US20110220332A1 - Micro channel device temperature control - Google Patents
Micro channel device temperature control Download PDFInfo
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- US20110220332A1 US20110220332A1 US12/722,811 US72281110A US2011220332A1 US 20110220332 A1 US20110220332 A1 US 20110220332A1 US 72281110 A US72281110 A US 72281110A US 2011220332 A1 US2011220332 A1 US 2011220332A1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
- F28F7/02—Blocks traversed by passages for heat-exchange media
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/0093—Microreactors, e.g. miniaturised or microfabricated reactors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/502715—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L7/00—Heating or cooling apparatus; Heat insulating devices
- B01L7/52—Heating or cooling apparatus; Heat insulating devices with provision for submitting samples to a predetermined sequence of different temperatures, e.g. for treating nucleic acid samples
- B01L7/525—Heating or cooling apparatus; Heat insulating devices with provision for submitting samples to a predetermined sequence of different temperatures, e.g. for treating nucleic acid samples with physical movement of samples between temperature zones
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00781—Aspects relating to microreactors
- B01J2219/00783—Laminate assemblies, i.e. the reactor comprising a stack of plates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
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- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
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- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00781—Aspects relating to microreactors
- B01J2219/00873—Heat exchange
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00781—Aspects relating to microreactors
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- B01J2219/00876—Insulation elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00781—Aspects relating to microreactors
- B01J2219/0095—Control aspects
- B01J2219/00952—Sensing operations
- B01J2219/00954—Measured properties
- B01J2219/00961—Temperature
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- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/10—Integrating sample preparation and analysis in single entity, e.g. lab-on-a-chip concept
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/14—Process control and prevention of errors
- B01L2200/143—Quality control, feedback systems
- B01L2200/147—Employing temperature sensors
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/18—Means for temperature control
- B01L2300/1838—Means for temperature control using fluid heat transfer medium
- B01L2300/185—Means for temperature control using fluid heat transfer medium using a liquid as fluid
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2400/00—Moving or stopping fluids
- B01L2400/04—Moving fluids with specific forces or mechanical means
- B01L2400/0475—Moving fluids with specific forces or mechanical means specific mechanical means and fluid pressure
- B01L2400/0487—Moving fluids with specific forces or mechanical means specific mechanical means and fluid pressure fluid pressure, pneumatics
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/08—Embodiments of or processes related to ink-jet heads dealing with thermal variations, e.g. cooling
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
- F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the following generally relates to micro channel devices and more particularly to temperature control of one or more fluids respectively traversing one or more micro channels of a micro channel device.
- Micro channel devices include, but are not limited to, devices in which a small volume of a fluid is routed through a micro (sub-millimeter) channel of the device. Such devices have been used in biochip, lab-on-a-chip, inkjet printhead, and other micro channel based technologies.
- a temperature of a fluid traversing a micro channel of a micro channel device is controlled so that it is within a predetermined temperature range for processing, analysis, and/or other purposes. Controlling the temperature includes heating and/or cooling the fluid so that the temperature of the fluid is within the predetermined temperature range.
- One technique for heating and/or cooling the fluid involves using a Peltier device, which, generally, is a thermoelectric heat pump that transfers heat from one side of the Peltier device to the other side of the Peltier device.
- the Peltier device is placed in thermal communication with the micro channel device, and an appropriate voltage is applied to the Peltier device to create a temperature gradient for transferring heat between the sides of the Peltier device, either away from or towards the micro channel device.
- the polarity of the applied voltage determines whether the Peltier device heats up or cools down the fluid in the micro channel device.
- a Peltier device may require good mechanical/thermal contact between the Peltier device and the outside of the micro channel device. Such contact may require accurate and precise mechanical alignment and pressure. Furthermore, heat transfer via the Peltier device may be non-uniform through conduction via the side of the Peltier device in mechanical contact with the micro channel device. Furthermore, heat produced by the Peltier device may have to transfer through and thus may be absorbed by a thickness of a wall of the micro channel device before it reaches the desired channel(s). Moreover, using such a device may increase the thermal mass that participates in thermal cycling, which may increase the power required to implement thermal cycling.
- using a Peltier or similar device may increase the overall size of the micro channel device, power consumption and/or dissipation of the micro channel device, and/or the cost of the micro channel device, as well as provide non-uniform and/or relatively slow and inefficient temperature control.
- a micro channel device in one aspect, includes at least one micro channel and at least one heating/cooling channel.
- the at least one heating/cooling channel is in thermal communication with the at least one micro channel.
- a temperature of a heating/cooling fluid in the least one heating/cooling channel determines a temperature of a fluid in the at least one micro channel.
- a method in another aspect, includes controlling a temperature of a fluid in a micro channel of a micro device through a temperature of a heating/cooling fluid in a heating/cooling channel that is in thermal communication with the micro channel.
- a micro channel device in another aspect, includes a micro channel and means, internal to the micro channel device, for controlling a temperature of a fluid in the micro channel.
- FIG. 1 illustrates an example micro channel device with temperature control internal to the device
- FIG. 2 illustrates a cross-sectional view of the example micro channel device of FIG. 1 ;
- FIGS. 3-12 illustrate non-limiting embodiments of different arrangements of micro channels and heating/cooling channels of the micro channel device
- FIGS. 13-14 illustrate non-limiting embodiments of micro channels and/or heating/cooling channels of the micro channel device.
- FIG. 15 illustrates a method for controlling a temperature of a fluid in a micro channel of the micro channel device via temperature control internal to the device.
- micro channel devices include device in which a volume of a fluid is transported through one or more micro (e.g., sub-millimeter, or nanometer to micron) channels or capillaries of the device.
- micro channels or capillaries of the device.
- examples of such a device include, but are not limited to, a biochip (e.g., for DNA, enzymatic, protein, etc. analysis), a lab-on-a-chip, an inkjet printhead, and/or other micro channel devices.
- FIGS. 1 and 2 illustrate a sub-section of an example micro channel device 100 .
- FIG. 1 shows a view looking down on the micro channel device 100
- FIG. 2 shows a cross-sectional view looking into the micro channel device 100 along line A-A of FIG. 1 .
- the micro channel device 100 includes a substrate 102 .
- the substrate 102 may include glass, silicon, a polymer(s), ceramic, and/or one or more other materials.
- the illustrated substrate 102 includes N micro channels 104 1 , 104 2 , 104 3 , . . . , 104 N , where N is an integer equal to or greater than one.
- the N micro channels are collectively referred to herein as micro channels 104 .
- the micro channels 104 are configured for routing one or more fluids 114 such as a liquid, a gas, or other fluid.
- a fluid control system 106 controls a flow of a fluid, such as one or more sample fluids 114 or other fluid, in a micro channel 104 .
- the illustrated fluid control system 106 is located off the micro channel device 100 and includes a pressure system with a pump, a valve, a sensor, and/or one or more other components.
- the fluid control system 106 controllably moves the fluid through the micro channel 104 via pressure (e.g., high pressure) from the pressure system.
- At least a sub-portion of the fluid control system 106 is located on the micro channel device 100 .
- components that may be located on the micro channel device 100 include, but are not limited to, one or more of a micro-pump, a micro-valve, a micro-sensor, and/or one or more other micro-components. Such components may be based on Micro Electro Mechanical Systems (MEMS) or other technology.
- MEMS Micro Electro Mechanical Systems
- At least one of the micro channels 104 is used to route a sample fluid to a processing region 108 where the sample fluid is processed.
- this may include moving a bio-sample through one or more stages such as one or more of a purification stage, a priming stage, an amplification stage (e.g., via polymerase chain reaction (PCR)), a separation stage (e.g., via electrophoresis), an analysis stage, and/or other stage.
- PCR polymerase chain reaction
- separation stage e.g., via electrophoresis
- the micro channel device 100 also includes at least one heating/cooling channel 110 .
- the illustrated embodiment includes a single heating/cooling channel 110 that is internal to the micro channel device 100 and that is in thermal communication with the micro channels 104 .
- the illustrated heating/cooling channel 110 is separated from the micro channels by a predetermined finite distance. The illustrated distance is for explanatory purposes and is not limiting; this distance may be larger or smaller.
- the heating/cooling channel 110 is in physical contact with at least one of the micro channels 104 . This may improve heat transfer efficiency relative to embodiments in which heat traverses through a portion of the micro channel device 100 before reaching the desired micro channel 104 .
- the heating/cooling channel 110 can be used to control the temperature of one or more fluids traversing one or more of the channels 104 to be within a predetermine temperature range.
- the at least one heating/cooling channel 110 can route a heating/cooling fluid 116 , such as liquid (e.g., water, oil, antifreeze, etc.), a gas (e.g., air, etc.), or other fluid, having a temperature within a predetermined temperature range.
- the predetermined temperature range of the heating/cooling fluid 116 corresponds to the predetermined temperature range of the fluid(s) 114 in the channels 104 .
- the heating/cooling fluid 116 facilitates heating or cooling the fluid in the micro channels 104 .
- a thermal insulator can be included in the micro channel device 100 to facilitate mitigating thermal paths to other regions of the micro channel device 100 .
- a temperature control system 112 controls a temperature of the heating/cooling fluid 116 and hence the temperature of the sample fluid 114 .
- the temperature controller 112 may include a temperature servomechanism or other feedback based system, and/or other system for dynamic temperature control.
- a temperature sensor 118 senses a temperature of the fluid in a micro channel 104 , and the temperature controller 112 controls the temperature of the heating/cooling fluid 116 based on the sensed temperature.
- the heating/cooling fluid can facilitate heating and/or cooling the fluid in a micro channel over a predetermined temperature range.
- suitable temperatures include temperatures in a range of about zero degrees Celsius (0° C.) to about one hundred degrees Celsius (100° C.), such as about fifty degrees Celsius (50° C.), about fifty-nine degrees Celsius (59° C.), about seventy-two degrees Celsius (72° C.), about ninety-five degrees Celsius (95° C.), and/or other temperatures.
- the same fluid control system 106 is used to control the flow of both the sample fluid 114 and the heating/cooling fluid 116 .
- different fluid control systems 106 are employed for controlling the flow of the fluid 114 and the heating/cooling fluid 116 .
- the relative geometry e.g., shape, size, etc.
- the components herein e.g., the micro channel device, the micro channels, the heating/cooling channels, etc.
- the relative geometry e.g., shape, size, etc.
- other geometries are contemplated herein.
- FIG. 3 illustrates an embodiment in which the heating/cooling channel 110 is in thermal communication with less than N of the micro channels 104 .
- FIG. 4 illustrates an embodiment in which the heating/cooling channel 110 includes at least a first heating/cooling channel 110 1 and a second heating/cooling channel 110 2 .
- the first heating/cooling channel 110 1 is in thermal communication with a first sub-set of the channels 104 and facilitates controlling the temperature of fluid flowing therein
- the second heating/cooling channel 110 2 is in thermal communication with a second sub-set of the channels 104 and facilitates controlling the temperature of fluid flowing therein.
- FIG. 5 illustrates an embodiment in which the heating/cooling channel 110 includes N heating/cooling channels 110 1 , 110 2 , 110 3 , . . . , 110 N , where N is an integer equal to or greater than one. These heating/cooling channels are collectively referred to herein as heating/cooling channels 110 . As shown, in this embodiment, each of the heating/cooling sub-channels 110 corresponds to a different one of the micro channels 104 . Note that at least one of the N heating/cooling channels 110 (channel 110 1 in the illustrated embodiment) is in physical contact with one of the micro channels 104 .
- FIG. 6 illustrates an embodiment with two-dimensional array of the micro channels 104 , or a N ⁇ M matrix 602 of the micro channels 104 .
- the heating/cooling channel 110 may be used to control the temperature of one or more fluids in one or more rows of the matrix.
- a row extends along a longitudinal axis 604 of the heating/cooling channel 110 .
- FIG. 7 illustrates an embodiment in which a single heating/cooling channel 110 is located between at least two rows of micro channels 104 and 704 .
- the heating/cooling channel 110 can be used to control the temperature of a fluid in either or both of the rows of micro channels 104 and 704 .
- FIG. 8 illustrates an embodiment in which a first heating/cooling channel 110 is used to control the temperature of a fluid in a first set of micro channels 104 and a second heating/cooling channel 810 is used to control the temperature of a fluid in a second set of micro channels 804 .
- the first and second heating/cooling channels 110 and 810 are located between the first and second micro channels 104 and 804 .
- a combination of the heating/cooling channels 110 and 810 can be used to control the temperature of a fluid in either or both of the micro channels 104 and 804 .
- FIG. 9 shows an embodiment that is substantially similar to FIG. 8 except that the first and second micro channels 104 and 804 are located between the first and second heating/cooling channels 110 and 810 .
- a single micro channel 104 may be located between the first and second heating/cooling channels 110 and 810 .
- one or both of the first and second heating/cooling channels 110 and 810 are used to control the temperature of fluid in the single micro channel 104 therebetween.
- FIG. 10 shows an embodiment in which at least one heating/cooling channel 110 extends perpendicular to multiple rows 1000 1 , 1000 2 , . . . , 1000 K of micro channels 104 , instead of along rows of heating/cooling channel 110 as shown in FIG. 6 .
- FIG. 11 shows an embodiment with a heating/cooling channel 1100 that includes recesses 1102 .
- the micro channels 104 are located, with respect to the recesses 1102 , at least partially in the recesses 1102 . This may improve heat transfer characteristics relative to an embodiment in which the surface area of the heating/cooling channel 1100 adjacent to the micro channel 104 is smaller.
- FIG. 12 shows an embodiment with heating/cooling channels 1200 located between the micro channels 104 in a row of micro channels 104 . Similar to FIG. 11 , the heating/cooling channels 1200 include recesses 1202 , and the micro channels 104 are located at least partially in the recesses 1202 .
- FIG. 13 illustrates an embodiment in which at least one channel (the micro channel 104 and/or the heating/cooling channel 110 ) extends diagonally along the device 100 . Other orientations are also contemplated herein.
- FIG. 14 illustrates an embodiment in which at least one channel (the micro channel 104 and/or the heating/cooling channel 110 ) is irregularly shaped. Other shaped channels are also contemplated herein.
- the heating/cooling channel 110 is located outside of the micro channel device 100 and in thermal communication with the micro channels 104 .
- a temperature of a fluid in a micro channel 104 can still be controlled as described herein by controlling the temperature of the heating/cooling fluid flowing through the heating/cooling channel 110 .
- FIG. 15 illustrates a method for regulating the temperature of fluid in one or more micro channels 104 of a micro channel device 100 .
- a temperature of a heating/cooling fluid is brought to within a predetermined temperature range.
- this includes employing the temperature control system 112 to control the temperature of the heating/cooling fluid based on the predetermined temperature range.
- the heating/cooling fluid which is at the predetermined temperature, is routed through a heating/cooling channel 110 that is in thermal communication with a micro channel 104 .
- this includes employing the fluid control system 106 to control the flow of the heating/cooling fluid in a heating/cooling channel 110 .
- a fluid in the micro channel 104 is heated or cooled to be within a predetermined temperature range based on the temperature of the heating/cooling fluid flowing through the heating/cooling channel 110 .
- the heated or cooled fluid is moved through the micro channel 104 via the fluid control system 106 , for example, for subsequent processing.
Abstract
A micro channel device includes at least one micro channel and at least one heating/cooling channel. The at least one heating/cooling channel is in thermal communication with the at least one micro channel. A temperature of a heating/cooling fluid in the least one heating/cooling channel determines a temperature of a fluid in the at least one micro channel.
Description
- The following generally relates to micro channel devices and more particularly to temperature control of one or more fluids respectively traversing one or more micro channels of a micro channel device.
- Micro channel devices include, but are not limited to, devices in which a small volume of a fluid is routed through a micro (sub-millimeter) channel of the device. Such devices have been used in biochip, lab-on-a-chip, inkjet printhead, and other micro channel based technologies. In some instances, a temperature of a fluid traversing a micro channel of a micro channel device is controlled so that it is within a predetermined temperature range for processing, analysis, and/or other purposes. Controlling the temperature includes heating and/or cooling the fluid so that the temperature of the fluid is within the predetermined temperature range.
- One technique for heating and/or cooling the fluid involves using a Peltier device, which, generally, is a thermoelectric heat pump that transfers heat from one side of the Peltier device to the other side of the Peltier device. With this technique, the Peltier device is placed in thermal communication with the micro channel device, and an appropriate voltage is applied to the Peltier device to create a temperature gradient for transferring heat between the sides of the Peltier device, either away from or towards the micro channel device. The polarity of the applied voltage determines whether the Peltier device heats up or cools down the fluid in the micro channel device.
- Unfortunately, a Peltier device (or the like) may require good mechanical/thermal contact between the Peltier device and the outside of the micro channel device. Such contact may require accurate and precise mechanical alignment and pressure. Furthermore, heat transfer via the Peltier device may be non-uniform through conduction via the side of the Peltier device in mechanical contact with the micro channel device. Furthermore, heat produced by the Peltier device may have to transfer through and thus may be absorbed by a thickness of a wall of the micro channel device before it reaches the desired channel(s). Moreover, using such a device may increase the thermal mass that participates in thermal cycling, which may increase the power required to implement thermal cycling.
- As a consequence, using a Peltier or similar device may increase the overall size of the micro channel device, power consumption and/or dissipation of the micro channel device, and/or the cost of the micro channel device, as well as provide non-uniform and/or relatively slow and inefficient temperature control.
- Aspects of the application address the above matters, and others.
- In one aspect, a micro channel device includes at least one micro channel and at least one heating/cooling channel. The at least one heating/cooling channel is in thermal communication with the at least one micro channel. A temperature of a heating/cooling fluid in the least one heating/cooling channel determines a temperature of a fluid in the at least one micro channel.
- In another aspect, a method includes controlling a temperature of a fluid in a micro channel of a micro device through a temperature of a heating/cooling fluid in a heating/cooling channel that is in thermal communication with the micro channel.
- In another aspect, a micro channel device includes a micro channel and means, internal to the micro channel device, for controlling a temperature of a fluid in the micro channel.
- Those skilled in the art will recognize still other aspects of the present application upon reading and understanding the attached description.
- The application is illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements and in which:
-
FIG. 1 illustrates an example micro channel device with temperature control internal to the device; -
FIG. 2 illustrates a cross-sectional view of the example micro channel device ofFIG. 1 ; -
FIGS. 3-12 illustrate non-limiting embodiments of different arrangements of micro channels and heating/cooling channels of the micro channel device; -
FIGS. 13-14 illustrate non-limiting embodiments of micro channels and/or heating/cooling channels of the micro channel device; and -
FIG. 15 illustrates a method for controlling a temperature of a fluid in a micro channel of the micro channel device via temperature control internal to the device. - The following relates to micro channel devices. Such devices include device in which a volume of a fluid is transported through one or more micro (e.g., sub-millimeter, or nanometer to micron) channels or capillaries of the device. Examples of such a device include, but are not limited to, a biochip (e.g., for DNA, enzymatic, protein, etc. analysis), a lab-on-a-chip, an inkjet printhead, and/or other micro channel devices.
-
FIGS. 1 and 2 illustrate a sub-section of an examplemicro channel device 100.FIG. 1 shows a view looking down on themicro channel device 100, andFIG. 2 shows a cross-sectional view looking into themicro channel device 100 along line A-A ofFIG. 1 . - The
micro channel device 100 includes asubstrate 102. Thesubstrate 102 may include glass, silicon, a polymer(s), ceramic, and/or one or more other materials. The illustratedsubstrate 102 includes Nmicro channels micro channels 104. Themicro channels 104 are configured for routing one ormore fluids 114 such as a liquid, a gas, or other fluid. - A
fluid control system 106 controls a flow of a fluid, such as one ormore sample fluids 114 or other fluid, in amicro channel 104. The illustratedfluid control system 106 is located off themicro channel device 100 and includes a pressure system with a pump, a valve, a sensor, and/or one or more other components. Thefluid control system 106 controllably moves the fluid through themicro channel 104 via pressure (e.g., high pressure) from the pressure system. - In another embodiment, at least a sub-portion of the
fluid control system 106 is located on themicro channel device 100. Examples of components that may be located on themicro channel device 100 include, but are not limited to, one or more of a micro-pump, a micro-valve, a micro-sensor, and/or one or more other micro-components. Such components may be based on Micro Electro Mechanical Systems (MEMS) or other technology. - In the illustrated embodiment, at least one of the
micro channels 104 is used to route a sample fluid to aprocessing region 108 where the sample fluid is processed. In the case of DNA analysis, this may include moving a bio-sample through one or more stages such as one or more of a purification stage, a priming stage, an amplification stage (e.g., via polymerase chain reaction (PCR)), a separation stage (e.g., via electrophoresis), an analysis stage, and/or other stage. - The
micro channel device 100 also includes at least one heating/cooling channel 110. The illustrated embodiment includes a single heating/cooling channel 110 that is internal to themicro channel device 100 and that is in thermal communication with themicro channels 104. The illustrated heating/cooling channel 110 is separated from the micro channels by a predetermined finite distance. The illustrated distance is for explanatory purposes and is not limiting; this distance may be larger or smaller. In one non-limiting instance, the heating/cooling channel 110 is in physical contact with at least one of themicro channels 104. This may improve heat transfer efficiency relative to embodiments in which heat traverses through a portion of themicro channel device 100 before reaching the desiredmicro channel 104. - The heating/
cooling channel 110 can be used to control the temperature of one or more fluids traversing one or more of thechannels 104 to be within a predetermine temperature range. By way of example, the at least one heating/cooling channel 110 can route a heating/cooling fluid 116, such as liquid (e.g., water, oil, antifreeze, etc.), a gas (e.g., air, etc.), or other fluid, having a temperature within a predetermined temperature range. Generally, the predetermined temperature range of the heating/cooling fluid 116 corresponds to the predetermined temperature range of the fluid(s) 114 in thechannels 104. The heating/cooling fluid 116 facilitates heating or cooling the fluid in themicro channels 104. - A thermal insulator can be included in the
micro channel device 100 to facilitate mitigating thermal paths to other regions of themicro channel device 100. - A
temperature control system 112 controls a temperature of the heating/cooling fluid 116 and hence the temperature of thesample fluid 114. Thetemperature controller 112 may include a temperature servomechanism or other feedback based system, and/or other system for dynamic temperature control. In the illustrated embodiment, atemperature sensor 118 senses a temperature of the fluid in amicro channel 104, and thetemperature controller 112 controls the temperature of the heating/cooling fluid 116 based on the sensed temperature. - The heating/cooling fluid can facilitate heating and/or cooling the fluid in a micro channel over a predetermined temperature range. Examples of suitable temperatures include temperatures in a range of about zero degrees Celsius (0° C.) to about one hundred degrees Celsius (100° C.), such as about fifty degrees Celsius (50° C.), about fifty-nine degrees Celsius (59° C.), about seventy-two degrees Celsius (72° C.), about ninety-five degrees Celsius (95° C.), and/or other temperatures.
- In the illustrated embodiment, the same
fluid control system 106 is used to control the flow of both thesample fluid 114 and the heating/cooling fluid 116. In another embodiment, differentfluid control systems 106 are employed for controlling the flow of the fluid 114 and the heating/cooling fluid 116. - It is to be appreciated that the relative geometry (e.g., shape, size, etc.) of the components herein (e.g., the micro channel device, the micro channels, the heating/cooling channels, etc.) are provided for explanatory purposes and are not limiting, and other geometries are contemplated herein.
- Variations are contemplated.
-
FIG. 3 illustrates an embodiment in which the heating/cooling channel 110 is in thermal communication with less than N of themicro channels 104. -
FIG. 4 illustrates an embodiment in which the heating/cooling channel 110 includes at least a first heating/cooling channel 110 1 and a second heating/cooling channel 110 2. The first heating/cooling channel 110 1 is in thermal communication with a first sub-set of thechannels 104 and facilitates controlling the temperature of fluid flowing therein, and the second heating/cooling channel 110 2 is in thermal communication with a second sub-set of thechannels 104 and facilitates controlling the temperature of fluid flowing therein. -
FIG. 5 illustrates an embodiment in which the heating/cooling channel 110 includes N heating/cooling channels cooling channels 110. As shown, in this embodiment, each of the heating/cooling sub-channels 110 corresponds to a different one of themicro channels 104. Note that at least one of the N heating/cooling channels 110 (channel 110 1 in the illustrated embodiment) is in physical contact with one of themicro channels 104. -
FIG. 6 illustrates an embodiment with two-dimensional array of themicro channels 104, or a N×M matrix 602 of themicro channels 104. With this embodiment, the heating/cooling channel 110 may be used to control the temperature of one or more fluids in one or more rows of the matrix. InFIG. 6 , a row extends along alongitudinal axis 604 of the heating/cooling channel 110. -
FIG. 7 illustrates an embodiment in which a single heating/cooling channel 110 is located between at least two rows ofmicro channels cooling channel 110 can be used to control the temperature of a fluid in either or both of the rows ofmicro channels -
FIG. 8 illustrates an embodiment in which a first heating/cooling channel 110 is used to control the temperature of a fluid in a first set ofmicro channels 104 and a second heating/cooling channel 810 is used to control the temperature of a fluid in a second set ofmicro channels 804. In this embodiment, the first and second heating/cooling channels micro channels - With respect to
FIG. 8 , in another instance, a combination of the heating/cooling channels micro channels -
FIG. 9 shows an embodiment that is substantially similar toFIG. 8 except that the first and secondmicro channels cooling channels - With respect to
FIG. 9 , in another instance, a singlemicro channel 104 may be located between the first and second heating/cooling channels cooling channels micro channel 104 therebetween. -
FIG. 10 shows an embodiment in which at least one heating/cooling channel 110 extends perpendicular tomultiple rows micro channels 104, instead of along rows of heating/cooling channel 110 as shown inFIG. 6 . -
FIG. 11 shows an embodiment with a heating/cooling channel 1100 that includes recesses 1102. In this embodiment, themicro channels 104 are located, with respect to therecesses 1102, at least partially in therecesses 1102. This may improve heat transfer characteristics relative to an embodiment in which the surface area of the heating/cooling channel 1100 adjacent to themicro channel 104 is smaller. -
FIG. 12 shows an embodiment with heating/cooling channels 1200 located between themicro channels 104 in a row ofmicro channels 104. Similar toFIG. 11 , the heating/cooling channels 1200 includerecesses 1202, and themicro channels 104 are located at least partially in therecesses 1202. -
FIG. 13 illustrates an embodiment in which at least one channel (themicro channel 104 and/or the heating/cooling channel 110) extends diagonally along thedevice 100. Other orientations are also contemplated herein. -
FIG. 14 illustrates an embodiment in which at least one channel (themicro channel 104 and/or the heating/cooling channel 110) is irregularly shaped. Other shaped channels are also contemplated herein. - In still another embodiment, the heating/
cooling channel 110 is located outside of themicro channel device 100 and in thermal communication with themicro channels 104. In this instance, a temperature of a fluid in amicro channel 104 can still be controlled as described herein by controlling the temperature of the heating/cooling fluid flowing through the heating/cooling channel 110. - Other embodiments, including combinations of the above, are also contemplated herein.
-
FIG. 15 illustrates a method for regulating the temperature of fluid in one or moremicro channels 104 of amicro channel device 100. - At 1500, a temperature of a heating/cooling fluid is brought to within a predetermined temperature range.
- As described herein, in one non-limiting instance this includes employing the
temperature control system 112 to control the temperature of the heating/cooling fluid based on the predetermined temperature range. - At 1502, the heating/cooling fluid, which is at the predetermined temperature, is routed through a heating/
cooling channel 110 that is in thermal communication with amicro channel 104. - As described herein, in one non-limiting instance this includes employing the
fluid control system 106 to control the flow of the heating/cooling fluid in a heating/cooling channel 110. - At 1504, a fluid in the
micro channel 104 is heated or cooled to be within a predetermined temperature range based on the temperature of the heating/cooling fluid flowing through the heating/cooling channel 110. - At 1506, the heated or cooled fluid is moved through the
micro channel 104 via thefluid control system 106, for example, for subsequent processing. - The application has been described with reference to various embodiments. Modifications and alterations will occur to others upon reading the application. It is intended that the invention be construed as including all such modifications and alterations, including insofar as they come within the scope of the appended claims and the equivalents thereof.
Claims (20)
1. A micro channel device, comprising:
at least one micro channel; and
at least one heating/cooling channel in thermal communication with the at least one micro channel, wherein a temperature of a heating/cooling fluid in the least one heating/cooling channel determines a temperature of a fluid in the at least one micro channel.
2. The device of claim 1 , further comprising:
a fluid control system that controls a flow of the heating/cooling fluid in the least one heating/cooling channel.
3. The device of claim 2 , the fluid control system further comprising:
a pressure system, wherein the fluid control system controls the flow of the heating/cooling fluid in the least one heating/cooling channel via pressure.
4. The device of claim 3 , wherein the fluid control system controls a flow of the fluid in the least one micro channel via pressure.
5. The device of claim 1 , further comprising:
a temperature control system that controls the temperature of the heating/cooling fluid.
6. The device of claim 5 , wherein the temperature control system includes a temperature servomechanism that dynamically controls the temperature of the heating/cooling fluid based on a predetermined temperature range.
7. The device of claim 1 , wherein the at least one heating/cooling channel is internal to the micro channel device.
8. The device of claim 1 , wherein the at least one heating/cooling channel is part of the micro channel device.
9. The device of claim 1 , wherein the micro channel device includes a biochip.
10. The device of claim 9 , wherein the biochip includes at least one region configured for DNA analysis of the fluid.
11. The device of claim 1 , wherein the heating/cooling fluid is air.
12. The device of claim 1 , wherein the heating/cooling fluid is a liquid.
13. The device of claim 1 , wherein the at least one heating/cooling channel is in physical contact with the at least one micro channel.
14. A method, comprising:
controlling a temperature of a fluid in a micro channel of a micro channel device through a temperature of a heating/cooling fluid in a heating/cooling channel that is in thermal communication with the micro channel.
15. The method of claim 14 , further comprising:
controlling the temperature of the heating/cooling fluid based on a predetermined temperature range that corresponds to a temperature range for processing the fluid.
16. The method of claim 15 , wherein the temperature of the heating/cooling fluid is controlled through a servomechanism.
17. The method of claim 14 , further comprising,
controlling a flow of the heating/cooling fluid in the heating/cooling channel via pressure.
18. The method of claim 17 , further comprising,
controlling a flow of the fluid in the micro channel and the flow of the heating/cooling fluid in the heating/cooling channel with a same fluid control system.
19. The method of claim 14 , wherein the fluid includes a bio-sample, and further comprising:
controlling the temperature of the fluid for DNA analysis of the bio-sample.
20. A micro channel device, comprising:
a micro channel; and
means, internal to the micro channel device, for controlling a temperature of a fluid in the micro channel.
Priority Applications (2)
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US12/722,811 US20110220332A1 (en) | 2010-03-12 | 2010-03-12 | Micro channel device temperature control |
US13/903,239 US9050030B2 (en) | 2006-02-24 | 2013-05-28 | Zone extension systems and methods |
Applications Claiming Priority (1)
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US12/722,811 US20110220332A1 (en) | 2010-03-12 | 2010-03-12 | Micro channel device temperature control |
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US11/676,094 Continuation US7717562B2 (en) | 2006-02-24 | 2007-02-16 | Scaling Zernike coefficients to smaller pupil sizes for refractive treatments |
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US13/008,488 Continuation-In-Part US8454160B2 (en) | 2006-02-24 | 2011-01-18 | Zone extension systems and methods |
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US12/722,811 Abandoned US20110220332A1 (en) | 2006-02-24 | 2010-03-12 | Micro channel device temperature control |
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