US20120125588A1 - Heat dissipation plate for projection-type ic package - Google Patents
Heat dissipation plate for projection-type ic package Download PDFInfo
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- US20120125588A1 US20120125588A1 US13/266,202 US201013266202A US2012125588A1 US 20120125588 A1 US20120125588 A1 US 20120125588A1 US 201013266202 A US201013266202 A US 201013266202A US 2012125588 A1 US2012125588 A1 US 2012125588A1
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- United States
- Prior art keywords
- projection
- heat dissipation
- package
- type
- integrated circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- This disclosure relates to a heat dissipation plate for a projection-type IC package in which an integrated circuit (IC) in a board is formed to project, and more particularly, to a heat dissipation plate for a projection-type IC package which is installed to be joined and fixed to a projection-type IC package and effectively dissipates heat generated by an integrated circuit.
- IC integrated circuit
- An integrated circuit (IC) package that is introduced in order to solve a technical demand according to a tendency toward an increase in the number of pins has solder balls fused to a surface of the IC package or uses a number of lead wires provided in a side surface of the IC package as input and output means, and thus accommodates a large number of input and output signals and is formed with a small size.
- a projection-type IC package 1 from among various types of IC packages is shown in FIG. 1 .
- the structure of the projection-type IC package 1 is characterized in that an integrated circuit 2 is mounted on the surface of a board 3 , the integrated circuit 2 and the board 3 are connected to form an electrical connection, and particularly, the integrated circuit 2 is formed to project from the board 3 .
- the projection-type IC package 1 includes various kinds of input and output means according to the type, and for example, includes solder balls 4 fused on the rear surface in an array form or a number of lead wires (not shown) on the side surface.
- the projection-type IC package 1 is mounted on a printed circuit board 5 to be operated.
- the projection-type IC package 1 generates much heat during operations of the integrated circuit, and when the generated heat cannot be effectively dissipated to the outside, the performance of a semiconductor package is degraded.
- a typical heat dissipation plate H as shown in FIGS. 2( a ) and 2 ( b ) is used as it is, so that heat dissipation of the projection-type IC package cannot be effectively performed. That is, in a case where the heat dissipation plate H according to the related art as in FIGS.
- An object of the present invention is to provide, as a heat dissipation plate used for a projection-type IC package in which an integrated circuit (IC) in a board is formed to project, a heat dissipation plate for a projection-type IC package which can enhance not only heat dissipation efficiency but also adhesion performance by increasing the contact area with the projection-type IC package, and simultaneously can be simply produced, thereby reducing production costs.
- IC integrated circuit
- the present invention provides a heat dissipation plate for a projection-type integration circuit (IC) package, which is installed to be adhered and fixed to a projection-type IC package in which an integration circuit in a board is formed to project, so as to dissipate heat generated by the integrated circuit, including: a fixed plate adhered and fixed to the projection-type IC package; and heat dissipation fins (cooling fins) formed to be inclined upward from both opposing sides of the fixed plate, wherein an accommodation groove that accommodates the integrated circuit is formed in a rear surface of the fixed plate, and the accommodation groove is formed to have a shape to be joined to the integrated circuit, and the integrated circuit comes into close contact with the accommodation groove.
- IC projection-type integration circuit
- the accommodation groove may be formed by a press process.
- a surface of the fixed plate may be provided with a projection portion formed to project from the surface, the projection portion may include a projection surface and a projection connection surface formed along a periphery of the projection surface, and the projection connection surface may be formed to be inclined with respect to the projection surface and the surface of the fixed plate.
- An angle between the fixed plate and the heat dissipation plate is preferably greater than 90 degrees and equal to or smaller than 150 degrees.
- the heat dissipation fin may be provided with a plurality of though-holes.
- the contact area is increased, and thus not only the heat dissipation efficiency but also the adhesion performance can be enhanced.
- the heat dissipation plate according to the present invention can be easily produced by a press process or extrusion molding, so that the heat dissipation plate can be more efficiently produced without high production costs.
- FIG. 1 is a diagram showing the configuration of a projection-type IC package.
- FIG. 2 is a diagram showing a heat dissipation plate according to related art.
- FIG. 3( a ) is a perspective view of a heat dissipation plate for a projection-type IC package according to an embodiment of the present invention
- FIG. 3( b ) is a cross-sectional view taken along the line A-A of FIG. 3( a )
- FIG. 3( c ) is a cross-sectional view of a heat dissipation plate for a projection-type IC package according to the present invention, which is joined and fixed to the projection-type IC package.
- FIG. 4 is a perspective view of a heat dissipation plate for a projection-type IC package according to another embodiment of the present invention.
- FIG. 3( a ) is a perspective view of a heat dissipation plate 10 for a projection-type IC package according to a preferable embodiment of the present invention
- FIG. 3( b ) is a cross-sectional view taken along the line A-A of FIG. 3( a )
- FIG. 3( c ) is a side cross-sectional view of the heat dissipation plate for a projection-type IC package which is joined and fixed to a projection-type IC package 1 .
- the heat dissipation plate 10 for a projection-type integrated circuit (IC) package according to the present invention is installed to be joined and fixed to the projection-type IC package 1 in which an integrated circuit 2 is formed to project, so as to dissipate heat generated by the integrated circuit 2 .
- the heat dissipation plate 10 for a projection-type IC package is characterized in that it includes a fixed plate 11 joined and fixed to the projection-type IC package 1 , and heat dissipation fins (cooling fins) which are formed to be inclined upward from both opposing sides of the fixed plate, wherein an accommodation groove which accommodates the integrated circuit is formed on the rear surface of the fixed plate, the accommodation groove is formed into a shape to be joined to the integrated circuit, and the integrated circuit comes into close contact with the accommodation groove.
- the heat dissipation plate 10 for a projection-type IC package may be produced of any one selected from the groups consisting of aluminum, copper, zinc, silver, gold, iron, and an alloy of the metals.
- An accommodation groove 14 which accommodates the integrated circuit 2 is formed on a rear surface 11 y of the fixed plate 11 joined to the projection-type IC package 1 .
- the contact area of the projection-type IC package 1 and the heat dissipation plate 10 is increased, thereby enhancing heat dissipation performance and adhesion performance.
- the heat dissipation plate 10 used in an apparatus which requires a slim thickness such as a mobile device, the heat dissipation plate 10 may be configured by accommodating the integrated circuit 2 in the accommodation groove 14 formed in the fixed plate 11 while a heat dissipation fin 13 is not provided. If an apparatus to which the heat dissipation plate is attached ensures a sufficient internal space, the heat dissipation performance may further be enhanced by forming the heat dissipation fin 13 .
- the accommodation groove 14 of the fixed plate 11 may be easily formed by subjecting the fixed plate 11 to a forming process using a press die with a shape corresponding to the integrated circuit. Therefore, the accommodation groove 14 is formed into a shape to be joined to the integrated circuit 2 , so that the heat dissipation plate 10 may be closely fixed to the projection-type IC package.
- a surface 11 x of the fixed plate 11 is provided with a projection portion 15 formed to project from the surface 11 x .
- the projection portion 15 includes a projection surface 15 x and a projection connection surface 15 y formed along the periphery of the projection surface 15 x .
- the projection connection surface 15 y is inclined with respect to the surface 11 x of the fixed plate 11 and the projection surface 15 x of the projection portion 15 as shown in FIG. 3( b ).
- the heat dissipation plate 10 having the projection portion 15 on the surface has a widened contact area with the air due to the projection connection surface 15 y , so that the heat dissipation performance may further be enhanced.
- the above-described projection portion 15 may be formed as the surface 11 x projects in a case where the accommodation groove 14 is formed by subjecting the rear surface 11 y of the heat dissipation plate 10 having a sheet shape to a press process.
- a depth d of the accommodation groove is preferably greater than a projection height h of the integrated circuit.
- the fixed plate 11 of the heat dissipation plate 10 and the projection-type IC package 1 may be joined to each other though the adhesive 17 such as thermal conductive silicone sheet, a thermal conductive acrylic adhesive, or a thermal conductive acrylic form tape.
- the adhesive not only adheres the heat dissipation plate to the projection-type IC package but also increases thermal conductivity, thereby having a function of enhancing the heat dissipation performance of the projection-type IC package.
- the contact area of the fixed plate 11 and the projection-type IC package 1 is not limited only to the integrated circuit as in the heat dissipation plate according to the related art but extends to a printed circuit board 3 of the projection-type IC package, so that heat dissipation area is large and the adhesion performance may also be enhanced. That is, the heat dissipation plate according to the present invention has an advance in further increasing the heat dissipation efficiency while being firmly fixed onto the projection-type IC package.
- the heat dissipation fin 13 may be provided with a plurality of though-holes 16 as shown in FIG. 3( a ).
- the through-holes 16 increase the contact area with the air and thus enhance the performance of the heat dissipation fin.
- the heat dissipation fins 13 are formed to be inclined upward from both opposing sides 12 a and 12 b of the fixed plate 11 and the angle ⁇ between the fixed plate 11 and the heat dissipation fin 13 is preferably 90 to 150 degrees. If the angle between the fixed plate and the heat dissipation fin is an acute angle, the fixed plate and the heat dissipation fin are too close to each other to generate convection of the air. If the angle exceeds 150 degrees, a convection space is not ensured and thus heat dissipation is less likely to occur.
- FIG. 4( a ) is a schematic perspective view of a heat dissipation plate 10 ′ for a projection-type IC package according to another preferable embodiment of the present invention
- FIG. 4( b ) is a schematic perspective view of a heat dissipation plate 10 ′′ for a projection-type IC package according to still another preferable embodiment of the present invention
- the heat dissipation plate for a projection-type IC package shown in FIG. 4( a ) has a structure similar to that of the heat dissipation plate shown in FIG. 3 except that an insertion groove 18 is formed in the rear surface 11 y of the fixed plate 11 instead of the accommodation groove.
- the fixed plate 11 of the heat dissipation plate 10 ′ is provided with the insertion groove 18 in parallel with both opposing sides 12 a and 12 b .
- the insertion groove 18 corresponding to the width of the integrated circuit is a configuration for increasing the contact area between the projection-type IC package and the heat dissipation plate and the adhesion performance and simultaneously for facilitating production.
- the insertion groove 18 and the projection-type IC package are joined and fixed to each other by the adhesive and thus the depth of the insertion groove is preferably greater than the projecting height of the integrated circuit.
- the surface 11 x of the fixed plate 11 is provided with a projection portion 15 ′ at a position corresponding to the insertion groove 18 .
- the projection portion 15 ′ includes a projection surface 15 x ′ and a projection side surface 15 y ′ that connects the projection surface to the surface of the fixed plate.
- the heat dissipation plate 10 ′ increases the contact area with the air due to the projection side surface, so that the heat dissipation performance of the heat dissipation plate may further be enhanced.
- the heat dissipation plate for a projection-type IC package shown in FIG. 4( a ) may be produced by extrusion molding using a die of which a side end surface is opened, so that there is an advantage in that production may be simply performed and production costs may be reduced.
- a space separated from the projection-type IC package is formed along the lengthwise direction of the insertion groove 18 , and heat transfer may be achieved in the space by natural convection of the air, so that the heat dissipation performance may be not much degraded.
- the heat dissipation plate 10 ′′ for a projection-type IC package shown in FIG. 4( b ) includes a plurality of heat dissipation fins 19 on the surface 11 x of the fixed plate 11 and the insertion groove 18 on the rear surface 11 y of the fixed plate 11 . Since the insertion groove 18 is formed along the lengthwise direction of the heat dissipation fin 19 , the heat dissipation plate 10 ′′ according to this embodiment may also be easily produced using a die for extrusion molding.
- the contact area and the adhesion performance may be enhanced.
- the accommodation groove may be formed by a press process as described above.
Abstract
Description
- This disclosure relates to a heat dissipation plate for a projection-type IC package in which an integrated circuit (IC) in a board is formed to project, and more particularly, to a heat dissipation plate for a projection-type IC package which is installed to be joined and fixed to a projection-type IC package and effectively dissipates heat generated by an integrated circuit.
- An integrated circuit (IC) package that is introduced in order to solve a technical demand according to a tendency toward an increase in the number of pins has solder balls fused to a surface of the IC package or uses a number of lead wires provided in a side surface of the IC package as input and output means, and thus accommodates a large number of input and output signals and is formed with a small size.
- A projection-type IC package 1 from among various types of IC packages is shown in
FIG. 1 . The structure of the projection-type IC package 1 is characterized in that anintegrated circuit 2 is mounted on the surface of aboard 3, theintegrated circuit 2 and theboard 3 are connected to form an electrical connection, and particularly, theintegrated circuit 2 is formed to project from theboard 3. The projection-type IC package 1 includes various kinds of input and output means according to the type, and for example, includessolder balls 4 fused on the rear surface in an array form or a number of lead wires (not shown) on the side surface. - The projection-type IC package 1 is mounted on a printed
circuit board 5 to be operated. - The projection-type IC package 1 generates much heat during operations of the integrated circuit, and when the generated heat cannot be effectively dissipated to the outside, the performance of a semiconductor package is degraded.
- Therefore, in order to maximize the heat dissipation effect of the above-described projection-type IC package, there is a need to install a heat dissipation plate on the IC package to dissipate heat generated by the integrated circuit to the outside.
- However, as a heat dissipation plate according to the related art used in a projection-type IC package, a typical heat dissipation plate H as shown in
FIGS. 2( a) and 2(b) is used as it is, so that heat dissipation of the projection-type IC package cannot be effectively performed. That is, in a case where the heat dissipation plate H according to the related art as inFIGS. 2( a) and 2(b) is installed on the projection-type IC package, since the integrated circuit mounted on the projection-type IC package is formed to project from the board while the rear surface of a fixed plate P of the heat dissipation plate is formed as a flat surface, the contact area is limited only to the top of the integrated circuit, so that there are problems in that heat dissipation performance is not high and adhesion performance of the heat dissipation plate is degraded. - An object of the present invention is to provide, as a heat dissipation plate used for a projection-type IC package in which an integrated circuit (IC) in a board is formed to project, a heat dissipation plate for a projection-type IC package which can enhance not only heat dissipation efficiency but also adhesion performance by increasing the contact area with the projection-type IC package, and simultaneously can be simply produced, thereby reducing production costs.
- In order to accomplish the object, the present invention provides a heat dissipation plate for a projection-type integration circuit (IC) package, which is installed to be adhered and fixed to a projection-type IC package in which an integration circuit in a board is formed to project, so as to dissipate heat generated by the integrated circuit, including: a fixed plate adhered and fixed to the projection-type IC package; and heat dissipation fins (cooling fins) formed to be inclined upward from both opposing sides of the fixed plate, wherein an accommodation groove that accommodates the integrated circuit is formed in a rear surface of the fixed plate, and the accommodation groove is formed to have a shape to be joined to the integrated circuit, and the integrated circuit comes into close contact with the accommodation groove.
- The accommodation groove may be formed by a press process.
- A surface of the fixed plate may be provided with a projection portion formed to project from the surface, the projection portion may include a projection surface and a projection connection surface formed along a periphery of the projection surface, and the projection connection surface may be formed to be inclined with respect to the projection surface and the surface of the fixed plate.
- An angle between the fixed plate and the heat dissipation plate is preferably greater than 90 degrees and equal to or smaller than 150 degrees.
- The heat dissipation fin may be provided with a plurality of though-holes.
- According to the present invention, when the heat dissipation plate is adhered and fixed to the projection-type integration circuit (IC) package in which the integrated circuit in the substrate is formed to project, the contact area is increased, and thus not only the heat dissipation efficiency but also the adhesion performance can be enhanced. In addition, the heat dissipation plate according to the present invention can be easily produced by a press process or extrusion molding, so that the heat dissipation plate can be more efficiently produced without high production costs.
- The above and other aspects, features and advantages of the disclosed exemplary embodiments will be more apparent from the following detailed description taken in conjunction with the accompanying drawings in which:
-
FIG. 1 is a diagram showing the configuration of a projection-type IC package. -
FIG. 2 is a diagram showing a heat dissipation plate according to related art. -
FIG. 3( a) is a perspective view of a heat dissipation plate for a projection-type IC package according to an embodiment of the present invention,FIG. 3( b) is a cross-sectional view taken along the line A-A ofFIG. 3( a), andFIG. 3( c) is a cross-sectional view of a heat dissipation plate for a projection-type IC package according to the present invention, which is joined and fixed to the projection-type IC package. -
FIG. 4 is a perspective view of a heat dissipation plate for a projection-type IC package according to another embodiment of the present invention. -
FIG. 3( a) is a perspective view of aheat dissipation plate 10 for a projection-type IC package according to a preferable embodiment of the present invention,FIG. 3( b) is a cross-sectional view taken along the line A-A ofFIG. 3( a), andFIG. 3( c) is a side cross-sectional view of the heat dissipation plate for a projection-type IC package which is joined and fixed to a projection-type IC package 1. - The
heat dissipation plate 10 for a projection-type integrated circuit (IC) package according to the present invention is installed to be joined and fixed to the projection-type IC package 1 in which anintegrated circuit 2 is formed to project, so as to dissipate heat generated by theintegrated circuit 2. - The
heat dissipation plate 10 for a projection-type IC package is characterized in that it includes afixed plate 11 joined and fixed to the projection-type IC package 1, and heat dissipation fins (cooling fins) which are formed to be inclined upward from both opposing sides of the fixed plate, wherein an accommodation groove which accommodates the integrated circuit is formed on the rear surface of the fixed plate, the accommodation groove is formed into a shape to be joined to the integrated circuit, and the integrated circuit comes into close contact with the accommodation groove. - Hereinafter, the preferable embodiment will be described in more detail with reference to the accompanying drawings. However, it should be clearly understood by those skilled in the art that the embodiments are for describing the present invention more specifically and the scope of the present invention is not limited by the embodiments.
- The
heat dissipation plate 10 for a projection-type IC package may be produced of any one selected from the groups consisting of aluminum, copper, zinc, silver, gold, iron, and an alloy of the metals. - An
accommodation groove 14 which accommodates the integratedcircuit 2 is formed on arear surface 11 y of thefixed plate 11 joined to the projection-type IC package 1. As the integratedcircuit 2 of the projection-type IC package is accommodated in theaccommodation groove 14, the contact area of the projection-type IC package 1 and theheat dissipation plate 10 is increased, thereby enhancing heat dissipation performance and adhesion performance. With regard to theheat dissipation plate 10 used in an apparatus which requires a slim thickness such as a mobile device, theheat dissipation plate 10 may be configured by accommodating the integratedcircuit 2 in theaccommodation groove 14 formed in thefixed plate 11 while aheat dissipation fin 13 is not provided. If an apparatus to which the heat dissipation plate is attached ensures a sufficient internal space, the heat dissipation performance may further be enhanced by forming theheat dissipation fin 13. - The
accommodation groove 14 of thefixed plate 11 may be easily formed by subjecting thefixed plate 11 to a forming process using a press die with a shape corresponding to the integrated circuit. Therefore, theaccommodation groove 14 is formed into a shape to be joined to the integratedcircuit 2, so that theheat dissipation plate 10 may be closely fixed to the projection-type IC package. - A
surface 11 x of thefixed plate 11 is provided with aprojection portion 15 formed to project from thesurface 11 x. Theprojection portion 15 includes aprojection surface 15 x and aprojection connection surface 15 y formed along the periphery of theprojection surface 15 x. Theprojection connection surface 15 y is inclined with respect to thesurface 11 x of thefixed plate 11 and theprojection surface 15 x of theprojection portion 15 as shown inFIG. 3( b). - The
heat dissipation plate 10 having theprojection portion 15 on the surface has a widened contact area with the air due to theprojection connection surface 15 y, so that the heat dissipation performance may further be enhanced. - The above-described
projection portion 15 may be formed as thesurface 11 x projects in a case where theaccommodation groove 14 is formed by subjecting therear surface 11 y of theheat dissipation plate 10 having a sheet shape to a press process. - Meanwhile, since the
heat dissipation plate 10 and the projection-type IC package 1 may be joined and fixed to each other by an adhesive 17 as described later, a depth d of the accommodation groove is preferably greater than a projection height h of the integrated circuit. - The
fixed plate 11 of theheat dissipation plate 10 and the projection-type IC package 1 may be joined to each other though the adhesive 17 such as thermal conductive silicone sheet, a thermal conductive acrylic adhesive, or a thermal conductive acrylic form tape. The adhesive not only adheres the heat dissipation plate to the projection-type IC package but also increases thermal conductivity, thereby having a function of enhancing the heat dissipation performance of the projection-type IC package. - As shown in
FIG. 3( c), when theheat dissipation plate 10 for a projection-type IC package according to the preferable embodiment of the present invention is adhered and fixed onto the projection-type IC package 1, the contact area of thefixed plate 11 and the projection-type IC package 1 is not limited only to the integrated circuit as in the heat dissipation plate according to the related art but extends to a printedcircuit board 3 of the projection-type IC package, so that heat dissipation area is large and the adhesion performance may also be enhanced. That is, the heat dissipation plate according to the present invention has an advance in further increasing the heat dissipation efficiency while being firmly fixed onto the projection-type IC package. - In addition, the
heat dissipation fin 13 may be provided with a plurality of though-holes 16 as shown inFIG. 3( a). The through-holes 16 increase the contact area with the air and thus enhance the performance of the heat dissipation fin. - The
heat dissipation fins 13 are formed to be inclined upward from bothopposing sides fixed plate 11 and the angle θ between thefixed plate 11 and theheat dissipation fin 13 is preferably 90 to 150 degrees. If the angle between the fixed plate and the heat dissipation fin is an acute angle, the fixed plate and the heat dissipation fin are too close to each other to generate convection of the air. If the angle exceeds 150 degrees, a convection space is not ensured and thus heat dissipation is less likely to occur. -
FIG. 4( a) is a schematic perspective view of aheat dissipation plate 10′ for a projection-type IC package according to another preferable embodiment of the present invention, andFIG. 4( b) is a schematic perspective view of aheat dissipation plate 10″ for a projection-type IC package according to still another preferable embodiment of the present invention, and - The heat dissipation plate for a projection-type IC package shown in
FIG. 4( a) has a structure similar to that of the heat dissipation plate shown inFIG. 3 except that aninsertion groove 18 is formed in therear surface 11 y of thefixed plate 11 instead of the accommodation groove. - In order to increase the adhesion with the projection-type IC package, the
fixed plate 11 of theheat dissipation plate 10′ is provided with theinsertion groove 18 in parallel with bothopposing sides insertion groove 18 corresponding to the width of the integrated circuit is a configuration for increasing the contact area between the projection-type IC package and the heat dissipation plate and the adhesion performance and simultaneously for facilitating production. Theinsertion groove 18 and the projection-type IC package are joined and fixed to each other by the adhesive and thus the depth of the insertion groove is preferably greater than the projecting height of the integrated circuit. - In addition, the
surface 11 x of thefixed plate 11 is provided with aprojection portion 15′ at a position corresponding to theinsertion groove 18. Theprojection portion 15′ includes aprojection surface 15 x′ and aprojection side surface 15 y′ that connects the projection surface to the surface of the fixed plate. Theheat dissipation plate 10′ increases the contact area with the air due to the projection side surface, so that the heat dissipation performance of the heat dissipation plate may further be enhanced. - The heat dissipation plate for a projection-type IC package shown in
FIG. 4( a) may be produced by extrusion molding using a die of which a side end surface is opened, so that there is an advantage in that production may be simply performed and production costs may be reduced. - In addition, when the heat dissipation plate is installed on the projection-type IC package, a space separated from the projection-type IC package is formed along the lengthwise direction of the
insertion groove 18, and heat transfer may be achieved in the space by natural convection of the air, so that the heat dissipation performance may be not much degraded. - The
heat dissipation plate 10″ for a projection-type IC package shown inFIG. 4( b) includes a plurality ofheat dissipation fins 19 on thesurface 11 x of the fixedplate 11 and theinsertion groove 18 on therear surface 11 y of the fixedplate 11. Since theinsertion groove 18 is formed along the lengthwise direction of theheat dissipation fin 19, theheat dissipation plate 10″ according to this embodiment may also be easily produced using a die for extrusion molding. - In addition, although not shown in the figures, by forming an accommodation groove (not shown) in which the integration circuit of the projection-type IC package may be accommodated in the
rear surface 11 y of the fixedplate 11 instead of theinsertion groove 18, the contact area and the adhesion performance may be enhanced. Of course, the accommodation groove may be formed by a press process as described above. - Those skilled in the art will appreciate that the conceptions and specific embodiments disclosed in the foregoing description may be readily utilized as a basis for modifying or designing other embodiments for carrying out the same purposes of the present invention. Those skilled in the art will also appreciate that such equivalent embodiments do not depart from the spirit and scope of the present invention as set forth in the appended claims.
Claims (5)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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KR10-2009-0005143 | 2009-04-28 | ||
KR2020090005143U KR200448519Y1 (en) | 2009-04-28 | 2009-04-28 | Heat sink for protrusion type ic package |
PCT/KR2010/002545 WO2010126255A2 (en) | 2009-04-28 | 2010-04-23 | Heat sink for a protrusion-type ic package |
Publications (1)
Publication Number | Publication Date |
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US20120125588A1 true US20120125588A1 (en) | 2012-05-24 |
Family
ID=43032659
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US13/266,202 Abandoned US20120125588A1 (en) | 2009-04-28 | 2010-04-23 | Heat dissipation plate for projection-type ic package |
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US (1) | US20120125588A1 (en) |
EP (1) | EP2426711A2 (en) |
KR (1) | KR200448519Y1 (en) |
CN (1) | CN102439714A (en) |
WO (1) | WO2010126255A2 (en) |
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US11345625B2 (en) | 2013-01-15 | 2022-05-31 | Corning Laser Technologies GmbH | Method and device for the laser-based machining of sheet-like substrates |
US11542190B2 (en) | 2016-10-24 | 2023-01-03 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
US11648623B2 (en) | 2014-07-14 | 2023-05-16 | Corning Incorporated | Systems and methods for processing transparent materials using adjustable laser beam focal lines |
US11697178B2 (en) | 2014-07-08 | 2023-07-11 | Corning Incorporated | Methods and apparatuses for laser processing materials |
US11713271B2 (en) | 2013-03-21 | 2023-08-01 | Corning Laser Technologies GmbH | Device and method for cutting out contours from planar substrates by means of laser |
US11773004B2 (en) | 2015-03-24 | 2023-10-03 | Corning Incorporated | Laser cutting and processing of display glass compositions |
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---|---|---|---|---|
DE202014103436U1 (en) | 2014-07-25 | 2014-08-06 | Jenoptik Optical Systems Gmbh | Optoelectronic assembly with heat sink |
CN106416447A (en) * | 2015-01-22 | 2017-02-15 | 华为技术有限公司 | Heat dissipation apparatus for small-size device and circuit board heat dissipation system |
KR102346297B1 (en) * | 2021-07-15 | 2022-01-04 | (주)알에프세미 | Variable stacked heat sink package |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3187812A (en) * | 1963-02-11 | 1965-06-08 | Staver Co | Heat dissipator for electronic circuitry |
US3372733A (en) * | 1964-02-11 | 1968-03-12 | Russell J. Callender | Method of maintaining electrical characteristics of electron tubes and transistors an structure therefor |
US5794684A (en) * | 1996-11-08 | 1998-08-18 | Jacoby; John | Stacked fin heat sink construction and method of manufacturing the same |
US5869889A (en) * | 1997-04-21 | 1999-02-09 | Lsi Logic Corporation | Thin power tape ball grid array package |
US5932925A (en) * | 1996-09-09 | 1999-08-03 | Intricast, Inc. | Adjustable-pressure mount heatsink system |
US6169657B1 (en) * | 1998-03-06 | 2001-01-02 | Lg Electronics Inc. | Radiating device for electronic appliances |
US6308771B1 (en) * | 1998-10-29 | 2001-10-30 | Advanced Thermal Solutions, Inc. | High performance fan tail heat exchanger |
US6691768B2 (en) * | 2001-06-25 | 2004-02-17 | Sun Microsystems, Inc. | Heatsink design for uniform heat dissipation |
US7040388B1 (en) * | 2000-01-14 | 2006-05-09 | Matsushita Electric Industrial Co., Ltd. | Heat sink, method of manufacturing the same and cooling apparatus using the same |
US20060187645A1 (en) * | 2005-02-23 | 2006-08-24 | Kabushiki Kaisha Toshiba | Heat dissipation device for electronic equipment |
US20060187643A1 (en) * | 2005-02-18 | 2006-08-24 | Kabushiki Kaisha Toshiba | Heat dissipation device and heat dissipation method for electronic equipment |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2686408B2 (en) * | 1993-09-02 | 1997-12-08 | 富士電気化学株式会社 | Radiator for module |
TW258829B (en) * | 1994-01-28 | 1995-10-01 | Ibm | |
JPH07321257A (en) * | 1994-05-20 | 1995-12-08 | Hitachi Ltd | Multichip module |
KR20030041653A (en) * | 2001-11-21 | 2003-05-27 | 주동욱 | Method of ensuring grounding using one piece type heating slug improved adhesive power in a Flip-Chip BGA |
CN2645235Y (en) * | 2003-08-15 | 2004-09-29 | 英业达股份有限公司 | Heat abstractor |
CN201194463Y (en) * | 2008-05-12 | 2009-02-11 | 讯凯国际股份有限公司 | Heat radiator |
-
2009
- 2009-04-28 KR KR2020090005143U patent/KR200448519Y1/en not_active IP Right Cessation
-
2010
- 2010-04-23 CN CN2010800190932A patent/CN102439714A/en active Pending
- 2010-04-23 EP EP10769900A patent/EP2426711A2/en not_active Withdrawn
- 2010-04-23 US US13/266,202 patent/US20120125588A1/en not_active Abandoned
- 2010-04-23 WO PCT/KR2010/002545 patent/WO2010126255A2/en active Application Filing
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3187812A (en) * | 1963-02-11 | 1965-06-08 | Staver Co | Heat dissipator for electronic circuitry |
US3372733A (en) * | 1964-02-11 | 1968-03-12 | Russell J. Callender | Method of maintaining electrical characteristics of electron tubes and transistors an structure therefor |
US5932925A (en) * | 1996-09-09 | 1999-08-03 | Intricast, Inc. | Adjustable-pressure mount heatsink system |
US5794684A (en) * | 1996-11-08 | 1998-08-18 | Jacoby; John | Stacked fin heat sink construction and method of manufacturing the same |
US5869889A (en) * | 1997-04-21 | 1999-02-09 | Lsi Logic Corporation | Thin power tape ball grid array package |
US6169657B1 (en) * | 1998-03-06 | 2001-01-02 | Lg Electronics Inc. | Radiating device for electronic appliances |
US6308771B1 (en) * | 1998-10-29 | 2001-10-30 | Advanced Thermal Solutions, Inc. | High performance fan tail heat exchanger |
US7040388B1 (en) * | 2000-01-14 | 2006-05-09 | Matsushita Electric Industrial Co., Ltd. | Heat sink, method of manufacturing the same and cooling apparatus using the same |
US6691768B2 (en) * | 2001-06-25 | 2004-02-17 | Sun Microsystems, Inc. | Heatsink design for uniform heat dissipation |
US20060187643A1 (en) * | 2005-02-18 | 2006-08-24 | Kabushiki Kaisha Toshiba | Heat dissipation device and heat dissipation method for electronic equipment |
US20060187645A1 (en) * | 2005-02-23 | 2006-08-24 | Kabushiki Kaisha Toshiba | Heat dissipation device for electronic equipment |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11345625B2 (en) | 2013-01-15 | 2022-05-31 | Corning Laser Technologies GmbH | Method and device for the laser-based machining of sheet-like substrates |
US11713271B2 (en) | 2013-03-21 | 2023-08-01 | Corning Laser Technologies GmbH | Device and method for cutting out contours from planar substrates by means of laser |
US11148225B2 (en) | 2013-12-17 | 2021-10-19 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
US11697178B2 (en) | 2014-07-08 | 2023-07-11 | Corning Incorporated | Methods and apparatuses for laser processing materials |
US11648623B2 (en) | 2014-07-14 | 2023-05-16 | Corning Incorporated | Systems and methods for processing transparent materials using adjustable laser beam focal lines |
US11773004B2 (en) | 2015-03-24 | 2023-10-03 | Corning Incorporated | Laser cutting and processing of display glass compositions |
US11111170B2 (en) | 2016-05-06 | 2021-09-07 | Corning Incorporated | Laser cutting and removal of contoured shapes from transparent substrates |
US11130701B2 (en) | 2016-09-30 | 2021-09-28 | Corning Incorporated | Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots |
US11542190B2 (en) | 2016-10-24 | 2023-01-03 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
WO2021194716A1 (en) * | 2020-03-24 | 2021-09-30 | Arris Enterprises Llc | Heat exchange ribbon |
US11570932B2 (en) | 2020-03-24 | 2023-01-31 | Arris Enterprises Llc | Heat exchange ribbon |
Also Published As
Publication number | Publication date |
---|---|
EP2426711A2 (en) | 2012-03-07 |
WO2010126255A3 (en) | 2011-01-20 |
KR200448519Y1 (en) | 2010-04-21 |
WO2010126255A2 (en) | 2010-11-04 |
CN102439714A (en) | 2012-05-02 |
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