US20150136375A1 - System and Method of Producing Scalable Heat-sink Assembly - Google Patents
System and Method of Producing Scalable Heat-sink Assembly Download PDFInfo
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- US20150136375A1 US20150136375A1 US14/606,115 US201514606115A US2015136375A1 US 20150136375 A1 US20150136375 A1 US 20150136375A1 US 201514606115 A US201514606115 A US 201514606115A US 2015136375 A1 US2015136375 A1 US 2015136375A1
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- face
- troughs
- extruded member
- heat
- bulbous
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
- F28F3/083—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning capable of being taken apart
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4878—Mechanical treatment, e.g. deforming
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49366—Sheet joined to sheet
Definitions
- the present invention relates generally to heat-sinks, and more particularly to heat-sink assemblies constructed from press-fitted sub-units.
- a heat-sink is an object that transfers thermal energy from a higher temperature to a lower temperature fluid medium.
- Heat-sinks used for the cooling of electronic components are typically constructed from thermally conductive materials such as aluminum alloys and generally possess a base portion of relatively thicker material and a region having a plurality of fins or posts, designed to maximize the surface area of the heat-sink exposed to the air or other fluid medium having a temperature lower than that of the heat-sink.
- the base portion is in clone contact with a heat producing element such as a CPU or other heat producing electrical components, and the fins disperse the conducted heat to the surrounding fluid medium.
- Heat-sinks are conventionally manufactured by extruding, machining, pressure die-casting, or some combination of the foregoing processes.
- At least one interlocking heat-sink assembly is known in the art which teaches a heat-sink formed of pre-cut and press-fitted strip elements to form an interlocking stack permitting the heat-sinks to readily scale.
- the press-fitted sub-units are often subject to excessive shear forces causing unwanted deformation, deflection, structural failure and voids. Any gap between press-fitted elements necessarily reduces conduction across the heat-sink and impairs the heat-sink's ability to transfer heat to the fluid medium.
- the present invention is a system for assembling of a heat-sink and more particularly, a system in which the heat-sink assembly is constructed from individual extruded members which are press-fitted together to form various sized assemblies.
- the extruded members have opposing faces that are partially coated with a thermally conductive compound, such as a thermal epoxy, prior to a press-fit operation.
- a thermally conductive compound such as a thermal epoxy
- Each opposing face possesses an alternating series of troughs and ridges, with the ridges having a generally bulbous shape. At least some of the ridges and troughs possess a longitudinal groove or recess that performs as a feeder reservoir for the thermally conductive compound during the press-fitting.
- the bulbous shapes have the tendency to deform in a direction generally perpendicular to the inner surfaces of mating troughs resulting in reduced shearing between the mating surfaces.
- Reduced shearing prevents portions of the mating surfaces from scraping against each other during the progressive deformation which would otherwise result in the leading regions scraping the thermally conductive compound forward of the trailing regions, leading to voids.
- Transversely applied compressive force to the mated assembly produces a relatively uniform expansive deformation of the ridges into the troughs, with the distance between opposing sections of the troughs narrowing to meet the neck portion of the bulbous regions.
- the rounded profiles of the ridges and troughs reduce shear during press-fitting and evenly distributes the thermally conductive compound throughout the spaces between the individual sub-units. Absence of voids within the thermally conductive compound improves the overall thermal conductivity of the heat-sink assembly and means that application of thermal compound and press-fitting can be performed in one operation.
- At least some of the bulbous shaped protrusions possess a groove that serves as a reservoir for the thermally conductive substance during press-fit operations.
- the reservoir of the bulbous shape faces a reservoir of a trough portion and together form a longitudinal aperture that serves to feed additional thermally conductive compound to surrounding mating surfaces during the press-fit operation.
- FIG. 1 is a partial perspective view according to one embodiment of the present invention primarily depicting one face 12 e of an extruded member;
- FIG. 2 is a plan view according to the present invention of face 12 e of an extruded member
- FIG. 3 is cross-sectional view taken along lines 2 - 2 . of FIG. 2 depicting the respective profiles of faces 12 d and 12 e;
- FIG. 4 is an end view according to one embodiment of the present invention depicting an assembly of multiple extruded members press-fitted together;
- FIG. 5 is a detail view according to one embodiment of the present invention depicting the relative positions of a ridge of a one extruded member and a trough of another extruded member adjacent one another prior to press-fit;
- FIG. 6 is a detail view according to one embodiment of the present invention depicting the relative positions of a two extruded members prior to press-fit, with the top member shown having a head portion partially coated with a thermally conductive compound;
- FIG. 7 is a detail view according to one embodiment of the present invention depicting a the progression of a head portion of a top extruded member, which has been forced past the knob portions 24 of the bottom extruded member into a trough in which the thermally conductive compound depicted in FIG. 6 is being progressively forced into the interstices;
- FIG. 8 is a detail view according to one embodiment of the present invention depicting a bulbous formation mated with a trough after press-fitting in which the (1) bulbous portions have been expandable deformed into the troughs, and (2) the thermally conductive has been forced into the surrounding interstices;
- FIG. 9 is a detail view according to another embodiment of the present invention depicting the relative positions of a ridge of a one extruded member and a trough of another extruded member adjacent one another prior to press-fit.
- a system for producing scalable heat-sink assemblies includes, at least two extruded members 12 , logically divided into a top portion 12 a extending to a fin, a middle portion 12 b where the fin transitions to a shoulder, a bottom portion 12 c having two faces 12 d and 12 e that each posses a number of alternating ridges 14 and troughs 16 in which the ridges have a generally bulbous 18 shape which is further logically subdivided into a head portion 20 possessing two knob 24 portions.
- at least some ridges 14 possess a groove bra at the crown of the head portion 20
- some troughs possess a groove bib in the base 26 of the trough.
- the first and second sides of the extruded profiles interconnect with one another via the head portions 20 of the grooved ridges along face 12 d mate-ably engaged with the neck portions 22 of the non-grooved ridges along face 12 e, and the head portions of the non-grooved ridges along face 12 e mate-ably engaged with the neck portions of the gloved ridges along 12 d.
- the grooves bra of the ridges and the grooves bib of the troughs face one another and together form sinuses 29 defining a reservoir, which is produced by the two relatively shallow arcuate surfaces in mirrored opposition.
- FIG. 3 is a cross-sectional view taken along lines 2 ′- 2 ′ of FIG. 2 and depicts the profiles of the various mateable elements.
- the top portion 12 a of the extruded member starts at a shoulder and then extends to a fin, in which the left and right side profiles of the shoulder are interconnected forming a curve between each fin in the assembly as shown in FIG. 4 .
- Portions of the first face 12 d of each extruded member are coated with or dipped into a thermally conductive compound 32 in order to partially cover certain ridges, in this case the grooved ridges, prior to a press-fit operation in which a transverse compressive force F′ is applied evenly to each side of a grouping of adjacently arranged members 12 in order to first (1) force the ridges and troughs of the members together into an interlocking arrangement, and (2) further compressively deform the bulbous portions and troughs producing an interference fit.
- the grooves 28 a, 28 b which are axial to the applied compressive force are pressed together and deform, forcing additional compound 32 into the interstices between the mateably engaged members.
- Section 3′ of the assembly shown in FIG. 4 depicts a region of an extruded member where a ridge and trough mateably connected.
- FIGS. 5-8 illustrate the region shown in 3′ during the successive stages of the press-fitting operation which are in order, (i) the relative positions of a head portion 20 of an upper positioned member 12 possessing a groove bib opposite the groove bra of a trough portion 26 of a lower positioned member 12 positioned adjacent on another prior to a press fit operation, and (ii) the head portion 20 of the upper member now partially coated via a dipping process with a thermally conductive compound such as a thermal epoxy, which fills longitudinal groove 28 b, and (iii) the mating engagement between a ridge and trough in which the head portion 20 of the upper member has been forced past the adjacent knob portions 24 of a pair of non-grooved ridges and into a trough 26 of the lower member where further compression leads to expanding deformation forcing the thermal compound 32 out of
- the interconnected extruded members possess the same profile with some ridges and troughs having grooves which are alternating and interconnected in mirrored opposition forming reservoirs 29 which (after coating and prior to press-fitting) contain excess thermal compound resulting in superior flow of thermal compound to adjacent interstices, it is intended that a number of grooved regions which produce reservoirs when mated with non-grooved regions of an extruded member still fall within the scope of the invention. Although one non-limiting example of the latter is depicted in FIG.
- a non-grooved ridge can be mated with a grooved trough to produce a reservoir.
- the ridge portions having the grooves that form the reservoirs may be separated by relatively wider troughs than those shown in the figures, or relatively narrower troughs as the case may be, and that the bulbous portions may vary in size, distances apart, and possess more than, or less than two knobs on each head portion.
Abstract
A system for producing heat-sink assemblies in which a series of extruded members possess mating faces, each face having an alternating series of troughs and bulbous shaped ridges which are formed from the sides of the troughs. Mating ridges of one face of each extruded member are dipped with a thermally conductive compound prior to press-fitting and at least some of the ridges and troughs possess a groove that when mated to an opposing region of an adjacent extruded member, produces a reservoir that serves as a feeder source for thermally conductive compound. Once the extruded members are press-fitted, portions of the bulbous-shaped ridges on one face are forced past portions of the bulbous-shaped ridges of the opposing face and into the troughs. Deformation of the bulbous-shaped ridges is uniformly expansive so as to reduce shearing relative to the surfaces of the troughs, and the formed reservoirs are further compressed and feed thermal compound into the interstices between mating members.
Description
- This Application is a Divisional of U.S. Non-Provisional application Ser. No. 12/807,963 Titled “System and Method of Producing Scalable Heat-sink Assembly” and filed Sep. 17, 2010.
- The present invention relates generally to heat-sinks, and more particularly to heat-sink assemblies constructed from press-fitted sub-units.
- A heat-sink is an object that transfers thermal energy from a higher temperature to a lower temperature fluid medium. Heat-sinks used for the cooling of electronic components are typically constructed from thermally conductive materials such as aluminum alloys and generally possess a base portion of relatively thicker material and a region having a plurality of fins or posts, designed to maximize the surface area of the heat-sink exposed to the air or other fluid medium having a temperature lower than that of the heat-sink. The base portion is in clone contact with a heat producing element such as a CPU or other heat producing electrical components, and the fins disperse the conducted heat to the surrounding fluid medium.
- Heat-sinks are conventionally manufactured by extruding, machining, pressure die-casting, or some combination of the foregoing processes.
- Size of finned heat-sinks varies greatly depending on the application and range; from types used for graphic card memory of typically a 1 cm2 base size, to units having contact areas of >1000 cm2. Because the variety of electrical components that require cooling is virtually endless and the pace of innovation so rapid, many heat-sinks are custom produced for the particular application which increases the cost to manufacture, and invariably raises the price to the consumer.
- At least one interlocking heat-sink assembly is known in the art which teaches a heat-sink formed of pre-cut and press-fitted strip elements to form an interlocking stack permitting the heat-sinks to readily scale. When press-fitting sub-units to form larger assemblies, the press-fitted sub-units are often subject to excessive shear forces causing unwanted deformation, deflection, structural failure and voids. Any gap between press-fitted elements necessarily reduces conduction across the heat-sink and impairs the heat-sink's ability to transfer heat to the fluid medium.
- Although a scalable press-fit heat-sink assembly performing substantially as well as one conventionally produced would be desirable for many reasons, e.g., reduced time to manufacture, the production of such an assembly has heretofore been problematic.
- The present invention is a system for assembling of a heat-sink and more particularly, a system in which the heat-sink assembly is constructed from individual extruded members which are press-fitted together to form various sized assemblies. Even more particularly, the extruded members have opposing faces that are partially coated with a thermally conductive compound, such as a thermal epoxy, prior to a press-fit operation. Each opposing face possesses an alternating series of troughs and ridges, with the ridges having a generally bulbous shape. At least some of the ridges and troughs possess a longitudinal groove or recess that performs as a feeder reservoir for the thermally conductive compound during the press-fitting. During a press-fitting, while the direction and progress of the plastic deformation of the mating portions vary over time, the bulbous shapes have the tendency to deform in a direction generally perpendicular to the inner surfaces of mating troughs resulting in reduced shearing between the mating surfaces. Reduced shearing prevents portions of the mating surfaces from scraping against each other during the progressive deformation which would otherwise result in the leading regions scraping the thermally conductive compound forward of the trailing regions, leading to voids. Transversely applied compressive force to the mated assembly produces a relatively uniform expansive deformation of the ridges into the troughs, with the distance between opposing sections of the troughs narrowing to meet the neck portion of the bulbous regions. The rounded profiles of the ridges and troughs reduce shear during press-fitting and evenly distributes the thermally conductive compound throughout the spaces between the individual sub-units. Absence of voids within the thermally conductive compound improves the overall thermal conductivity of the heat-sink assembly and means that application of thermal compound and press-fitting can be performed in one operation.
- In one aspect of the present invention, at least some of the bulbous shaped protrusions possess a groove that serves as a reservoir for the thermally conductive substance during press-fit operations.
- In another aspect of the present invention, in certain regions where a bulbous shape is mate-ably engaged with a trough, the reservoir of the bulbous shape faces a reservoir of a trough portion and together form a longitudinal aperture that serves to feed additional thermally conductive compound to surrounding mating surfaces during the press-fit operation.
- It would be desirable to provide a means for manufacturing a custom sized heat-sink from a number sub-units of uniform shape.
- It would be desirable to provide a press-fit assembly constructed of extruded members with a layer of thermally conductive compound between the individual members.
- It would be desirable to reduce the time it takes to produce a custom sized heat-sink.
- It would be especially desirable to provide a geometry for the heat-sink assembly producing under compression, a uniform distribution of a thermally conductive compound in the interstices of the assembly.
- The description as follows is not intended to limit the scope of the invention to the particular forms set forth, but on the contrary, it is intended to cover such alternatives, modifications, combinations and equivalents as may be included within the spirit and scope of the invention as set forth in the detailed description.
-
FIG. 1 is a partial perspective view according to one embodiment of the present invention primarily depicting oneface 12 e of an extruded member; -
FIG. 2 is a plan view according to the present invention offace 12 e of an extruded member; -
FIG. 3 is cross-sectional view taken along lines 2-2. ofFIG. 2 depicting the respective profiles offaces -
FIG. 4 is an end view according to one embodiment of the present invention depicting an assembly of multiple extruded members press-fitted together; -
FIG. 5 is a detail view according to one embodiment of the present invention depicting the relative positions of a ridge of a one extruded member and a trough of another extruded member adjacent one another prior to press-fit; -
FIG. 6 is a detail view according to one embodiment of the present invention depicting the relative positions of a two extruded members prior to press-fit, with the top member shown having a head portion partially coated with a thermally conductive compound; -
FIG. 7 is a detail view according to one embodiment of the present invention depicting a the progression of a head portion of a top extruded member, which has been forced past theknob portions 24 of the bottom extruded member into a trough in which the thermally conductive compound depicted inFIG. 6 is being progressively forced into the interstices; -
FIG. 8 is a detail view according to one embodiment of the present invention depicting a bulbous formation mated with a trough after press-fitting in which the (1) bulbous portions have been expandable deformed into the troughs, and (2) the thermally conductive has been forced into the surrounding interstices; -
FIG. 9 is a detail view according to another embodiment of the present invention depicting the relative positions of a ridge of a one extruded member and a trough of another extruded member adjacent one another prior to press-fit. - 12 extruded member
- 12 a top portion extruded member
- 12 b middle portion extruded member
- 12 c bottom portion extruded member
- 12 d first face of extruded member
- 12 e second face of extruded member
- 14 ridge
- 16 trough
- 18 bulbous formation
- 20 head portion
- 22 neck portion
- 24 knob
- 26 base of trough
- 28 a groove bib groove
- 29 reservoir
- 30 interstices
- 32 thermally conductive compound
- Referring generally to
FIGS. 1-9 ; a system for producing scalable heat-sink assemblies includes, at least twoextruded members 12, logically divided into atop portion 12 a extending to a fin, amiddle portion 12 b where the fin transitions to a shoulder, abottom portion 12 c having twofaces alternating ridges 14 andtroughs 16 in which the ridges have a generally bulbous 18 shape which is further logically subdivided into ahead portion 20 possessing twoknob 24 portions. According to one embodiment, at least someridges 14 possess a groove bra at the crown of thehead portion 20, while some troughs possess a groove bib in thebase 26 of the trough. - In the particular embodiment depicted there are typically two ridge profiles, one type, found on a
first side 12 d of theextruded member 12, has a groove, while the other ridge located along asecond side 12 e of the extruded member lacks the groove. Likewise, there are typically two trough profiles, one type lacking a groove, found on thefirst side 12 d, and another type located along thesecond side 12 e having agroove 28 b. After press-fit-ting together, the first and second sides of the extruded profiles interconnect with one another via thehead portions 20 of the grooved ridges alongface 12 d mate-ably engaged with theneck portions 22 of the non-grooved ridges alongface 12 e, and the head portions of the non-grooved ridges alongface 12 e mate-ably engaged with the neck portions of the gloved ridges along 12 d. The grooves bra of the ridges and the grooves bib of the troughs face one another and together formsinuses 29 defining a reservoir, which is produced by the two relatively shallow arcuate surfaces in mirrored opposition. -
FIG. 3 is a cross-sectional view taken alonglines 2′-2′ ofFIG. 2 and depicts the profiles of the various mateable elements. Thetop portion 12 a of the extruded member starts at a shoulder and then extends to a fin, in which the left and right side profiles of the shoulder are interconnected forming a curve between each fin in the assembly as shown inFIG. 4 . Portions of thefirst face 12 d of each extruded member are coated with or dipped into a thermallyconductive compound 32 in order to partially cover certain ridges, in this case the grooved ridges, prior to a press-fit operation in which a transverse compressive force F′ is applied evenly to each side of a grouping of adjacently arrangedmembers 12 in order to first (1) force the ridges and troughs of the members together into an interlocking arrangement, and (2) further compressively deform the bulbous portions and troughs producing an interference fit. During the press-fitting, thegrooves additional compound 32 into the interstices between the mateably engaged members. As the deformation of the bulbous portions is expansive, i.e., having little shearing between the ridges and troughs, void formation within the thermal compound at the junctions between the ridges and troughs is prevented by an uninterrupted flow of compound from thegrooves -
Section 3′ of the assembly shown inFIG. 4 depicts a region of an extruded member where a ridge and trough mateably connected. For conciseness and clarity,FIGS. 5-8 illustrate the region shown in 3′ during the successive stages of the press-fitting operation which are in order, (i) the relative positions of ahead portion 20 of an upper positionedmember 12 possessing a groove bib opposite the groove bra of atrough portion 26 of a lower positionedmember 12 positioned adjacent on another prior to a press fit operation, and (ii) thehead portion 20 of the upper member now partially coated via a dipping process with a thermally conductive compound such as a thermal epoxy, which fillslongitudinal groove 28 b, and (iii) the mating engagement between a ridge and trough in which thehead portion 20 of the upper member has been forced past theadjacent knob portions 24 of a pair of non-grooved ridges and into atrough 26 of the lower member where further compression leads to expanding deformation forcing thethermal compound 32 out of thereservoir 29 formed by the facinggrooves FIG. 8 , we see the sinus-shapedreservoir 29 formed by the facinggrooves 28 a, bib has diminished in volume, having released most of its contents to the adjacent interstices during the press-fitting. - While preferably the interconnected extruded members possess the same profile with some ridges and troughs having grooves which are alternating and interconnected in mirrored
opposition forming reservoirs 29 which (after coating and prior to press-fitting) contain excess thermal compound resulting in superior flow of thermal compound to adjacent interstices, it is intended that a number of grooved regions which produce reservoirs when mated with non-grooved regions of an extruded member still fall within the scope of the invention. Although one non-limiting example of the latter is depicted inFIG. 9 which depicts a bottom extruded member with a non-grooved trough prior to mating with a top extruded member with a grooved ridge, a non-grooved ridge can be mated with a grooved trough to produce a reservoir. belatedly, it is conceivable that the ridge portions having the grooves that form the reservoirs may be separated by relatively wider troughs than those shown in the figures, or relatively narrower troughs as the case may be, and that the bulbous portions may vary in size, distances apart, and possess more than, or less than two knobs on each head portion. Accordingly, while the invention has been described by the embodiments given, it is not intended to limit the scope of the invention to the particular form set forth, but on the contrary, it is intended to cover such alternatives, modifications, and equivalents as may be included within the spirit and scope of the invention as defined by the appended claims.
Claims (4)
1. A heat-sink assembly comprising:
(1) at least two extruded members, each extruded member having length, width, a top portion, a middle portion, a bottom portion, a first face and a second face, with the top portion extending to a fin, and the first and second faces having an alternating pattern of longitudinal ridges and troughs; and,
(2) a generally bulbous formation formed from each ridge, the bulbous formation possessing a head portion, and a neck portion that transitions to an adjacent trough; and, wherein the first face of one extruded member is mateably engageable with the second face of another extruded member, with the spaces between adjacent extrusions defining interstices; and, at least some of the head portions and it least some of the troughs of an extruded member possessing a groove that when engaged with an adjacent extruded member produces a reservoir for the feeding of a thermally conductive compound into the interstices during a press-fitting operation producing a multi-part heat sink assembly.
2. The heat-sink assembly according to claim 1 in which at least a portion of the ridges includes a coating of thermally conductive compound prior to mateable engagement.
3. A heat-sink assembly comprising:
(1) at least two extruded members, each extruded member having length, width, a top portion, a middle portion, a bottom portion, a first face and a second face, with the top portion extending to a fin, and the first and second faces having an alternating pattern of longitudinal ridges and troughs; and,
(2) a generally bulbous formation at each ridge terminus, the bulbous formation possessing a neck portion that transitions to an adjacent trough; and, wherein the first face of one extruded member is mateably engageable with the second face of another extruded member, and when thus engaged, the spaces between adjacent extrusions defining interstices; and, at least some of the bulbous formations and it least some of the troughs of an extruded member possessing a groove that when engaged with an adjacent extruded member produces a reservoir for the feeding of a thermally conductive compound into the interstices during a press-fitting operation, thus producing a multi-part heat sink assembly.
4. The heat-sink assembly according to claim 3 wherein either a first or second face further comprises a coating of thermally conductive compound.
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US14/606,115 US20150136375A1 (en) | 2010-09-17 | 2015-01-27 | System and Method of Producing Scalable Heat-sink Assembly |
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US12/807,963 US8966758B1 (en) | 2010-09-17 | 2010-09-17 | System and method of producing scalable heat-sink assembly |
US14/606,115 US20150136375A1 (en) | 2010-09-17 | 2015-01-27 | System and Method of Producing Scalable Heat-sink Assembly |
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US14/606,115 Abandoned US20150136375A1 (en) | 2010-09-17 | 2015-01-27 | System and Method of Producing Scalable Heat-sink Assembly |
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Cited By (1)
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US20140022728A1 (en) * | 2010-07-16 | 2014-01-23 | Rockwell Automation Technologies, Inc. | Heat sink for power circuits |
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US9431271B2 (en) * | 2011-12-18 | 2016-08-30 | Cooler Master Development Corporation | Heat dissipating device |
WO2013102301A1 (en) * | 2012-01-05 | 2013-07-11 | Sapa Ab | Heat sink and method for manufacturing |
US10030916B2 (en) * | 2014-07-29 | 2018-07-24 | Intel Corporation | Fluid flow channel for enhanced heat transfer efficiency |
CN214412924U (en) * | 2020-11-20 | 2021-10-15 | 京东方科技集团股份有限公司 | Network adapter and terminal equipment |
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US20140022728A1 (en) * | 2010-07-16 | 2014-01-23 | Rockwell Automation Technologies, Inc. | Heat sink for power circuits |
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US8966758B1 (en) | 2015-03-03 |
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