US20110247561A1 - Thermal Chemical Vapor Deposition Methods, and Thermal Chemical Vapor Deposition Systems - Google Patents
Thermal Chemical Vapor Deposition Methods, and Thermal Chemical Vapor Deposition Systems Download PDFInfo
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- US20110247561A1 US20110247561A1 US13/165,412 US201113165412A US2011247561A1 US 20110247561 A1 US20110247561 A1 US 20110247561A1 US 201113165412 A US201113165412 A US 201113165412A US 2011247561 A1 US2011247561 A1 US 2011247561A1
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- 238000000034 method Methods 0.000 title claims abstract description 53
- 238000002230 thermal chemical vapour deposition Methods 0.000 title claims abstract description 31
- 238000000151 deposition Methods 0.000 claims abstract description 71
- 238000010926 purge Methods 0.000 claims abstract description 65
- 230000008021 deposition Effects 0.000 claims abstract description 62
- 239000000463 material Substances 0.000 claims abstract description 60
- 239000000758 substrate Substances 0.000 claims abstract description 56
- 239000002243 precursor Substances 0.000 claims abstract description 54
- 239000000126 substance Substances 0.000 claims abstract description 14
- 239000007789 gas Substances 0.000 claims description 105
- 238000002955 isolation Methods 0.000 claims description 22
- 239000012530 fluid Substances 0.000 claims description 20
- 238000005086 pumping Methods 0.000 claims description 14
- 238000004891 communication Methods 0.000 claims description 13
- 238000011144 upstream manufacturing Methods 0.000 claims description 13
- 229910003074 TiCl4 Inorganic materials 0.000 claims description 10
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 claims description 10
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 8
- 239000000460 chlorine Substances 0.000 claims description 8
- 229910052801 chlorine Inorganic materials 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 239000011261 inert gas Substances 0.000 claims description 5
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims 2
- 239000006227 byproduct Substances 0.000 description 5
- 238000001914 filtration Methods 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 125000001309 chloro group Chemical group Cl* 0.000 description 2
- 238000010348 incorporation Methods 0.000 description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910004537 TaCl5 Inorganic materials 0.000 description 1
- 241001377894 Trias Species 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- OEIMLTQPLAGXMX-UHFFFAOYSA-I tantalum(v) chloride Chemical compound Cl[Ta](Cl)(Cl)(Cl)Cl OEIMLTQPLAGXMX-UHFFFAOYSA-I 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4408—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber by purging residual gases from the reaction chamber or gas lines
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
Definitions
- Embodiments of the invention pertain to thermal chemical vapor deposition methods, and to thermal chemical vapor deposition systems.
- Thermal chemical vapor deposition is a method used in the fabrication of integrated circuitry for depositing one or more insulative, conductive, or semiconductive materials onto a substrate.
- First and second deposition precursors are provided to a chamber within which a substrate is received.
- the substrate and/or chamber are provided at a desired elevated temperature, and the precursors react to deposit a suitable material onto the substrate. More than two deposition precursors and one or more carrier gases might also be used.
- One prior art thermal CVD process uses TiCl 4 and NH 3 as deposition precursors in depositing TiN.
- the desired reaction by-product is HCl which is exhausted from the chamber.
- other reaction by-products are created, and regardless chlorine can undesirably remain in the deposited material.
- One existing manner of minimizing chlorine incorporation includes repeating a sequence of deposition steps.
- TiCl 4 and NH 3 are flowed to the substrate to deposit a layer of TiN which is thinner than the desired ultimate thickness.
- an inert purge gas flow to remove unreacted precursor and reaction by-product.
- NH 3 is flowed to the substrate with the effect being chlorine removal by formation of HCl and additional nitrogen atom incorporation into the previously deposited material.
- another inert purge step this one typically lasting from 5 to 10 seconds. The overall process is repeated until a layer of desired thickness is deposited onto the substrate.
- TEL Tokyo Electron
- TEL Unity System a plurality of filtering devices in the form of traps to collect unreacted precursors and reaction by-products prior to flowing to a vacuum pump.
- FIGURE is a diagrammatic representation of one embodiment thermal chemical vapor deposition system in accordance with an embodiment the invention.
- Embodiments herein include thermal chemical vapor deposition systems, as well as methods of thermal chemical vapor deposition.
- the system embodiments are not necessarily limited by method, nor are method embodiments necessarily limited by system.
- One embodiment thermal chemical vapor deposition system is indicated generally with reference 10 in the FIGURE.
- Such includes a deposition chamber 12 within which a substrate 14 to be deposited upon is to be received.
- Chamber 12 might be configured for receiving a single wafer or for receiving multiple wafers for thermal chemical vapor deposition.
- Two precursor feed lines P 1 and P 2 are diagrammatically shown feeding to chamber 12 . Such might feed separately to chamber 12 as shown, alternately might combine prior to feeding to chamber 12 , might feed to a showerhead received within chamber 12 , might feed to different locations to chamber 12 , etc.
- a foreline 16 extends from chamber 12 .
- a “foreline” is any line extending from a deposition chamber through which gas is exhausted from a deposition chamber.
- a first exhaust line 18 connects with foreline 16 and a second exhaust line 20 connects with foreline 16 .
- First exhaust line 18 and second exhaust line 20 are in fluid parallel communication relative one another with and downstream of deposition chamber 12 . Such are depicted relative to a single foreline 16 although exhaust lines 18 and 20 might connect directly with chamber 12 , and regardless multiple forelines might of course be utilized.
- First exhaust line 18 and second exhaust line 20 are in downstream fluid parallel communication with a vacuum pump 25 .
- Multiple vacuum pumps might of course be utilized, and whether connected in series or parallel relative one another.
- a single vacuum pump feedline 26 is shown as feeding vacuum pump 25 , with the first and second exhaust lines 18 , 20 respectively connecting therewith and thereby being in downstream fluid parallel communication with vacuum pump feedline 26 .
- the first exhaust line comprises a filter and an isolation valve upstream thereof.
- FIG. 1 depicts first exhaust line 18 comprising multiple filters 30 , 32 and an isolation valve 34 upstream of all filters in first exhaust line 18 .
- an example filter 30 is any suitable self-regenerating trap largely useable for chemical filtering
- an example filter 32 is any suitable mechanical trap for example a column trap largely for solid particulate filtering. Filters 30 , 32 might filter/trap with respect to any unreacted deposition precursors flowing through the chamber, to any reaction by-product, and/or to any other material exiting chamber 12 , for example to protect exhaust pumping equipment, such as vacuum pump 25 .
- Second exhaust line 20 of example embodiment system 10 comprises an isolation valve 40 and another pump 45 downstream of second exhaust line isolation valve 40 and upstream of vacuum pump 25 .
- second exhaust line 20 is devoid of any filters.
- An example pump is a turbomolecular pump.
- pump 45 may be of the same, lesser, or greater pumping capacity than vacuum pump 25 .
- pump 45 has the same pumping capacity as that of vacuum pump 25 .
- pump 45 has greater pumping capacity than that of vacuum pump 25 .
- a thermal chemical vapor deposition system comprises a deposition chamber within which a substrate to be deposited upon is to be received.
- First and second fluid parallel exhaust lines are in fluid communication with the chamber downstream thereof.
- the first and second exhaust lines are in downstream fluid parallel communication with a vacuum pump.
- the first exhaust line comprises a filter and an isolation valve upstream of the filter
- the second exhaust line comprises an isolation valve and is devoid of any filters independent of whether another pump is included in the second exhaust line.
- the first exhaust line comprises an isolation valve independent of whether including one or more filters
- the second exhaust line comprises an isolation valve and another pump downstream of the second exhaust line isolation valve and upstream of the vacuum pump independent of whether containing any filters in the second exhaust line.
- a substrate within a chamber is exposed to first and second deposition precursors effective to thermally chemical deposit a material on the substrate. More than first and second deposition precursors might of course be utilized, as well as one or more carrier and/or inert gases.
- the system 10 of the FIGURE might be utilized for feeding a first deposition precursor P 1 and a second deposition precursor P 2 for exposure of a substrate 14 within chamber 12 thereto. Such might be in the context of a single substrate received within a chamber, or multiple substrates received within a chamber.
- an example first deposition precursor comprises TiCl 4 and an example second precursor comprises NH 3 .
- example first deposition precursors include one or both of a silane and tetraethylorthosilicate (TEOS), with an example second deposition precursor being NH 3 .
- TEOS tetraethylorthosilicate
- an example first deposition precursor comprises TaCl 5 and an example second deposition precursor comprises NH 3 .
- thermal chemical vapor deposition might be with a hot-wall or a cold-wall reactor, and with or without the susceptor on which the substrate rests being separately heated.
- One particular example includes a single wafer, hot-wall, reactor having wall temperature set at from about 100° C. to about 200° C., with about 150° C. being a specific example.
- An example susceptor temperature range is from about 450° C. to about 700° C., more narrowly from about 550° C. to about 650° C., with about 600° C. being a specific example.
- Pressure is desirably subatmospheric, with an example range being from about 1.5 Torr to about 5 Torr, more narrowly from about 1 Torr to about 2 Torr, with about 1 Torr being a specific example.
- an example flow rate for each of TiCl 4 and NH 3 is from about 50 sccm to about 10 sccm, with about 70 sccm being a specific example flow rate for each.
- An example deposition rate is from about 3 Angstroms to about 5 Angstroms per second of a TiN-comprising material. Such might comprise incorporated chlorine as identified in the Background section above. Regardless, an example deposition time is from about 3 seconds to about 2 minutes.
- Unreacted first and second deposition precursors are exhausted from the chamber through a vacuum pump via a first exhaust line.
- the first exhaust line comprises a filter through which unreacted first and second deposition precursors are exhausted to a vacuum pump.
- the first exhaust line may comprise more than one filter.
- the first exhaust line comprises two filters in series through which unreacted first and second deposition precursors are exhausted.
- material other than unreacted first and second deposition precursors might also flow through the first exhaust line, regardless.
- exhaust line 18 in FIG. 1 of system 10 is an example first exhaust line
- regardless vacuum pump 25 of system 10 is an example vacuum pump.
- a reactive gas is flowed to the material on the substrate, with such reactive gas being reactive with the material previously thermally chemical vapor deposited onto the substrate.
- the reactive gas is reactive with the material to one or both of remove undesired constituents from the deposited material and/or to incorporate at least some portion of the reactive gas into the deposited material.
- the reactive gas might comprise one of the first and second deposition precursors or might not be comprised of either of the first or second deposition precursors.
- an example reactive gas is NH 3 .
- Such might be reactive to one or both of extract chlorine atoms from the deposited material and exhaust such as HCl, and/or incorporate additional nitrogen atoms into the previously deposited TiN-comprising material.
- Example temperature and pressure ranges and specifics are as described above in connection with the thermal CVD.
- An example reactive gas flow rate is 100% NH 3 at from about 1000 sccm to about 5000 sccm, with one embodiment being from about 2000 sccm to about 4000 sccm, and about 2000 sccm being a specific example.
- An example embodiment time of NH 3 flow is from about 1 second to 10 seconds.
- an example reactive gas is H 2 .
- H 2 such might be reactive to extract chlorine atoms from the deposited material and exhaust such as HCl.
- H 2 flowing might be combined with flowing of N 2 to the chamber.
- an inert purge gas is flowed to the material on the substrate intermediate the exposing of the substrate to the first and second deposition precursors and the flowing of the reactive gas.
- an example inert purge gas flow comprises 100% N 2 at about 200 sccm for from about 2 to about 5 seconds.
- such inert purge gas flowing is through the vacuum pump.
- such inert purge gas flowing is also via the first exhaust line.
- an inert purge gas is flowed through the chamber and through a second exhaust line and through the vacuum pump.
- the second exhaust line does not include the filter or filters of the first exhaust line.
- the second exhaust line does not comprise any filters through which the inert purge gas flows to the vacuum pump.
- the inert purge gases utilized during such might be compositionally the same or different. Regardless, the inert purge gas flowing immediately after flowing of the reactive gas in one embodiment is precluded from flowing through the filter in the first exhaust line during at least most, if not all, of the flowing of such inert purge gas. Regardless, an example inert purge gas flowing immediately after flowing of the reactive gas comprises N 2 at about 2000 sccm.
- the second exhaust line comprises another pump through which the inert purge gas flows prior to flowing through the vacuum pump during the flowing of the inert purge gas immediately after flowing of the reactive gas.
- second exhaust line 20 and its associated components in system 10 of the FIGURE is an example such second exhaust line.
- the another pump is operated at equal pumping capacity to that of the vacuum pump during flow of the inert purge gas through the another pump. In one embodiment, the another pump is operated at greater pumping capacity than that of the vacuum pump during flow of the inert purge gas through the another pump.
- an inert purge gas flowing after flowing of the NH 3 -only had to occur for from 5 to 10 seconds to achieve adequate purging. Such was believed to be in part due to flow of the purge gas through one or more filters prior to the vacuum pump, causing flow restriction and thus added time.
- Flowing of an inert purge gas immediately after flowing of a reactive gas through a second exhaust line not comprising one or more of the filters of the first exhaust line (i.e, at least containing less filters than the first exhaust line, and in one embodiment containing no filters) may facilitate exhausting/evacuating of the chamber of the reactive gas faster.
- flow of the inert purge gas through the second exhaust line after flow of the reactive gas should enable reduction of such purge gas flow to less than 5 seconds, and even at about 3 seconds or 2 seconds or less if another pump (i.e., pump 45 ) is utilized. Such may facilitate overall throughput by reducing time.
- pump 45 another pump
- exposing of the first and second deposition precursors for thermal CVD, flowing of the reactive gas, and flowing of the inert purge gas thereafter are repeated effective to deposit material of desired thickness on the substrate.
- the flow of the reactive gas might be through the first exhaust line and to the vacuum pump, through the second exhaust line and to the vacuum pump, or through both the first and second exhaust lines.
- individual of the inert gas flowings immediately after the reactive gas flowings are less than 5 seconds in duration, and in one embodiment are no greater than 3 seconds in duration.
- a thermal chemical vapor deposition method in accordance with one embodiment includes exposing a substrate within a chamber to first and second deposition precursors effective to thermally CVD a material on the substrate, and exhausting unreacted first and second deposition precursors from the chamber through a vacuum pump via a first exhaust line.
- a reactive gas is flowed to the material on the substrate and is reactive with such material.
- an inert purge gas is flowed through the chamber and through the vacuum pump.
- the first exhaust line comprises a filter and the flowing of the inert purge gas to the vacuum pump is through a second exhaust line not comprising the filter in the first exhaust line and independent of whether the second exhaust line comprises another pump through which the inert purge gas flows prior to flowing to the vacuum pump.
- the flowing of the inert purge gas to the vacuum pump is through a second exhaust line comprising another pump through which the inert purge gas flows prior to flowing to the vacuum pump independent of whether the first exhaust line includes any filter.
- exposing to the first and second deposition precursors effective for thermal CVD, flowing of the reactive gas, and flowing of the inert purge gas are repeated effective to deposit material of desired thickness on the substrate.
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Abstract
One embodiment thermal chemical vapor deposition method includes exposing a substrate within a chamber to first and second deposition precursors effective to thermally chemical vapor deposit a material on the substrate, and exhausting unreacted first and second deposition precursors from the chamber through a vacuum pump via a first exhaust line comprising a filter. A reactive gas is flowed to the material on the substrate, with the reactive gas being reactive with the material. After flowing the reactive gas, an inert purge gas is flowed through the chamber and through the vacuum pump. The flowing of the inert purge gas to the vacuum pump is through a second exhaust line not comprising the filter. The exposing, the flowing of the reactive gas, and the flowing of the inert purge gas are repeated effective to deposit material of desired thickness on the substrate.
Description
- This patent resulted from a divisional application of U.S. patent application Ser. No. 11/709,509 filed on Feb. 21, 2007 which is hereby incorporated by reference herein.
- Embodiments of the invention pertain to thermal chemical vapor deposition methods, and to thermal chemical vapor deposition systems.
- Thermal chemical vapor deposition (CVD) is a method used in the fabrication of integrated circuitry for depositing one or more insulative, conductive, or semiconductive materials onto a substrate. First and second deposition precursors are provided to a chamber within which a substrate is received. The substrate and/or chamber are provided at a desired elevated temperature, and the precursors react to deposit a suitable material onto the substrate. More than two deposition precursors and one or more carrier gases might also be used.
- One prior art thermal CVD process uses TiCl4 and NH3 as deposition precursors in depositing TiN. The desired reaction by-product is HCl which is exhausted from the chamber. However, other reaction by-products are created, and regardless chlorine can undesirably remain in the deposited material.
- One existing manner of minimizing chlorine incorporation includes repeating a sequence of deposition steps. In a first step, TiCl4 and NH3 are flowed to the substrate to deposit a layer of TiN which is thinner than the desired ultimate thickness. This is followed by an inert purge gas flow to remove unreacted precursor and reaction by-product. After the purge step, NH3 is flowed to the substrate with the effect being chlorine removal by formation of HCl and additional nitrogen atom incorporation into the previously deposited material. This is followed by another inert purge step, this one typically lasting from 5 to 10 seconds. The overall process is repeated until a layer of desired thickness is deposited onto the substrate. Existing equipment in which such is conducted is available from Tokyo Electron (TEL), for example the “TRIAS TiN System” or the “TEL Unity System”. Such include a plurality of filtering devices in the form of traps to collect unreacted precursors and reaction by-products prior to flowing to a vacuum pump.
- While embodiments disclosed herein were motivated in addressing the above issues particular to a thermal CVD of TiN, the disclosure herein is in no way so limited.
- The FIGURE is a diagrammatic representation of one embodiment thermal chemical vapor deposition system in accordance with an embodiment the invention.
- Embodiments herein include thermal chemical vapor deposition systems, as well as methods of thermal chemical vapor deposition. The system embodiments are not necessarily limited by method, nor are method embodiments necessarily limited by system. One embodiment thermal chemical vapor deposition system is indicated generally with
reference 10 in the FIGURE. Such includes adeposition chamber 12 within which asubstrate 14 to be deposited upon is to be received.Chamber 12 might be configured for receiving a single wafer or for receiving multiple wafers for thermal chemical vapor deposition. Two precursor feed lines P1 and P2 are diagrammatically shown feeding tochamber 12. Such might feed separately tochamber 12 as shown, alternately might combine prior to feeding tochamber 12, might feed to a showerhead received withinchamber 12, might feed to different locations tochamber 12, etc. - A
foreline 16 extends fromchamber 12. In the context of this document, a “foreline” is any line extending from a deposition chamber through which gas is exhausted from a deposition chamber. Afirst exhaust line 18 connects withforeline 16 and asecond exhaust line 20 connects withforeline 16.First exhaust line 18 andsecond exhaust line 20 are in fluid parallel communication relative one another with and downstream ofdeposition chamber 12. Such are depicted relative to asingle foreline 16 althoughexhaust lines chamber 12, and regardless multiple forelines might of course be utilized. -
First exhaust line 18 andsecond exhaust line 20 are in downstream fluid parallel communication with avacuum pump 25. Multiple vacuum pumps might of course be utilized, and whether connected in series or parallel relative one another. Regardless, a singlevacuum pump feedline 26 is shown asfeeding vacuum pump 25, with the first andsecond exhaust lines vacuum pump feedline 26. - The first exhaust line comprises a filter and an isolation valve upstream thereof.
FIG. 1 depictsfirst exhaust line 18 comprisingmultiple filters isolation valve 34 upstream of all filters infirst exhaust line 18. By way of examples only, anexample filter 30 is any suitable self-regenerating trap largely useable for chemical filtering, and anexample filter 32 is any suitable mechanical trap for example a column trap largely for solid particulate filtering.Filters material exiting chamber 12, for example to protect exhaust pumping equipment, such asvacuum pump 25. -
Second exhaust line 20 ofexample embodiment system 10 comprises anisolation valve 40 and anotherpump 45 downstream of second exhaustline isolation valve 40 and upstream ofvacuum pump 25. In one embodiment and as depicted,second exhaust line 20 is devoid of any filters. An example pump is a turbomolecular pump. Regardless,pump 45 may be of the same, lesser, or greater pumping capacity thanvacuum pump 25. In one embodiment,pump 45 has the same pumping capacity as that ofvacuum pump 25. In one embodiment,pump 45 has greater pumping capacity than that ofvacuum pump 25. - In one embodiment, a thermal chemical vapor deposition system comprises a deposition chamber within which a substrate to be deposited upon is to be received. First and second fluid parallel exhaust lines are in fluid communication with the chamber downstream thereof. The first and second exhaust lines are in downstream fluid parallel communication with a vacuum pump. In one embodiment, the first exhaust line comprises a filter and an isolation valve upstream of the filter, and the second exhaust line comprises an isolation valve and is devoid of any filters independent of whether another pump is included in the second exhaust line. In one embodiment, the first exhaust line comprises an isolation valve independent of whether including one or more filters, and the second exhaust line comprises an isolation valve and another pump downstream of the second exhaust line isolation valve and upstream of the vacuum pump independent of whether containing any filters in the second exhaust line.
- Other embodiments include thermal chemical vapor deposition methods independent of whether using the above-described embodiment systems. However by way of example only, example embodiment methods are described below using the
example system 10 in the FIGURE. In one embodiment, a substrate within a chamber is exposed to first and second deposition precursors effective to thermally chemical deposit a material on the substrate. More than first and second deposition precursors might of course be utilized, as well as one or more carrier and/or inert gases. By way of example only, thesystem 10 of the FIGURE might be utilized for feeding a first deposition precursor P1 and a second deposition precursor P2 for exposure of asubstrate 14 withinchamber 12 thereto. Such might be in the context of a single substrate received within a chamber, or multiple substrates received within a chamber. - By way of example only and where the deposited material comprises TiN, an example first deposition precursor comprises TiCl4 and an example second precursor comprises NH3. In another example where Si3N4 is to be deposited, example first deposition precursors include one or both of a silane and tetraethylorthosilicate (TEOS), with an example second deposition precursor being NH3. As another example where the deposited material comprises TaN, an example first deposition precursor comprises TaCl5 and an example second deposition precursor comprises NH3. Regardless, such thermal chemical vapor deposition might be with a hot-wall or a cold-wall reactor, and with or without the susceptor on which the substrate rests being separately heated. One particular example includes a single wafer, hot-wall, reactor having wall temperature set at from about 100° C. to about 200° C., with about 150° C. being a specific example. An example susceptor temperature range is from about 450° C. to about 700° C., more narrowly from about 550° C. to about 650° C., with about 600° C. being a specific example. Pressure is desirably subatmospheric, with an example range being from about 1.5 Torr to about 5 Torr, more narrowly from about 1 Torr to about 2 Torr, with about 1 Torr being a specific example. For deposition of TiN, an example flow rate for each of TiCl4 and NH3 is from about 50 sccm to about 10 sccm, with about 70 sccm being a specific example flow rate for each. An example deposition rate is from about 3 Angstroms to about 5 Angstroms per second of a TiN-comprising material. Such might comprise incorporated chlorine as identified in the Background section above. Regardless, an example deposition time is from about 3 seconds to about 2 minutes.
- Unreacted first and second deposition precursors are exhausted from the chamber through a vacuum pump via a first exhaust line. In one embodiment, the first exhaust line comprises a filter through which unreacted first and second deposition precursors are exhausted to a vacuum pump. The first exhaust line may comprise more than one filter. In one embodiment, the first exhaust line comprises two filters in series through which unreacted first and second deposition precursors are exhausted. Of course, material other than unreacted first and second deposition precursors might also flow through the first exhaust line, regardless. By way of example only,
exhaust line 18 inFIG. 1 ofsystem 10 is an example first exhaust line, and regardlessvacuum pump 25 ofsystem 10 is an example vacuum pump. - A reactive gas is flowed to the material on the substrate, with such reactive gas being reactive with the material previously thermally chemical vapor deposited onto the substrate. The reactive gas is reactive with the material to one or both of remove undesired constituents from the deposited material and/or to incorporate at least some portion of the reactive gas into the deposited material. The reactive gas might comprise one of the first and second deposition precursors or might not be comprised of either of the first or second deposition precursors. In one embodiment, for example in the thermal CVD of a TiN-comprising material using deposition precursors of TiCl4 and NH3, an example reactive gas is NH3. By way of example only, such might be reactive to one or both of extract chlorine atoms from the deposited material and exhaust such as HCl, and/or incorporate additional nitrogen atoms into the previously deposited TiN-comprising material. Example temperature and pressure ranges and specifics are as described above in connection with the thermal CVD. An example reactive gas flow rate is 100% NH3 at from about 1000 sccm to about 5000 sccm, with one embodiment being from about 2000 sccm to about 4000 sccm, and about 2000 sccm being a specific example. An example embodiment time of NH3 flow is from about 1 second to 10 seconds. In one embodiment, for example in the thermal CVD of a TiN-comprising material using deposition precursors of TiCl4 and NH3, an example reactive gas is H2. By way of example only, such might be reactive to extract chlorine atoms from the deposited material and exhaust such as HCl. Regardless in one embodiment, such H2 flowing might be combined with flowing of N2 to the chamber.
- In one embodiment, an inert purge gas is flowed to the material on the substrate intermediate the exposing of the substrate to the first and second deposition precursors and the flowing of the reactive gas. By way of example only, such an example inert purge gas flow comprises 100% N2 at about 200 sccm for from about 2 to about 5 seconds. In one embodiment, such inert purge gas flowing is through the vacuum pump. In one embodiment, such inert purge gas flowing is also via the first exhaust line.
- After flowing of the reactive gas, an inert purge gas is flowed through the chamber and through a second exhaust line and through the vacuum pump. In one embodiment, the second exhaust line does not include the filter or filters of the first exhaust line. In one embodiment, the second exhaust line does not comprise any filters through which the inert purge gas flows to the vacuum pump. Where inert purge gas is flowed to material on the substrate intermediate the exposure to the first and second deposition precursors and the flowing of the reactive gas, such may be considered as a first flowing of an inert purge gas through the chamber, and the flowing of the inert purge gas through the chamber and second exhaust line after flowing of the reactive gas may be considered as a second flowing of an inert purge gas. The inert purge gases utilized during such might be compositionally the same or different. Regardless, the inert purge gas flowing immediately after flowing of the reactive gas in one embodiment is precluded from flowing through the filter in the first exhaust line during at least most, if not all, of the flowing of such inert purge gas. Regardless, an example inert purge gas flowing immediately after flowing of the reactive gas comprises N2 at about 2000 sccm.
- In one embodiment, the second exhaust line comprises another pump through which the inert purge gas flows prior to flowing through the vacuum pump during the flowing of the inert purge gas immediately after flowing of the reactive gas. By way of example only,
second exhaust line 20 and its associated components insystem 10 of the FIGURE is an example such second exhaust line. In one embodiment, the another pump is operated at equal pumping capacity to that of the vacuum pump during flow of the inert purge gas through the another pump. In one embodiment, the another pump is operated at greater pumping capacity than that of the vacuum pump during flow of the inert purge gas through the another pump. - In accordance with the prior art problem which motivated the invention, an inert purge gas flowing after flowing of the NH3-only had to occur for from 5 to 10 seconds to achieve adequate purging. Such was believed to be in part due to flow of the purge gas through one or more filters prior to the vacuum pump, causing flow restriction and thus added time. Flowing of an inert purge gas immediately after flowing of a reactive gas through a second exhaust line not comprising one or more of the filters of the first exhaust line (i.e, at least containing less filters than the first exhaust line, and in one embodiment containing no filters) may facilitate exhausting/evacuating of the chamber of the reactive gas faster. For example, flow of the inert purge gas through the second exhaust line after flow of the reactive gas should enable reduction of such purge gas flow to less than 5 seconds, and even at about 3 seconds or 2 seconds or less if another pump (i.e., pump 45) is utilized. Such may facilitate overall throughput by reducing time.
- Regardless, exposing of the first and second deposition precursors for thermal CVD, flowing of the reactive gas, and flowing of the inert purge gas thereafter are repeated effective to deposit material of desired thickness on the substrate. Note that the flow of the reactive gas might be through the first exhaust line and to the vacuum pump, through the second exhaust line and to the vacuum pump, or through both the first and second exhaust lines. In one embodiment, individual of the inert gas flowings immediately after the reactive gas flowings are less than 5 seconds in duration, and in one embodiment are no greater than 3 seconds in duration.
- A thermal chemical vapor deposition method in accordance with one embodiment includes exposing a substrate within a chamber to first and second deposition precursors effective to thermally CVD a material on the substrate, and exhausting unreacted first and second deposition precursors from the chamber through a vacuum pump via a first exhaust line. A reactive gas is flowed to the material on the substrate and is reactive with such material. After flowing the reactive gas, an inert purge gas is flowed through the chamber and through the vacuum pump. In one embodiment, the first exhaust line comprises a filter and the flowing of the inert purge gas to the vacuum pump is through a second exhaust line not comprising the filter in the first exhaust line and independent of whether the second exhaust line comprises another pump through which the inert purge gas flows prior to flowing to the vacuum pump. In one embodiment, the flowing of the inert purge gas to the vacuum pump is through a second exhaust line comprising another pump through which the inert purge gas flows prior to flowing to the vacuum pump independent of whether the first exhaust line includes any filter.
- Regardless, exposing to the first and second deposition precursors effective for thermal CVD, flowing of the reactive gas, and flowing of the inert purge gas are repeated effective to deposit material of desired thickness on the substrate.
- In compliance with the statute, the subject matter disclosed herein has been described in language more or less specific as to structural and methodical features. It is to be understood, however, that the claims are not limited to the specific features shown and described, since the means herein disclosed comprise example embodiments. The claims are thus to be afforded full scope as literally worded, and to be appropriately interpreted in accordance with the doctrine of equivalents.
Claims (55)
1. A thermal chemical vapor deposition method, comprising:
exposing a substrate within a chamber to first and second deposition precursors effective to thermally chemical vapor deposit a material on the substrate, and exhausting unreacted first and second deposition precursors from the chamber through a vacuum pump via a first exhaust line comprising a filter;
flowing a reactive gas to the material on the substrate, the reactive gas being reactive with the material;
after flowing the reactive gas, flowing an inert purge gas through the chamber and through the vacuum pump, the flowing of the inert purge gas to the vacuum pump being through a second exhaust line not comprising the filter; and
repeating thermal chemical vapor depositing material, exhausting of unreacted first and second deposition precursors, flowing of the reactive gas, and flowing of the inert purge gas effective to deposit material of desired thickness on the substrate.
2. The method of claim 1 wherein the reactive gas comprises one of the first and second deposition precursors.
3. The method of claim 1 wherein the reactive gas does not comprise either of the first or second deposition precursors.
4. The method of claim 1 wherein the exposing forms the material to comprise TiN.
5. The method of claim 4 wherein one of the first and second deposition precursors comprises NH3, and the reactive gas comprises NH3.
6. The method of claim 4 wherein one of the first and second deposition precursors comprises NH3, and the reactive gas comprises H2.
7. The method of claim 1 wherein the first exhaust line comprises multiple filters through which the exhausting occurs.
8. The method of claim 1 wherein the flowing of the reactive gas is through the first exhaust line and to the vacuum pump.
9. The method of claim 1 wherein the flowing of the reactive gas is through the second exhaust line and to the vacuum pump.
10. The method of claim 1 comprising flowing an inert purge gas to the material on the substrate intermediate the exposing and the flowing of the reactive gas.
11. The method of claim 1 wherein the second exhaust line comprises no filters through which the inert purge gas flows to the vacuum pump.
12. The method of claim 1 wherein individual of the inert gas flowings are less than 5 seconds in duration.
13. The method of claim 1 wherein the second exhaust line comprises another pump through which the inert purge gas flows prior to flowing through the vacuum pump.
14. The method of claim 13 wherein individual of the inert gas flowings are no greater than 3 seconds in duration.
15. The method of claim 13 wherein the second exhaust line comprises no filters through which the inert purge gas flows to the vacuum pump.
16. The method of claim 13 wherein the another pump is operated at equal pumping capacity to that of the vacuum pump during flow of the inert purge gas through the another pump.
17. The method of claim 13 wherein the another pump is operated at greater pumping capacity than that of the vacuum pump during flow of the inert purge gas through the another pump.
18. The method of claim 1 wherein the inert purge gas is precluded from flowing through the filter during at least most of the flowing of the inert purge gas.
19. A thermal chemical vapor deposition method, comprising:
exposing a substrate within a chamber to first and second deposition precursors effective to thermally chemical vapor deposit a material on the substrate, and exhausting unreacted first and second deposition precursors from the chamber through a vacuum pump via a first exhaust line comprising two filters in series;
first flowing an inert purge gas through the chamber and through the vacuum pump via the first exhaust line;
after the first flowing, flowing one of the first and second deposition precursors to the material on the substrate and through the vacuum pump, the one of the first and second deposition precursors being reactive with the material;
after flowing the reactive gas, second flowing an inert purge gas through the chamber and through the vacuum pump, the flowing of the inert purge gas to the vacuum pump being through a second exhaust line, the second exhaust line not comprising any filter and comprising another pump through which gas flows to the vacuum pump during the second flowing; and
repeating thermal chemical vapor depositing material, exhausting of unreacted first and second deposition precursors, the first flowing, the flowing of the one of the first and second deposition precursors, and the second flowing effective to deposit material of desired thickness on the substrate.
20. The method of claim 19 wherein the flowing of the one of the first and second deposition precursors is through the first exhaust line and to the vacuum pump.
21. The method of claim 19 wherein the flowing of the one of the first and second deposition precursors is through the second exhaust line and to the vacuum pump.
22. A thermal chemical vapor deposition method, comprising:
exposing a substrate within a chamber to first and second deposition precursors effective to thermally chemical vapor deposit a material on the substrate, and exhausting unreacted first and second deposition precursors from the chamber through a vacuum pump via a first exhaust line;
flowing a reactive gas to the material on the substrate, the reactive gas being reactive with the material;
after flowing the reactive gas, flowing an inert purge gas through the chamber and through the vacuum pump, the flowing of the inert purge gas to the vacuum pump being through a second exhaust line comprising another pump through which the inert purge gas flows prior to flowing to the vacuum pump; and
repeating thermal chemical vapor depositing material, exhausting unreacted first and second deposition precursors, flowing of the reactive gas, and flowing of the inert purge gas effective to deposit material of desired thickness on the substrate.
23. The method of claim 22 wherein the reactive gas comprises one of the first and second deposition precursors.
24. The method of claim 22 wherein the reactive gas does not comprise either of the first or second deposition precursors.
25. The method of claim 22 wherein the flowing of the reactive gas is through the first exhaust line and to the vacuum pump.
26. The method of claim 22 wherein the flowing of the reactive gas is through the second exhaust line and to the vacuum pump.
27. The method of claim 22 wherein individual of the inert gas flowings are no greater than 3 seconds in duration.
28. The method of claim 22 wherein the second exhaust line comprises no filters through which the inert purge gas flows to the vacuum pump.
29. The method of claim 22 comprising operating the another pump at equal pumping capacity to that of the vacuum pump during the flowing of the inert purge gas through the another pump.
30. The method of claim 22 comprising operating the another pump at a greater pumping capacity than that of the vacuum pump during the flowing of the inert purge gas through the another pump.
31. A thermal chemical vapor deposition method of depositing titanium nitride on a substrate, comprising:
exposing the substrate within a chamber to TiCl4 and NH3 effective to thermally chemical vapor deposit a TiN-comprising material on the substrate, and exhausting unreacted TiCl4 and NH3 from the chamber through a vacuum pump via a first exhaust line comprising two filters in series, the TiN-comprising material comprising chlorine;
first flowing an inert purge gas through the chamber and through the vacuum pump;
after the first flowing, flowing NH3 to the TiN-comprising material on the substrate and through the vacuum pump, the NH3 flowing removing chlorine from the TiN-comprising material;
after the NH3 flowing, second flowing an inert purge gas through the chamber and through the vacuum pump, the second flowing of the inert purge gas to the vacuum pump being through a second exhaust line not comprising either of the two filters; and
repeating thermal chemical vapor depositing TiN-comprising material, the exhausting, the first flowing, the NH3 flowing, and the second flowing effective to deposit TiN-comprising material of desired thickness on the substrate.
32. The method of claim 31 wherein the first flowing is through the first exhaust line.
33. The method of claim. 31 wherein the NH3 flowing is through the first exhaust line.
34. The method of claim 31 wherein the first flowing is through the first exhaust line, and the NH3 flowing is through the first exhaust line.
35. The method of claim 31 wherein the NH3 flowing is through the second exhaust line.
36. The method of claim 31 wherein individual of the second flowings are less than 5 seconds in duration.
37. The method of claim 31 wherein the second exhaust line comprises another pump through which the second flowing occurs prior to flowing through the vacuum pump.
38. The method of claim 37 wherein the second exhaust line comprises no filters through which the inert purge gas flows to the vacuum pump.
39. The method of claim 38 wherein individual of the second flowings are no longer than 3 seconds.
40. A thermal chemical vapor deposition method of depositing titanium nitride on a substrate, comprising:
exposing the substrate within a chamber to TiCl4 and NH3 effective to thermally chemical vapor deposit a TiN-comprising material on the substrate, and exhausting unreacted TiCl4 and NH3 from the chamber through a vacuum pump via a first exhaust line comprising two filters in series, the TiN-comprising material comprising chlorine;
first flowing an inert purge gas through the chamber and through the vacuum pump;
after the first flowing, flowing H2 to the TiN-comprising material on the substrate and through the vacuum pump, the H2 flowing removing chlorine from the TiN-comprising material;
after the H2 flowing, second flowing an inert purge gas through the chamber and through the vacuum pump, the second flowing of the inert purge gas to the vacuum pump being through a second exhaust line not comprising either of the two filters; and
repeating thermal chemical vapor depositing TiN-comprising material, the exhausting, the first flowing, the H2 flowing, and the second flowing effective to deposit TiN-comprising material of desired thickness on the substrate.
41. The method of claim 40 wherein the flowing H2 also comprises flowing N2 to the chamber with the H2.
42. A thermal chemical vapor deposition system, comprising:
a deposition chamber within which a substrate to be deposited upon is to be received;
first and second fluid parallel exhaust lines in fluid communication with the chamber downstream thereof, the first and second exhaust lines being in downstream fluid parallel communication with a vacuum pump;
the first exhaust line comprising a filter and an isolation valve upstream of the filter; and
the second exhaust line comprising an isolation valve and being devoid of any filters.
43. The system of claim 42 comprising at least one foreline extending from the chamber, the first and second exhaust lines being in fluid connection with a single of the at least one foreline.
44. The system of claim 42 comprising a single vacuum pump feed line to which each of the first and second exhaust lines connect.
45. The system of claim 42 wherein the first exhaust line comprises multiple filters, the isolation valve in the first exhaust line being upstream of all filters in the first exhaust line.
46. The system of claim 42 wherein the second exhaust line comprises another pump downstream of the second exhaust line isolation valve and upstream of the vacuum pump.
47. The system of claim 42 wherein the another pump is of equal pumping capacity than that of the vacuum pump.
48. The system of claim 42 wherein the another pump is of greater pumping capacity than that of the vacuum pump.
49. A thermal chemical vapor deposition system, comprising:
a deposition chamber within which a substrate to be deposited upon is to be received;
first and second fluid parallel exhaust lines in fluid communication with the chamber downstream thereof, the first and second exhaust lines being in downstream fluid parallel communication with a vacuum pump;
the first exhaust line comprising an isolation valve; and
the second exhaust line comprising an isolation valve and another pump downstream of the second exhaust line isolation valve and upstream of the vacuum pump.
50. The system of claim 49 comprising at least one foreline extending from the chamber, the first and second exhaust lines being in fluid connection with a single of the at least one foreline.
51. The system of claim 49 comprising a single vacuum pump feed line to which each of the first and second exhaust lines connect.
52. The system of claim 49 wherein the another pump is of equal pumping capacity than that of the vacuum pump.
53. The system of claim 49 wherein the another pump is of greater pumping capacity than that of the vacuum pump.
54. A thermal chemical vapor deposition system, comprising:
a deposition chamber within which a substrate to be deposited upon is to be received;
first and second fluid parallel exhaust lines in fluid communication with the chamber downstream thereof, the first and second exhaust lines being in downstream fluid parallel communication with a vacuum pump;
the first exhaust line comprising multiple filters and an isolation valve upstream of all filters in the first exhaust line; and
the second exhaust line comprising an isolation valve and another pump downstream of the second exhaust line isolation valve and upstream of the vacuum pump, the second exhaust line being devoid of any filters.
55. A thermal chemical vapor deposition system, comprising:
a deposition chamber within which a substrate to be deposited upon is to be received;
a foreline extending from the chamber;
first and second fluid parallel exhaust lines in fluid communication with the foreline;
a vacuum pump downstream of the foreline, the vacuum pump comprising a single vacuum pump feed line;
the first and second exhaust lines being in downstream fluid parallel communication with the vacuum pump feed line;
the first exhaust line comprising multiple filters and an isolation valve upstream of all filters in the first exhaust line; and
the second exhaust line comprising an isolation valve and another pump downstream of the second exhaust line isolation valve and upstream of the vacuum pump, the second exhaust line being devoid of any filters.
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US20080289495A1 (en) | 2007-05-21 | 2008-11-27 | Peter Eisenberger | System and Method for Removing Carbon Dioxide From an Atmosphere and Global Thermostat Using the Same |
US8500857B2 (en) | 2007-05-21 | 2013-08-06 | Peter Eisenberger | Carbon dioxide capture/regeneration method using gas mixture |
US20140130670A1 (en) | 2012-11-14 | 2014-05-15 | Peter Eisenberger | System and method for removing carbon dioxide from an atmosphere and global thermostat using the same |
JP5492789B2 (en) * | 2008-12-12 | 2014-05-14 | 東京エレクトロン株式会社 | Film forming method and film forming apparatus |
JP5932771B2 (en) | 2010-04-30 | 2016-06-08 | ピーター・アイゼンベルガー | System and method for capturing and sequestering carbon dioxide |
US9028592B2 (en) | 2010-04-30 | 2015-05-12 | Peter Eisenberger | System and method for carbon dioxide capture and sequestration from relatively high concentration CO2 mixtures |
US20130095999A1 (en) * | 2011-10-13 | 2013-04-18 | Georgia Tech Research Corporation | Methods of making the supported polyamines and structures including supported polyamines |
US11059024B2 (en) | 2012-10-25 | 2021-07-13 | Georgia Tech Research Corporation | Supported poly(allyl)amine and derivatives for CO2 capture from flue gas or ultra-dilute gas streams such as ambient air or admixtures thereof |
EA201691356A1 (en) | 2013-12-31 | 2016-11-30 | Питер Айзенбергер | ROTATING SYSTEM FOR LAYER MOVEMENT WITH A MULTIPLE OF MONOLITHIC LAYERS TO REMOVE COAT OF THE ATMOSPHERE |
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