US20120138665A1 - Method for fabricating optical semiconductor device - Google Patents
Method for fabricating optical semiconductor device Download PDFInfo
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- US20120138665A1 US20120138665A1 US13/311,064 US201113311064A US2012138665A1 US 20120138665 A1 US20120138665 A1 US 20120138665A1 US 201113311064 A US201113311064 A US 201113311064A US 2012138665 A1 US2012138665 A1 US 2012138665A1
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- United States
- Prior art keywords
- solder
- semiconductor laser
- fabricating
- semiconductor device
- laser chip
- Prior art date
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- Abandoned
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3013—Au as the principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Abstract
A method for fabricating an optical semiconductor device, including: melting a solder supplied on a carrier; mounting a semiconductor laser chip on the melted solder with a tool for holding the semiconductor laser chip; cooling the solder; releasing the tool from the semiconductor laser chip after the solder is cooled; remelting the solder after the tool is released from the semiconductor laser chip; and recooling the remelted solder.
Description
- This application is based upon and claims the benefit of priority of the prior Japanese Patent Application No. 2010-270799, filed on Dec. 3, 2010, the entire contents of which are incorporated herein by reference.
- (i) Technical Field
- A certain aspect of the embodiments discussed herein is related to a method for fabricating an optical semiconductor device.
- (ii) Related Art
- There is known an optical semiconductor device in which a semiconductor laser and a related optical component are integrated and mounted on a carrier (see Japanese Patent Application Publication No. 2004-289011). When an optical component such as the semiconductor laser is mounted on the carrier, a solder supplied on the surface of the carrier is melted, the optical component is mounted and positioned on the solder, and then the solder is cooled and the optical component is fixed to the carrier.
- However, the present inventor has found a problem that the optical component warps after the solder is cooled by using the above-mentioned method.
- It is an object of the present invention to provide a method for fabricating an optical semiconductor device that can restrain warpage of the optical component mounted on the carrier.
- According to an aspect of the present invention, there is provided a method for fabricating an optical semiconductor device, including: melting a solder supplied on a carrier; mounting a semiconductor laser chip on the melted solder with a tool for holding the semiconductor laser chip; cooling the solder; releasing the tool from the semiconductor laser chip after the solder is cooled; remelting the solder after the tool is released from the semiconductor laser chip; and recooling the remelted solder.
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FIG. 1 is a diagram of a configuration of an semiconductor laser to be mounted on an optical semiconductor device; -
FIG. 2 is a flowchart of a method for fabricating the optical semiconductor device; -
FIGS. 3A to 3D are cross-sectional diagrams illustrating the method for fabricating the optical semiconductor device; -
FIG. 4A is a cross-sectional diagram of a tool; -
FIG. 4B is a top view of the tool, as viewed from a front edge direction; -
FIG. 5A is a schematic top view of the semiconductor laser; -
FIG. 5B is a schematic view in the case where a layer containing an optical waveguide layer is seen through from an upper surface; -
FIG. 6 is a top view illustrating the method for fabricating the optical semiconductor device; -
FIG. 7A is a schematic cross-sectional diagram of the optical semiconductor device fabricated by a conventional method; -
FIG. 7B is a schematic cross-sectional diagram of the optical semiconductor device fabricated by a method of the present embodiment; -
FIG. 8 is a graph indicating a measurement result of a warpage amount of an optical component; -
FIG. 9 is a flowchart of the method for fabricating the optical semiconductor device according to a second embodiment; and -
FIG. 10 is a top view of the optical semiconductor device according to a third embodiment. -
FIG. 1 is a schematic cross-sectional diagram of the whole configuration of asemiconductor laser 60 to be mounted on an optical semiconductor device according to a first embodiment. As illustrated inFIG. 1 , thesemiconductor laser 60 has a structure in which a SOA (Semiconductor Optical Amplifier) region C, a SG-DFB (Sampled Grating Distribution Feedback) region A, and a CSG-DBR (Chirped Sample Grating Distributed Reflector) region B are coupled in order. In thesemiconductor laser 60, the SG-DFB region A and the CSG-DBR region B function as a wavelength selection portion selecting a wavelength, and the SOA region C functions as a light amplification portion amplifying a laser light. - The SG-DFB region A has a structure in which a
lower cladding layer 2, anactive layer 3, an upper cladding layer 6, acontact layer 7 and anelectrode 8 are laminated on asubstrate 1. The CSG-DBR region B has a structure in which thelower cladding layer 2, anoptical waveguide layer 4, the upper cladding layer 6, aninsulating layer 9 andheaters 10 are laminated on thesubstrate 1. Each of theheaters 10 has apower supply electrode 11 and aground electrode 12. The SOA region C has a structure in which thelower cladding layer 2, anoptical amplification layer 19, the upper cladding layer 6, acontact layer 20 and anelectrode 21 are laminated on thesubstrate 1. - The
substrate 1, thelower cladding layer 2 and the upper cladding layer 6 of the SG-DFB region A, the CSG-DBR region B and the SOA region C are formed as a unit respectively. Theactive layer 3, theoptical waveguide layer 4, and theoptical amplification layer 19 are formed on the same plane. An AR (Anti Reflection)layer 16 is formed on an facet of thesubstrate 1, thelower cladding layer 2, theactive layer 3 and the upper cladding layer 6 on the side of the SOA region C. TheAR layer 16 acts as a front facet of thesemiconductor laser 60. Areflection layer 17 is formed on an facet of thesubstrate 1, thelower cladding layer 2, theoptical waveguide layer 4, and the upper cladding layer 6 on the side of the CSG-DBR region B. Thereflection layer 17 acts as a rear facet of thesemiconductor laser 60. - A plurality of diffraction gratings (corrugations) 18 are formed in the
lower cladding layer 2 of the SG-DFB region A and the CSG-DBR region B in a given interval. The SG-DFB region A and the CSG-DBR region B have a plurality of segments. The segment is a region in which one region having the diffraction grating 18 and one space portion not having the diffraction grating 18 are combined. The diffraction grating 18 is made of a material having a refractive index that is different from that of thelower cladding layer 2. - In the CSG-DBR region B, at least two of the segments have a different optical length. Thus, intensity of each of reflection peak wavelengths in the CSG-DBR region B depends on wavelength. On the other hand, each optical length of the segments in the SG-DFB region A is substantially equal to each other. Therefore, intensity of each of reflection peak wavelengths in the SG-DFB region A does not depend on wavelength. According to the combination of the SG-DFB region A and the CSG-DBR region B, a desirable wavelength is selected by overlapping the reflection peak wavelength of the SG-DFB region A with the reflection peak wavelength of the CSG-DBR region B, by using vernier effect. Thus, the
semiconductor laser 60 can perform a stable laser oscillation at the desirable wavelength. - The
substrate 1 is, for example, a crystal substrate made of n-type InP. Thelower cladding layer 2 has n-type conductivity. The upper cladding layer 6 has p-type conductivity. Thelower cladding layer 2 and the upper cladding layer 6 are, for example, made of InP. Thelower cladding layer 2 and the upper cladding layer 6 confines a light in theactive layer 3, theoptical waveguide layer 4 and theoptical amplification layer 19. - The
active layer 3 is made of semiconductor having a gain. Theactive layer 3 may have quantum well structure in which a well layer made of Ga0.32In0.68As0.92P0.08 having a thickness of 5 nm and a barrier layer made of Ga0.22In0.78As0.47P0.53 having a thickness of 10 nm are laminated alternately. - The
optical waveguide layer 4 is, for example, made of bulk semiconductor layer, and may be made of Ga0.22In0.78As0.47P0.53. - The
contact layer 7 is, for example, made of p-type Ga0.47In0.53As crystal. The insulatinglayer 9 is a protective layer made of an insulator such as SiN or SiO2. Theheater 10 is a thin film resistor such as NiCr. Eachheater 10 may extend through a plurality of the segments in the CSG-DBR region B. - The
electrodes 8, thepower supply electrode 11 and theground electrode 12 are made of conductive material such as Au (gold). Areverse face electrode 15 is formed on a lower face of thesubstrate 1. Thereverse face electrode 15 is, for example, made of Au (gold). Thereverse face electrode 15 extends through the SG-DFB region A, the CSG-DBR region B and the SOA region C. - The
optical amplification layer 19 is a region in which a gain is given by current injection from theelectrode 21, and optical amplification thereby is performed. Theoptical amplification layer 19 may have quantum well structure in which a well layer made of Ga0.35In0.65As0.99P0.01 having a thickness of 5 nm and a barrier layer made of Ga0.15In0.85As0.32P0.68 having a thickness of 10 nm are laminated alternately, for example. Theoptical amplification layer 19 may employ a bulk semiconductor made of Ga0.44In0.56As0.95P0.05 as another structure, for example. Thecontact layer 20 is, for example, made of p-type Ga0.47In0.53As crystal. - Next, a description will be given of an operation of the
semiconductor laser 60. When a predetermined driving current is provided to theelectrode 8, eachheater 10 generates heat at a predetermined temperature. A TEC (Thermoelectric cooler) controls the temperature of thesemiconductor laser 60 to be a predetermined temperature. Thus, the SG-DFB region A and the CSG-DBR region B select a wavelength, and the semiconductor laser 100 oscillates at the wavelength. The laser light is optically amplified and output from a front facet (on the side of the SOA region C) to outside. -
FIG. 2 is a flowchart of a method for fabricating the optical semiconductor device according to the first embodiment, andFIGS. 3A to 3D are cross-sectional diagrams illustrating the method for fabricating the optical semiconductor device. At start time, aheater block 80 for heat supply is provided in astorage 70 in which anopening 72 is formed in a ceiling, as illustrated inFIG. 3A . The inside of thestorage 70 is filled up with an inactive gas (for example, nitrogen gas). First, acarrier 30 is installed on theheater block 80 as illustrated inFIG. 3A (step S10). Asolder 40 for fixing thesemiconductor laser 60 is supplied on thecarrier 30 in advance. For example, AuSn can be used as thesolder 40. - Next, a
tool 50 for holding a component moves thesemiconductor laser 60 above thecarrier 30 as illustrated inFIG. 3A (step S12). Thesemiconductor laser 60 is placed inside thestorage 70 from theopening 72 of thestorage 70. Thetool 50 has an absorption mechanism at a front edge thereof, and holds a central portion of thesemiconductor laser 60 by adsorbing the surface of thesemiconductor laser 60 at the front edge. -
FIGS. 4A and 4B illustrate detailed configuration of thetool 50.FIG. 4A is a cross-sectional diagram of thetool 50, andFIG. 4B is a top view of thetool 50, as viewed from a front edge direction. Thetool 50 includes abody portion 52 and afront edge portion 54. Anabsorption hole 56 is provided in a central portion of thebody portion 52. Thetool 50 comes in contact with thesemiconductor laser 60 at a tip of thefront edge portion 54. Thefront edge portion 54 is divided into two by agroove 58 formed according to theabsorption hole 56. The shape of a cross-sectional surface of each dividededge portion 54 is a substantial semicircle (seeFIG. 4B . A solid line indicates an outline of thefront edge portion 54, and a dotted line indicates an outline of thebody portion 52 and the absorption hole 56). -
FIG. 5A is a schematic top view of thesemiconductor laser 60, andFIG. 5B is a schematic view in the case where a layer containing theoptical waveguide layer 4 is seen through from an upper surface. As illustrated inFIG. 5B , a width (W1) of theactive layer 3, theoptical waveguide layer 4 and theoptical amplification layer 19 are smaller than a width (W2) of thesemiconductor laser 60. As illustrated inFIG. 5A , widths of theelectrodes 8 on the SG-DFB region A and theelectrodes 21 on the SOA region C are larger than the above-mentioned width (W1) of theoptical waveguide layer 4. When thetool 50 holds thesemiconductor laser 60, it is desirable that thetool 50 holds regions (e.g. dotted line regions indicated by reference numbers 90) corresponding to both sides of theactive layer 3, theoptical waveguide layer 4 or theoptical amplification layer 19 in order to avoid adding pressure to theactive layer 3, theoptical waveguide layer 4 and theoptical amplification layer 19 ofFIG. 5B . If a tool is thetool 50 having the configuration as illustrated inFIGS. 4A and 4B , thesemiconductor laser 60 can be held by aligning the positions of thegroove 58, theactivity layer 3,optical waveguide layer 4 and theoptical amplification layer 19 so that thefront edge portion 54 does not press the above-mentioned layers. - Next, the
solder 40 on thecarrier 30 is melted by raising the temperature of theheater block 80 and applying heat to thesolder 40 through the carrier 30 (step S14). When AuSn is used as thesolder 40, for example, it is desirable to set a temperature of melting to 290-310° C., and set a time period of melting to 2-6 seconds. Thereby, it is possible to restrain oxidation of the optical component including thesemiconductor laser 60. - Next, the
tool 50 mounts thesemiconductor laser 60 on the meltedsolder 40, as illustrated inFIG. 3B (step S16). Then, a cold gas (e.g. nitrogen gas or dry air) is supplied with a gas supply line 74 from theopening 72 of thestorage 70, thesolder 40 is cooled while the cold gas is blowing, and the meltedsolder 40 is solidified (step S18). At this time, by pressing thesolder 40 from above with thetool 50, thesemiconductor laser 60 is fixed so that the position thereof is aligned. -
FIG. 6 is a schematic top view illustrating a state where thesemiconductor laser 60 is mounted on thesolder 40. InFIG. 6 , thesemiconductor laser 60 is indicated by hatching, and thetool 50 is omitted. In the present embodiment, thecarrier 30 is located with fixingjigs semiconductor laser 60 may be mounted without using the fixing jigs. - Next, as illustrated in
FIG. 3C , thetool 50 is separated from the semiconductor laser 60 (Step S20). At this time, thesemiconductor laser 60 is in a state fixed oncarrier 30 by the solidifiedsolder 40. Next, as illustrated inFIG. 3D , thesolder 40 is melted again by theheater block 80 in the state where thetool 50 is separated from the semiconductor laser 60 (step S22). It is desirable to set a temperature of remelting to 310-320° C., and set a time period of remelting to 3-6 seconds. Thus, the reason why the setting temperature of the remelting is set higher than that of the first melting is that AuSn of thesolder 40 and Au of metal of a chip backside melt, a rate of Au increases, and hence the temperature needed for the remelting rises. However, when the temperatures of the first melting and the remelting are similarly set to 310-320° C., it is desirable to set the time period of the first melting to 3 seconds or less. Preferably, it is desirable to set the time period of the first melting to 2-3 seconds. - When the
solder 40 melts, thecarrier 30 on which thesemiconductor laser 60 is mounted is taken out from thestorage 70, and thesolder 40 is again solidified by natural cooling, for example, leaving thecarrier 30 on a heat sink (radiator). As another method of the natural cooling, heating of theheater block 80 may be stopped (step S24). In the present embodiment, the natural cooling is used as a recooling method. However, when cool time is shortened, the cooling may be performed by nitrogen gas as is the case with the first cooling. In addition, the first embodiment explains an example in which AuSn is used as the material of thesolder 40. However, even when the material of thesolder 40 is different material e.g. AuGe, the temperature of the remelting is higher than that of the first melting. Therefore, the setting temperature of the remelting of theheater block 80 is set higher than that of the first melting, so that the remelting can be performed easily. - In the method for fabricating the optical semiconductor device, the
semiconductor laser 60 is mounted on the meltedsolder 40, cooled once, and hence the meltedsolder 40 is solidified. Moreover, the solidifiedsolder 40 is remelted and recooled, and hence the meltedsolder 40 is resolidified. At the time of the first cooling, thesemiconductor laser 60 is pressed against thecarrier 30 with thetool 50. Therefore, the pressure concentrates in a central portion ofsolder 40, and distortion occurs in thesolder 40. However, at the time of the recooling, thetool 50 is separated from thesemiconductor laser 60. Therefore, the pressure applied from thesemiconductor laser 60 to thesolder 40 becomes uniform, and the distortion of the form of thesolder 40 is eliminated. Then, the recooling is performed in the state where the distortion of thesolder 40 is eliminated, so that thesolder 40 is solidified without the distortion. As a result, it is possible to restrain warpage of thesemiconductor laser 60 after cooling. -
FIGS. 7A and 7B are schematic cross-sectional diagrams illustrating the above-mentioned effects.FIG. 7A illustrates the optical semiconductor device fabricated by a conventional method.FIG. 7B illustrates the optical semiconductor device fabricated by the method of the present embodiment. Conventionally, since correct positioning on the carrier was required to fix the optical device, the optical device was fixed with keeping the tool pressing so that the position of the optical device may align. However, as illustrated inFIG. 7A , thesemiconductor laser 60 has a large size, compared to the tool. Therefore, when thesolder 40 is cooled in the state where the central portion of thesemiconductor laser 60 is pressed with thetool 50 as is the case with the conventional method, distribution of thesolder 40 becomes uneven by the pressure of thetool 50, the distortion occurs in thesolder 40. As a result, thesemiconductor laser 60 mounted on thesolder 40 also warps and is solidified. In addition, since thesemiconductor laser 60 is formed in a rectangular parallelepiped, the distribution of thesolder 40 becomes more uneven, the distortion also occurs in thesolder 40, and thesemiconductor laser 60 mounted on thesolder 40 also further warps. - On the contrary, in the present embodiment, since the
tool 50 is separated from thesemiconductor laser 60 in the state where thesolder 40 is melted, as illustrated inFIG. 7B , the distortion of thesolder 40 is restrained, and hence the warpage of thesemiconductor laser 60 is also restrained. In the present embodiment, the cooling is performed in the state where the positioning is performed once, the meltedsolder 40 is solidified, remelted and then recooled, and hence the meltedsolder 40 is resolidified. As a result, the influence of a positional deviation is also small. - If the warpage of the
semiconductor laser 60 is large as in the conventional example, a characteristic thereof worsens. This is because, when thesemiconductor laser 60 warps, an optical path (theactivity layer 3, theoptical waveguide layer 4, and optical amplification layer 19) in the inside of thesemiconductor laser 60 also warps, and hence a laser cannot be output according to a desirable optical path. Especially, since thesemiconductor laser 60 is a tunable laser using the vernier effect, a deviation occurs in the reflection peak wavelength of the SG-DFB region A or the reflection peak wavelength of the CSG-DBR region B when the warpage occurs as in the conventional example. Therefore, deterioration occurs in a cross protection of the vernier effect, and a desirable wavelength is not selected. Thus, since thesemiconductor laser 60 is the tunable laser, the warpage of the chip can be restrained and deterioration of the characteristic can be restrained by using the fabrication method of the present embodiment. -
FIG. 8 is a graph indicating a measurement result of a warpage amount. A horizontal axis of the graph indicates positions in a width direction of thesemiconductor laser 60, and a vertical axis of the graph indicates positions (the warpage amount of the semiconductor laser 60) in a height direction of the laser. In the present embodiment, thesemiconductor laser 60 of 3500 μm in length, 500 μm in width, and 100 μm in height is used. The surface of thesolder 40 before the melting is located in the vicinity of a scale of 116 μm in the vertical axis. A dotted line graph indicates the measurement result of the warpage amount in the conventional example, and a solid line indicates the measurement result thereof in the present embodiment, respectively. It is known that, in the conventional example, the graph greatly dents at the central portion of thesemiconductor laser 60, as illustrated inFIG. 8 , and the warpage of thesolder 40 and thesemiconductor laser 60 is large. On the contrary, it is known that the warpage amount of the central portion is greatly small in the present embodiment, compared to the conventional example, and a boundary face of thesolder 40 and thesemiconductor laser 60 is wholly uniform. Moreover, in the present embodiment, the same effect can be obtained even when thesemiconductor laser 60 of 3000 μm in length, 500 μm in width, and 100 μm in height is used. - A second embodiment is an example when the remelting and the recooling of the solder are not performed.
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FIG. 9 is a flowchart of the method for fabricating the optical semiconductor device according to the second embodiment. Since the steps S30 to S36 are the same as the steps S10 to S16 ofFIG. 2 , description thereof is not omitted. In the second embodiment, thetool 50 is separated from thesemiconductor laser 60 before the first melting of thesolder 40 is performed (step S38). Thereby, thesemiconductor laser 60 is placed on the melted solder 40 (this is the same asFIG. 3D ). Then, thesolder 40 is cooled in the state where thetool 50 is separated from thesemiconductor laser 60, and the meltedsolder 40 is solidified (step S40). Thesolder 40 may be cooled by the natural cooling, or the nitrogen gas to shorten the cool time. - According to the method for fabricating the optical semiconductor device of the second embodiment, the
tool 50 is separated from thesemiconductor laser 60 at the time of the cooling of thesolder 40 as is the case with the first embodiment, and hence the warpage of thesemiconductor laser 60 after the cooling can be restrained. Since the remelting and the recooling are not performed, the number of steps corresponding to the remelting and the recooling can be reduced, compared to the first embodiment. However, according to the method of the first embodiment, since thesemiconductor laser 60 is pressed with thetool 50 at the time of the first cooling, the positioning of thesemiconductor laser 60 can be performed more accurately. - A third embodiment is an example in which a solder accumulation portion is provided on the surface of the carrier.
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FIG. 10 is a top view of the optical semiconductor device according to a third embodiment, and illustrates a state where thesemiconductor laser 60 is mounted on thecarrier 30. InFIG. 10 , a detailed pattern on thesemiconductor laser 60 is omitted, and thesolder 40 is indicated by hatching. As illustrated inFIG. 10 , asolder accumulation portion 32 for accumulating a redundant solder is provided at the periphery of a region on which thesemiconductor laser 60 is mounted. Thesolder accumulation portion 32 extends in a direction intersecting a longitudinal direction of a mounted region of thesemiconductor laser 60 from the central portion of the mounted region of thesemiconductor laser 60. - In the optical semiconductor device according to the third embodiment, the
semiconductor laser 60 is mounted on thecarrier 30 by the same steps as the first or second embodiment. At this time, in the steps where thesolder 40 is melted, cooled and then solidified, thesolder 40 is supplied from thesolder accumulation portion 32 to a region that runs short of thesolder 40 between thesemiconductor laser 60 and thecarrier 30. On the contrary, thesolder 40 is discharged from a region where thesolder 40 remains, to thesolder accumulation portion 32. Thus, thesolder accumulation portion 32 is provided, so that a deviation amount of thesolder 40 between thesemiconductor laser 60 and thecarrier 30 can be reduced, and distortion of thesolder 40 at the time of the cooling can be restrained. As a result, the warpage of thesemiconductor laser 60 can be further restrained, compared to the first and the second embodiments. - The
solder accumulation portion 32 is provided at the periphery of the mounted region of thesemiconductor laser 60, but the position of thesolder accumulation portion 32 is not limited to the position as indicated by the present embodiment. In the method for fabricating the optical semiconductor device according to the first and the second embodiments, the central portion of thesemiconductor laser 60 in the longitudinal direction is hold with thetool 50. Therefore, it is preferable that thesolder accumulation portion 32 is formed at a midway position in the longitudinal direction of the mounted region of thesemiconductor laser 60. It is more preferable that thesolder accumulation portion 32 is formed in the vicinity of the central portion of thesemiconductor laser 60 to which the pressure from thetool 50 is applied. - In the first to third embodiments, the example in which the
semiconductor laser 60 is mounted on thecarrier 30 is explained, but the present invention can be applied to also the case where a laser other than thesemiconductor laser 60 or an optical component other than a laser (e.g. a light emitting element, a light receiving element, an etalon, an isolator, or the like) is mounted on the carrier with the solder. In addition, a device other than thetool 50 illustrated in the first and the second embodiments may be used as a method for holding the optical component. Moreover, a material other than AuSn (e.g. AuGe, AgSn, or the like) may be used as the material of the solder. - The present invention is not limited to the specifically described embodiments and variations but other embodiments and variations may be made without departing from the scope of the claimed invention.
Claims (20)
1. A method for fabricating an optical semiconductor device, comprising:
melting a solder supplied on a carrier;
mounting a semiconductor laser chip on the melted solder with a tool for holding the semiconductor laser chip;
cooling the solder;
releasing the tool from the semiconductor laser chip after the solder is cooled;
remelting the solder after the tool is released from the semiconductor laser chip; and
recooling the remelted solder.
2. The method for fabricating the optical semiconductor device according to claim 1 , wherein the cooling is natural cooling.
3. The method for fabricating the optical semiconductor device according to claim 1 , wherein the cooling is cooling by blowing gas.
4. The method for fabricating the optical semiconductor device according to claim 1 , wherein the carrier includes a mounted region on which the semiconductor laser chip is mounted, and a solder accumulation portion that extends in a direction intersecting a longitudinal direction of the mounted region.
5. The method for fabricating the optical semiconductor device according to claim 1 , wherein a length of the longitudinal direction of the semiconductor laser chip is equal to or more than 6 times of a width thereof.
6. The method for fabricating the optical semiconductor device according to claim 1 , wherein a long side of the semiconductor laser chip is equal to or more than 3.0 mm.
7. The method for fabricating the optical semiconductor device according to claim 1 , wherein a metal of a backside of the semiconductor laser chip is Au, and a temperature of the remelting is higher than a temperature of the mounting of the semiconductor laser.
8. The method for fabricating the optical semiconductor device according to claim 1 , wherein the solder is AuSn, a melting temperature and a remelting temperature are 310-320° C., and a interval between the mounting of the semiconductor laser chip and startup of the cooling is equal to or less than 3 seconds.
9. A method for fabricating an optical semiconductor device, comprising:
melting a solder supplied on a carrier;
mounting a semiconductor laser chip on the melted solder with a tool for holding the semiconductor laser chip, a length of the longitudinal direction of the semiconductor laser chip being equal to or more than 6 times of a width thereof;
releasing the tool from the semiconductor laser chip in a state where the solder is melted; and
cooling the solder in a state where the tool is released from the semiconductor laser chip.
10. The method for fabricating the optical semiconductor device according to claim 9 , wherein a long side of the semiconductor laser chip is equal to or more than 3.0 mm.
11. The method for fabricating the optical semiconductor device according to claim 1 , wherein the semiconductor laser chip is a tunable laser.
12. The method for fabricating the optical semiconductor device according to claim 1 , wherein the tool is in contact with a surface of a region excluding a stripe-like active region in the semiconductor laser chip, and holds the semiconductor laser chip.
13. The method for fabricating the optical semiconductor device according to claim 1 , wherein the melting is carried out by placing the carrier on a heater block.
14. The method for fabricating the optical semiconductor device according to claim 1 , wherein the solder is AuSn, AuGe or AgSn.
15. The method for fabricating the optical semiconductor device according to claim 2 , wherein the natural cooling is carried out by placing the carrier on a heat sink.
16. The method for fabricating the optical semiconductor device according to claim 3 , wherein the gas is nitrogen gas.
17. The method for fabricating the optical semiconductor device according to claim 4 , wherein the solder accumulation portion is a center portion in the direction intersecting the longitudinal direction of the mounted region.
18. The method for fabricating the optical semiconductor device according to claim 4 , wherein the solder accumulation portion is rectangle.
19. The method for fabricating the optical semiconductor device according to claim 9 , wherein the solder is AuSn, AuGe or AgSn.
20. The method for fabricating the optical semiconductor device according to claim 9 , wherein the melting is carried out by placing the carrier on a heater block.
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US14/982,503 US10328511B2 (en) | 2010-12-03 | 2015-12-29 | Laser apparatus with capacitor disposed in vicinity of laser diode |
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JP2010270799A JP2012119637A (en) | 2010-12-03 | 2010-12-03 | Manufacturing method of optical semiconductor device |
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US14/982,503 Active US10328511B2 (en) | 2010-12-03 | 2015-12-29 | Laser apparatus with capacitor disposed in vicinity of laser diode |
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Also Published As
Publication number | Publication date |
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JP2012119637A (en) | 2012-06-21 |
US20160129513A1 (en) | 2016-05-12 |
US20170225250A9 (en) | 2017-08-10 |
US10328511B2 (en) | 2019-06-25 |
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