US20150050105A1 - Vapor dryer module with reduced particle generation - Google Patents
Vapor dryer module with reduced particle generation Download PDFInfo
- Publication number
- US20150050105A1 US20150050105A1 US13/882,135 US201213882135A US2015050105A1 US 20150050105 A1 US20150050105 A1 US 20150050105A1 US 201213882135 A US201213882135 A US 201213882135A US 2015050105 A1 US2015050105 A1 US 2015050105A1
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- substrate
- support structure
- module
- actuator
- tank
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/001—Handling, e.g. loading or unloading arrangements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/06—Chambers, containers, or receptacles
- F26B25/14—Chambers, containers, receptacles of simple construction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
Abstract
Embodiments described herein generally relate to a vapor dryer module for cleaning substrates during a chemical mechanical polishing (CMP) process. In one embodiment, a module for processing a substrate is provided. The module includes a tank having sidewalls with an outer surface and an inner surface defining a processing volume, a substrate support structure for transferring a substrate within the processing volume, the substrate support structure having a first portion that is at least partially disposed in the processing volume and a second portion that is outside of the processing volume, and one or more actuators disposed on an outer surface of one of the sidewalls of the tank and coupled between the outer surface and the second portion of the support structure, the one or more actuators operable to move the support structure relative to the tank.
Description
- 1. Field
- Embodiments of the invention generally relate to a vapor dryer module for cleaning substrates.
- 2. Description of the Related Art
- In the manufacture of electronic devices on substrates, such as semiconductor devices, chemical mechanical polishing (CMP) is commonly utilized. The final cleaning step after polishing includes subjecting the substrate to an aqueous cleaning process in a vapor dryer module to remove residual particles from polishing and/or scrubbing, as well as eliminate fluid marks (i.e., watermarks, streaking and/or bath residue) from the substrate. As semiconductor device geometries continue to decrease, the importance of ultra clean processing increases. Aqueous cleaning of the substrate within a vapor dryer module containing fluid (or a bath) followed by a rinse achieves desirable cleaning levels. However, moving the substrate into and out of the vapor dryer module, as well as supporting the substrate within the vapor dryer module, requires transfer mechanisms inside the tank. The transfer mechanisms are typically mechanical devices that are prone to generating particles. As the final cleaning process is designed to remove particles from previous processes, it is desirable to minimize the generation of particles and/or control the propagation of residual particles during the final cleaning process.
- What is needed is a vapor dryer module that minimizes and/or eliminates particle generation therein, and controls particles that may be transferred to the vapor dryer module from the substrate.
- Embodiments described herein generally relate to a vapor dryer module for cleaning substrates during a chemical mechanical polishing (CMP) process. In one embodiment, a module for processing a substrate is provided. The module includes a tank having sidewalls with an outer surface and an inner surface defining a processing volume, a substrate support structure for transferring a substrate within the processing volume, the substrate support structure having a first portion that is at least partially disposed in the processing volume and a second portion that is outside of the processing volume, and one or more actuators disposed on an outer surface of one of the sidewalls of the tank and coupled between the outer surface and the second portion of the support structure, the one or more actuators operable to move the support structure relative to the tank.
- In another embodiment, a module for processing a substrate is provided. The module includes a tank having sidewalls defining a processing volume, a substrate support structure for transferring a substrate within the processing volume, the substrate support structure having a first portion that is at least partially disposed in the processing volume and a second portion that is outside of the processing volume, a first actuator for moving the substrate support structure vertically relative to the tank, and a second actuator for moving the substrate support structure rotationally relative to the tank, wherein each of the first actuator and second actuator are disposed outside of the processing volume.
- In another embodiment, a method for processing a substrate is provided. The method includes transferring a substrate into a first portion of a processing volume contained in a tank, securing the substrate in a substrate support structure at least partially disposed in the processing volume, wherein the substrate support structure is positioned in a first position having the substrate at a first orientation, tilting the substrate support structure to move the substrate to a second orientation utilizing a first actuator disposed outside of the processing volume, and lifting the substrate support structure to a second position that is vertically displaced from the first position using a second actuator that is disposed outside of the processing volume.
- So that the manner in which the above-recited features of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments.
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FIG. 1 is an isometric view of a vapor dryer module according to embodiments described herein. -
FIG. 2 is an isometric view of the vapor dryer module ofFIG. 1 . -
FIG. 3 is an isometric top view of a portion of the vapor dryer module ofFIG. 2 . -
FIG. 4 is an isometric cross-sectional view of the tank housing showing one embodiment of the support structure that may be utilized in the vapor dryer module ofFIG. 1 . -
FIGS. 5A-5E are side cross-sectional views of the vapor dryer module showing embodiments of a cleaning cycle that may be performed in the vapor dryer module ofFIG. 1 . - To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.
- Embodiments described herein generally relate to a vapor dryer module for cleaning substrates during a chemical mechanical polishing (CMP) process. The vapor dryer module may be utilized to clean the substrate after polishing and a scrubbing process. The vapor dryer module includes a tank with minimal moving parts within the tank to minimize generation of particles during a cleaning process performed therein. Further, the vapor dryer module includes means for managing particles that may be present on an incoming substrate to prevent the particles from reattaching to the substrate. The vapor dryer module as provided herein may be utilized with a CMP cleaning system, such as a DESICA® cleaning system, available from Applied Materials, Inc. of Santa Clara, Calif., as well as cleaning systems from other manufacturers.
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FIG. 1 is an isometric view of avapor dryer module 100 according to embodiments described herein. Thevapor dryer module 100 comprises atank housing 105 configured as a tank that contains fluid in aprocessing volume 110. Theprocessing volume 110 is bifurcated by abaffle plate 115 into an incoming (loading)portion 120A and an outgoing (unloading)portion 120B. Theincoming portion 120A and theoutgoing portion 120B are horizontally displaced in at least the Y direction. Thevapor dryer module 100 also includes asupport structure 130 that is at least partially disposed within theprocessing volume 110. Thesupport structure 130 includes a first portion, which includes twoarms substrate 125 within thetank volume 110. Thesupport structure 130 also includes a second portion, which includes twoarms arms 135A, 1358, respectively. Details of the structure and support function of thearms - The
support structure 130 is coupled to one or more actuators adapted to position thesupport structure 130 rotationally and or linearly relative to thetank housing 105. For example, thesupport structure 130 is coupled to afirst actuator 145A and asecond actuator 145B disposed on anouter sidewall 150 of thetank housing 105. In one embodiment, thefirst actuator 145A engages alinear slide 155 disposed outside of thetank housing 105 that moves thesupport structure 130 linearly (Z direction) relative to thetank housing 105. Thesecond actuator 145B may be coupled to across-member 160 positioned between thearms second actuator 145B is utilized to rotate or tilt thesupport structure 130 relative to thetank housing 105, such as along the X axis. Thefirst actuator 145A and thesecond actuator 145B may be powered pneumatically, hydraulically, electrically, or combinations thereof. Thesecond actuator 145B may selectively engage with thelinear slide 155 and rotational force is imparted between thelinear slide 155 and thecross-member 160 to cause thesupport structure 130 to rotate relative to thetank housing 105. In one embodiment, thesecond actuator 145B rotates thesupport structure 130 through an angle α, which may be about 0 degrees to about 12 degrees from normal, for example about 9 degrees from normal. - The
vapor dryer module 100 also includes agripping device 165 adjacent an opening of theoutgoing portion 120B of theprocessing volume 110. Thegripping device 165 includes twoarms arms grippers 172 that engage an edge of thesubstrate 125. Eacharm actuator 174A that moves one or both of thearms substrate 125. Thegripping device 165 also includes arotation mechanism 173 that includes asupport bar 175 and anactuator 176. Theactuator 176 rotates thesupport bar 175 and thegripping device 165 about 0 degrees from normal to about 90 degrees from normal. Thegripping device 165 also includes alinear actuator 174B that may operate to move thegripping device 165 and theactuator 174A along the length of thesupport bar 175 in order to position thegripping device 165 in the X-Z plane, the X-Y plane, or any direction therebetween, depending upon the angle of rotation of therotation mechanism 173. Therotation mechanism 173 may also be raised or lowered vertically by anactuator 177 that is disposed outside of theprocessing volume 110. Theactuator 177 is coupled between theouter sidewall 150 and theactuator 176 by asupport member 178. Theactuator 177 may raise or lower therotation mechanism 173 and thegripping device 165 to facilitate transfer of thesubstrate 125. Theactuator 177 may interface with alinear slide 179 coupled to theouter sidewall 150 of thetank housing 105. Theactuator 174A, theactuator 174B, theactuator 176 and theactuator 177 may be powered pneumatically, hydraulically, electrically, and combinations thereof. - In operation, the
substrate 125 is transferred into theincoming portion 120A by an end effector (not shown) and transferred from the end effector to a first position between the twoarms support structure 130 that are disposed in theprocessing volume 110. Thesubstrate 125 is held in this lowered position by thesupport structure 130 during processing in theprocessing volume 110. During processing, the support structure 130 (and the substrate 125) may move (i.e., tilt or rotate) from the first position to a second position by motive force from thesecond actuator 145B. After moving to the second position, thefirst actuator 145A may provide motive force to raise the support structure 130 (and substrate 125) to a third position where thesubstrate 125 may be transferred from thesupport structure 130 to thegripping device 165. Once thegripping device 165 engages thesubstrate 125, thesupport structure 130 may be lowered into the processing volume 110 (shown inFIG. 1 ) to receive another incoming substrate. -
FIG. 2 is an isometric view of thevapor dryer module 100 ofFIG. 1 showing thesubstrate 125 rotated in thegripping device 165 to a fourth position. The fourth position may be substantially horizontal (i.e., 90 degrees from normal) to facilitate transfer of thesubstrate 125 from thegripping device 165 to a robot blade (not shown).FIG. 2 also shows a substrate 200 (in phantom) in the third position similar to thesubstrate 125 shown inFIG. 1 with the exception of thesubstrate 200 being supported by thesupport structure 130. Thesubstrate 200 is in a position for transfer to thegripping device 165. Thesupport structure 130 is raised in this Figure to show the position of thesupport structure 130 for transfer of thesubstrate 125 to thegripping device 165. Once thesubstrate 125 is removed from thegripping device 165, thegripping device 165 may be rotated to a substantially vertical position. Thearms substrate 200. Movement of one or both of thegripping device 165 and thesupport structure 130 may be utilized to bring thegripping device 165 and thesubstrate 200 in proximity with each other. When thegripping device 165 and thesubstrate 200 are in proximity, thearms substrate 200 edge. Thegripping device 165 may then rotate thesubstrate 200 to the fourth position for transfer, and thesupport structure 130 may be lowered into theprocessing volume 110 to receive another substrate. -
FIG. 3 is an isometric top view of a portion of thevapor dryer module 100 ofFIG. 2 . In this view, thegrippers 172 of thegripping device 165 are shown engaging thesubstrate 200 edge. Also shown are theincoming portion 120A and theoutgoing portion 120B of theprocessing volume 110. Theincoming portion 120A and theoutgoing portion 120B are at least partially separated by thebaffle plate 115. In operation, theprocessing volume 110 would be filled with fluid to a level near adrain conduit 300. Thebaffle plate 115 extends at least partially below this fluid level and is utilized to isolate theincoming portion 120A from theoutgoing portion 120B. When a substrate is transferred into theincoming portion 120A, the substrate passes between a pair ofspray bars 305 to spray a fluid such as deionized water onto the incoming substrate. As the incoming substrate may include residual particles, the particles become dislodged and typically float on the surface of the fluid. Thebaffle plate 115 keeps the floating particles from entering theoutgoing portion 120B. Thebaffle plate 115 also minimizes splashing or wave movement from entering into theoutgoing portion 120B. This allows theoutgoing portion 120B to remain relatively particle free and provides a constant water level in theoutgoing portion 120B. As the substrate exits theprocessing volume 110 through theoutgoing portion 120B, the substrate passes betweenspray bars 310 which spray a fluid such as isopropyl alcohol (IPA) onto the outgoing substrate. The constant water level in theoutgoing portion 120B may assist in drying of the substrate and prevention of watermark defects on the substrate. Additionally, a cover (partially shown inFIG. 1 ) having openings for theincoming portion 120A and theoutgoing portion 120B may be utilized to cover the remainder of theprocessing volume 110. The cover may be in two pieces that will provide easy disassembly and access to the spray bars 305 and 310. -
FIG. 4 is an isometric cross-sectional view of thetank housing 105 showing one embodiment of thesupport structure 130 that may be utilized in thevapor dryer module 100 ofFIG. 1 . Thesupport structure 130 includesarms arms arms cradle 400. Thecradle 400 includes one or more raisedstructures 405 that each include a channel formed therein to receive thesubstrate 200 edge. The channels are configured to hold the substrate in a substantially vertical orientation without clamping the substrate.Drainage channels 410 may be formed between thestructures 405 to assist in draining fluid. Thearms arms arms arms -
FIGS. 5A-5E are side cross-sectional views of thevapor dryer module 100 showing embodiments of a cleaning cycle that may be performed in thevapor dryer module 100 ofFIG. 1 .FIG. 5A shows asubstrate 125 submerged in theprocessing volume 110 below afluid level 500. Thesubstrate 125 may be transferred into thevapor dryer module 100 by an end effector (not shown) that lowers thesubstrate 125 at least partially into theprocessing volume 110 and transfers thesubstrate 125 to thesupport structure 130. In one embodiment, thesubstrate 125 enters theprocessing volume 110 between the spray bars 305 and is supported by the end effector prior to transfer from the end effector to thecradle 400 of thesupport structure 130. In another embodiment, thesupport structure 130 may be raised and thesubstrate 125 may be transferred to thecradle 400 so the end effector does not enter theprocessing volume 110. Thesupport structure 130 then lowers thesubstrate 125 into between the spray bars 305 and into theprocessing volume 110. Regardless of the transfer method, thesubstrate 125 is placed into and supported by thecradle 400 in the submerged position. Thesubstrate 125 is in a first position and orientation in theprocessing volume 110. Thesubstrate 125 in this position may be oriented parallel to afirst sidewall 505A of thetank housing 105. -
FIG. 5B shows thesubstrate 125 rotated into a second position and orientation. Rotation is provided by theactuator 145B coupled to thesupport structure 130. In one embodiment, the angle of rotation is about 6 degrees to about 12 degrees from the first position (i.e. substantially normal), such as about 9 degrees from the first position. Thesubstrate 125 in this position may be oriented parallel to asecond sidewall 505B of thetank housing 105. -
FIG. 5C shows the substrate raised to a third position, which may be a transfer position for transferring thesubstrate 125 to thegripping device 165. Actuation of theactuator 145A raises thesupport structure 130, which raises thesubstrate 125 to this position. Thesubstrate 125 may be raised to the third position in the second orientation. Thearms gripping device 165 may be spaced apart to allow thesubstrate 125 to at least partially pass thegrippers 172 on thearms substrate 125 may be raised to a position between thegrippers 172. Once thesubstrate 125 is between opposinggrippers 172, thearms gripping device 165 may be moved together to grip thesubstrate 125 as shown inFIG. 5D . -
FIG. 5D shows thesubstrate 125 transferred to thegripping device 165. Thesubstrate 125 may be raised from thetank housing 105 to a distal end of thesupport bar 175 by theactuator 174B, as shown. It is to be noted that raising lowering and pivoting of thesupport structure 130 is independent of any movement of thesupport structure 130, and vice versa. As such, after transfer of thesubstrate 125, thesupport structure 130 may be moved linearly and/or rotated to prepare for transfer of an incoming substrate. -
FIG. 5E shows thesubstrate 125 in thegripping device 165 that is rotated for transfer to a robot blade (not shown).FIG. 5E also shows thesupport structure 130 in the first position having asubstrate 200 thereon for beginning the processing sequence. Thesubstrate 125 is in a fourth position and a third orientation. The orientation of thesubstrate 125 is substantially horizontal. The third orientation may be substantially orthogonal to thesubstrate 200 in the first position. - It is to be noted, the
support structure 130 nor the substrate 125 (or 200) does not contact any portion of thetank housing 105 during the sequence shown inFIGS. 5A-5E , which markedly reduces particle generation. - The
vapor dryer module 100 as described herein provides improved processing by providing substrate transfer mechanisms outside of the processing volume of the tank. Benefits include improved particle management by minimizing particle generation, reduced vibration, increased reliability and servicing. The independent movement of thegripping device 165 and thesupport structure 130 also improves throughput. - While the foregoing is directed to embodiments of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.
Claims (15)
1. A module for processing a substrate, comprising
a tank having sidewalls with an outer surface and an inner surface defining a processing volume;
a substrate support structure for transferring a substrate within the processing volume, the substrate support structure having a first portion that is at least partially disposed in the processing volume and a second portion that is outside of the processing volume; and
one or more actuators disposed on an outer surface of one of the sidewalls of the tank and coupled between the outer surface and the second portion of the support structure, the one or more actuators operable to move the support structure relative to the tank.
2. The module of claim 1 , further comprising a linear slide mechanism disposed on the outer surface of one of the sidewalls of the tank and coupled to one of the one or more actuators.
3. The module of claim 2 , wherein the one or more actuators comprise a first actuator to move the substrate support structure rotationally relative to the tank.
4. The module of claim 3 , wherein the one or more actuators comprise a second actuator to move the substrate support structure vertically relative to the tank.
5. The module of claim 1 , wherein the first portion of the support structure comprises two arms that terminate at a support cradle for holding the substrate.
6. The module of claim 5 , wherein the first portion of the substrate support structure comprises a first material and the second portion of the substrate support structure comprises a second material, the first material being different from the second material.
7. The module of claim 6 , wherein the first material comprises a polymeric material.
8. The module of claim 1 , wherein the processing volume is at least partially separated by a baffle plate.
9. A module for processing a substrate, comprising
a tank having sidewalls defining a processing volume;
a substrate support structure for transferring a substrate within the processing volume, the substrate support structure having a first portion that is at least partially disposed in the processing volume and a second portion that is outside of the processing volume;
a first actuator for moving the substrate support structure vertically relative to the tank; and
a second actuator for moving the substrate support structure rotationally relative to the tank, wherein each of the first actuator and second actuator are disposed outside of the processing volume.
10. The module of claim 9 , wherein the first portion of the support structure comprises two arms that terminate at a support cradle for holding the substrate.
11. The module of claim 10 , wherein the one of the first actuator or the second actuator maintains the two arms in a spaced apart relation to in inner surface of the sidewalls of the tank.
12. The module of claim 9 , further comprising a linear slide mechanism disposed on an outer surface of one of the sidewalls of the tank and coupled to one or both of the first actuator and the second actuator.
13. The module of claim 9 , wherein the first portion of the substrate support structure comprises a first material and the second portion of the substrate support structure comprises a second material, the first material being different from the second material.
14. The module of claim 6 , wherein the first material comprises a polymeric material and the second material comprises aluminum.
15. The module of claim 9 , further comprising a linear slide mechanism disposed on the outer surface of one of the sidewalls of the tank and coupled to the first actuator.
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US13/882,135 US20150050105A1 (en) | 2012-04-26 | 2012-07-25 | Vapor dryer module with reduced particle generation |
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US201261638936P | 2012-04-26 | 2012-04-26 | |
US13/882,135 US20150050105A1 (en) | 2012-04-26 | 2012-07-25 | Vapor dryer module with reduced particle generation |
PCT/US2012/048183 WO2013162638A1 (en) | 2012-04-26 | 2012-07-25 | Vapor dryer module with reduced particle generation |
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TW201344836A (en) * | 2012-04-26 | 2013-11-01 | Applied Materials Inc | Vapor dryer module with reduced particle generation |
CN115218627A (en) * | 2022-06-22 | 2022-10-21 | 江苏亚电科技有限公司 | Wafer drying equipment swing mechanism |
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2012
- 2012-07-25 TW TW101126818A patent/TW201344836A/en unknown
- 2012-07-25 US US13/882,135 patent/US20150050105A1/en not_active Abandoned
- 2012-07-25 WO PCT/US2012/048183 patent/WO2013162638A1/en active Application Filing
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Also Published As
Publication number | Publication date |
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TW201344836A (en) | 2013-11-01 |
WO2013162638A1 (en) | 2013-10-31 |
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