US20110070811A1 - Point of use recycling system for cmp slurry - Google Patents
Point of use recycling system for cmp slurry Download PDFInfo
- Publication number
- US20110070811A1 US20110070811A1 US12/730,079 US73007910A US2011070811A1 US 20110070811 A1 US20110070811 A1 US 20110070811A1 US 73007910 A US73007910 A US 73007910A US 2011070811 A1 US2011070811 A1 US 2011070811A1
- Authority
- US
- United States
- Prior art keywords
- polishing
- slurry
- unit
- stream
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The present invention generally relates to apparatus and method for recycling both polishing slurry and rinse water from CMP processes. The present invention also relates to rheology measurements and agglomeration prevention using centrifugal pumps.
Description
- This application claims benefit of U.S. Provisional Patent Application Ser. No. 61/211,156 (Attorney Docket No. 14199L01), filed Mar. 25, 2009, U.S. Provisional Patent Application Ser. No. 61/163,451 (Attorney Docket No. 14199L02), filed Mar. 26, 2009, U.S. Provisional Patent Application Ser. No. 61/170,413 (Attorney Docket No. 14199L03), filed Apr. 17, 2009, and U.S. Provisional Patent Application Ser. No. 61/185,424 (Attorney Docket No. 14199L04), filed Jun. 9, 2009. All the aforementioned patent applications are herein incorporated by reference.
- 1. Field of the Invention
- Embodiments of the present invention generally relate to apparatus and method for recycling polishing slurry and rinse water in a chemical mechanical polishing (CMP) system.
- 2. Background
- Due to the high cost of CMP polishing slurry recycling CMP polishing slurry from CMP process has been the subject of numerous studies. Polishing slurries are generally comprises about 3% to about 30% solid particles suspended in water. Polishing slurry generally accounts about 50% of CMP cost.
- However, recycling and reuse of CMP polishing slurries for use in semiconductor processing faces significant challenges. During CMP processing, particle concentration, particle size, particle homogeneity have profound effect in removal rate and defect reduction, therefore, must be carefully controlled. However, these factors are difficult to achieve in recycled polishing slurry because some particles are crushed and some of the particles agglomerate during polishing, and particles of removed materials enter into the polishing slurry.
- Additionally, recycling rinsing water is also of interest to reduce cost of ownership. However, there is concern that recycled water is not satisfactory to perform multiple rinses post polishing.
- Therefore, there is a need for apparatus and method for recycling polishing slurry and rinse water in a chemical mechanical polishing system.
- The present invention generally relates to apparatus and method for recycling both polishing slurry and rinse water from CMP processes.
- One embodiment of the present invention provides an apparatus for recycling comprising a first filtration unit, wherein the first filtration unit comprises an inlet configured to receive one or more of used polishing slurry, rinsing fluid, such as water, glycol or others, and polishing waste, a water outlet configured to output a first filtered stream for water recycling, and a chemical outlet configured to output a second stream for recycling polishing slurry, a second filtration unit, wherein the second filtration unit comprises an inlet connected with the chemical outlet of the first filtration unit, a product outlet configured to output a stream of recycled polishing slurry, and a water outlet configured to output another filtered stream for water recycling, and an optional UV (ultra violet) unit, wherein the UV unit comprises an inlet connected with the water outlet of the first and/or filtration unit, and an outlet configured to output a stream of UV treated fluid.
- Another embodiment of the present invention provides a method for recycling polishing fluid, comprising filtering one or more of used polishing slurry, rinsing fluid and polishing waste through a first filtration unit to generate a water stream and a suspension stream, filtering the suspension stream through a second filtration unit to separate a stream of reusable polishing slurry from a water stream, flowing the stream of reusable polishing slurry to a polishing slurry source for a polishing station, recycling the water stream, and flowing the recycled water stream to a recycled water source.
- Yet another embodiment of the present invention provides a chemical mechanical polishing system comprising one or more polishing stations, a polishing slurry unit configured to provide polishing slurry to the one or more polishing stations, a rinse water unit configured to provide rinse water to the one or more polishing stations, and a recycling unit configured to recycle polishing slurry and rinse water, wherein the recycling unit comprises a first filtration unit, wherein the first filtration unit comprises an inlet configured to receive a mixture of used polishing slurry, rinsing fluid, and polishing waste from the one or more polishing stations, a water outlet configured to output a first filtered stream for water recycling, and a chemical outlet configured to output a second stream for recycling polishing slurry, a second filtration unit, wherein the second filtration unit comprises an inlet connected with the chemical outlet of the first filtration unit, a product outlet configured to output a stream of recycled polishing slurry to the polishing slurry unit, and a water outlet, to output another filtered stream for water recycling, an optional UV (ultra violet) unit, wherein the UV unit comprises an inlet connected with the water outlet of the first and/or second filtration unit, and an outlet configured to output a stream of UV treated water, and a treatment unit configured to purify the UV treated water by removing organic compounds, and or to kill bacteria wherein the treatment unit comprises, an inlet connected to the outlet of the UV unit, and an outlet configured to output a stream of purified water to the rinse water unit.
- So that the manner in which the above recited features of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments.
-
FIG. 1 is a schematic chart of a polishing system having a recycling unit in accordance with one embodiment of the present invention. -
FIG. 2A is a schematic chart of a polishing system having a recycling unit in accordance with one embodiment of the present invention. -
FIG. 2B is a schematic chart of a polishing system having a recycling unit in accordance and a centrifugal separator with one embodiment of the present invention. -
FIG. 2C is a schematic chart of a polishing system having a recycling unit in accordance and a centrifugal separator with one embodiment of the present invention. -
FIG. 2D is a schematic chart of a polishing system having a diverter valve and a recycling unit in accordance with one embodiment of the present invention. -
FIG. 3 is a schematic chart of a polishing station having a dedicated recycled slurry source in accordance with another embodiment of the present invention. -
FIG. 4 is a schematic chart of a polishing station having a dedicated recycled rinse water source in accordance with another embodiment of the present invention. -
FIG. 5 is a schematic chart of a polishing system having multiple polishing stations and a recycling unit in accordance with another embodiment of the present invention. - To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements disclosed in one embodiment may be beneficially utilized on other embodiments without specific recitation.
- Embodiments of the present invention generally relate to apparatus and method for recycling slurry and liquid from various processes that use slurry, such as chemical mechanical polishing, or wire saw cutting applications.
- Embodiment of the present invention provides apparatus and method for recycling polishing slurry and rinse water discharged from a polishing station. The discharge generally comprises one or more of used polishing slurry, debris from planarized or wire cut surface, rinsing fluid, and particles of removed and pad material. One embodiment of the present invention provides a recycling unit that receives waste mixture and outputs recycled water and recycled polishing slurry. In one embodiment, the recycling unit comprises four filtration/treatment units. A first filtration unit is configured to separate the mixture into a water stream which mainly includes large particles and a concentrate stream which includes solids. The concentration stream then goes through a second filtration unit for further filtration before going back as recycled slurry. Before going back as recycled slurry, a fourth filtration step could be implemented as an option for safety purpose. The stream of water then goes through a third treatment unit to be further purified including optional deionization.
- Depth filtration, centrifugal separation, microfiltration, nanofiltration, and ultrafiltration may be used alone or in combination in the filtration/treatment units. In one embodiment, magnetically levitated pumps are used in the filtration/treatment units to apply a pressure without deleteriously impacting in the nature of the polishing slurry.
- In one embodiment, a centrifugal separation unit is used to remove large particles, agglomerates, and/or polymeric particles. The centrifugal separation unit may be positioned before or after a filtration unit.
- The recycling unit may be configured to recycle polishing slurries from various CMP processes, such as polishing of copper, tungsten, silicon oxides, single crystalline silicon, polycrystalline silicon, or from wire saw applications.
- Embodiments of the present invention also relate to using centrifugal pumps, such as magnetically levitated pumps, in pumping, mixing, and metering to reduce and prevent agglomeration of particles in the CMP polishing slurry and to reduce particle contamination. In one embodiment, particle agglomeration may be reduced by controlling the amount of sheer when pumping, mixing and metering.
-
FIG. 1 is a schematic chart of apolishing system 100 having arecycling unit 104 in accordance with one embodiment of the present invention. Thepolishing system 100 may be configured to planarize substrates comprising variety of materials, such as polycrystalline silicon, single crystalline silicon, oxides, tungsten, aluminum, copper, or combinations of different materials. In one embodiment, thepolishing system 100 may be used to prepare a polycrystalline silicon substrate for solar panel fabrication. - The
polishing system 100 comprises apolishing station 101 wherein substrates are polished by a polishing slurry with the assistance of relative motion between the substrate being processed and a polishing pad. The polishing slurry is usually sprayed on the substrate or the polishing pad during polishing. After polishing, one or more rinses of the substrate are carried out by spraying deionized water. - The
polishing system 100 further comprises a polishingslurry source 102 configured to supply polishing slurry to the polishingstation 101. In one embodiment, the polishingslurry source 102 may comprise one or more slurry tanks configured to store virgin polishing slurry, and/or recycled polishing slurry therein and one or more pumps configured to supply polishing slurry in the tanks to the polishingstation 101. In one embodiment, the pumps may be centrifugal pumps, such as magnetically levitated pumps, configured to provide real time rheology measurements and torque requirements to a system controller. - In another embodiment, the polishing
slurry source 102 may comprise a slurry generator configured to manufacturing polishing slurry in-situ. The slurry generator assures “fresh” polishing slurry and avoids settling or other aging problems that associated with pre-made polishing slurry. In one embodiment, the slurry generator may be connected to a small local slurry tank to assure steady flow of slurry during processing. - The
polishing system 100 further comprises a rinsewater source 103 configured to supply rinse water to the polishingstation 101 for rinsing of the substrates and/or the polishingstation 101. The rinsewater source 103 may be configured to supply ultra purified water to the polishingstation 101. - In one embodiment, the
polishing system 101 may have atank 119 connected downstream to the polishingstation 101 and configured to receive used polishing slurry and used rinse fluid, such as water, glycol or others. In one embodiment, thetank 119 may be coupled to multiple polishing stations and configured to collect mixtures of used polishing slurry and rinsing water from multiple polishing stations. - The
polishing system 100 further comprises arecycling unit 104 configured to receive the mixture from thetank 119 and to generate reusable polishing slurry, reusable rinse water or both from the mixture in thetank 119. In another embodiment, therecycling unit 104 may be directly connected to the polishingstation 101. - The
recycling unit 104 comprises afirst filtration unit 150 configured to split received mixture into a water stream with chemicals and particles removed and a concentration stream comprising the majority of chemicals and particles. Thefirst filtration unit 150 may also have a waste outlet that provides an exit for waste, such as large particles. The concentration stream is directed to asecond filtration unit 160 to obtain reusable polishing slurry. The water stream is directed to anoptional sanitization unit 180 and atreatment unit 170 to obtain reusable clean water. - The
first filtration unit 150 may comprise a suitable filtering media for depth filtration and/or surface filtration. In one embodiment, thefirst filtration unit 150 comprises one or more membranes or other filtration units configured to remove particles of different sizes. In one embodiment, the membranes or other filtration units may be microfiltration membrane, nanofiltration membrane, or ultrafiltration membrane. - In one embodiment, the
first filtration unit 150 may be a cross flow filtration unit. The water stream is the permeate stream that permeates all the one or more membranes and the concentration stream is the reject stream from one of the membranes. In another embodiment, thefirst filtration unit 150 is a dead-end filtration unit having two or more membranes or other optional filtration technologies, and the water stream is the permeate stream that permeates all the two or more separators. This dead-end filtration unit can optionally utilize a back flush regeneration to clean the membrane surface. Thefirst filtration unit 150 removes particles that are too large for polishing slurry from the concentration stream. - The
second filtration unit 160 is connected downstream to thefirst filtration 150 to receive the concentration stream. Thesecond filtration unit 160 is configured to stabilize particle size distribution in the output stream. In one embodiment, thesecond filtration unit 160 is configured to remove both large particles and small particles from the stream to obtain qualifying abrasive particle size for the stream to be reusable. In one embodiment, thesecond filtration unit 160 comprises a membrane or other filtering media and a pump configured to pressure the concentration stream through the membrane. The pump may be a magnetically levitated pump that imposes minimal destruction to the abrasive particles in the polishing slurry. Thesecond filtration unit 160 may be cleaned by backward flush to remove waste and surplus water. The water may be exit thesecond filtration unit 160 through awaste output 165 or will be fed to thetreatment unit 170. In one embodiment, the waste may be about 10% to about 15% of feed stream. The concentrate stream from thesecond filtration unit 160 goes back to polishing from aslurry output 164. - In one embodiment, the
second filtration unit 160 further comprises adosing unit 167 configured for keeping the abrasive slurries stabilized during processing in thesecond filtration unit 160. Thedosing unit 167 may provide an additional stream of conditioning chemicals, such as KOH or NH4OH 167 to thesecond filtration unit 160 either before, during or after filtration. - The stream from the
slurry output 164 may be directed back to a local polishing slurry tank of the polishingstation 101 or to combine with virgin polishing slurry in the polishingslurry source 102. In one embodiment, rinse water or additional chemical, particles may be blended with theslurry output 164 to obtain desired concentration of a polishing slurry for reuse. - In one embodiment, the slurry out of the second filtration unit may be filtered with a polishing
filtration unit 190 before directed back to a local polishing slurry tank of the polishingstation 101 or to combine with virgin polishing slurry in the polishingslurry source 102. - The
sanitization unit 180 is optional. In one embodiment, thesanitation unit 180 is configured to remove organic species from the fluid flowing therethrough, such as the water stream from thefirst filtration unit 150 and/or the water stream from thesecond filtration unit 160. In one embodiment, thesanitization unit 180 may be an ultra violet (UV) unit configured to oxidize the organic species in the water stream. In another embodiment, thesanitization unit 180 is configured to reduce and control bacteria counts. - In one embodiment, the sanitized water stream out of the
sanitization unit 180 is directly flown back to the polishingstation 101 for rinsing or other function. The sanitized water stream may be used in a first rinse, which has low requirement for the purity of the rinse water. - The
treatment unit 170 is configured to purify and/or deionize the water stream. In one embodiment, thetreatment unit 170 may comprise a reverse osmosis membrane for a reverse osmosis filtration. In another embodiment, thetreatment unit 170 may comprise an ion-exchange resin, which may be continuously regenerated, to deionize the water stream. In another embodiment, thetreatment unit 170 may comprise both a reverse osmosis membrane and an ion-exchange resin. The output stream from thetreatment unit 170 results in ultra purified water. The rejected stream from thetreatment unit 170 exits therecycling unit 104 as waste water. In one embodiment, the waste water is between about 5% to about 20% of feed stream. The purified water from thetreatment unit 170 may be sent back to directly to the polishingstation 101 or to mix with virgin ultra purified water from the rinsewater source 103. - In one embodiment, the
treatment unit 170 may be positioned locally near the polishingstation 101. In another embodiment, thetreatment unit 170 may located remotely. In one embodiment, a factory water treatment may be used as thetreatment unit 170. The water stream from thefirst filtration unit 150 and or from thesecond filtration unit 160 may be flown to factory water treatment unit for recycling, which may be located outside the building where the factory wide water treatment systems are positioned. - Since both polishing and rinsing comprise multiple phases. For example, polishing may be performed in three or more steps to achieve high throughput and high quality. The initial polishing step, such as bulk polishing, is usually more tolerant to variation of polishing slurry than the final polishing step, such as buffing. Therefore, it can be desirable to direct recycled polishing slurry to the polishing station when it performs bulk polishing and shut off the recycled polishing slurry when the polishing station is performing final step buffing. Similarly, initial rinse after polishing is less sensitive to traces of chemical and ions in the rinse water than the final rinse. Therefore, it is desirable to supply recycled rinse water to the polishing station while the polishing station is performing initial rinsing and shut off the recycled rinse water when the polishing station is performing final rinsing.
- In one embodiment, the
polishing system 100 further comprises asystem controller 109. In one embodiment, thesystem controller 109 may control the multiple valves in thepolishing system 100 to insure that recycled polishing slurry and/or rinse water is delivered or shut off at desired time. For simplicity of drawing, connections between thesystem controllers 109 and the components of thepolishing system 100 are not shown. In one embodiment, thesystem controller 109 is a stand alone independent controller for supplying and recycling polishing slurry. In another embodiment, thesystem controller 109 is integrated in to a CMP tool controller as an integral part. -
FIG. 2A is a schematic chart of apolishing system 200A having arecycling unit 204 in accordance with another embodiment of the present invention. Thepolishing system 200A is similar to thepolishing system 100 ofFIG. 1 but with detailed exemplary embodiments for different units. - The
polishing system 200A may be configured to planarize substrates comprising variety of materials, such as polycrystalline silicon, single crystalline silicon, oxides, tungsten, copper, aluminum, or combinations of different materials. In one embodiment, thepolishing system 200A may be used to prepare a polycrystalline silicon substrate for solar panel fabrication. - The
polishing system 200A comprises a polishingstation 201 wherein asubstrate 213 being processed is retained by a polishinghead 212 and pressed against apolishing pad 211. The polishinghead 212 and thepolishing pad 211 both rotate and provide relative motion between thesubstrate 213 and a polishing surface of thepolishing pad 211. Aslurry nozzle 214 provides a polishing slurry to thepolishing pad 211. A rinsenozzle 215 provides rinse water to the polishingstation 201. - The
polishing system 200A further comprises a polishingslurry unit 202 configured to supply polishing slurry to the polishingstation 201. The polishingslurry unit 202 comprises asource 221 and alocal tank 224. In one embodiment, thesource 221 may be a source tank storing pre-generated the polishing slurry. The source tank is generally much larger than thelocal tank 224. In another embodiment, thesource 221 may be a slurry generator to generate polishing slurry on-site. During operation, apump 222 pumps polishing slurry through afilter 223 to thelocal tank 224, and apump 225 from connected to thelocal tank 224 pumps the slurry through afilter 226 to theslurry nozzle 214. - In one embodiment, the
filter 226 may be a point-of-use depth filter and particle filtration to remove any gels and agglomerates just prior to dispensing the polishing slurry to the polishingstation 201. In one embodiment, thefilter 226 is disposed downstream to thepump 225 and upstream to a delivery arm to which theslurry nozzle 214 is connected. - The
polishing system 200A further comprises a rinsewater unit 203 configured to supply rinse water to the polishingstation 201 for rinsing of the substrates and/or the polishingstation 201. The rinsewater unit 203 may comprise atank 231 configured for store rinse water for supplying to the rinse nozzle. Thetank 231 usually connects to a source of virgin ultra purified water. - In one embodiment, the polishing
station 201 comprises acollecting bin 216 configured to receive used polishing slurry, rinse fluid along with removed material. In one embodiment, the collectingbin 216 may be lowered during substrate loading and unloading and raised during polishing and rinsing to catch polishing slurry and rinsing fluid. - The
polishing system 200A may have atank 219 connected downstream to thecollecting bin 216. In one embodiment, thetank 219 may be coupled to multiple polishing stations and configured to collect mixtures of used polishing slurry and rinsing fluid from multiple polishing stations. - The
polishing system 200A further comprises arecycling unit 204 configured to receive the mixture from thetank 219 and to generate reusable polishing slurry and reusable rinse water from the mixture in thetank 219. - The
recycling unit 204 comprises afirst filtration unit 250 configured to split received mixture into a water stream with majority of chemicals and particles removed and a concentration stream comprising chemicals and particles. The concentration stream is directed to asecond filtration unit 260 to obtain reusable polishing slurry. In one embodiment, the water stream is directed to anoptional sanitization unit 280 and atreatment unit 270 to obtain reusable purified water. In another embodiment, the water stream may be directly going to waste. - The
first filtration unit 250 comprises apump 251 connected upstream to afilter unit 252. Thepump 251 is configured to pressurize income stream from thetank 219 through thefilter unit 252. Thefirst filtration unit 250 is configured to remove particles that are too large for polishing slurry from the concentration stream. - The
filter unit 252 comprises suitable filter media, such as depth filter and particle filtration unit. In one embodiment, thefilter unit 252 comprises one or more membranes or other filtration technologies. As shown inFIG. 2A , thefilter unit 252 can comprise one or more membranes, such as a microfiltration membrane, a nanofiltration membrane or an ultrafiltration membrane. In one embodiment, the membranes may be disposed in a staged manner. The income stream would go through the one or more membranes in sequence. In one embodiment, thefilter unit 252 comprises a microfiltration membrane, a nanofiltration membrane, and an ultrafiltration membrane in sequence. - In one embodiment, the
first filtration unit 250 comprises aconcentration outlet 257 in fluid communication with stream between themicrofiltration membrane 253 and thenanofiltration membrane 254. As a result, large particles from the income stream do not permeate thefilter unit 252 and small particles permeate thefilter unit 252. - The
first filtration unit 250 further comprises awater output 258 in fluid communication with the permeate stream out of the all stages of membranes in thefilter unit 252 to output a water stream with most chemical and particles removed. In another embodiment, the stream from thewater output 258 may also exit the system as waste. - The
pump 251 may be a diaphragm pump, a bellow pump, or a magnetically coupled or centrifugal pump. Alternately a vacuum system or gas pressure can be employed for transfer of fluids. In one embodiment, thepump 251 may be a magnetically levitated pump. This low sheer pump has minimum impact on particle size distribution of the polishing slurry. - The
filter unit 252 may be configured for dead-end filtration, cross flow filtration, or back flushable filtration. In one embodiment, themicrofiltration membrane 253, thenanofiltration membrane 254 and theultrafiltration membrane 255 may be polymeric membranes or ceramic membranes. The one or more membranes in thefilter unit 252 may be spiral membranes, tubular membranes, plate and frame, or hollow fiber membranes. - The
second filtration unit 260 is connected downstream to thefirst filtration unit 250 to receive the concentration stream. Thesecond filtration unit 260 is configured to stabilize particle size distribution in the output stream. - In one embodiment, the
second filtration unit 260 comprises afilter media 262 and apump 261 configured to pressure the concentration stream through thefilter media 262. In one embodiment, thefilter media 262 comprises a membrane. The pump may be a magnetically levitated pump that imposes minimal destruction to the abrasive particles in the polishing slurry. - The
second filtration unit 260 has aslurry output 264 configured to output a permeated stream, and a backflush port 266 configured to receive a rinse fluid to clean thefilter media 262 by backwashing to remove waste. The waste may be exit thesecond filtration unit 260 through awaste output 265. In one embodiment, the waste may be about 10% to about 15% of feed stream. In another embodiment, thewaste output 265 may be connected to the water recycling branch, such as an inlet of the sanitizingunit 280 for water recycling. - In one embodiment, the
second filtration unit 260 further comprises adosing unit 267 configured for keeping the abrasive slurries stabilized during processing in thesecond filtration unit 260. Thedosing unit 267 may provide an additional stream of conditioning chemicals, such as KOH or NH4OH 267 to thesecond filtration unit 260 either before, during or after filtration. - The
pump 261 may be a diaphragm pump, a bellow pump, or a magnetically coupled or centrifugal pump. In one embodiment, thepump 261 may be a magnetically levitated pump with minimized impact on particles of the polishing slurry. - The
filter media 262 may be a polymeric membranes or a ceramic membrane. Thefilter media 262 may be a spiral membrane, a tubular membrane, or a hollow fiber membrane. - The
second filtration unit 260 may be a dead-end filtration or a cross-flow filtration. - In one embodiment, the slurry out of the
second filtration unit 260 may be further filtered with a polishingfiltration unit 290 before directed back to a local polishing slurry tank of the polishingstation 201 or to the polishingslurry unit 202. - The permeate stream from the
slurry output 264 maybe directed to thesource 221 or thelocal tank 224. - The
sanitization unit 280 is configured to reduce and control bacteria and or organic contamination from the fluid flowing therethrough, such as the water stream from thefirst filtration unit 250 and/or thesecond filtration unit 260. In one embodiment, thesanitization unit 280 may be an ultra violet (UV) unit configured to oxidize the organic species or kill the bacteria in the water stream. - In one embodiment, the sanitized water stream is directly flown back to the polishing
station 201 for rinsing or other function. The sanitized water stream may be used in a first rinse, which has low requirement for the purity of the rinse water. - The
treatment unit 270 is configured to purify and deionize the water stream. In one embodiment, thetreatment unit 270 comprises apump 271, areverse osmosis membrane 273 and an ion-exchange resin 274, which may be regenerated continuously via ion selective membranes. Thepump 271 is configured to pressurize incoming flow to thereverse osmosis membrane 273 and the ion-exchange resin 274. The output stream from anoutlet 276 of thetreatment unit 270 results in ultra purified water. The rejected stream from thetreatment unit 270 exits through awaste output 278 as waste water. In one embodiment, the waste water is between about 5% to about 20% of feed stream. The purified water from thetreatment unit 270 may be sent back to directly to the polishingstation 201 or to mix with virgin ultra purified water from a rinsewater inlet 232. - In one embodiment, the
treatment unit 270 is a stand alone water recycling unit. In another embodiment, thetreatment unit 270 belongs to a pre-existing factory water treatment system. - In one embodiment, the
polishing system 200A further comprises asystem controller 209. In one embodiment, thesystem controller 209 may control the multiple valves in thepolishing system 200A to insure that recycled polishing slurry and/or rinse water is delivered or shut off at desired time. For simplicity of drawing, connections between thesystem controllers 209 and the components of thepolishing system 200A are not shown. - The membranes used in each filtration/
treatment unit - In one embodiment, the
system controller 209 is a stand alone independent controller for supplying and recycling polishing slurry. In another embodiment, thesystem controller 209 is integrated in to a CMP tool controller or implemented as a slave to the CMP tool control system. - In one embodiment, the
system controller 209 is connected to at least one of the reservoir pumps 222, 225 and the filtration pumps 251, 261, 271. Thesystem controller 209 is configured to monitor and/or adjust characteristics of polishing slurry according to process parameters of the at least one pump connected to thesystem controller 209. In one embodiment, the at least pump connected to thesystem controller 209 is a centrifugal pump, such as an electromagnetically levitated centrifugal pump. - Each of the
pumps pumps pumps - In one embodiment, connecting the
system controller 209 to at least one magnetically levitated centrifugal pump enables return of real time rheology measurements and/or torque requirements on each slurry blending and recycling step. Rheology measurements and/torque requirement can be obtained from pumps at one or more of the following positions: a position where recycled slurry is blended into virgin slurry, a position wherein slurry recycles back to a main reservoir, a position driving agglomeration filtration, a position transport past large reservoir, a position transport past local reservoir, a position feeding polishing slurry to the polishing pad. - In one embodiment, magnetically levitated centrifugal pumps may be used to meter polishing slurry to local reservoir or to polishing pads.
- In one embodiment, magnetically levitated centrifugal pumps may be used to afford appropriate levels of shear to the polishing slurry to positively impact rheology and minimize agglomeration.
- In another embodiment, magnetically levitated centrifugal pumps may be used to inject and mix additives, to mix/combine various streams of virgin slurry, recycled polishing slurry, water, and/or chemical additive packages.
- In another embodiment, other metrology sensors positioned adjacent pump housing may be used in addition to or incorporation of magnetically levitated centrifugal pumps.
- In another embodiment, magnetically levitated centrifugal pumps may be used to monitor the back pressure of feed to the filtration and back wash media to (1) alert to plugging issues that would require filtration maintenance, (2) adjust pumping power to compensate for increased pressure drop until process is finished and shut down without interrupting process, and (3) initiate additional frequency, increased flow during cross flow or back wash steps, or optionally inject a cleaning agent bypass the current polishing slurry and ultra purified water recycle until the clean agent is purged as predetermined by the control software based on set point parameters.
- In another embodiment, magnetically levitated centrifugal pumps may be used to provide feedback to the optional integrated controls system that manages the CMP water and slurry recycle system as a holistic set of unit operations along with the CMP tool and water plant rather than operating as a cluster of individually controlled circuits.
- In another embodiment, magnetically levitated centrifugal pumps may be used to lower levels of contamination due to complete encapsulation of all moving parts with an inert polymer and the absence of metal or ceramic drive seals in the pumping system.
-
FIG. 2B is a schematic view of apolishing system 200B with one embodiment of the present invention. Thepolishing system 200B is similar to thepolishing system 200A ofFIG. 2A , except that thepolishing system 200B has aseparation unit 295 configured to separate polymeric particles or large particles, such as large silicon oxide particle, from the flow before recycling. In one embodiment, theseparation unit 295 is a centrifugal separator. The separated particles may exit the system from anoutlet 296. -
FIG. 2C is a schematic view of apolishing system 200C in accordance with one embodiment of the present invention. Thepolishing system 200C is similar to thepolishing system 200B ofFIG. 2B except that theseparator unit 295 is disposed down stream of thefirst filtration unit 250. -
FIG. 2D is a schematic view of apolishing system 200D in accordance with one embodiment of the present invention. Thepolishing system 200D is similar to thepolishing system 200A ofFIG. 2D , except that thepolishing system 200D use adiverter valve 294 to separate a water stream and a concentrations stream in stead of using thefirst filtration unit 250 as in thepolishing system 200A. - The
diverter valve 294 is connected to thecollecting bin 216 of the polishingstation 201. The collectingpin 216 may be stationary or movable. In one embodiment, thediverter valve 294 is configured to direct the content in thecollecting bin 216 to thesecond filtration unit 260 for slurry recycling or to thetreatment unit 270 for water recycling. In one embodiment, thediverter valve 294 is a three way valve. The status of thediverter valve 294 may be controlled by the system controller according to the process in the polishingstation 201. For example, thediverter valve 294 may be adjusted to direct the flow to thesecond filtration unit 260 for slurry recycling when there is polishing slurry flowing from theslurry nozzle 214 to the polishingstation 201, and adjusted to direct the flow towards thetreatment unit 270 during rinsing or there no slurry flow from upstream. - In one embodiment, the
polishing system 200D comprises anoptional separation unit 295 connected between thediverter valve 294 and thesecond filtration unit 260 to remove polymeric particles and/or large particle prior to the slurry recycling. -
FIG. 3 is a schematic chart of apolishing system 300 having a dedicatedrecycled slurry tank 324 and a dedicatedvirgin slurry tank 327 in accordance with another embodiment of the present invention. Thepolishing system 300 is similar to the polishing system 200 ofFIG. 2 , except for the difference in theslurry unit 302. - The
slurry unit 302 is configured to provide the polishingstation 301 with virgin polishing slurry without mixing with the recycled slurry during polishing. This allows the polishingstation 301 to perform multiple steps of polishing and use recycled polishing slurry only when process parameter permits. -
FIG. 4 is a schematic chart of apolishing system 400 having a dedicated recycled rinsewater tank 432 in accordance with another embodiment of the present invention. Thepolishing system 400 is similar to the polishing system 200 ofFIG. 2 , except for the difference in the rinsewater unit 403. - The rinse
water unit 403 comprises a recycled rinsewater tank 432 to receive recycled rinse water and a virgin rinsewater tank 431 without recycled rinse water. This allows the polishingstation 301 to perform multiple rinsing and use recycled rinse water only when process parameter permits, such as during initial rinsing. -
FIG. 5 is a schematic chart of apolishing system 500 having multiple polishingstations recycling unit 504 in accordance with another embodiment of the present invention. Thepolishing system 500 is configured to perform multiple polishing steps. Each polishingstation - The polishing waste from the polishing
stations tank 519 and sent to therecycling unit 504, which is similar to therecycling units - A polishing
source 502 provides recycled and virgin polishing slurry to the polishingstations - A rinse
water source 503 is configured to selectively supply recycled rinse water and virgin rinse slurry to each polishing station. - Even though three polishing stations are shown in
FIG. 5 , more or less polishing stations may be used according to process requirement. - While the foregoing is directed to embodiments of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.
Claims (20)
1. An apparatus for recycling, comprising:
a separation unit comprising:
an inlet configured to receive a mixture of used polishing slurry, rinsing fluid, and polishing waste;
a water outlet configured to output a first stream for waste or water recycling; and
a slurry outlet configured to output a second stream for slurry recycling polishing; and
a slurry filtration unit comprising:
an inlet connected with the slurry outlet of the separation unit;
one or more filtering media configured for filtration or removal of ions and organics; and
a pump disposed upstream of the one or more filtering media and configured to press a stream of fluid through the one or more membranes.
a product outlet configured to output a stream of concentrated and recycled polishing slurry; and
a water outlet for water recycling or waste.
2. The apparatus of claim 1 , wherein the separation unit comprises a diverter valve selectively connecting the inlet to the water outlet and the slurry outlet.
3. The apparatus of claim 2 , wherein the pump of the slurry filtration unit is one of a piston pump, a diaphragm pump, a bellow pump, a peristaltic pump, a magnetically levitated centrifugal pump, and a device for fluid transfer by vacuum draw or pressurization.
4. The apparatus of claim 2 , wherein the filtering media of the slurry filtration unit and the is a spiral membrane, a hollow fiber membrane, a tubular membrane, a plate and frame membrane operated in a dead-end filtration methods, a back flushable filtration method, a cross flow filtration method, or a filtering media operated by depth filtration.
5. The apparatus of claim 2 , wherein the slurry filtration unit comprises one or more of a microfiltration membrane, a nanofiltration membrane, and an ultrafiltration membrane.
6. The apparatus of claim 5 , wherein the slurry filtration unit further comprises a backwash or cross flow clean capability.
7. The apparatus of claim 2 , further comprising a UV (ultra violet) unit configured to reduce bacteria and organic contamination from fluid passing through, wherein the UV unit comprises:
an inlet connected with the water outlet of the separation unit and/or the water outlet of the slurry filtration unit; and
an outlet configured to output a stream of sanitized fluid.
8. The apparatus of claim 7 , further comprising a water treatment unit configured to purify the sanitized fluid by removing trace of chemicals, wherein the treatment unit comprises:
an inlet connected to the outlet of the UV unit; and
an outlet configured to output a stream of purified fluid.
9. The apparatus of claim 2 , further comprising a dosing unit connected to the slurry filtration unit for dosing conditioning chemicals during processing in the slurry filtration unit.
10. The apparatus of claim 1 , wherein the separation unit is a filtration unit comprising:
a filtering media comprising:
a microfiltration membrane; and
a nanofiltration membrane disposed downstream to the microfiltration membrane; and
a pump disposed upstream of the microfiltration membrane and configured to press a stream of fluid through the filtering media, wherein the slurry outlet is disposed between the microfiltration membrane and the nanofiltration membrane, and the water outlet of the separation unit is disposed downstream to the filtration media.
11. The apparatus of claim 1 , further comprising a centrifugal separator configured to separate polymeric or large particles, wherein the centrifugal separator is disposed upstream or downstream of the separation unit.
12. A method for recycling polishing fluid, comprising:
generating a waste water stream and a concentration stream from a mixture of used polishing slurry, rinsing fluid and polishing waste;
filtering the concentration stream through a slurry filtration unit to separate a stream of reusable polishing slurry from a water stream;
flowing the stream of reusable polishing slurry to a polishing slurry source for a polishing station; and
flowing the water stream to a recycled water source.
13. The method of claim 12 , wherein generating the waste water stream and the concentration stream comprises filtering the mixture through a filtering unit having multiple membranes or using a diverter valve to selectively direct the mixture to a slurry outlet and a water outlet.
14. The method of claim 13 , further comprising measuring one or more characteristics of the reusable polishing slurry before flowing the stream of reusable polishing slurry to a polishing slurry source for a polishing station, wherein the one or more characteristics of the reusable polishing slurry comprises one or more of zeta potential, density, particle size, and particle distribution.
15. The method of claim 14 , further comprising supplying the reusable polishing slurry to perform a bulk polishing process in the polishing station.
16. The method of claim 13 , further comprising:
sanitizing the water stream to remove organic species from the water stream prior to flowing the water stream to the recycled water source;
purifying the sanitized water stream by a reversed osmosis process through a treatment unit; and
deionizing the purified water stream by one of a continuous electrodeionization (CEDI) process, ion exchange, or ion removal prior to flowing the water stream to the recycled water source.
17. The method of claim 16 , further comprising
supplying rinsing water from the recycled water source to perform one or more initial rinses in a polishing station; and
supplying virgin ultra purified water to perform final rinses in the polishing station.
18. A polishing slurry unit for a polishing system, comprising:
a slurry reservoir having a reservoir pump, wherein the slurry reservoir is connected to a virgin slurry source;
a recycling unit comprising one or more filtration units, wherein the one or more filtration unit comprises a filtration pump, and the recycling unit is connected to the slurry reservoir and is configured to receive used polishing slurry, pump the used slurry through the one or more filtration units and provide filtered polishing slurry to the slurry reservoir; and
a controller connected to at least one of the reservoir pump and the filtration pump, wherein the controller is configured to monitor and/or adjust characteristics of the polishing slurry according to process parameters of the at least one pump connected thereto.
19. The polishing slurry unit of claim 18 , wherein the filtration pump is a magnetically levitated centrifugal pump.
20. The polishing slurry unit of claim 19 , wherein the recycling unit comprises a valve system configured to divert excessive polishing slurry during polishing to a slurry recycling unit and rinse fluid during rinse to a rinse water recycling unit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/730,079 US20110070811A1 (en) | 2009-03-25 | 2010-03-23 | Point of use recycling system for cmp slurry |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US21115609P | 2009-03-25 | 2009-03-25 | |
US16345109P | 2009-03-26 | 2009-03-26 | |
US17041309P | 2009-04-17 | 2009-04-17 | |
US18542409P | 2009-06-09 | 2009-06-09 | |
US12/730,079 US20110070811A1 (en) | 2009-03-25 | 2010-03-23 | Point of use recycling system for cmp slurry |
Publications (1)
Publication Number | Publication Date |
---|---|
US20110070811A1 true US20110070811A1 (en) | 2011-03-24 |
Family
ID=43757011
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/730,079 Abandoned US20110070811A1 (en) | 2009-03-25 | 2010-03-23 | Point of use recycling system for cmp slurry |
Country Status (1)
Country | Link |
---|---|
US (1) | US20110070811A1 (en) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110048542A1 (en) * | 2009-08-27 | 2011-03-03 | Weinstock Motty | system for wafer manufacture |
US20120042575A1 (en) * | 2010-08-18 | 2012-02-23 | Cabot Microelectronics Corporation | Cmp slurry recycling system and methods |
JP2013248706A (en) * | 2012-05-31 | 2013-12-12 | Panasonic Corp | Method for regenerating waste coolant, method and system for treating waste coolant, and method for producing regenerated coolant |
US8696404B2 (en) | 2011-12-21 | 2014-04-15 | WD Media, LLC | Systems for recycling slurry materials during polishing processes |
US20140331567A1 (en) * | 2011-12-22 | 2014-11-13 | Konica Minolta, Inc. | Abrasive Material Regeneration Method And Regenerated Abrasive Material |
US20150013235A1 (en) * | 2011-12-27 | 2015-01-15 | Konica Minolta, Inc. | Method For Separating Polishing Material And Regenerated Polishing Material |
CN104552008A (en) * | 2013-10-23 | 2015-04-29 | 株式会社荏原制作所 | Polishing method and polishing apparatus |
US20170066101A1 (en) * | 2014-03-07 | 2017-03-09 | Ebara Corporation | Substrate processing system and substrate processing method |
ITUB20154174A1 (en) * | 2015-10-06 | 2017-04-06 | Nova S R L | EQUIPMENT AND METHOD FOR RECOVERY OF WASTE MATERIAL IN PARTICULAR FOR WATER JET CUTTING MACHINES |
JP2021030363A (en) * | 2019-08-23 | 2021-03-01 | 株式会社ディスコ | Processing waste liquid treatment apparatus |
US20210154799A1 (en) * | 2019-11-25 | 2021-05-27 | Synticos, LLC | Abrasive suspension jet cutting system having reduced system wear and process materials reclamation |
CN113231964A (en) * | 2021-05-21 | 2021-08-10 | 中国工程物理研究院激光聚变研究中心 | Double-vacuum-pump-body polishing solution recovery device and method |
WO2021207298A1 (en) * | 2020-04-07 | 2021-10-14 | Evoqua Water Technologies Llc | Treatment of slurry copper wastewater with ultrafiltration and ion exchange |
CN114515997A (en) * | 2022-02-18 | 2022-05-20 | 王德泮 | Grinding fluid filtering device for intelligent grinding machine |
TWI805364B (en) * | 2022-05-12 | 2023-06-11 | 英萊特國際有限公司 | Method and system for recycling polishing slurry waste |
US11689792B2 (en) | 2020-05-08 | 2023-06-27 | Furonteer Inc. | Camera module manufacturing apparatus, camera module, and manufacturing method thereof |
US11872670B2 (en) | 2016-12-12 | 2024-01-16 | Omax Corporation | Recirculation of wet abrasive material in abrasive waterjet systems and related technology |
Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4740881A (en) * | 1986-01-11 | 1988-04-26 | Korea Advanced Institute Of Science And Technology | Simultaneous recovery commutation current source inverter for AC motors drives |
US5827362A (en) * | 1995-05-20 | 1998-10-27 | Envirotreat Limited | Modified organoclays |
US6106728A (en) * | 1997-06-23 | 2000-08-22 | Iida; Shinya | Slurry recycling system and method for CMP apparatus |
US6126531A (en) * | 1998-03-30 | 2000-10-03 | Speedfam Co., Ltd. | Slurry recycling system of CMP apparatus and method of same |
US6183352B1 (en) * | 1998-08-28 | 2001-02-06 | Nec Corporation | Slurry recycling apparatus and slurry recycling method for chemical-mechanical polishing technique |
US6238571B1 (en) * | 1998-09-15 | 2001-05-29 | Massachusetts Institute Of Technology | Removal of contaminant metals from waste water |
US20010004538A1 (en) * | 1999-12-21 | 2001-06-21 | Applied Materials, Inc. | High through-put copper CMP with reduced erosion and dishing |
US20010039077A1 (en) * | 1998-06-30 | 2001-11-08 | Mcteer Allen | Semiconductor Constructions Compromising Aluminum-Containing Layers |
US6413151B2 (en) * | 1999-12-10 | 2002-07-02 | Lsi Logic Corporation | CMP slurry recycling apparatus and method for recycling CMP slurry |
US20020104803A1 (en) * | 1998-07-10 | 2002-08-08 | Filson James L. | Ion exchange removal of metal ions from wastewater |
US20030003851A1 (en) * | 2001-06-28 | 2003-01-02 | Seh America, Inc. | Method and apparatus for recycling slurry |
US6575717B2 (en) * | 1999-12-27 | 2003-06-10 | Ntn Corporation | Magnetically levitated pump |
US6866784B2 (en) * | 2000-06-27 | 2005-03-15 | Nymtech, Co., Ltd. | Slurry recycling system and method for CMP apparatus |
US20050076581A1 (en) * | 2003-10-10 | 2005-04-14 | Small Robert J. | Particulate or particle-bound chelating agents |
US7052599B2 (en) * | 1998-12-25 | 2006-05-30 | Fujitsu Limited | Method and apparatus for reuse of abrasive fluid used in the manufacture of semiconductors |
US20080047901A1 (en) * | 2006-08-25 | 2008-02-28 | Golden Josh H | Method and system for point of use treatment of substrate polishing fluids |
US20080213496A1 (en) * | 2002-02-14 | 2008-09-04 | Applied Materials, Inc. | Method of coating semiconductor processing apparatus with protective yttrium-containing coatings |
US20090018688A1 (en) * | 2007-06-15 | 2009-01-15 | Applied Materials, Inc. | Methods and systems for designing and validating operation of abatement systems |
-
2010
- 2010-03-23 US US12/730,079 patent/US20110070811A1/en not_active Abandoned
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4740881A (en) * | 1986-01-11 | 1988-04-26 | Korea Advanced Institute Of Science And Technology | Simultaneous recovery commutation current source inverter for AC motors drives |
US5827362A (en) * | 1995-05-20 | 1998-10-27 | Envirotreat Limited | Modified organoclays |
US6106728A (en) * | 1997-06-23 | 2000-08-22 | Iida; Shinya | Slurry recycling system and method for CMP apparatus |
US6126531A (en) * | 1998-03-30 | 2000-10-03 | Speedfam Co., Ltd. | Slurry recycling system of CMP apparatus and method of same |
US20010039077A1 (en) * | 1998-06-30 | 2001-11-08 | Mcteer Allen | Semiconductor Constructions Compromising Aluminum-Containing Layers |
US20020104803A1 (en) * | 1998-07-10 | 2002-08-08 | Filson James L. | Ion exchange removal of metal ions from wastewater |
US6183352B1 (en) * | 1998-08-28 | 2001-02-06 | Nec Corporation | Slurry recycling apparatus and slurry recycling method for chemical-mechanical polishing technique |
US6238571B1 (en) * | 1998-09-15 | 2001-05-29 | Massachusetts Institute Of Technology | Removal of contaminant metals from waste water |
US7052599B2 (en) * | 1998-12-25 | 2006-05-30 | Fujitsu Limited | Method and apparatus for reuse of abrasive fluid used in the manufacture of semiconductors |
US6413151B2 (en) * | 1999-12-10 | 2002-07-02 | Lsi Logic Corporation | CMP slurry recycling apparatus and method for recycling CMP slurry |
US20010004538A1 (en) * | 1999-12-21 | 2001-06-21 | Applied Materials, Inc. | High through-put copper CMP with reduced erosion and dishing |
US6575717B2 (en) * | 1999-12-27 | 2003-06-10 | Ntn Corporation | Magnetically levitated pump |
US6866784B2 (en) * | 2000-06-27 | 2005-03-15 | Nymtech, Co., Ltd. | Slurry recycling system and method for CMP apparatus |
US20030003851A1 (en) * | 2001-06-28 | 2003-01-02 | Seh America, Inc. | Method and apparatus for recycling slurry |
US20080213496A1 (en) * | 2002-02-14 | 2008-09-04 | Applied Materials, Inc. | Method of coating semiconductor processing apparatus with protective yttrium-containing coatings |
US20050076581A1 (en) * | 2003-10-10 | 2005-04-14 | Small Robert J. | Particulate or particle-bound chelating agents |
US20080047901A1 (en) * | 2006-08-25 | 2008-02-28 | Golden Josh H | Method and system for point of use treatment of substrate polishing fluids |
US20090018688A1 (en) * | 2007-06-15 | 2009-01-15 | Applied Materials, Inc. | Methods and systems for designing and validating operation of abatement systems |
Cited By (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110048542A1 (en) * | 2009-08-27 | 2011-03-03 | Weinstock Motty | system for wafer manufacture |
US20120042575A1 (en) * | 2010-08-18 | 2012-02-23 | Cabot Microelectronics Corporation | Cmp slurry recycling system and methods |
US8696404B2 (en) | 2011-12-21 | 2014-04-15 | WD Media, LLC | Systems for recycling slurry materials during polishing processes |
US9796894B2 (en) * | 2011-12-22 | 2017-10-24 | Konica Minolta, Inc. | Abrasive material regeneration method and regenerated abrasive material |
US20140331567A1 (en) * | 2011-12-22 | 2014-11-13 | Konica Minolta, Inc. | Abrasive Material Regeneration Method And Regenerated Abrasive Material |
US20150013235A1 (en) * | 2011-12-27 | 2015-01-15 | Konica Minolta, Inc. | Method For Separating Polishing Material And Regenerated Polishing Material |
US10017675B2 (en) * | 2011-12-27 | 2018-07-10 | Konica Minolta, Inc. | Method for separating polishing material and regenerated polishing material |
JP2013248706A (en) * | 2012-05-31 | 2013-12-12 | Panasonic Corp | Method for regenerating waste coolant, method and system for treating waste coolant, and method for producing regenerated coolant |
TWI645938B (en) * | 2013-10-23 | 2019-01-01 | 日商荏原製作所股份有限公司 | Polishing method and polishing apparatus |
KR20200139655A (en) * | 2013-10-23 | 2020-12-14 | 가부시키가이샤 에바라 세이사꾸쇼 | Polishing method and polishing apparatus |
US11192216B2 (en) * | 2013-10-23 | 2021-12-07 | Ebara Corporation | Polishing method and polishing apparatus |
US20150140907A1 (en) * | 2013-10-23 | 2015-05-21 | Ebara Corporation | Polishing method and polishing apparatus |
CN104552008A (en) * | 2013-10-23 | 2015-04-29 | 株式会社荏原制作所 | Polishing method and polishing apparatus |
KR102274731B1 (en) * | 2013-10-23 | 2021-07-08 | 가부시키가이샤 에바라 세이사꾸쇼 | Polishing method and polishing apparatus |
US10618140B2 (en) * | 2014-03-07 | 2020-04-14 | Ebara Corporation | Substrate processing system and substrate processing method |
US20170066101A1 (en) * | 2014-03-07 | 2017-03-09 | Ebara Corporation | Substrate processing system and substrate processing method |
ITUB20154174A1 (en) * | 2015-10-06 | 2017-04-06 | Nova S R L | EQUIPMENT AND METHOD FOR RECOVERY OF WASTE MATERIAL IN PARTICULAR FOR WATER JET CUTTING MACHINES |
US11872670B2 (en) | 2016-12-12 | 2024-01-16 | Omax Corporation | Recirculation of wet abrasive material in abrasive waterjet systems and related technology |
JP2021030363A (en) * | 2019-08-23 | 2021-03-01 | 株式会社ディスコ | Processing waste liquid treatment apparatus |
JP7446668B2 (en) | 2019-08-23 | 2024-03-11 | 株式会社ディスコ | Processing waste liquid treatment equipment |
US20210154799A1 (en) * | 2019-11-25 | 2021-05-27 | Synticos, LLC | Abrasive suspension jet cutting system having reduced system wear and process materials reclamation |
WO2021207298A1 (en) * | 2020-04-07 | 2021-10-14 | Evoqua Water Technologies Llc | Treatment of slurry copper wastewater with ultrafiltration and ion exchange |
CN115413293A (en) * | 2020-04-07 | 2022-11-29 | 懿华水处理技术有限责任公司 | Treatment of slurry copper wastewater with ultrafiltration and ion exchange |
US11689792B2 (en) | 2020-05-08 | 2023-06-27 | Furonteer Inc. | Camera module manufacturing apparatus, camera module, and manufacturing method thereof |
CN113231964A (en) * | 2021-05-21 | 2021-08-10 | 中国工程物理研究院激光聚变研究中心 | Double-vacuum-pump-body polishing solution recovery device and method |
CN114515997A (en) * | 2022-02-18 | 2022-05-20 | 王德泮 | Grinding fluid filtering device for intelligent grinding machine |
TWI805364B (en) * | 2022-05-12 | 2023-06-11 | 英萊特國際有限公司 | Method and system for recycling polishing slurry waste |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20110070811A1 (en) | Point of use recycling system for cmp slurry | |
WO2010111291A2 (en) | Point of use recycling system for cmp slurry | |
KR102092441B1 (en) | Ultrapure water production apparatus | |
JP3426149B2 (en) | Method and apparatus for recycling polishing waste liquid in semiconductor manufacturing | |
CN1530331B (en) | Water purifying system, method and tangential filter for the system | |
US9592471B2 (en) | Recycling method and device for recycling waste water containing slurry from a semi-conductor treatment process, in particular from a chemico-mechanical polishing process | |
KR101928212B1 (en) | Method for washing reverse osmosis membrane | |
US9050851B2 (en) | Accurately monitored CMP recycling | |
CN111867986A (en) | Method for removing boron in water to be treated, boron removal system, ultrapure water production system, and method for measuring boron concentration | |
DE102011056633B4 (en) | Method for cleaning a filter | |
CN112203988A (en) | Ultrapure water production apparatus and ultrapure water production method | |
JP6469400B2 (en) | Ultrapure water production equipment | |
CN104150624A (en) | Treatment method for recycling silicon wafer grinding wastewater in semiconductor industry | |
CA2765367C (en) | Closed circuit desalination retrofit for improved performance of common reverse osmosis systems | |
KR101336174B1 (en) | Recycling system of waste water produced during chemical-mechanical planarization and die sawing process of semi-conductor | |
KR20150001208A (en) | Cleaning system of separation membrane and method using the same | |
CN112770825B (en) | Method for starting up ultrapure water production device, and ultrapure water production device | |
JP7079130B2 (en) | Gas-dissolved water supply system | |
TWI619579B (en) | Chemical mechanical polishing slurry regeneration method and regeneration device | |
CN112897788A (en) | Novel standard water treatment process | |
US20230174394A1 (en) | Treatment of slurry copper wastewater with ultrafiltration and ion exchange | |
JP7446668B2 (en) | Processing waste liquid treatment equipment | |
WO2020241476A1 (en) | Ultrapure water production system and ultrapure water production method | |
JP7469790B2 (en) | METHOD AND APPARATUS FOR PRODUCING METHOD OF SLURRY FOR METAL FILMS | |
CN105263607A (en) | Filtration system and filtration method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: APPLIED MATERIALS, INC., CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:NEUBER, ANDREAS;CHANDLER, PHIL;STOW, CLIFFORD C.;AND OTHERS;SIGNING DATES FROM 20100420 TO 20100506;REEL/FRAME:024408/0080 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |