US20120081633A1 - Liquid Crystal Display - Google Patents
Liquid Crystal Display Download PDFInfo
- Publication number
- US20120081633A1 US20120081633A1 US13/232,113 US201113232113A US2012081633A1 US 20120081633 A1 US20120081633 A1 US 20120081633A1 US 201113232113 A US201113232113 A US 201113232113A US 2012081633 A1 US2012081633 A1 US 2012081633A1
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- Prior art keywords
- light source
- point light
- liquid crystal
- guide plate
- source assembly
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133382—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
- G02B6/0055—Reflecting element, sheet or layer
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0086—Positioning aspects
- G02B6/0088—Positioning aspects of the light guide or other optical sheets in the package
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133609—Direct backlight including means for improving the color mixing, e.g. white
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Liquid Crystal (AREA)
- Planar Illumination Modules (AREA)
Abstract
A liquid crystal display includes a light guide plate that guides incident light, a first point light source assembly including first point light source elements that provide the light to the light guide plate and a first support substrate having the first point light source elements, the first point light source assembly being disposed at one side of the light guide plate, a second point light source assembly including second point light source elements that provide the light to the light guide plate and a second support substrate having the second point light source elements, the second point light source assembly being disposed at the other side of the light guide plate, a liquid crystal panel assembly disposed on the light guide plate that displays image information, and a lower container that accommodates the light guide plate, first and second point light source assemblies, and liquid crystal panel assembly.
Description
- This application is a divisional of U.S. patent application Ser. No. 11/944,012, filed on Nov. 21, 2007, which in turn claims priority from Korean Patent Application Nos. 10-2006-0115165 and 10-2006-0123917 filed on Nov. 21, 2006 and Dec. 7, 2006, respectively, the disclosures of which are incorporated herein by reference in their entireties.
- 1. Technical Field
- The present disclosure relates to a display, and more particularly to a liquid crystal display including a point light source assembly.
- 2. Discussion of the Related Art
- Liquid crystal displays are widely used flat panel displays. A liquid crystal display includes two substrates with electrodes and a liquid crystal layer interposed between the substrates. The liquid crystal display rearranges liquid crystal molecules in a liquid crystal layer by applying a voltage to electrodes to control the amount of light passing through the liquid crystal layer.
- Because these liquid crystal molecules display images by changing light transmittance according to the direction and magnitude of an electromagnetic field, a liquid crystal display uses light for displaying images. Typical light sources used in liquid crystal displays are, for example, a light emitting diode (LED), a cold cathode fluorescent lamp (CCFL), and a flat fluorescent lamp (FFL).
- LEDs have a characteristic of low power consumption and high luminance.
- The emitting efficiency of the LEDs changes according to the change of a surrounding temperature. The change of emitting efficiency of the LEDs results in deterioration of display characteristics of liquid crystal displays. For example, the emitting efficiency of a red LED changes substantially according to changes in a surrounding temperature, and color spots appear due to decreased color uniformity for each region. The decrease in color uniformity occurs because the surrounding temperature is not uniform for each region of the liquid crystal display.
- According to an exemplary embodiment of the present invention, a liquid crystal display includes a light guide plate guiding incident light, a first point light source assembly which includes first point light source elements providing the light to the light guide plate and a first support substrate having the first point light source elements and is disposed at a side of the light guide plate, a second point light source assembly which includes second point light source elements providing the light to the light guide plate and a second support substrate having the second point light source elements and is disposed at the other side of the light guide plate, a liquid crystal panel assembly disposed on the light guide plate and displaying image information, and a lower container accommodating the light guide plate, first and second point light source assemblies, and liquid crystal panel assembly. The first support substrate can be larger than the second support substrate in area.
- According to an exemplary embodiment of the present invention, a liquid crystal display includes a light guide plate guiding incident light, a first point light source assembly which includes first point light source elements providing the light to the light guide plate and a first support substrate equipped with the first point light source elements and is disposed at a side of the light guide plate, a second point light source assembly which includes second point light source elements providing the light to the light guide plate and a second support substrate having the second point light source elements and is disposed at the other side of the light guide plate, a liquid crystal panel assembly disposed on the light guide plate and displaying image information, a lower container accommodating the light guide plate, first and second point light source assemblies, and liquid crystal panel assembly, and first and second heat conductive pads interposed between the lower container and the first and second point light source assemblies, respectively. The first heat conductive pad can be larger than the second heat conductive pad in area.
- According to an exemplary embodiment of the invention, a liquid crystal display includes a light guide plate guiding incident light, a point light source assembly including point light source elements providing the light to the light guide plate and a support substrate having groups of point light source element comprising at least one of the point light source elements, a lower container accommodating the light guide plate and point light source assembly, and a heat conductive pad interposed between the point light source assembly and the lower container. The heat conductive pad can include unit regions having the groups of point light source elements, and the unit regions include a first unit region and a second unit region wherein the first unit region and the second unit region are different in size.
- Exemplary embodiments of the present invention can be understood in more detail from the following descriptions taken in conjunction with the accompanying drawings in which:
-
FIG. 1 is an exploded perspective view of a liquid crystal display according to an exemplary embodiment of the present invention; -
FIG. 2 is a graph showing a luminance of an emitting chip in relation to a surrounding temperature; -
FIG. 3 is a partial perspective cut-away view illustrating a first point light source assembly and a lower container according to an exemplary embodiment of the present invention; -
FIG. 4 is a cross-sectional view of a liquid crystal display taken along the line IV-IV′ ofFIG. 1 ; -
FIG. 5 a is an exploded perspective view showing a point light source assembly and a lower container accommodating the point light source assembly included in a liquid crystal display according to an exemplary embodiment of the present invention; -
FIG. 5 b is a cross-sectional view of a point light source assembly and a lower container taken along the line Vb-Vb′ ofFIG. 5 a; -
FIG. 5 c is a cross-sectional view of a point light source assembly and a lower container taken along the line Vc-Vc′ ofFIG. 5 a; -
FIG. 6 a is an exploded perspective view showing a point light source assembly and a lower container accommodating the point light source assembly included in a liquid crystal display according to an exemplary embodiment of the present invention; -
FIG. 6 b is a cross-sectional view of a point light source assembly and a lower container taken along the line VIb-VIb′ ofFIG. 6 a; -
FIG. 7 a is an exploded perspective view of a point light source assembly and a lower container accommodating the point light source assembly included in a liquid crystal display according to an exemplary embodiment of the present invention; -
FIG. 7 b is a cross-sectional view of a point light source assembly and a lower container taken along the line VIIb-VIIb′ ofFIG. 7 a; -
FIG. 8 is an exploded perspective view of a point light source assembly and a lower container accommodating the point light source assembly according to an exemplary embodiment of the present invention; -
FIG. 9 is a first heat conductive pad according to an exemplary embodiment of the present invention; -
FIG. 10 a is a perspective view of a point light source assembly included in a liquid crystal display according to an exemplary embodiment of the present invention; -
FIG. 10 b is a plan view of a point light source assembly according to an exemplary embodiment of the present invention; -
FIG. 11 is a diagram of a heat conductive pad of a point light source assembly according to an exemplary embodiment of the present invention; -
FIG. 12 a is an exploded perspective view of a backlight unit having a point light source assembly according to an exemplary embodiment of the present invention; -
FIG. 12 b is a backlight unit according to an exemplary embodiment of the present invention; -
FIG. 13 is a table illustrating heat dissipation effects of a point light source assembly; -
FIG. 14 a is a perspective view of a point light source assembly included in a liquid crystal display according to an exemplary embodiment of the present invention; and -
FIG. 14 b is a plan view of a point light source assembly according to an exemplary embodiment of the present invention. - The invention is described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown.
- The invention may, however, be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein.
- A liquid crystal display according to an exemplary embodiment of the invention is described with reference to
FIGS. 1 to 4 . -
FIG. 1 is an exploded perspective view of a liquid crystal display according to an exemplary embodiment of the present invention. - Referring to
FIG. 1 , aliquid crystal display 100 according to an exemplary embodiment of the present invention includes a liquidcrystal panel assembly 130, abacklight unit 140, anupper container 110, and alower container 160. - The liquid
crystal panel assembly 130 includes a liquid crystal panel 136 including alower display substrate 133, an upper display substrate 134 and a liquid crystal layer (not shown) inserted between the display substrates, a gatechip film package 131, a datachip film package 132, and a printedcircuit board 135. - The liquid crystal panel 136 includes the
lower display substrate 133 that includes gate lines (not shown), data lines (not shown), a thin film transistor array, pixel electrodes and the upper display substrate 134 that includes color filters, a black matrix, and a common electrode and faces thelower display substrate 133. The color filters and common electrode may be formed on thelower display substrate 133. The liquid crystal panel 136 displays image information. - The gate
chip film package 131 is connected to each gate line (not shown) formed on thelower display substrate 133 and provides each gate line with gate driving signals. The datachip film package 132 is connected to each data line (not shown) formed on thelower display substrate 133 and provides each data line with data driving signals. The gatechip film package 131 and datachip film package 132 include a Tape Automated Bonding (TAB) tape with a semiconductor chip bonded with a wiring pattern formed on a base film by Tape Automated Bonding (TAB). For example, for the gate and datachip film packages - The printed
circuit board 135 is mounted with a variety of driving elements that process gate driving signals inputted into the gatechip film package 131 and data driving signals inputted into the datachip film package 132. The printedcircuit board 135 is connected with the liquid crystal panel 136 and provides image information to the liquid crystal panel 136. - The
backlight unit 140 includesoptical sheets 141, alight guide plate 142, first and second pointlight source assemblies sheet 146. - The
light guide plate 142 guides light supplied from the first and second pointlight source assemblies light guide plate 142 comprises a plate of a transparent material. For example, an acrylic resin, such as PolyMethyl MethAcrylate (PMMA), or polycarbonate can be used as thelight guide plate 142. When incident light through a side of thelight guide plate 142 reaches the upper or lower surface of thelight guide plate 142 over the critical angle of thelight guide plate 142, the incident light is reflected from the surface of thelight guide plate 142 and transmitted throughout the inside of thelight guide plate 142 without leakage. - A diffusion pattern (not shown) is formed on at least one of the upper and lower surfaces of the
light guide plate 142 to guide the light inside thelight guide plate 142 to travel to the liquid crystal panel 136 disposed on thelight guide plate 142. In an exemplary embodiment, a diffusion pattern may be formed on the lower surface of thelight guide plate 142. That is, the light inside thelight guide plate 142 is reflected from the diffusion pattern and travels outside through the upper surface of thelight guide plate 142. The diffusion pattern formed on a surface of thelight guide plate 142 may change in size and density according to the distance from the first and second pointlight source assemblies light guide plate 142 uniform in luminance. For example, the larger the distance from the first and second pointlight source assemblies - The diffusion pattern may be formed by, for example, a silk screen printing of ink. A diffusion pattern that has substantially the same operational effect may be formed by forming fine grooves or protrusions on the
light guide plate 142. - The first and second point
light source assemblies light guide plate 142. In an exemplary embodiment, thelight guide plate 142 can be formed, for example, in a flat plate shape with a substantially uniform thickness to uniformly transmit light throughout the display. - The first point
light source assembly 145 a supplies light to the liquid crystal panel 136 that is a passive light emitting component. The first pointlight source assembly 145 a includes a plurality of pointlight source elements 143 and afirst support substrate 144 a having the pointlight source elements 143 disposed thereon. The second pointlight source assembly 145 b supplies light to the liquid crystal panel 136. The second pointlight source assembly 145 b includes a plurality of point light source elements (not shown) and asecond support substrate 144 b having the point light source elements. The first pointlight source assembly 145 a is disposed on a first inside of thelower container 160 that is close to the datachip film package 132. The second pointlight source assembly 145 b is disposed on a second inside facing the first inside of thelower container 160. - The point
light source elements 143 are formed on sides of the first andsecond support substrates second support substrates second support substrates - Each of the point
light source elements 143 includes a light emitting element that emits light, for example, directly. For example, the pointlight source element 143 may be an LED, an incandescent lamp, and a white halogen lamp. Each of the pointlight source element 143 includes a frame (not shown) and red, green, and blue light emitting chips disposed inside the frame. White light is produced by mixing red, green, and blue light emitted from each light emitting chip. -
FIG. 2 is a graph that shows a luminance of light emitting chips in relation to a surrounding temperature. The relative luminance is based on the luminance of light radiated from the light emitting chips at a temperature of about 25° C. - As shown in
FIG. 2 , relative luminance of a red light emitting chip R rapidly changes with respect to temperature as compared with a green light emitting chip G and blue light emitting chip B. The pointlight source element 143 comprises the red, green, and blue light emitting chips R, G, B. When temperatures are different at each region where the pointlight source elements 143 are disposed, color scheme of red, green, and blue light radiated from each pointlight source element 143 varies, which reduces color uniformity. - Referring to
FIG. 1 , the reflectingsheet 146 is disposed under thelight guide plate 142 and reflects light that travels down out of thelight guide plate 142 upwardly. The reflectingsheet 146 reduces loss of light entering the liquid crystal panel 136 and improves color uniformity of light passing through the exit surface of thelight guide plate 142 by reflecting light, which is not reflected by the diffusion pattern on a side of thelight guide plate 142, to the exit surface of thelight guide plate 142. - For example, the reflecting
sheet 146 may comprise polyethylene terephthalate (PET) and a side of the reflectingsheet 146 may be coated with a diffusion layer that contains, for example, titanium dioxide. As titanium dioxide is dried and fixed, light can be more uniformly diffused by a white surface of frost formed by the titanium dioxide and predetermined reflective effect is achieved. - The
optical sheets 141, disposed on the upper surface of thelight guide plate 142, diffuse and concentrate light transmitted from thelight guide plate 142. Theoptical sheets 141 include, for example, a diffusion sheet, a prism sheet, and a protection sheet. Disposed between thelight guide plate 142 and the prism sheet, the diffusion sheet prevents a partial concentration of light by distributing light from thelight guide plate 142. The prism sheet has an upper surface with a predetermined array of triangular prisms and may comprise, for example, two sheets. The prism arrays that cross with each other at a predetermined angle concentrate light diffused from the diffusion sheet perpendicularly to the liquid crystal panel 136. Accordingly, most light passing through the prism sheet perpendicularly travels and luminance is uniformly distributed on the protection sheet. The protection sheet, formed on the prism sheet, protects the surface of the prism sheet, and diffuses light to uniformly distribute the light. Configuration of theoptical sheets 141 is not limited to the above and may be variously modified. - The liquid crystal panel 136 is formed on the protection sheet and placed inside the
lower container 160 together with thebacklight unit 140. Thelower container 160 has sides formed along the edge of the bottom (see 164 inFIG. 3 ). Thelower container 160 accommodates thebacklight unit 140 and the liquidcrystal panel assembly 130 inside the sides. Thelower container 160 prevents thebacklight unit 140 with a plurality of sheets from being bent. The printedcircuit board 135 of the liquidcrystal panel assembly 130 is bent and placed onto the outside of a side of thelower container 160, e.g., a rear side of thelower container 160. Thelower container 160 may have a variety of shapes, depending on, for example, the ways of disposing thebacklight unit 140 or the liquidcrystal panel assembly 130 into thelower container 160. - The
upper container 110 is combined with thelower container 160. Theupper container 110 covers the upper surface of the liquidcrystal panel assembly 130 placed in thelower container 160. A window is formed on the upper surface of theupper container 110 to expose the liquidcrystal panel assembly 130 to the outside. - The
upper container 110 may be combined with thelower container 160 by, for example, hooks (not shown). In an exemplary embodiment, the hooks are formed on the outsides of the sides of thelower container 160 and corresponding hook-inserting holes (not shown) are formed in the sides of theupper container 110. Accordingly, when theupper container 110 and thelower container 160 are combined by moving theupper container 110 down over thelower container 160, the hooks of thelower container 160 are inserted into the hook-inserting holes of theupper container 110 and theupper container 110 is fastened with thelower container 160. Theupper container 110 andlower container 160 may be combined in a variety of ways. -
FIG. 3 is a partial perspective cut-away view illustrating the first pointlight source assembly 145 a and thelower container 160 according to an exemplary embodiment of the present invention.FIG. 4 is a cross-sectional view of a liquid crystal display taken along the line IV-IV′ inFIG. 1 . - Referring to
FIGS. 3 and 4 , as described above, thelower container 160 hassides 162 formed along the edge of the bottom 164. Afirst groove 166 a and asecond groove 166 b are formed on the bottom 164 along twosides 162. The first and second pointlight source assemblies first groove 166 a andsecond groove 166 b, respectively. The first andsecond support substrates second grooves sides 162 of thelower container 160. - The first point
light source assembly 145 a is disposed adjacent to theside 162 of thelower container 160, close to the datachip film package 132, and the second pointlight source assembly 145 b is disposed adjacent to the opposite side to the first pointlight source assembly 145 a. The region around the first pointlight source assembly 145 a is higher in temperature than the region adjacent to the second pointlight source assembly 145 b due to the heat generated by a driving IC (integrated circuit) (IC) mounted in the datachip film package 132. Non-uniformity of temperature in the regions reduces color uniformity. - Heat generated from the point
light elements 143 of the first and second pointlight source assemblies sides 162 of thelower container 160 through the first andsecond support substrates light source assembly 145 a, more heat out of the first pointlight source assembly 145 a can be dissipated to the outside as compared with the second pointlight source assembly 145 b. In an exemplary embodiment, the area of thefirst support substrate 144 a is larger than thesecond support substrate 144 b. For example, the first andsecond support substrates second support substrates sides 162 of thelower container 160, and the width W1 of thefirst support substrate 144 a can be larger than the width W2 of thesecond support substrate 144 b. For example, when the width W1 of thefirst support substrate 144 a is 1.2 times larger than the width W2 of thesecond support substrate 144 b, the region around the first pointlight source assembly 145 a can decrease the temperature by about 2° C. to about 5° C. - For the first point
light source assembly 145 a disposed at the relatively high-temperature region, color uniformity can be improved by increasing the area of thefirst support substrate 144 a facing theside 162 of thelower container 160 while decreasing the surrounding temperature. - Since the
first support substrate 144 a is larger than thesecond support substrate 144 b in area, thefirst groove 166 a may be formed with a depth D1 which is larger than thesecond groove 166 b with a depth D2. Therefore, the pointlight elements 143 of the first and second pointlight source assemblies light guide plate 142. -
FIG. 5 a is an exploded perspective view showing a point light source assembly and a lower container accommodating the point light source assembly included in a liquid crystal display according to an exemplary embodiment of the present invention.FIG. 5 b is a cross-sectional view of a point light source assembly and a lower container taken along the line Vb-Vb′ inFIG. 5 a.FIG. 5 c is a cross-sectional view of a point light source assembly and a lower container taken along the line Vc-Vc′ inFIG. 5 a. - Referring to
FIGS. 5 a to 5 c, a first pointlight source assembly 245 a includes a plurality of pointlight elements 143 and afirst support substrate 244 a having the pointlight elements 143. Afirst groove 266 a to receive the first pointlight source assembly 245 a and asecond groove 166 b to receive the second pointlight source assembly 145 b are formed on the bottom of alower container 260 along twosides 162. - Because the first point
light source assembly 245 a is disposed close to the datachip film package 132, the region around the first pointlight source assembly 245 a is higher in temperature than the region around the second pointlight source assembly 145 b due to heat generated by a driving IC mounted in the datachip film package 132. The central portion is higher in temperature than both sides in the first pointlight source assembly 245 a. - To decrease the temperature of the first point
light source assembly 245 a at a level approximate to the second pointlight source assembly 145 b, the area of thefirst support substrate 244 a can be larger than thesecond support substrate 144 b. - To decrease the temperature of the central portion at a level approximate to both side portions of the first point
light source assembly 245 a, the central area can be formed larger than the side portions of thefirst support substrate 244 a. In an exemplary embodiment, the central width is larger than the side width of thefirst support substrate 244 a. For example, thefirst support substrate 244 a may be formed into a T-shape. When the central width is about 1.1 to about 1.2 times larger than the side width of thefirst support substrate 244 a, the central portion can decrease the temperature by about 2° to about 5° C. - The side width of the
first support substrate 244 a may be set substantially the same as or larger than the width of thesecond support substrate 144 b. - Color uniformity of the
LCD 100 can be improved by forming the central width larger than the side width of thefirst support substrate 244 a because the temperature of the central portion can be reduced. - Since the central width of the first support substrate is larger than the side width of the
first support substrate 244 a, the corresponding central portion of thefirst groove 266 a can be formed deeper than the corresponding side portions of thefirst groove 266 a. -
FIG. 6 a is an exploded perspective view showing a point light source assembly and a lower container accommodating the assembly included in a liquid crystal display according to an exemplary embodiment of the present invention.FIG. 6 b is a cross-sectional view of a point light source assembly and lower container taken along the line VIb-VIb′ ofFIG. 6 a. - Referring to
FIGS. 6 a and 6 b, a first pointlight source assembly 345 a includes a plurality of pointlight source elements 143 and afirst support substrate 344 a having the pointlight source elements 143. Afirst groove 366 a to receive the first pointlight source assembly 345 a and a second groove (not shown) to receive the second pointlight source assembly 145 b are formed on the bottom of alower container 360 along twosides 162. - Because the first point
light source assembly 345 a is disposed close to the datachip film package 132, the region around the first pointlight source assembly 345 a is higher in temperature than the region around the second pointlight source assembly 145 b due to heat generated by a driving IC mounted in the datachip film package 132. The central portion of the first pointlight source assembly 345 a is higher in temperature than short-side portions of the first pointlight source assembly 345 a. - To decrease the temperature of the first point
light source assembly 345 a at a level approximate to the second pointlight source assembly 145 b, the area of thefirst support substrate 344 a can be larger than thesecond support substrate 144 b. To decrease the temperature of the central portion of the firstlight source assembly 345 a to a level approximate to both side portions of the first pointlight source assembly 345 a, the central portion can be formed larger than the side portions of thefirst support substrate 344 a. The central width of thefirst support substrate 344 a can be larger than the side width of thefirst support substrate 344 a. For example, thefirst support substrate 344 a may be formed into an arch with a wide central portion. - Color uniformity of the
LCD 100 can be improved by increasing the central width of thefirst support substrate 344 a than the side width of thefirst support substrate 344 a. - Since the central width of the
first support substrate 344 a is larger than the side width of thefirst support substrate 344 a, thefirst groove 366 a can be formed in an arch with the central portion deeper than the side portions to correspond to the shape of thefirst support substrate 344 a. -
FIG. 7 a is an exploded perspective view of a point light source assembly and a lower container accommodating the assembly included in a liquid crystal display according to an exemplary embodiment of the present invention.FIG. 7 b is a cross-sectional view of a point light source assembly and a lower container taken along the line VIIb-VIIb′ inFIG. 7 a. - Referring to
FIGS. 7 a and 7 b, a first pointlight source assembly 445 a includes a plurality of pointlight source elements 143 and afirst support substrate 444 a having the pointlight source elements 143 thereon. Afirst groove 466 a to receive the first pointlight source assembly 445 a and asecond groove 166 b to receive the second pointlight source assembly 145 b are formed on the bottom of alower container 460 along twosides 162. - Because the first point
light source assembly 445 a is disposed close to the datachip film package 132, the region around the first pointlight source assembly 445 a is higher in temperature than the region around the second pointlight source assembly 145 b due to heat generated by a driving IC mounted in the datachip film package 132. - Heat generated from the point
light source elements 143 in the first pointlight source assembly 445 a is transmitted to theside 162 of thelower container 460 through thefirst support substrate 444 a and a first heatconductive pad 400 a interposed between thefirst support substrate 444 a and theside 162 of thelower container 460. Heat generated from the pointlight source elements 143 in the second pointlight source assembly 145 b is transmitted to theside 162 of thelower container 460 through thesecond support substrate 144 b and a second heatconductive pad 400 b interposed between thesecond support substrate 144 b andside 162 of thelower container 460. Respectively interposed between the first and second pointlight source assemblies side 162 of thelower container 460, the first and second heatconductive pads light source assemblies conductive pads light source assemblies lower container 460. - To decrease the temperature of the first point
light source assembly 445 a at a level approximate to the second pointlight source assembly 145 b, the area of the first heatconductive pad 400 a can be larger than the second heat conductive pad 440 b. For example, when the first and second heatconductive pads conductive pad 400 a can be larger than the width of the second heatconductive pad 400 b. For example, when the width of the first heatconductive pad 400 a is 1.2 times larger than the second heatconductive pad 400 b the first pointlight source assembly 445 a can decrease the temperature by about 2° C. to about 5° C. - Color uniformity of the
LCD 100 can be improved by forming the width of the first heat conductive pad 400 larger than the second heat conductive pad 440 b. - In an exemplary embodiment, the
first support substrate 444 a may have a larger area than thesecond support substrate 144 b to further decrease the temperature around the first pointlight source assembly 445 a. - In an exemplary embodiment of the present invention, uniformity in temperature is achieved throughout the
liquid crystal display 100 by forming the area of the first heatconductive pad 400 a larger than the second heatconductive pad 400 b. In an exemplary embodiment of the present invention, uniformity of temperature is achieved by using a material having a higher heat conductivity for the first heatconductive pad 400 a as compared with the second heatconductive pad 400 b. -
FIG. 8 is an exploded perspective view of the point light source assembly and a lower container accommodating the assembly according to an exemplary embodiment of the present invention. - Because the first point
light source assembly 445 a is disposed close to the datachip film package 132, the region around the first pointlight source assembly 445 a is higher in temperature than the region around the second pointlight source assembly 145 b due to heat generated by a driving IC mounted in the datachip film package 132. The central portion is higher in temperature than short-side portions in the first pointlight source assembly 445 a. - Heat generated from the point
light source elements 143 in the first pointlight source assembly 445 a is transmitted to theside 162 of thelower container 460 through thefirst support substrate 444 a and a first heatconductive pad 500 a interposed between thefirst support substrate 444 a and theside 162 of thelower container 460. Interposed between the first pointlight source assembly 445 a and theside 162 of thelower container 460, the first heatconductive pads 500 a dissipates heat generated from the first pointlight source assembly 445 a to the outside. The first heatconductive pad 500 a may be used to attach the first pointlight source assembly 445 a to the side of thelower container 460. - To decrease the central temperature at a level approximate to the side portions in the first point
light source assembly 445 a, the central area is formed larger than the side areas in the first heatconductive pad 500 a. In an exemplary embodiment, the first heatconductive pad 500 a has larger width at the central portion than the side portions. For example, the first heatconductive pad 500 a may have an H-shape. For example, as shown inFIG. 9 , a first heatconductive pad 500 a′ may have a T-shape. - For the central portion of the first point
light source assembly 445 a disposed at a relatively high-temperature region, color uniformity can be improved by increasing the central width than the sides in the first heatconductive pad 500 a with decrease in temperature. - In an exemplary embodiment, the color uniformity using the first heat
conductive pad 500 a can be achieved by making the central portion corresponding to the central portion of thefirst support substrate 444 a of a material having a higher heat conductivity as compared with the side portions corresponding to the side portions of thefirst support substrate 444 a. -
FIG. 10 a is a perspective view of a point light source assembly included in a liquid crystal display according to an exemplary embodiment of the invention.FIG. 10 b is a plan view of the point light source assembly according to an exemplary embodiment of the present invention.FIG. 11 is a diagram of a heat conductive pad in a point light source assembly according to an exemplary embodiment of the present invention. - Referring to
FIGS. 10 a and 10 b, a pointlight source assembly 1400 includes pointlight source components 1410, asupport substrate 1430, and aheat conductive pad 1450. Each pointlight source element 1410 includes a light emitting chip (not shown). The light emitting chip is a PN junction diode, in which when P- and N-type diodes are bonded and a voltage is applied to the diodes, and holes of the P-type semiconductor are concentrated on the intermediate layer of the N-type semiconductor. The electrons of the N-type semiconductor are concentrated on the intermediate layer that is the lowest part of a conduction band of the P-type semiconductor. The electrons drop on the holes of a valence band. When the electrons drop, energy corresponding to the difference in potential levels of the conduction band and valence band, i.e. an energy gap, is released into light. Alternatively, light emitting chip that emits light in a variety of ways may be used. The light emitting chip can emit light with a variety of wavelengths. To emit light with a variety of wavelengths, for example, it is possible to adjust content of indium that is used as an active layer in nitride-based light emitting diodes, to combine light emitting diodes that emit light having different wavelengths, or to combine a fluorescent body with a light emitting chip that emits light in a predetermined range of wavelength, such as, for example, ultraviolet rays. - In an exemplary embodiment, the point
light source elements 1410 are side view-typed light emitting diodes that emit light through the sides. - The
support substrate 1430 is formed with a circuit pattern to mount the pointlight source elements 1410. For example, thesupport substrate 1430 may be any one of various printed circuit boards, such as, for example, a Flexible PCB (FPCB), a common printed circuit board (e.g., a rigid PCB), or a metal PCB. - The
support substrate 1430 having the pointlight source elements 1410 is disposed on theheat conductive pad 1450. Theheat conductive pad 1450 is interposed between thesupport substrate 1430 and the bottom of a lower container (not shown) and dissipates heat generated from the pointlight source elements 1410 to the bottom of the lower container. Theheat conductive pad 1450 may comprise a material having a good heat conductivity, such as, for example, metallic materials. - The entire region of the
heat conductive pad 1450 is sectioned into several unit regions where groups of the point light source elements (G1 to G5) are disposed. That is, theheat conductive pad 1450 is sectioned into a unit region A for a first point light source element group G1, a unit region B for a second point light source element group G2, a unit region C for a third point light source element group G3, a unit region D for a fourth point light source element group G4, and a unit region E for a fifth point light source element group G5. Each point light source element group includes four point light source elements. That is, the first point light source element group G1 includes a first pointlight source element 14101 a to a fourth point light source element 14101 d and the other groups of point light source element have substantially the same configuration. In an exemplary embodiment of the present invention, four point light source elements are arranged in a line in each group of point light source element. - The
heat conductive pad 1450 includes the central portion I with dense point light source elements and edge portions II at both sides of the central portion I. The central portion includes the unit regions B, C and D while the left and right edge portions II includes the unit regions A and E, respectively. In theheat conductive pad 1450, the unit region pertaining to the edge portions II, i.e. the unit regions A or E is formed smaller in area than any one of the unit regions pertaining to the central portion I, i.e. the unit regions B, C and D. In an exemplary embodiment, the unit regions A and E of the edge portions II are formed into a trapezoid with the height Ly and the base LA and LE, respectively. In an exemplary embodiment, the unit region B in the central portion I can be formed into a square or a rectangular shape with the base LB and the height LY, where LA=LB=LE. - When the unit regions in the central portion I are larger in area than the unit regions in the edge portions II, the unit regions with dense point
light source elements 1410 is improved in dissipation efficiency, so that theheat conductive pad 1450 can be controlled to dissipate heat uniformly throughout the whole regions. - The
heat conductive pad 1450 shown inFIG. 11 is sectioned into a unit region A to a unit region E and formed into a substantially half octagon. - The upper side of the
heat conductive pad 1450, i.e. the shorter side is about 100 mm in length (L2). The base opposite to the upper side, i.e. the longer side is about 265 mm in length (L1). The first height H1 is about 15 mm, and the second height H2 is about 30 mm. The dimension of theheat conductive pad 1450 is a heat conductive pad according to an exemplary embodiment of the present invention and may be variously changed. For example, a ratio among each side can be when the shorter side of theheat conductive pad 1450 is 1 in length, the longer side may be 2.6 to 2.8, the first height can be 0.1 to 0.2, and the second height can be 0.29 to 0.31. -
FIG. 12 a is an exploded perspective view of a backlight unit having a point light source assembly according to an exemplary embodiment of the present invention.FIG. 12 b is an exploded perspective view of a backlight unit according to an exemplary embodiment of the present invention. - Referring to
FIGS. 12 a and 12 a, a backlight unit includes thelight guide plate 142, a pointlight source assembly 1400 that provides light to thelight guide plate 142,optical sheets 141 disposed on the upper surface of thelight guide plate 142, and areflective sheet 146 disposed under thelight guide plate 142. - The point
light source assembly 1400 includes pointlight source elements 1410 mounted on thesupport substrate 1430 and aheat conductive pad 1450 in which the unit regions pertaining to the central portion are smaller in area than those pertaining to the edge portions. The pointlight source assembly 1400 is disposed at a side (see e.g.,FIG. 12 a) or both sides (see e.g.,FIG. 12 b) of thelight guide plate 142 and used to provide light to thelight guide plate 142. Thelight guide plate 142 converts light with optical distribution of a point light source type that is generated from the pointlight source assembly 1400 into light with optical distribution of a surface light source type. -
FIG. 13 shows a table for comparing heat dissipation of a point light source assembly of a relate art and a point light source assembly of an exemplary embodiment of the present invention. InFIG. 13 , a point light source assembly that has a heat conductive pad in which the unit regions in the central portion is the same as the unit regions in the edge portion in area is selected for the related art, and a point light source assembly in which the unit regions in the central portion are larger in area than the unit regions in the edge portions as described above is selected for an exemplary embodiment of the present invention. - According to the related art, the point light source elements at the left edge were 44.4° C. in temperature, the point light source elements at the right edge were 42.2° C., and the point light source elements at the central portion were 47.4° C. Accordingly, it can be seen from the table that the point light source elements at the central portion is about 3 to about 4° C. higher than the edge portions. The differences in temperature are related to the differences in luminance of the point light source elements.
- According to an exemplary embodiment of the present invention, the point light source elements at the left edge portion were 45.1° C. in temperature, the point light source elements at the right edge were 45.9° C., and the point light source elements at the central portion were 45.4° C. Accordingly, it can be seen from the table that differences in temperature are not substantial in the point light source elements in an exemplary embodiment of the present invention. As a result, luminance of the whole point light source elements on the heat conductive pad is almost uniformly distributed.
-
FIG. 14 a is a perspective view of a point light source assembly included in a liquid crystal display according to an exemplary embodiment of the invention, andFIG. 14 b is a plan view of a point light source assembly according to an exemplary embodiment of the present invention. - The point
light source assembly 1400 includes pointlight source elements 1410, asupport substrate 1430, and aheat conductive pad 1460. - The entire region of the
heat conductive pad 1460 is sectioned into several unit regions where groups of point light source element (G1 to G5) are disposed. That is, theheat conductive pad 1460 is sectioned into a unit region F for a first point light source element group G1, a unit region G for a second point light source element group G2, a unit region H for a third point light source element group G3, a unit region I for a fourth point light source element group G4, and a unit region J for a fifth point light source element group G5. Each point light source element group includes four point light source elements. That is, the first point light source element group G1 includes a first pointlight source element 14101 a to a fourth point light source element 14101 d, and the other groups of point light source element have substantially the same configuration. In an exemplary embodiment of the present invention, four point light source elements are arranged in a line in each group of point light source element. - The
heat conductive pad 1460 is divided into the central portion I with dense point light source elements and edge portions II at both sides of the central portion I. The central portion includes the unit regions G, H and I while the left and right edge portions II include the unit regions F and J, respectively. In theheat conductive pad 1460, the unit region pertaining to the edge portions II, i.e. the unit regions F or J is formed smaller in area than any one of the unit regions pertaining to the central portion I, i.e. the unit regions G and I. In an exemplary embodiment of the present invention, the unit regions F and J of the edge portions II are formed into a square or a rectangular shape with the height Ly2 and the base LF and LJ. The unit region G in the central portion I can be formed into a trapezoid with the base LG and the height LY1, where LF=LJ=LG and Ly2<LY1. However, the shapes of the unit regions are not limited to the above and may be variously modified. - According to an exemplary embodiment of the present invention, by increasing a heat dissipating rate for point light source assemblies at relatively high-temperature regions, color uniformity can be improved throughout a display.
- Although the illustrative embodiments of the present invention have been described herein with reference to the accompanying drawings, it is to be understood that the present invention should not be limited to those precise embodiments and that various other changes and modifications may be affected herein by one of ordinary skill in the related art without departing from the scope or spirit of the invention. All such changes and modifications are intended to be included with the scope of the invention as defined by the appended claims.
Claims (11)
1. A liquid crystal display comprising:
a light guide plate guiding incident light;
a first point light source assembly including first point light source elements providing the light to the light guide plate and a first support substrate having the first point light source elements, the first point light source assembly being disposed at a first side of the light guide plate;
a second point light source assembly including second point light source elements providing the light to the light guide plate and a second support substrate having the second point light source elements, the second point light source assembly being disposed at a second side of the light guide plate;
a liquid crystal panel assembly disposed on the light guide plate and displaying image information;
a lower container accommodating the light guide plate, first and second point light source assemblies, and liquid crystal panel assembly; and
first and second heat conductive pads interposed between the lower container and the first and second point light source assemblies, respectively,
wherein the first heat conductive pad is larger in area than the second heat conductive pad.
2. The liquid crystal display of claim 1 , wherein the first heat conductive pad is larger in width than the second heat conductive pad.
3. The liquid crystal display of claim 1 , wherein the first heat conductive pad is larger in width at a central portion than at edge portions.
4. The liquid crystal display of claim 1 , wherein the central portion comprises a material having a heat conductivity higher than a heat conductivity of the edge portions in the first heat conductive pad.
5. The liquid crystal display of claim 1 , wherein the lower container comprises a bottom, sides formed at edges of the bottom, and first and second grooves formed on the bottom along the sides to receive the first and second point light source assemblies, respectively.
6. The liquid crystal display of claim 1 , wherein:
the liquid crystal panel assembly comprises a liquid crystal panel and a chip film package connected to a side of the liquid crystal panel and providing driving signals to the liquid crystal panel; and
the first point light source assembly is disposed adjacent to the chip film package.
7. The liquid crystal display of claim 6 , wherein the chip film package is connected with data lines of the liquid crystal panel and provides data driving signals to the liquid crystal panel.
8. A liquid crystal display comprising:
a light guide plate guiding incident light;
a point light source assembly including point light source elements providing the light to the light guide plate and a support substrate having groups of point light source elements comprising at least one of the point light source elements;
a lower container accommodating the light guide plate and point light source assembly; and
a heat conductive pad interposed between the point light source assembly and the lower container,
wherein the heat conductive pad includes unit regions having the groups of point light source elements, and the unit regions include a first unit region and a second unit region, wherein the first unit region and the second unit region are different in size.
9. The liquid crystal display of claim 8 , wherein:
the heat conductive pad includes a central portion including the first unit region and edge portions disposed at sides of the central portion including second unit region; and
the first unit region is larger in area than the second unit region.
10. The liquid crystal display of claim 9 , wherein:
the first unit region is formed to have a square or a rectangle shape; and
the second unit region is formed to have a trapezoid shape
11. The liquid crystal display of claim 9 , wherein the first and second unit regions are formed to have a square or a rectangle shape.
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US11/944,012 US8031292B2 (en) | 2006-11-21 | 2007-11-21 | Liquid crystal display comprising first and second point light source assemblies wherein a first support substrate is larger than the second support substrate, and a first groove of a lower container is deeper than a second groove |
US13/232,113 US20120081633A1 (en) | 2006-11-21 | 2011-09-14 | Liquid Crystal Display |
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US13/232,113 Abandoned US20120081633A1 (en) | 2006-11-21 | 2011-09-14 | Liquid Crystal Display |
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TWM324216U (en) * | 2007-05-23 | 2007-12-21 | Everlight Electronics Co Ltd | LED back light module |
-
2007
- 2007-11-21 US US11/944,012 patent/US8031292B2/en not_active Expired - Fee Related
-
2011
- 2011-09-14 US US13/232,113 patent/US20120081633A1/en not_active Abandoned
-
2012
- 2012-12-07 US US13/708,552 patent/US8576353B2/en not_active Expired - Fee Related
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US20020089840A1 (en) * | 2000-10-25 | 2002-07-11 | Hisanori Kawakami | Illumination device and liquid crystal apparatus using the same |
US20030048628A1 (en) * | 2001-09-05 | 2003-03-13 | Keun-Woo Lee | Illumination device and reflection type liquid crystal display device using the same |
US20060114694A1 (en) * | 2004-11-29 | 2006-06-01 | Samsung Electronics Co., Ltd. | Backlight assembly and display apparatus having the same |
US20060187660A1 (en) * | 2005-02-18 | 2006-08-24 | Au Optronics Corporation | Backlight module having device for fastening lighting units |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110043724A1 (en) * | 2009-08-21 | 2011-02-24 | Tae Ho Kim | Backlight unit and display device using the same |
US10935226B2 (en) | 2017-06-13 | 2021-03-02 | Sharp Kabushiki Kaisha | Lighting device and display apparatus |
Also Published As
Publication number | Publication date |
---|---|
US8031292B2 (en) | 2011-10-04 |
US20080117361A1 (en) | 2008-05-22 |
US20130093970A1 (en) | 2013-04-18 |
US8576353B2 (en) | 2013-11-05 |
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Legal Events
Date | Code | Title | Description |
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AS | Assignment |
Owner name: SAMSUNG DISPLAY CO., LTD., KOREA, REPUBLIC OF Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SAMSUNG ELECTRONICS CO., LTD.;REEL/FRAME:029045/0860 Effective date: 20120904 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |