US20110067841A1 - Heat sink systems and devices - Google Patents
Heat sink systems and devices Download PDFInfo
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- US20110067841A1 US20110067841A1 US12/566,042 US56604209A US2011067841A1 US 20110067841 A1 US20110067841 A1 US 20110067841A1 US 56604209 A US56604209 A US 56604209A US 2011067841 A1 US2011067841 A1 US 2011067841A1
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- heat sink
- inside surface
- surface portion
- pin fins
- thermally conductive
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
Definitions
- the present invention generally relates to heat sinks. More specifically the subject matter disclosed herein relates to structures and devices for increasing thermal efficiency in a heat sink.
- coolant systems rely on forced air cooling commonly found in electronic devices such as personal computers, or liquid fluid flow heat exchangers that are commonly found in vehicles and in industrial environments.
- Liquid flow systems are known to be more efficient that forced air systems, particularly in environments where a source of relatively cold air is not readily available.
- the Newton's first law states that given a specific heat transfer coefficient, which is fixed by the material used, the rate of heat transfer is proportional to both the surface area of the heat exchanger and the difference between the coolant temperature and the ambient temperature, all else being equal.
- the rate of heat transfer is proportional to both the surface area of the heat exchanger and the difference between the coolant temperature and the ambient temperature, all else being equal.
- inefficiencies in the coolant flow within the heat exchanger are factors that reduce the effective flow and therefore increase effective temperature of the. Thus larger than necessary heat exchangers may be required.
- the disclosure herein provides for a novel heat sink.
- the heat sink comprises a thermally conductive cover including a first inside surface portion and a first plurality of pin fins integral to and depending from the first inside surface portion.
- the heat sink also comprises a thermally conductive body portion having a second inside surface portion and a second plurality of pin fins integral to and extending from the second inside surface portion in a direction towards the first inside surface portion.
- the heat sink comprises a thermally conductive cover including a first inside surface portion and a first plurality of pin fins integral to and depending from the first inside surface portion.
- the heat sink also includes a thermally conductive body portion having a second inside surface and a first boss protruding from the second inside surface portion, running substantially parallel to at least one of the first plurality of pin fins.
- the heat sink comprises a thermally conductive cover including a first inside surface portion and a first plurality of pin fins integral to and depending from the first inside surface portion.
- the heat sink also includes a thermally conductive body portion having a second inside surface portion and a inside bottom surface portion with a first boss protruding from the second inside surface portion, running substantially parallel to at least one of the first plurality of pin fins and extending from the first inside surface portion to the inside bottom surface portion.
- the hat sink provides for a second plurality of pin fins integral to and extending from the bottom surface portion in a direction towards the first inside surface portion.
- FIG. 1 a is a cross-sectional view of a heat exchanger in accordance with the prior art
- FIG. 1 b is a cross-sectional view of an exemplary heat sink in accordance with the subject matter disclosed herein;
- FIG. 1 c is a cross-sectional view of an alternative exemplary heat sink in accordance with the subject matter disclosed herein;
- FIG. 2 is an isometric view of an exemplary coolant cavity
- FIG. 3 is an plan view of an exemplary embodiment showing thermal bosses and chassis pins fins and their configuration as disclosed herein;
- FIG. 4 is a broader cross-sectional view of an exemplary coolant cavity with abutting heat sources
- FIG. 5 is an exploded isometric view of an exemplary heat sink according to the subject matter as disclosed herein;
- FIG. 6 is an isometric view of an alternative embodiment of a heat sink as disclosed herein.
- a heat sink absorbs heat received from a heat source and dissipates the heat to a mass existing at a cooler temperature.
- the heat sink may be in thermodynamic contact with a heat source by physically abutting a heat source (e.g. an electronic circuit) such that heat is received by conduction, it may abut an intervening component that is indirectly receiving heat from a heat source or it may receive heat directly over an intervening distance by convection or radiation.
- a heat sink may absorb and dissipate heat from multiple heat sources.
- a heat sink may be of any shape, and may be designed to match the shape and/or size of a heat source.
- the subject matter disclosed herein will refer to a heat sink shaped as a parallelepiped for simplicity.
- a heat source may be easily attached to the top and to the bottom of the heat sink as well as to one of more sides of the heat sink.
- the subject matter disclosed hereinafter may be applied to forced gaseous systems as well as to forced liquid systems. However, only forced liquid heat sink systems will be addressed herein in the interest of brevity and clarity.
- FIG. 1 a is a cross-sectional view of a portion of one coolant cavity 105 of a forced fluid heat exchanger 5 (i.e. a heat sink) that is known in the art.
- the coolant cavity 105 comprises a body portion or chassis 100 and a cover 110 .
- the cover 110 includes a plurality of uniformly dispersed structures or heat sink pin fins 120 that depend from the underside of the top cover.
- the heat sink pin fins 120 may be of uniform conical or uniform truncated conical shape and may or may not come in contact with the chassis 100 .
- a heat sink pin fin 120 The purpose of a heat sink pin fin 120 is to increase the surface area of the heat sink 5 that is in contact with the coolant flow 600 (see FIG. 6 ). As liquid coolant 600 passes the heat sink pin fin 120 , some of the coolant impinges on the heat sink pin fin resulting in the transfer of heat from the heat sink pin fin to the coolant. As the coolant 600 impinges on the heat sink pin fin 120 , the fluid is slowed by friction resulting in an incremental pressure drop across the heat sink 5 .
- a gasket or an o-ring 101 is used at the junction of the cover 110 and the chassis 100 to prevent coolant leakage therethrough.
- the Cover 110 is secured to the chassis 100 by fasteners 103 (See FIG. 5 ) that may be made of a heat conducting material or a heat insulating material.
- the fasteners 103 may be any type of suitable fastener and may include bolts, clips, and the like.
- non-uniform coolant channels or coolant bypasses 115 ′, between the heat sink pin fins 120 and the sides of the chassis 100 .
- the heat sink of FIG. 1 a also creates non-uniform coolant bypasses between adjacent heat sink pin fins 120 .
- the term “non-uniform” is being defined herein as a varying width of a coolant channel 115 ′.
- a non-uniform coolant channel 115 ′ allows some laminar coolant flow between components thereby allowing some coolant to avoid significant thermodynamic contact with a heat transferring component of the heat sink 10 , such as heat sink pin fin 120 .
- FIG. 1 b is a cross-sectional view of an embodiment of a heat sink 10 described in accordance with the subject matter being disclosed herein.
- the heat sink 10 includes a plurality of thermal bosses 150 as integral components of the chassis 100 and are preferably cast therewith.
- the thermal bosses 150 may be spaced regularly along the internal wall of the chassis 100 of the heat sink and protrude substantially perpendicular to the coolant flow. (See FIG. 2 ).
- the thermal boss 150 is a coolant bypass elimination feature which eliminates a dead zone where the coolant flow therein resembles laminar flow with a slowly moving boundary layer. Slowly moving boundary layers tend to act like thermal insulators.
- the coolant flow at the location of the thermal boss 150 is converted from laminar flow to turbulent flow by redirecting the coolant flow along the wall of the coolant bypass device towards a nearby heat sink pin fin 120 .
- the added surface area of the thermal boss and the additional turbulent flow impinging against the heat sink pin fin 120 further increases heat transfer with the heat sink pin fin.
- the thermal boss 150 has a draft or a slope extending from the o-ring 101 to the floor of the chassis 100 that matches a taper of the heat sink pin fin 120 .
- the matching draft and taper create a uniform coolant bypass channel 115 between the thermal boss 150 and the nearest heat sink pin fin 120 .
- the surface of the thermal boss 150 is a smooth, curvilinear surface that minimizes fluid friction across its surface thereby minimizing its incremental contribution to the pressure drop across the entire heat sink 10 .
- Non-limiting exemplary shapes of the thermal boss 150 may include a half cone, a tapered wave shape (i.e. sinusoidal), or other shape that may be found to both minimize fluid friction and maintain a coolant channel with a uniform spacing between the thermal boss and a proximate heat sink pin fin 120 .
- FIG. 1 b also illustrates a complimentary feature comprising one or more chassis pin fins 160 which are depicted herein as being attached to the floor of the chassis 100 .
- the chassis pin fin(s) 160 may be cast as part of the floor portion of the chassis 100 or may be added after casting by means known in the art such as by welding or sintering.
- the chassis pin fin(s) 160 may be of any height and can be used to control the pressure drop across the entire heat sink 10 .
- heat transfer i.e. pin fin height/surface area
- the chassis pin fin 160 may also be designed such that the draft, or taper, of the chassis pin fin is the same as the taper of a proximate heat sink pin fin 120 so that the width of the coolant channel(s) 115 between a heat sink pin fin 120 and a proximate chassis pin fin 160 is uniform along the length of the chassis pin fin 160 .
- the uniformity in the width of the coolant channel 115 when applied across the entire coolant cavity 105 , allows the spacing between the heat sink pins fins 120 and the chassis pin fins 160 and between heat sink pin fins and the thermal bosses 150 to be used as an adjustable manufacturing parameter. The spacing may be used to fine tune the fluid flow through and the pressure drop across the heat sink 10 .
- each coolant cavity may include chassis pin fins 160 of a different height than the chassis pin fins of another coolant cavity in the same heat sink 10 . This capability may be useful in controlling the pressure drop and heat transfer rate in one coolant cavity differently as compared to a second coolant cavity.
- a circuit board A attached to a coolant cavity A may generate a heat load that is greater than a circuit board B attached to second coolant cavity B that may be connected in series. Therefore it may be desirable to include chassis pin fins 160 of a greater height to increase the surface area of the coolant cavity 105 and increase the time that the coolant remains in the coolant cavity A (resulting in a high pressure drop) and include smaller chassis pin fins in coolant cavity B (resulting in a small pressure drop) because the heat load is lower.
- the total pressure drop may remain at a constant designated pressure drop across both coolant cavities.
- FIG. 1 c is an alternative embodiment.
- the pin fin(s) 120 in FIG. 1 c actually make contact with the floor of the chassis 100 whereas the embodiments of FIG. 1 b do not.
- Actual contact with the chassis 100 prevents coolant flow (i.e. laminar flow) under the pin fin 120 .
- Eliminating the interstitial space between the heat sink pin fin 120 and the chassis 100 forces the coolant into the turbulent flow which increases the heat absorption efficiency of the coolant 600 .
- the direct contact also allows for heat transfer directly between the cover 110 and the chassis 100 , if so desired.
- Direct contact of the heat sink pin fin 120 with the chassis 100 may be desirable in some situations and not in others.
- a direct contact may be desirable to eliminate a coolant bypass and to more efficiently dissipate heat to the additional mass of the chassis 100 making the coolant 600 flow more efficient.
- direct contact of the heat sink pin fin 120 with the chassis 100 may cause some undesired heat to be transferred from heat source A (high temp) to heat source B (lower temp). Therefore, a designable interstitial gap between the tip of the heat sink pin fin 120 and the chassis 100 may be found useful in some embodiments.
- FIG. 2 is an isomeric view of a chassis 100 partially defining the coolant cavity 105 showing several exemplary thermal bosses 150 regularly spaced along a side of the chassis 100 .
- this particular embodiment there are illustrated two rows of chassis pin fins 160 between heat sink pin fins 120 .
- the thermal pin fin(s) 120 that depend from the cover are positioned between the pairs of chassis pin fins 160 with substantially uniform spacing between each of the heat sink pin fins 120 and each of the chassis pin fins along their proximate surfaces. (See also FIG. 3 ).
- FIG. 4 is a cross-sectional view of the portion of a coolant cavity 105 depicted in the plan view of FIG. 3 as viewed from line 4 - 4 .
- Heat sink pin fins 120 a - d depend from cover 100 upon which a heat source A may be fixedly attached.
- Chassis pin fins 160 w - z extend upward from the floor of the chassis 100 upon which a heat source B may be fixedly attached.
- the width of the channels between heat sink pin fins a-e 120 and the chassis pin fins u-z 160 is essentially uniform. Exemplary spacing between heat sink pin fins 120 and the chassis pin fins 160 is shown in FIGS. 3 and 4 . (e.g., See spacing (u-a), (a-v), (v-b), (b-w), (w-c), (c-x), (x-d), (d-y), (y-e) and (e-z))
- FIG. 5 presents an exemplary embodiment of a single pass heat exchanger manifold 510 comprising three coolant cavities 105 .
- Each coolant cavity 105 comprises a plurality of thermal bosses 150 and a cover 110 or base plate from which depends the heat sink pin fins 120 .
- Each cover 110 is thermodynamically attached to a heat source (A, B, C) which may be an electronic power module or other heat source.
- the heat exchanger manifold 510 also comprises a second cover 100 wherein is configured three sets of chassis pin fins 160 that mesh with a corresponding set of heat sink pin fins 120 thereby creating uniform coolant channels therebetween when assembled.
- coolant 600 enters the coolant inlet port 512 , passes through each coolant cavity 105 in succession, and exits the heat exchanger manifold 510 through coolant outlet port 514 . While flowing through each coolant cavity 105 , the coolant 600 is evenly dispersed in a turbulent manner amongst the heat sink pin fins 120 where heat transfer takes place. The turbulence is maximized by the presence of the thermal bosses 150 and the chassis pin fins 160 thereby allowing all of the coolant 600 to impinge upon the plurality of heat sink pin fins in each coolant cavity.
- the chassis pin fins 160 and the thermal bosses 150 also transfer heat to the coolant.
- FIG. 6 presents an exemplary embodiment of a double pass heat exchanger manifold 510 comprising two manifolds including six coolant cavities 105 .
- Each coolant cavity 105 comprises a plurality of thermal bosses 150 and a cover 110 or base plate from which depends the heat sink pin fins 120 .
- Each cover 110 opposite the heat sink pin fins 120 , is thermally connected to a heat source (A, B, C) which may be an electronic power module or other electronic circuit board.
- Each heat exchanger manifold 510 also comprises a second cover 100 wherein is configured three sets of chassis pin fins 160 that mesh with the heat sink pin fins 120 depending from each cover 110 .
- coolant 600 enters the coolant inlet port 512 , passes through each coolant cavity 105 in succession and exits the heat exchanger manifold 510 through coolant outlet port 514 . While flowing through each coolant cavity 105 , the coolant 600 is evenly dispersed in a turbulent manner amongst the heat sink pin fins 120 where heat transfer takes place. The turbulence is maximized by the presence of the thermal bosses 150 and the chassis pin fins 160 thereby allowing all of the coolant 600 to impinge upon the plurality of heat sink pin fins 120 in each coolant cavity.
- FIGS. 5 and 6 illustrate two exemplary embodiments of a heat exchanger
- any number of manifolds may be connected in series, in parallel, or in a combination of series and parallel configurations and fall within the intended scope of the disclosure herein.
- any number of coolant cavities 105 may comprise a heat exchange manifold 510 , and the coolant cavities may be of any desired shape or configuration as may be required.
- the heat exchangers disclosed herein are positive pressure systems (i.e. pump operated), the heat exchangers may operate in any physical orientation (e.g. vertically, horizontally or upside down).
- the heat exchangers may also operate in a vacuum and in high vibration environments and are therefore suitable for space flight and for general aviation.
- the subject matter disclosed herein may operate in systems open to the atmosphere or in closed systems where any atmospheric gasses are vacated from the system.
Abstract
Description
- The present invention generally relates to heat sinks. More specifically the subject matter disclosed herein relates to structures and devices for increasing thermal efficiency in a heat sink.
- One concern in the design of electronic systems is the possibility of high heat loads created by concentrating a large number of circuits onto a single chip and more chips onto a single circuit board thus possibly reducing the life expectancy of such devices. Without efficient cooling systems, today's sophisticated electronics would fail far sooner than their design life expectancy. This is especially true when such devices must operate in high heat environments.
- Typically, coolant systems rely on forced air cooling commonly found in electronic devices such as personal computers, or liquid fluid flow heat exchangers that are commonly found in vehicles and in industrial environments. Liquid flow systems are known to be more efficient that forced air systems, particularly in environments where a source of relatively cold air is not readily available.
- It is generally known that the amount of heat absorbed by a heat sink is proportional to the surface area a heat exchanger and the temperature differential between the environmental temperature and the coolant temperature in the heat exchanger. Newton's first law of cooling, states that the rate of heat transfer to a body is proportional to the difference in temperatures between the body and its surroundings. A general formulation of heat transfer may be stated as:
-
dQ/dt=h·A(T env −T(f f)) - where,
Q=Thermal energy in joules
h=Heat transfer coefficient
A=Surface area of the heat exchanger
T(ff)=Temperature of the coolant as a function of flow rate and utilization efficiency.
Tenv=Temperature of the heat environment. - As such, the Newton's first law states that given a specific heat transfer coefficient, which is fixed by the material used, the rate of heat transfer is proportional to both the surface area of the heat exchanger and the difference between the coolant temperature and the ambient temperature, all else being equal. However, inefficiencies in the coolant flow within the heat exchanger are factors that reduce the effective flow and therefore increase effective temperature of the. Thus larger than necessary heat exchangers may be required.
- Accordingly, it is desirable to have more efficient heat exchangers. Furthermore, other desirable features and characteristics of the present invention will become apparent from the subsequent detailed description and the appended claims, taken in conjunction with the accompanying drawings and the foregoing technical field and background.
- It should be appreciated that this Summary is provided to introduce a selection of non-limiting concepts. The embodiments disclosed herein are exemplary as the combinations and permutations of various features of the subject matter disclosed herein are voluminous. The discussion herein is limited for the sake of clarity and brevity.
- The disclosure herein provides for a novel heat sink. The heat sink comprises a thermally conductive cover including a first inside surface portion and a first plurality of pin fins integral to and depending from the first inside surface portion. The heat sink also comprises a thermally conductive body portion having a second inside surface portion and a second plurality of pin fins integral to and extending from the second inside surface portion in a direction towards the first inside surface portion.
- In another embodiment, the heat sink comprises a thermally conductive cover including a first inside surface portion and a first plurality of pin fins integral to and depending from the first inside surface portion. The heat sink also includes a thermally conductive body portion having a second inside surface and a first boss protruding from the second inside surface portion, running substantially parallel to at least one of the first plurality of pin fins.
- In another embodiment, the heat sink comprises a thermally conductive cover including a first inside surface portion and a first plurality of pin fins integral to and depending from the first inside surface portion. The heat sink also includes a thermally conductive body portion having a second inside surface portion and a inside bottom surface portion with a first boss protruding from the second inside surface portion, running substantially parallel to at least one of the first plurality of pin fins and extending from the first inside surface portion to the inside bottom surface portion. In addition, the hat sink provides for a second plurality of pin fins integral to and extending from the bottom surface portion in a direction towards the first inside surface portion.
- The present invention will hereinafter be described in conjunction with the following drawing figures, wherein like numerals denote like elements.
-
FIG. 1 a is a cross-sectional view of a heat exchanger in accordance with the prior art; -
FIG. 1 b is a cross-sectional view of an exemplary heat sink in accordance with the subject matter disclosed herein; -
FIG. 1 c is a cross-sectional view of an alternative exemplary heat sink in accordance with the subject matter disclosed herein; -
FIG. 2 is an isometric view of an exemplary coolant cavity; -
FIG. 3 is an plan view of an exemplary embodiment showing thermal bosses and chassis pins fins and their configuration as disclosed herein; -
FIG. 4 is a broader cross-sectional view of an exemplary coolant cavity with abutting heat sources; -
FIG. 5 is an exploded isometric view of an exemplary heat sink according to the subject matter as disclosed herein; and -
FIG. 6 is an isometric view of an alternative embodiment of a heat sink as disclosed herein. - The following detailed description is merely exemplary in nature and is not intended to limit the subject matter or the application and uses of the subject matter described herein below. Furthermore, there is no intention to be bound by any theory presented in the preceding technical field, background, brief summary or the following detailed description.
- The subject matter disclosed herein relates to a novel heat sink or a system also known as a “heat sink”. A heat sink absorbs heat received from a heat source and dissipates the heat to a mass existing at a cooler temperature. The heat sink may be in thermodynamic contact with a heat source by physically abutting a heat source (e.g. an electronic circuit) such that heat is received by conduction, it may abut an intervening component that is indirectly receiving heat from a heat source or it may receive heat directly over an intervening distance by convection or radiation. A heat sink may absorb and dissipate heat from multiple heat sources.
- A heat sink may be of any shape, and may be designed to match the shape and/or size of a heat source. As a non-limiting example, the subject matter disclosed herein will refer to a heat sink shaped as a parallelepiped for simplicity. As such, a heat source may be easily attached to the top and to the bottom of the heat sink as well as to one of more sides of the heat sink. Further, those of ordinary skill in the art will recognize that the subject matter disclosed hereinafter may be applied to forced gaseous systems as well as to forced liquid systems. However, only forced liquid heat sink systems will be addressed herein in the interest of brevity and clarity.
-
FIG. 1 a is a cross-sectional view of a portion of onecoolant cavity 105 of a forced fluid heat exchanger 5 (i.e. a heat sink) that is known in the art. Thecoolant cavity 105 comprises a body portion orchassis 100 and acover 110. Thecover 110 includes a plurality of uniformly dispersed structures or heatsink pin fins 120 that depend from the underside of the top cover. The heatsink pin fins 120 may be of uniform conical or uniform truncated conical shape and may or may not come in contact with thechassis 100. - The purpose of a heat
sink pin fin 120 is to increase the surface area of theheat sink 5 that is in contact with the coolant flow 600 (seeFIG. 6 ). Asliquid coolant 600 passes the heatsink pin fin 120, some of the coolant impinges on the heat sink pin fin resulting in the transfer of heat from the heat sink pin fin to the coolant. As thecoolant 600 impinges on the heatsink pin fin 120, the fluid is slowed by friction resulting in an incremental pressure drop across theheat sink 5. - A gasket or an o-
ring 101 is used at the junction of thecover 110 and thechassis 100 to prevent coolant leakage therethrough. TheCover 110 is secured to thechassis 100 by fasteners 103 (SeeFIG. 5 ) that may be made of a heat conducting material or a heat insulating material. Thefasteners 103 may be any type of suitable fastener and may include bolts, clips, and the like. - Those of ordinary skill in the art will appreciate that the coolant inlet pressure, coolant flow rate, pressure drop across the heat sink and coolant inlet temperature are all pertinent variables in determining the amount of heat that a
heat sink 5 will absorb. A thermodynamic analysis of any particular heat sink embodiment is beyond the scope of the disclosure and will be omitted in favor of brevity and clarity. - However, it should be noted that the prior art heat sink depicted in
FIG. 1 a creates non-uniform coolant channels, or coolant bypasses 115′, between the heatsink pin fins 120 and the sides of thechassis 100. The heat sink ofFIG. 1 a also creates non-uniform coolant bypasses between adjacent heatsink pin fins 120. The term “non-uniform” is being defined herein as a varying width of acoolant channel 115′. Anon-uniform coolant channel 115′ allows some laminar coolant flow between components thereby allowing some coolant to avoid significant thermodynamic contact with a heat transferring component of theheat sink 10, such as heatsink pin fin 120. -
FIG. 1 b is a cross-sectional view of an embodiment of aheat sink 10 described in accordance with the subject matter being disclosed herein. Theheat sink 10 includes a plurality ofthermal bosses 150 as integral components of thechassis 100 and are preferably cast therewith. Thethermal bosses 150 may be spaced regularly along the internal wall of thechassis 100 of the heat sink and protrude substantially perpendicular to the coolant flow. (SeeFIG. 2 ). - The
thermal boss 150 is a coolant bypass elimination feature which eliminates a dead zone where the coolant flow therein resembles laminar flow with a slowly moving boundary layer. Slowly moving boundary layers tend to act like thermal insulators. By inserting athermal boss 150, the coolant flow at the location of thethermal boss 150 is converted from laminar flow to turbulent flow by redirecting the coolant flow along the wall of the coolant bypass device towards a nearby heatsink pin fin 120. The added surface area of the thermal boss and the additional turbulent flow impinging against the heatsink pin fin 120 further increases heat transfer with the heat sink pin fin. - The
thermal boss 150 has a draft or a slope extending from the o-ring 101 to the floor of thechassis 100 that matches a taper of the heatsink pin fin 120. The matching draft and taper create a uniformcoolant bypass channel 115 between thethermal boss 150 and the nearest heatsink pin fin 120. - The surface of the
thermal boss 150 is a smooth, curvilinear surface that minimizes fluid friction across its surface thereby minimizing its incremental contribution to the pressure drop across theentire heat sink 10. Non-limiting exemplary shapes of thethermal boss 150 may include a half cone, a tapered wave shape (i.e. sinusoidal), or other shape that may be found to both minimize fluid friction and maintain a coolant channel with a uniform spacing between the thermal boss and a proximate heatsink pin fin 120. -
FIG. 1 b also illustrates a complimentary feature comprising one or morechassis pin fins 160 which are depicted herein as being attached to the floor of thechassis 100. The chassis pin fin(s) 160 may be cast as part of the floor portion of thechassis 100 or may be added after casting by means known in the art such as by welding or sintering. The chassis pin fin(s) 160 may be of any height and can be used to control the pressure drop across theentire heat sink 10. One of ordinary skill in the art will appreciate that there is a trade off between heat transfer (i.e. pin fin height/surface area) and the pressure drop across the coolant cavity. - Similar to the
thermal boss 150, thechassis pin fin 160 may also be designed such that the draft, or taper, of the chassis pin fin is the same as the taper of a proximate heatsink pin fin 120 so that the width of the coolant channel(s) 115 between a heatsink pin fin 120 and a proximatechassis pin fin 160 is uniform along the length of thechassis pin fin 160. The uniformity in the width of thecoolant channel 115, when applied across theentire coolant cavity 105, allows the spacing between the heat sink pinsfins 120 and thechassis pin fins 160 and between heat sink pin fins and thethermal bosses 150 to be used as an adjustable manufacturing parameter. The spacing may be used to fine tune the fluid flow through and the pressure drop across theheat sink 10. - Since the
heat sink 10 may be constructed to include multiple coolant cavities 105 (SeeFIGS. 5 and 6 ), each coolant cavity may includechassis pin fins 160 of a different height than the chassis pin fins of another coolant cavity in thesame heat sink 10. This capability may be useful in controlling the pressure drop and heat transfer rate in one coolant cavity differently as compared to a second coolant cavity. - For example, a circuit board A attached to a coolant cavity A may generate a heat load that is greater than a circuit board B attached to second coolant cavity B that may be connected in series. Therefore it may be desirable to include
chassis pin fins 160 of a greater height to increase the surface area of thecoolant cavity 105 and increase the time that the coolant remains in the coolant cavity A (resulting in a high pressure drop) and include smaller chassis pin fins in coolant cavity B (resulting in a small pressure drop) because the heat load is lower. However, the total pressure drop may remain at a constant designated pressure drop across both coolant cavities. -
FIG. 1 c is an alternative embodiment. However, the pin fin(s) 120 inFIG. 1 c actually make contact with the floor of thechassis 100 whereas the embodiments ofFIG. 1 b do not. Actual contact with thechassis 100 prevents coolant flow (i.e. laminar flow) under thepin fin 120. Eliminating the interstitial space between the heatsink pin fin 120 and thechassis 100 forces the coolant into the turbulent flow which increases the heat absorption efficiency of thecoolant 600. The direct contact also allows for heat transfer directly between thecover 110 and thechassis 100, if so desired. - Direct contact of the heat
sink pin fin 120 with thechassis 100 may be desirable in some situations and not in others. For example, in embodiments that include a heat source A (See,FIG. 4 ) attached to only thechassis 100 or cover 110, a direct contact may be desirable to eliminate a coolant bypass and to more efficiently dissipate heat to the additional mass of thechassis 100 making thecoolant 600 flow more efficient. In other embodiments where there may be a relatively high temperature heat source A abutting thecover 110 and a lower temperature heat source B abutting thechassis 100, direct contact of the heatsink pin fin 120 with thechassis 100 may cause some undesired heat to be transferred from heat source A (high temp) to heat source B (lower temp). Therefore, a designable interstitial gap between the tip of the heatsink pin fin 120 and thechassis 100 may be found useful in some embodiments. -
FIG. 2 is an isomeric view of achassis 100 partially defining thecoolant cavity 105 showing several exemplarythermal bosses 150 regularly spaced along a side of thechassis 100. In this particular embodiment there are illustrated two rows ofchassis pin fins 160 between heatsink pin fins 120. However, in some embodiments there may as fewer than two rows ofchassis pin fins 160. There may be three or more rows in other embodiments. - When the
cover 110 is installed on top of thechassis 100 with O-ring 101 positioned therebetween, the thermal pin fin(s) 120 that depend from the cover are positioned between the pairs ofchassis pin fins 160 with substantially uniform spacing between each of the heatsink pin fins 120 and each of the chassis pin fins along their proximate surfaces. (See alsoFIG. 3 ). -
FIG. 4 is a cross-sectional view of the portion of acoolant cavity 105 depicted in the plan view ofFIG. 3 as viewed from line 4-4. Heatsink pin fins 120 a-d depend fromcover 100 upon which a heat source A may be fixedly attached. Chassis pin fins 160 w-z extend upward from the floor of thechassis 100 upon which a heat source B may be fixedly attached. The width of the channels between heat sink pin fins a-e 120 and the chassis pin fins u-z 160 is essentially uniform. Exemplary spacing between heatsink pin fins 120 and thechassis pin fins 160 is shown inFIGS. 3 and 4 . (e.g., See spacing (u-a), (a-v), (v-b), (b-w), (w-c), (c-x), (x-d), (d-y), (y-e) and (e-z)) -
FIG. 5 presents an exemplary embodiment of a single passheat exchanger manifold 510 comprising threecoolant cavities 105. Eachcoolant cavity 105 comprises a plurality ofthermal bosses 150 and acover 110 or base plate from which depends the heatsink pin fins 120. Eachcover 110 is thermodynamically attached to a heat source (A, B, C) which may be an electronic power module or other heat source. Theheat exchanger manifold 510 also comprises asecond cover 100 wherein is configured three sets ofchassis pin fins 160 that mesh with a corresponding set of heatsink pin fins 120 thereby creating uniform coolant channels therebetween when assembled. In this particular embodiment,coolant 600 enters thecoolant inlet port 512, passes through eachcoolant cavity 105 in succession, and exits theheat exchanger manifold 510 throughcoolant outlet port 514. While flowing through eachcoolant cavity 105, thecoolant 600 is evenly dispersed in a turbulent manner amongst the heatsink pin fins 120 where heat transfer takes place. The turbulence is maximized by the presence of thethermal bosses 150 and thechassis pin fins 160 thereby allowing all of thecoolant 600 to impinge upon the plurality of heat sink pin fins in each coolant cavity. One of ordinary skill in the art will recognize thechassis pin fins 160 and thethermal bosses 150 also transfer heat to the coolant. -
FIG. 6 presents an exemplary embodiment of a double passheat exchanger manifold 510 comprising two manifolds including sixcoolant cavities 105. Eachcoolant cavity 105 comprises a plurality ofthermal bosses 150 and acover 110 or base plate from which depends the heatsink pin fins 120. Eachcover 110, opposite the heatsink pin fins 120, is thermally connected to a heat source (A, B, C) which may be an electronic power module or other electronic circuit board. Eachheat exchanger manifold 510 also comprises asecond cover 100 wherein is configured three sets ofchassis pin fins 160 that mesh with the heatsink pin fins 120 depending from eachcover 110. - In this
exemplary embodiment coolant 600 enters thecoolant inlet port 512, passes through eachcoolant cavity 105 in succession and exits theheat exchanger manifold 510 throughcoolant outlet port 514. While flowing through eachcoolant cavity 105, thecoolant 600 is evenly dispersed in a turbulent manner amongst the heatsink pin fins 120 where heat transfer takes place. The turbulence is maximized by the presence of thethermal bosses 150 and thechassis pin fins 160 thereby allowing all of thecoolant 600 to impinge upon the plurality of heatsink pin fins 120 in each coolant cavity. - While
FIGS. 5 and 6 illustrate two exemplary embodiments of a heat exchanger, it will be appreciated that any number of manifolds may be connected in series, in parallel, or in a combination of series and parallel configurations and fall within the intended scope of the disclosure herein. It will further be appreciated that any number ofcoolant cavities 105 may comprise aheat exchange manifold 510, and the coolant cavities may be of any desired shape or configuration as may be required. - Because the heat exchangers disclosed herein are positive pressure systems (i.e. pump operated), the heat exchangers may operate in any physical orientation (e.g. vertically, horizontally or upside down). The heat exchangers may also operate in a vacuum and in high vibration environments and are therefore suitable for space flight and for general aviation. Further, the subject matter disclosed herein may operate in systems open to the atmosphere or in closed systems where any atmospheric gasses are vacated from the system.
- While at least one exemplary embodiment has been presented in the foregoing detailed description, it should be appreciated that a vast number of variations exist. It should also be appreciated that the exemplary embodiment or exemplary embodiments are only examples, and are not intended to limit the scope, applicability, or configuration of the invention in any way. Rather, the foregoing detailed description will provide those skilled in the art with a convenient road map for implementing an exemplary embodiment or exemplary embodiments. It should be understood that various changes may be made in the function and arrangement of elements described in an exemplary embodiment without departing from the scope of the invention as set forth in the appended claims and the legal equivalents thereof.
Claims (20)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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US12/566,042 US20110067841A1 (en) | 2009-09-24 | 2009-09-24 | Heat sink systems and devices |
DE102010040610A DE102010040610A1 (en) | 2009-09-24 | 2010-09-13 | Systems and devices with a heat sink |
CN201010293333XA CN102034771B (en) | 2009-09-24 | 2010-09-21 | Heat sink systems and devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US12/566,042 US20110067841A1 (en) | 2009-09-24 | 2009-09-24 | Heat sink systems and devices |
Publications (1)
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US20110067841A1 true US20110067841A1 (en) | 2011-03-24 |
Family
ID=43755612
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US12/566,042 Abandoned US20110067841A1 (en) | 2009-09-24 | 2009-09-24 | Heat sink systems and devices |
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US (1) | US20110067841A1 (en) |
CN (1) | CN102034771B (en) |
DE (1) | DE102010040610A1 (en) |
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US20220316817A1 (en) * | 2021-03-30 | 2022-10-06 | Asia Vital Components Co., Ltd. | Liquid-cooling heat dissipation structure |
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Also Published As
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CN102034771B (en) | 2013-10-16 |
CN102034771A (en) | 2011-04-27 |
DE102010040610A1 (en) | 2011-05-05 |
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