIG. 5 exemplifies another light apparatus
- FIG. 6 shows the waveform of driving current I IN and I LIN that the modulator and the illumination driver of FIG. 5 provide respectively;
- FIG. 7 exemplifies another light apparatus
- FIG. 8 demonstrates a cross section view of LED cells 8 c ( 3 , 1 ) and 8 c ( 3 , 2 ) in FIG. 7 , cutting along the dotted line BB′;
- FIGS. 9-12 exemplify four light apparatuses.
- One embodiment of the invention employs LED cells as a light source to transmit digital information over a free space optical data pathway at the same time when LED cells functions for illumination. Transmission is accomplished by modulating or varying the current flowing through LED cells.
- FIG. 1 illustrates broadcast system 10 with light apparatuses 12 a and 12 b according to one embodiment of the invention.
- Light apparatuses 12 a and 12 b are powered by AC grid power lines and optionally receive digital data over AC grid power lines by way of power line communication.
- Each of light apparatuses 12 a and 12 b has an LED module with at least one LED chip.
- each of light apparatuses 12 a and 12 b transmits the digital data over the air to receiver 14 a or 14 b .
- the modulation should be over a signal carrier with an adequately-high frequency and be imperceptible by a human eye.
- the data transmission rate from the AC power lines to receiver 14 a or 14 b is limited by the signal bandwidth that the LED chips in light apparatuses 12 a and 12 b can support.
- Input capacitance of each LED chip in light apparatuses 12 a and 12 b could strongly affect the bandwidth supported.
- input capacitance of an LED chain refers to the capacitance measured from two conductive pads respectively connected to n-type and p-type contact layers of the LED chain, by means of small-signal response. The less input capacitance of an LED chip, the broader bandwidth the LED chip can support.
- FIG. 2 exemplifies light apparatus 12 a .
- light apparatus 12 a has modem 16 and LED module 19 a including LED chips 8 a .
- Modem 16 powered by AC grid power lines, is the combination of a demodulator which retrieves data carried from AC grid power lines, and a modulator 17 which provides and modulates driving current I IN to LED module 19 a to transmit data over the emitted light.
- Modulator 17 might include a converter converting an AC source current to driving current I IN .
- the light emitted from the LED chips 8 a is a visible light, for example a blue light having a wavelength spectrum around 440 ⁇ 480 nm, a green light having a wavelength spectrum around 500 ⁇ 560 nm, a green light having a wavelength spectrum around 500 ⁇ 560 nm, a red light having a wavelength spectrum around 600 ⁇ 650 nm, or white light.
- LED module 19 a has two LED chips 8 a connected in series.
- an LED module might have only one LED chip.
- LED chip 8 a has LED cells 8 a ( 1 , 1 ) ⁇ 8 a ( 3 , 3 ), arranged as an LED array with 3 columns and 3 rows.
- Label WW(N, M) refers to the LED cell located at N th column and M th row of LED chip WW.
- LED cells 8 a ( 1 , 1 ) ⁇ 8 a ( 3 , 3 ) are connected in series as an LED chain having two conductive pads IN+ and IN ⁇ , which are located at two diagonal corners of LED cells 8 a ( 1 , 1 ) and 8 a ( 3 , 3 ), respectively.
- the physical orientation for each LED cell in 1 st and 3 rd column is opposite to that of each LED cell in 2 nd column.
- LED cells 8 a ( 1 , 1 ) ⁇ 8 a ( 3 , 3 ) are epitaxial grown on a monolithic substrate through MOCVD process and other semiconductor process, such as sputtering, lithography, and etching process, such that the active layers therein are formed at the same time and made of substantially the same material.
- MOCVD process a monolithic substrate
- other semiconductor process such as sputtering, lithography, and etching process
- the active layers therein are formed at the same time and made of substantially the same material.
- LED chip 8 a is sometimes referred as a high-voltage (HV) LED chip.
- the number of the LED cells of the LED chip is around 3 ⁇ 80, or preferred 8 - 40 , depending on the operation voltage to be applied.
- an LED chip In order to provide the function of illumination, an LED chip should have enough number of LED cells emitting at the same time. LED cells connected in parallel could emit light at the same time, but the input capacitance for the LED cells as a whole increases as the number of the LED cells increases.
- the capacitance of the LED cells as a whole will be K1*F farad.
- increased input capacitance might reduce the bandwidth and the data transmission rate, such that LED cells connected in parallel are not suitable for data communication.
- LED cells connected in series as an LED chain emit at the same time, and the input capacitance for the LED cells as a whole decreases as the number of the LED cells connected in series increases.
- a driven LED chain has a plurality of LED cells connected in series, the number of the LED cells is around 3 ⁇ 80, or preferred 8 - 40 .
- FIG. 3 shows the waveform of driving current I IN that modem 16 could provide to LED module 19 a of FIG. 2 .
- Driving current I IN substantially switches between a high current level and a low current level back and forth.
- the low current level (of logic 0) is no less than 0 A and could be as low as 0 A, forcing LED module 19 a to stop emitting.
- the high current level (of logic 1) drives LED module 19 a to emit visible light.
- a rising edge means data “1” while a falling edge means data “0”.
- This kind of encoding scheme is called Manchester coding, a special case of binary phase shift keying.
- the data transmission rate should exceed the frequency range perceivable by a human eye, such that LED module 19 a is seen by human eyes to illuminate without flickering and provide constant intensity of light as being driven by average current I BRT , which is the average of the high and low current levels.
- FIG. 4 demonstrates a cross section view of LED cells 8 a ( 1 , 1 ) and 8 a ( 1 , 2 ), cutting along the dotted line AA′ in FIG. 2 .
- a similar drawing has been published in FIG. 2 of US Patent Application Publication 2010/0213474, whose entirety is incorporated by reference.
- LED cells 8 a ( 1 , 1 ) and 8 a ( 1 , 2 ) are grown on a monolithic substrate 60 , each having, from bottom to top, n-type contact layer 62 , n-type cladding layer 64 , active layer 66 , p-type cladding layer 68 , and p-type contact layer 70 .
- a wavelength conversion layer 72 is optionally formed on contact layer 70 to convert the light emitting from the active layer.
- Two electrodes 76 and 74 are optionally formed (may be omitted) on n-type contact layer 62 and p-type contact layer 70 , respectively.
- LED cells 8 a ( 1 , 1 ) and 8 a ( 1 , 2 ) are physically separated on monolithic substrate by a trench between LED cells 8 a ( 1 , 1 ) and 8 a ( 1 , 2 ).
- An electric circuit layer 78 provides electric connection between the n-type contact layer 62 of 8 a ( 1 , 1 ) and the p-type contact layer 70 of the adjacent LED cell, such as 8 a ( 1 , 2 ) to forma series connection.
- each of LED cells 8 a ( 1 , 1 ) to 8 a ( 3 , 3 ) occupies a cell area on the monolithic substrate 60 no more than 121 mil 2 .
- the monolithic substrate 60 has a surface area, for example between 1.21*10 2 to 1*10 5 mil 2 .
- Two conductive pads IN ⁇ , IN+ are provided for electric connection between the LED chip 8 a and an electric circuit outside the chip through external wires.
- the two conductive pads IN ⁇ , IN+ are respectively formed on the monolithic substrate 60 outside the array area for LED cells 8 a ( 1 , 1 ) ⁇ 8 a ( 1 , 3 ), and preferably at different corners or borders of the LED chip 8 a .
- the conductive pads IN ⁇ , IN+ are electrically coupled to the LED cells 8 a ( 1 , 1 ) ⁇ 8 a ( 1 , 3 ) via the electric circuit layer 78 as in FIG. 4 .
- LED cells 8 a ( 1 , 1 ) ⁇ 8 a ( 3 , 3 ) are epitaxial grown on monolithic substrate 60 using MOCVD process and other semiconductor process, such as sputtering, lithography, and etching process, the compositions of the active layers 66 therein are substantially the same to emit lights with the same or similar wavelength spectrum. Nevertheless, wavelength conversion layers 72 may be different or absent for some LED cells.
- all LED cells 8 a ( 1 , 1 ) ⁇ 8 a ( 3 , 3 ) are white LED cells each having an active layer emitting blue light and a wavelength conversion layer downconverting the blue light into yellow light.
- some of LED cells 8 a ( 1 , 1 ) ⁇ 8 a ( 3 , 3 ) are white LED cells each having a wavelength conversion layer downconverting the blue light into yellow light, and others are blue LED cells having a wavelength conversion layer downconverting the blue light into red light.
- some of LED cells 8 a ( 1 , 1 ) ⁇ 8 a ( 3 , 3 ) are white LED cells each having a wavelength conversion layer and others are blue LED cells having no wavelength conversion layer.
- the wavelength conversion layer is formed a layered structure bonded to the contact layer through a glue bonding layer under chip process for the foregoing embodiments.
- the wavelength conversion layer is formed by encapsulating the LED chip by an encapsulating material containing a wavelength conversion material under packaging process.
- FIG. 5 exemplifies light apparatus 12 b .
- LED module 19 b is controlled by controller 11 to provide both illumination and data transmission. Similar with LED chip 8 a of FIG. 2 , LED chip 8 b in LED module 19 b has LED cells 8 b ( 1 , 1 ) ⁇ 8 b ( 3 , 3 ), arranged as an LED array on a monolithic substrate. LED chip 8 b is slightly different with LED chip 8 a . While LED chip 8 a of FIG. 2 has only one LED chain with one pair of conductive pads IN+ and IN ⁇ as inputs, LED chip 8 b of FIG. 5 has two LED chains 22 and 24 .
- LED chain 22 has a pair of conductive pads LIN+ and IN+/LIN ⁇ while LED chain 24 has a pair of conductive pads IN+/LIN ⁇ and IN ⁇ . It can be found conductive pad IN+/LIN ⁇ is a common conductive pad connected to both the anode (or the n-type contact layer) of LED chains 24 and the cathode (or the p-type contact layer) of LED chain 22 . Conductive pads LIN+, IN ⁇ , and IN+/LIN ⁇ are provided for electric connection between the LED chip 8 a and an electric circuit outside the chip through external wires.
- the conductive pads LIN+, IN ⁇ , and IN+/LIN ⁇ are respectively formed on the monolithic substrate 60 outside the area of the LED cells of LED chip 8 b , and preferred at different corners or borders of the LED chip 8 b as shown in FIG. 5 .
- the conductive pads LIN+, IN ⁇ , and IN+/LIN ⁇ are electrically coupled to the LED cells via the electric circuit layer 78 as in FIG. 4 .
- pad IN+/LIN ⁇ is connected via electric circuit layer 78 to both a p-type contact layer of LED chain 24 and a n-type contact layer of LED chain 22 .
- FIG. 6 shows the waveform of driving current I IN and I LIN respectively provided by modulator 17 and illumination driver 13 of FIG. 5 .
- the operation of modulator 17 is not detailed here for brevity since it has been done in the paragraphs regarding with FIGS. 2 and 3 . It is comprehensive that LED chain 24 driven by modulator 17 transmits data via the light it emits.
- Illumination driver 13 of FIG. 5 provides driving current I LIN to LED chain 22 .
- Driving current I LIN is almost a constant and conveys no data as shown in FIG.
- LED chip 8 b has two LED chains 22 and 24 where LED chain 22 is only for illumination and LED chain 24 is for data transmission.
- LED chip 8 b is formed on a monolithic substrate, each of LED cells 8 b ( 1 , 1 ) to 8 b ( 3 , 3 ) occupies a cell area on a monolithic substrate no more than 121 mil 2 , and the number of LED cells in LED chain 24 is smaller than that in LED chain 22 .
- the area of one of the LED cell(s) in LED chain 24 for data transmission is smaller than that in LED chain 22 for illumination.
- the area of one of the LED cell (s) for data transmission is preferred no more than 121 mil 2
- the area of one of the LED cells for illumination is preferred no more than 400 mil 2 .
- LED chains 22 and 24 emit light of different colors.
- LED cells in chain 22 comprises white LED cells and LED cell 8 b ( 3 , 3 ) in chain 24 is a blue LED cell.
- FIG. 7 exemplifies light apparatus 12 c .
- LED chip 8 c of FIG. 7 has two LED chains 26 and 28 .
- LED chain 26 is only for illumination, driven via a pair of conductive pads LIN+ and LIN ⁇ /IN ⁇ by illumination driver 13 .
- LED chain 28 is for data transmission, driven via a pair of conductive pads IN+ and LIN ⁇ /IN ⁇ by modulator 17 .
- the conductive pad LIN ⁇ /IN ⁇ is electrically connected to both two n-type contact layers of LED chains 26 and 28 .
- LED chip 8 c is formed on a monolithic substrate.
- LED cell 8 c ( 3 , 1 ) and 8 c ( 3 , 2 ) in FIG. 7 cutting along the dotted line BB′.
- LED cell 8 c ( 3 , 1 ) which belongs to LED chain 26
- LED cell 8 c ( 3 , 2 ) has a cell orientation opposite to LED cell 8 c ( 3 , 2 ), which belongs to LED chain 28 .
- FIGS. 9 and 10 exemplify light apparatuses 12 d and 12 e .
- LED chip 8 d has LED chain 30 only for illumination and LED chain 32 for data transmission.
- Conductive pads LIN+ and LIN ⁇ for LED chain 30 are independent to conductive pads IN+ and IN ⁇ for LED chain 32
- LED cell 8 d ( 3 , 1 ) has the same cell orientation with LED cell 8 d ( 3 , 2 ).
- LED chains 30 and 32 are electrically insulated on the monolithic substrate.
- LED chip 8 e has LED chain 34 only for illumination and LED chain 36 for data transmission, while LED cell 8 e ( 3 , 1 ) has a cell orientation opposite to LED cell 8 e ( 3 , 2 ).
- FIG. 11 exemplifies light apparatus 12 f . It is unnecessary that LED cells in an LED module are all monolithically formed as an array on a monolithic substrate.
- LED module 19 f has individual LED chips 8 f 1 to 8 fn , where n is an integer. LED chips 8 f 1 to 8 fn could be formed on different substrates individually and together packaged on a submount, where the data transmitting speed would be lower compared with the LED module as disclosed in the foregoing embodiments using a monolithically-formed LED cell array on a single chip.
- LED chips 8 f 1 to 8 fn are all white LED chips.
- LED chips 8 f 1 to 8 fn consist of red, green and blue LED chips.
- LED module 19 f has two conductive terminals TIN+ and TIN ⁇ , through which modulator 17 provides driving current I IN to LED cells 8 f 1 to 8 fn to transmit data.
- FIG. 12 exemplifies light apparatus 12 g .
- LED module 19 g of FIG. 12 has LED chips 8 g 1 to 8 gn , where n is an integer.
- LED chips 8 g 1 to 8 g 5 are grouped and connected as LED chain 38 , driven by illumination driver 13 and functioning only for illumination.
- LED chips 8 g 6 to 8 gn are grouped and connected as LED chain 40 , driven by modulator 17 for data transmission.
- the light from LED chain 38 might be the same with or different to that from LED chain 40 .
- LED chips 8 g 1 to 8 g 5 of LED chain 38 or LED chips 8 g 6 to 8 gn of LED chain 40 comprise at least one selected from blue LED, green LED, red LED, and white LED chips.
- LED chips 8 g 1 to 8 g 5 of LED chain 38 consist of green and red LED chips and LED chips 8 g 6 to 8 gn consist of only blue LED chips.
- LED chain 38 provides visible light
- LED chain 40 provides invisible light.
- the wavelength spectrum of the light from LED chain 40 has a peak that is not affected by the intensity of the light from LED chain 38 .
Abstract
Lighting apparatuses and LED modules capable of both illumination and data transmission are disclosed. An exemplifying lighting apparatus has a LED module and a modulator. The LED module comprises a plurality of LED cells connected as a LED chain having two conductive pads. The light emitted from the LED module is visible. The modulator provides driving current to the LED module to transmit data.
Description
- This application is a Continuation of co-pending Application Ser. No. 13/089,946, filed on Apr. 19, 2011, for which priority is claimed under 35 U.S.C. §120, the entire contents of all of which are hereby incorporated by reference.
- The present disclosure relates generally to optical communication and array-type light-emitting devices.
- Light emitting diodes (LEDs) are an important class of solid-state devices that convert electric energy to light. They generally comprise an active layer of semiconductor material sandwiched between two oppositely-doped cladding layers. When a bias is applied across the cladding layers, electrons and holes are injected into the active layer where electrons and holes recombine to generate photons, or light. Recent advances in LEDs have resulted in highly efficient light sources that surpass the efficiency of filament-based light sources, providing light with equal or greater brightness in relation to input power.
- Disadvantage of conventional LEDs used for lighting applications is that they cannot generate white light directly from their active layers. Recently, two different ways have been introduced to produce white light from conventional LEDs. One way to produce white light from conventional LEDs is to combine different wavelength of light from different LEDs. For example, white light can be produced by combining the light from red, green and blue LEDs or combining the light from blue and yellow LEDs. The other way to produce white light is using yellow phosphor, polymer or dye to downconvert portion of the light from a blue LED into yellow light. A white LED is seemly produced because it simultaneously emits both blue and yellow light, which combine to provide white light.
- Since white LEDs are developed, LEDs have widely used because of their high durability, longevity, portability, low power consumption, absence of harmful substances such as mercury, and so forth. Often-seen applications of LEDs include white light illumination, indicator lights, vehicle signal and illuminating light, LCD backlight modules, projector light sources, outdoor displays, and so forth. Nevertheless, other applications might use LEDs to replace their light sources.
- Embodiments of the present invention disclose a lighting apparatus capable of simultaneously providing illumination and data transmission to a receiver. The lighting apparatus comprises an LED module and a modulator. The LED module comprises a plurality of LED cells connected as an LED chain having two conductive pads. The light emitted from the LED module is visible. The modulator provides driving current to the LED module to transmit data.
- Embodiments of the present invention disclose an LED module, comprising LEDs and conductive pads. A first group of the LED cells is connected as a first LED chain, driven for illumination. A second group of the LED cells is connected as a second LED chain for data transmission. The conductive pads include a first pair of conductive pads connected to the first LED chain and a second pair of conductive pads connected to the second LED chain.
- The invention can be more fully understood by the subsequent detailed description and examples with references made to the accompanying drawings, wherein:
-
FIG. 1 illustrates a broadcast system; -
FIG. 2 exemplifieslight apparatus 12 a; -
FIG. 3 shows the waveform of driving current IIN that a modem provides to the LED module ofFIG. 2 ; -
FIG. 4 demonstrates a cross section view ofLED cells 8 a(1, 1) and 8 a(1, 2), cutting along the dotted line AA′ inFIG. 2 ; -
FIG. 5 exemplifies another light apparatus; -
FIG. 6 shows the waveform of driving current IIN and ILIN that the modulator and the illumination driver ofFIG. 5 provide respectively; -
FIG. 7 exemplifies another light apparatus; -
FIG. 8 demonstrates a cross section view ofLED cells 8 c(3, 1) and 8 c(3, 2) inFIG. 7 , cutting along the dotted line BB′; and -
FIGS. 9-12 exemplify four light apparatuses. - The following embodiments are described in sufficient detail to enable those skilled in the art to make and use the invention. It is to be understood that other embodiments would be evident based on the present disclosure, and that proves or mechanical changes may be made without departing from the scope of the present invention.
- In the following description, numerous specific details are given to provide a thorough understanding of the invention. However, it will be apparent that the invention may be practiced without these specific details. In order to avoid obscuring the present invention, some well-known configurations and process steps are not disclosed in detail.
- One embodiment of the invention employs LED cells as a light source to transmit digital information over a free space optical data pathway at the same time when LED cells functions for illumination. Transmission is accomplished by modulating or varying the current flowing through LED cells.
-
FIG. 1 illustratesbroadcast system 10 withlight apparatuses Light apparatuses light apparatuses light apparatuses receiver - Subject to other factors, the data transmission rate from the AC power lines to
receiver light apparatuses light apparatuses -
FIG. 2 exemplifieslight apparatus 12 a. As shown inFIG. 2 ,light apparatus 12 a hasmodem 16 andLED module 19 a includingLED chips 8 a.Modem 16, powered by AC grid power lines, is the combination of a demodulator which retrieves data carried from AC grid power lines, and amodulator 17 which provides and modulates driving current IIN toLED module 19 a to transmit data over the emitted light.Modulator 17 might include a converter converting an AC source current to driving current IIN. The light emitted from theLED chips 8 a is a visible light, for example a blue light having a wavelength spectrum around 440˜480 nm, a green light having a wavelength spectrum around 500˜560 nm, a green light having a wavelength spectrum around 500˜560 nm, a red light having a wavelength spectrum around 600˜650 nm, or white light. In the embodiment ofFIG. 2 ,LED module 19 a has twoLED chips 8 a connected in series. For another embodiment, an LED module might have only one LED chip. - As an example,
LED chip 8 a hasLED cells 8 a(1, 1)˜8 a(3, 3), arranged as an LED array with 3 columns and 3 rows. Label WW(N, M) refers to the LED cell located at Nth column and Mth row of LED chip WW.LED cells 8 a(1, 1)˜8 a(3, 3) are connected in series as an LED chain having two conductive pads IN+ and IN−, which are located at two diagonal corners ofLED cells 8 a(1, 1) and 8 a(3, 3), respectively. The physical orientation for each LED cell in 1st and 3rd column is opposite to that of each LED cell in 2nd column. If one LED cell in an LED chain is forward biased, all LED cells in the LED chain are forward biased, and vice versa. In one embodiment,LED cells 8 a(1, 1)˜8 a(3, 3) are epitaxial grown on a monolithic substrate through MOCVD process and other semiconductor process, such as sputtering, lithography, and etching process, such that the active layers therein are formed at the same time and made of substantially the same material. As the operation voltage ofLED chip 8 a is the summation of the operation voltages of individual LED cells,LED chip 8 a is sometimes referred as a high-voltage (HV) LED chip. The number of the LED cells of the LED chip is around 3˜80, or preferred 8-40, depending on the operation voltage to be applied. - In order to provide the function of illumination, an LED chip should have enough number of LED cells emitting at the same time. LED cells connected in parallel could emit light at the same time, but the input capacitance for the LED cells as a whole increases as the number of the LED cells increases. Supposed that there are K1 identical LED cells connected in parallel and each individual LED cell has input capacitance of F farad, the capacitance of the LED cells as a whole will be K1*F farad. As mentioned before, increased input capacitance might reduce the bandwidth and the data transmission rate, such that LED cells connected in parallel are not suitable for data communication. Nevertheless, LED cells connected in series as an LED chain emit at the same time, and the input capacitance for the LED cells as a whole decreases as the number of the LED cells connected in series increases. The input capacitance for K1 identical LED cells as a whole will be F/K1 farad if they are connected in series wherein each individual one has input capacitance of F farad. Thus, an LED chain is suitable for both illumination and data transmission. In the embodiment of
FIG. 2 , a driven LED chain has a plurality of LED cells connected in series, the number of the LED cells is around 3˜80, or preferred 8-40. - There is another advantage that series connection surpasses parallel connection. Each and every LED in an LED chain of an LED chip will be driven with the same driving current even if there are slight differences between the characteristics of the LED cells in the LED chain. In other words, the LED cells in an LED chain of an LED chip emit power evenly. LED cells connected in parallel acts differently, however. Most of the driving current for the LED cells connected in parallel crowds to the LED cell with the least resistance, such that the LED cell with the least resistance emits higher power in comparison with others, therefore downgrading the reliability of the LED chip.
-
FIG. 3 shows the waveform of driving current IIN thatmodem 16 could provide toLED module 19 a ofFIG. 2 . Driving current IIN substantially switches between a high current level and a low current level back and forth. The low current level (of logic 0) is no less than 0 A and could be as low as 0 A, forcingLED module 19 a to stop emitting. The high current level (of logic 1) drivesLED module 19 a to emit visible light. Within a clock cycle time, a rising edge means data “1” while a falling edge means data “0”. This kind of encoding scheme is called Manchester coding, a special case of binary phase shift keying. The data transmission rate should exceed the frequency range perceivable by a human eye, such thatLED module 19 a is seen by human eyes to illuminate without flickering and provide constant intensity of light as being driven by average current IBRT, which is the average of the high and low current levels. - As an example,
FIG. 4 demonstrates a cross section view ofLED cells 8 a(1, 1) and 8 a(1, 2), cutting along the dotted line AA′ inFIG. 2 . A similar drawing has been published in FIG. 2 of US Patent Application Publication 2010/0213474, whose entirety is incorporated by reference. As shown inFIG. 4 ,LED cells 8 a(1, 1) and 8 a(1, 2) are grown on amonolithic substrate 60, each having, from bottom to top, n-type contact layer 62, n-type cladding layer 64,active layer 66, p-type cladding layer 68, and p-type contact layer 70. A wavelength conversion layer 72 is optionally formed oncontact layer 70 to convert the light emitting from the active layer. Twoelectrodes type contact layer 62 and p-type contact layer 70, respectively.LED cells 8 a(1, 1) and 8 a(1, 2) are physically separated on monolithic substrate by a trench betweenLED cells 8 a(1, 1) and 8 a(1, 2). Anelectric circuit layer 78 provides electric connection between the n-type contact layer 62 of 8 a(1,1) and the p-type contact layer 70 of the adjacent LED cell, such as 8 a(1, 2) to forma series connection. Aninsulator layer 80 is formed under portion ofelectric circuit layer 78 to prevent unwanted short circuits. In one embodiment, each ofLED cells 8 a(1, 1) to 8 a(3, 3) occupies a cell area on themonolithic substrate 60 no more than 121 mil2. Themonolithic substrate 60 has a surface area, for example between 1.21*102 to 1*105 mil2. - Two conductive pads IN−, IN+ are provided for electric connection between the
LED chip 8 a and an electric circuit outside the chip through external wires. The two conductive pads IN−, IN+ are respectively formed on themonolithic substrate 60 outside the array area forLED cells 8 a(1, 1)˜8 a(1, 3), and preferably at different corners or borders of theLED chip 8 a. The conductive pads IN−, IN+ are electrically coupled to theLED cells 8 a(1,1)˜8 a(1,3) via theelectric circuit layer 78 as inFIG. 4 . - As
LED cells 8 a(1,1)˜8 a(3,3) are epitaxial grown onmonolithic substrate 60 using MOCVD process and other semiconductor process, such as sputtering, lithography, and etching process, the compositions of theactive layers 66 therein are substantially the same to emit lights with the same or similar wavelength spectrum. Nevertheless, wavelength conversion layers 72 may be different or absent for some LED cells. For example, in one embodiment, allLED cells 8 a(1, 1)˜8 a(3, 3) are white LED cells each having an active layer emitting blue light and a wavelength conversion layer downconverting the blue light into yellow light. In another embodiment, some ofLED cells 8 a(1,1)˜8 a(3,3) are white LED cells each having a wavelength conversion layer downconverting the blue light into yellow light, and others are blue LED cells having a wavelength conversion layer downconverting the blue light into red light. In another embodiment, some ofLED cells 8 a(1,1)˜8 a(3,3) are white LED cells each having a wavelength conversion layer and others are blue LED cells having no wavelength conversion layer. In one embodiment, the wavelength conversion layer is formed a layered structure bonded to the contact layer through a glue bonding layer under chip process for the foregoing embodiments. In another embodiment, the wavelength conversion layer is formed by encapsulating the LED chip by an encapsulating material containing a wavelength conversion material under packaging process. -
FIG. 5 exemplifieslight apparatus 12 b.LED module 19 b is controlled bycontroller 11 to provide both illumination and data transmission. Similar withLED chip 8 a ofFIG. 2 ,LED chip 8 b inLED module 19 b has LEDcells 8 b(1,1)˜8 b(3,3), arranged as an LED array on a monolithic substrate.LED chip 8 b is slightly different withLED chip 8 a. WhileLED chip 8 a ofFIG. 2 has only one LED chain with one pair of conductive pads IN+ and IN− as inputs,LED chip 8 b ofFIG. 5 has two LEDchains LED chain 24, or more than one LED cell.LED chain 22 has a pair of conductive pads LIN+ and IN+/LIN− whileLED chain 24 has a pair of conductive pads IN+/LIN− and IN−. It can be found conductive pad IN+/LIN− is a common conductive pad connected to both the anode (or the n-type contact layer) ofLED chains 24 and the cathode (or the p-type contact layer) ofLED chain 22. Conductive pads LIN+, IN−, and IN+/LIN− are provided for electric connection between theLED chip 8 a and an electric circuit outside the chip through external wires. The conductive pads LIN+, IN−, and IN+/LIN− are respectively formed on themonolithic substrate 60 outside the area of the LED cells ofLED chip 8 b, and preferred at different corners or borders of theLED chip 8 b as shown inFIG. 5 . The conductive pads LIN+, IN−, and IN+/LIN− are electrically coupled to the LED cells via theelectric circuit layer 78 as inFIG. 4 . For example, pad IN+/LIN− is connected viaelectric circuit layer 78 to both a p-type contact layer ofLED chain 24 and a n-type contact layer ofLED chain 22. The pair of conductive pads LIN+ and IN+/LIN− is connected toillumination driver 13 ofcontroller 11 and the pair of conductive pads IN+/LIN− and IN− is connected to modulator 17 ofcontroller 11.FIG. 6 shows the waveform of driving current IIN and ILIN respectively provided bymodulator 17 andillumination driver 13 ofFIG. 5 . The operation ofmodulator 17 is not detailed here for brevity since it has been done in the paragraphs regarding withFIGS. 2 and 3 . It is comprehensive thatLED chain 24 driven bymodulator 17 transmits data via the light it emits.Illumination driver 13 ofFIG. 5 provides driving current ILIN toLED chain 22. Driving current ILIN is almost a constant and conveys no data as shown inFIG. 6 , such thatLED chain 22 only acts as a lighting source for illumination. Accordingly,LED chip 8 b has two LEDchains LED chain 22 is only for illumination andLED chain 24 is for data transmission. In one embodiment,LED chip 8 b is formed on a monolithic substrate, each ofLED cells 8 b(1, 1) to 8 b(3, 3) occupies a cell area on a monolithic substrate no more than 121 mil2, and the number of LED cells inLED chain 24 is smaller than that inLED chain 22. In another embodiment, the area of one of the LED cell(s) inLED chain 24 for data transmission is smaller than that inLED chain 22 for illumination. In one embodiment, the area of one of the LED cell (s) for data transmission is preferred no more than 121 mil2, and the area of one of the LED cells for illumination is preferred no more than 400 mil2. - In one embodiment,
LED chains chain 22 comprises white LED cells andLED cell 8 b(3,3) inchain 24 is a blue LED cell. -
FIG. 7 exemplifieslight apparatus 12 c. Similar withLED chip 8 b ofFIG. 5 ,LED chip 8 c ofFIG. 7 has two LEDchains LED chain 26 is only for illumination, driven via a pair of conductive pads LIN+ and LIN−/IN− byillumination driver 13.LED chain 28 is for data transmission, driven via a pair of conductive pads IN+ and LIN−/IN− bymodulator 17. The conductive pad LIN−/IN− is electrically connected to both two n-type contact layers ofLED chains LED chip 8 c is formed on a monolithic substrate.FIG. 8 demonstrates a cross section view ofLED cells 8 c(3, 1) and 8 c(3, 2) inFIG. 7 , cutting along the dotted line BB′. As shown inFIG. 8 , even though they are located in the same column,LED cell 8 c(3, 1), which belongs toLED chain 26, has a cell orientation opposite toLED cell 8 c(3, 2), which belongs toLED chain 28. - It is unnecessary that the LED chain only for illumination must shares a common conductive pad with the LED chain for data transmission.
FIGS. 9 and 10 exemplifylight apparatuses FIG. 9 ,LED chip 8 d has LEDchain 30 only for illumination andLED chain 32 for data transmission. Conductive pads LIN+ and LIN− forLED chain 30 are independent to conductive pads IN+ and IN− forLED chain 32, whileLED cell 8 d(3, 1) has the same cell orientation withLED cell 8 d(3, 2).LED chains FIG. 10 ,LED chip 8 e has LEDchain 34 only for illumination andLED chain 36 for data transmission, whileLED cell 8 e(3, 1) has a cell orientation opposite toLED cell 8 e(3, 2). -
FIG. 11 exemplifieslight apparatus 12 f. It is unnecessary that LED cells in an LED module are all monolithically formed as an array on a monolithic substrate. InFIG. 11 , LED module 19 f has individual LED chips 8f 1 to 8 fn, where n is an integer. LED chips 8f 1 to 8 fn could be formed on different substrates individually and together packaged on a submount, where the data transmitting speed would be lower compared with the LED module as disclosed in the foregoing embodiments using a monolithically-formed LED cell array on a single chip. In one embodiment, LED chips 8f 1 to 8 fn are all white LED chips. In another embodiment, LED chips 8f 1 to 8 fn consist of red, green and blue LED chips. LED module 19 f has two conductive terminals TIN+ and TIN−, through whichmodulator 17 provides driving current IIN to LED cells 8f 1 to 8 fn to transmit data. -
FIG. 12 exemplifieslight apparatus 12 g. Similar withFIG. 11 , LED module 19 g ofFIG. 12 has LED chips 8g 1 to 8 gn, where n is an integer. LED chips 8g 1 to 8 g 5 are grouped and connected asLED chain 38, driven byillumination driver 13 and functioning only for illumination. LED chips 8 g 6 to 8 gn are grouped and connected asLED chain 40, driven bymodulator 17 for data transmission. The light fromLED chain 38 might be the same with or different to that fromLED chain 40. LED chips 8g 1 to 8 g 5 ofLED chain 38 or LED chips 8 g 6 to 8 gn ofLED chain 40 comprise at least one selected from blue LED, green LED, red LED, and white LED chips. For example, LED chips 8g 1 to 8 g 5 ofLED chain 38 consist of green and red LED chips and LED chips 8 g 6 to 8 gn consist of only blue LED chips. In one embodiment,LED chain 38 provides visible light, andLED chain 40 provides invisible light. In view of noise immunity, it is preferable that the wavelength spectrum of the light fromLED chain 40 has a peak that is not affected by the intensity of the light fromLED chain 38. - All the previously-mentioned LED chains that function, partially or fully, for illumination provide visible light. Nevertheless, the previously-mentioned LED chains that function only for data transmission could provide visible or invisible light.
- While the invention has been described by way of example and in terms of preferred embodiment, it is to be understood that the invention is not limited thereto. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
Claims (14)
1. An LED module, comprising:
a modulator;
a first LED chain, connected to the modulator, comprising a first group of LED cells and configured to emit a first light, wherein the first light comprises a digital data over a signal carrier;
a driver independent from the modulator in controlling an emission of light;
a second LED chain, connected to the driver, comprising a second group of LED cells, and configured to emit a second light which is independent from an emission of the first light; and
a wavelength conversion layer associated with the first LED chain and disassociated with the second LED chain.
2. The LED module of claim 1 , further comprising first conductive pads connected to the first LED chain and second conductive pads connected to the second LED chain, wherein the first conductive pads and the second conductive pads share a common conductive pad.
3. The LED module of claim 2 , wherein the first LED chain comprises a first-type contact layer, the second LED chain comprises a second-type contact layer, the first-type and the second-type contact layers are electrically coupled to the common conductive pad.
4. The LED module of claim 2 , wherein the first LED chain comprises a p-type contact layer, the second LED chain comprises an n-type contact layer, the p-type contact layer and the n-type contact layer are electrically coupled to the common conductive pad under which an insulating layer is formed.
5. The LED module of claim 1 , wherein the second LED chain comprises an LED cell having an area of not greater than 121 mil2.
6. The LED module of claim 1 , wherein the first LED chain is capable of emitting a color light which is different from that emitted from the second LED chain.
7. The LED module of claim 1 , wherein the first LED chain comprises at least one LED cell capable of emitting a color light different from that emitted from another LED cell in the second LED chain.
8. The LED module of claim 1 , wherein the second LED chain has less LED cells than the first LED chain.
9. The LED module of claim 1 , further comprising a substrate having an area between 1.21*102 and 1*105 mil2.
10. The LED module of claim 1 , wherein the signal carrier has a frequency imperceptible to human eyes.
11. The LED module of claim 1 , wherein the LED module is capable of receiving data in a way of power line communication.
12. The LED module of claim 1 , wherein the first LED chain comprises a first LED, the second LED chain comprises a second LED, wherein the second LED has an area greater than that of the first LED.
13. The LED module of claim 1 , wherein the first light has a wavelength spectrum having a peak which is not affected by the second light.
14. An LED module, comprising:
a modulator;
an LED module configured to emit a light comprising a digital data over a signal carrier by the modulator; and
a wavelength conversion layer bonded to the LED module.
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US20120269520A1 (en) | 2012-10-25 |
CN102748604A (en) | 2012-10-24 |
US20170287888A1 (en) | 2017-10-05 |
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