US20110303197A1 - Microcondenser device - Google Patents
Microcondenser device Download PDFInfo
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- US20110303197A1 US20110303197A1 US12/797,257 US79725710A US2011303197A1 US 20110303197 A1 US20110303197 A1 US 20110303197A1 US 79725710 A US79725710 A US 79725710A US 2011303197 A1 US2011303197 A1 US 2011303197A1
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- heat sink
- porous heat
- sink element
- housing
- microcondenser device
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02M—SUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
- F02M33/00—Other apparatus for treating combustion-air, fuel or fuel-air mixture
- F02M33/02—Other apparatus for treating combustion-air, fuel or fuel-air mixture for collecting and returning condensed fuel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/002—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by condensation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- B60K15/00—Arrangement in connection with fuel supply of combustion engines or other fuel consuming energy converters, e.g. fuel cells; Mounting or construction of fuel tanks
- B60K15/03—Fuel tanks
- B60K15/035—Fuel tanks characterised by venting means
- B60K15/03504—Fuel tanks characterised by venting means adapted to avoid loss of fuel or fuel vapour, e.g. with vapour recovery systems
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02M—SUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
- F02M25/00—Engine-pertinent apparatus for adding non-fuel substances or small quantities of secondary fuel to combustion-air, main fuel or fuel-air mixture
- F02M25/08—Engine-pertinent apparatus for adding non-fuel substances or small quantities of secondary fuel to combustion-air, main fuel or fuel-air mixture adding fuel vapours drawn from engine fuel reservoir
- F02M25/0854—Details of the absorption canister
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02M—SUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
- F02M31/00—Apparatus for thermally treating combustion-air, fuel, or fuel-air mixture
- F02M31/20—Apparatus for thermally treating combustion-air, fuel, or fuel-air mixture for cooling
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02M—SUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
- F02M33/00—Other apparatus for treating combustion-air, fuel or fuel-air mixture
- F02M33/02—Other apparatus for treating combustion-air, fuel or fuel-air mixture for collecting and returning condensed fuel
- F02M33/08—Other apparatus for treating combustion-air, fuel or fuel-air mixture for collecting and returning condensed fuel returning to the fuel tank
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2259/00—Type of treatment
- B01D2259/45—Gas separation or purification devices adapted for specific applications
- B01D2259/4516—Gas separation or purification devices adapted for specific applications for fuel vapour recovery systems
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/02—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography
- B01D53/04—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents
- B01D53/0407—Constructional details of adsorbing systems
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- B60K15/00—Arrangement in connection with fuel supply of combustion engines or other fuel consuming energy converters, e.g. fuel cells; Mounting or construction of fuel tanks
- B60K15/03—Fuel tanks
- B60K15/035—Fuel tanks characterised by venting means
- B60K15/03504—Fuel tanks characterised by venting means adapted to avoid loss of fuel or fuel vapour, e.g. with vapour recovery systems
- B60K2015/03514—Fuel tanks characterised by venting means adapted to avoid loss of fuel or fuel vapour, e.g. with vapour recovery systems with vapor recovery means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02M—SUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
- F02M25/00—Engine-pertinent apparatus for adding non-fuel substances or small quantities of secondary fuel to combustion-air, main fuel or fuel-air mixture
- F02M25/08—Engine-pertinent apparatus for adding non-fuel substances or small quantities of secondary fuel to combustion-air, main fuel or fuel-air mixture adding fuel vapours drawn from engine fuel reservoir
- F02M2025/0863—Engine-pertinent apparatus for adding non-fuel substances or small quantities of secondary fuel to combustion-air, main fuel or fuel-air mixture adding fuel vapours drawn from engine fuel reservoir with means dealing with condensed fuel or water, e.g. having a liquid trap
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/10—Internal combustion engine [ICE] based vehicles
- Y02T10/12—Improving ICE efficiencies
Abstract
A microcondenser device for an evaporative emission control system associated with an internal combustion engine includes a housing having a lower wall and at least one side wall extending upward from the lower wall. The lower wall and the at least one side wall together defining a chamber in the housing. A thermoelectric element is supported by the at least one side wall in spaced relation relative to the lower wall. An inlet is defined in the housing for admitting fuel vapor into the chamber. A condensation outlet is defined in the housing for discharging liquid fuel that is condensed from the fuel vapor in the chamber. A porous heat sink element is received in the chamber for absorbing the fuel vapor admitted through the inlet. The porous heat sink element is in conductive thermal contact with the thermoelectric element.
Description
- The present disclosure generally relates to evaporative emission control systems for internal combustion engines, and more particularly relates to a microcondenser device for an evaporative emission control system associated with an internal combustion engine.
- Conventional vehicle fuel systems associated with internal combustion engines typically employ a fuel canister for receiving fuel vapor from a vehicle's fuel tank. The fuel canister is adapted to temporarily retain the received vapor therein to prevent it from being released to the atmosphere. More particularly, fuel vapor can enter the fuel canister from the fuel tank wherein the fuel vapor is absorbed and retained in a carbon bed of the fuel canister. Typically, the retention of the displaced fuel vapor within the fuel canister is only temporary as the fuel vapor retained in the fuel canister is periodically purged to allow the canister to accommodate and absorb additional fuel vapor from the fuel tank. During such purging, the fuel vapor captured by the canister can be sent to the vehicle's engine, and particularly to an induction system of the engine, for combustion.
- Various other systems have been proposed to more strictly control containment of fuel vapors and/or improve vehicle efficiency by controlling fuel vapor processing. For example, some systems include a bladder disposed in the vehicle's fuel tank that expands and contracts to control fuel vapor. A pump can be used in association with the bladder for applying pressure to the walls of the bladder. The pressure is applied for purposes of forcing the bladder walls against the fuel contained therein to prevent or limit vapor formation. A fuel canister, as described in the preceding paragraph, can optionally be used in the bladder fuel system for capturing fuel vapor that forms despite the use of the bladder.
- Also known is a canisterless evaporative emission control system for an internal combustion engine. One particular known system includes a fuel tank wherein vaporized fuel is generated and a microcondenser device for processing the vaporized fuel received from the fuel tank. The microcondenser device has a heat sink portion formed of carbon foam in thermal communication with a thermoelectric element for removing heat from the heat sink portion. The fuel vapor is processed by passing the fuel vapor through the heat sink portion to remove heat therefrom and condense at least a portion of the fuel vapor to liquid fuel. Drawbacks of this known canisterless control system include significant power consumption requirements for the thermoelectric element and a significant volume of uncondensed fuel vapor passing through the microcondenser device.
- According to one aspect, a microcondenser device is provided for an evaporative emission control system associated with an internal combustion engine. The device includes a housing having a lower wall and at least one side wall extending upward from the lower wall. The lower wall and the at least one side wall together define a chamber in the housing. A thermoelectric element is supported by the at least one side wall in spaced relation relative to the lower wall. An inlet is defined in the housing for admitting fuel vapor into the chamber. A condensation outlet is defined in the housing for discharging liquid fuel that is condensed from the fuel vapor in the chamber. A porous heat sink element is received in the chamber for absorbing the fuel vapor admitted through the inlet. The porous heat sink element is in conductive thermal contact with the thermoelectric element.
- According to another aspect, a microcondenser device for an evaporative emission control system includes a housing having an inlet for receiving fuel vapor and a condensation outlet for discharging condensed fuel vapor. A porous heat sink element is disposed in the housing and fluidly interposed between the inlet and the condensation outlet for absorbing the fuel vapor received through the inlet. A thermoelectric element is in thermal contact with the thermal heat sink element for removing heat from the fuel vapor absorbed by the porous heat sink element to condense the fuel vapor. At least one support baffle supports the porous heat sink element within the housing.
- According to a further aspect, a microcondenser device for an evaporative emission control system includes a housing having an inlet for receiving fuel vapor and a condensation outlet for discharging condensed fuel vapor. A porous heat sink element is disposed in the housing and is fluidly interposed between the inlet and the condensation outlet for absorbing the fuel vapor received through the inlet. A thermoelectric element is in thermal contact with the porous heat sink element for removing heat from the fuel vapor absorbed by the porous heat sink element to condense the fuel vapor. A heat removal assembly is in conductive thermal contact with a hot side of the microcondenser element for removing heat therefrom. The heat removal assembly comprises at least one of: a heat pipe or a liquid cooling circuit.
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FIG. 1 is a schematic view of an evaporative emission control system having a microcondenser device for processing fuel vapor. -
FIG. 2 is a perspective view, partially in cross-section, of the microcondenser device. -
FIG. 3 is an elevational cross-section view of the microcondenser device. -
FIG. 4 is plan cross-section view of the microcondenser device. -
FIG. 5 is an elevational cross-section view of a microcondenser device according to an alternate embodiment. -
FIG. 6 is a plan cross-section view of the microcondenser device ofFIG. 5 . -
FIG. 7 is an elevational cross-section view of a microcondenser device according to another alternate embodiment. -
FIG. 8 is a plan cross-section view of the microcondenser device ofFIG. 7 . -
FIG. 9 is an elevational cross-section view of a microcondenser device according to yet another alternate embodiment. -
FIG. 10 is a plan cross-section view of the microcondenser device ofFIG. 9 . -
FIG. 11 is a schematic elevational view of a microcondenser device having a heat pipe (shown in cross-section) for removing heat therefrom. -
FIG. 12 is a schematic elevational view of a microcondenser device having a cooling fluid circuit for removing heat therefrom. - Referring now to the drawings wherein the showings are for purposes of illustrating one or more exemplary embodiments and not for purposes of limiting same,
FIG. 1 schematically shows an evaporativeemission control system 10 for aninternal combustion engine 12. As shown, theengine 12 is provided with an induction system including anintake pipe 14 in which athrottle valve 16 is operatively mounted. A throttle valve opening (THA)sensor 18 is connected to thethrottle valve 16. The throttlevalve opening sensor 18 outputs a signal corresponding to the opening angle (THA) of thethrottle valve 16 and supplies the signal to an electronic control unit (ECU) 20.Fuel injection valve 22, only one of which is shown, are inserted into theintake pipe 14 at locations intermediate between the cylinder block of theengine 12 and thethrottle valve 16 and slightly upstream of the respective intake valves (not shown). Thefuel injection valves 22 can be connected through afuel supply pipe 24 to afuel tank 26 and afuel pump unit 28 is provided therealong for delivering fuel from thetank 26 to thefuel injection valves 22. Eachfuel injection valve 22 can be electrically connected to theECU 20, and its valve opening can be controlled by a signal from theECU 20. - One or more sensors can be provided on the
intake pipe 14 for monitoring conditions at the intake pipe. For example, theintake pipe 14 can be provided with an intake pipe absolute pressure (PBA)sensor 34 for detecting an absolute pressure (PBA) in theintake pipe 14 and an intake air temperature (TA)sensor 36 for detecting an air temperature (TA) in theintake pipe 14 at positions downstream of thethrottle valve 16. These sensors, includingsensors ECU 20. In addition, thefuel tank 26 can be provided with one or more sensors for monitoring specific conditions associated therewith, including, for example, a tank pressure (PTANK)sensor 38 for detecting a pressure (PTANK) in the fuel tank, a fuel temperature (TGAS)sensor 40 for detecting a fuel temperature (TGAS) in thefuel tank 26, and afuel level sensor 42 for detecting a fuel level (i.e., a remaining fuel amount) in thefuel tank 26. Like the other sensors described herein, the fuel tank sensors, includingsensors fuel tank 26 and provide the signal to theECU 20. - Additional sensors can be provided on or in association with the
engine 12. More particularly, an engine rotational (NE)sensor 44 for detecting an engine rotational speed (NE) can be disposed near the outer periphery of a camshaft or crankshaft (both not shown) of theengine 12. There can also be provided an enginecoolant temperature sensor 46 for detecting a coolant temperature (TW) of theengine 12 and an oxygen concentration sensor (also referred to as a “LAF sensor”) 48 for detecting an oxygen concentration in exhaust gases from theengine 12. Detection signals from thesesensors ECU 20. TheLAF sensor 48 can function as a wide-area air-fuel ratio sensor adapted to output a signal substantially proportional to an oxygen concentration and exhaust gases (i.e., proportional to an air-fuel ratio of air-fuel mixture supplied to the engine 12). - The evaporative
emission control system 10 further includes amicrocondenser device 50. With additional reference toFIG. 2 , themicrocondenser device 50 includes ahousing 52 having aninlet 54 for receiving fuel vapor and acondensation outlet 56 for discharging condensed fuel vapor. In the illustrated embodiment, theinlet 54 is connected to thefuel tank 26 throughvapor line 58 so that fuel vapors formed in thefuel tank 26 can be delivered to themicrocondenser device 50. Thecondensation outlet 56 is also connected to thefuel tank 26. In particular, thecondensation outlet 56 is connected to thefuel tank 26 throughcondensation discharge line 60 for directing condensed vapor (i.e., liquid fuel) from the microcondenser device back to thefuel tank 26. Thehousing 52 can also have avapor outlet 62 for discharging fuel vapor that remains vaporized after passing through themicrocondenser device 50. In the illustrated embodiment, thevapor outlet 62 is fluidly connected to theintake pipe 14 upstream of thefuel injectors 22 viavapor line 64. This allows fuel vapor discharged by themicrocondenser device 50 to be recirculated through theinternal combustion engine 12 for combustion therein. - As will be described in more detail below, the
microcondenser device 50 can also include athermoelectric element 66 for condensing fuel vapors admitted through theinlet 54. Thethermoelectric element 66 can be a Peltier microelement that employs or uses the Peltier effect to condense evaporative or vaporized fuel received from thefuel tank 26 via thevapor line 58. Advantageously, providing thethermoelectric element 66 as a Peltier microelement can be effective for condensing vaporized fuel from thefuel tank 26 while being of a small size and requiring minimum power consumption thereby not taxing the spatial layout of the vehicle or its electrical system. Operation of themicrocondenser device 50 can occur as described in U.S. Pat. No. 7,527,045, which is expressly incorporated in its entirety herein. - With additional reference to
FIGS. 3 and 4 , thehousing 52 has a bottom orlower wall 70 and at least oneside wall lower wall 70. Thelower wall 70 and the at least one side wall 72-78 together define achamber 80 in thehousing 52. In the embodiment illustrated inFIGS. 2-4 , thehousing 52 has a cuboid or box-shaped configuration such that the at least one side wall includes fourrectangular side walls lower wall 70. As shown, theinlet 54 is defined in thehousing 52, and particularly theside wall 76 thereof, for admitting fuel vapor into thechamber 80. Thecondensation outlet 56 is defined in thehousing 52, and particularly in theside wall 72 thereof, for discharging liquid fuel that is condensed from the fuel vapor in thechamber 80. Thevapor outlet 62 is defined in thehousing 52, and particularly in theside wall 78 thereof, for discharging uncondensed fuel vapor from thechamber 80. - The
thermoelectric element 66 is supported by the at least one side wall (i.e., side walls 72-78 in the embodiment illustrated inFIGS. 2-4 ) in spaced relation relative to thelower wall 70. By this arrangement, thethermoelectric element 66 is spaced apart vertically from thebottom wall 70. For supporting thethermoelectric element 66 in spaced relation relative to thelower wall 70, the at least one side wall (i.e., side walls 72-78) can include arecess 82 defined by ashoulder 84 and face 86 extending upward from theshoulder 84. In particular, each of the side walls 72-78 of the illustrated embodiment can includeshoulder 84 and face 86 defining therecess 82. As shown, thethermoelectric element 66 can be supported on theshoulder 84 and sized such that at least one peripheral edge of thethermoelectric element 66 is positioned closely adjacent theface 86. In the illustrated embodiment, thethermoelectric element 66 can have a rectangular configuration including fourperipheral edges 66 a and eachperipheral edge 66 a can be positioned closelyadjacent face 86 of a corresponding one of the side walls 72-78. By this arrangement, thethermoelectric element 66 is nestably received within therecess 82 defined in thehousing 52. - A porous
heat sink element 100 can be disposed in thehousing 52, and particularly received in thechamber 80 of thehousing 52. The porous heat sink element is fluidly interposed between theinlet 54 and thecondensation outlet 56 for absorbing the fuel vapor received or admitted through theinlet 54. Thethermoelectric element 66 can be in thermal contact with the porousheat sink element 100 for removing heat from the fuel vapor absorbed by the porousheat sink element 100 to condense the fuel vapor. In particular, the porousheat sink element 100 can be in conductive thermal contact with thethermoelectric element 66. In addition to be interposed between theinlet 54 and thecondensation outlet 56, the porousheat sink element 100 is also fluidly interposed between theinlet 54 and thevapor outlet 62, which discharges fuel vapor that remains vaporized after passing through theporous heat sink 100. - In one embodiment, the porous
heat sink element 100 is a carbon foam heat sink element. Being formed of carbon foam provides advantages such as higher thermal conductivity and greater surface area per unit volume than conventional heat sinks and/or heat sinks formed of aluminum fins. Moreover, the carbon foamheat sink element 100 has greater heat transfer efficiency than conventional arrangements which results in the overall electric load needed to power themicrocondenser device 50 being considerably lower than would be necessary if the heat sink were formed with conventional fins. - In the illustrated embodiment, a
copper plate 102 is interposed between the porousheat sink element 100 and thethermoelectric element 66. Accordingly, conductive heat transfer occurs from the porousheat sink element 100, then to thecopper plate 102, and next to thethermoelectric element 66. Using thecopper plate 102 allows for improved heat transfer from the porousheat sink element 100 to thethermoelectric element 66. In particular, thecopper plate 102 can have an improved flatness, particularly on aside 104 that interfaces with the porous heat sink element 100 (i.e., improved flatness compared to other efficient heat transfer materials). In addition, athermal paste 106 can be interposed between at least one of thecopper plate 102 and thethermoelectric element 66 or thecopper plate 102 and the porousheat sink element 100. In the illustrated embodiment, as shown,thermal paste 106 is interposed between both thecopper plates 102 and thethermoelectric element 66 and thecopper plate 102 and the porousheat sink element 100. Thethermal paste 106 facilitates better heat transfer between conductive elements of themicrocondenser device 50. - As shown in the illustrated embodiment, the
copper plate 102 is supported by theshoulder 84 and thethermoelectric element 66 is supported on top of thecopper plate 102. Together, thethermoelectric element 66 and thecopper plate 102 are nestably received within therecess 82 defined in thehousing 52. Particularly, in the illustrated embodiment, theseelements housing 52 and close thechamber 80 defined by thehousing 52. Aseal 108 can be interposed between theunderside 104 of thecopper plate 102 and theshoulder 84 defined in each of the side walls 72-78. The nesting relation of thecopper plate 102 and thethermoelectric element 66 within therecess 82 and/or the provision of theseal 108 is believed to advantageously reduce or eliminate frost or fog formation on themicrocondenser device 50, and particularly thehousing 52 thereof, which improves efficiency of the device 50 (i.e., less power is needed to operate the device). [Question for inventors: what material is theseal 108 formed of?] - Also to improve efficiency of the
microcondenser device 50, thehousing 52 can be formed of a plastic material. This provides thehousing 52 with a low heat mass body and a low thermal conductivity body material. The particular plastic material employed for thehousing 52 can have sufficient rigidity while otherwise reducing the amount of energy needed for thethermoelectric element 66 to cool vaporized fuel passing through the porousheat sink element 100. Using plastic also provides an additional minimal weight benefit through the use of a lighter material. - Specifically, for example, the body material of the
housing 52 can be polyamide, polyacetal, PEI, PPS, or any other fuel-resistant plastic material providing for low heat loss and/or low thermal mass. In addition, to further limit thermal loss to the environment, an insulation or an insulating layer can be disposed one of: around an exterior of thehousing 52 or inside the housing around the porousheat sink element 100. In the illustrated embodiment, afoam insulating layer 110 is shown provided around an exterior of thehousing 52. Alternatively, other insulating materials can be applied to the exterior of thehousing 52. For example, aerogels or other foams can be applied to an exterior of the housing for insulating the housing from thermal losses to the surrounding environment. - The
microcondenser device 50 can additionally include at least one support baffle supporting the porousheat sink element 100 within thehousing 52. As will be described in more detail below, the at least one support baffle supports the porousheat sink element 100 in an elevated position (i.e., in spaced apart relation) from thelower wall 70 and in conductive thermal contact with thethermoelectric element 66. As will also be described in more detail below, the at least one support baffle can urge the porousheat sink element 100 toward thethermoelectric element 66 and/or into thermal contact with thethermoelectric element 66. The at least one support baffle can be one or more baffles shaped or configured to provide various sub-chambers within thechamber 80 of thehousing 52. The baffles can be formed of a foam insulation material, such as a Teflon foam insulation, for example, which provides the baffles with some resiliency and enable the stacked baffles to urge the porousheat sink element 100 toward thecopper plate 102, which assists in efficient heat transfer therebetween. - In the illustrated embodiment, the at least one support baffle includes a plurality of stacked baffles, which facilitates the baffles urging or supplying support pressure against the porous
heat sink element 100. Whether stacked, shaped or otherwise configured, the one or more support baffles can be arranged to efficiently direct fuel vapor into the porousheat sink element 100 and/or to facilitate efficient liquid drainage (i.e., condensed fuel vapor). In the illustrated embodiment, the plurality of baffles includes abase baffle 112 having a cut out or recess 114 accommodating thecondensation outlet 56. Intermediate baffles 116, 118, 120, 122 are stacked on thebase baffle 112. In particular,intermediate baffles intermediate baffles stacked baffles inlet 54 and the second pair ofbaffles vapor outlet 62, and wherein the pairs ofstacked baffles condensation outlet 56. - The baffles can be arranged so as to direct gas and/or liquid flow within the
microcondenser device 50 and support the porousheat sink element 100. For example,upper baffles heat sink element 100. In particular, the illustrated embodiment, theupper baffle 124 is stacked on the first pair ofintermediate baffles vapor inlet 54 and theupper baffle 126 is stacked on the second pair ofintermediate baffles vapor outlet 62. Like the intermediate baffles 116-122, theupper baffles condensation outlet 56. - In the illustrated embodiment of
FIGS. 2-4 , the baffles are arranged so as to define aplenum chamber 128 adjacent thevapor inlet 54 and extending from theside wall 72 to theside wall 74. Theplenum chamber 128 can allow the fuel vapor admitted through thevapor inlet 54 to expand along a dimension of the porousheat sink element 100 extending from theside wall 72 to theside wall 74 and thus more effectively absorb the fuel vapor. In particular, theplenum chamber 128 of the illustrated embodiment is formed by theside walls baffles heat sink element 100. Theplenum chamber 128 extends along substantially an entire width of the porous heat sink element 100 (e.g., the width extending between theside walls 72, 74). Theplenum chamber 128 can function to ensure that fuel vapor entering through theinlet 54 is allowed to spread out before being absorbed into the porousheat sink element 100. - The baffles also define a
condensation chamber 130 vertically between thecondensation outlet 56 and the porousheat sink element 100. As shown, thecondensation chamber 130 is disposed below the porousheat sink element 100. This allows gravity to assist in removing condensed fuel from the porousheat sink element 100 and directing the same to thecondensation outlet 56. Theupper baffle 124 is smaller in the illustrated embodiment that theupper baffle 126, which defines an expandedarea 132 of thecondensation chamber 130. The expandedarea 132 facilitates gravitational removal of condensed fuel from the porousheat sink element 100 on a side of thecondensation chamber 130 adjacent thevapor inlet 54. [is this correct?] - With reference to
FIGS. 5 and 6 , amicrocondenser device 150 is illustrated. Themicrocondenser device 150 can be the same as themicrocondenser device 50 except as indicated below. InFIGS. 5 and 6 , the base and intermediate stacked baffles of themicrocondenser device 50 are replaced with a single shapedbaffle 152 that includes abase portion 154 similar in configuration to thebase baffle 112 andintermediate baffle portions microcondenser device 150 includesupper baffles intermediate baffle portions microcondenser device 50, themicrocondenser 150 has itsupper baffles plenum chamber 164 andcondensation chamber 166. In particular, theupper baffle 160 has arear side 168 aligned with arear side 170 of theintermediate baffle portion 156. Accordingly, no expandedarea 132 is defined above theintermediate baffle portion 156; however, theplenum chamber 164 has an increased depth (i.e., a dimension from thevapor inlet 54 and/orside wall 76 to the upper baffle 160). Instead of the expandedarea 132, an expandedarea 172 is disposed above theintermediate baffle portion 158. The expandedarea 172 results from therear edge 174 of theupper baffle 162 being laterally spaced apart from therear side 176 of theintermediate baffle portion 158. - With reference to
FIGS. 7 and 8 , anothermicrocondenser device 250 is illustrated. Themicrocondenser device 250 can be the same as themicrocondenser device 150 except as indicated below. In the embodiment illustrated inFIGS. 7 and 8 , theupper baffle 162 is replaced with upper baffle 126 (i.e. the same baffle used in the microcondenser device 50). Accordingly, in this embodiment, there is no expanded area of thecondensation chamber 130 above theintermediate baffle portion 156 or above theintermediate baffle portion 158, only theenlarged plenum chamber 164. - With reference to
FIGS. 9 and 10 , still anothermicrocondenser device 350 is illustrated, which can be the same as themicrocondenser device 150 except as indicated below. In themicrocondenser device 350, upper baffle 124 (same as used in the microcondenser 50) is disposed above theintermediate baffle portion 156 and theupper baffle portion 162 is disposed above theintermediate baffle portion 158. Accordingly, by this arrangement, expandedarea 132 is disposed above theintermediate baffle portion 156 and expandedarea 172 is disposed above theintermediate baffle portion 158. Asmall plenum chamber 128 is also disposed above theintermediate baffle portion 156 adjacent theinlet 54. - Returning reference to
FIGS. 2-4 , the porousheat sink element 100 can have a varying porosity. One exemplary varying porosity for the porousheat sink element 100 is schematically illustrated by the stippling in the figures. As shown, the porousheat sink element 100 can have an increased porosity at a first side orportion 100 a, which is adjacent theplenum chamber 128 and theinlet 54, than adjacent a second side orportion 100 b. The porousheat sink element 100 can also have an increased porosity adjacent an underside or underside portion 100 c than an upper side or upper side portion 100 d that is adjacent thethermoelectric element 66. While the illustrated embodiment includes progressively decreasing porosity from thefirst side portion 100 a to thesecond side portion 100 b and from the underside portion 100 c to the upper side portion 100 d, it is to be appreciated that such varying porosity could occur only from one side to another (e.g., fromside portion 100 a toside portion 100 b or from side portion 100 c to side portion 100 d). Alternatively, other arrangements or patterns of varying porosity could be used with theheat sink element 100. - As best shown in
FIG. 3 , the arrangement of thevapor inlet 54 and theoutlets microcondenser device 50. As used herein, relative positioning can refer to positioning of a central axis or central area of each of theinlet 54 andoutlets vapor outlet 62 can be relatively positioned vertically above thevapor inlet 54 and above thecondensation outlet 56. Thecondensation outlet 56 can be relatively positioned below thevapor inlet 54 and below thevapor outlet 62. Thevapor inlet 54 can be disposed vertically between thevapor outlet 62 and thecondensation outlet 56. In addition to relative positioning, relative sizing can facilitate efficient fuel flow through themicrocondenser device 50. For example, as shown, thevapor inlet 54 can have an increased size relative to thecondensation outlet 56, which itself can have an increased size relative to thevapor outlet 62. - With reference to
FIGS. 11 and 12 , themicrocondenser device 50 can additionally include aheat removal assembly hot side 66 b of thethermoelectric element 66. Theheat removal assembly FIG. 11 ) or a liquid cooling circuit 172 (FIG. 12 ). InFIG. 11 , anexemplary heat pipe 170 is shown having acasing 174, awick 176 and a vapor cavity 178. As is known and understood by those skilled in the art, theheat pipe 170 can facilitate more rapid removal of heat from thehot side 66 b of thethermoelectric element 66, which reduces the power consumption of the thermoelectric element for condensing fuel vapor in thecavity 80. InFIG. 12 , an exemplaryliquid cooling circuit 172 is shown having apump 180, aheat exchanger 182 and aliquid circulation loop 184. As is known and understood by those skilled in the art, thepump 180 circulates a heat transfer fluid (e.g., antifreeze) in theloop 184 from thehot side 66 b of thethermoelectric element 66 where the fluid absorbs heat from thethermoelectric element 66 to theheat exchanger 182 where the fluid dissipates its absorbed heat. Alternatively or in addition, thehot side 66 a of thethermoelectric element 66 can be cooled by convection fins and/or a fan (both not shown). Although not shown, a thermal paste can be used between theheat removal assembly hot side 66 a of thethermoelectric element 66. Using theheat pipe 170 or theliquid cooling circuit 172, rapid heat removal can occur from thehot side 66 a of thethermoelectric element 66 increasing its efficiency. - Advantageously, the microcondenser devices described herein can provide improved efficiencies which allow the devices to have smaller footprints when employed in a vehicle electrical system. It will be appreciated that various of the above-disclosed and other features and functions, or alternatives or varieties thereof, may be desirably combined into many other different systems or applications. Also that various presently unforeseen or unanticipated alternatives, modifications, variations or improvements therein may be subsequently made by those skilled in the art which are also intended to be encompassed by the following claims.
Claims (26)
1. A microcondenser device for an evaporative emission control system associated with an internal combustion engine, comprising:
a housing having a lower wall and at least one side wall extending upward from the lower wall, the lower wall and the at least one side wall together define a chamber in the housing;
a thermoelectric element supported by the at least one side wall in spaced relation relative to the lower wall;
an inlet defined in the housing for admitting fuel vapor into the chamber;
a condensation outlet defined in the housing for discharging liquid fuel that is condensed from the fuel vapor in the chamber; and
a porous heat sink element received in the chamber for absorbing the fuel vapor admitted through the inlet, the porous heat sink element in conductive thermal contact with the thermoelectric element.
2. The microcondenser device of claim 1 further including at least one support baffle supporting the porous heat sink element in an elevated position from the lower wall and in conductive thermal contact with the thermoelectric element.
3. The microcondenser device of claim 1 wherein the porous heat sink element is a carbon foam element having a varying porosity.
4. The microcondenser device of claim 1 further including a vapor outlet defined in the housing for discharging uncondensed fuel vapor, the vapor outlet elevated relative to the inlet and the inlet elevated relative to the condensation outlet.
5. The microcondenser device of claim 1 further including a heat pipe or a liquid cooling circuit for removing heat from the thermoelectric element.
6. A microcondenser device for an evaporative emission control system, comprising:
a housing having an inlet for receiving fuel vapor and a condensation outlet for discharging condensed fuel vapor;
a porous heat sink element disposed in the housing and fluidly interposed between the inlet and the condensation outlet for absorbing the fuel vapor received through the inlet;
a thermoelectric element in thermal contact with the porous heat sink element for removing heat from the fuel vapor absorbed by the porous heat sink element to condense the fuel vapor; and
at least one support baffle supporting the porous heat sink element within the housing.
7. The microcondenser device of claim 6 wherein the porous heat sink element is a carbon foam heat sink element.
8. The microcondenser device of claim 6 wherein the housing has a vapor outlet for discharging fuel vapor that remains vaporized after passing through the porous heat sink element, the porous heat sink element fluidly interposed between the inlet and the vapor outlet.
9. The microcondenser device of claim 8 wherein the housing includes a bottom wall and at least one side wall extending upward from the bottom wall, the thermoelectric element is spaced apart vertically from the bottom wall, the at least one support baffle supports the porous heat sink element in spaced apart relation from the bottom wall.
10. The microcondenser device of claim 9 wherein the at least one support baffle urges the porous heat sink element toward the thermoelectric element.
11. The microcondenser device of claim 9 wherein the at least one support baffle urges the porous heat sink element into thermal contact with the thermoelectric element.
12. The microcondenser device of claim 9 wherein a plenum chamber is formed by the at least one side wall, the at least one support baffle and the porous heat sink element, the plenum chamber extending along substantially an entire width of the porous heat sink element.
13. The microcondenser device of claim 12 wherein the porous heat sink element has an increased porosity adjacent the plenum chamber.
14. The microcondenser device of claim 9 wherein the porous heat sink element has an increased porosity adjacent a first side of the porous heat sink element disposed adjacent the inlet than a second side adjacent the vapor outlet.
15. The microcondenser device of claim 14 wherein the porous heat sink element has an increased porosity adjacent an underside of the porous heat sink element disposed adjacent the condensation outlet than an upper side adjacent the thermoelectric element.
16. The microcondenser device of claim 9 wherein the porous heat sink element has an increased porosity adjacent an underside of the porous heat sink element disposed adjacent the condensation outlet than an upper side adjacent the thermoelectric element.
17. The microcondenser device of claim 6 wherein the thermoelectric element is nestably received within a recess defined in the housing.
18. The microcondenser device of claim 17 wherein the housing includes a bottom wall and at least one side wall extending upward from the bottom wall, the at least one side wall includes a recess defined by a shoulder and face extending upward from the shoulder, the thermoelectric element supported on the shoulder and sized such that at least one peripheral edge of the thermoelectric element is positioned closely adjacent the face.
19. The microcondenser device of claim 18 wherein a copper plate is interposed between the porous heat sink element and the thermoelectric element.
20. The microcondenser device of claim 1 wherein a copper plate is interposed between the porous heat sink element and the thermoelectric element.
21. The microcondenser device of claim 20 wherein a thermal paste is interposed between at least one of: the copper plate and the thermoelectric element or the copper plate and the porous heat sink element.
22. The microcondenser device of claim 6 wherein the porous heat sink element has an increased porosity adjacent the inlet than adjacent the condensation outlet.
23. The microcondenser device of claim 6 wherein the housing is formed of a plastic material.
24. The microcondenser device of claim 6 wherein an insulating layer is disposed one of: around an exterior of the housing or inside the housing around the porous heat sink element.
25. The microcondenser of claim 6 further including a heat removal assembly for removing heat from a hot side of the microcondenser element, the heat removal assembly comprising at least one of: a heat pipe or a liquid cooling circuit.
26. A microcondenser device for an evaporative emission control system, comprising:
a housing having an inlet for receiving fuel vapor and a condensation outlet for discharging condensed fuel vapor;
a porous heat sink element disposed in the housing and fluidly interposed between the inlet and the condensation outlet for absorbing the fuel vapor received through the inlet;
a thermoelectric element in thermal contact with the porous heat sink element for removing heat from the fuel vapor absorbed by the porous heat sink element to condense the fuel vapor; and
a heat removal assembly in conductive thermal contact with a hot side of the microcondenser element for removing heat therefrom, the heat removal assembly comprising at least one of: a heat pipe or a liquid cooling circuit.
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
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US12/797,257 US20110303197A1 (en) | 2010-06-09 | 2010-06-09 | Microcondenser device |
US13/702,796 US9334837B2 (en) | 2010-06-09 | 2011-06-08 | Microcondenser device and evaporative emission control system and method having microcondenser device |
CN201180039528.4A CN103069146B (en) | 2010-06-09 | 2011-06-08 | Microcondenser device and there is the evaporative emission control system of this microcondenser device |
EP17166275.2A EP3219532B1 (en) | 2010-06-09 | 2011-06-08 | Microcondenser device and evaporative emission control system and method having microcondenser device |
EP11793072.7A EP2580461B1 (en) | 2010-06-09 | 2011-06-08 | Microcondenser device and evaporative emission control system and method having microcondenser device |
CA2801604A CA2801604C (en) | 2010-06-09 | 2011-06-08 | Microcondenser device and evaporative emission control system and method having microcondenser device |
JP2013514327A JP5878921B2 (en) | 2010-06-09 | 2011-06-08 | Microcondenser device and evaporative gas suppression system and method with microcondenser device |
PCT/US2011/039563 WO2011156452A1 (en) | 2010-06-09 | 2011-06-08 | Microcondenser device and evaporative emission control system and method having microcondenser device |
MX2012014424A MX2012014424A (en) | 2010-06-09 | 2011-06-08 | Microcondenser device and evaporative emission control system and method having microcondenser device. |
JP2016014172A JP6142019B2 (en) | 2010-06-09 | 2016-01-28 | Microcondenser device and evaporative gas suppression system and method with microcondenser device |
Applications Claiming Priority (1)
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US12/797,257 US20110303197A1 (en) | 2010-06-09 | 2010-06-09 | Microcondenser device |
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US13/702,796 Continuation-In-Part US9334837B2 (en) | 2010-06-09 | 2011-06-08 | Microcondenser device and evaporative emission control system and method having microcondenser device |
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EP (2) | EP3219532B1 (en) |
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US20170174072A1 (en) * | 2014-04-01 | 2017-06-22 | Plastic Omnium Advanced Innovation And Research | Vehicle storage system and convertor for use in such a system |
US20150300289A1 (en) * | 2014-04-18 | 2015-10-22 | Hyundai Motor Company | Cylinder head for engine |
US9617949B2 (en) * | 2014-04-18 | 2017-04-11 | Hyundai Motor Company | Cylinder head for engine |
US20160118566A1 (en) * | 2014-10-23 | 2016-04-28 | Samsung Electronics Co., Ltd. | Wearable device having thermoelectric generator |
US9842978B1 (en) * | 2016-09-21 | 2017-12-12 | GM Global Technology Operations LLC | Vehicle including thermoelectric generator |
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US11428193B2 (en) * | 2019-12-09 | 2022-08-30 | Mahle International Gmbh | Thermal insulation of a membrane module for mitigating evaporative fuel emissions of automobiles |
Also Published As
Publication number | Publication date |
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MX2012014424A (en) | 2013-06-24 |
CN103069146B (en) | 2016-04-27 |
CA2801604C (en) | 2018-02-13 |
EP2580461B1 (en) | 2017-05-31 |
JP6142019B2 (en) | 2017-06-07 |
EP2580461A1 (en) | 2013-04-17 |
JP2016121691A (en) | 2016-07-07 |
EP3219532B1 (en) | 2019-03-27 |
CA2801604A1 (en) | 2011-12-15 |
CN103069146A (en) | 2013-04-24 |
JP2013531759A (en) | 2013-08-08 |
JP5878921B2 (en) | 2016-03-08 |
US20130118457A1 (en) | 2013-05-16 |
EP2580461A4 (en) | 2013-12-25 |
WO2011156452A1 (en) | 2011-12-15 |
US9334837B2 (en) | 2016-05-10 |
EP3219532A1 (en) | 2017-09-20 |
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