US20130202134A1 - Systems and methods for improved acousto-haptic speakers - Google Patents
Systems and methods for improved acousto-haptic speakers Download PDFInfo
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- US20130202134A1 US20130202134A1 US13/646,218 US201213646218A US2013202134A1 US 20130202134 A1 US20130202134 A1 US 20130202134A1 US 201213646218 A US201213646218 A US 201213646218A US 2013202134 A1 US2013202134 A1 US 2013202134A1
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- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
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- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2807—Enclosures comprising vibrating or resonating arrangements
- H04R1/2811—Enclosures comprising vibrating or resonating arrangements for loudspeaker transducers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R3/00—Circuits for transducers, loudspeakers or microphones
- H04R3/12—Circuits for transducers, loudspeakers or microphones for distributing signals to two or more loudspeakers
- H04R3/14—Cross-over networks
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- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
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- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
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Abstract
The systems and methods described herein relate to, among other things, a transducer capable of producing acoustic and tactile stimulation. The transducer includes a rigid mass element disposed on the diaphragm of a speaker. The mass element may optionally be removable and may have a mass selected such that the resonant frequency of the transducer falls within the range of frequencies present in an input electrical audio signal. The systems and methods advantageously benefits from both the fidelity and audio performance of a full-range speaker while simultaneously producing high-fidelity, adjustable and palpable haptic vibrations.
Description
- This application claims the benefit of U.S. Provisional Application 61/626,891 filed Oct. 5, 2011, and U.S. Provisional Application 61/743,516 filed Sep. 5, 2012, the contents of each of which incorporated by reference herein in its entirety.
- The systems and methods described herein relates in general to acoustic and tactile transducer systems, and methods for driving the same.
- Today there is an increasing need to supplement multimedia systems, that present audio and visual data to a user, with additional sensory stimuli. Multimedia systems such as televisions, portable devices, and video games are being enhanced through the introduction of improved screens and network capabilities. In addition to these more traditional areas of improving user experience, another area of consideration is tactile stimulation. In combination with improved audio and visual effects, tactile stimulation can make a game or movie experience much more realistic and memorable.
- Currently, there exists devices such as piezo-electric transducers that are capable of specifically providing tactile stimulation. These devices have to be controlled by a driver that is separate from the driver used to control audio or visual output. Thus, not only are they separate from audio speakers, they also require additional components for synchronized operation with the rest of the multimedia system.
- There are several other types of devices such as bass shakers and multifunction transducers that provide palpable vibrations while also processing audio signals and generating sound. The bass shaker converts the bass component of an electric audio input into vibrations. Bass shakers are driven by a very low frequency signal that causes the device to resonate and thereby generate these palpable vibrations. However, these bass shakers have poor damping characteristics, resulting in lingering vibrations even after the audio/visual data has ended.
- Another device that has gained some popularity in providing both audio and tactile stimulation is a multifunction transducer (MFT). MFTs comprise a speaker cone connected to a voice coil, and a magnetic assembly that provides a magnetic field in which the coil operates. Unlike regular speakers, both the voice coil and the magnetic assembly are resiliently mounted and capable of oscillating. The magnetic assembly and the speaker cone can be driven to oscillate by applying signals to the voice coil. The magnetic assembly owing to its mass and compliance of its mounting will oscillate at a relatively low frequency within the range of frequencies that are easily perceptible to a user. Although, MFT's provide both audio and tactile stimulation, their resonant frequencies are predetermined and difficult to modify without completely disassembling them.
- Accordingly, a need exists for systems and methods that improve the user's interaction with the content being presented. It is desirable that the system does not distract from the content being presented. It is also desirable that the system be easy to use, portable, inexpensive, and suitable for long term use.
- As noted above there exists systems for providing both audio and tactile stimulations. However, these existing systems cannot mimic the fidelity and audio performance of a full-range speaker while simultaneously producing high-fidelity and adjustable vibrations. The systems and methods described herein provide for such an acoustic and tactile transducer. In particular, the acousto-haptic transducer described herein may comprise a mass element disposed on the diaphragm of a speaker such as a full-range speaker. The mass element may optionally be removable and may have a mass selected such that the resonant frequency of the transducer falls within the range of frequencies present in an input electrical audio signal. The mass element may be attached to the diaphragm via a holder. The holder and the mass element may also be configured so as to avoid contact with the center region of the diaphragm and allow for sound to pass through from the center of the speaker. The acousto-haptic transducer may comprise an echo chamber formed near the diaphragam for enhancing and/or amplifying the haptic signal. The echo chamber may be formed in the region enclosing the diaphragm and an additional semi-rigid diaphragm attached to the voice coil. The acousto-haptic transducer may comprise a rotation assembly for allowing the transducer to rotate and move or pivot freely when placed on the user. Such a rotation assembly may include a ball and socket mechanism. The system may further comprise a controller for splitting an electrical audio signal into a high and low frequency portion and amplifying the low frequency portion. During operation, the amplified low frequency portion of the input audio signal may overlap with the resonant frequency of the transducer and cause it to vibrate while being damped by the full-range speaker's spider.
- In particular, in one aspect, the systems and methods described herein include a transducer capable of generating acoustic and haptic signals. The transducer may comprise a speaker, including a diaphragm, configured to transform an electrical signal having audio information in a first range of frequencies, into an acoustic signal. The transducer may further comprise a mass element attached to the center region of the diaphragm and an echo chamber formed adjacent to the diaphragm. In certain embodiments, the mass of the mass element is selected such that a portion of a resonant frequency range of the combination of the speaker and the mass element falls within the first range of frequencies. The resonant frequency range may be from 50 to 4000 Hz. The mass element may be removably attached to the diaphragm. In certain embodiments, the mass element is glued to the center region of the diaphragm.
- The mass element may be formed from a rigid material having a mass in the range of about 1 g to 4 g. The mass element may be formed from copper and may optionally be disk-shaped. In certain embodiments, the ratio of surface area of the top surface of the diaphragm to the surface area of the top surface of the mass element is about 4:1. The transducer may further include a holder attached to the diaphragm for holding the mass element. In certain embodiments, the transducer includes a plurality of mass elements removably stacked on top of each other.
- The transducer, and more particularly the speaker may further include a voice coil attached to a diaphragm for receiving the electrical signal and moving the diaphragm in response to the electrical signal, and a spider attached to the voice coil for damping oscillations of the voice coil, the diaphragm and the mass element. In certain embodiments, the diaphragm is substantially rigid and the speaker further comprises a semi-rigid diaphragm. The semi-rigid diaphragm may be attached to the voice coil and the rigid diaphragm, such that the echo chamber is formed in the region enclosed by the semi-rigid diaphragm and the rigid diaphragm. The rigid diaphragm may be cone-shaped and the semi-rigid diaphragm may be substantially hemispherical shaped.
- The speaker may be a full-range speaker. In certain embodiments, the transducer may include a housing having a cap such that the speaker and mass element are disposed within the housing. In such embodiments, the diaphragm is capable of moving up to a maximum height within the housing, and wherein the mass element has a height selected such that when the diaphragm has moved up to the maximum height, the mass element is within the housing and below the cap.
- In certain embodiments, the transducer includes comprising a controller connected to a source of the electrical signal and the speaker for splitting the electrical signal and driving the speaker and the mass element with at least one of a signal containing information in the audible frequencies, and a signal containing information in the haptic frequencies. In such embodiments, the controller is configured to amplify the signal containing information in the haptic frequencies.
- In another aspect, the systems and methods described herein may include a transducer capable of generating acoustic and tactile signals from an electrical signal having audio information. The transducer may comprise a commercially-available speaker, having a voice coil and a diaphragm disposed within a housing, capable of generating an acoustic signals from electrical signals having audio information within a first range of frequencies. The transducer may also comprise a mass element coupled to at least one of the voice coil and the diaphragm, and an echo chamber formed between the diaphragm and the voice coil. The mass element may be selected such that the transducer has a resonant frequency that falls within the first range of frequencies.
- In yet another aspect, the systems and methods described herein may include a system of generating acoustic and tactile signals from an electrical signal having audio information. The system may include a transducer, and a controller. The transducer may include a voice coil, a diaphragm, a spider, a mass element and an echo chamber. The voice coil may be configured to receive an output electrical signal having information within a output range of frequencies. The diaphragm and the spider may be coupled to the voice coil. The mass element may be coupled to at least one of the voice coil and the diaphragm, and having a mass selected such that the resonant frequency of the transducer is within the output range of frequencies. The echo chamber may be formed between the diaphragm and the voice coil. In certain embodiments, the controller may comprise a splitter, an amplifier and a switch. The splitter may be configured for receiving an input electrical signal, and splitting the input electrical signal into at least a first portion having a first range of frequencies and a second portion having a second range of frequencies, wherein the resonant frequency is within the second range of frequencies. The amplifier may be configured for amplifying the second portion. The switch may be connected to the splitter and the amplifier, and configured to receive the first portion, the amplified second portion and a combination of the first portion and the amplified second portion.
- In yet another aspect, the systems and methods described herein may include a system of generating acoustic and tactile signals from an electrical signal having audio information. The system may include a transducer, and a controller. The transducer may include a voice coil, a diaphragm, a spider, a mass element and a rotation assembly. The voice coil may be configured to receive an output electrical signal having information within a output range of frequencies. The diaphragm and the spider may be coupled to the voice coil. The mass element may be coupled to at least one of the voice coil and the diaphragm, and having a mass selected such that the resonant frequency of the transducer is within the output range of frequencies. The rotation assembly may include ball attached to a portion of the transducer, the ball being configured to fit within the socket. The transducer may be configured to rotate within the socket. In certain embodiments, the controller may comprise a splitter, an amplifier and a switch. The splitter may be configured for receiving an input electrical signal, and splitting the input electrical signal into at least a first portion having a first range of frequencies and a second portion having a second range of frequencies, wherein the resonant frequency is within the second range of frequencies. The amplifier may be configured for amplifying the second portion. The switch may be connected to the splitter and the amplifier, and configured to receive the first portion, the amplified second portion and a combination of the first portion and the amplified second portion.
- In still another aspect, the systems and methods described herein may include a method of generating acoustic and tactile signals from an electrical signal having information within a first range of frequencies. The method may comprise providing a transducer having a mass element disposed on a diaphragm of a speaker, wherein, the mass of the mass element is selected such that a portion of a resonant frequency range of the transducer falls within the first range of frequencies. The method may further comprise providing a transducer having an echo chamber formed adjacent the diaphragm. The method further comprises receiving, at the transducer, the electrical signals, and generating, at the transducer, acoustic signals due to the vibration of the diaphragm, and haptic signals due to the resonance of the transducer created by the movement of the mass element at a frequency within the resonant frequency range. The haptic signals may be amplified by the echo chamber. In certain embodiments, the speaker includes a voice coil for receiving the electrical signals, and a spider connected to the voice coil, the method further comprising damping, by the spider, the vibration of the diaphragm and the movement of the mass element.
- In another aspect, the systems and methods described herein include a method of manufacturing a transducer capable of generating acoustic and haptic signals from an electrical signal. The method comprises providing an acoustic transducer having a diaphragm, spider and voice coil, and attaching a mass element to the diaphragm. The method further comprises attaching a semi-rigid diaphragm adjacent to the rigid diaphragm to form an echo chamber. In certain embodiments, the mass element includes a rigid metal having a mass selected such that the resonant frequency of the acoustic transducer combined with the mass element falls within a range of frequencies of the electrical signal.
- In another aspect, the systems and methods described herein include a method of manufacturing a transducer capable of generating acoustic and haptic signals from an electrical signal. The method comprises providing an acoustic transducer having a diaphragm, spider and voice coil, and attaching a mass element to the diaphragm. The method further comprises attaching a rotation assembly including a socket, and a ball to a portion of the transducer. The ball may be configured to fit within the socket and the transducer may be configured to rotate within the socket. In certain embodiments, the mass element includes a rigid metal having a mass selected such that the resonant frequency of the acoustic transducer combined with the mass element falls within a range of frequencies of the electrical signal.
- In another aspect, the systems and methods described herein include a transducer capable of generating acoustic and haptic signals. The transducer may comprise a speaker, including a diaphragm, configured to transform an electrical signal having audio information in a first range of frequencies, into an acoustic signal. The transducer may further comprise a mass element attached to the center region of the diaphragm. The transducer may also include a rotation assembly including a socket, and a ball attached to a portion of the speaker, the ball being configured to fit within the socket. The speaker may be configured to rotate within the socket. In certain embodiments, the mass of the mass element is selected such that a portion of a resonant frequency range of the combination of the speaker and the mass element falls within the first range of frequencies. The resonant frequency range may be from 50 to 4000 Hz. The mass element may be removably attached to the diaphragm. In certain embodiments, the transducer further comprises a sponge block positioned within the socket, such that the ball is positioned on a surface of the sponge block.
- In another aspect, the systems and methods described herein include a transducer capable of generating acoustic and haptic signals. The transducer may comprise a speaker, including a diaphragm, configured to transform an electrical signal having audio information in a first range of frequencies, into an acoustic signal. The transducer may comprise a holder attached to a portion of the diaphragm. The holder may include an opening positioned above a center region of the diaphragm. The transducer may further comprise a mass element attached to the holder above the center region of the diaphragm. In certain embodiments, the mass element includes an opening positioned above the opening of the holder, such that at least a portion of the acoustic signal passes from the speaker and through the openings in the mass element and the holder. The transducer may also include a rotation assembly including a socket, and a ball attached to a portion of the speaker, the ball being configured to fit within the socket. The speaker may be configured to rotate within the socket. In certain embodiments, the mass of the mass element is selected such that a portion of a resonant frequency range of the combination of the speaker and the mass element falls within the first range of frequencies. The resonant frequency range may be from 50 to 4000 Hz. The mass element may be removably attached to the diaphragm. In certain embodiments, the transducer further comprises a sponge block positioned within the socket, such that the ball is positioned on a surface of the sponge block.
- The foregoing and other objects and advantages of the invention will be appreciated more fully from the following further description thereof, with reference to the accompanying drawings wherein:
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FIGS. 1A and 1B depict side and perspective views of an acousto-haptic transducer, according to an illustrative embodiment of the invention. -
FIG. 2A depicts a side view of an acousto-haptic transducer, according to an illustrative embodiment of the invention. -
FIGS. 2B and 2C depict a side view of an acousto-haptic transducer having an echo chamber, according to an illustrative embodiment of the invention. -
FIG. 2D depicts a side view of an acousto-haptic transducer having an echo chamber and a mechanism to allow for an improved fit to the body of the user, according to an illustrative embodiment of the invention. -
FIGS. 2E and 2F depict perspective views, exploded and assembled, respectively, of an acousto-haptic transducer, according to an illustrative embodiment of the invention. -
FIG. 3 is a block diagram of an acousto-haptic transducer coupled to a controller, according to an illustrative embodiment of the invention. -
FIG. 4 is a block diagram of two acousto-haptic transducers coupled to a controller, according to an illustrative embodiment of the invention. -
FIG. 5 is a block diagram of two acousto-haptic transducers and two speakers coupled to a controller, according to an illustrative embodiment of the invention. -
FIG. 6 is a block diagram of acousto-haptic transducers integrated with a surround sound system, according to an illustrative embodiment of the invention. - The systems and methods described herein relate to a transducer capable of producing acoustic and tactile stimulation. The transducer includes a mass element disposed on the diaphragm of a speaker. The mass element may optionally be removable and may have a mass selected such that the resonant frequency of the transducer falls within the range of frequencies present in an input electrical audio signal. The mass element may be attached to the diaphragm via a holder. The holder and the mass element may also be configured so as to avoid contact with the center region of the diaphragm and allow for sound to pass through from the center of the speaker. The transducer may include an echo chamber for enhancing the tactile stimulation, and a rotation assembly (e.g., ball and socket mechanism) for improving the fit of the transducer on a user. The systems and methods described herein will now be described with reference to certain illustrative embodiments. However, the present disclosure is not to be limited to these illustrated embodiments which are provided merely for the purpose of describing the systems and methods described herein and are not to be understood as limiting in anyway.
- In particular,
FIGS. 1A and 1B depict side and perspective views of an acousto-haptic transducer 100, according to an illustrative embodiment of the invention.Transducer 100 includes amass element 102 coupled to aspeaker 101. Thespeaker 101 may be an acoustic transducer disposed within ahousing 110 and includes avoice coil 106 suspended in a magnetic field generated bymagnetic assembly 112. Thevoice coil 106 includes a length of wire wound about a core and capable of generating a magnetic field when electric current is passed through leads 114. Thevoice coil 106 is attached to thehousing 110 by aspider 108. Thespeaker 101 further includes a diaphragm disposed on thevoice coil 106 and configured to couple to thehousing 110 viaflexible rim 120. Thediaphragm 104 is capable of vibrating in response to an electrical signal. Thediaphragm 104 can be between 0.5 inches and 4 inches in diameter, with a preferred size dependent on the user's size. A thin cushion (not shown) can overlay thediaphragm 104 and be disposed between thediaphragm 104 and the user to soften the impact of the vibrations on the user. The thin cushion may be made of any suitable material that is sufficiently resilient and can provide padding, such as a silicone gel. An external surface of thediaphragm 104 can be any suitable material that is sufficiently tacky to prevent slippage when the external surface rests against skin or fabrics typically used in clothing. Examples of suitable materials include synthetic rubber, polyurethane, fabric used to cover audio speakers, and foam cushion used to cover headphone speakers. The surface material is typically between 1 mm and 5 mm in thickness. A cushion can encircle thetransducer 100 to protect the edge of thediaphragm 104. - During operation, an electrical signal (typically broadband oscillating signals) containing at least one of audio and haptic or tactile information may be transmitted to the
voice coil 106 through leads 114. The electrical current flowing through thevoice coil 106 creates a Lorentz force between thevoice coil 106 solenoid and themagnetic assembly 112. In certain embodiments themagnetic assembly 112 is fixed and attached to thehousing 110 and therefore, in response to the Lorentz force, thevoice coil 106 may start to oscillate. Thespider 108 may damp this oscillation allowing the speaker to have a high fidelity across a full-range of frequencies. Thevoice coil 106 may serve as an actuator moving themass element 102 along with the diaphragm. Themass element 102 advantageously allows a user to adjust the resonant frequency of thetransducer 100 by varying the mass of themass element 102. In particular, the transducer may have a resonant frequency range that lies within the range of frequencies of the electrical signal. This resonant frequency range may be moved about the spectrum by adjusting one or more characteristics of the mass element, including its mass. When thevoice coil 106 is excited by signals at a frequency in the resonant frequency range, thetransducer 100 will vibrate to produce haptic signals. A user can place thetransducer 100 in close proximity to skin to perceive tactile sensations generated by these haptic signals. - In certain embodiments, the
mass element 102 may be formed from a rigid material having a high density. Alternatively, themass element 102 may include non-rigid material alone or in combination with rigid material. The non-rigid materials may include, without limitations, silicon. Themass element 102 may be formed from a metal or a metal-alloy. Themass element 102 may be formed from at least one of copper, nickel, silver, gold, manganese, aluminum, and titanium. Themass element 102 may be formed from any suitable rigid material without departing from the scope of the invention. In certain embodiments, themass element 102 may be formed from a material selected such that the mass, footprint, height, and/or volume of themass element 102 are suitable for combining with aspeaker 101 having a predetermined dimension. In one example, thespeaker 101 may be a commercially available speaker having a diaphragm, voice coil and housing with pre-determined dimensions. In such an example, themass element 102 may need to have a particular dimension and shape, and consequently, themass element 102 may be formed from a material to provide a mass within the constraints imposed by the pre-determined dimensions of the commercially-available speaker. The mass of themass element 100 may be about 2 g. In certain embodiments, the mass of themass element 100 may be from about 0.01 g to about 20 g. In other embodiments, the mass may range from about 1 g to about 4 g. The mass of the mass element may be less than or equal to about 0.1 g, 0.25 g, 0.5 g, 1 g, 1.5 g, 2 g, 2.5 g, 3 g, 3.5 g, 4 g, 4.5 g, 5 g, 10 g, 15 g, or 20 g. In certain embodiments, the mass of themass element 100 may be selected based on the desired application. For example, for a microspeaker (e.g., microspeakers in mobile devices such as smart phones) having a mass around 1 g-2 g, the mass of themass element 100 may be selected to be less than 1 g. In certain instances, the mass of the mass element may be selected to be less than 0.1 g. - Generally, as the mass of the
mass element 102 increases, the resonant frequency of the transducer decreases. Consequently, the mass of themass element 102 may be selected to generate haptic signals within particular frequency ranges. In addition to the mass of themass element 102, the mass of thespeaker 101 andhousing 110 may be relevant towards the performance of thetransducer 100. In particular, the mass of theentire transducer 100 may affect the amplitude of vibrations in the resonant frequency range. Generally, the greater the mass of thetransducer 100, the lower the amplitude. - Generally, the
mass element 102 may be sized and shaped as suitable for a desired application. Themass element 102 may have a circular cross-section and may be disk-shaped, hemispherical, conical, or frusto-conical. Themass element 102 may have a rectangular cross-section and may be cuboidal, or pyramidal shaped. In one embodiment themass element 102 has a similar shape and dimensions as that of a U.S. 1 cent coin. In particular, themass element 102 may be disk-shaped and about 0.75 inches (19.05 mm) in diameter and about 0.061 inches (about 1.55 mm) in thickness. Generally, the shape of themass element 102 may be selected based on the shape of theunderlying diaphragm 104 orvoice coil 106 orhousing 110. Themass element 102 may be selected such that its footprint (cross section area) is small enough so as not to affect the acoustic characteristics of the diaphragm. Generally, the larger the footprint of themass element 102, the lower the amplitude of the sound produced by thetransducer 100. Therefore, it may be desirable to have amass element 102 with a footprint small enough so that thediaphragm 104 can produce audible sound. In one embodiment, the ratio between thediaphragm 104 and the cross-section surface area of themass element 102 may be about four. - In certain embodiments,
transducer 100 may include an optional andremovable dust cap 116. In such embodiments, the dimensions of themass element 102 may be selected such that during operation (when themass element 102 moves towards and away from the cap 116) themass element 102 does not make contact with thecap 116. In such embodiments, the haptic signals are transmitted to the user through inertial vibration of thehousing 110 of the transducer. In certain embodiments, the transducer may be configured to provide an alarm signal to a user when the transducer is malfunctioning or is being incorrectly or inappropriately used. Themass element 102 may be configured to make contact with thecap 116 during operation. In such an embodiment, a user may place thecap 116 in contact with skin and may feel the mass striking the inside of thecap 116 during use. Such haptic signals may be stronger than other signals and consequently may signal an alarm to the user. - The
mass element 102 may be disposed near the center region of thediaphragm 104. The mass element may be attached away from the center region on thediaphragm 104. In certain embodiments,transducer 100 includes a plurality ofmass elements 102, having the same or different masses sizes and shapes, stacked on top of each other at one or more locations on thediaphragm 104. In one such embodiment, thetransducer 100 includes a plurality ofmass elements 102 located at a two or more locations on thediaphragm 104. In such an embodiment, thetransducer 100 may have more than one adjustable resonant frequency range, and when vibrated at one or more of these frequencies, thetransducer 100 may generate haptic signals. In certain embodiments, a plurality ofmass elements 102 having different masses, based on their location on thediaphragm 104, may be capable of transverse vibrations in addition to longitudinal vibrations. In such embodiments, a user may selectively control which of the plurality ofmass elements 102 to resonate. - In certain embodiments, the
mass element 102 may be attached to thediaphragm 104 using an adhesive such as glue. In certain embodiments, thediaphragm 104 may have an opening in the center region. In such embodiments, themass element 102 may be attached to thevoice coil 106 and/or a portion of thediaphragm 104 surrounding the opening. In certain embodiments, themass element 102 may be permanently attached to thediaphragm 104 and/orvoice coil 106. In certain other embodiments, themass element 102 may be removably attached or removably coupled to thediaphragm 104 and/orvoice coil 106. In such embodiments, themass element 102 may be attached to thediaphragm 104 and/orvoice coil 106 by a temporary or removable adhesive. In other embodiments, themass element 102 may be attached to one or more portions of thehousing 110. In such embodiments, themass element 102 may be attached to an inside or outside portion of the housing. In one embodiment, the mass element includes one or more components associated with thehousing 110. For example, if adiaphragm 104 is directly connected to (e.g., glued) to the frame of a housing module, the magnet and/or the frame of the speaker may act as the resonant mass. Thus, various components of a transducer system may be configured, shaped, connected, weighted, and/or arranged in a selected way as to provide a resonant mass for the transducer system. -
FIGS. 2A-2F depict various illustrative embodiments of an acousto-haptic transducer as described herein. Features in each of theFIGS. 2A-2F andFIGS. 1A-1B may be combined, modified and substituted in any suitable configuration without departing from the scope of the present disclosure. For example, features shown or described with reference to one or more ofFIGS. 1A-2F may be combined with features shown or described with reference to another one or more ofFIGS. 1A-2F without departing from the scope of the present disclosure. In certain embodiments, as depicted inFIG. 2A ,mass element 102 may be coupled, indirectly, to thediaphragm 104 and/orvoice coil 106 via aholder 250. In particular,FIG. 2A depicts a side view of an acousto-haptic transducer 200, according to an illustrative embodiment of the invention.Transducer 200 may be similar totransducer 100 ofFIG. 1 in many respects, however, mass element 200 (which may be similar to mass element 100) is removably coupled to thespeaker 101 using aholder 250. Themass element 200 may be snapped into theholder 250 to allow thetransducer 200 to suitably operate as a haptic transducer. As desired, haptic functionality may be reduced by snapping offmass element 200 from itsholder 250. Theholder 250 may be formed from any suitable material, and sized and shaped as desired without departing from the scope of the invention. In certain embodiments, theholder 250 may be configured to hold a plurality ofmass elements 102. -
Transducers mass elements mass elements mass elements mass elements holder 250. Each of the plurality ofmass elements - Generally, the
speakers 101 may be any audio producing device. For example, theaudio speakers 101 can be any suitable audio device, such as a loudspeaker, tweeter, subwoofer, earphone, headphone, or neckphone, and the like. Thespeaker 101 and themass element 102 are enclosed withinhousing 110. Thehousing 110 may encase thespeaker 101,mass element 102 and/or other processing circuitry, as will be described in more detail below with reference toFIGS. 3-9 . Thehousing 110 may be configured to support user control interfaces such as a button, switch, dial or screen. Thehousing 110 may be adapted to attach (directly or indirectly) at least by wire leads 114 to any suitable data source of audio or haptic data, such as a portable music device or video game console. In another alternative embodiment, housing can include, an on-board power source, and a wireless receiver, a wireless transceiver, and a wireless transmitter for communicating audio or haptic data. - In certain embodiments, to help increase the efficiency and performance, the acousto-haptic transducer described herein may be configured to amplify the output of haptic frequencies. In such embodiments, the acousto-haptic transducer may include one or more echo mediums or echo chambers for generating reverberations or echos and thereby enhance the output of the haptic signal.
FIGS. 2B and 2C depict a side view of an acousto-haptic transducer having such an echo chamber, according to an illustrative embodiment of the invention. In particular,transducer 260 includes amass element 262 coupled to aspeaker 261. Thespeaker 261 may be an acoustic transducer disposed within ahousing 270 and includes avoice coil 266 suspended in a magnetic field generated bymagnetic assembly 272. Thevoice coil 266 includes a length of wire wound about a core and capable of generating a magnetic field when electric current is passed through leads 274. Thevoice coil 266 is attached to thehousing 270 by aspider 268. Thespeaker 261 further includes a diaphragm disposed on thevoice coil 266 and configured to couple to thehousing 270 viaflexible rim 280. Thediaphragm 264 is capable of vibrating in response to an electrical signal. Thediaphragm 264 can be between 0.5 inches and 4 inches in diameter, with a preferred size dependent on the user's size. A thin cushion (not shown) can overlay thediaphragm 264 and be disposed between thediaphragm 264 and the user to soften the impact of the vibrations on the user. The thin cushion may be made of any suitable material that is sufficiently resilient and can provide padding, such as a silicone gel. An external surface of thediaphragm 264 can be any suitable material that is sufficiently tacky to prevent slippage when the external surface rests against skin or fabrics typically used in clothing. Examples of suitable materials include synthetic rubber, polyurethane, fabric used to cover audio speakers, and foam cushion used to cover headphone speakers. The surface material is typically between 1 mm and 5 mm in thickness. A cushion can encircle thetransducer 260 to protect the edge of thediaphragm 264. - As shown in
FIG. 2B and in a simplified depiction oftransducer 260 inFIG. 2C , thediaphragm 264 may be a substantially rigid surface. Therigid diaphragm 264 may be any suitable material that is substantially rigid, to prevent uncontrolled cone motions, have relatively low mass, to minimize starting force requirements and energy storage issues, and be well damped, to reduce vibrations continuing after the signal has stopped with little or no audible ringing due to its resonance frequency as determined by its usage. In certain embodiments, the substantiallyrigid diaphragm 264 may be formed from at least one of metal, plastic or a suitable composite material such as composite paper infused with carbon fiber, Kevlar, glass, hemp or bamboo fibers. The substantiallyrigid diaphragm 264 may be configured in a honeycomb sandwich construction, and may include an additional coating to provide additional stiffening or damping. Thediaphragm 264 may have a cone- or dome-shaped profile, and may be any suitable size as desired without departing from the scope of the present disclosure. The substantiallyrigid diaphragm 264 may be attached to thevoice coil 266 through asemi-rigid diaphragm 282. - The
semi-rigid diaphragm 282 may be formed from semi-rigid materials including at least one of cellulose fiber (paper), cellulose fiber (paper) with synthetic fibers and binders, and silk. In certain embodiments, thesemi-rigid diaphragm 282 may be shaped and positioned such that an echo chamber or echo medium 284 is created between thesemi-rigid diaphragm 282 and therigid diaphragm 264. During operation, in response to electrical signals passing through thevoice coil 266, thesemi-rigid diaphragm 282 and therigid diaphragm 264 may vibrate to produce haptic signals. Such haptic signals may reverberate within theecho chamber 284 and thereby amplifying the strength of the output signal. Thesemi-rigid diaphragm 282 may be shaped, sized and have a suitable curvature as necessary depending on the desired sound characteristics. The size of theecho chamber 284 may be selected as necessary depending on the desired sound characteristics. - In certain embodiments, the
echo chamber 284 helps amplifying the output of haptic frequencies because it functions as a low frequency resonator. In certain alternative embodiments, the acousto-haptic transducer described herein may include one or more other low frequency resonating structions, alone or in combination with theecho chamber 284. For example, the acousto-haptic transducer described herein may include one or more springs having a similar natural frequency. These one or more springs may have any suitable shape, including but not limited to, conical, constant pitch, hourglass, variable pitch, and barrel shaped, and these one or more springs may be formed from round or rectangular wire as desired without departing from the scope of the present disclosure. The one or more springs may be formed from any suitable material including at least one of metal and plastic. The acousto-haptic transducer described herein may include any suitable low frequency resonator without departing from the scope of the present disclosure. - In certain embodiments of the systems and methods described herein, it may be desirable to improve the fit of the acousto-haptic transducer to a user.
FIG. 2D depicts a simplified side view of an acousto-haptic transducer having an echo chamber and a mechanism to allow for an improved fit to the body of the user, according to an illustrative embodiment of the invention. In particular,transducer 290 ofFIG. 2D is similar totransducer 260 ofFIGS. 2B and 2C with the addition of an exemplary rotation assembly mechanism to allow for rotation and/or movement of the transducer about a body of a user.Transducer 290 includes a ball and socket mechanism including aball 282, and a socket assembly 286 (shown in cross sectionFIG. 2D aspartial sockets ball 282 is attached to the transducer (such as transducer 286) and during operation, the transducer with theball 282 may rotate freely about and within socket assembly 286. Although, theball 282 is shown as being attached to themagnet 272 in the simplifiedFIG. 2D , it should be understood that theball 282 may be attached to any portion of the transducer including, among others,housing 270 without departing from the scope of the present disclosure. - Generally, the ball and socket mechanism may be formed form any suitable rigid material as desired without departing from the scope of the present disclosure. The
ball 282 is depicted as a hemispherical structure, however, theball 282 may be any suitable portion of a spherical structure or any suitable shape. The socket 286 may be sized and shaped to accommodate theball 282. In certain embodiments, the rotation assembly including the ball and socket further includes asponge block 284, which may be formed from foam-like material, disposed within the socket and provides a landing for theball 282. In particular, theball 282 may be disposed within the socket 286 such that theball 282 is in contact with thesponge block 284. Thesponge block 284 may allow for the free movement of theball 282 within the socket 286. The rotation assembly may further include arigid plane 288 for supporting theball 282, socket 286 and/orsponge block 284. Generally, the rotation assembly may include any suitable mechanism alone or in combination with the ball and socket mechanism. For example, the rotation assembly may include a gimbal assembly having one, two or three degrees of freedom along one, two or three axes. Any suitable rotation assembly may be included without departing from the scope of the present disclosure. - In certain embodiments, the mass element described herein may be coupled indirectly to a portion of the speaker. For example, as was depicted and described herein with reference to
FIG. 2A , the mass element may be coupled to a diaphragm and/or voice coil via a holder. Such embodiments may be desirable when, among other times, fitting a commercially available speaker or microspeaker with a mass element to turn the speaker or microspeaker into an acousto-haptic transducer as described herein. When coupled to the speaker, it may be desirable for the mass element to not dampen the audible frequencies of the speaker.FIGS. 2E and 2F depict perspective views, exploded and assembled, respectively, of an acousto-haptic transducer 200′ having a mass element sized, shaped and positioned on a speaker to limit dampening of the audible frequencies, according to an illustrative embodiment of the invention. In particular,FIGS. 2E and 2F show a simplified depiction of aspeaker 101′, which may be similar tospeaker 101 ofFIGS. 1A and 1B .Speaker 101′ may include a commercially available speaker or microspeaker and may include a diaphragm disposed over a voice coil.Transducer 200′ includes amass element 202′ and aholder 250′. Themass element 202′ and theholder 250′ are carefully selected to not dampen, or at least substantially limit dampening the audible frequencies generated by thespeaker 101′. Specifically, Applicants have recognized that such dampening can be reduced by limiting or eliminating the contact of themass element 202′ and/orholder 250′ with a central region 298 of thespeaker 101′. Lower frequencies, generally responsible for the haptic signals generated bytransducer 200′, may be in the range of about 0 to about 500 Hz. These haptic signals are typically generated by the excursion of the entire or a substantial portion of the diaphragm. Therefore, it may be sufficient to attach themass element 202′ to the periphery of the central region 298 of thespeaker 101′. - As depicted in
FIGS. 2E and 2F , themass element 202′ is attached tospeaker 101′ viaholder 250′. To minimize the footprint of themass element 202′ and theholder 250′ on the central region 298, theholder 250′ includes legs 297 that are permanently or removably attached outside of the central region 298. The legs 297 may be attached to the diaphragm in any suitable manner including, among others, by glueing with adhesive. The legs 297 are depicted as having an s-shaped profile to accommodate themass element 202′ and to attach to the diaphragm. The legs 297 may be shaped such that only a portion of the end tip regions of the legs 297 may be attached to the diaphragm of thespeaker 101′. To prevent damage to the diaphragm, the tips or ends or edges of the legs 297 may be rounded. - The
holder 250′ includes a central ring shaped region to accommodate themass element 202′. Theholder 250′ may be formed from any suitable material sufficient to support themass element 202′ above the central region 298 during vibration ofspeaker 101′. In certain embodiments, theholder 250′ may be formed from a thin suspension film membrane such as a polyester membrane including, but not limited, to polyethylene terephthalate (PET), biaxially-oriented polyethylene terephthalate (BoPET), polypropylene (PP) and biaxially-oriented polypropylene (BoPP). Theholder 250′ may be formed from any material having properties similar to those of PET, BoPET, BoPP, PP, without departing from the scope of the present disclosure. Theholder 250′ may have a thickness similar to or smaller than the thickness of the diaphragm ofspeaker 101′. In certain embodiments, the thickness of theholder 250′ may be larger than the thickness of the diaphragm ofspeaker 101′. Generally, theholder 250′ may be sized and shaped as desired to allow for stable anchoring of themass element 202′on the diaphragm, while preventing the mass from making contact with the diaphragm ofspeaker 101′ during vibration. - The
mass element 202′ may be similar to the mass elements described with reference toFIGS. 1A-2D and serves to convert thespeaker 101′ to an acousto-haptic transducer 200′. As shown inFIGS. 2E-2F , themass element 202′ is a toroidal shaped structure having an opening 295 positioned on top of theholder 250′. Theholder 250′ also includes an opening 296 substantially concentric with the opening 295 of themass element 202′. The toroidal shape allows sound to pass through to a user from the central region 298 of thespeaker 101′. Thus, the openings 295 and 296 serve to reduce dampening of acoustic signals in the acousto-haptic transducer. Themass element 202′ and the opening 295 may be any suitable shape or size without departing from the scope of the present disclosure. Moreover, themass element 202′ and theholder 250′ may or may not have the same shape. Themass element 202′ may be larger than or smaller than theholder 250′, and the opening 295 may be larger than or smaller than the opening 296. In certain embodiments, the opening 296 may not be concentric with the opening 295, and themass element 202′ may be not positioned centrally with reference toholder 250′. In one example (not shown in the figures), themass element 202′ may have a rectangular shape, but the opening 295 may be circular. In certain embodiments, acousto-haptic transducer 200′ may have a mass of about 1.107 g, wherein the mass of themass element 202′ may be less than 0.1 g and approximately 0.086 g. In such embodiments, theholder 250′ may be formed from BoPET and have a thickness of about 0.04 mm. - As noted earlier, during operation electrical signals from a data source cause the
transducer transducer -
FIG. 3 is a block diagram of an acousto-haptic transducer coupled to a controller, according to an illustrative embodiment of the invention. In particular,FIG. 3 shows asystem 300 including an acousto-haptic transducer controller 302. Electrical signals containing audio and/orhaptic signals 312 are fed into thecontroller 302, and specifically intofilter 304.Splitter 304 splits thesignal 312 into afirst portion 314 having a first range of frequencies and asecond portion 316 having a second range of frequencies. Often times, haptic information may be contained in the low frequency region of anincoming audio signal 312. Thesplitter 304 may include a combination of one or more high-pass, low-pass, band-pass filters to split thesignal 312 into a high frequency portion corresponding tofirst portion 314, and a low frequency portion corresponding tosecond portion 316. Thesecond portion 316 is amplified atamplifier 306 to produce an amplifiedsignal 318. Below is a more detailed description of amplifying or enhancing the low frequency or bass portion of the signal (bass enhancement). - The
controller 300 may include aswitch 308 for controlling the nature of thesignal 320 being sent to thetransducer switch 308 includes a 3-way switch. In such embodiments, in a first mode, theswitch 308 may be configured to transmit to thetransducer 100 thefirst portion 314. In a second mode, theswitch 308 may be configured to transmit to thetransducer second portion 318. In a third configuration, theswitch 308 in connection withother processing circuitry 310, e.g., a summing circuit, amplifier, transistor, operational amplifier, or like signal combiner, may be configured to transmit a combination of bothportions switch 308 may be mechanical, electromechanical, micromachined, MEMS-based, integrated circuit (IC) based, hardware and/or software based. - Any of the
components components controller 302. The microprocessor may include or interface with a memory configured to store instructions of a software program, function, and/or application. A function or application may be configured to control one or more of thecomponents switch 308 based on a detectedsignal splitter 306 or filter 304 to set the frequency and/or bandwidth for filtering or splitting. The microprocessor may include a digital signal processor (DSP), running microcode or the like, to perform certain functions. Any of the various illustrative systems disclosed herein may include a microprocessor controller as described above. In some embodiments, any of the signals, at any stage of signal processing, may be converted and processed as digital signals, and then converted to an analog signal for driving the output audio and/or haptic signals. - The
switch 308 andprocessing circuitry 310 arrangement are one example of how signals may be combined and/or separately provided to thespeaker speaker signals speaker - In certain embodiments, the incoming
electrical audio signal 312 may be a stereo signal configured to be processed and transformed to sound by a plurality of transducers.FIG. 4 is a block diagram of two acousto-haptic transducers coupled to a controller for processing stereo sound and haptics, according to an illustrative embodiment of the invention. In particular,FIG. 4 shows a system 400 including two acousto-haptic transducer transducers electrical signals 312 are split into two portions similar tocontroller 302 ofFIG. 3 . One portion of thesignal 312 corresponding to the haptic portion may be amplified and optionally recombined with the audio portion. Controller 402 further includes processing circuitry 450 for separately driving theleft transducer 100 a andright transducer 100 b. - Acousto-
haptic systems 300 and 400 described above may receive electrical signals containing audio, haptic, and other data from a variety of media and devices. Example media include music, movies, television programs, video games, and virtual reality environments. Example devices that can provide data and be used in conjunction with a vibration device include portable music players, portable video players, portable video game consoles, televisions, computers, and home entertainment systems. Exemplary acousto-haptic systems may connect to exemplary devices via an audio jack coupled to a wire or may contain a wireless receiver for wirelessly receiving signals from a device equipped with a wireless transmitter. - Using a acousto-haptic device in conjunction with a media device can enhance the user's interaction with the media by creating tactile sensations that synchronize with the data being presented by the media device. For example, soundtracks that accompany movies typically have, in addition to music and dialogue, sounds that accompany the action in the movie, such as a door slamming or an explosion. The acousto-haptic device, by transforming these sounds into vibrations, allows the user to simultaneously feel this action in addition to seeing and hearing it, which can create a more immersive experience for the user. This immersive effect can be especially desirable when the visual data is poor, for example portable devices with small video screens or computer monitors with relatively low resolution. As another example, the user's perception of music may be enhanced by the vibration device, which can create a tactile sensation synchronized with the music by using the same data source as the audio speakers. This enhancement can be especially desirable for experiencing the low frequency component, also known as bass.
- As noted above the acousto-
haptic systems 300 and 400 can include processing circuitry capable of processing electrical signals for enhancing the content perceived by the user or allowing the user to modify the content. Exemplary functions of processing circuitry include selecting acoustic and/or haptic signal portions, pitch control, volume control, fade-in, amplitude-ceiling, auto shut-off, channel separation, phase-delay, and bass enhancement, whose implementations are well-known to one skilled in the art. Pitch control allows a user to increase or decrease the overall frequency of an electrical signal. Volume control allows a user to increase or decrease the overall amplitude of an electrical signal. Fade-in gradually increases the amplitude of the beginning of an electrical signal to lessen the initial impact of vibrations on a user. Amplitude-ceiling creates an upper bound on the magnitude of the amplitude of the electrical signal to prevent the user from experiencing excessively intense vibrations. Auto shut-off turns off the processing circuitry to conserve power without receiving input from the user and when an electrical signal has not been received for a preset amount of time. Channel separation separates a stereo or multichannel signal into its component channels. Phase-delay delays a signal sent to a second vibrator with respect to a signal sent to a first transducer to give the user the impression the sound originated from a location closer to the first transducer than the second transducer. Bass enhancement increases the amplitude of the bass component of an electrical audio signal relative to the rest of the signal. - Examples of multichannel signals that can be separated by processing circuitry include stereo sound, surround sound, and multichannel haptic data. Stereo sound typically uses two channels. Channel separation circuitry can separate a stereo sound two-channel electrical audio signal into a left channel signal and a right channel signal intended to be experienced by the user from, respectively, a left-hand side and a right-hand side. Multichannel electrical audio signals, such as those used in 5.1 and 6.1 surround sound, can similarly be separated, and typically contain rear channel signals intended to be experienced by the user from the rear. Channel separation circuitry can also separate multichannel haptic data, such as those used with video games or virtual reality environments, that similarly contain data intended to be experienced by the user from a specific direction.
- Multiple implementations of bass enhancement are possible. In one implementation, an electrical signal is received at an input for transmitting to a transducer and/or audio speakers. A low frequency cross-over circuit can filter through only the bass component of the received electrical signal, whose overall amplitude is increased by an amplifier before reaching a transducer.
- Another bass enhancement implementation increases the bass component without filtering out the rest of a signal. Processing circuitry can sample a received electrical signal to create a sampled signal, modulate the pitch of the sampled signal to create a modulated sampled signal, and mix the modulated sampled signal with the received electrical signal to create a signal for the transducer. The modulation of the pitch preferably lowers the pitch of the sampled signal to increase the bass component of the signal received by the transducer. The user may also control the degree of bass enhancement by lowering the overall frequency of a signal using pitch control.
- In certain embodiments, acousto-haptic transducers may be combined with one or more speakers. Two such embodiments are shown in
FIGS. 5 and 6 .FIG. 5 is a block diagram of two acousto-haptic transducers and two speakers coupled to a controller, according to an illustrative embodiment of the invention.System 500 includes twospeakers System 500 allows a user to separately enjoy the audio throughspeakers transducers transducers electrical signal generator 504, which may be separate from the incoming signal source which contains audio information. The various signals may be switched at switchingcircuitry 506 and drive thetransducers system 500 may includedrivers amplifier elements - Many, if not most homes are equipped with multispeaker systems for generating an immersive surround sound that envelopes a user. Such a system will be further enhanced with the inclusion of one or more acousto-haptic transducers integrated, using suitable processing circuitry, with a conventional surround sound system for a fully-immersive entertainment experience.
FIG. 6 is a block diagram of an exemplary acousto-haptic transducers integrated with a surround sound system, according to an illustrative embodiment of the invention. In particular,FIG. 6 shows asurround sound system 600 and acousto-haptic transducers Transducer 604 may be housed in a compact adjustable housing for attaching to a user's body, for example about the shoulder and on the sternum.Transducer 606 may be configured to be positioned in close proximity to a chair or sofa or another piece of furniture that the user is in contact with.Transducers processing circuitry 602.Processing circuitry 602 may be similar to processing circuitry described above with reference toFIGS. 3-5 . - In certain embodiments,
processing circuitry 602 can send different signals, each based on an electrical signal received from a source of data, to different destinations. The different destinations can include audio speakers andtransducers Exemplary torso transducers 604, can include a left transducer and a right transducer for receiving, respectively, a left channel and a right channel generated by channel separation processing circuitry. Processing circuitry can also combine multiple functions and can apply different sets of functions to electrical signals depending on their destinations. Preferably, signals sent to transducers have undergone bass enhancement. Different speakers and transducers may also each have individual controllers to allow the user more flexibility in controlling the immersive experience. - As shown in
FIG. 6 transducers 606 may be in contact or in close proximity to a piece of furniture such as acouch 608, which in turn may be in direct contact with a user. Similarly,transducers 606 may be positioned in another part of the room that may be in indirect contact with a user. For example,transducer 606 may be positioned in contact with a wall in the room. In such an example, thetransducer 606 may be facing the wall or facing away from the wall. In certain embodiments when thetransducer 606 is facing away from the wall, acoustic signals can travel from thetransducer 606 to the user through the air in between, while the haptic signals may travel through the walls and furniture to the user. Depending on the desired application, the mass of the mass element intransducers 606 may be selected. In certain embodiments, the more indirect the path of the haptic signal from thetransducer 606 to the user, the greater the desired mass of the mass element of thetransducer 606. In one example, the mass may be selected to be larger than 20 g as desired for providing users with an acousto-haptic effect in large movie theaters. - In the case of a home theater system, for example, the masses in the range of 0.1-20 g would not apply if an indirect method of haptic delivery is used, for example by mounting the acoustohaptic transducer to a wall in the room. Because such range of masses are based on the assumption that the resonant module is in direct contact with the user (i.e. it is used in a cell phone, headphone, or KOR-fx type system). Such devices are low mass enough to allow the small resonant masses mentioned to produce sufficiently strong haptic effects for the user. However, for a home theater system or like larger scale system, then the mass can have a much larger size, even in Kgs (e.g. for movie theater walls).
- It will be apparent to those of ordinary skill in the art that certain aspects involved in the operation of the
controller 302 may be embodied in a computer program product that includes a computer usable and/or readable medium. For example, such a computer usable medium may consist of a read only memory device, such as a CD ROM disk or conventional ROM devices, or a random access memory, such as a hard drive device or a computer diskette, or flash memory device having a computer readable program code stored thereon. - The foregoing embodiments are merely examples of various configurations of components of vibration systems described and disclosed herein and are not to be understood as limiting in any way. Additional configurations can be readily deduced from the foregoing, including combinations thereof, and such configurations and continuations are included within the scope of the invention. Variations, modifications, and other implementations of what is described may be employed without departing from the spirit and the scope of the invention. More specifically, any of the method, system and device features described above or incorporated by reference may be combined with any other suitable method, system, or device features disclosed herein or incorporated by reference, and is within the scope of the contemplated inventions.
Claims (28)
1. A transducer capable of generating acoustic and haptic signals, comprising:
a speaker, including a diaphragm, configured to transform an electrical signal having audio information in a first range of frequencies, into an acoustic signal,
an echo chamber formed adjacent to the diaphragm, and
a mass element attached to the diaphragm,
wherein the mass of the mass element is selected such that a portion of a resonant frequency range of the combination of the speaker and the mass element falls within the first range of frequencies.
2. The transducer of claim 1 , wherein the diaphragm is substantially rigid and the speaker further comprises a semi-rigid diaphragm attached to a voice coil and rigid diaphragm, such that the echo chamber is formed in the region enclosed by the semi-rigid diaphragm and the rigid diaphragm.
3. The transducer of claim 2 , wherein the rigid diaphragm is cone-shaped and the semi-rigid diaphragm is substantially hemispherical shaped.
4. The transducer of claim 1 , wherein the mass element is removably attached to the diaphragm.
5. The transducer of claim 1 , wherein the mass element is glued to the center region of the diaphragm.
6. The transducer of claim 1 , wherein the mass element is formed from a rigid material having a mass in the range of about 0.1 g to 20 g.
7. The transducer of claim 1 , wherein the mass element is formed from a metal.
8. The transducer of claim 1 , wherein the mass element is disk-shaped.
9. The transducer of claim 1 , wherein the ratio of surface area of the top surface of the diaphragm to the surface area of the top surface of the mass element is about 4:1.
10. The transducer of claim 1 , wherein the speaker further includes
a voice coil attached to a diaphragm for receiving the electrical signal and moving the diaphragm in response to the electrical signal, and
a spider attached to the voice coil for damping oscillations of the voice coil, the diaphragm and the mass element.
11. The transducer of claim 1 , further comprising a holder attached to the diaphragm for holding the mass element.
12. The transducer of claim 1 , comprising a plurality of mass elements removably stacked on top of each other.
13. The transducer of claim 1 , further comprising a housing having a cap such that the speaker and mass element are disposed within the housing.
14. The transducer of claim 13 , wherein the diaphragm is capable of moving up to a maximum height within the housing, and wherein the mass element has a height selected such that when the diaphragm has moved up to the maximum height, the mass element is within the housing and below the cap.
15. The transducer of claim 1 , wherein the speaker is a full-range speaker.
16. The transducer of claim 1 , wherein resonant frequency range is from 2 to 800 Hz.
17. The transducer of claim 1 , comprising a controller connected to a source of the electrical signal and the speaker for splitting the electrical signal and driving the speaker and the mass element with at least one of a signal containing information in the audible frequencies, and a signal containing information in the haptic frequencies.
18. The transducer of claim 17 , wherein the controller is configured to amplify the signal containing information in the haptic frequencies.
19. A transducer capable of generating acoustic and haptic signals, comprising:
a speaker, including a diaphragm, configured to transform an electrical signal having audio information in a first range of frequencies, into an acoustic signal,
a mass element attached to the diaphragm, and
a rotation assembly including a socket, and a ball attached to a portion of the speaker, the ball being configured to fit within the socket,
wherein the mass of the mass element is selected such that a portion of a resonant frequency range of the combination of the speaker and the mass element falls within the first range of frequencies, and
wherein the speaker is configured to rotated within the socket.
20. The transducer of claim 19 , further comprising a sponge block positioned within the socket, wherein the ball is positioned on a surface of the sponge block.
21. A transducer capable of generating acoustic and tactile signals from an electrical signal having audio information, comprising:
a commercially-available speaker, having a voice coil and a diaphragm disposed within a housing, capable of generating an acoustic signals from electrical signals having audio information within a first range of frequencies,
an echo chamber formed between the diaphragm and the voice coil, and
a mass element coupled to the diaphragm,
wherein the mass element is selected such that the transducer has a resonant frequency that falls within the first range of frequencies.
22. A system of generating acoustic and tactile signals from an electrical signal having audio information, comprising:
a transducer, having
a voice coil configured to receive an output electrical signal having information within a output range of frequencies,
a diaphragm and a spider coupled to the voice coil,
an echo chamber formed between the diaphragm and the voice coil, and
a mass element coupled to at least one of the voice coil and the diaphragm, and having a mass selected such that the resonant frequency of the transducer is within the output range of frequencies; and
a controller, comprising
a splitter for receiving an input electrical signal, and splitting the input electrical signal into at least a first portion having a first range of frequencies and a second portion having a second range of frequencies, wherein the resonant frequency is within the second range of frequencies,
an amplifier, for amplifying the second portion, and
a switch connected to the splitter and the amplifier, configured to receive the first portion, the amplified second portion and a combination of the first portion and the amplified second portion.
23. A system of generating acoustic and tactile signals from an electrical signal having audio information, comprising:
a transducer, having
a voice coil configured to receive an output electrical signal having information within a output range of frequencies,
a diaphragm and a spider coupled to the voice coil,
a rotation assembly including a socket, and a ball attached to a portion of the transducer, the ball being configured to fit within the socket, wherein the transducer is configured to rotate within the socket, and
a mass element coupled to at least one of the voice coil and the diaphragm, and having a mass selected such that the resonant frequency of the transducer is within the output range of frequencies; and
a controller, comprising
a splitter for receiving an input electrical signal, and splitting the input electrical signal into at least a first portion having a first range of frequencies and a second portion having a second range of frequencies, wherein the resonant frequency is within the second range of frequencies,
an amplifier, for amplifying the second portion, and
a switch connected to the splitter and the amplifier, configured to receive the first portion, the amplified second portion and a combination of the first portion and the amplified second portion.
24. A method of generating acoustic and tactile signals from an electrical signal having information within a first range of frequencies, comprising
providing a transducer having
a mass element disposed on a diaphragm of a speaker, wherein, the mass of the mass element is selected such that a portion of a resonant frequency range of the transducer falls within the first range of frequencies, and
an echo chamber formed adjacent to the diaphragm;
receiving, at the transducer, the electrical signals;
generating, at the transducer, acoustic signals due to the vibration of the diaphragm, and haptic signals due to the resonance of the transducer created by the movement of the mass element at a frequency within the resonant frequency range, such that the haptic signals are amplified by the echo chamber.
25. The method of claim 24 , wherein the speaker includes a voice coil for receiving the electrical signals, and a spider connected to the voice coil, the method further comprising damping, by the spider, the vibration of the diaphragm and the movement of the mass element.
26. A method of manufacturing a transducer capable of generating acoustic and haptic signals from an electrical signal, comprising
providing an acoustic transducer having a rigid diaphragm, spider and voice coil,
attaching a mass element to the diaphragm, and
attaching a semi-rigid diaphragm adjacent to the rigid diaphragm to form an echo chamber,
wherein the mass element includes a rigid metal having a mass selected such that the resonant frequency of the acoustic transducer combined with the mass element falls within a range of frequencies of the electrical signal.
27. A method of manufacturing a transducer capable of generating acoustic and haptic signals from an electrical signal, comprising
providing an acoustic transducer having a rigid diaphragm, spider and voice coil,
attaching a mass element to the diaphragm, and
attaching a rotation assembly including a socket, and a ball to a portion of the transducer, the ball being configured to fit within the socket, wherein the transducer is configured to rotated within the socket,
wherein the mass element includes a rigid metal having a mass selected such that the resonant frequency of the acoustic transducer combined with the mass element falls within a range of frequencies of the electrical signal.
28. A transducer capable of generating acoustic and haptic signals, comprising:
a speaker, including a diaphragm, configured to transform an electrical signal having audio information in a first range of frequencies, into an acoustic signal,
a holder attached to a portion of the diaphragm, the holder includes an opening positioned above a center region of the diaphragm, and
a mass element attached to the holder above the center region of the diaphragm, the mass element having an opening positioned above the opening of the holder,
wherein the mass of the mass element is selected such that a portion of a resonant frequency range of the combination of at least the speaker and the mass element falls within the first range of frequencies, and
wherein the opening of the mass element and the opening of the holder are positioned such that at least a portion of the acoustic signal passes from the speaker and through the openings.
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Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130318438A1 (en) * | 2012-05-25 | 2013-11-28 | Immerz, Inc. | Haptic interface for portable electronic device |
US20150063606A1 (en) * | 2013-08-28 | 2015-03-05 | StudioFeed USA, LLC | Multistage tactile sound device |
US20150189441A1 (en) * | 2013-12-30 | 2015-07-02 | Skullcandy, Inc. | Headphones for stereo tactile vibration, and related systems and methods |
US20150208155A1 (en) * | 2014-01-20 | 2015-07-23 | Fairchild Semiconductor Corporation | Apparatus and method for recovering from partial insertion of an audio jack |
US20150350803A1 (en) * | 2014-05-30 | 2015-12-03 | Apple Inc. | Synchronization of independent output streams |
US20150355712A1 (en) * | 2014-06-09 | 2015-12-10 | Immersion Corporation | Haptic devices and methods for providing haptic effects via audio tracks |
US9588586B2 (en) | 2014-06-09 | 2017-03-07 | Immersion Corporation | Programmable haptic devices and methods for modifying haptic strength based on perspective and/or proximity |
CN106507262A (en) * | 2016-12-27 | 2017-03-15 | 深圳精拓创新科技有限公司 | A kind of diaphragm of loudspeaker tester with controlled excitation source |
US9613506B2 (en) | 2014-05-30 | 2017-04-04 | Apple Inc. | Synchronization of independent output streams |
US9794708B2 (en) | 2014-01-20 | 2017-10-17 | Fairchild Semiconductor Corporation | Apparatus and method for detecting insertion anomaly of an audio jack |
US20180054680A1 (en) * | 2015-05-21 | 2018-02-22 | Goertek, Inc. | Electrical-acoustic transformation device and electronic device |
DE102016115199A1 (en) * | 2016-08-16 | 2018-02-22 | Endress+Hauser Flowtec Ag | Ultrasonic sensor for determining or monitoring a process variable of a medium in automation technology |
US20180186622A1 (en) * | 2016-12-30 | 2018-07-05 | Sonion Nederland B.V. | Micro-electromechanical transducer |
US10152296B2 (en) | 2016-12-28 | 2018-12-11 | Harman International Industries, Incorporated | Apparatus and method for providing a personalized bass tactile output associated with an audio signal |
US10186138B2 (en) | 2014-09-02 | 2019-01-22 | Apple Inc. | Providing priming cues to a user of an electronic device |
US10390156B2 (en) * | 2016-05-09 | 2019-08-20 | Subpac, Inc. | Tactile sound device having active feedback system |
US20190300020A1 (en) * | 2016-08-05 | 2019-10-03 | Subpac, Inc. | Transducer system providing tactile sensations |
WO2020047679A1 (en) * | 2018-09-07 | 2020-03-12 | Audio Hospitality Inc. | Methods and systems applied to transposing audio signals to haptic stimuli in the body for multichannel immersion |
US10835924B1 (en) | 2016-07-25 | 2020-11-17 | SonicSensory, Inc. | Haptic transducer device and insole for receiving the same |
US10969402B2 (en) * | 2016-06-01 | 2021-04-06 | Sonion Nederland B.V. | Vibration sensor for a portable device including a damping arrangement to reduce mechanical resonance peak of sensor |
US11207018B2 (en) * | 2016-10-25 | 2021-12-28 | Boston Scientific Neuromodulation Corporation | Stimulation progamming aid using a sensory projection |
US11666942B2 (en) | 2016-07-25 | 2023-06-06 | Haptech Holdings, Inc. | Haptic transducer and footplate coupled to the same |
US11758318B1 (en) * | 2023-03-02 | 2023-09-12 | Flatvox Fzc Llc | Headphone and headset comprising the same |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170060114A (en) | 2014-09-24 | 2017-05-31 | 택션 테크놀로지 인코포레이티드 | Systems and methods for generating damped electromagnetically actuated planar motion for audio-frequency vibrations |
US10573139B2 (en) | 2015-09-16 | 2020-02-25 | Taction Technology, Inc. | Tactile transducer with digital signal processing for improved fidelity |
US10198920B1 (en) * | 2017-09-28 | 2019-02-05 | Apple Inc. | Wearable electronic device including audio output transducer and haptic actuator driving and related methods |
US11121661B2 (en) * | 2019-06-20 | 2021-09-14 | Cirrus Logic, Inc. | Minimizing transducer settling time |
US11785392B2 (en) | 2019-09-27 | 2023-10-10 | Apple Inc. | Dual function transducer |
US11070920B2 (en) | 2019-09-27 | 2021-07-20 | Apple Inc. | Dual function transducer |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4131180A (en) * | 1976-04-12 | 1978-12-26 | Trio Kabushiki Kaisha | Speaker system |
US4590332A (en) * | 1983-05-23 | 1986-05-20 | Pascal Delbuck | Phase coherent low frequency speaker |
US5388992A (en) * | 1991-06-19 | 1995-02-14 | Audiological Engineering Corporation | Method and apparatus for tactile transduction of acoustic signals from television receivers |
US5528697A (en) * | 1991-05-17 | 1996-06-18 | Namiki Precision Jewel Co., Ltd. | Integrated vibrating and sound producing device |
US6141427A (en) * | 1998-06-08 | 2000-10-31 | Temco Japan Co., Ltd. | Bone-conduction speaker |
US6839444B2 (en) * | 2000-11-30 | 2005-01-04 | New Transducers Limited | Loudspeakers |
US7003130B2 (en) * | 2003-01-29 | 2006-02-21 | Samsung Electro-Mechanics Co., Ltd. | Resonance frequency correction method and vibration speaker |
US7635941B2 (en) * | 2002-05-20 | 2009-12-22 | New Transducers Limited | Transducer |
US20100246861A1 (en) * | 2007-05-15 | 2010-09-30 | Han Sung-Moon | Small-sized sound receiver for producing body-sensing vibration |
US7916878B2 (en) * | 2004-04-16 | 2011-03-29 | New Transducers Limited | Acoustic device and method of making acoustic device |
US20130056296A1 (en) * | 2010-02-26 | 2013-03-07 | Pss Belgium N.V. | Mass loading for piston loudspeakers |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4482026A (en) * | 1982-12-02 | 1984-11-13 | Stehlin Jr George D | Loudspeaker enclosure |
US5054011A (en) * | 1989-04-25 | 1991-10-01 | Scosche Industries, Inc. | Adjustably mounted portable compact disc player |
US5125031A (en) * | 1991-08-14 | 1992-06-23 | Robert Ledonne | Speaker system with focused vibration |
KR950011496B1 (en) * | 1992-02-17 | 1995-10-05 | 이정기 | Body speaker |
US5629501A (en) * | 1994-06-23 | 1997-05-13 | Fenton; Robert | Composite speaker system having a directional adjustable transducer |
US5802191A (en) * | 1995-01-06 | 1998-09-01 | Guenther; Godehard A. | Loudspeakers, systems, and components thereof |
JP2937939B2 (en) * | 1996-04-25 | 1999-08-23 | 松下電器産業株式会社 | Exciter, excitation device and portable terminal device |
KR100354376B1 (en) * | 1999-12-08 | 2002-09-28 | 에스텍 주식회사 | Speaker having a device capable of generating both sound and vibration |
US6563934B1 (en) * | 2000-04-17 | 2003-05-13 | Motorola, Inc. | Mechanically tunable diaphragm using nickel titanium memory metal |
DE60139589D1 (en) * | 2000-09-28 | 2009-10-01 | Panasonic Corp | Electromagnetic transducer and portable communication device |
KR20010078915A (en) * | 2001-05-17 | 2001-08-22 | 안치엽 | Sound-to-vibration conversion apparatus |
KR100419161B1 (en) * | 2001-08-22 | 2004-02-18 | 삼성전기주식회사 | Multi-functional Actuator |
US7421088B2 (en) * | 2003-08-28 | 2008-09-02 | Motorola, Inc. | Multifunction transducer |
KR100612217B1 (en) * | 2003-11-08 | 2006-08-14 | 아이필유(주) | Multi-function dual mode micro speaker having function as tactile sound, bone conduction and vibration motor |
US8290192B2 (en) * | 2005-02-03 | 2012-10-16 | Nokia Corporation | Gaming headset vibrator |
US20090180646A1 (en) * | 2005-05-28 | 2009-07-16 | Evgeny Vulfson | Wearable Tactile Subwoofer and Its Use |
US8027491B2 (en) * | 2006-03-03 | 2011-09-27 | Tactile Sound Systems, Inc. | Contact speaker |
KR20080048377A (en) * | 2006-11-28 | 2008-06-02 | 아이필유(주) | Microspeaker having vibration function |
US8520866B2 (en) * | 2006-12-15 | 2013-08-27 | Nokia Corporation | Apparatus, method, and computer program product providing sound-produced tactile feedback |
CN102577434A (en) * | 2009-04-10 | 2012-07-11 | 伊默兹公司 | Systems and methods for acousto-haptic speakers |
US20100296691A1 (en) * | 2009-05-19 | 2010-11-25 | Aishin Co., Ltd. | Electromechanical vibration converter for tactile acoustic apparatus |
US8243963B2 (en) * | 2009-06-18 | 2012-08-14 | Gladwin Timothy A | Swivel tweeter mechanism for a constant phase coaxial acoustic transducer |
SG184123A1 (en) * | 2010-03-17 | 2012-10-30 | Bayer Ip Gmbh | Statistic analysis of audio signals for generation of discernable feedback |
FR2964761B1 (en) * | 2010-09-14 | 2012-08-31 | Thales Sa | HAPTIC INTERACTION DEVICE AND METHOD FOR GENERATING HAPTIC AND SOUND EFFECTS |
-
2012
- 2012-10-05 EP EP12838657.0A patent/EP2786591B1/en active Active
- 2012-10-05 WO PCT/US2012/059080 patent/WO2013052883A1/en active Application Filing
- 2012-10-05 US US13/646,218 patent/US20130202134A1/en not_active Abandoned
-
2017
- 2017-02-06 US US15/425,799 patent/US10154348B2/en active Active
-
2018
- 2018-12-10 US US16/214,360 patent/US10979817B2/en active Active
-
2021
- 2021-04-12 US US17/228,546 patent/US11611832B2/en active Active
-
2023
- 2023-02-14 US US18/169,066 patent/US20230379632A1/en active Pending
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4131180A (en) * | 1976-04-12 | 1978-12-26 | Trio Kabushiki Kaisha | Speaker system |
US4590332A (en) * | 1983-05-23 | 1986-05-20 | Pascal Delbuck | Phase coherent low frequency speaker |
US5528697A (en) * | 1991-05-17 | 1996-06-18 | Namiki Precision Jewel Co., Ltd. | Integrated vibrating and sound producing device |
US5388992A (en) * | 1991-06-19 | 1995-02-14 | Audiological Engineering Corporation | Method and apparatus for tactile transduction of acoustic signals from television receivers |
US6141427A (en) * | 1998-06-08 | 2000-10-31 | Temco Japan Co., Ltd. | Bone-conduction speaker |
US6839444B2 (en) * | 2000-11-30 | 2005-01-04 | New Transducers Limited | Loudspeakers |
US7635941B2 (en) * | 2002-05-20 | 2009-12-22 | New Transducers Limited | Transducer |
US7003130B2 (en) * | 2003-01-29 | 2006-02-21 | Samsung Electro-Mechanics Co., Ltd. | Resonance frequency correction method and vibration speaker |
US7916878B2 (en) * | 2004-04-16 | 2011-03-29 | New Transducers Limited | Acoustic device and method of making acoustic device |
US20100246861A1 (en) * | 2007-05-15 | 2010-09-30 | Han Sung-Moon | Small-sized sound receiver for producing body-sensing vibration |
US20130056296A1 (en) * | 2010-02-26 | 2013-03-07 | Pss Belgium N.V. | Mass loading for piston loudspeakers |
Cited By (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9785236B2 (en) * | 2012-05-25 | 2017-10-10 | Immerz, Inc. | Haptic interface for portable electronic device |
US20130318438A1 (en) * | 2012-05-25 | 2013-11-28 | Immerz, Inc. | Haptic interface for portable electronic device |
US10111010B2 (en) | 2013-08-28 | 2018-10-23 | Subpac, Inc. | Multistage tactile sound device |
KR102211084B1 (en) * | 2013-08-28 | 2021-02-02 | 써브팩, 아이엔씨. | Multistage tactile sound device |
US10812914B2 (en) | 2013-08-28 | 2020-10-20 | Subpac, Inc. | Multistage tactile sound device |
KR20160065839A (en) * | 2013-08-28 | 2016-06-09 | 써브팩, 아이엔씨. | Multistage tactile sound device |
US20150063606A1 (en) * | 2013-08-28 | 2015-03-05 | StudioFeed USA, LLC | Multistage tactile sound device |
US9672703B2 (en) * | 2013-08-28 | 2017-06-06 | Subpac, Inc. | Multistage tactile sound device |
US9549260B2 (en) * | 2013-12-30 | 2017-01-17 | Skullcandy, Inc. | Headphones for stereo tactile vibration, and related systems and methods |
US20150189441A1 (en) * | 2013-12-30 | 2015-07-02 | Skullcandy, Inc. | Headphones for stereo tactile vibration, and related systems and methods |
US10063976B2 (en) | 2013-12-30 | 2018-08-28 | Skullcandy, Inc. | Headphones for stereo tactile vibration, and related systems and methods |
US20150208155A1 (en) * | 2014-01-20 | 2015-07-23 | Fairchild Semiconductor Corporation | Apparatus and method for recovering from partial insertion of an audio jack |
US9584893B2 (en) * | 2014-01-20 | 2017-02-28 | Fairchild Semiconductor Corporation | Apparatus and method for recovering from partial insertion of an audio jack |
US9794708B2 (en) | 2014-01-20 | 2017-10-17 | Fairchild Semiconductor Corporation | Apparatus and method for detecting insertion anomaly of an audio jack |
US9613506B2 (en) | 2014-05-30 | 2017-04-04 | Apple Inc. | Synchronization of independent output streams |
US9913033B2 (en) * | 2014-05-30 | 2018-03-06 | Apple Inc. | Synchronization of independent output streams |
US20150350803A1 (en) * | 2014-05-30 | 2015-12-03 | Apple Inc. | Synchronization of independent output streams |
US10146311B2 (en) | 2014-06-09 | 2018-12-04 | Immersion Corporation | Haptic devices and methods for providing haptic effects via audio tracks |
US20190101990A1 (en) * | 2014-06-09 | 2019-04-04 | Immersion Corporation | Haptic devices and methods for providing haptic effects via audio tracks |
US20170173457A1 (en) * | 2014-06-09 | 2017-06-22 | Immersion Corporation | System and method for outputting a haptic effect based on a camera zoom state, camera perspective, and/or a direction in which a user's eyes are directed |
US9588586B2 (en) | 2014-06-09 | 2017-03-07 | Immersion Corporation | Programmable haptic devices and methods for modifying haptic strength based on perspective and/or proximity |
US20150355712A1 (en) * | 2014-06-09 | 2015-12-10 | Immersion Corporation | Haptic devices and methods for providing haptic effects via audio tracks |
US9715279B2 (en) * | 2014-06-09 | 2017-07-25 | Immersion Corporation | Haptic devices and methods for providing haptic effects via audio tracks |
US11521477B2 (en) | 2014-09-02 | 2022-12-06 | Apple Inc. | Providing priming cues to a user of an electronic device |
US10984649B2 (en) | 2014-09-02 | 2021-04-20 | Apple Inc. | Providing priming cues to a user of an electronic device |
US10186138B2 (en) | 2014-09-02 | 2019-01-22 | Apple Inc. | Providing priming cues to a user of an electronic device |
US10291991B2 (en) * | 2015-05-21 | 2019-05-14 | Goertek, Inc. | Electrical-acoustic transformation device and electronic device |
US20180054680A1 (en) * | 2015-05-21 | 2018-02-22 | Goertek, Inc. | Electrical-acoustic transformation device and electronic device |
US10390156B2 (en) * | 2016-05-09 | 2019-08-20 | Subpac, Inc. | Tactile sound device having active feedback system |
US10969402B2 (en) * | 2016-06-01 | 2021-04-06 | Sonion Nederland B.V. | Vibration sensor for a portable device including a damping arrangement to reduce mechanical resonance peak of sensor |
US11666942B2 (en) | 2016-07-25 | 2023-06-06 | Haptech Holdings, Inc. | Haptic transducer and footplate coupled to the same |
US10835924B1 (en) | 2016-07-25 | 2020-11-17 | SonicSensory, Inc. | Haptic transducer device and insole for receiving the same |
US20190300020A1 (en) * | 2016-08-05 | 2019-10-03 | Subpac, Inc. | Transducer system providing tactile sensations |
US10940872B2 (en) * | 2016-08-05 | 2021-03-09 | Subpac, Inc. | Transducer system providing tactile sensations |
DE102016115199A1 (en) * | 2016-08-16 | 2018-02-22 | Endress+Hauser Flowtec Ag | Ultrasonic sensor for determining or monitoring a process variable of a medium in automation technology |
DE102016115199B4 (en) | 2016-08-16 | 2023-08-31 | Endress+Hauser Flowtec Ag | Ultrasonic sensor for determining or monitoring a process variable of a medium in automation technology |
US11207018B2 (en) * | 2016-10-25 | 2021-12-28 | Boston Scientific Neuromodulation Corporation | Stimulation progamming aid using a sensory projection |
CN106507262A (en) * | 2016-12-27 | 2017-03-15 | 深圳精拓创新科技有限公司 | A kind of diaphragm of loudspeaker tester with controlled excitation source |
US10152296B2 (en) | 2016-12-28 | 2018-12-11 | Harman International Industries, Incorporated | Apparatus and method for providing a personalized bass tactile output associated with an audio signal |
US10620906B2 (en) | 2016-12-28 | 2020-04-14 | Harman International Industries, Incorporated | Apparatus and method for providing a personalized bass tactile output associated with an audio signal |
US11358859B2 (en) | 2016-12-30 | 2022-06-14 | Sonion Nederland B.V. | Micro-electromechanical transducer |
US20180186622A1 (en) * | 2016-12-30 | 2018-07-05 | Sonion Nederland B.V. | Micro-electromechanical transducer |
US10947108B2 (en) * | 2016-12-30 | 2021-03-16 | Sonion Nederland B.V. | Micro-electromechanical transducer |
US11760624B2 (en) | 2016-12-30 | 2023-09-19 | Sonion Nederland B.V. | Micro-electromechanical transducer |
WO2020047679A1 (en) * | 2018-09-07 | 2020-03-12 | Audio Hospitality Inc. | Methods and systems applied to transposing audio signals to haptic stimuli in the body for multichannel immersion |
US11758318B1 (en) * | 2023-03-02 | 2023-09-12 | Flatvox Fzc Llc | Headphone and headset comprising the same |
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US11611832B2 (en) | 2023-03-21 |
EP2786591A1 (en) | 2014-10-08 |
US20170150273A1 (en) | 2017-05-25 |
EP2786591A4 (en) | 2016-05-04 |
US20230379632A1 (en) | 2023-11-23 |
US10154348B2 (en) | 2018-12-11 |
US20210377667A1 (en) | 2021-12-02 |
EP2786591B1 (en) | 2018-06-27 |
WO2013052883A1 (en) | 2013-04-11 |
US10979817B2 (en) | 2021-04-13 |
US20190281391A1 (en) | 2019-09-12 |
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