US20140034281A1 - Heat dissipation mechanism - Google Patents
Heat dissipation mechanism Download PDFInfo
- Publication number
- US20140034281A1 US20140034281A1 US13/731,267 US201213731267A US2014034281A1 US 20140034281 A1 US20140034281 A1 US 20140034281A1 US 201213731267 A US201213731267 A US 201213731267A US 2014034281 A1 US2014034281 A1 US 2014034281A1
- Authority
- US
- United States
- Prior art keywords
- main
- sub
- casing
- casings
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Definitions
- the present invention relates to a heat dissipation mechanism, and in particular, relates to a heat dissipation mechanism for a stacking system.
- the present invention provides a heat dissipation mechanism, comprising a main casing, an air exhaust device, and at least a first sub-casing.
- the main casing includes an opening, an air outlet and a main joining portion.
- the air exhaust device is disposed in the main casing to exhaust air through the air outlet from the main casing.
- the first sub-casing includes a first through hole and a first joining portion, wherein the first through hole communicates with the opening and the first joining portion engages with the main connecting portion, so as to fix the first sub-casing to the main casing.
- FIGS. 1 a and 1 b is a schematic view showing a main casing of a heat dissipation mechanism according to an embodiment of the invention
- FIGS. 2 a and 2 b is a schematic view showing a first sub-casing of a heat dissipation mechanism according to an embodiment of the invention
- FIG. 3 is a schematic view of a heat dissipation mechanism according to an embodiment of the invention.
- FIG. 4 is a schematic view of a heat dissipation mechanism according to another embodiment
- FIG. 5 is a schematic view of a heat dissipation mechanism according to another embodiment of the invention t;
- FIG. 6 is a schematic view of a heat dissipation mechanism according to another embodiment of the invention.
- FIG. 7 is a schematic view of a heat dissipation mechanism according to another embodiment of the invention.
- FIG. 8 is a schematic view of a heat dissipation mechanism according to another embodiment of the invention.
- FIG. 9 is a schematic view of a heat dissipation mechanism according to another embodiment of the invention.
- FIG. 10 is a schematic view of a main casing of a heat dissipation mechanism according to another embodiment of the invention.
- FIG. 11 is a schematic view showing an of a heat dissipation mechanism according to an embodiment of the invention.
- an embodiment of a heat dissipation mechanism ( FIG. 3 ) comprises a main casing 1 and a first sub-casing 2 .
- the main casing 1 comprises an opening 10 , an air outlet 5 and a main joining portion 11 .
- the main joining portion 11 projects from a surface of the main casing 1
- an air exhaust device 4 is disposed in the main casing 1 .
- the air exhaust device 4 may include a fan for exhausting air in the main casing 1 through the air outlet 5 , wherein an electronic component such as a graphics processing unit may also be disposed in the main casing 1 .
- the first sub-casing 2 comprises a first through hole 20 and a first joining portion 21 , wherein the first joining portion 21 may be a recess formed on a surface of the first sub-casing 2 .
- the main casing 1 when the main casing 1 is engaged with the first sub-casing 2 , the main joining portion 11 is engaged with the first joining portion 21 , and the first through hole 20 is communicated with the opening 10 .
- the fan 4 drives air from the first through hole 20 , through the first sub-casing 2 and the main casing 1 for heat dissipation. Subsequently, air is exhausted by the fan 4 through an air outlet 5 on the top side of the main casing 1 .
- the air outlet 5 may also be disposed on other sides of the main casing 1 .
- FIG. 4 another embodiment of a heat dissipation mechanism comprises a main casing 1 and two first sub-casings 2 .
- the main casing 1 comprises two openings 10 and two main joining portions 11 , wherein the openings 10 and the main joining portions 11 are respectively disposed on opposite sides of the main casing 1 .
- the two first sub-casings 2 are disposed on opposite sides of the main casing 1 , wherein the two first joining portions 21 of the first sub-casings 2 are respectively engaged with the two main joining portions 11 , and the two first through holes 20 are respectively communicated with the two openings 10 .
- the fan 4 can inhales air from the first through holes 20 for dissipating the heat inside of the two first sub-casings 2 , and air can be exhausted through an air outlet 5 on the top side of the main casing 1 by the fan 4 .
- the first sub-casing 2 has a hollow first joining portion 21 and a protruding second joining portion 22 , and the first joining portion 21 and the second joining portion 22 are disposed on opposite sides thereof
- the second sub-casing 3 has a second through hole 30 and a hollow third joining portion 31 .
- the main casing 1 , the first sub-casing 2 , and the second sub-casing 3 can be assembled, wherein the main joining portion 11 engages with the first joining portion 21 , the second joining portion 22 engages with the third joining portion 31 , and the first through hole 20 communicates with the opening 10 and the second through hole 30 .
- the fan 4 can inhale air from the second through hole 30 and dissipate heat sequentially through the second sub-casing 3 , the first sub-casing 2 , and the main casing 1 . Subsequently, air is exhausted through an air outlet 5 on the top side of the main casing 1 by the fan 4 (as arrows indicate shown in FIG. 5 ).
- a first joining portion 21 and a second first joining portion 22 are respectively disposed on the right and left sides of the first sub-casing 2 .
- the main joining portion 11 is engaged with the first joining portion 21
- the second joining portion 22 is engaged with the main joining portion 11 ′
- all the openings 10 of the main casings 1 are communicated with the first through hole 20 of the first sub-casing 2 .
- two fans 4 in the main casings 1 can inhale air from the opening 10 on the right side of the main casing 1 and dissipate heat through the air outlets 5 .
- Two protruding hollow main joining portions 11 are respectively formed on the opposite sides of the left main casing 1 .
- the right main casing has a main joining portion 11 and a main portion 11 ′ on opposite sides thereof for engagement with the left main casing 1 .
- the first joining portions 21 are respectively formed on the two first sub-casings, and the first joining portions 21 are corresponding to the main joining portions 11 .
- the main casings 1 can be connected to each other and the first sub-casings 2 can be disposed on opposite sides of the two main casings 1 and respectively engaged therewith.
- air can enter the heat dissipation mechanism through the first through hole 20 , dissipating heat inside of the two main casings 1 and the first sub-casings 2 . Subsequently, air can be exhausted through air outlets 5 on the top sides by the two fans 4 .
- the two main casings 1 are respectively disposed on opposite sides of the two sub-casings 2 and engaged with the first sub-casings 2 .
- two air inlets 60 are respectively disposed on the two first sub-casings 2 , and air can enter the heat dissipation mechanism through the two openings 10 and the air inlets 60 for dissipating heat in the first sub-casings 2 . Subsequently, air may be exhausted through the air outlets 5 on the top side of the two main casings 1 by the fans 4 .
- air can enter the heat dissipation mechanism through the first through hole 20 or the air inlets 60 .
- air flows through the first sub-casing 2 and main casing 1 , and can be exhausted through air outlets 5 on the top side of the two main casings 1 by the fans 4 .
- a main casing 1 may comprise two fans 4 for increasing the quantity of air flow.
- a meshed structure 70 may be disposed on the opening 10 of the main casing 1 , and the ventilation area ratio of the meshed structure 70 ranges from 30% ⁇ 50%.
- the meshed structure 70 may also be disposed on the first through hole 20 of the first sub-casing 2 or the second through hole 30 of the second sub-casing 3 for preventing damage of the fan 4 due to unexpected impact from external objects.
- the heat dissipation mechanism can form a flow channel by engaging the main casing with the sub-casing, so as to rapidly dissipate heat and improve cooling efficiency of a stacking system.
Abstract
A heat dissipation mechanism is provided, comprising a main casing, an air exhaust device and a first sub-casing. The main casing includes an opening, an air outlet and a main joining portion. The air exhaust device is disposed in the main casing to exhaust air through the air outlet from the main casing. The first sub-casing includes a first through hole and a first joining portion, wherein the first through hole communicates with the opening, and the first joining portion engages with the main connecting portion, so as to fix the first sub-casing to the main casing.
Description
- This Application claims priority of Taiwan Patent Application No. 101215052, filed on Aug. 6, 2012, the entirety of which is incorporated by reference herein.
- 1. Field of the Invention
- The present invention relates to a heat dissipation mechanism, and in particular, relates to a heat dissipation mechanism for a stacking system.
- 2. Description of the Related Art
- Various external components such as a graphics processing units, memories, and hard disks can be connected to traditional notebook computers due to their compact dimensions. However, the external components all need heat dissipation devices, which increase production costs. Thus, decreasing the cost of heat dissipation devices, while maintaining efficiency has become an important issue in the field.
- The present invention provides a heat dissipation mechanism, comprising a main casing, an air exhaust device, and at least a first sub-casing. The main casing includes an opening, an air outlet and a main joining portion. The air exhaust device is disposed in the main casing to exhaust air through the air outlet from the main casing. The first sub-casing includes a first through hole and a first joining portion, wherein the first through hole communicates with the opening and the first joining portion engages with the main connecting portion, so as to fix the first sub-casing to the main casing.
- The present invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:
-
FIGS. 1 a and 1 b is a schematic view showing a main casing of a heat dissipation mechanism according to an embodiment of the invention; -
FIGS. 2 a and 2 b is a schematic view showing a first sub-casing of a heat dissipation mechanism according to an embodiment of the invention; -
FIG. 3 is a schematic view of a heat dissipation mechanism according to an embodiment of the invention; -
FIG. 4 is a schematic view of a heat dissipation mechanism according to another embodiment; -
FIG. 5 is a schematic view of a heat dissipation mechanism according to another embodiment of the invention t; -
FIG. 6 is a schematic view of a heat dissipation mechanism according to another embodiment of the invention; -
FIG. 7 is a schematic view of a heat dissipation mechanism according to another embodiment of the invention; -
FIG. 8 is a schematic view of a heat dissipation mechanism according to another embodiment of the invention; -
FIG. 9 is a schematic view of a heat dissipation mechanism according to another embodiment of the invention; -
FIG. 10 is a schematic view of a main casing of a heat dissipation mechanism according to another embodiment of the invention; and -
FIG. 11 is a schematic view showing an of a heat dissipation mechanism according to an embodiment of the invention; - Referring to
FIG. 1 a to 3, an embodiment of a heat dissipation mechanism (FIG. 3 ) comprises a main casing 1 and afirst sub-casing 2. As shown inFIGS. 1 a and 1 b, the main casing 1 comprises anopening 10, anair outlet 5 and a main joiningportion 11. The main joiningportion 11 projects from a surface of the main casing 1, and anair exhaust device 4 is disposed in the main casing 1. In this embodiment, theair exhaust device 4 may include a fan for exhausting air in the main casing 1 through theair outlet 5, wherein an electronic component such as a graphics processing unit may also be disposed in the main casing 1. As shown inFIGS. 2 a and 2 b, thefirst sub-casing 2 comprises a first throughhole 20 and a first joiningportion 21, wherein the first joiningportion 21 may be a recess formed on a surface of thefirst sub-casing 2. - Referring to
FIG. 3 , when the main casing 1 is engaged with thefirst sub-casing 2, the main joiningportion 11 is engaged with the first joiningportion 21, and the first throughhole 20 is communicated with the opening 10. As the arrows indicate inFIG. 3 , as the main casing 1 is engaged with thefirst sub-casing 2, thefan 4 drives air from the first throughhole 20, through thefirst sub-casing 2 and the main casing 1 for heat dissipation. Subsequently, air is exhausted by thefan 4 through anair outlet 5 on the top side of the main casing 1. In some embodiments, theair outlet 5 may also be disposed on other sides of the main casing 1. - Referring to
FIG. 4 , another embodiment of a heat dissipation mechanism comprises a main casing 1 and twofirst sub-casings 2. As shown inFIG. 4 , the main casing 1 comprises twoopenings 10 and two main joiningportions 11, wherein theopenings 10 and the main joiningportions 11 are respectively disposed on opposite sides of the main casing 1. When the main casing 1 is engaged with thefirst sub-casings 2, the twofirst sub-casings 2 are disposed on opposite sides of the main casing 1, wherein the two first joiningportions 21 of thefirst sub-casings 2 are respectively engaged with the two main joiningportions 11, and the two first throughholes 20 are respectively communicated with the twoopenings 10. After assembly, thefan 4 can inhales air from the first throughholes 20 for dissipating the heat inside of the twofirst sub-casings 2, and air can be exhausted through anair outlet 5 on the top side of the main casing 1 by thefan 4. - Referring to
FIG. 5 , another embodiment of a heat dissipation mechanism comprises a main casing 1, afirst sub-casing 2, and asecond sub-casing 3. Thefirst sub-casing 2 has a hollow first joiningportion 21 and a protruding second joiningportion 22, and the first joiningportion 21 and the second joiningportion 22 are disposed on opposite sides thereof As shown inFIG. 5 , thesecond sub-casing 3 has a second throughhole 30 and a hollow third joiningportion 31. The main casing 1, thefirst sub-casing 2, and thesecond sub-casing 3 can be assembled, wherein the main joiningportion 11 engages with the first joiningportion 21, the second joiningportion 22 engages with the third joiningportion 31, and the first throughhole 20 communicates with the opening 10 and the second throughhole 30. As a result, thefan 4 can inhale air from the second throughhole 30 and dissipate heat sequentially through thesecond sub-casing 3, thefirst sub-casing 2, and the main casing 1. Subsequently, air is exhausted through anair outlet 5 on the top side of the main casing 1 by the fan 4 (as arrows indicate shown inFIG. 5 ). - Referring to
FIG. 6 , another embodiment of a heat dissipation mechanism comprises two main casings 1 and afirst sub-casing 2, wherein the main casing 1 on the right side of thefirst sub-casing 2 has a hollow main joiningportion 11′ and twoopenings 10, and the main casing 1 on the left side of thefirst sub-casing 2 has a protruding main joiningportion 11 and anopening 10. In this embodiment, a first joiningportion 21 and a second first joiningportion 22 are respectively disposed on the right and left sides of thefirst sub-casing 2. When thefirst sub-casing 2 is connected to the two main casings 1, the main joiningportion 11 is engaged with the first joiningportion 21, the second joiningportion 22 is engaged with the main joiningportion 11′, and all theopenings 10 of the main casings 1 are communicated with the first throughhole 20 of thefirst sub-casing 2. After assembly, twofans 4 in the main casings 1 can inhale air from the opening 10 on the right side of the main casing 1 and dissipate heat through theair outlets 5. - Referring to
FIG. 7 , another embodiment of a heat dissipation mechanism comprises two main casings 1 and twofirst sub-casings 2. Two protruding hollow main joiningportions 11 are respectively formed on the opposite sides of the left main casing 1. The right main casing has a main joiningportion 11 and amain portion 11′ on opposite sides thereof for engagement with the left main casing 1. The first joiningportions 21 are respectively formed on the two first sub-casings, and the first joiningportions 21 are corresponding to the main joiningportions 11. As shown inFIG. 7 , the main casings 1 can be connected to each other and thefirst sub-casings 2 can be disposed on opposite sides of the two main casings 1 and respectively engaged therewith. Thus, air can enter the heat dissipation mechanism through the first throughhole 20, dissipating heat inside of the two main casings 1 and thefirst sub-casings 2. Subsequently, air can be exhausted throughair outlets 5 on the top sides by the twofans 4. - Referring to
FIG. 8 , another embodiment of a heat dissipation mechanism comprises two main casings 1 and twofirst sub-casings 2, wherein the twofirst sub-casings 2 are connected to each other. The two main casings 1 are respectively disposed on opposite sides of the twosub-casings 2 and engaged with thefirst sub-casings 2. In this embodiment, twoair inlets 60 are respectively disposed on the twofirst sub-casings 2, and air can enter the heat dissipation mechanism through the twoopenings 10 and theair inlets 60 for dissipating heat in thefirst sub-casings 2. Subsequently, air may be exhausted through theair outlets 5 on the top side of the two main casings 1 by thefans 4. - Referring to
FIG. 9 , another embodiment of a heat dissipation mechanism comprises two main casings 1 and twofirst sub-casings 2, wherein the main casings 1 andfirst sub-casings 2 are connected to each other and arranged in a staggered manner. In this embodiment, air can enter the heat dissipation mechanism through the first throughhole 20 or theair inlets 60. Subsequently, air flows through thefirst sub-casing 2 and main casing 1, and can be exhausted throughair outlets 5 on the top side of the two main casings 1 by thefans 4. - Referring to
FIG. 10 , another embodiment of a main casing 1 may comprise twofans 4 for increasing the quantity of air flow. As shown inFIG. 11 , ameshed structure 70 may be disposed on theopening 10 of the main casing 1, and the ventilation area ratio of the meshedstructure 70 ranges from 30%˜50%. However, themeshed structure 70 may also be disposed on the first throughhole 20 of thefirst sub-casing 2 or the second throughhole 30 of thesecond sub-casing 3 for preventing damage of thefan 4 due to unexpected impact from external objects. - Specifically, when the main joining
portions portion 21, the second joiningportion 22, and the third joiningportion 31 are engaged with each other, the mechanical strength between the casings is improved, and electrical signals can be transmitted between the electronic components in the casings through the joining portions. Thus, the heat dissipation mechanism can form a flow channel by engaging the main casing with the sub-casing, so as to rapidly dissipate heat and improve cooling efficiency of a stacking system. - While the invention has been described by way of example and in terms of the preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
Claims (10)
1. A heat dissipation mechanism is provided, comprising:
a main casing, including an opening, an air outlet and a main joining portion;
an air exhaust device, disposed in the main casing to exhaust air through the air outlet from the main casing; and
at least a first sub-casing, including a first through hole and a first joining portion, wherein the first through hole communicates with the opening, and the first joining portion engages with the main connecting portion, so as to fix the first sub-casing to the main casing .
2. The heat dissipation mechanism as claimed in claim 1 , wherein the heat dissipation mechanism further comprises two first sub-casings, and the main casing further comprises two openings and two main joining portions,
wherein the first sub-casings are respectively disposed on opposite sides of the main casing, the first joining portions of the first sub-casings are respectively engaged with the main joining portions, and the first through holes are respectively communicated with the openings.
3. The heat dissipation mechanism as claimed in claim 1 , wherein the heat dissipation mechanism further comprises a second sub-casing and the first sub-casing further comprises a second joining portion, and the first and second joining portions are respectively disposed on opposite sides of the first sub-casing, and the second sub-casing includes a second through hole and a third joining portion, wherein the second through hole communicates with the first through hole, and the third joining portion engages with the second joining portion.
4. The heat dissipation mechanism as claimed in claim 1 , wherein the heat dissipation mechanism further comprises two main casings, and one of the main casings comprises two openings, and the first sub-casing joining portions are respectively disposed on opposite sides of the first sub-casing and respectively engaged with the main casings, and the openings are communicated with the first through hole.
5. The heat dissipation mechanism as claimed in claim 1 , wherein the heat dissipation mechanism further comprises two main casings and two first sub-casings, the main casings are engaged with each other, and the first sub-casings are disposed on opposite sides of the main casings.
6. The heat dissipation mechanism as claimed in claim 1 , wherein the heat dissipation mechanism further comprises two main casings and two first sub-casings, the first sub-casings are engaged with each other, and the main casings are disposed on opposite sides of the first sub-casings.
7. The heat dissipation mechanism as claimed in claim 1 , wherein the heat dissipation mechanism further comprises two main casings and two first sub-casings engaged with each other and arranged in a staggered manner.
8. The heat dissipation mechanism as claimed in claim 1 , wherein the main joining portion is engaged with and electrically connected to the first joining portion.
9. The heat dissipation mechanism as claimed in claim 1 , wherein the first sub-casing further comprises an air inlet, and air flows into the first sub-casing through the air inlet.
10. The heat dissipation mechanism as claimed in claim 1 , wherein the main casing further comprises a meshed structure, disposed in the opening, and the ventilation area ratio ranges from 30%˜50%.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101215052U TWM445207U (en) | 2012-08-06 | 2012-08-06 | Heat dissipation mechanism |
TW101215052 | 2012-08-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20140034281A1 true US20140034281A1 (en) | 2014-02-06 |
Family
ID=48090896
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/731,267 Abandoned US20140034281A1 (en) | 2012-08-06 | 2012-12-31 | Heat dissipation mechanism |
Country Status (3)
Country | Link |
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US (1) | US20140034281A1 (en) |
EP (1) | EP2696258A1 (en) |
TW (1) | TWM445207U (en) |
Cited By (1)
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---|---|---|---|---|
US20180085671A1 (en) * | 2015-02-27 | 2018-03-29 | Sony Interactive Entertainment Inc. | Information processing apparatus |
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2013
- 2013-01-24 EP EP13152521.4A patent/EP2696258A1/en not_active Withdrawn
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Also Published As
Publication number | Publication date |
---|---|
TWM445207U (en) | 2013-01-11 |
EP2696258A1 (en) | 2014-02-12 |
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