US20140125315A1 - Determining high frequency operating parameters in a plasma system - Google Patents
Determining high frequency operating parameters in a plasma system Download PDFInfo
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- US20140125315A1 US20140125315A1 US14/154,400 US201414154400A US2014125315A1 US 20140125315 A1 US20140125315 A1 US 20140125315A1 US 201414154400 A US201414154400 A US 201414154400A US 2014125315 A1 US2014125315 A1 US 2014125315A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32018—Glow discharge
- H01J37/32045—Circuits specially adapted for controlling the glow discharge
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R21/00—Arrangements for measuring electric power or power factor
- G01R21/06—Arrangements for measuring electric power or power factor by measuring current and voltage
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R23/00—Arrangements for measuring frequencies; Arrangements for analysing frequency spectra
- G01R23/02—Arrangements for measuring frequency, e.g. pulse repetition rate; Arrangements for measuring period of current or voltage
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
- H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
- H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M7/53—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M7/537—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
- H02M7/5383—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a self-oscillating arrangement
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/38—Impedance-matching networks
- H03H7/40—Automatic matching of load impedance to source impedance
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B41/00—Circuit arrangements or apparatus for igniting or operating discharge lamps
- H05B41/14—Circuit arrangements
- H05B41/26—Circuit arrangements in which the lamp is fed by power derived from dc by means of a converter, e.g. by high-voltage dc
- H05B41/28—Circuit arrangements in which the lamp is fed by power derived from dc by means of a converter, e.g. by high-voltage dc using static converters
- H05B41/2806—Circuit arrangements in which the lamp is fed by power derived from dc by means of a converter, e.g. by high-voltage dc using static converters with semiconductor devices and specially adapted for lamps without electrodes in the vessel, e.g. surface discharge lamps, electrodeless discharge lamps
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
Abstract
Determining a high frequency operating parameter in a plasma system including a plasma power supply device coupled to a plasma load using a hybrid coupler having four ports is accomplished by: generating two high frequency source signals of identical frequency, the signals phase shifted by 90° with respect to one another; generating a high frequency output signal by combining the high frequency source signals in the hybrid coupler; transmitting the high frequency output signal to the plasma load; detecting two or more signals, each signal corresponding to a respective port of the hybrid coupler and related to an amplitude of a high frequency signal present at the respective port; and based on an evaluation of the two or more signals, determining the high frequency operating parameter.
Description
- This application is a continuation of U.S. Ser. No. 12/692,246, filed Jan. 22, 2010, which is a continuation of PCT International Application No. PCT/EP2008/005241, filed Jun. 27, 2008, incorporated herein by reference, which claims priority under 35 U.S.C. §119(e) to U.S. Pat. No. 60/951,392, filed on Jul. 23, 2007, hereby incorporated by reference in its entirety.
- This disclosure relates to determining high frequency operating parameters, which arise between a plasma load and a plasma power supply device.
- A plasma is a special aggregate state, which is produced from a gas. Each gas essentially comprises atoms and/or molecules. In the case of a plasma, this gas is for the most part ionized. This means that, by supplying energy, the atoms or molecules are split into positive and negative charge carriers (i.e., ions and electrons). A plasma is suitable for the processing of workpieces since the electrically charged particles are chemically extremely reactive and can also be influenced by electrical fields. The charged particles can be accelerated by means of an electrical field onto a workpiece, where, on impact, they are able to extract individual atoms from the workpiece. The separated atoms can be removed via a gas flow (etching), or deposited as a coating on other workpieces (thin-film production). Such processing by means of a plasma is used above all when extremely thin layers, in particular in the region of a few atom layers, are to be processed. Typical applications are semiconductor technology (coating, etching etc.), flat screens (similar to semiconductor technology), solar cells (similar to semiconductor technology), architectural glass coating (thermal protection, glare protection, etc.), memory media (CDs, DVDs, hard drives), decorative layers (colored glasses etc.) and tool hardening. These applications make great demands on accuracy and process stability. Furthermore, a plasma can also be used to excite lasers, in particular gas lasers.
- To generate a plasma from a gas, energy has to be supplied to the gas. This can be effected in different ways, for example, via light, heat, or electrical energy. A plasma for the processing of workpieces is typically ignited and maintained in a plasma chamber.
- To that end, normally a noble gas, e.g. argon, is introduced into the plasma chamber at low pressure. Via electrodes and/or antennas, the gas is exposed to an electrical field. A plasma is generated and is ignited when several conditions are satisfied. First of all, a small number of free charge carriers must be present, in which case, free electrons, which are typically present to a very small extent, are used. The free charge carriers are so forcefully accelerated by the electrical field that as they collide with atoms or molecules of the noble gas they release additional electrons, thereby producing positively charged ions and further negatively charged electrons. The additional free charge carriers are in turn accelerated and, as they collide, generate more ions and electrons. An avalanche effect commences. The discharges produced as these particles collide with the wall of the plasma chamber or other objects and the natural recombination counteract the continuous generation of ions and electrons (i.e., electrons are attracted by ions and recombine to form electrically neutral atoms or molecules). For that reason, an ignited plasma must be constantly supplied with energy in order for it to be maintained.
- The supply of energy can be effected via a direct current supply device or an alternating current supply device. The following remarks relate to high frequency (HF) alternating current supply devices with an output frequency >3 MHz.
- Plasmas have a very dynamic impedance which makes it difficult to supply uniform HF power. For instance, during the ignition process, the impedance changes very quickly from a high value to a low value. As a result, negative effective resistances can occur during operation, which reduce the current flow as the voltage rises, and undesirable local discharges (arcs) may occur, which may damage the material to be processed, the plasma chamber, or the electrodes.
- Power supply devices for plasmas (plasma supply devices) must therefore be designed for a high output power and a high reflected power. EP 1 701 376 A1 has shown that such plasma supply devices can advantageously be achieved by relatively small high frequency amplifiers, the output powers of which are coupled by a coupler, preferably by a 3-dB coupler (e.g., hybrid coupler, Lange coupler, etc.). For that purpose, the two high frequency amplifiers are connected to two ports of the hybrid coupler, hereafter called
port 1 andport 2. The high frequency amplifiers are driven in such a way that their high frequency signals of the same fundamental frequency have a phase shift of 90° with respect to one another. At a third port of the hybrid coupler, the first of the two high frequency signals is present lagging by 45°, and the second of the two high frequency signals is present leading by 45°. At a fourth port of the hybrid coupler, the first of the two high frequency signals is present leading by 45° and the second lagging by 45°. By the phase-shifted driving of the high frequency sources, the high frequency source signals thereof add up at the third port by constructive superposition, whereas at the fourth port they cancel each other out (destructive superposition). The high frequency sources upstream of the coupler, thus, each require only half the power of the required high frequency output signal. A cascading of such coupler stages is possible to enable the use of high frequency sources with even less source power or to achieve an even higher power of the high frequency output signal. - The fourth port of the hybrid coupler is normally terminated with a terminating resistance of the system impedance (often 50Ω). As described in
EP 1 701 376 A1, a high frequency signal is expected at this port only when a high frequency signal reflected by the plasma load is in turn reflected at the high frequency sources. - In the case of mismatching due to different impedances of plasma supply device and plasma load, the power delivered by the plasma supply device is partially or fully reflected. An impedance matching circuit (matchbox) can transform the impedance of the plasma load in certain ranges and match it to the output impedance of the plasma supply device. If the transformation range of the matching circuit is exceeded, or if regulation of the impedance matching circuit cannot follow a rapid impedance change of the plasma, then the total power delivered by the plasma supply device is not absorbed in the plasma, but rather reflection occurs again.
- A particular problem in connection with the described unavoidable reflections of the plasma load is the poor absorption in the system as a whole. Since all components of the plasma supply device and the matching circuit are designed for lowest possible loss in the interests of high efficiency, a high frequency signal reflected by the plasma load travels via an optionally present matching circuit back to
port 3 of the hybrid coupler, is here split into two parts and returned viaports port 3 toport 1 and an identical phase advance by 45° en route fromport 3 toport 2, respectively. - The two high frequency sources can be, for example, two self-contained high frequency generators driven by a common control oscillator. This control oscillator can have a phase shift of 90° for the high frequency signals at its two outputs. The two high frequency sources can alternatively be amplifier stages driven by a common high frequency driver transmitter, the output signal of which is split, for example, by way of a second hybrid coupler. Moreover, the two high frequency sources can also be two ports of a second hybrid coupler having a third port connected to a high frequency generator.
- To be able to (i) measure accurately and adjust the high frequency power delivered to the plasma load, even during reflection, (ii) have the opportunity to detect incipient arcs and by suitable measures if possible to prevent them from developing fully, and (iii) supply the optionally present matching circuit with the required information about the impedance of the plasma, is it desirable to know all relevant high frequency operating parameters that arise between high frequency generator and plasma load or matching circuit. These include, for example, the power Pf of the high frequency output signal delivered by the plasma supply device, and also the high frequency operating parameters influenced by the complex impedance of the plasma load and optionally the matching circuit, such as power Pr and phase angle φ of the reflected high frequency signal, and the variables dependent thereon, such as reflection factor,
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- or the total power of the high frequency output signal and reflected high frequency signal,
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P S =P f +P r =P f·(1+|Γ|2), - as well as the power of the high frequency signal reflected by the high frequency sources for a second time. In the knowledge of these high frequency operating parameters, the matching circuit can be driven, the power of the high frequency output signals can be adjusted, and the state of the plasma can be reliably determined.
- Directional couplers may be used to measure the powers of the high frequency output signal and the returning high frequency signal. A directional coupler necessitates an expensive component, which, even though accuracy should be high in the case of large proportions of reflected high frequency power, requires especially narrow manufacturing tolerances. In addition, to determine the phase, the two measured signals need to be combined before their detection. This can be effected, for example, by vector analysis with or without preceding down-mixing into a different frequency range or into the baseband or by mixing their standardized oscillations. Both methods are quite complex.
- U.S. Pat. No. 4,489,271 discloses an arrangement with which the phase angle of the reflected high frequency signal can be also determined. However, this arrangement requires five different couplers.
- Another possible method of measuring the output delivered to the load is to measure the current and the voltage. In that case, however, a very good measurement of the voltage and the current sensors must be achieved. Here too, to determine the phase angle φ and the reflection factor Γ, a phase comparison of the standardized high frequency measurement signals of current and voltage in a high frequency mixer is required, for example, or a vector analysis of these two measurement signals.
- In one aspect, a simple and reliable circuit is provided that determines the high frequency operating parameters in a plasma supply device containing a hybrid coupler and, in particular, determines the high frequency power delivered to the plasma load, the high frequency power reflected by the plasma load and the phase position thereof, without interrelating the high frequency signals. In this way, the circuit makes available values for the impedance matching circuit and for control and regulation of the plasma supply device, so that an immediate response can be made to changing conditions of the plasma load. relating
- In a second aspect, high frequency operating parameters that arise during supply of a plasma load by a plasma supply device generating two high frequency source signals of identical frequency phase shifted by 90° with respect to one another and coupled in a hybrid coupler to a high frequency output signal that is transmitted to the plasma load are determined by detecting at least two of the four ports of the hybrid coupler a respective signal that is related to the amplitude of the high frequency signal present at the port, and from that, generating at least one high frequency operating parameter.
- In a third aspect, a device is provided for determining high frequency operating parameters which arise between a plasma load and a plasma supply device, wherein the plasma supply device comprises two high frequency sources, the outputs of which are connected to a respective port of a hybrid coupler, and the plasma load is connected to the third port of the hybrid coupler, at which the high frequency source signals are constructively superimposed, wherein measurement circuits are connected to at least two ports of the hybrid coupler, to each measurement circuit there is connected a detector, which generates a measurement signal related to the amplitude of the high frequency signal at the relevant port of the hybrid coupler, and the detectors are connected to an evaluating device, which is designed to determine at least one high frequency operating parameter from the measurement signals.
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FIG. 1 illustrates a plasma supply device with a schematic illustration of the measurement signal detection. -
FIG. 2 illustrates a plasma supply device with measurement circuits and evaluating device. -
FIGS. 3 a and 3 b illustrate the local conditions of forward-running and backward-running waves. -
FIGS. 4 a, 4 b and 4 c illustrate the time conditions of forward-running and backward-running waves. -
FIG. 5 illustrates different measurement signals and high frequency operating parameters with a constant reflection factor over all phase angles φ from 0° to 360°. - The same reference numerals have been used in the different Figures for corresponding elements or signals.
- In a first implementation, high frequency operating parameters that arise during supply of a plasma load by a plasma supply device generating two high frequency source signals of identical frequency phase shifted by 90° with respect to one another and coupled in a hybrid coupler to a high frequency output signal that is transmitted to the plasma load are determined by detecting at least two of the four ports of the hybrid coupler a respective signal that is related to the amplitude of the high frequency signal present at the port, and from that, generating at least one high frequency operating parameter.
- For each measurement signal, a portion of the high frequency signal is measured at the respective port. In that case, the portion of the high frequency signal measured for the measurement signal and present at the measurement point can be very small.
- After the measurement, a detection can be effected, for example, by a diode or by a different rectifier. Then a low-pass filtering can be carried out, which frees the resulting measurement signal from residual high frequency spectral components. The rate of change of the measurement signals is substantially determined only by the dynamics of the impedance of the plasma load.
- For the further processing, it is advantageous if a signal that corresponds to the mean high frequency power at the respective measurement point is generated from the measurement signal by scaling.
- The one part of the high frequency signal reflected by the plasma load is also phase-delayed by 45° en route from
port 3 toport 1 like the high frequency source signal en route fromport 1 toport 3; a superposition of these two high frequency signals is therefore present atport 1, so that for the mean high frequency power at this point the following equation is valid: -
- Here, Pq is the power of the high frequency source signal, |Γ| is the reflection factor, φ is the phase angle of the reflected high frequency signal, in which the reflection phase of the plasma load, the line length from the hybrid coupler as far as the plasma load and the phase shifts in an optionally interposed impedance matching circuit are taken into account.
- The delay of π/2 in the superposition of high frequency source signal Uq and the reflected high frequency signal weighted with |Γ| derives from the double pass of the distance between
port 1 andport 3 of the hybrid coupler, which each time causes a phase shift of π/4=45°. - Like the high frequency source signal en route from
port 2 toport 3 previously, the other part of the high frequency signal reflected by the plasma load also experiences a phase advance by 45° en route fromport 3 toport 2. Provided that the high frequency power Pq is the same, then atport 2 the following equation is valid: -
- In this way, the two parts of the reflected high frequency signal are superimposed in phase opposition with the two high frequency source signals on the lines between the high frequency sources and the hybrid coupler. If the high frequency source signal and the relevant part of the reflected high frequency signal have a maximum constructive superposition at the measurement point at
port 1, then the superposition at the measurement point atport 2 will have maximum deconstruction and vice versa. The sum of the two high frequency powers P1 and P2 present at theports -
P S =P 1 +P 2 =P f +P r - Half the difference between the high frequency power P1 at
port 1 and the high frequency power P2 atport 2 is a sine function, the amplitude of which is defined by the reflection factor and the phase of which is defined by the phase angle of the reflected high frequency signal. -
- These variables can be determined if measured values are detected at least at
ports - A phase shift of the reflected signal cannot be definitely determined by means of the exactly oppositely directed (anti-parallel) superpositions of the forward-running and backward-running high frequency signals at
ports port 3, as here the superposition of the reflected high frequency signal with the high frequency output signal is effected at an orthogonal angle relative to the superpositions atport port 3, the difference of the high frequency power atport 3 and the sum of the two high frequency powers present atports - Half the difference between the measured high frequency power, P3, at
port 3 and the sum of the high frequency powers measured atport 1 andport 2, PS=P1+P2, is a cosine function, the amplitude of which is likewise defined by the reflection factor and the phase of which is defined by the phase angle of the reflected high frequency signal. -
- This cosine function is orthogonal to the sine function obtained exclusively at
port 1 orport 2. - Because of that, the reflection factor equals
-
- with the radius R of the two trigonometric functions
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R=√{square root over ((P 1 −P 2)2+(P 3−(P 1 −P 2))2)}{square root over ((P 1 −P 2)2+(P 3−(P 1 −P 2))2)} - By inserting the auxiliary relation
-
- the equations can be solved according to the forward power Pf.
- Thus:
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- The reflection factor |Γ| can accordingly also be determined.
- In addition, the reverse power as well as the standing wave ratio (VSWR, voltage standing wave ratio) can be calculated from the reflection factor and the sum of forward power and reverse power.
- The above-described calculations can be replaced by tables, by which high frequency parameters are allocated to the measurement signals.
- Detection of a measurement signal at port 4 furthermore permits monitoring of high frequency signals reflected at the high frequency sources, and which have arrived back at the plasma supply device owing to previous reflection at the plasma load. Port 4 carries the sum of the powers reflected by the high frequency sources.
- Detection of measurement signals at the ports of the hybrid coupler thus delivers all the desired high frequency operating parameters.
- Scaling of the measurement signals into signals that are proportional to the high frequency powers at the measurement points, as well as other calculations, can be carried out especially simply with a digital processor or a digital circuit. For that purpose, the measurement signals must be digitized with an A/D converter.
- The high frequency operating parameters obtained in this manner can be used to control or regulate the high frequency output power generated. A constant input of electrical power into the plasma can thus be ensured, as is required in particular for processes with constant deposition or etch rates or for lasers having a constant output power. In particular, error conditions can be deduced from the high frequency operating parameters. From a table of stored states, a control or digital signal processing can select what the response should be in what error states. In this connection, previous states can be considered (taking account of history). An expert system or a neural network can continuously improve the regulation and learn new error situations and respond correspondingly to errors. The regulation of the high frequency source can also be effected by fuzzy logic.
- In addition, the high frequency operating parameters can be used to control an impedance transformation between the plasma supply device and the plasma load.
- In another implementation, a device is provided for determining high frequency operating parameters which arise between a plasma load and a plasma supply device, wherein the plasma supply device comprises two high frequency sources, the outputs of which are connected to a respective port of a hybrid coupler, and the plasma load is connected to the third port of the hybrid coupler, at which the high frequency source signals are constructively superimposed, wherein measurement circuits are connected to at least two ports of the hybrid coupler, to each measurement circuit there is connected a detector, which generates a measurement signal related to the amplitude of the high frequency signal at the relevant port of the hybrid coupler, and the detectors are connected to an evaluating device, which is designed to determine at least one high frequency operating parameter from the measurement signals.
- The high frequency sources can also be represented by correspondingly driven generators or amplifiers or even by two ports of a second hybrid coupler fed by a generator. Each high frequency source can also in turn again comprise an arrangement of further high frequency sources, which are coupled together by further hybrid couplers. The high frequency sources can comprise switching elements. If active drivers are allocated to the switching elements and each drive can be individually driven, and hence duration and point in time of switch-on of the switching element can be individually controlled for each switching element, this can be effected reliably and exactly, taking into consideration the high frequency parameters determined.
- The plasma load to be fed is connected to the third port of the hybrid coupler either directly or via the interconnection of further units, such as for example, an impedance matching circuit.
- A terminating resistance can be connected to the fourth port of the first hybrid coupler.
- The measurement circuit for generating the measurement signals can be, for example, a resistance network or a capacitive or inductive network or a combination thereof. An inductive measurement can also be achieved by an auxiliary winding at the inductances of the hybrid coupler. If the hybrid coupler is constructed using strip line technology, the measurement circuit can be manufactured by means of suitable strip lines.
- The measurement point need not be disposed directly at the relevant port of the first hybrid coupler, but in the case of
ports port 3 towards the impedance matching circuit or the plasma load and in the case of port 4 towards the terminating resistance. - The detectors for the measurement signals can be, for example, diodes or bridge rectifiers. To smooth each measurement signal, a low-pass filter that blocks the remaining high frequency spectral components can be connected downstream of the particular detector. The measurement signal thus obtained relates to the amplitude of the high frequency signal at the relevant port of the hybrid coupler.
- The outputs of the detectors for the measurement signals and of the downstream low-pass filters are connected to an evaluating unit, which is able to determine the high frequency operating parameters from the measurement signals.
- Since it is advantageous for the determination of the high frequency operating parameters for the measurement signals to represent the particular high frequency power at the relevant measurement point, the detectors can be correspondingly designed or calibrated. Alternatively, the measurement signals can be converted upstream of or in the evaluating unit into signals that correspond to the particular high frequency power.
- To obtain linearly independent superpositions of forward-running and backward-running high frequency signals, it is advantageous for a measurement circuit with downstream detector for generation of a measurement signal to be connected also to
port 3 of the hybrid coupler to which the plasma load is connected. - Since the measurement signals follow only changes in the impedance of the plasma load and not the instantaneous value of the high frequency signal, the frequency components to be processed are low enough to allow the measurement signals to be processed and the high frequency operating parameters to be determined by a digital circuit as well. Such a circuit may also be a digital signal processor or a microcontroller or have such a device. For that purpose, the particular measurement signal must previously have been digitized by means of an A/D converter.
- If measurement circuits and detectors are connected to the
ports - The evaluating unit can be connected to at least one of the high frequency sources in order to control the latter. In addition, the evaluating unit can be connected to the impedance matching circuit, in order to control the impedance transformation taking place therein.
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FIG. 1 is a schematic representation of aplasma supply device 1 comprising twohigh frequency sources hybrid coupler 30 with fourports resistance 40 andmeasurement devices impedance matching circuit 50 is connected to the output of theplasma supply device 1, which is connected to port 33, and theplasma load 60, here represented only as an impedance, is connected to this impedance matching circuit. - The two
high frequency sources ports hybrid coupler 30, thehigh frequency source 10 being driven in such a way that its signal leads that of thehigh frequency source 20 phase-shifted by 90°. - The two high frequency sources can be, for example, independent generators driven phased-shifted by 90°, correspondingly driven amplifiers or even simply the outputs of a hybrid coupler or power splitter with a 90° phase shift.
- The
hybrid coupler 30 delays the high frequency signal of thehigh frequency source 10 en route fromport 31 toport 33 by a phase angle of 45°, whereas it allows the high frequency signal of thehigh frequency source 20 to lead by 45° en route fromport 32 toport 33. Accordingly, both high frequency signals are present constructively superposed atport 33. - En route to port 34, the conditions are reversed. The
hybrid coupler 30 lets the high frequency signal of thehigh frequency source 10 lead en route fromport 31 toport 34 by 45°, whilst it delays the high frequency signal of thehigh frequency source 20 by 45° en route fromport 32 toport 34. Accordingly, both high frequency signals are present destructively superposed atport 34 and cancel each other out. - Any high frequency signals reflected by the
plasma load 60 and theimpedance matching circuit 50 return toport 33 of thedirectional coupler 30, are split and transmitted via the twoports high frequency sources high frequency sources port 33 and are constructively superposed only atport 34, to which the terminatingresistance 40 is connected. - Four
measurement devices ports hybrid coupler 30, the measurement devices in this example being kept especially simple. Each of these measurement devices comprise identical parts, which are explained by means of themeasurement device 110. Themeasurement circuit 111 in the form in this case only of a resistance is followed by adetector 112 for rectification, which in this embodiment is in the form of a diode, and ameasurement instrument 113, the second connection of which is connected to earth. By means of themeasurement instrument 113 it is possible to observe the voltage obtained with thedecupling circuit 111 and thedetector 112, which is related to the amplitude of the high frequency signal atport 31 of thecoupler 30. InFIG. 1 , such measurement devices are connected to all four ports 31-34 of thecoupler 30. - By operating the circuit shown in
FIG. 1 , by reading off the measurement instruments in themeasurement devices -
FIG. 2 shows a second exemplary embodiment of a plasma supply device having the main components already known fromFIG. 1 . Themeasurement circuits ports hybrid coupler 30. They are followed by thedetectors pass filters unit 150 is provided, which is equipped at its four inputs with analog-to-digital (A/D)converters device 150. The evaluatingdevice 150 can also undertake entirely or partially the control of thehigh frequency sources impedance matching circuit 50, for which purpose it is connected to these by respective control lines. In this way, for example, by controlling thehigh frequency sources port 33 of thehybrid coupler 30 can be kept constant, or the impedance of theplasma load 60 can be matched by theimpedance matching circuit 50 to the output impedance of theplasma supply device 1. - In
FIG. 3 , the spatial phase shift of the high frequency signals on the lines to theports FIG. 3 a shows two instantaneous images after switching on the twohigh frequency sources high frequency source 10 commences with itswave train 210 earlier by a phase angle of 90° than thewave train 220 of thehigh frequency source 20; both wave trains can be seen in the first instantaneous image to the left of thehybrid coupler 30. The starts of the wave trains are each marked with circles, the broken line indicates the earlier start; the amplitudes of the two wave trains and hence the output powers of the two high frequency sources are identical in this Figure. In the second instantaneous image to the right of thehybrid coupler 30, thewave train 230 coupled in thehybrid coupler 30 leaves thehybrid coupler 30 fromport 33 towards the plasma load; by the addition of the powers, the amplitude of thewave train 230 is now √2 as large as the respective amplitudes of the wave trains 210 and 220. - In
FIG. 3 b, the start of awave train 330 reflected by the plasma load and likewise indicated by a circle can be seen in the first instantaneous image to the right of thehybrid coupler 30. In this example, a complete reflection is assumed, so that the amplitude thereof is identical to that of thewave train 230. Thewave train 330 runs towards thehybrid coupler 30 and is there split into the twowave trains ports -
FIGS. 4 a-4 c show the variation with time of the high frequency signals at theports hybrid coupler 30. InFIG. 4 c, let ahigh frequency signal 330 reflected by the plasma load have at the port 33 a phase angle φ of 30° with respect to the highfrequency output signal 230 running to the plasma load. In addition, in each ofFIGS. 4 a-4 c, for better clarification, let thehigh frequency signal 330 reflected by the plasma load have just half the amplitude compared with thehigh frequency signal 230. - The variations in times at the
ports FIGS. 4 a and 4 b, respectively. Thehigh frequency signal 330 reflected by the plasma load is split by the hybrid coupler into the two high frequency signals 310, which appears atport port 32. En route fromport 33 toport 31 thesignal 310 experiences a delay of 45° compared with thesignal 330; in contrast, thesignal 320 experiences an acceleration of 45° compared with thesignal 330. But since the high frequency source signal 210 leads by 45°, in order to compensate for the phase lag en route fromport 32 toport 33, and the high frequency source signal 220 lags by 45°, in order to compensate for the phase lead en route fromport 32 toport 33, thehigh frequency signal 310 now exhibits a delay with respect to thehigh frequency signal 210 of 30°+90°=120°, whereas thehigh frequency signal 320 now has a delay with respect to thehigh frequency signal 220 of 30°−90°=−60°, that is, a lead of 60°. -
FIG. 5 shows the mean powers P1, P2, and P3 of the high frequency signals at theports FIG. 5 illustrates the high frequency operating parameters PS=P1+P2, P1−P2, P3−(P1+P2) derived therefrom and the vector length R, from which the reflection coefficient [Γ] and the phase angle φ can be calculated.
Claims (10)
1. A plasma power evaluation device comprising:
a measurement circuit configured to be coupled to a port of a hybrid coupler in a plasma system having two high frequency power sources coupled to a plasma load through the hybrid coupler;
a detector coupled to the measurement circuit and configured to generate a signal corresponding to an amplitude of a high frequency signal received by the detector; and
a processing device coupled to the detector to receive the signal and operable to determine one or more high frequency operating parameters based on the signal;
wherein the one or more high frequency operating parameters are selected from the group consisting of:
a reflection factor of the plasma load,
a voltage standing wave ratio,
a phase angle between a wave running to the plasma load and a wave reflected by the plasma load,
a power of a high frequency signal reflected by the plasma load,
a sum of a power of the high frequency output signal and the power of the high frequency signal reflected by the plasma load, and
a sum of powers reflected by the high frequency power sources.
2. The device of claim 1 , wherein the processing device is operable to determine at least two high frequency operating parameters from signals received from two or more detectors.
3. The device of claim 1 , further comprising:
an A/D converter coupled between the detector and the processing device to convert the signal from an analog signal to a digital signal;
wherein the processing device comprises a digital signal processor configured to receive and process the digital signal.
4. The device of claim 1 , wherein the processing device includes a control output to transmit control signals to the two high frequency power sources.
5. The device of claim 1 , wherein the processing device includes a control output to transmit control signals to an impedance matching circuit coupled between the hybrid coupler and the plasma load.
6. A plasma processing power control system for a plasma power system having two high frequency power sources coupled to a hybrid coupler to generate a high frequency output signal for a plasma load, the system comprising:
a set of detection circuits configured to be coupled to respective ports of the hybrid coupler and to generate respective signals corresponding to an amplitude of a high frequency signal detected at the respective port of the hybrid coupler; and
a processing device coupled to the detection circuits to receive the signals and operable to determine a parameter value based on the signals, the parameter value representing a power transfer characteristic associated with power being transferred between the high frequency power sources and the plasma load.
7. The system of claim 6 , wherein the processing device is further operable to control the high frequency power sources based on the determined parameter value so as to maintain a constant high frequency output signal.
8. The system of claim 6 , wherein the processing device is further operable to control an impedance matching circuit based on the determined parameter value to match an impedance of the plasma load to an output impedance of the plasma power system.
9. The system of claim 6 , wherein the power transfer characteristic is a forward power, a reverse power, or a phase angle characteristic.
10. The system of claim 6 , wherein each detection circuit of the set of detection circuits includes a respective measurement circuit to couple the detection circuit to the respective port.
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US20160300695A1 (en) * | 2013-12-18 | 2016-10-13 | Trumpf Huettinger Gmbh + Co. Kg | Power Supply Systems and Methods for Generating Power with Multiple Amplifier Paths |
US10042407B2 (en) | 2013-12-18 | 2018-08-07 | Trumpf Huettinger Gmbh + Co. Kg | Power supply systems and methods for generating power |
US11284500B2 (en) | 2018-05-10 | 2022-03-22 | Applied Materials, Inc. | Method of controlling ion energy distribution using a pulse generator |
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US11476145B2 (en) | 2018-11-20 | 2022-10-18 | Applied Materials, Inc. | Automatic ESC bias compensation when using pulsed DC bias |
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US11508554B2 (en) | 2019-01-24 | 2022-11-22 | Applied Materials, Inc. | High voltage filter assembly |
US11569066B2 (en) | 2021-06-23 | 2023-01-31 | Applied Materials, Inc. | Pulsed voltage source for plasma processing applications |
US11699572B2 (en) | 2019-01-22 | 2023-07-11 | Applied Materials, Inc. | Feedback loop for controlling a pulsed voltage waveform |
US11776788B2 (en) | 2021-06-28 | 2023-10-03 | Applied Materials, Inc. | Pulsed voltage boost for substrate processing |
US11791138B2 (en) | 2021-05-12 | 2023-10-17 | Applied Materials, Inc. | Automatic electrostatic chuck bias compensation during plasma processing |
US11798790B2 (en) | 2020-11-16 | 2023-10-24 | Applied Materials, Inc. | Apparatus and methods for controlling ion energy distribution |
US11810760B2 (en) | 2021-06-16 | 2023-11-07 | Applied Materials, Inc. | Apparatus and method of ion current compensation |
US11901157B2 (en) | 2020-11-16 | 2024-02-13 | Applied Materials, Inc. | Apparatus and methods for controlling ion energy distribution |
US11948780B2 (en) | 2021-05-12 | 2024-04-02 | Applied Materials, Inc. | Automatic electrostatic chuck bias compensation during plasma processing |
US11967483B2 (en) | 2021-06-02 | 2024-04-23 | Applied Materials, Inc. | Plasma excitation with ion energy control |
US11972924B2 (en) | 2022-06-08 | 2024-04-30 | Applied Materials, Inc. | Pulsed voltage source for plasma processing applications |
Families Citing this family (106)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10161743B4 (en) * | 2001-12-15 | 2004-08-05 | Hüttinger Elektronik GmbH & Co. KG | High-frequency excitation system |
JP5606312B2 (en) | 2007-07-23 | 2014-10-15 | トゥルンプフ ヒュッティンガー ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフト | Plasma power supply device |
JP5171520B2 (en) * | 2008-09-30 | 2013-03-27 | 日立オートモティブシステムズ株式会社 | Power converter |
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DE102010031568B4 (en) | 2010-07-20 | 2014-12-11 | TRUMPF Hüttinger GmbH + Co. KG | Arclöschanordnung and method for erasing arcs |
JP5735114B2 (en) * | 2010-09-30 | 2015-06-17 | トムソン ライセンシングThomson Licensing | Encoding method, encoding device, decoding method and decoding device |
DE202010014176U1 (en) * | 2010-10-11 | 2012-01-16 | Tigres Dr. Gerstenberg Gmbh | Apparatus for treating surfaces with discharge monitoring |
GB2491550A (en) * | 2011-01-17 | 2012-12-12 | Radiant Res Ltd | A hybrid power control system using dynamic power regulation to increase the dimming dynamic range and power control of solid-state illumination systems |
FR2971886B1 (en) * | 2011-02-21 | 2014-01-10 | Nanotec Solution | DEVICE AND METHOD FOR INTERCONNECTING ELECTRONIC SYSTEMS TO DIFFERENT REFERENCE POTENTIALS |
FR2976724B1 (en) * | 2011-06-16 | 2013-07-12 | Nanotec Solution | DEVICE FOR GENERATING AN ALTERNATIVE VOLTAGE DIFFERENCE BETWEEN REFERENCE POTENTIALS OF ELECTRONIC SYSTEMS. |
EP2549645A1 (en) | 2011-07-21 | 2013-01-23 | Telefonaktiebolaget LM Ericsson (publ) | Transformer filter arrangement |
GB201116299D0 (en) * | 2011-09-21 | 2011-11-02 | Aker Subsea Ltd | Condition monitoring employing cross-correlation |
DE102011087106B4 (en) | 2011-11-25 | 2017-10-19 | TRUMPF Hüttinger GmbH + Co. KG | High frequency Class D MOSFET amplifier module |
DE102011087807B4 (en) * | 2011-12-06 | 2015-11-12 | TRUMPF Hüttinger GmbH + Co. KG | Output network for a plasma supply device and plasma supply device |
US8903009B2 (en) * | 2012-01-06 | 2014-12-02 | Broadcom Corporation | Common-mode termination within communication systems |
DE102012200702B3 (en) * | 2012-01-19 | 2013-06-27 | Hüttinger Elektronik Gmbh + Co. Kg | A method of phasing multiple RF power generation units of an RF power supply system and RF power supply system |
US9279722B2 (en) | 2012-04-30 | 2016-03-08 | Agilent Technologies, Inc. | Optical emission system including dichroic beam combiner |
WO2014049818A1 (en) * | 2012-09-28 | 2014-04-03 | 三洋電機株式会社 | Power converter |
US9082589B2 (en) * | 2012-10-09 | 2015-07-14 | Novellus Systems, Inc. | Hybrid impedance matching for inductively coupled plasma system |
DE102013100617B4 (en) * | 2013-01-22 | 2016-08-25 | Epcos Ag | Device for generating a plasma and handheld device with the device |
US9536713B2 (en) * | 2013-02-27 | 2017-01-03 | Advanced Energy Industries, Inc. | Reliable plasma ignition and reignition |
JP6177012B2 (en) * | 2013-06-04 | 2017-08-09 | 株式会社ダイヘン | Impedance matching device |
DE102013106702B4 (en) * | 2013-06-26 | 2017-08-31 | Sma Solar Technology Ag | Method and device for detecting an arc |
EP2849204B1 (en) * | 2013-09-12 | 2017-11-29 | Meyer Burger (Germany) AG | Plasma generating apparatus |
US10978955B2 (en) | 2014-02-28 | 2021-04-13 | Eagle Harbor Technologies, Inc. | Nanosecond pulser bias compensation |
US10892140B2 (en) | 2018-07-27 | 2021-01-12 | Eagle Harbor Technologies, Inc. | Nanosecond pulser bias compensation |
US10020800B2 (en) | 2013-11-14 | 2018-07-10 | Eagle Harbor Technologies, Inc. | High voltage nanosecond pulser with variable pulse width and pulse repetition frequency |
US11539352B2 (en) | 2013-11-14 | 2022-12-27 | Eagle Harbor Technologies, Inc. | Transformer resonant converter |
CN109873621B (en) | 2013-11-14 | 2023-06-16 | 鹰港科技有限公司 | High-voltage nanosecond pulse generator |
US9641095B1 (en) * | 2014-02-21 | 2017-05-02 | Pai Capital Llc | Power converter output stage using heat dissipating bus bars |
WO2015131199A1 (en) | 2014-02-28 | 2015-09-03 | Eagle Harbor Technologies, Inc. | Galvanically isolated output variable pulse generator disclosure |
US10483089B2 (en) * | 2014-02-28 | 2019-11-19 | Eagle Harbor Technologies, Inc. | High voltage resistive output stage circuit |
US9952297B2 (en) * | 2014-05-08 | 2018-04-24 | Auburn University | Parallel plate transmission line for broadband nuclear magnetic resonance imaging |
US11051369B2 (en) | 2014-10-21 | 2021-06-29 | Ultraflex International, Inc. | Radio frequency heating apparatus using direct-digital radio frequency power control and fine-tune power control |
US10624158B2 (en) | 2014-10-21 | 2020-04-14 | Ultraflex International Inc. | Radio frequency heating apparatus using direct-digital radio frequency power control and fine-tune power control |
TWI574296B (en) * | 2014-12-04 | 2017-03-11 | 萬機科技股份有限公司 | A power output generation system and method that adapts to periodic waveform |
US10049857B2 (en) * | 2014-12-04 | 2018-08-14 | Mks Instruments, Inc. | Adaptive periodic waveform controller |
DE102015212152B4 (en) | 2015-06-30 | 2018-03-15 | TRUMPF Hüttinger GmbH + Co. KG | Non-linear radio frequency amplifier arrangement |
DE102015212220A1 (en) | 2015-06-30 | 2017-01-05 | TRUMPF Hüttinger GmbH + Co. KG | RF amplifier arrangement |
DE102015212247A1 (en) | 2015-06-30 | 2017-01-05 | TRUMPF Hüttinger GmbH + Co. KG | RF amplifier arrangement |
DE102015212232B4 (en) * | 2015-06-30 | 2020-03-05 | TRUMPF Hüttinger GmbH + Co. KG | Power combiner for coupling high-frequency signals and power combiner arrangement with such a power combiner |
US10386962B1 (en) | 2015-08-03 | 2019-08-20 | Apple Inc. | Reducing touch node electrode coupling |
CN105137246B (en) * | 2015-09-21 | 2018-02-02 | 华中科技大学 | The life testing method of metallization film capacitor under repetitive frequency pulsed |
US11452982B2 (en) | 2015-10-01 | 2022-09-27 | Milton Roy, Llc | Reactor for liquid and gas and method of use |
EP4226999A3 (en) | 2015-10-01 | 2023-09-06 | Milton Roy, LLC | Plasma reactor for liquid and gas and related methods |
US10882021B2 (en) | 2015-10-01 | 2021-01-05 | Ion Inject Technology Llc | Plasma reactor for liquid and gas and method of use |
US10187968B2 (en) * | 2015-10-08 | 2019-01-22 | Ion Inject Technology Llc | Quasi-resonant plasma voltage generator |
DE102015220847A1 (en) * | 2015-10-26 | 2017-04-27 | TRUMPF Hüttinger GmbH + Co. KG | A method of impedance matching a load to the output impedance of a power generator and impedance matching arrangement |
US10046300B2 (en) | 2015-12-09 | 2018-08-14 | Ion Inject Technology Llc | Membrane plasma reactor |
DE102015226149A1 (en) * | 2015-12-21 | 2017-06-22 | Robert Bosch Gmbh | Drive electronics for a drive |
US9577516B1 (en) | 2016-02-18 | 2017-02-21 | Advanced Energy Industries, Inc. | Apparatus for controlled overshoot in a RF generator |
CN106026702B (en) * | 2016-05-23 | 2019-10-25 | 安徽省金屹电源科技有限公司 | A kind of high power DC plasma electrical source |
DE102016110141A1 (en) * | 2016-06-01 | 2017-12-07 | TRUMPF Hüttinger GmbH + Co. KG | Method and device for igniting a plasma load |
US11004660B2 (en) | 2018-11-30 | 2021-05-11 | Eagle Harbor Technologies, Inc. | Variable output impedance RF generator |
US11430635B2 (en) | 2018-07-27 | 2022-08-30 | Eagle Harbor Technologies, Inc. | Precise plasma control system |
US10903047B2 (en) | 2018-07-27 | 2021-01-26 | Eagle Harbor Technologies, Inc. | Precise plasma control system |
EP3491500B1 (en) | 2016-07-29 | 2023-11-29 | Apple Inc. | Touch sensor panel with multi-power domain chip configuration |
EP3580841A4 (en) | 2017-02-07 | 2020-12-16 | Eagle Harbor Technologies, Inc. | Transformer resonant converter |
CN117200759A (en) * | 2017-03-31 | 2023-12-08 | 鹰港科技有限公司 | High voltage resistive output stage circuit |
WO2019003345A1 (en) * | 2017-06-28 | 2019-01-03 | 株式会社日立国際電気 | High-frequency power source device and plasma processing device using same |
WO2019010312A1 (en) * | 2017-07-07 | 2019-01-10 | Advanced Energy Industries, Inc. | Inter-period control system for plasma power delivery system and method of operating the same |
US11615943B2 (en) * | 2017-07-07 | 2023-03-28 | Advanced Energy Industries, Inc. | Inter-period control for passive power distribution of multiple electrode inductive plasma source |
US11651939B2 (en) * | 2017-07-07 | 2023-05-16 | Advanced Energy Industries, Inc. | Inter-period control system for plasma power delivery system and method of operating same |
EP3652857B1 (en) * | 2017-07-13 | 2021-06-30 | ABB Schweiz AG | Power semiconductor module gate driver with input common mode choke |
KR102208429B1 (en) | 2017-08-25 | 2021-01-29 | 이글 하버 테크놀로지스, 인코포레이티드 | Arbitrary waveform generation using nanosecond pulses |
CN107450645B (en) * | 2017-09-07 | 2018-12-28 | 武汉驭波科技有限公司 | Radio-frequency power supply |
US10510575B2 (en) | 2017-09-20 | 2019-12-17 | Applied Materials, Inc. | Substrate support with multiple embedded electrodes |
US10990221B2 (en) | 2017-09-29 | 2021-04-27 | Apple Inc. | Multi-power domain touch sensing |
WO2019067268A1 (en) | 2017-09-29 | 2019-04-04 | Apple Inc. | Multi modal touch controller |
US20190108976A1 (en) * | 2017-10-11 | 2019-04-11 | Advanced Energy Industries, Inc. | Matched source impedance driving system and method of operating the same |
KR102644960B1 (en) | 2017-11-29 | 2024-03-07 | 코멧 테크놀로지스 유에스에이, 인크. | Retuning for impedance matching network control |
DE102018204587B4 (en) * | 2018-03-26 | 2019-10-24 | TRUMPF Hüttinger GmbH + Co. KG | Method for igniting a plasma in a plasma chamber and ignition circuit |
CN110504149B (en) * | 2018-05-17 | 2022-04-22 | 北京北方华创微电子装备有限公司 | Pulse modulation system and method of radio frequency power supply |
US10515781B1 (en) * | 2018-06-13 | 2019-12-24 | Lam Research Corporation | Direct drive RF circuit for substrate processing systems |
DE102018116637A1 (en) | 2018-07-10 | 2020-01-16 | TRUMPF Hüttinger GmbH + Co. KG | Power supply facility and operating procedures therefor |
US11302518B2 (en) | 2018-07-27 | 2022-04-12 | Eagle Harbor Technologies, Inc. | Efficient energy recovery in a nanosecond pulser circuit |
US11532457B2 (en) | 2018-07-27 | 2022-12-20 | Eagle Harbor Technologies, Inc. | Precise plasma control system |
US11222767B2 (en) | 2018-07-27 | 2022-01-11 | Eagle Harbor Technologies, Inc. | Nanosecond pulser bias compensation |
US10607814B2 (en) | 2018-08-10 | 2020-03-31 | Eagle Harbor Technologies, Inc. | High voltage switch with isolated power |
EP3605115A1 (en) | 2018-08-02 | 2020-02-05 | TRUMPF Huettinger Sp. Z o. o. | Arc detector for detecting arcs, plasma system and method of detecting arcs |
WO2020033931A1 (en) | 2018-08-10 | 2020-02-13 | Eagle Harbor Technologies, Inc. | Plasma sheath control for rf plasma reactors |
JP7370377B2 (en) * | 2018-08-17 | 2023-10-27 | ラム リサーチ コーポレーション | Direct frequency tuning for matchless plasma sources in substrate processing systems |
KR102438864B1 (en) * | 2018-09-28 | 2022-08-31 | 램 리써치 코포레이션 | Methods and systems for optimizing power delivery to an electrode in a plasma chamber |
US11016616B2 (en) | 2018-09-28 | 2021-05-25 | Apple Inc. | Multi-domain touch sensing with touch and display circuitry operable in guarded power domain |
WO2020146436A1 (en) | 2019-01-08 | 2020-07-16 | Eagle Harbor Technologies, Inc. | Efficient energy recovery in a nanosecond pulser circuit |
US11019714B1 (en) * | 2020-10-30 | 2021-05-25 | Atmospheric Plasma Solutions, Inc. | Waveform detection of states and faults in plasma inverters |
CA3136812C (en) * | 2019-04-16 | 2024-03-12 | Atmospheric Plasma Solutions, Inc. | Frequency chirp resonant optimal ignition method |
CN114041204A (en) * | 2019-04-30 | 2022-02-11 | 朗姆研究公司 | Double-frequency direct-drive inductively coupled plasma source |
US11114279B2 (en) * | 2019-06-28 | 2021-09-07 | COMET Technologies USA, Inc. | Arc suppression device for plasma processing equipment |
US11527385B2 (en) | 2021-04-29 | 2022-12-13 | COMET Technologies USA, Inc. | Systems and methods for calibrating capacitors of matching networks |
US11596309B2 (en) | 2019-07-09 | 2023-03-07 | COMET Technologies USA, Inc. | Hybrid matching network topology |
US11107661B2 (en) | 2019-07-09 | 2021-08-31 | COMET Technologies USA, Inc. | Hybrid matching network topology |
TWI778449B (en) | 2019-11-15 | 2022-09-21 | 美商鷹港科技股份有限公司 | High voltage pulsing circuit |
US11527383B2 (en) | 2019-12-24 | 2022-12-13 | Eagle Harbor Technologies, Inc. | Nanosecond pulser RF isolation for plasma systems |
US11521832B2 (en) | 2020-01-10 | 2022-12-06 | COMET Technologies USA, Inc. | Uniformity control for radio frequency plasma processing systems |
US11830708B2 (en) | 2020-01-10 | 2023-11-28 | COMET Technologies USA, Inc. | Inductive broad-band sensors for electromagnetic waves |
US11887820B2 (en) | 2020-01-10 | 2024-01-30 | COMET Technologies USA, Inc. | Sector shunts for plasma-based wafer processing systems |
US11670488B2 (en) | 2020-01-10 | 2023-06-06 | COMET Technologies USA, Inc. | Fast arc detecting match network |
US11961711B2 (en) | 2020-01-20 | 2024-04-16 | COMET Technologies USA, Inc. | Radio frequency match network and generator |
US11605527B2 (en) | 2020-01-20 | 2023-03-14 | COMET Technologies USA, Inc. | Pulsing control match network |
DE102020104090A1 (en) * | 2020-02-17 | 2021-08-19 | Comet Ag | High-frequency amplifier arrangement for a high-frequency generator |
US11373844B2 (en) | 2020-09-28 | 2022-06-28 | COMET Technologies USA, Inc. | Systems and methods for repetitive tuning of matching networks |
US11923175B2 (en) | 2021-07-28 | 2024-03-05 | COMET Technologies USA, Inc. | Systems and methods for variable gain tuning of matching networks |
US11657980B1 (en) | 2022-05-09 | 2023-05-23 | COMET Technologies USA, Inc. | Dielectric fluid variable capacitor |
Citations (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5195045A (en) * | 1991-02-27 | 1993-03-16 | Astec America, Inc. | Automatic impedance matching apparatus and method |
US5345145A (en) * | 1992-03-31 | 1994-09-06 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus for generating highly dense uniform plasma in a high frequency electric field |
US5689215A (en) * | 1996-05-23 | 1997-11-18 | Lam Research Corporation | Method of and apparatus for controlling reactive impedances of a matching network connected between an RF source and an RF plasma processor |
US5869817A (en) * | 1997-03-06 | 1999-02-09 | General Mills, Inc. | Tunable cavity microwave applicator |
US6160449A (en) * | 1999-07-22 | 2000-12-12 | Motorola, Inc. | Power amplifying circuit with load adjust for control of adjacent and alternate channel power |
US6166598A (en) * | 1999-07-22 | 2000-12-26 | Motorola, Inc. | Power amplifying circuit with supply adjust to control adjacent and alternate channel power |
US6313584B1 (en) * | 1998-09-17 | 2001-11-06 | Tokyo Electron Limited | Electrical impedance matching system and method |
US6456010B2 (en) * | 2000-03-13 | 2002-09-24 | Mitsubishi Heavy Industries, Ltd. | Discharge plasma generating method, discharge plasma generating apparatus, semiconductor device fabrication method, and semiconductor device fabrication apparatus |
US20020171411A1 (en) * | 2001-04-06 | 2002-11-21 | Nasman Kevin P. | Reflection coefficient phase detector |
US6494986B1 (en) * | 2000-08-11 | 2002-12-17 | Applied Materials, Inc. | Externally excited multiple torroidal plasma source |
US6741446B2 (en) * | 2001-03-30 | 2004-05-25 | Lam Research Corporation | Vacuum plasma processor and method of operating same |
US6794301B2 (en) * | 1995-10-13 | 2004-09-21 | Mattson Technology, Inc. | Pulsed plasma processing of semiconductor substrates |
US20050136604A1 (en) * | 2000-08-10 | 2005-06-23 | Amir Al-Bayati | Semiconductor on insulator vertical transistor fabrication and doping process |
US6946847B2 (en) * | 2002-02-08 | 2005-09-20 | Daihen Corporation | Impedance matching device provided with reactance-impedance table |
US7037813B2 (en) * | 2000-08-11 | 2006-05-02 | Applied Materials, Inc. | Plasma immersion ion implantation process using a capacitively coupled plasma source having low dissociation and low minimum plasma voltage |
US7320734B2 (en) * | 2000-08-11 | 2008-01-22 | Applied Materials, Inc. | Plasma immersion ion implantation system including a plasma source having low dissociation and low minimum plasma voltage |
US20090026968A1 (en) * | 2007-07-23 | 2009-01-29 | Huettinger Elektronik Gmbh + Co. Kg | Plasma supply device |
US20110006687A1 (en) * | 2007-11-14 | 2011-01-13 | Aurion Anlagentechnik Gmbh | Method and generator circuit for production of plasma by means of radio-frequency excitation |
US20120319584A1 (en) * | 2010-08-29 | 2012-12-20 | Advanced Energy Industries, Inc. | Method of controlling the switched mode ion energy distribution system |
Family Cites Families (113)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT944469B (en) | 1971-12-29 | 1973-04-20 | Honeywell Inf Systems | SWITCH TRANSFORMER DRIVING CIRCUIT |
DE2519845C3 (en) | 1975-05-03 | 1978-06-08 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Circuit arrangement for bringing together high-frequency power components |
US4215392A (en) | 1978-12-19 | 1980-07-29 | Ncr Corporation | Inverter power supply |
JPS5582967A (en) * | 1978-12-19 | 1980-06-23 | Hitachi Cable Ltd | Measuring method for electric signal wave-form using optical-fiber |
US4489271A (en) * | 1979-01-15 | 1984-12-18 | Riblet Gordon P | Reflection coefficient measurements |
JPS5836169A (en) * | 1981-08-28 | 1983-03-03 | Fuji Electric Co Ltd | Monitoring device for thyristor |
US4490684A (en) | 1983-01-03 | 1984-12-25 | Motorola, Inc. | Adaptive quadrature combining apparatus |
JPS59202715A (en) * | 1983-04-30 | 1984-11-16 | Shimadzu Corp | High frequency power source device for icp analysis |
US6229718B1 (en) * | 1984-10-05 | 2001-05-08 | Ole K. Nilssen | Parallel-resonant bridge inverter |
US4701176A (en) * | 1985-09-06 | 1987-10-20 | Kimberly-Clark Corporation | Form-fitting self-adjusting disposable garment with fixed full-length fasteners |
US4656434A (en) | 1986-02-03 | 1987-04-07 | Raytheon Company | RF power amplifier with load mismatch compensation |
US4733137A (en) * | 1986-03-14 | 1988-03-22 | Walker Magnetics Group, Inc. | Ion nitriding power supply |
US4701716A (en) | 1986-05-07 | 1987-10-20 | Rca Corporation | Parallel distributed signal amplifiers |
JP2723516B2 (en) | 1987-04-30 | 1998-03-09 | ファナック 株式会社 | Laser oscillation device |
JPS6450396A (en) * | 1987-08-20 | 1989-02-27 | Nippon Denshi Shomei Kk | Lighting device of fluorescent discharge lamp |
US4758941A (en) | 1987-10-30 | 1988-07-19 | International Business Machines Corporation | MOSFET fullbridge switching regulator having transformer coupled MOSFET drive circuit |
US4860189A (en) | 1988-03-21 | 1989-08-22 | International Business Machines Corp. | Full bridge power converter circuit |
DE3876420T2 (en) * | 1988-04-05 | 1993-04-08 | Heidenhain Gmbh Dr Johannes | TIME AREA REFLECTOMETRY MEASUREMENT METHOD AND ARRANGEMENT FOR ITS PERFORMANCE. |
DE3906308A1 (en) | 1989-02-28 | 1990-09-20 | Gore W L & Ass Gmbh | Flat cable spiral |
US4910452A (en) | 1989-05-16 | 1990-03-20 | American Telephone And Telegraph Company, At&T Bell Laboratories | High frequency AC magnetic devices with high efficiency |
US4980810A (en) | 1989-05-25 | 1990-12-25 | Hughes Aircraft Company | VHF DC-DC power supply operating at frequencies greater than 50 MHz |
DE3942509A1 (en) * | 1989-12-22 | 1991-06-27 | Hirschmann Richard Gmbh Co | HF circuit with tunable printed coil - having inductance varied by moving relative position of ferrite element i.e. by distance or amt. of coverage |
US5222246A (en) | 1990-11-02 | 1993-06-22 | General Electric Company | Parallel amplifiers with combining phase controlled from combiner difference port |
US5598327A (en) * | 1990-11-30 | 1997-01-28 | Burr-Brown Corporation | Planar transformer assembly including non-overlapping primary and secondary windings surrounding a common magnetic flux path area |
GB2252208B (en) * | 1991-01-24 | 1995-05-03 | Burr Brown Corp | Hybrid integrated circuit planar transformer |
US5392018A (en) * | 1991-06-27 | 1995-02-21 | Applied Materials, Inc. | Electronically tuned matching networks using adjustable inductance elements and resonant tank circuits |
KR950000906B1 (en) | 1991-08-02 | 1995-02-03 | 니찌덴 아넬바 가부시기가이샤 | Sputtering apparatus |
US5225687A (en) * | 1992-01-27 | 1993-07-06 | Jason Barry L | Output circuit with optically coupled control signals |
US5523955A (en) * | 1992-03-19 | 1996-06-04 | Advanced Energy Industries, Inc. | System for characterizing AC properties of a processing plasma |
US5418707A (en) | 1992-04-13 | 1995-05-23 | The United States Of America As Represented By The United States Department Of Energy | High voltage dc-dc converter with dynamic voltage regulation and decoupling during load-generated arcs |
DE4244107C2 (en) * | 1992-12-24 | 1996-02-08 | Hirschmann Richard Gmbh Co | High frequency transmitter |
JPH0732078B2 (en) * | 1993-01-14 | 1995-04-10 | 株式会社アドテック | High frequency plasma power supply and impedance matching device |
US5363020A (en) * | 1993-02-05 | 1994-11-08 | Systems And Service International, Inc. | Electronic power controller |
US5635762A (en) | 1993-05-18 | 1997-06-03 | U.S. Philips Corporation | Flip chip semiconductor device with dual purpose metallized ground conductor |
US5434527A (en) | 1993-10-25 | 1995-07-18 | Caterpillar Inc. | Gate drive circuit |
US5438498A (en) | 1993-12-21 | 1995-08-01 | Raytheon Company | Series resonant converter having a resonant snubber |
US5424691A (en) * | 1994-02-03 | 1995-06-13 | Sadinsky; Samuel | Apparatus and method for electronically controlled admittance matching network |
US5435881A (en) * | 1994-03-17 | 1995-07-25 | Ogle; John S. | Apparatus for producing planar plasma using varying magnetic poles |
US5563775A (en) * | 1994-06-16 | 1996-10-08 | Reliance Comm/Tech Corporation | Full bridge phase displaced resonant transition circuit for obtaining constant resonant transition current from 0° phase angle to 180° phase angle |
KR0157885B1 (en) * | 1995-07-08 | 1999-03-20 | 문정환 | Power supply detecting circuit |
US5810963A (en) * | 1995-09-28 | 1998-09-22 | Kabushiki Kaisha Toshiba | Plasma processing apparatus and method |
JP3163318B2 (en) * | 1995-10-24 | 2001-05-08 | 長野日本無線株式会社 | Core for inductive element and inductive element |
US5875103A (en) | 1995-12-22 | 1999-02-23 | Electronic Measurements, Inc. | Full range soft-switching DC-DC converter |
US5882492A (en) * | 1996-06-21 | 1999-03-16 | Sierra Applied Sciences, Inc. | A.C. plasma processing system |
JP3736096B2 (en) * | 1997-06-12 | 2006-01-18 | 株式会社日立製作所 | Lighting device and lamp using the same |
US6329757B1 (en) * | 1996-12-31 | 2001-12-11 | The Perkin-Elmer Corporation | High frequency transistor oscillator system |
JP3733675B2 (en) | 1997-01-31 | 2006-01-11 | 東芝ライテック株式会社 | Inverter device, discharge lamp lighting device and lighting device |
JPH10215160A (en) * | 1997-01-31 | 1998-08-11 | Matsushita Electric Ind Co Ltd | Semiconductor switching circuit with protection function, welding machine and cutting machine |
SE521212C2 (en) * | 1997-06-11 | 2003-10-14 | Abb Ab | Device for detecting leakage of coolant at a high voltage drive station |
JP3674283B2 (en) * | 1997-12-26 | 2005-07-20 | 富士電機ホールディングス株式会社 | Insulated power converter |
US5944942A (en) * | 1998-03-04 | 1999-08-31 | Ogle; John Seldon | Varying multipole plasma source |
US6038142A (en) | 1998-06-10 | 2000-03-14 | Lucent Technologies, Inc. | Full-bridge isolated Current Fed converter with active clamp |
JP3049427B2 (en) | 1998-10-21 | 2000-06-05 | 株式会社ハイデン研究所 | Positive and negative pulse type high frequency switching power supply |
DE19927368A1 (en) * | 1999-06-16 | 2000-12-21 | Merten Kg Pulsotronic | Device for removing metal parts |
US7180758B2 (en) | 1999-07-22 | 2007-02-20 | Mks Instruments, Inc. | Class E amplifier with inductive clamp |
US6469919B1 (en) * | 1999-07-22 | 2002-10-22 | Eni Technology, Inc. | Power supplies having protection circuits |
DE60011874T2 (en) | 1999-07-22 | 2005-08-25 | Eni Technologies, Inc. | POWER SUPPLIES WITH PROTECTIVE SWITCHES |
JP3654089B2 (en) * | 1999-10-26 | 2005-06-02 | 松下電工株式会社 | Power supply |
JP2001185443A (en) * | 1999-12-22 | 2001-07-06 | Hitachi Ltd | Thin-film capacitor |
US6365868B1 (en) * | 2000-02-29 | 2002-04-02 | Hypertherm, Inc. | DSP based plasma cutting system |
US6297696B1 (en) | 2000-06-15 | 2001-10-02 | International Business Machines Corporation | Optimized power amplifier |
US6344768B1 (en) | 2000-08-10 | 2002-02-05 | International Business Machines Corporation | Full-bridge DC-to-DC converter having an unipolar gate drive |
US6246599B1 (en) | 2000-08-25 | 2001-06-12 | Delta Electronics, Inc. | Constant frequency resonant inverters with a pair of resonant inductors |
EP1405394B1 (en) | 2001-02-01 | 2007-12-12 | Power-One, Inc. | Isolated drive circuitry used in switch-mode power converters |
JP2002237419A (en) * | 2001-02-08 | 2002-08-23 | Eiwa:Kk | Planar transformer |
DE10107609A1 (en) * | 2001-02-17 | 2002-08-29 | Power One Ag Uster | Power Module |
JP2003125586A (en) * | 2001-10-15 | 2003-04-25 | Amada Eng Center Co Ltd | Power unit for plasma generation |
KR100557842B1 (en) * | 2001-12-10 | 2006-03-10 | 동경 엘렉트론 주식회사 | High-frequency power source and its control method, and plasma processor |
DE10161743B4 (en) | 2001-12-15 | 2004-08-05 | Hüttinger Elektronik GmbH & Co. KG | High-frequency excitation system |
DE10211609B4 (en) | 2002-03-12 | 2009-01-08 | Hüttinger Elektronik GmbH & Co. KG | Method and power amplifier for generating sinusoidal high-frequency signals for operating a load |
US6972972B2 (en) * | 2002-04-15 | 2005-12-06 | Airak, Inc. | Power inverter with optical isolation |
US6703080B2 (en) | 2002-05-20 | 2004-03-09 | Eni Technology, Inc. | Method and apparatus for VHF plasma processing with load mismatch reliability and stability |
JP3635538B2 (en) | 2002-07-05 | 2005-04-06 | 株式会社京三製作所 | DC power supply for plasma generation |
JP3641785B2 (en) * | 2002-08-09 | 2005-04-27 | 株式会社京三製作所 | Power supply for plasma generation |
US7025895B2 (en) * | 2002-08-15 | 2006-04-11 | Hitachi High-Technologies Corporation | Plasma processing apparatus and method |
JP3700785B2 (en) | 2002-12-03 | 2005-09-28 | オリジン電気株式会社 | Power converter |
US6971851B2 (en) * | 2003-03-12 | 2005-12-06 | Florida Turbine Technologies, Inc. | Multi-metered film cooled blade tip |
US7563748B2 (en) | 2003-06-23 | 2009-07-21 | Cognis Ip Management Gmbh | Alcohol alkoxylate carriers for pesticide active ingredients |
US7573000B2 (en) * | 2003-07-11 | 2009-08-11 | Lincoln Global, Inc. | Power source for plasma device |
US7403400B2 (en) | 2003-07-24 | 2008-07-22 | Harman International Industries, Incorporated | Series interleaved boost converter power factor correcting power supply |
KR100807724B1 (en) * | 2003-08-07 | 2008-02-28 | 가부시키가이샤 히다치 고쿠사이 덴키 | Substrate processing apparatus and substrate processing method |
US6992902B2 (en) | 2003-08-21 | 2006-01-31 | Delta Electronics, Inc. | Full bridge converter with ZVS via AC feedback |
US7244343B2 (en) * | 2003-08-28 | 2007-07-17 | Origin Electric Company Limited | Sputtering apparatus |
JP2005086622A (en) * | 2003-09-10 | 2005-03-31 | Nec Engineering Ltd | Electric power synthesizing / distributing unit |
DE10342611A1 (en) * | 2003-09-12 | 2005-04-14 | Hüttinger Elektronik Gmbh + Co. Kg | 90 ° hybrid for splitting or merging high-frequency power |
JP2005092783A (en) | 2003-09-19 | 2005-04-07 | Rohm Co Ltd | Power supply device and electronic apparatus equipped with it |
US7755300B2 (en) * | 2003-09-22 | 2010-07-13 | Mks Instruments, Inc. | Method and apparatus for preventing instabilities in radio-frequency plasma processing |
KR100980598B1 (en) * | 2003-11-27 | 2010-09-07 | 가부시키가이샤 다이헨 | High-Frequency Power Supply System |
US6909617B1 (en) * | 2004-01-22 | 2005-06-21 | La Marche Manufacturing Co. | Zero-voltage-switched, full-bridge, phase-shifted DC-DC converter with improved light/no-load operation |
KR101215551B1 (en) | 2004-03-12 | 2012-12-27 | 엠케이에스 인스트루먼츠, 인코포레이티드 | Control circuit for switching power supply |
CN1906837B (en) | 2004-03-18 | 2011-02-23 | 三井物产株式会社 | DC-DC converter |
CN100589675C (en) | 2004-03-29 | 2010-02-10 | 三菱电机株式会社 | Plasma generation power supply apparatus |
DE102004024805B4 (en) | 2004-05-17 | 2015-11-12 | TRUMPF Hüttinger GmbH + Co. KG | Method and control arrangement for regulating the output power of an RF amplifier arrangement |
US7307475B2 (en) | 2004-05-28 | 2007-12-11 | Ixys Corporation | RF generator with voltage regulator |
US7214934B2 (en) * | 2004-07-22 | 2007-05-08 | Varian Australia Pty Ltd | Radio frequency power generator |
JP4035568B2 (en) * | 2004-11-29 | 2008-01-23 | 株式会社エーイーティー | Atmospheric pressure large area plasma generator |
JP2006165438A (en) * | 2004-12-10 | 2006-06-22 | Nec Tokin Corp | Printed-circuit board |
US7138861B2 (en) * | 2004-12-29 | 2006-11-21 | Telefonaktiebolaget L M Ericsson (Publ) | Load mismatch adaptation in coupler-based amplifiers |
KR101121418B1 (en) | 2005-02-17 | 2012-03-16 | 주성엔지니어링(주) | Plasma generation apparatus comprising toroidal core |
ATE344973T1 (en) | 2005-03-10 | 2006-11-15 | Huettinger Elektronik Gmbh | VACUUM PLASMA GENERATOR |
US6996892B1 (en) * | 2005-03-24 | 2006-02-14 | Rf Micro Devices, Inc. | Circuit board embedded inductor |
US7173467B2 (en) | 2005-03-31 | 2007-02-06 | Chang Gung University | Modified high-efficiency phase shift modulation method |
JP2006296032A (en) * | 2005-04-07 | 2006-10-26 | Sumitomo Electric Ind Ltd | Power converter |
US7477711B2 (en) * | 2005-05-19 | 2009-01-13 | Mks Instruments, Inc. | Synchronous undersampling for high-frequency voltage and current measurements |
DE102005046921A1 (en) * | 2005-09-30 | 2007-04-12 | Siemens Ag | Circuit arrangement for monitoring a load current using emissions from a semiconductor component |
DE502005003768D1 (en) | 2005-10-17 | 2008-05-29 | Huettinger Elektronik Gmbh | RF plasma supply device |
JP2007124007A (en) * | 2005-10-25 | 2007-05-17 | Sumitomo Electric Ind Ltd | Power converter and voltage control method |
US7353771B2 (en) * | 2005-11-07 | 2008-04-08 | Mks Instruments, Inc. | Method and apparatus of providing power to ignite and sustain a plasma in a reactive gas generator |
JP2007151331A (en) * | 2005-11-29 | 2007-06-14 | Mitsubishi Electric Corp | Power conversion device |
US7679341B2 (en) | 2007-12-12 | 2010-03-16 | Monolithic Power Systems, Inc. | External control mode step down switching regulator |
CN101488712B (en) | 2008-01-15 | 2011-01-26 | 天钰科技股份有限公司 | Voltage converter |
JP5749020B2 (en) * | 2008-01-31 | 2015-07-15 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | Apparatus for coupling RF power to a plasma chamber |
US7872523B2 (en) | 2008-07-01 | 2011-01-18 | Mks Instruments, Inc. | Radio frequency (RF) envelope pulsing using phase switching of switch-mode power amplifiers |
-
2007
- 2007-10-04 JP JP2010517262A patent/JP5606312B2/en not_active Expired - Fee Related
- 2007-10-04 DE DE112007003667T patent/DE112007003667A5/en not_active Withdrawn
- 2007-10-04 EP EP07817617.9A patent/EP2097920B1/en active Active
- 2007-10-04 WO PCT/DE2007/001775 patent/WO2009012735A1/en active Application Filing
- 2007-12-20 AT AT07856986T patent/ATE497251T1/en active
- 2007-12-20 DE DE502007006404T patent/DE502007006404D1/en active Active
- 2007-12-20 WO PCT/EP2007/011263 patent/WO2009012803A1/en active Application Filing
- 2007-12-20 EP EP07856986A patent/EP2174339B1/en not_active Not-in-force
- 2007-12-20 DE DE112007003213.8T patent/DE112007003213B4/en not_active Expired - Fee Related
- 2007-12-20 WO PCT/EP2007/011264 patent/WO2009012804A1/en active Application Filing
-
2008
- 2008-04-03 EP EP08748861A patent/EP2097921B1/en active Active
- 2008-04-03 JP JP2010517277A patent/JP5371978B2/en active Active
- 2008-04-03 WO PCT/EP2008/002657 patent/WO2009012825A1/en active Application Filing
- 2008-04-03 WO PCT/EP2008/002660 patent/WO2009012826A1/en active Application Filing
- 2008-04-03 DE DE112008000106.5T patent/DE112008000106B4/en active Active
- 2008-06-11 WO PCT/EP2008/004650 patent/WO2009012848A1/en active Application Filing
- 2008-06-11 WO PCT/EP2008/004651 patent/WO2009012849A1/en active Application Filing
- 2008-06-11 DE DE112008000092.1T patent/DE112008000092B4/en active Active
- 2008-06-11 DE DE112008000105.7T patent/DE112008000105B4/en not_active Expired - Fee Related
- 2008-06-27 DE DE112008000115.4T patent/DE112008000115B4/en active Active
- 2008-06-27 WO PCT/EP2008/005241 patent/WO2009012863A1/en active Application Filing
- 2008-06-30 EP EP08784577A patent/EP2174337B1/en active Active
- 2008-06-30 AT AT08784577T patent/ATE545945T1/en active
- 2008-06-30 WO PCT/EP2008/005314 patent/WO2009012867A2/en active Application Filing
- 2008-06-30 DE DE112008000107T patent/DE112008000107A5/en not_active Withdrawn
- 2008-06-30 WO PCT/EP2008/005313 patent/WO2009012866A1/en active Application Filing
- 2008-06-30 WO PCT/EP2008/005318 patent/WO2009012868A1/en active Application Filing
- 2008-06-30 DE DE112008000120.0T patent/DE112008000120B4/en active Active
- 2008-07-02 US US12/166,963 patent/US8129653B2/en active Active
- 2008-07-22 JP JP2010517313A patent/JP5631208B2/en active Active
- 2008-07-22 US US12/177,818 patent/US8222885B2/en active Active
- 2008-07-22 EP EP12004116A patent/EP2511940A3/en not_active Withdrawn
- 2008-07-22 DE DE112008000104.9T patent/DE112008000104B4/en active Active
- 2008-07-22 DE DE112008000095.6T patent/DE112008000095B4/en active Active
- 2008-07-22 WO PCT/EP2008/005992 patent/WO2009012974A1/en active Application Filing
- 2008-07-22 US US12/177,809 patent/US8466622B2/en not_active Expired - Fee Related
- 2008-07-22 WO PCT/EP2008/005991 patent/WO2009012973A2/en active Application Filing
- 2008-07-22 WO PCT/EP2008/005987 patent/WO2009012969A2/en active Application Filing
- 2008-07-22 EP EP08784945A patent/EP2174338B1/en active Active
- 2008-07-22 WO PCT/EP2008/005980 patent/WO2009012966A1/en active Application Filing
- 2008-07-23 US US12/178,372 patent/US8357874B2/en active Active
- 2008-07-23 US US12/178,414 patent/US8154897B2/en active Active
-
2010
- 2010-01-11 US US12/685,142 patent/US8436543B2/en active Active
- 2010-01-12 US US12/686,023 patent/US8421377B2/en active Active
- 2010-01-14 US US12/687,483 patent/US8482205B2/en active Active
- 2010-01-22 US US12/692,246 patent/US8643279B2/en active Active
-
2013
- 2013-03-21 US US13/848,319 patent/US8866400B2/en active Active
-
2014
- 2014-01-14 US US14/154,400 patent/US20140125315A1/en not_active Abandoned
Patent Citations (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5195045A (en) * | 1991-02-27 | 1993-03-16 | Astec America, Inc. | Automatic impedance matching apparatus and method |
US5345145A (en) * | 1992-03-31 | 1994-09-06 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus for generating highly dense uniform plasma in a high frequency electric field |
US6794301B2 (en) * | 1995-10-13 | 2004-09-21 | Mattson Technology, Inc. | Pulsed plasma processing of semiconductor substrates |
US5689215A (en) * | 1996-05-23 | 1997-11-18 | Lam Research Corporation | Method of and apparatus for controlling reactive impedances of a matching network connected between an RF source and an RF plasma processor |
US5869817A (en) * | 1997-03-06 | 1999-02-09 | General Mills, Inc. | Tunable cavity microwave applicator |
US6313584B1 (en) * | 1998-09-17 | 2001-11-06 | Tokyo Electron Limited | Electrical impedance matching system and method |
US6160449A (en) * | 1999-07-22 | 2000-12-12 | Motorola, Inc. | Power amplifying circuit with load adjust for control of adjacent and alternate channel power |
US6166598A (en) * | 1999-07-22 | 2000-12-26 | Motorola, Inc. | Power amplifying circuit with supply adjust to control adjacent and alternate channel power |
US6456010B2 (en) * | 2000-03-13 | 2002-09-24 | Mitsubishi Heavy Industries, Ltd. | Discharge plasma generating method, discharge plasma generating apparatus, semiconductor device fabrication method, and semiconductor device fabrication apparatus |
US20050136604A1 (en) * | 2000-08-10 | 2005-06-23 | Amir Al-Bayati | Semiconductor on insulator vertical transistor fabrication and doping process |
US7294563B2 (en) * | 2000-08-10 | 2007-11-13 | Applied Materials, Inc. | Semiconductor on insulator vertical transistor fabrication and doping process |
US7320734B2 (en) * | 2000-08-11 | 2008-01-22 | Applied Materials, Inc. | Plasma immersion ion implantation system including a plasma source having low dissociation and low minimum plasma voltage |
US6494986B1 (en) * | 2000-08-11 | 2002-12-17 | Applied Materials, Inc. | Externally excited multiple torroidal plasma source |
US7037813B2 (en) * | 2000-08-11 | 2006-05-02 | Applied Materials, Inc. | Plasma immersion ion implantation process using a capacitively coupled plasma source having low dissociation and low minimum plasma voltage |
US6741446B2 (en) * | 2001-03-30 | 2004-05-25 | Lam Research Corporation | Vacuum plasma processor and method of operating same |
US20020171411A1 (en) * | 2001-04-06 | 2002-11-21 | Nasman Kevin P. | Reflection coefficient phase detector |
US6657394B2 (en) * | 2001-04-06 | 2003-12-02 | Eni Technology, Inc. | Reflection coefficient phase detector |
US6946847B2 (en) * | 2002-02-08 | 2005-09-20 | Daihen Corporation | Impedance matching device provided with reactance-impedance table |
US20090026968A1 (en) * | 2007-07-23 | 2009-01-29 | Huettinger Elektronik Gmbh + Co. Kg | Plasma supply device |
US20100170640A1 (en) * | 2007-07-23 | 2010-07-08 | Huettinger Elektronik Gmbh + Co. Kg | Determining high frequency operating parameters in a plasma system |
US20100171427A1 (en) * | 2007-07-23 | 2010-07-08 | Huettinger Elektronik Gmbh + Co. Kg | Protecting High-Frequency Amplifers |
US8643279B2 (en) * | 2007-07-23 | 2014-02-04 | Huettinger Elektronik Gmbh + Co. Kg | Determining high frequency operating parameters in a plasma system |
US20110006687A1 (en) * | 2007-11-14 | 2011-01-13 | Aurion Anlagentechnik Gmbh | Method and generator circuit for production of plasma by means of radio-frequency excitation |
US20120319584A1 (en) * | 2010-08-29 | 2012-12-20 | Advanced Energy Industries, Inc. | Method of controlling the switched mode ion energy distribution system |
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