US20110139430A1 - Heat dissipation system - Google Patents
Heat dissipation system Download PDFInfo
- Publication number
- US20110139430A1 US20110139430A1 US12/996,983 US99698309A US2011139430A1 US 20110139430 A1 US20110139430 A1 US 20110139430A1 US 99698309 A US99698309 A US 99698309A US 2011139430 A1 US2011139430 A1 US 2011139430A1
- Authority
- US
- United States
- Prior art keywords
- cold source
- electronic
- housing
- lid
- aircraft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
A system for dissipating heat generated by an electronic system, for example an electronic device in an aircraft. The system includes a housing including an external lid covering the electronic system and configured to be in contact with a first cold source, and a second cold source located inside the external lid. The housing includes an internal lid located inside the external lid and covering the electronic system, the second cold source being located between the internal and external lids.
Description
- This invention relates to a heat dissipation system.
- It applies especially to a system for dissipation of the heat produced by an electronic system, in particular by an electronic equipment item in an aircraft.
- Electronic systems heat up during their operation. The reliability and the quality of electronic systems are highly dependent on the temperature to which they are subjected. In fact, if the electronic systems are subjected to excessively high temperatures, they may exhibit failures.
- The heat produced by the operation of an electronic system therefore must be dissipated and directed toward a cold source. In order to facilitate that, the thermal resistance between the system and the cold source must be reduced to the minimum.
- Nonetheless, if the temperature of the cold source varies markedly, the temperature of the electronic system undergoes temperature changes.
- The reliability of electronic systems that are subjected to great temperature variations is considerably reduced and their aging is accelerated.
- Furthermore, in an aircraft, it is advantageous to position certain electronic equipment items outside protected zones of the aircraft. The thermal conditions in these unprotected zones are close to conditions outside the aircraft.
- For example, unprotected zones are the tail cone or the interior of the wing group of the aircraft.
- In this way, electronic equipment items are subjected to environmental stresses, and in particular to extreme thermal conditions.
- Consequently, the reliability of such electronic equipment items is reduced and their aging accelerated.
- There thus is known in
document EP 1 615 488 a printed circuit accommodated in a housing and in contact with an interface layer forming a heat sink. Such a heat dissipation system, however, is limited to the use of a cold source in contact with the electronic system. - This invention has as a purpose to propose a heat dissipation system making it possible at the same time to reduce the effect of thermal variations of the cold source on the electronic equipment in an aircraft.
- To this end, this invention relates according to a first aspect to a system for dissipation of the heat produced by an electronic system, in particular by an electronic equipment item in an aircraft, the dissipation system comprising a housing that includes an external lid covering the electronic system and adapted for being in contact with a first cold source, and a second cold source located inside the external lid.
- According to the invention, the housing comprises an internal lid located inside the external lid and covering the electronic system, the second cold source being located between the internal and external lids.
- In this way, the housing and the second cold source (which are disposed between the electronic system and the first cold source) mitigate the effect of the temperature variations of the first cold source on the electronic system. Consequently, the electronic system only slightly undergoes the temperatures variations of the first cold source, while allowing dissipation of the heat produced by the electronic system.
- Furthermore, the internal lid protects the electronic system from contact with the second cold source.
- According to a preferred characteristic, the internal lid and the external lid form a cavity containing the second cold source.
- In this way, the electronic system is surrounded by the second cold source, and consequently insulated from the first cold source. The effect of temperature changes of the first cold source on the electronic system thus is minimized.
- Consequently, if for example, the first cold source is the ambient air, the heat produced by the electronic equipment in an aircraft is directed toward the ambient air, and at the same time the electronic system is insulated from the ambient air and less exposed to the stresses of the environment.
- Moreover, the electronic equipment only slightly undergoes the temperature changes of the environment.
- In fact, it is necessary to extract the heat dissipated by the electronic equipment and at the same time to protect the electronic equipment from the effect of extreme thermal conditions.
- According to one embodiment, the second cold source has a heat capacity value greater than the heat capacity value of the first cold source.
- In this way, the second cold source absorbs the temperature variations of the first cold source and the electronic system only slightly undergoes the temperature variations of the first cold source, while allowing dissipation of the heat produced by the electronic system.
- The second cold source advantageously comprises water.
- By virtue of the significant heat capacity of the water, the temperature changes of the ambient air are tempered by the water.
- In practice, the housing comprises six faces, a first face being fastened to a support and the other five faces being adapted for being in contact with the first cold source.
- In this way, the surface of the housing through which the heat produced by the electronic system is transmitted toward the first cold source is maximized.
- According to a second aspect, the invention applies to an aircraft comprising a dissipation system according to the invention.
- Consequently, when the dissipation system according to the invention is used in order to dissipate the heat produced by an electronic equipment item located in a non-pressurized zone of an aircraft, the reliability and service life of the electronic equipment are increased.
- This aircraft has characteristics and advantages similar to those described above in relation to the dissipation system.
- Other features and advantages also will become apparent in the description below.
- In the attached drawings, provided by way of non-limitative examples:
-
FIG. 1 is a diagram illustrating a longitudinal section of a dissipation system according to an embodiment of the invention; -
FIG. 2 a shows the evolution of the temperature of a first cold source in time; -
FIG. 2 b shows the evolution of the temperature of a second cold source in time; and -
FIG. 2 c shows the evolution of the temperature of an electronic system in time. - A dissipation system according to an embodiment of the invention first is going to be described with reference to
FIG. 1 . - An
electronic board 1 comprising an electronic system is fastened on a support orrack 2. - A
lid 3 also is fastened torack 2, forming therewith a housing 4. In this way, this housing 4 encloses and protects the outside of theelectronic board 1. - In this way, the dimensions of housing 4 are according to the dimensions of
electronic board 1. - In this example, housing 4 has a parallelepiped shape.
- By way of example in no way limitative, the length and the width of the housing may be in a range from 200 to 500 mm and the height may be in a range from 20 to 300 mm.
- The housing, for example, may be made of aluminum or of composite materials.
- Of course, the dimensions and materials in which the housings are constructed may be different.
- Here, the outside of housing 4 is in contact with
ambient air 5, which represents a firstcold source 5. - In fact, the heat produced by
electronic board 1 is directed towardcold source 5, that is to say towardambient air 5, through housing 4. - Housing 4 comprises an
internal lid 8 located insideexternal lid 3 and covering electronic system 1 (here, electronic board 1). - In this way,
internal lid 8 is disposed betweenelectronic board 1 andexternal lid 3. -
Lids cavity 6. Thiscavity 6 comprises a material that constitutes a secondcold source 6 a. - The heat capacity of second
cold source 6 a is of a value greater than that of firstcold source 5, that is to say that the second cold source requires a thermal energy supply greater than the first cold source in order to undergo a temperature increase. - Here, the material making up second
cold source 6 a is mainly water, such as for example propylene glycol-water. - In this embodiment, for an electronic equipment item or
system 1 occupying a volume of 800 ml (volume equivalent to a rise in the water level generated by the immersion of the electronic equipment orsystem 1 in a tank filled with water), the volume of water inside thecavity 6 is 330 ml. -
Internal lid 8 protectselectronic board 1 from contact with the material making up secondcold source 6 a, here water. - Of course, the volume may have different values.
- Furthermore, other materials with high heat capacity value may be used, such as, for example, Galden® (marketed by SOLVAY) or methoxy-nanofluorobutane.
- The heat capacity (Cth) of the materials is calculated by means of the following formula known to the individual skilled in the art:
-
Cth=p×Cp×V - in which p is the density of the material, Cp is the mass heat capacity of the material and V the volume of material used.
- In this way, for example, the heat capacity per unit volume of the air, the water and the aluminum has the following values:
-
Cth air=1.2 kg/m3×1,407 J/(kg.K)×V=1,688 J/m3 ×V -
Cth water=1,000 kg/m3×4,180 J/(kg.K)×V=4,180,000 J/m3 ×V -
Cth al=2,800 kg/m3×910 J/(kg.K)×V=2,548,000 J/m3 ×V - Housing 4 is fastened by one of these
faces 4 a to asupport 7, the five other remaining faces being in contact with firstcold source 5. - In this way, the five faces in contact with first cold source 5 (here, the ambient air) make it possible to exchange the heat dissipated by
electronic board 1 withambient air 5 by natural convection. - It will be noted that the size and the material in which housing 4 is constructed have an impact on the heat exchange capacity between second
cold source 6 a and housing 4 and between housing 4 and firstcold source 5. - In other embodiments, housing 4 may be adapted for increasing (or for decreasing) its heat exchange capacity with
ambient air 5, for example by increasing (or by decreasing) the surface of housing 4 in contact withambient air 5 or by modifying the material in which housing 4 is made up. - One way to increase the surface of housing 4 in contact with
ambient air 5, without, for all that, increasing the volume of housing 4, is to add blades. - Of course, other means of heat exchange may be used, for example forced convection.
- In fact, there are temperature exchanges between
electronic board 1 andwater 6 a, and betweenwater 6 a and ambient air 5 (through the housing) instead of exchanges betweenelectronic board 1 andambient air 5 directly. - By virtue of the high heat capacity value of second
cold source 6 a,electronic board 1 undergoes the temperature variations ofambient air 5 to a lesser extent. In fact, the temperature changes ofambient air 5 are mitigated bywater 6 a. - As may be seen on
FIG. 2 a, the temperature ofambient air 5 surrounding an aircraft may vary very considerably, and for example it may vary between −55° and 80° C.FIG. 2 a shows a variation of the temperature ofambient air 5 outside the aircraft in time. The temperature changes are cyclic, corresponding, for example, to flight frequency. - On
FIG. 2 b, it may be seen that the temperature of secondcold source 6 a absorbs these changes in temperature, the latter varying between −35° and 20° C. As forFIG. 2 a, the temperature variation is expressed according to time. - Thus, by virtue of the presence of second
cold source 6 a with high heat exchange value, disposed between firstcold source 5 andelectronic board 1, the temperature ofelectronic board 1 also varies between −35° and 20° C., as can be seen onFIG. 2 c. As forFIGS. 2 a and 2 b, the temperature variation is expressed according to time. - In this way, by virtue of the invention, it is possible to increase the reliability and the service life of the electronic equipment items of an aircraft which are located in unprotected zones of the aircraft, the equipment items thus being exposed to considerable temperature variations.
- Of course, many modifications may be made to the exemplary implementations described above without departing from the context of the invention.
- For example, the materials used as second cold source may be varied.
- Furthermore, the housing may comprise a different number of lids, and may have varied shapes.
Claims (7)
1-6. (canceled)
7. A system for dissipation of heat produced by an electronic system, or by an electronic equipment item in an aircraft, comprising:
a housing that includes an external lid covering the electronic system and configured to be in contact with a first cold source, and a second cold source located inside the external lid,
wherein the housing further includes an internal lid located inside the external lid and covering the electronic system, the second cold source being located between the internal and external lids.
8. A dissipation system according to claim 7 , wherein the internal lid and the external lid form a cavity containing the second cold source.
9. A dissipation system according to claim 7 , wherein the second cold source has a heat capacity value greater than a heat capacity value of the first cold source.
10. A dissipation system according to claim 7 , wherein the housing comprises six faces, a first face being fastened to a support and the other five faces being configured to be in contact with the first cold source.
11. A dissipation system according to claim 7 , wherein the second cold source comprises water.
12. An aircraft, comprising:
a dissipation system according to claim 7 .
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR08/53838 | 2008-06-10 | ||
FR0853838A FR2932356B1 (en) | 2008-06-10 | 2008-06-10 | HEAT DISSIPATION SYSTEM |
PCT/FR2009/000694 WO2010000974A1 (en) | 2008-06-10 | 2009-06-10 | Heat dissipation system |
Publications (1)
Publication Number | Publication Date |
---|---|
US20110139430A1 true US20110139430A1 (en) | 2011-06-16 |
Family
ID=40104685
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/996,983 Abandoned US20110139430A1 (en) | 2008-06-10 | 2009-06-10 | Heat dissipation system |
Country Status (4)
Country | Link |
---|---|
US (1) | US20110139430A1 (en) |
EP (1) | EP2289292B1 (en) |
FR (1) | FR2932356B1 (en) |
WO (1) | WO2010000974A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103996664A (en) * | 2014-05-30 | 2014-08-20 | 佐志温控技术(上海)有限公司 | Liquid forced cooling device of anti-backflow diode |
US20220127013A1 (en) * | 2020-10-23 | 2022-04-28 | CCX Technologies | Secure avioncs wireless access point device with heat sink enclosure |
Citations (30)
Publication number | Priority date | Publication date | Assignee | Title |
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FR1266244A (en) * | 1960-08-29 | 1961-07-07 | Sony Corp | Semiconductor cooling device |
US3957107A (en) * | 1975-02-27 | 1976-05-18 | The United States Of America As Represented By The Secretary Of The Air Force | Thermal switch |
US4395728A (en) * | 1979-08-24 | 1983-07-26 | Li Chou H | Temperature controlled apparatus |
US4649990A (en) * | 1985-05-06 | 1987-03-17 | Hitachi, Ltd. | Heat-conducting cooling module |
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US5463872A (en) * | 1994-09-08 | 1995-11-07 | International Business Machines Corporation | High performance thermal interface for low temperature electronic modules |
US5621615A (en) * | 1995-03-31 | 1997-04-15 | Hewlett-Packard Company | Low cost, high thermal performance package for flip chips with low mechanical stress on chip |
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US6236568B1 (en) * | 1999-03-20 | 2001-05-22 | Siliconware Precision Industries, Co., Ltd. | Heat-dissipating structure for integrated circuit package |
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US6845627B1 (en) * | 2003-11-10 | 2005-01-25 | Be Intellectual Property, Inc. | Control system for an aircraft galley cooler |
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US20050201060A1 (en) * | 2003-12-26 | 2005-09-15 | Advanced Semiconductor Engineering, Inc. | Heat sink with built-in heat pipes for semiconductor packages |
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US20070181555A1 (en) * | 2006-02-09 | 2007-08-09 | Onscreen Technologies, Inc. | Method and apparatus for leak-proof mounting of a liquid cooling device on an integrated circuit |
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US20080087403A1 (en) * | 2006-10-12 | 2008-04-17 | Inventec Corporation | Liquid-gas circulation heat-dissipating unit |
US20080112137A1 (en) * | 2006-11-12 | 2008-05-15 | Ko Kang Hoon | Cooling device for inverter and ldc elements for hev |
US20080110593A1 (en) * | 2006-11-11 | 2008-05-15 | Rolls-Royce Plc | Cooling arrangement for electronics |
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-
2008
- 2008-06-10 FR FR0853838A patent/FR2932356B1/en active Active
-
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- 2009-06-10 US US12/996,983 patent/US20110139430A1/en not_active Abandoned
- 2009-06-10 EP EP09772657.4A patent/EP2289292B1/en active Active
- 2009-06-10 WO PCT/FR2009/000694 patent/WO2010000974A1/en active Application Filing
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FR1266244A (en) * | 1960-08-29 | 1961-07-07 | Sony Corp | Semiconductor cooling device |
US3957107A (en) * | 1975-02-27 | 1976-05-18 | The United States Of America As Represented By The Secretary Of The Air Force | Thermal switch |
US4395728A (en) * | 1979-08-24 | 1983-07-26 | Li Chou H | Temperature controlled apparatus |
US4796155A (en) * | 1983-11-29 | 1989-01-03 | Fujitsu Limited | Liquid cooling type high frequency solid state device |
US4649990A (en) * | 1985-05-06 | 1987-03-17 | Hitachi, Ltd. | Heat-conducting cooling module |
US5463872A (en) * | 1994-09-08 | 1995-11-07 | International Business Machines Corporation | High performance thermal interface for low temperature electronic modules |
US5621615A (en) * | 1995-03-31 | 1997-04-15 | Hewlett-Packard Company | Low cost, high thermal performance package for flip chips with low mechanical stress on chip |
US5880524A (en) * | 1997-05-05 | 1999-03-09 | Intel Corporation | Heat pipe lid for electronic packages |
US6127758A (en) * | 1997-09-17 | 2000-10-03 | Alliedsignal Inc. | Ram air turbine system |
US20010022219A1 (en) * | 1998-04-13 | 2001-09-20 | Masami Ikeda | Plate type heat pipe and its mounting structure |
US6236568B1 (en) * | 1999-03-20 | 2001-05-22 | Siliconware Precision Industries, Co., Ltd. | Heat-dissipating structure for integrated circuit package |
US6833674B2 (en) * | 2000-06-19 | 2004-12-21 | Pioneer Corporation | Heat-dissipation structure of plasma display panel device |
US6504720B2 (en) * | 2000-09-25 | 2003-01-07 | Kabushiki Kaisha Toshiba | Cooling unit for cooling heat generating component, circuit module including the cooling unit, and electronic apparatus mounted with the circuit module |
US6525420B2 (en) * | 2001-01-30 | 2003-02-25 | Thermal Corp. | Semiconductor package with lid heat spreader |
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US20060144566A1 (en) * | 2004-12-30 | 2006-07-06 | Jensen Kip B | System and method for cooling an integrated circuit device by electromagnetically pumping a fluid |
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US20070181555A1 (en) * | 2006-02-09 | 2007-08-09 | Onscreen Technologies, Inc. | Method and apparatus for leak-proof mounting of a liquid cooling device on an integrated circuit |
US20080087403A1 (en) * | 2006-10-12 | 2008-04-17 | Inventec Corporation | Liquid-gas circulation heat-dissipating unit |
US20080110593A1 (en) * | 2006-11-11 | 2008-05-15 | Rolls-Royce Plc | Cooling arrangement for electronics |
US20080112137A1 (en) * | 2006-11-12 | 2008-05-15 | Ko Kang Hoon | Cooling device for inverter and ldc elements for hev |
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Non-Patent Citations (1)
Title |
---|
http://www.solvay.com/en/markets-and-products/featured-products/Galden.html May 2017 Webpage * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103996664A (en) * | 2014-05-30 | 2014-08-20 | 佐志温控技术(上海)有限公司 | Liquid forced cooling device of anti-backflow diode |
US20220127013A1 (en) * | 2020-10-23 | 2022-04-28 | CCX Technologies | Secure avioncs wireless access point device with heat sink enclosure |
Also Published As
Publication number | Publication date |
---|---|
EP2289292A1 (en) | 2011-03-02 |
WO2010000974A1 (en) | 2010-01-07 |
FR2932356B1 (en) | 2011-03-25 |
EP2289292B1 (en) | 2017-08-09 |
FR2932356A1 (en) | 2009-12-11 |
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Owner name: AIRBUS OPERATIONS (S.A.S.), FRANCE Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:COLONGO, EMILE;REBEYROTTE, VINCENT;SIGNING DATES FROM 20110105 TO 20110128;REEL/FRAME:027137/0688 |
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