US20120229156A1 - Testing apparatus and relative method - Google Patents
Testing apparatus and relative method Download PDFInfo
- Publication number
- US20120229156A1 US20120229156A1 US13/394,127 US201013394127A US2012229156A1 US 20120229156 A1 US20120229156 A1 US 20120229156A1 US 201013394127 A US201013394127 A US 201013394127A US 2012229156 A1 US2012229156 A1 US 2012229156A1
- Authority
- US
- United States
- Prior art keywords
- testing
- substrate
- holes
- suction
- nest
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 129
- 238000000034 method Methods 0.000 title claims description 22
- 239000000758 substrate Substances 0.000 claims abstract description 146
- 239000000523 sample Substances 0.000 claims abstract description 42
- 230000009471 action Effects 0.000 claims description 25
- 239000004020 conductor Substances 0.000 claims description 2
- 230000000712 assembly Effects 0.000 claims 1
- 238000000429 assembly Methods 0.000 claims 1
- 238000003780 insertion Methods 0.000 abstract description 9
- 230000037431 insertion Effects 0.000 abstract description 9
- 238000012545 processing Methods 0.000 description 34
- 230000000875 corresponding effect Effects 0.000 description 23
- 239000000463 material Substances 0.000 description 13
- 238000007689 inspection Methods 0.000 description 9
- 238000007650 screen-printing Methods 0.000 description 8
- 235000012431 wafers Nutrition 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 238000011161 development Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000012546 transfer Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 3
- 238000007641 inkjet printing Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920005372 Plexiglas® Polymers 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000002596 correlated effect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000012811 non-conductive material Substances 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S50/00—Monitoring or testing of PV systems, e.g. load balancing or fault identification
- H02S50/10—Testing of PV devices, e.g. of PV modules or single PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention concerns a testing apparatus and relative method used in a production plant for electronic devices to carry out an electric control, or test of the devices thus made.
- the testing apparatus is used to carry out an electric control of substrates, or wafers, of solar cells, to check for possible defects in the electric pattern or patterns made therein.
- Testing apparatuses to test electronic devices such as substrates or wafers of solar cells, are known, which are normally positioned at the end of a production line of a plant which produces said electronic devices.
- substrates or wafers made of semi-conductor material of solar cells, but it cannot be excluded that the apparatus according to the present invention can be used for testing other types of electronic devices such as electronic cards, PCB (Printed Circuit Boards) or others.
- These known testing apparatuses comprise two beds of needles disposed reciprocally facing between which at least a substrate to be tested is positioned.
- the substrate is provided on both its sides with a plurality of electric contact areas, connected to an electric pattern made in the substrate itself.
- the beds of needles are reciprocally movable between at least a first position in which they allow the insertion of the substrate to be tested between the beds, substantially like a sandwich, and a second position, in which they are disposed so as to allow the needles to contact the corresponding contact areas of both sides of the substrate.
- the beds of needles disposed in the second position allow to exert a mechanical contrasting action on both sides of the substrate, keeping the substrate in a stable and secure position during the testing.
- Substrates or wafers of the “all back contacts” type are also known, in which all the contact areas are disposed on one side of the substrate, for example the rear side.
- the testing apparatus provides the presence of a single bed of needles, reciprocally movable with respect to the substrate so as to allow the substrate to be positioned so that each needle is in contact with a corresponding contact area.
- One purpose of the present invention is to make a testing apparatus which allows to maintain the substrates or wafers or other electronic devices to be tested stable in a desired position, avoiding unwanted damage or breakages of the substrates during testing.
- Another purpose of the present invention is to perfect a testing method for substrates, or other electronic devices, which allows to keep the substrates or wafers or other electronic devices to be tested stable in a desired position, avoiding unwanted damage and breakages of the substrates during testing.
- the Applicant has devised, tested and embodied the present invention to overcome the shortcomings of the state of the art and to obtain these and other purposes and advantages.
- a testing apparatus can, for example, be used in a production plant for substrates of solar cells, or other electronic devices, to carry out an electric control or test on the devices thus made.
- the testing apparatus comprises a support, substantially flat, able to support on one of its surfaces, directly or indirectly, at least a substrate or other device to be electrically tested.
- the support comprises a plurality of through holes, each suitable for the insertion of a corresponding electric testing probe of the apparatus, to allow the connection and/or contact of each probe with a corresponding test area of the substrate.
- the testing apparatus comprises suction means associated with the support, and suitable to exert a holding action through depression on one side of the substrate in order to contrast the thrust action exerted by the testing probes on said testing areas.
- the suction means are disposed in cooperation with each through hole of the support. This allows an optimal distribution of the holding action exerted on the substrate depending on the actual thrusting action exerted by the probes.
- each substrate is operatively associable with a supporting nest, used for the movement and the transport of the substrate during different steps of production.
- the supporting nest is provided with a plurality of through openings, each of which is able to cooperate with at least a corresponding hole of the support for the passage of a corresponding test probe.
- each nest comprises a suction pipe operatively associable with the suction means to allow to hold the substrate to the supporting nest, and therefore to the support.
- the present invention also concerns a method for testing substrates of solar cells and other electronic devices.
- the method comprises a step in which a substrate, or other device to be electrically tested, is disposed on a support, substantially flat, comprising a plurality of through holes, each one suitable for the insertion of a corresponding electric testing probe, belonging to a plurality of testing probes.
- the method comprises a testing step in which at least some of the testing probes are inserted in a corresponding through hole to be connected and put in contact with a corresponding testing area of the substrate.
- the method comprises a suction step in which, by means of suction means, associated with the support, a holding action through depression is exerted on one side of the substrate in order to contrast the thrusting action exerted by the testing probes on the testing areas in said testing step.
- FIG. 1 is a schematic isometric view of a processing system used with embodiments of the present invention
- FIG. 2 is a schematic plan view of the system depicted in FIG. 1 ;
- FIG. 3 is a perspective view of the testing apparatus according to the present invention.
- FIG. 4 is a top plan view of the testing apparatus of FIG. 3 ;
- FIG. 4A is an enlarged view of particular of FIG. 4 ;
- FIG. 5 is a lateral view of FIG. 3 ;
- FIG. 5A is an enlarged view of a particular of FIG. 5 ;
- FIG. 6 is a perspective view of part of the testing apparatus according to the present invention.
- FIG. 7 is a top plan view of a detail of FIG. 6 ;
- FIG. 8 is a perspective view of a needle supporting member of the apparatus according to the present invention.
- FIG. 9 is an enlarged view from above of a detail of FIG. 7 ;
- FIG. 10 is a view from above of a variant of the detail in FIG. 9 ;
- FIG. 11 is a schematic view in section from VI to VI in FIG. 10 .
- a testing apparatus 10 can be used in a plant to produce substrates 150 , or wafers, for solar cells, advantageously, but not exclusively, of the “back side contact” type, in which all the metallic contacts for the extraction of converted electric energy are disposed on one single side of the substrate 150 .
- the substrates 150 have a substantially flat structure of a square or rectangular shape.
- FIG. 1 is a schematic isometric view of a system 100 for processing substrates 150 , associated with an embodiment of the present invention.
- the system 100 generally includes two incoming conveyors 111 , an actuator assembly 140 , a plurality of processing nests 131 , a plurality of processing heads 102 , two outgoing conveyors 112 , and a system controller 101 .
- the incoming conveyors 111 are configured in a parallel processing configuration so that each can receive unprocessed substrates 150 from an input device, such as an input conveyor 113 , and transfer each unprocessed substrate 150 to a processing nest 131 coupled to the actuator assembly 140 .
- the outgoing conveyors 112 are configured in parallel so that each can receive a processed substrate 150 from a processing nest 131 and transfer each processed substrate 150 to a substrate removal device, such as an exit conveyor 114 .
- each exit conveyor 114 is adapted to transport processed substrates 150 through an oven 199 to cure material deposited on the substrate 150 via the processing heads 102 .
- the system 100 is a screen printing processing system and the processing heads 102 include screen printing components, which are configured to screen print a patterned layer of material on a substrate 150 .
- the system 100 is an ink jet printing system and the processing heads 102 include ink jet printing components, which are configured to deposit a patterned layer of material on a substrate 150 .
- FIG. 2 is a schematic plan view of the system 100 depicted in FIG. 1 .
- FIGS. 1 and 2 illustrate the system 100 having two processing nests 131 (in positions “ 1 ” and “ 3 ”) each positioned to both transfer a processed substrate 150 to the outgoing conveyor 112 and receive an unprocessed substrate 150 from the incoming conveyor 111 .
- the substrate motion generally follows the path “A” shown in FIGS. 1 and 2 .
- the other two processing nests 131 are each positioned under a processing head 102 so that a process (e.g., screen printing, ink jet printing, material removal) can be performed on the unprocessed substrates 150 situated on the respective processing nests 131 .
- a process e.g., screen printing, ink jet printing, material removal
- Such a parallel processing configuration allows increased processing capacity with a minimized processing system footprint.
- the system 100 is depicted having two processing heads 102 and four processing nests 131 , the system 100 may comprise additional processing heads 102 and/or processing nests 131 without departing from the scope of the present invention.
- the incoming conveyor 111 and outgoing conveyor 112 include at least one belt 116 to support and transport the substrates 150 to a desired position within the system 100 by use of an actuator (not shown) that is in communication with the system controller 101 .
- FIGS. 1 and 2 generally illustrate a two belt style substrate transferring system, other types of transferring mechanisms may be used to perform the same substrate transferring and positioning functions without varying from the basic scope of the invention.
- the system 100 also includes an inspection system 200 , which is adapted to locate and inspect the substrates 150 before and after processing has been performed.
- the inspection system 200 may include one or more detection means, or cameras 120 , that are positioned to inspect a substrate 150 positioned in the loading/unloading positions “ 1 ” and “ 3 ,” as shown in FIGS. 1 and 2 .
- the inspection system 200 generally includes at least one camera 120 (e.g., CCD camera) and other electronic components that are able to locate, inspect, and communicate the results to the system controller 101 .
- the inspection system 200 locates the position of certain features of an incoming substrate 150 and communicates the inspection results to the system controller 101 for analysis of the orientation and position of the substrate 150 to assist in the precise positioning of the substrate 150 under a processing head 102 prior to processing the substrate 150 .
- the inspection system 200 inspects the substrates 150 so that damaged or mis-processed substrates can be removed from the production line.
- the processing nests 131 may each contain a lamp, or other similar optical radiation device, to illuminate the substrate 150 positioned thereon so that it can be more easily inspected by the inspection system 200 .
- the system controller 101 facilitates the control and automation of the overall system 100 and may include a central processing unit (CPU) (not shown), memory (not shown), and support circuits (or I/O) (not shown).
- the CPU may be one of any form of computer processors that are used in industrial settings for controlling various chamber processes and hardware (e.g., conveyors, detectors, motors, fluid delivery hardware, etc.) and monitor the system and chamber processes (e.g., substrate position, process time, detector signal, etc.).
- the memory is connected to the CPU and may be one or more of a readily available memory, such as random access memory (RAM), read only memory (ROM), floppy disk, hard disk, or any other form of digital storage, local or remote.
- Software instructions and data can be coded and stored within the memory for instructing the CPU.
- the support circuits are also connected to the CPU for supporting the processor in a conventional manner.
- the support circuits may include cache, power supplies, clock circuits, input/output circuitry, subsystems, and the like.
- a program (or computer instructions) readable by the system controller 101 determines which tasks are performable on a substrate.
- the program is software readable by the system controller 101 , which includes code to generate and store at least substrate positional information, the sequence of movement of the various controlled components, substrate inspection system information, and any combination thereof.
- the two processing heads 102 utilized in the system 100 may be conventional screen printing heads available from Applied Materials Italia Srl which are adapted to deposit material in a desired pattern on the surface of a substrate 150 disposed on a processing nest 131 in position “ 2 ” or “ 4 ” during a screen printing process.
- the processing head 102 includes a plurality of actuators, for example, actuators 105 (e.g., stepper motors or servomotors) that are in communication with the system controller 101 and are used to adjust the position and/or angular orientation of a screen printing mask (not shown) disposed within the processing head 102 with respect to the substrate 150 being printed.
- actuators 105 e.g., stepper motors or servomotors
- the screen printing mask is a metal sheet or plate with a plurality of holes, slots, or other apertures formed therethrough to define a pattern and placement of screen printed material on a surface of a substrate 150 .
- the screen printed material may comprise a conductive ink or paste, a dielectric ink or paste, a dopant gel, an etch gel, one or more mask materials, or other conductive or dielectric materials.
- the screen printed pattern that is to be deposited on the surface of a substrate 150 is aligned to the substrate 150 in an automated fashion by orienting the screen printing mask using the actuators 105 and information received by the system controller 101 from the inspection system 200 .
- the processing heads 102 are adapted to deposit a metal containing or dielectric containing material on a solar cell substrate having a width between about 125 mm and 156 mm and a length between about 70 mm and 156 mm.
- the apparatus 10 is generally disposed downstream the exit conveyors 114 and the ovens 199 in the system 100 and comprises a support 16 ( FIGS. 3 , 4 , 6 ), a supporting nest 18 for each substrate 150 to be tested, a test member 26 provided with probes or needles 42 , for the electric testing of the substrate 150 , and one or more suction pipes 50 distributed inside the support 16 and operatively connectable to holes 24 in the nest 18 .
- Each substrate is transferred from the exit conveyor 114 to the supporting nest 18 in a known way, for example by means of an automated transfer system able to move the substrate from the conveyor 114 to the supporting nest 18 and to the support 16 .
- the support 16 substantially flat, is suitable to support in a horizontal position at least one nest 18 and therefore, as will be described in more detail hereafter, an associated substrate 150 .
- the support 16 is preferably made of steel covered by a first layer of nickel and by a second layer of dielectric varnish, of the known type and easily available on the market, therefore allowing to obtain an efficient and optimal support planarity and an adequate electric insulation of the support 16 .
- the support 16 is provided with a plurality of first through testing holes 22 ( FIG. 11 ), suitable to allow the passage of at least a corresponding needle 42 of the test member 26 , as will be described in more detail hereafter.
- the suction pipes 50 ( FIG. 6 ) are also provided with a suction sleeve 51 at one of their ends, in turn connected to a suction member of the known type, not shown, such as a vacuum generator or other suitable device.
- the nest 18 also substantially flat, has a regular shape, for example rectangular or square, and is made of a non-conductive material, for example Plexiglas.
- the nest 18 is provided with abutment pins 20 ( FIGS. 3 , 4 and 5 ), disposed in predetermined positions on its upper surface, so as to allow a precise positioning of the substrate 150 in a predetermined position and to impede an unwanted horizontal movement thereof during testing.
- the disposition of the abutment pins 20 is such as to allow the positioning on the supporting nest 18 of various types of substrate 150 having different formats.
- Each supporting nest 18 can also be used for moving an associated substrate 150 also during other working steps, as for example during the step or steps of printing the electric patterns.
- the nest 18 is moved together with its own substrate 150 , by movement means of the known type, such as conveyor belts or conveyors.
- the supporting nest 18 is also provided with a plurality of second testing holes 23 ( FIGS. 7 , 9 , 10 and 11 ), through and disposed in predetermined positions coordinated with the disposition of the first testing holes 22 , that is, substantially concentric to them when the nest 18 is positioned on the support 16 , so as to allow the passage of at least one needle 42 of the test member 26 both through the first testing hole 22 and the second testing hole 23 , as will be described in more detail hereafter.
- the diameter D 2 of the second hole 23 ( FIG. 11 ) is advantageously smaller than the diameter D 1 of the first testing hole 22 so as to allow an easy insertion of a corresponding testing needle 42 , even if one or more needles 42 are not perfectly aligned with the holes 22 , 23 or have an inclination not perfectly perpendicular to the plane of the support 16 . This so as to further reduce the possibility of an undesired contact of each needle 42 with the support 16 or with the nest 18 .
- the nest 18 is also provided with a suction line 52 ( FIG. 6 ) operatively connectable at predetermined joining points 52 a to the suction pipe 50 , when the nest 18 is disposed on the support 16 .
- the suction line 52 develops inside the thickness of the nest 18 so as to define a suction course for the air which is distributed in proximity to each of the second testing holes 23 .
- the suction line 52 in fact, is provided with suction portions 53 ( FIG. 9 ) which develop around each second hole 23 and surround it.
- Each portion 53 is connected to the upper surface of the nest 18 by means of a plurality of suction holes 24 ( FIGS. 7 , 9 , 10 , 11 ), suitable to generate a condition of local depression around the second hole 23 on the contact surface of the substrate 150 so as to exert an effective action to hold the substrate on the nest 18 during testing, as will be explained in more detail hereafter.
- the suction holes 24 are advantageously distanced in a regular way on the development of each portion 53 , so as to generate an effective holding action through depression on the substrate 150 which contrasts locally the mechanical thrusting action exerted by the needles 42 .
- each portion 53 has a quadrangular development and the holes 24 are disposed in correspondence with the angles and in intermediate positions along its sides.
- the portions 53 have a substantially circular development in which the holes 24 are disposed substantially equidistant.
- the number of holes 24 which guarantees an effective holding action is correlated to the sizes of the portion 53 , for example its diameter, to the thrust force of the needles 42 , and the holding/depression force exerted, as will be described in more detail hereafter.
- the number of holes 24 related to each portion 53 is eight.
- suction holes 24 can be greater or fewer than eight, or that, instead of suction holes 24 , a single suction opening can be made, conformed in a circular manner, so as to surround, at least partly, the second hole 23 .
- the test member 26 ( FIGS. 3 , 6 and 8 ) comprises two arms 30 , made for example of Plexiglas, disposed parallel and at the same reciprocal height under the support 16 .
- the arms 28 are disposed at a predetermined reciprocal distance so as to support respective bars 30 .
- Each bar 30 is suitable to support a plurality of electric testing needles 42 .
- the number of bars 30 is coordinated to the number of needles 42 on the basis of typology and size of the different substrates 150 to be tested.
- the bars 30 are slidingly constrained in correspondence with their opposite ends to sliding guides 29 made on each arm 28 . This is to position the bars 30 at regular and predetermined reciprocal distances or in at least partly reciprocal continuity between two or more bars 30 , to obtain a desired positioning of the needles 42 , consistent with the actual sizes of the substrates 150 to be tested.
- the arms 28 are also movable ( FIG. 6 ), substantially in a vertical direction, according to the direction of the arrow F, between a lower position in which the needles 42 are not inserted in the holes 22 , 23 , and a higher position in which the bars 30 are disposed adjacent to the support 16 to allow the insertion of each needle 42 in a respective pair of holes 22 , 23 and therefore allow contact with the zone of the substrate 150 to be tested.
- the movement of the arms 28 occurs by means of a pair of actuators 34 of the known type, e.g., air cylinders, electric motors or the like, disposed laterally with respect to the support 16 .
- Each actuator is provided with a vertically movable piston 36 able to cooperate with a horizontal shoulder element 38 , solid with a corresponding arm 28 so as to lift and lower them and therefore to position the bars 30 at the desired height.
- the bars 30 are replaced by a single flat support structure, constrained along two of its opposite lateral edges to the arms.
- the needles 42 are distributed on the flat structure according to a predetermined disposition consistent with the different types and sizes of substrates to be tested.
- the testing needles 42 are conductive components typically comprising a metallic material and having at least a desired shaped contact point that is configured to achieve a reliable contact with the surface of the substrate 150 .
- Each testing needle 42 is suitable to measure both the voltage and the current in correspondence with the predetermined zone of the substrate 150 .
- each needle 42 is provided with two testing probes, not shown in the present drawings, conformed in a point and disposed substantially parallel, of which one is suitable to acquire the value of voltage and the other to acquire the value of electrical current flowing through the contact point that is in contact with the substrate 150 .
- the needle 42 can be of the coaxial type in which a first external probe is suitable to measure the current or tension and a second internal probe is suitable to measure the tension or the current, retractable with respect to the external probe.
- Each needle 42 is electrically connected, in a known way, to a processing unit, for example to the system controller 101 or to another controller, able to acquire and process the voltage and current values and verify that these values are within a range provided for the correct functioning of the substrate 150 .
- the testing apparatus 10 as described heretofore functions as follows.
- the substrate 150 is transferred to a supporting nest 18 and transported together with it on the support 16 in the direction indicated by the arrow “A” ( FIGS. 3 , 4 ), by means of an actuator, for example a magnetic linear motor 25 which is able to move the support 16 .
- the nest 18 is positioned on the support 16 so as to align the second holes 23 with corresponding first holes 22 and so as to hydraulically connect the line 52 with the pipes 50 .
- the arms 28 are disposed in their lower position, so as to allow an easy positioning of the nest 18 and the substrate 150 .
- the arms 28 are moved by the actuators 34 into their higher position so as to allow the insertion of each needle 42 in a corresponding pair of holes 22 , 23 , and therefore the contact with a corresponding area of the surface of the lower side of the substrate 150 .
- the suction member is activated so as to generate a depression in the pipes 50 , in the line 52 and therefore in the corresponding portions 53 .
- This allows one to obtain a holding action distributed in a uniform and regular way both around each hole 23 , and exerted by depression by means of the suction holes 24 surrounding each hole 23 , and also a uniform holding action carried out directly on the whole surface of the lower side, i.e. the backside, of the substrate 150 .
- This allows to hold the substrate 150 in an efficient and secure way, and therefore the nest 18 , to the support 16 during the electric testing.
- the holding action is made in such a way as to contrast the overall mechanical thrust exerted by the testing needles 42 which are disposed in contact with the areas of the substrate 150 to be tested. In this way it is possible to maintain the substrates 150 in one fixed position during testing, avoiding possible wrong measurements.
- the number of holes 24 which guarantees an effective holding action is correlated to the sizes of the portion 53 , for example its diameter, to the thrust force of the needles 42 , and the holding/depression force exerted.
- the maximum force that the needle 42 , or one of its springs, of the known type and not shown in the figures, exerts on the substrate, and the ultimate tensile stress of the material that makes up the substrate are taken as known.
- a safety coefficient defined as the ratio between ultimate tensile stress, expressed in [N/mm2], and the admissible mechanical tension, it is possible to calculate the positioning diameter of the holes 24 along the portion 53 .
- the minimum diameter D 3 of the circumference of development of the portion 53 is also determined by a dynamic condition: in the case of small diameters the substrate 150 disposed on the nest 18 , given the same stress, is subjected locally to a lesser deformation, which gives a lesser cushioning. This in turn entails that the impact between each needle 42 and the substrate is less cushioned, and can cause the substrate to break.
- the ratio K 1 between the number of holes 24 and the diameter D 3 of the portion 53 is equal to 0.5 mm-1; the ratio K 2 between said diameter D 3 and the total area of the holes 24 is equal to about 0.92 mm-1.
- the number of holes 24 is between five and ten. In one embodiment, the number of holes 24 is eight.
- the testing of the substrate 150 is performed in a known way, measuring voltage and current between predetermined contact points of the substrates, so as to measure, for example, the resistance of the screen patterned layer and/or the surface resistance of the doped portions of the substrate 150 .
- the arms 28 are moved into their lower position by means of the actuators 34 , so as to allow the extraction of each needle 42 from the corresponding pair of holes 22 , 23 .
- the depression member is deactivated, allowing the subsequent movement of the nest 18 and the substrate 150 in the direction indicated by the arrow “U” and the transfer of the substrate 150 for example toward a subsequent process, or in the case of a defective substrate 150 to a discharge station for discards.
- a testing apparatus used in a plant to produce substrates ( 150 ) for solar cells, or other electronic devices, comprising a support ( 16 ), substantially flat and able to support, directly or indirectly, on a surface thereof at least a substrate ( 150 ) or other device to be electrically tested, a supporting nest ( 18 ) for each substrate ( 150 ) to be tested, and a plurality of testing probes ( 42 ), said support ( 16 ) comprising a plurality of through holes ( 22 ), each suitable for the insertion of a corresponding testing probe ( 42 ), to allow the connection of each probe ( 42 ) to a corresponding and predetermined testing area of the substrate, characterized in that it comprises suction means ( 50 ), distributed inside the support ( 16 ) from the same side where the testing probes ( 42 ) are located, operatively connectable to suction holes ( 24 ) provided in the nest ( 18 ) through a suction line ( 52 ), each of said nest ( 18 ) comprising testing holes ( 23 ) suitable to be
- the apparatus is characterized in that said suction means ( 50 ) are disposed in cooperation with each through hole ( 22 ) of the support ( 16 ).
- the apparatus is characterized in that the suction line ( 52 ) develops in the nest ( 18 ) so as to define a suction path distributed in proximity with each of said testing holes ( 23 ).
- the apparatus is characterized in that the suction line ( 52 ) is provided with suction portions which develop around each of said testing holes ( 23 ), at least partly surrounding it, each portion being connected to the upper surface of the nest ( 18 ) by means of said suction holes ( 24 ).
- the apparatus is characterized in that said suction portion is a quadrangular shape.
- the apparatus is characterized in that said suction portion is a circular shape.
- the apparatus is characterized in that the number of suction holes ( 24 ) goes from five to ten.
- the apparatus is characterized in that the number of suction holes ( 24 ) is eight.
- the apparatus is characterized in that the suction holes ( 24 ) are distanced in a regular way along the development of each suction portion.
- the apparatus is characterized in that the support ( 16 ) is made of at least partly non-conductive material.
- a method for testing substrates ( 150 ) of solar cells, or other electronic devices comprising a step in which a substrate ( 150 ) to be tested electrically is disposed on a supporting nest ( 18 ) and then the nest ( 18 ) is positioned on a support ( 16 ), substantially flat, comprising a plurality of through testing holes ( 22 ), each suitable for the insertion of a corresponding testing probe ( 42 ) of a plurality of testing probes ( 42 ), each of said nest ( 18 ) comprising testing holes ( 23 ) suitable to be aligned, in use, to the testing holes ( 22 ) provided in the support ( 16 ) to allow the passage through of the relative testing probe ( 42 ), a testing step in which at least some of the testing probes ( 42 ) are inserted in said corresponding testing holes ( 22 , 23 ) to be connected and put in contact with a corresponding testing area of the substrate ( 150 ), characterized in that it comprises a suction step in which by means of suction means ( 50 ).
- the method is characterized in that said suction means ( 50 ) are disposed in cooperation with each through hole ( 22 ) of the support ( 16 )
Abstract
Description
- This application claims benefit of International Patent Application Serial No. PCT/EP2010/062831 filed Sep. 2, 2010, which claims the benefit of Italian Patent Application Serial Number UD2009A000146, filed Sep. 3, 2009, which are both herein incorporated by reference.
- The present invention concerns a testing apparatus and relative method used in a production plant for electronic devices to carry out an electric control, or test of the devices thus made.
- In particular, the testing apparatus according to the present invention is used to carry out an electric control of substrates, or wafers, of solar cells, to check for possible defects in the electric pattern or patterns made therein.
- Testing apparatuses to test electronic devices, such as substrates or wafers of solar cells, are known, which are normally positioned at the end of a production line of a plant which produces said electronic devices. Here and hereafter specific reference is made to substrates or wafers, made of semi-conductor material of solar cells, but it cannot be excluded that the apparatus according to the present invention can be used for testing other types of electronic devices such as electronic cards, PCB (Printed Circuit Boards) or others.
- These known testing apparatuses comprise two beds of needles disposed reciprocally facing between which at least a substrate to be tested is positioned. The substrate is provided on both its sides with a plurality of electric contact areas, connected to an electric pattern made in the substrate itself.
- The beds of needles are reciprocally movable between at least a first position in which they allow the insertion of the substrate to be tested between the beds, substantially like a sandwich, and a second position, in which they are disposed so as to allow the needles to contact the corresponding contact areas of both sides of the substrate.
- In this way, as well as allowing the effective electric test, by means of tension and/or current measuring in correspondence with said contact areas, the beds of needles disposed in the second position allow to exert a mechanical contrasting action on both sides of the substrate, keeping the substrate in a stable and secure position during the testing.
- One disadvantage of these known apparatuses is that, in the case of substrates or wafers made of silicon or other semi-conductor material, the mechanical contrasting action, which is substantially not cushioned, can determine an involuntary and undesired breakage or crack in the fragile structure of the substrate.
- Substrates or wafers of the “all back contacts” type are also known, in which all the contact areas are disposed on one side of the substrate, for example the rear side. In this case the testing apparatus provides the presence of a single bed of needles, reciprocally movable with respect to the substrate so as to allow the substrate to be positioned so that each needle is in contact with a corresponding contact area.
- This solution, although allowing to avoid unwanted breakages of the substrates during testing, does not allow to always keep the substrate in a stable and secure position during testing. This can lead to one or more needles not making stable contact with the corresponding contact areas of the substrate, and therefore give a negative test result of a substrate which is not in fact defective.
- One purpose of the present invention is to make a testing apparatus which allows to maintain the substrates or wafers or other electronic devices to be tested stable in a desired position, avoiding unwanted damage or breakages of the substrates during testing.
- Another purpose of the present invention is to perfect a testing method for substrates, or other electronic devices, which allows to keep the substrates or wafers or other electronic devices to be tested stable in a desired position, avoiding unwanted damage and breakages of the substrates during testing.
- The Applicant has devised, tested and embodied the present invention to overcome the shortcomings of the state of the art and to obtain these and other purposes and advantages.
- The present invention is set forth and characterized in the independent claims, while the dependent claims describe other characteristics of the invention or variants to the main inventive idea.
- In accordance with the above purposes, a testing apparatus can, for example, be used in a production plant for substrates of solar cells, or other electronic devices, to carry out an electric control or test on the devices thus made. The testing apparatus comprises a support, substantially flat, able to support on one of its surfaces, directly or indirectly, at least a substrate or other device to be electrically tested.
- The support comprises a plurality of through holes, each suitable for the insertion of a corresponding electric testing probe of the apparatus, to allow the connection and/or contact of each probe with a corresponding test area of the substrate.
- According to one feature of the present invention, the testing apparatus comprises suction means associated with the support, and suitable to exert a holding action through depression on one side of the substrate in order to contrast the thrust action exerted by the testing probes on said testing areas.
- In this way, it is possible to firmly maintain the substrate or substrates in a predetermined position during testing, allowing an adequate and effective contrasting action to the thrust of the testing probes, acting on the same side of the substrates on which the probes are connected. This prevents the generation of high mechanical stresses, thus allowing to reduce or minimize possible breakages of the substrate.
- According to a variant of the present invention the suction means are disposed in cooperation with each through hole of the support. This allows an optimal distribution of the holding action exerted on the substrate depending on the actual thrusting action exerted by the probes.
- According to another variant, each substrate is operatively associable with a supporting nest, used for the movement and the transport of the substrate during different steps of production. The supporting nest is provided with a plurality of through openings, each of which is able to cooperate with at least a corresponding hole of the support for the passage of a corresponding test probe.
- According to another variant, each nest comprises a suction pipe operatively associable with the suction means to allow to hold the substrate to the supporting nest, and therefore to the support.
- The present invention also concerns a method for testing substrates of solar cells and other electronic devices.
- The method comprises a step in which a substrate, or other device to be electrically tested, is disposed on a support, substantially flat, comprising a plurality of through holes, each one suitable for the insertion of a corresponding electric testing probe, belonging to a plurality of testing probes.
- The method comprises a testing step in which at least some of the testing probes are inserted in a corresponding through hole to be connected and put in contact with a corresponding testing area of the substrate.
- According to one feature of the present invention the method comprises a suction step in which, by means of suction means, associated with the support, a holding action through depression is exerted on one side of the substrate in order to contrast the thrusting action exerted by the testing probes on the testing areas in said testing step.
- These and other characteristics of the present invention will become apparent from the following description of a preferential form of embodiment, given as a non-restrictive example with reference to the attached drawings wherein:
-
FIG. 1 is a schematic isometric view of a processing system used with embodiments of the present invention; -
FIG. 2 is a schematic plan view of the system depicted inFIG. 1 ; -
FIG. 3 is a perspective view of the testing apparatus according to the present invention; -
FIG. 4 is a top plan view of the testing apparatus ofFIG. 3 ; -
FIG. 4A is an enlarged view of particular ofFIG. 4 ; -
FIG. 5 is a lateral view ofFIG. 3 ; -
FIG. 5A is an enlarged view of a particular ofFIG. 5 ; -
FIG. 6 is a perspective view of part of the testing apparatus according to the present invention; -
FIG. 7 is a top plan view of a detail ofFIG. 6 ; -
FIG. 8 is a perspective view of a needle supporting member of the apparatus according to the present invention; -
FIG. 9 is an enlarged view from above of a detail ofFIG. 7 ; -
FIG. 10 is a view from above of a variant of the detail inFIG. 9 ; -
FIG. 11 is a schematic view in section from VI to VI inFIG. 10 . - To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.
- With reference to the attached drawings, a
testing apparatus 10 according to the present invention can be used in a plant to producesubstrates 150, or wafers, for solar cells, advantageously, but not exclusively, of the “back side contact” type, in which all the metallic contacts for the extraction of converted electric energy are disposed on one single side of thesubstrate 150. Thesubstrates 150 have a substantially flat structure of a square or rectangular shape. -
FIG. 1 is a schematic isometric view of asystem 100 forprocessing substrates 150, associated with an embodiment of the present invention. In one embodiment, thesystem 100 generally includes twoincoming conveyors 111, anactuator assembly 140, a plurality ofprocessing nests 131, a plurality ofprocessing heads 102, twooutgoing conveyors 112, and asystem controller 101. Theincoming conveyors 111 are configured in a parallel processing configuration so that each can receiveunprocessed substrates 150 from an input device, such as aninput conveyor 113, and transfer eachunprocessed substrate 150 to aprocessing nest 131 coupled to theactuator assembly 140. Additionally, theoutgoing conveyors 112 are configured in parallel so that each can receive a processedsubstrate 150 from aprocessing nest 131 and transfer each processedsubstrate 150 to a substrate removal device, such as anexit conveyor 114. - In one embodiment, each
exit conveyor 114 is adapted to transport processedsubstrates 150 through anoven 199 to cure material deposited on thesubstrate 150 via theprocessing heads 102. - In one embodiment of the present invention, the
system 100 is a screen printing processing system and theprocessing heads 102 include screen printing components, which are configured to screen print a patterned layer of material on asubstrate 150. In another embodiment, thesystem 100 is an ink jet printing system and the processing heads 102 include ink jet printing components, which are configured to deposit a patterned layer of material on asubstrate 150. -
FIG. 2 is a schematic plan view of thesystem 100 depicted inFIG. 1 .FIGS. 1 and 2 illustrate thesystem 100 having two processing nests 131 (in positions “1” and “3”) each positioned to both transfer a processedsubstrate 150 to theoutgoing conveyor 112 and receive anunprocessed substrate 150 from theincoming conveyor 111. Thus, in thesystem 100, the substrate motion generally follows the path “A” shown inFIGS. 1 and 2 . In this configuration, the other two processing nests 131 (in positions “2” and “4”) are each positioned under aprocessing head 102 so that a process (e.g., screen printing, ink jet printing, material removal) can be performed on theunprocessed substrates 150 situated on therespective processing nests 131. Such a parallel processing configuration allows increased processing capacity with a minimized processing system footprint. Although, thesystem 100 is depicted having two processingheads 102 and fourprocessing nests 131, thesystem 100 may comprise additional processing heads 102 and/orprocessing nests 131 without departing from the scope of the present invention. - In one embodiment, the
incoming conveyor 111 andoutgoing conveyor 112 include at least onebelt 116 to support and transport thesubstrates 150 to a desired position within thesystem 100 by use of an actuator (not shown) that is in communication with thesystem controller 101. WhileFIGS. 1 and 2 generally illustrate a two belt style substrate transferring system, other types of transferring mechanisms may be used to perform the same substrate transferring and positioning functions without varying from the basic scope of the invention. - In one embodiment, the
system 100 also includes aninspection system 200, which is adapted to locate and inspect thesubstrates 150 before and after processing has been performed. Theinspection system 200 may include one or more detection means, orcameras 120, that are positioned to inspect asubstrate 150 positioned in the loading/unloading positions “1” and “3,” as shown inFIGS. 1 and 2 . - The
inspection system 200 generally includes at least one camera 120 (e.g., CCD camera) and other electronic components that are able to locate, inspect, and communicate the results to thesystem controller 101. In one embodiment, theinspection system 200 locates the position of certain features of anincoming substrate 150 and communicates the inspection results to thesystem controller 101 for analysis of the orientation and position of thesubstrate 150 to assist in the precise positioning of thesubstrate 150 under aprocessing head 102 prior to processing thesubstrate 150. - In one embodiment, the
inspection system 200 inspects thesubstrates 150 so that damaged or mis-processed substrates can be removed from the production line. In one embodiment, theprocessing nests 131 may each contain a lamp, or other similar optical radiation device, to illuminate thesubstrate 150 positioned thereon so that it can be more easily inspected by theinspection system 200. - The
system controller 101 facilitates the control and automation of theoverall system 100 and may include a central processing unit (CPU) (not shown), memory (not shown), and support circuits (or I/O) (not shown). The CPU, may be one of any form of computer processors that are used in industrial settings for controlling various chamber processes and hardware (e.g., conveyors, detectors, motors, fluid delivery hardware, etc.) and monitor the system and chamber processes (e.g., substrate position, process time, detector signal, etc.). The memory is connected to the CPU and may be one or more of a readily available memory, such as random access memory (RAM), read only memory (ROM), floppy disk, hard disk, or any other form of digital storage, local or remote. Software instructions and data can be coded and stored within the memory for instructing the CPU. - The support circuits are also connected to the CPU for supporting the processor in a conventional manner. The support circuits may include cache, power supplies, clock circuits, input/output circuitry, subsystems, and the like. A program (or computer instructions) readable by the
system controller 101 determines which tasks are performable on a substrate. Preferably, the program is software readable by thesystem controller 101, which includes code to generate and store at least substrate positional information, the sequence of movement of the various controlled components, substrate inspection system information, and any combination thereof. - In one embodiment, the two processing heads 102 utilized in the
system 100 may be conventional screen printing heads available from Applied Materials Italia Srl which are adapted to deposit material in a desired pattern on the surface of asubstrate 150 disposed on aprocessing nest 131 in position “2” or “4” during a screen printing process. In one embodiment, theprocessing head 102 includes a plurality of actuators, for example, actuators 105 (e.g., stepper motors or servomotors) that are in communication with thesystem controller 101 and are used to adjust the position and/or angular orientation of a screen printing mask (not shown) disposed within theprocessing head 102 with respect to thesubstrate 150 being printed. In one embodiment, the screen printing mask is a metal sheet or plate with a plurality of holes, slots, or other apertures formed therethrough to define a pattern and placement of screen printed material on a surface of asubstrate 150. In one embodiment, the screen printed material may comprise a conductive ink or paste, a dielectric ink or paste, a dopant gel, an etch gel, one or more mask materials, or other conductive or dielectric materials. - In general, the screen printed pattern that is to be deposited on the surface of a
substrate 150 is aligned to thesubstrate 150 in an automated fashion by orienting the screen printing mask using theactuators 105 and information received by thesystem controller 101 from theinspection system 200. In one embodiment, the processing heads 102 are adapted to deposit a metal containing or dielectric containing material on a solar cell substrate having a width between about 125 mm and 156 mm and a length between about 70 mm and 156 mm. - The
apparatus 10 according to the present invention is generally disposed downstream theexit conveyors 114 and theovens 199 in thesystem 100 and comprises a support 16 (FIGS. 3 , 4, 6), a supportingnest 18 for eachsubstrate 150 to be tested, atest member 26 provided with probes or needles 42, for the electric testing of thesubstrate 150, and one ormore suction pipes 50 distributed inside thesupport 16 and operatively connectable toholes 24 in thenest 18. - Each substrate is transferred from the
exit conveyor 114 to the supportingnest 18 in a known way, for example by means of an automated transfer system able to move the substrate from theconveyor 114 to the supportingnest 18 and to thesupport 16. - The
support 16, substantially flat, is suitable to support in a horizontal position at least onenest 18 and therefore, as will be described in more detail hereafter, an associatedsubstrate 150. Thesupport 16 is preferably made of steel covered by a first layer of nickel and by a second layer of dielectric varnish, of the known type and easily available on the market, therefore allowing to obtain an efficient and optimal support planarity and an adequate electric insulation of thesupport 16. - The
support 16 is provided with a plurality of first through testing holes 22 (FIG. 11 ), suitable to allow the passage of at least acorresponding needle 42 of thetest member 26, as will be described in more detail hereafter. - The suction pipes 50 (
FIG. 6 ) are also provided with asuction sleeve 51 at one of their ends, in turn connected to a suction member of the known type, not shown, such as a vacuum generator or other suitable device. - The
nest 18, also substantially flat, has a regular shape, for example rectangular or square, and is made of a non-conductive material, for example Plexiglas. Thenest 18 is provided with abutment pins 20 (FIGS. 3 , 4 and 5), disposed in predetermined positions on its upper surface, so as to allow a precise positioning of thesubstrate 150 in a predetermined position and to impede an unwanted horizontal movement thereof during testing. - The disposition of the abutment pins 20 is such as to allow the positioning on the supporting
nest 18 of various types ofsubstrate 150 having different formats. - Each supporting
nest 18 can also be used for moving an associatedsubstrate 150 also during other working steps, as for example during the step or steps of printing the electric patterns. Thenest 18 is moved together with itsown substrate 150, by movement means of the known type, such as conveyor belts or conveyors. - The supporting
nest 18 is also provided with a plurality of second testing holes 23 (FIGS. 7 , 9, 10 and 11), through and disposed in predetermined positions coordinated with the disposition of the first testing holes 22, that is, substantially concentric to them when thenest 18 is positioned on thesupport 16, so as to allow the passage of at least oneneedle 42 of thetest member 26 both through thefirst testing hole 22 and thesecond testing hole 23, as will be described in more detail hereafter. - The diameter D2 of the second hole 23 (
FIG. 11 ) is advantageously smaller than the diameter D1 of thefirst testing hole 22 so as to allow an easy insertion of acorresponding testing needle 42, even if one ormore needles 42 are not perfectly aligned with theholes support 16. This so as to further reduce the possibility of an undesired contact of eachneedle 42 with thesupport 16 or with thenest 18. - The
nest 18 is also provided with a suction line 52 (FIG. 6 ) operatively connectable at predetermined joiningpoints 52 a to thesuction pipe 50, when thenest 18 is disposed on thesupport 16. - The
suction line 52 develops inside the thickness of thenest 18 so as to define a suction course for the air which is distributed in proximity to each of the second testing holes 23. - The
suction line 52, in fact, is provided with suction portions 53 (FIG. 9 ) which develop around eachsecond hole 23 and surround it. Eachportion 53 is connected to the upper surface of thenest 18 by means of a plurality of suction holes 24 (FIGS. 7 , 9, 10, 11), suitable to generate a condition of local depression around thesecond hole 23 on the contact surface of thesubstrate 150 so as to exert an effective action to hold the substrate on thenest 18 during testing, as will be explained in more detail hereafter. - The suction holes 24 are advantageously distanced in a regular way on the development of each
portion 53, so as to generate an effective holding action through depression on thesubstrate 150 which contrasts locally the mechanical thrusting action exerted by theneedles 42. - According to a first form of embodiment, shown in
FIG. 9 , eachportion 53 has a quadrangular development and theholes 24 are disposed in correspondence with the angles and in intermediate positions along its sides. - According to another form of embodiment, shown in
FIG. 10 , theportions 53 have a substantially circular development in which theholes 24 are disposed substantially equidistant. - Advantageously the number of
holes 24 which guarantees an effective holding action is correlated to the sizes of theportion 53, for example its diameter, to the thrust force of theneedles 42, and the holding/depression force exerted, as will be described in more detail hereafter. In one embodiment the number ofholes 24 related to eachportion 53 is eight. - It is understood that the number of suction holes 24 can be greater or fewer than eight, or that, instead of suction holes 24, a single suction opening can be made, conformed in a circular manner, so as to surround, at least partly, the
second hole 23. - The test member 26 (
FIGS. 3 , 6 and 8) comprises twoarms 30, made for example of Plexiglas, disposed parallel and at the same reciprocal height under thesupport 16. Thearms 28 are disposed at a predetermined reciprocal distance so as to supportrespective bars 30. Eachbar 30 is suitable to support a plurality of electric testing needles 42. The number ofbars 30 is coordinated to the number ofneedles 42 on the basis of typology and size of thedifferent substrates 150 to be tested. - The
bars 30 are slidingly constrained in correspondence with their opposite ends to slidingguides 29 made on eacharm 28. This is to position thebars 30 at regular and predetermined reciprocal distances or in at least partly reciprocal continuity between two ormore bars 30, to obtain a desired positioning of theneedles 42, consistent with the actual sizes of thesubstrates 150 to be tested. - The
arms 28 are also movable (FIG. 6 ), substantially in a vertical direction, according to the direction of the arrow F, between a lower position in which theneedles 42 are not inserted in theholes bars 30 are disposed adjacent to thesupport 16 to allow the insertion of eachneedle 42 in a respective pair ofholes substrate 150 to be tested. - The movement of the
arms 28 occurs by means of a pair ofactuators 34 of the known type, e.g., air cylinders, electric motors or the like, disposed laterally with respect to thesupport 16. Each actuator is provided with a verticallymovable piston 36 able to cooperate with ahorizontal shoulder element 38, solid with acorresponding arm 28 so as to lift and lower them and therefore to position thebars 30 at the desired height. - In a form of embodiment, not shown in the drawings, the
bars 30 are replaced by a single flat support structure, constrained along two of its opposite lateral edges to the arms. Theneedles 42 are distributed on the flat structure according to a predetermined disposition consistent with the different types and sizes of substrates to be tested. - The testing needles 42 are conductive components typically comprising a metallic material and having at least a desired shaped contact point that is configured to achieve a reliable contact with the surface of the
substrate 150. Eachtesting needle 42 is suitable to measure both the voltage and the current in correspondence with the predetermined zone of thesubstrate 150. Advantageously eachneedle 42 is provided with two testing probes, not shown in the present drawings, conformed in a point and disposed substantially parallel, of which one is suitable to acquire the value of voltage and the other to acquire the value of electrical current flowing through the contact point that is in contact with thesubstrate 150. - It is understood that the
needle 42 can be of the coaxial type in which a first external probe is suitable to measure the current or tension and a second internal probe is suitable to measure the tension or the current, retractable with respect to the external probe. - Each
needle 42 is electrically connected, in a known way, to a processing unit, for example to thesystem controller 101 or to another controller, able to acquire and process the voltage and current values and verify that these values are within a range provided for the correct functioning of thesubstrate 150. - The
testing apparatus 10 as described heretofore functions as follows. - At the end of a predetermined processing, for example when the
substrates 150 exit from theoven 199, or at the end of the production of a solar cell, thesubstrate 150 is transferred to a supportingnest 18 and transported together with it on thesupport 16 in the direction indicated by the arrow “A” (FIGS. 3 , 4), by means of an actuator, for example a magneticlinear motor 25 which is able to move thesupport 16. Thenest 18 is positioned on thesupport 16 so as to align thesecond holes 23 with correspondingfirst holes 22 and so as to hydraulically connect theline 52 with thepipes 50. In this step thearms 28 are disposed in their lower position, so as to allow an easy positioning of thenest 18 and thesubstrate 150. - Subsequently the
arms 28 are moved by theactuators 34 into their higher position so as to allow the insertion of eachneedle 42 in a corresponding pair ofholes substrate 150. - In coordination with the movement of the
arms 28, the suction member is activated so as to generate a depression in thepipes 50, in theline 52 and therefore in the correspondingportions 53. This allows one to obtain a holding action distributed in a uniform and regular way both around eachhole 23, and exerted by depression by means of the suction holes 24 surrounding eachhole 23, and also a uniform holding action carried out directly on the whole surface of the lower side, i.e. the backside, of thesubstrate 150. This allows to hold thesubstrate 150 in an efficient and secure way, and therefore thenest 18, to thesupport 16 during the electric testing. - The holding action is made in such a way as to contrast the overall mechanical thrust exerted by the testing needles 42 which are disposed in contact with the areas of the
substrate 150 to be tested. In this way it is possible to maintain thesubstrates 150 in one fixed position during testing, avoiding possible wrong measurements. - Moreover, by regulating the intensity of the depression it is also possible to regulate the holding action, according to the mechanical thrust action of the
needles 42, thus obtaining a cushioning action on thesubstrate 150 which allows to minimize possible breakages and/or cracks of the fragile crystalline structure of thesubstrate 150. - The number of
holes 24 which guarantees an effective holding action is correlated to the sizes of theportion 53, for example its diameter, to the thrust force of theneedles 42, and the holding/depression force exerted. In fact, considering that thesubstrate 150 is constrained, in correspondence with theholes 24, to the support plane, the maximum force that theneedle 42, or one of its springs, of the known type and not shown in the figures, exerts on the substrate, and the ultimate tensile stress of the material that makes up the substrate, are taken as known. By fixing a safety coefficient, defined as the ratio between ultimate tensile stress, expressed in [N/mm2], and the admissible mechanical tension, it is possible to calculate the positioning diameter of theholes 24 along theportion 53. Said diameter must be carefully verified since the force exerted by theneedle 42 could be such as to cause a curvature deformation so that the holding force given by the vacuum, that is, by the maximum value of vacuum obtained as the sum of the line vacuum pressure and load losses of thesuction pipe 50 and thesuction line 52, is not able to hold the substrate constrained to thesupport nest 18. In this case it is necessary to provide a reduction in the diameter of the circumference of development of theportion 53 where theholes 24 are positioned. - On the contrary, repeating the calculations after having fixed the value of said diameter, we obtain a new safety coefficient, which must not be lower than a limit value, otherwise the
substrate 150, or cell, could break. - The minimum diameter D3 of the circumference of development of the
portion 53 is also determined by a dynamic condition: in the case of small diameters thesubstrate 150 disposed on thenest 18, given the same stress, is subjected locally to a lesser deformation, which gives a lesser cushioning. This in turn entails that the impact between eachneedle 42 and the substrate is less cushioned, and can cause the substrate to break. - According to these considerations it has been calculated that: the ratio K1 between the number of
holes 24 and the diameter D3 of theportion 53 is equal to 0.5 mm-1; the ratio K2 between said diameter D3 and the total area of theholes 24 is equal to about 0.92 mm-1. - In one embodiment, the number of
holes 24 is between five and ten. In one embodiment, the number ofholes 24 is eight. - The testing of the
substrate 150 is performed in a known way, measuring voltage and current between predetermined contact points of the substrates, so as to measure, for example, the resistance of the screen patterned layer and/or the surface resistance of the doped portions of thesubstrate 150. - At the end of the acquisition/measuring of the voltage and current values the
arms 28 are moved into their lower position by means of theactuators 34, so as to allow the extraction of eachneedle 42 from the corresponding pair ofholes - In coordination with the movement of the
arms 28, the depression member is deactivated, allowing the subsequent movement of thenest 18 and thesubstrate 150 in the direction indicated by the arrow “U” and the transfer of thesubstrate 150 for example toward a subsequent process, or in the case of adefective substrate 150 to a discharge station for discards. - Provided herein is a testing apparatus used in a plant to produce substrates (150) for solar cells, or other electronic devices, comprising a support (16), substantially flat and able to support, directly or indirectly, on a surface thereof at least a substrate (150) or other device to be electrically tested, a supporting nest (18) for each substrate (150) to be tested, and a plurality of testing probes (42), said support (16) comprising a plurality of through holes (22), each suitable for the insertion of a corresponding testing probe (42), to allow the connection of each probe (42) to a corresponding and predetermined testing area of the substrate, characterized in that it comprises suction means (50), distributed inside the support (16) from the same side where the testing probes (42) are located, operatively connectable to suction holes (24) provided in the nest (18) through a suction line (52), each of said nest (18) comprising testing holes (23) suitable to be aligned, in use, to the testing holes (22) provided in the support (16) to allow the passage through of the relative testing probe (42), the suction means (50) exerting through said suction line (52) and said suction holes (24) in the nest (18) a holding action through depression on one face of the substrate (150), to contrast the thrust action exerted by the testing probes (42) on said testing areas.
- The apparatus is characterized in that said suction means (50) are disposed in cooperation with each through hole (22) of the support (16).
- The apparatus is characterized in that the suction line (52) develops in the nest (18) so as to define a suction path distributed in proximity with each of said testing holes (23).
- The apparatus is characterized in that the suction line (52) is provided with suction portions which develop around each of said testing holes (23), at least partly surrounding it, each portion being connected to the upper surface of the nest (18) by means of said suction holes (24).
- The apparatus is characterized in that said suction portion is a quadrangular shape.
- The apparatus is characterized in that said suction portion is a circular shape.
- The apparatus is characterized in that the number of suction holes (24) goes from five to ten.
- The apparatus is characterized in that the number of suction holes (24) is eight.
- The apparatus is characterized in that the suction holes (24) are distanced in a regular way along the development of each suction portion.
- The apparatus is characterized in that the support (16) is made of at least partly non-conductive material.
- Provided herein is a method for testing substrates (150) of solar cells, or other electronic devices, comprising a step in which a substrate (150) to be tested electrically is disposed on a supporting nest (18) and then the nest (18) is positioned on a support (16), substantially flat, comprising a plurality of through testing holes (22), each suitable for the insertion of a corresponding testing probe (42) of a plurality of testing probes (42), each of said nest (18) comprising testing holes (23) suitable to be aligned, in use, to the testing holes (22) provided in the support (16) to allow the passage through of the relative testing probe (42), a testing step in which at least some of the testing probes (42) are inserted in said corresponding testing holes (22, 23) to be connected and put in contact with a corresponding testing area of the substrate (150), characterized in that it comprises a suction step in which by means of suction means (50), associated with the support and comprising a suction line (52) and suction holes (24) provided in each of said nest (18), a holding action through depression is exerted on one side of the substrate to contrast the thrust action exerted by the testing probes (42) on the testing areas.
- The method is characterized in that said suction means (50) are disposed in cooperation with each through hole (22) of the support (16)
- It is clear that modifications and/or additions of parts or steps may be made to the
testing apparatus 10 as described heretofore, without departing from the field and scope of the present invention. - It is also clear that, although the present invention has been described with reference to some specific examples, a person of skill in the art shall certainly be able to achieve many other equivalent forms of testing apparatus and relative testing method, having the characteristics as set forth in the claims and hence all coming within the field of protection defined thereby.
Claims (19)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITUD2009A000146 | 2009-09-03 | ||
ITUD2009A0146 | 2009-09-03 | ||
ITUD2009A000146A IT1395561B1 (en) | 2009-09-03 | 2009-09-03 | TEST SYSTEM AND ITS PROCEDURE |
PCT/EP2010/062831 WO2011026875A1 (en) | 2009-09-03 | 2010-09-02 | Testing apparatus and relative method |
Publications (2)
Publication Number | Publication Date |
---|---|
US20120229156A1 true US20120229156A1 (en) | 2012-09-13 |
US9412898B2 US9412898B2 (en) | 2016-08-09 |
Family
ID=42355406
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/394,127 Expired - Fee Related US9412898B2 (en) | 2009-09-03 | 2010-09-02 | Apparatus and method of testing a substrate using a supporting nest and testing probes |
Country Status (9)
Country | Link |
---|---|
US (1) | US9412898B2 (en) |
EP (1) | EP2473862B1 (en) |
JP (1) | JP2013504050A (en) |
KR (1) | KR101862245B1 (en) |
CN (2) | CN102483437B (en) |
DE (3) | DE202010018086U1 (en) |
IT (1) | IT1395561B1 (en) |
TW (2) | TWI451103B (en) |
WO (1) | WO2011026875A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103956973A (en) * | 2014-05-20 | 2014-07-30 | 常州亿晶光电科技有限公司 | Support for flaky material anti-aging testing |
CN106104819A (en) * | 2014-12-02 | 2016-11-09 | 应用材料意大利有限公司 | In the device producing printing on solar cell substrate and the method transmitting this substrate |
US9825585B2 (en) | 2013-12-03 | 2017-11-21 | Lg Electronics Inc. | Solar cell measuring apparatus |
WO2021244827A1 (en) * | 2020-06-02 | 2021-12-09 | Osram Opto Semiconductors Gmbh | Electrical apparatus |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101685461B1 (en) * | 2011-09-05 | 2016-12-20 | 가부시키가이샤 니혼 마이크로닉스 | Apparatus and Method for Evaluating Sheet-like Battery |
ITUD20110166A1 (en) * | 2011-10-18 | 2013-04-19 | Applied Materials Italia Srl | TEST DEVICE FOR TESTING PLATES FOR ELECTRONIC CIRCUITS AND ITS PROCEDURE |
CN103063996B (en) * | 2012-12-14 | 2015-08-05 | 浙江晶科能源有限公司 | A kind of back contact solar cell built-in testing device |
WO2015006625A2 (en) * | 2013-07-11 | 2015-01-15 | Johnstech International Corporation | Testing apparatus and method for microcircuit and wafer level ic testing |
JP2015049137A (en) * | 2013-09-02 | 2015-03-16 | 三菱電機株式会社 | Semiconductor chip tester and semiconductor chip test method |
WO2018077423A1 (en) * | 2016-10-28 | 2018-05-03 | Applied Materials Italia S.R.L. | Apparatus for testing solar cells, system for production of solar cells, and method for controlling an irradiation device for simulating a spectrum of solar radiation |
TWI627400B (en) * | 2017-04-11 | 2018-06-21 | Defective rejection method for passive component batch detection and rejection system thereof | |
CN112014600B (en) * | 2019-05-31 | 2023-11-24 | 三赢科技(深圳)有限公司 | Test fixture and test machine |
AU2021232853A1 (en) | 2020-03-10 | 2022-09-22 | Massachusetts Institute Of Technology | Compositions and methods for immunotherapy of NPM1c-positive cancer |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4771234A (en) * | 1986-11-20 | 1988-09-13 | Hewlett-Packard Company | Vacuum actuated test fixture |
US4814698A (en) * | 1987-10-14 | 1989-03-21 | Everett/Charles Contact Products, Inc. | Technique for elimination of static in printed circuit board test fixtures |
US4841231A (en) * | 1987-10-30 | 1989-06-20 | Unisys Corporation | Test probe accessibility method and tool |
US5027063A (en) * | 1990-04-24 | 1991-06-25 | John Fluke Mfg. Co., Inc. | Vacuum-actuated test fixture for testing electronic components |
US5801543A (en) * | 1994-08-13 | 1998-09-01 | Ke Kommunikations-Elektronik Gmbh & Co. | Device for testing printed circuit boards and/or flat modules |
US6894479B2 (en) * | 2002-08-26 | 2005-05-17 | Agilent Technologies, Inc. | Connector cable and method for probing vacuum-sealable electronic nodes of an electrical testing device |
US7355418B2 (en) * | 2004-02-12 | 2008-04-08 | Applied Materials, Inc. | Configurable prober for TFT LCD array test |
US20110025344A1 (en) * | 2007-11-26 | 2011-02-03 | Tokyo Electron Limited | Holding member for use in test and method for manufacturing same |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4491173A (en) * | 1982-05-28 | 1985-01-01 | Temptronic Corporation | Rotatable inspection table |
US4561541A (en) * | 1983-09-26 | 1985-12-31 | Spectrolab, Incorporated | Carrier system for photovoltaic cells |
JPH073833B2 (en) | 1987-03-30 | 1995-01-18 | 東京エレクトロン株式会社 | Probe device |
JPH07263526A (en) * | 1994-03-17 | 1995-10-13 | Hitachi Ltd | Method of cooling wafer chuck and semiconductor device |
WO1996029607A1 (en) * | 1995-03-18 | 1996-09-26 | Tokyo Electron Limited | Method and apparatus for inspecting substrate |
JPH0829499A (en) | 1994-07-15 | 1996-02-02 | Nec Corp | Inspection device for circuit board |
US5708222A (en) * | 1994-08-01 | 1998-01-13 | Tokyo Electron Limited | Inspection apparatus, transportation apparatus, and temperature control apparatus |
JPH08236594A (en) | 1995-02-28 | 1996-09-13 | Hitachi Ltd | Inspecting device of semiconductor device |
JP3320706B2 (en) | 1999-08-18 | 2002-09-03 | イビデン株式会社 | Wafer prober, ceramic substrate used for wafer prober, and wafer prober device |
JP3735556B2 (en) * | 2001-10-23 | 2006-01-18 | 株式会社ルネサステクノロジ | Semiconductor device manufacturing method and semiconductor device |
JP4483795B2 (en) * | 2001-12-25 | 2010-06-16 | 東京エレクトロン株式会社 | Delivery mechanism and processing device |
DE10331565A1 (en) * | 2003-05-28 | 2004-12-30 | Osram Opto Semiconductors Gmbh | Wafer holding device for semiconductor chips in wafers has holed suction device on vacuum chamber that is transparent to electromagnetic radiation |
JP2005156317A (en) | 2003-11-25 | 2005-06-16 | Sony Corp | Device for measuring electronic component, and electronic component measurement method |
US20060038554A1 (en) * | 2004-02-12 | 2006-02-23 | Applied Materials, Inc. | Electron beam test system stage |
US20060000806A1 (en) * | 2004-06-30 | 2006-01-05 | Golzarian Reza M | Substrate carrier for surface planarization |
DE102004050463B3 (en) * | 2004-10-16 | 2006-04-20 | Manz Automation Ag | Test system for solar cells |
JP4600655B2 (en) * | 2004-12-15 | 2010-12-15 | セイコーエプソン株式会社 | Substrate holding method |
CN100395879C (en) | 2005-12-05 | 2008-06-18 | 深圳市矽电半导体设备有限公司 | Multiplex test method for semiconductor wafer and multiplex test probe station therefor |
CN101212016A (en) * | 2006-12-31 | 2008-07-02 | 中国科学院半导体研究所 | Complementary metal oxide layer semiconductor magnetic sensor |
JP5088167B2 (en) | 2008-02-22 | 2012-12-05 | 東京エレクトロン株式会社 | PROBE DEVICE, PROBING METHOD, AND STORAGE MEDIUM |
CN201233434Y (en) * | 2008-04-14 | 2009-05-06 | 无锡市易控系统工程有限公司 | Full automatic wafer testing platform device |
-
2009
- 2009-09-03 IT ITUD2009A000146A patent/IT1395561B1/en active
-
2010
- 2010-09-02 CN CN201080039570.1A patent/CN102483437B/en active Active
- 2010-09-02 TW TW099129742A patent/TWI451103B/en not_active IP Right Cessation
- 2010-09-02 DE DE202010018086U patent/DE202010018086U1/en not_active Expired - Lifetime
- 2010-09-02 DE DE202010018093.7U patent/DE202010018093U1/en not_active Expired - Lifetime
- 2010-09-02 EP EP10752540.4A patent/EP2473862B1/en not_active Not-in-force
- 2010-09-02 CN CN201410411864.2A patent/CN104181449B/en active Active
- 2010-09-02 US US13/394,127 patent/US9412898B2/en not_active Expired - Fee Related
- 2010-09-02 DE DE202010018088.0U patent/DE202010018088U1/en not_active Expired - Lifetime
- 2010-09-02 TW TW103126444A patent/TWI550290B/en not_active IP Right Cessation
- 2010-09-02 WO PCT/EP2010/062831 patent/WO2011026875A1/en active Application Filing
- 2010-09-02 JP JP2012527310A patent/JP2013504050A/en active Pending
- 2010-09-02 KR KR1020127008522A patent/KR101862245B1/en active IP Right Grant
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4771234A (en) * | 1986-11-20 | 1988-09-13 | Hewlett-Packard Company | Vacuum actuated test fixture |
US4814698A (en) * | 1987-10-14 | 1989-03-21 | Everett/Charles Contact Products, Inc. | Technique for elimination of static in printed circuit board test fixtures |
US4841231A (en) * | 1987-10-30 | 1989-06-20 | Unisys Corporation | Test probe accessibility method and tool |
US5027063A (en) * | 1990-04-24 | 1991-06-25 | John Fluke Mfg. Co., Inc. | Vacuum-actuated test fixture for testing electronic components |
US5801543A (en) * | 1994-08-13 | 1998-09-01 | Ke Kommunikations-Elektronik Gmbh & Co. | Device for testing printed circuit boards and/or flat modules |
US6894479B2 (en) * | 2002-08-26 | 2005-05-17 | Agilent Technologies, Inc. | Connector cable and method for probing vacuum-sealable electronic nodes of an electrical testing device |
US7355418B2 (en) * | 2004-02-12 | 2008-04-08 | Applied Materials, Inc. | Configurable prober for TFT LCD array test |
US20110025344A1 (en) * | 2007-11-26 | 2011-02-03 | Tokyo Electron Limited | Holding member for use in test and method for manufacturing same |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9825585B2 (en) | 2013-12-03 | 2017-11-21 | Lg Electronics Inc. | Solar cell measuring apparatus |
CN103956973A (en) * | 2014-05-20 | 2014-07-30 | 常州亿晶光电科技有限公司 | Support for flaky material anti-aging testing |
CN106104819A (en) * | 2014-12-02 | 2016-11-09 | 应用材料意大利有限公司 | In the device producing printing on solar cell substrate and the method transmitting this substrate |
US20170077342A1 (en) * | 2014-12-02 | 2017-03-16 | Applied Materials Italia S.R.L. | Apparatus for printing on a substrate for the production of a solar cell, and method for transporting a substrate for the production of a solar cell |
CN112018012A (en) * | 2014-12-02 | 2020-12-01 | 应用材料意大利有限公司 | Device for printing on a substrate for producing solar cells and method for transporting said substrate |
WO2021244827A1 (en) * | 2020-06-02 | 2021-12-09 | Osram Opto Semiconductors Gmbh | Electrical apparatus |
Also Published As
Publication number | Publication date |
---|---|
CN102483437B (en) | 2015-06-17 |
TW201126183A (en) | 2011-08-01 |
EP2473862B1 (en) | 2018-06-20 |
EP2473862A1 (en) | 2012-07-11 |
ITUD20090146A1 (en) | 2011-03-04 |
TWI550290B (en) | 2016-09-21 |
KR101862245B1 (en) | 2018-05-29 |
IT1395561B1 (en) | 2012-09-28 |
JP2013504050A (en) | 2013-02-04 |
TWI451103B (en) | 2014-09-01 |
DE202010018086U1 (en) | 2013-12-16 |
CN102483437A (en) | 2012-05-30 |
CN104181449A (en) | 2014-12-03 |
DE202010018088U1 (en) | 2014-01-08 |
KR20120058604A (en) | 2012-06-07 |
WO2011026875A1 (en) | 2011-03-10 |
DE202010018093U1 (en) | 2014-01-09 |
TW201443459A (en) | 2014-11-16 |
CN104181449B (en) | 2017-08-04 |
US9412898B2 (en) | 2016-08-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9412898B2 (en) | Apparatus and method of testing a substrate using a supporting nest and testing probes | |
EP2449576B1 (en) | Substrate processing system | |
KR101394362B1 (en) | Wafer inspection apparatus | |
EP2581934B1 (en) | Apparatus and method for the production of photovoltaic modules | |
US20120225518A1 (en) | Method and Apparatus to Detect the Alignment of a Substrate | |
KR20150040286A (en) | Method for bringing substrate into contact with probe card | |
EP2473351A1 (en) | Substrate processing apparatus and method | |
KR101641571B1 (en) | Test device for solar cell performance | |
EP2474211B1 (en) | Method for centering a print track | |
US7960980B2 (en) | Testing device to test plates for electronic circuits and relative method | |
US20230124392A1 (en) | Inspection apparatus and inspection method | |
US20120315825A1 (en) | Device for housing a substrate, and relative method | |
CN114729963A (en) | Device alignment and test device with fine pitch and device alignment method | |
KR20200121191A (en) | User tray align device for test handler, user tray align method for test handler, and test handler | |
KR20000065293A (en) | Nozzle Apparatus of MICRO-BGA Block for Handler |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: APPLIED MATERIALS, INC., CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:VAZZOLER, MICHELE;REEL/FRAME:028302/0960 Effective date: 20120220 |
|
FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
FEPP | Fee payment procedure |
Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
LAPS | Lapse for failure to pay maintenance fees |
Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
|
FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20200809 |