US20110063450A1 - Camera module - Google Patents
Camera module Download PDFInfo
- Publication number
- US20110063450A1 US20110063450A1 US12/926,317 US92631710A US2011063450A1 US 20110063450 A1 US20110063450 A1 US 20110063450A1 US 92631710 A US92631710 A US 92631710A US 2011063450 A1 US2011063450 A1 US 2011063450A1
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- US
- United States
- Prior art keywords
- holder
- housing
- camera module
- end portion
- coupled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B11/00—Filters or other obturators specially adapted for photographic purposes
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Definitions
- the present invention relates to a camera module.
- camera modules are mounted on IT devices such as mobile terminals, PDAs (Personal Digital Assistant), MP3 players and so on.
- IT devices such as mobile terminals, PDAs (Personal Digital Assistant), MP3 players and so on.
- the resolution of the camera modules changes from 300,000 pixels (VGA) to several million pixels, and the reduction in size and thickness of the camera modules are being performed depending on mounting targets.
- the camera module provides various additional functions, such as auto-focusing (AF) and optical zoom.
- AF auto-focusing
- optical zoom optical zoom
- the camera modules are manufactured by using main parts of charge coupled device (CCD) or complementary metal oxide semiconductor (CMOS) image sensors. Incident light transmitted through the lens is condensed by the image sensor and is stored as data in a memory. The stored data is displayed as an image through a display medium, such as liquid crystal display (LCD) or PC monitor.
- CCD charge coupled device
- CMOS complementary metal oxide semiconductor
- Typical camera modules are manufactured by a chip-on-film (COF) method, a chip-on-board (COB) method and the like.
- COF chip-on-film
- COB chip-on-board
- FIG. 1 is an exploded perspective view of a conventional camera module manufactured by the COB method
- FIG. 2 is a cross-sectional view of the conventional camera module.
- a printed board 11 having a CCD or CMOS image sensor 12 mounted thereon through wire bonding is coupled to a lower end portion of a housing 13 formed of plastic, and a lens barrel 16 having a cylindrical body 14 a extending downward is coupled to a lower end portion of a barrel 13 a extending upward from the housing 13 .
- the housing 13 and the lens barrel 14 are coupled to each other by coupling a female screw portion 13 b formed on the inner circumferential surface of the barrel 13 a to a male screw portion 14 b formed on the outer circumferential surface of the cylindrical body 14 a.
- an IR filter 15 is interposed between a lens 14 c mounted in the lens barrel 14 and the image sensor 12 attached on the upper surface of the printed board 11 so as to cut off excessive long-wavelength infrared rays incident on the image sensor 12 .
- the camera module assembled in such a manner, while light incident from a specific object passes through the lens 14 c , an image is inverted so that the focus is adjusted on the surface of the image sensor 12 .
- an adhesive is injected between the barrel 13 a of the housing 13 and the lens barrel 14 such that the housing 13 and the lens barrel 14 are bonded to each other. Then, the camera module is finalized.
- the lens barrel 14 is inserted into the upper opening of the housing 13 such that the lens barrel 14 and the housing 13 are closely coupled to each other through the screw coupling using the female and male screw portions 13 b and 14 b formed on the inner and outer circumferential surfaces of the housing 13 and the lens barrel 14 .
- height adjustment is performed by rotating the lens barrel 14 at the upper end portion of the housing 13 , focus adjustment between the lens 14 c within the lens barrel 14 and the image sensor 12 mounted on the printed board 11 is achieved.
- the particles occurring between the housing 13 and the lens barrel 14 inevitably fall onto the upper surface of the IR filter 14 or the light receiving region of the image sensor 12 , because the housing 13 is rocked left and right when the focus adjustment is performed by rotating the lens barrel 14 mounted on the upper end portion of the housing 13 . Therefore, when an image is reproduced by the image sensor 12 , the particles have a large effect on the image.
- the lens may be tilted along a spiral angle formed in the lens barrel 14 when the lens barrel 14 is rotated along the spiral contact surface.
- the housing 13 having the IR filter 15 coupled thereto is mounted on the printed board 11 after the image sensor 12 is wire-bonded to the printed board 11 , movable foreign matters may fall into the housing 13 , or specifically onto the upper end portion of the image sensor 12 such that defects frequently occur. Furthermore, since passive elements (not shown in FIG. 1 ) are mounted around the image sensor 12 , flux or other foreign matters frequently occur.
- a sample manufacturing schedule needs to be reduced by standardizing a camera module.
- An advantage of the present invention is that it provides a camera module which adopts a holder assembly which has an image sensor and an IR filter mounted therein and is formed of a ceramic material, thereby minimizing defects caused by foreign matters. Since the holder assembly is previously manufactured, it is possible to quickly respond to users' requests. Further, as a reflow process is adopted, it is possible to simplify the manufacturing process. Further, when defects occur in the camera module, a rework operation can be easily performed, and the manufacturing cost can be reduced.
- Another advantage of the invention is that it provides a method of manufacturing a camera module.
- a method of manufacturing a camera module including a housing that includes one or more lenses which are sequentially fixed and coupled and of which the focus does not need to be adjusted; a holder assembly that is coupled to a lower end portion of the housing; and a main substrate that is coupled to a lower end portion of the holder assembly.
- the method comprises providing bonding media for bonding the main substrate through a reflow process such that the bonding media are disposed on a lower surface of a holder substrate composing the lower end portion of the holder assembly, and fixing an image sensor on an upper surface of the holder substrate through wire bonding; mounting a holder formed of a ceramic material so as to surround the image sensor wire-bonded to the holder substrate; mounting an IR filter on the holder so as to seal an internal space of the holder, which is defined by the holder substrate and the holder and in which the image sensor is included, thereby completely manufacturing the holder assembly; bonding the holder assembly to the main substrate through a reflow process; and performing fine focus adjustment while sliding the housing into the housing mounting portion formed at the upper end portion of the holder body coupled to the main substrate.
- the housing may include a support portion which extends from an inner lower end of the housing so as to come in contact with the upper end portion of the holder assembly.
- the support portion may be provided so as to be disposed on an upper end portion of the IR filter.
- the method further comprises providing passive elements on the holder substrate such that the passive elements are positioned outside the holder, before the bonding of the holder assembly to the main substrate.
- a camera module comprises a housing that includes one or more lenses which are sequentially fixed and coupled and of which the focus does not need to be adjusted; a holder assembly that is coupled to a lower end portion of the housing; and a main substrate that is coupled to a lower end portion of the holder assembly through a reflow process.
- the holder assembly includes a holder including: a housing mounting portion that is formed on an upper end portion of the holder such that fine focus adjustment can be performed in a sliding manner when the holder assembly is coupled to the lower end portion of the housing; and a filter mounting portion that is formed in such a manner that an internal space of the holder is sealed by an IR filter, the holder being formed of a ceramic material on which a reflow process can be performed; the IR filter that is mounted on the filter mounting portion formed in the holder; and a holder substrate that is coupled to a lower end portion of the holder and includes an image sensor fixed on an upper surface thereof through wire bonding and bonding media for bonding the main substrate through a reflow process, the bonding media being provided on a lower surface of the holder substrate.
- the housing may include a support portion which extends from an inner lower end of the housing so as to come in contact with the upper end portion of the holder assembly.
- the support portion may extend so as to be disposed on an upper end portion of the IR filter.
- the filter mounting portion may be formed on an inner surface of the upper end portion of the holder.
- the filter mounting portion may be formed on an inner surface of a middle portion of the holder.
- the camera module further comprises passive elements that are provided on the holder substrate so as to be positioned outside the holder.
- the bonding media formed on the lower surface of the holder substrate may be solder balls or pads.
- FIG. 1 is an exploded perspective view of a conventional camera module manufactured by the COB method
- FIG. 2 is a cross-sectional view of the conventional camera module
- FIG. 3 is a cross-sectional view of a holder assembly according to a first embodiment of the invention
- FIG. 4 is a cross-sectional view of a camera module 40 according to a second embodiment of the invention.
- FIG. 5 is a cross-sectional view of a camera module 50 according to a third embodiment of the invention.
- FIG. 6 is a cross-sectional view of a camera module 60 according to a fourth embodiment of the invention.
- FIGS. 7A to 7G are process diagrams sequentially showing a method of manufacturing a camera module according to the invention.
- FIG. 3 is a cross-sectional view of a holder assembly according to a first embodiment of the invention.
- the hold assembly 30 shown in FIG. 3 includes a holder 31 , a holder substrate 32 , an image sensor 33 , an IR filter 34 , and bonding media 35 for a reflow process.
- the holder 31 formed in a cylindrical shape is mounted so as to surround the image sensor 33 fixed on the holder substrate 32 through wire bonding.
- a housing (not shown in FIG. 3 ) including a lens is coupled to the holder assembly 30
- a lower end portion of the housing and an upper end portion of the holder assembly 30 are coupled in a sliding manner. Therefore, a housing mounting portion 36 is formed along the circumferential surface of the upper end of the holder 31 .
- a stepped filter mounting portion 37 is formed along the inner circumferential surface of the upper end of the holder 31 , and the IR filter 34 is mounted on the filter mounting portion 37 .
- the IR filter 34 is fixed to the holder 31 through an adhesive such as ultraviolet (UV) bond. Therefore, the depth of the filter mounting portion 37 within the holder 31 corresponds to the height of the IR filter 34 .
- the IR filter 34 serves to cut off excessive infrared rays incident on the image sensor 33 and to ‘seal’ the holder assembly 30 .
- the IR filter 34 serves as a cover glass for protecting the image sensor 33 within the holder assembly 30 from external contaminants which may occur during a variety of processes to be subsequently performed, even though it will be described below in a method of manufacturing a camera module.
- the lower end portion of the holder 31 is coupled to the holder substrate 32 .
- the image sensor 33 is fixed on the upper surface of the holder substrate 32 through wire bonding, and the bonding media 35 for bonding a main substrate 41 (refer to FIG. 4 ) are provided on the lower surface of the holder substrate 32 .
- solder balls or pads are provided as the bonding media 35 for a reflow process.
- the main substrate 41 and the holder assembly 30 are previously bonded to each other through a reflow process before the housing 42 (refer to FIG. 4 ) is coupled.
- the process for bonding the camera module to the main substrate is separately performed.
- the bonding media 35 are previously mounted between the holder assembly 30 and the main substrate 41 such that a plurality of holder assemblies 30 can be bonded to a plurality of main substrates through one process. Therefore, it is possible to simplify the manufacturing process.
- the holder 31 is formed of a ceramic substrate on which the reflow process can be performed. Accordingly, only the holder assembly 30 can be attached to the main substrate 41 through the reflow process, before the housing 42 including lenses 42 a is installed.
- passive elements 38 such as a capacitor, an inductor, and a resistor are mounted on the holder substrate 32 so as to be disposed outside the holder 31 .
- passive elements 38 are mounted around the image sensor 33 , foreign matters may have an effect upon the image sensor 33 .
- the passive elements 38 are isolated from the image sensor 33 within the holder 31 , it is possible to minimize the contamination of the image sensor 33 caused by the occurrence of foreign matters.
- a standardized and commonly-used module can be previously manufactured as the holder assembly 30 so as to be mounted on the main substrate 41 depending on a user's request, which makes it possible to quickly respond to the user's request. Therefore, it is possible to reduce the manufacturing time.
- FIG. 4 is a cross-sectional view of a camera module 40 according to a second embodiment of the invention.
- the camera module 40 includes a main substrate, a housing 42 , and the holder assembly 30 described in the first embodiment.
- the holder assembly 30 is mounted on the main substrate 41 , and a reflow process is then performed.
- the reflow process is performed at a high temperature of about 250° C., the reflow process is performed before the housing formed of plastic such as PVC is mounted on the holder assembly 30 .
- the housing 42 is mounted on the upper end portion of the holder assembly 30 .
- the housing 42 includes one or more lenses 42 a which are sequentially fixed and coupled and of which the focus does not need to be adjusted.
- the housing 42 is inserted into the housing mounting portion 36 of the holder 31 while being adjusted in a sliding manner. Therefore, the depth of the housing mounting portion 36 is designed in such a manner that a focal distance (that is, a distance from the lower end of the lens to the upper end of the image sensor) can be adjusted.
- the screw adjustment should be performed so as to adjust a focal distance. Accordingly, foreign matters may occur during the screw adjustment. In this embodiment, however, since the housing 42 is adjusted in a sliding manner, it is possible to minimize foreign matters.
- FIG. 5 is a cross-sectional view of a camera module 50 according to a third embodiment of the present invention.
- the housing 42 further includes a support portion 42 b which extends from an inner lower end of the housing 42 so as to come in contact with the upper end of the holder assembly. That is, the housing 42 further includes the cylindrical support portion 42 b formed at the inner lower end thereof. The support portion 42 b may be disposed on the upper end of the IR filter 34 .
- the housing 42 and the holder assembly 30 can be coupled more reliably. Further, when the housing 42 is coupled, the housing 42 can be inserted into the holder 31 without a separate height adjustment process. In other words, the height of the support portion 42 b is determined after a desirable focal distance is previously calculated. Then, the housing 42 can be inserted into the holder 31 without a separate height adjustment process. Therefore, it is possible to prevent an image error caused by ‘tilting’ when the image sensor module and the housing are coupled.
- FIG. 6 is a cross-sectional view of a camera module 60 according to a fourth embodiment of the invention.
- a filter mounting portion 37 a is formed on the inner surface of a middle portion of the holder 31 of the holder assembly 30 .
- pads may be used instead of solder balls.
- the pads reliably bond the holder assembly 30 to the main substrate 41 , while an adhesive provided on the lower ends of the pads is molten during a high-temperature reflow process. Therefore, it is possible to simplify the manufacturing process, as in the reflow process using the solder balls.
- a holder assembly 30 is manufactured. Then, a main substrate 41 is bonded to the holder assembly 30 through a reflow process, and a housing 42 is mounted on the upper end portion of the holder assembly 30 . Since a general reflow process is performed at a high temperature of about 250° C., the housing formed of plastic such as PVC is mounted on the holder assembly 30 after the reflow process.
- the holder assembly 30 is manufactured by the following process.
- bonding media 35 for bonding the main substrate 40 through a reflow process are provided on the lower surface of a holder substrate 32 composing the lower end portion of the holder assembly 30 , and an image sensor 33 is mounted on the upper surface of the holder substrate 32 (refer to FIG. 7A ) and is fixed through wire bonding (refer to FIG. 7B ).
- bonding media 35 solder balls or pads may be used.
- a holder 31 formed of a ceramic material having thermal resistance is mounted on the holder substrate 32 so as to surround the image sensor 33 wire-bonded on the holder substrate 32 (refer to FIG. 7C ). Since the holder 31 is formed of a ceramic material, it can endure high-temperature heat generated during a reflow process.
- a housing mounting portion 36 on which a housing 42 is to be mounted is provided on the upper end portion of the holder 31 along the circumferential surface of the holder 31 .
- a filter mounting portion 37 on which an IR filter is to be mounted is provided along the inner circumferential surface of the upper end portion of the holder 31 .
- an adhesive such as UV bond may be used.
- the IR filter 34 may serve as a cover glass for protecting the expensive image sensor 33 from external contaminants which may occur during a variety of processes to be subsequently performed (refer to FIG. 7D ).
- passive elements 38 are provided on the holder substrate 32 so as to be positioned outside the holder 31 (refer to FIG. 7E ).
- the passive elements 38 may be provided on the upper end portion of the holder 31 as well as the holder substrate 32 (not shown).
- the holder assembly 30 constructed in such a manner is bonded to the main substrate 41 through a reflow process (refer to FIG. 7F ).
- a reflow process (refer to FIG. 7F )
- the holder assembly 30 since a plurality of holder assemblies can be bonded to a plurality of main substrates through one process, it is possible to simplify the manufacturing process. Further, since the holder assembly 30 is previously manufactured, it is possible to quickly respond to users' requests, thereby reducing the manufacturing time. That is because, since a proper quantity of main substrates 41 are bonded through the reflow process in accordance with users' requests, mass production can be achieved.
- the housing 42 is mounted on the housing mounting portion 36 of the holder assembly 30 in a sliding manner. While the housing 42 is slowly slid into the housing mounting portion 36 of the holder assembly 30 , fine focus adjustment is performed (refer to FIG. 7G ). Therefore, it is possible to minimize foreign matters which have occurred during the screw adjustment in the conventional screw coupling method.
- defects caused by foreign matters can be minimized. Further, since the holder assembly is previously manufactured, it is possible to quickly respond to users' requests. Further, since the reflow process is adopted, the manufacturing process can be simplified, and throughput can be enhanced. Further, when defects occur in the camera module, a rework operation can be easily performed, and the image sensor can be reused, which makes it possible to reduce the manufacturing cost.
Abstract
A camera module including a housing that includes one or more lenses which are sequentially fixed and coupled and of which the focus does not need to be adjusted; a holder assembly that is coupled to a lower end portion of the housing; and a main substrate that is coupled to a lower end portion of the holder assembly through a reflow process, wherein the holder assembly includes a holder including a housing mounting portion, and a filter mounting portion that is formed in such a manner that an internal space of the holder is sealed by an IR filter.
Description
- This application is a U.S. divisional application filed under 37 USC 1.53(b) claiming priority benefit of U.S. Ser. No. 12/289,471 filed in the United States on Oct. 28, 2008, which claims earlier priority benefit to Korean Patent Application No. 10-2008-0077148 filed with the Korean Intellectual Property Office on Aug. 6, 2008, the disclosures of which are incorporated herein by reference.
- 1. Field
- The present invention relates to a camera module.
- 2. Description of the Related Art
- Recently, camera modules are mounted on IT devices such as mobile terminals, PDAs (Personal Digital Assistant), MP3 players and so on. With the development of technology, the resolution of the camera modules changes from 300,000 pixels (VGA) to several million pixels, and the reduction in size and thickness of the camera modules are being performed depending on mounting targets. Further, the camera module provides various additional functions, such as auto-focusing (AF) and optical zoom.
- The camera modules are manufactured by using main parts of charge coupled device (CCD) or complementary metal oxide semiconductor (CMOS) image sensors. Incident light transmitted through the lens is condensed by the image sensor and is stored as data in a memory. The stored data is displayed as an image through a display medium, such as liquid crystal display (LCD) or PC monitor.
- Typical camera modules are manufactured by a chip-on-film (COF) method, a chip-on-board (COB) method and the like. The COB method will be described with reference to drawings.
-
FIG. 1 is an exploded perspective view of a conventional camera module manufactured by the COB method, andFIG. 2 is a cross-sectional view of the conventional camera module. - In the
conventional camera module 10, a printedboard 11 having a CCD orCMOS image sensor 12 mounted thereon through wire bonding is coupled to a lower end portion of ahousing 13 formed of plastic, and a lens barrel 16 having acylindrical body 14 a extending downward is coupled to a lower end portion of abarrel 13 a extending upward from thehousing 13. - In the
camera module 10, thehousing 13 and thelens barrel 14 are coupled to each other by coupling afemale screw portion 13 b formed on the inner circumferential surface of thebarrel 13 a to amale screw portion 14 b formed on the outer circumferential surface of thecylindrical body 14 a. - Further, an
IR filter 15 is interposed between alens 14 c mounted in thelens barrel 14 and theimage sensor 12 attached on the upper surface of the printedboard 11 so as to cut off excessive long-wavelength infrared rays incident on theimage sensor 12. - In the camera module assembled in such a manner, while light incident from a specific object passes through the
lens 14 c, an image is inverted so that the focus is adjusted on the surface of theimage sensor 12. At this time, when a focus is optimally adjusted while thelens barrel 14 screwed to the upper end of thehousing 13 is rotated, an adhesive is injected between thebarrel 13 a of thehousing 13 and thelens barrel 14 such that thehousing 13 and thelens barrel 14 are bonded to each other. Then, the camera module is finalized. - In the camera module manufactured by the COB method, the
lens barrel 14 is inserted into the upper opening of thehousing 13 such that thelens barrel 14 and thehousing 13 are closely coupled to each other through the screw coupling using the female andmale screw portions housing 13 and thelens barrel 14. As height adjustment is performed by rotating thelens barrel 14 at the upper end portion of thehousing 13, focus adjustment between thelens 14 c within thelens barrel 14 and theimage sensor 12 mounted on the printedboard 11 is achieved. - Therefore, in the conventional camera modules manufactured by the above-described assembling method, when the
housing 13 and thelens barrel 14 are vertically coupled, and if the female andmale screws male screws - Further, the particles occurring between the
housing 13 and thelens barrel 14 inevitably fall onto the upper surface of theIR filter 14 or the light receiving region of theimage sensor 12, because thehousing 13 is rocked left and right when the focus adjustment is performed by rotating thelens barrel 14 mounted on the upper end portion of thehousing 13. Therefore, when an image is reproduced by theimage sensor 12, the particles have a large effect on the image. - Further, since the
housing 13 and thelens barrel 14 are coupled though the male and female screws, the lens may be tilted along a spiral angle formed in thelens barrel 14 when thelens barrel 14 is rotated along the spiral contact surface. - Once foreign matters fall onto the
lens 14 c or theimage sensor 12, they cannot be simply removed. Therefore, thecamera module 10 in which the foreign matters have occurred should be discarded as a whole. As a result, theexpensive lens 14 c or theimage sensor 12 is also discarded. - Further, since the
housing 13 having theIR filter 15 coupled thereto is mounted on the printedboard 11 after theimage sensor 12 is wire-bonded to the printedboard 11, movable foreign matters may fall into thehousing 13, or specifically onto the upper end portion of theimage sensor 12 such that defects frequently occur. Furthermore, since passive elements (not shown inFIG. 1 ) are mounted around theimage sensor 12, flux or other foreign matters frequently occur. - Further, in order to quickly respond to users' request which changes day by day, a sample manufacturing schedule needs to be reduced by standardizing a camera module.
- An advantage of the present invention is that it provides a camera module which adopts a holder assembly which has an image sensor and an IR filter mounted therein and is formed of a ceramic material, thereby minimizing defects caused by foreign matters. Since the holder assembly is previously manufactured, it is possible to quickly respond to users' requests. Further, as a reflow process is adopted, it is possible to simplify the manufacturing process. Further, when defects occur in the camera module, a rework operation can be easily performed, and the manufacturing cost can be reduced.
- Another advantage of the invention is that it provides a method of manufacturing a camera module.
- Additional aspect and advantages of the present general inventive concept will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the general inventive concept.
- According to an aspect of the invention, there is provided a method of manufacturing a camera module, the camera module including a housing that includes one or more lenses which are sequentially fixed and coupled and of which the focus does not need to be adjusted; a holder assembly that is coupled to a lower end portion of the housing; and a main substrate that is coupled to a lower end portion of the holder assembly. The method comprises providing bonding media for bonding the main substrate through a reflow process such that the bonding media are disposed on a lower surface of a holder substrate composing the lower end portion of the holder assembly, and fixing an image sensor on an upper surface of the holder substrate through wire bonding; mounting a holder formed of a ceramic material so as to surround the image sensor wire-bonded to the holder substrate; mounting an IR filter on the holder so as to seal an internal space of the holder, which is defined by the holder substrate and the holder and in which the image sensor is included, thereby completely manufacturing the holder assembly; bonding the holder assembly to the main substrate through a reflow process; and performing fine focus adjustment while sliding the housing into the housing mounting portion formed at the upper end portion of the holder body coupled to the main substrate.
- The housing may include a support portion which extends from an inner lower end of the housing so as to come in contact with the upper end portion of the holder assembly. The support portion may be provided so as to be disposed on an upper end portion of the IR filter.
- The method further comprises providing passive elements on the holder substrate such that the passive elements are positioned outside the holder, before the bonding of the holder assembly to the main substrate.
- According to another aspect of the invention, a camera module comprises a housing that includes one or more lenses which are sequentially fixed and coupled and of which the focus does not need to be adjusted; a holder assembly that is coupled to a lower end portion of the housing; and a main substrate that is coupled to a lower end portion of the holder assembly through a reflow process. The holder assembly includes a holder including: a housing mounting portion that is formed on an upper end portion of the holder such that fine focus adjustment can be performed in a sliding manner when the holder assembly is coupled to the lower end portion of the housing; and a filter mounting portion that is formed in such a manner that an internal space of the holder is sealed by an IR filter, the holder being formed of a ceramic material on which a reflow process can be performed; the IR filter that is mounted on the filter mounting portion formed in the holder; and a holder substrate that is coupled to a lower end portion of the holder and includes an image sensor fixed on an upper surface thereof through wire bonding and bonding media for bonding the main substrate through a reflow process, the bonding media being provided on a lower surface of the holder substrate.
- The housing may include a support portion which extends from an inner lower end of the housing so as to come in contact with the upper end portion of the holder assembly. The support portion may extend so as to be disposed on an upper end portion of the IR filter.
- The filter mounting portion may be formed on an inner surface of the upper end portion of the holder.
- The filter mounting portion may be formed on an inner surface of a middle portion of the holder.
- The camera module further comprises passive elements that are provided on the holder substrate so as to be positioned outside the holder.
- The bonding media formed on the lower surface of the holder substrate may be solder balls or pads.
- These and/or other aspects and advantages of the present general inventive concept will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
-
FIG. 1 is an exploded perspective view of a conventional camera module manufactured by the COB method; -
FIG. 2 is a cross-sectional view of the conventional camera module; -
FIG. 3 is a cross-sectional view of a holder assembly according to a first embodiment of the invention; -
FIG. 4 is a cross-sectional view of acamera module 40 according to a second embodiment of the invention; -
FIG. 5 is a cross-sectional view of acamera module 50 according to a third embodiment of the invention; -
FIG. 6 is a cross-sectional view of acamera module 60 according to a fourth embodiment of the invention; and -
FIGS. 7A to 7G are process diagrams sequentially showing a method of manufacturing a camera module according to the invention. - Reference will now be made in detail to the embodiments of the present general inventive concept, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout. The embodiments are described below in order to explain the present general inventive concept by referring to the figures. In the drawings, the thicknesses of layers and regions are exaggerated for clarity.
- Hereinafter, a camera module and a method of manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings.
-
FIG. 3 is a cross-sectional view of a holder assembly according to a first embodiment of the invention. - The
hold assembly 30 shown inFIG. 3 includes aholder 31, aholder substrate 32, animage sensor 33, anIR filter 34, andbonding media 35 for a reflow process. - First, the
holder 31 formed in a cylindrical shape is mounted so as to surround theimage sensor 33 fixed on theholder substrate 32 through wire bonding. In the first embodiment, when a housing (not shown inFIG. 3 ) including a lens is coupled to theholder assembly 30, a lower end portion of the housing and an upper end portion of theholder assembly 30 are coupled in a sliding manner. Therefore, ahousing mounting portion 36 is formed along the circumferential surface of the upper end of theholder 31. - Further, a stepped
filter mounting portion 37 is formed along the inner circumferential surface of the upper end of theholder 31, and theIR filter 34 is mounted on thefilter mounting portion 37. For example, theIR filter 34 is fixed to theholder 31 through an adhesive such as ultraviolet (UV) bond. Therefore, the depth of thefilter mounting portion 37 within theholder 31 corresponds to the height of theIR filter 34. - The
IR filter 34 serves to cut off excessive infrared rays incident on theimage sensor 33 and to ‘seal’ theholder assembly 30. In other words, theIR filter 34 serves as a cover glass for protecting theimage sensor 33 within theholder assembly 30 from external contaminants which may occur during a variety of processes to be subsequently performed, even though it will be described below in a method of manufacturing a camera module. - Meanwhile, the lower end portion of the
holder 31 is coupled to theholder substrate 32. Theimage sensor 33 is fixed on the upper surface of theholder substrate 32 through wire bonding, and thebonding media 35 for bonding a main substrate 41 (refer toFIG. 4 ) are provided on the lower surface of theholder substrate 32. For example, solder balls or pads are provided as thebonding media 35 for a reflow process. - In the first embodiment, the
main substrate 41 and theholder assembly 30 are previously bonded to each other through a reflow process before the housing 42 (refer toFIG. 4 ) is coupled. In the conventional COB method, the process for bonding the camera module to the main substrate is separately performed. In the reflow process according to the invention, however, thebonding media 35 are previously mounted between theholder assembly 30 and themain substrate 41 such that a plurality ofholder assemblies 30 can be bonded to a plurality of main substrates through one process. Therefore, it is possible to simplify the manufacturing process. - However, since a general reflow process is performed at a high temperature of about 250° C., it was difficult to apply the reflow process to a camera module which is manufactured by the COB method and uses a housing formed of plastic such as PVC.
- Therefore, in this embodiment, the
holder 31 is formed of a ceramic substrate on which the reflow process can be performed. Accordingly, only theholder assembly 30 can be attached to themain substrate 41 through the reflow process, before thehousing 42 includinglenses 42 a is installed. - Further,
passive elements 38 such as a capacitor, an inductor, and a resistor are mounted on theholder substrate 32 so as to be disposed outside theholder 31. When the passive elements are mounted around theimage sensor 33, foreign matters may have an effect upon theimage sensor 33. In this embodiment, however, since thepassive elements 38 are isolated from theimage sensor 33 within theholder 31, it is possible to minimize the contamination of theimage sensor 33 caused by the occurrence of foreign matters. - According to this embodiment, a standardized and commonly-used module can be previously manufactured as the
holder assembly 30 so as to be mounted on themain substrate 41 depending on a user's request, which makes it possible to quickly respond to the user's request. Therefore, it is possible to reduce the manufacturing time. - Further, in the conventional camera module, individual components were sequentially assembled. In this embodiment, however, since the
holder assembly 30 is previously manufactured, the manufacturing process can be simplified. Further, a rework operation can be easily performed when defects occur in the camera module, and the lenses or image sensor can be reused. -
FIG. 4 is a cross-sectional view of acamera module 40 according to a second embodiment of the invention. - In this embodiment, the descriptions of the same technical construction as that of the first embodiment will be omitted, and like reference numerals will be attached to the same components.
- The
camera module 40 according to the second embodiment includes a main substrate, ahousing 42, and theholder assembly 30 described in the first embodiment. - First, the
holder assembly 30 is mounted on themain substrate 41, and a reflow process is then performed. In general, since the reflow process is performed at a high temperature of about 250° C., the reflow process is performed before the housing formed of plastic such as PVC is mounted on theholder assembly 30. - After the
holder assembly 30 is bonded to themain substrate 41, thehousing 42 is mounted on the upper end portion of theholder assembly 30. Thehousing 42 includes one ormore lenses 42 a which are sequentially fixed and coupled and of which the focus does not need to be adjusted. At this time, thehousing 42 is inserted into thehousing mounting portion 36 of theholder 31 while being adjusted in a sliding manner. Therefore, the depth of thehousing mounting portion 36 is designed in such a manner that a focal distance (that is, a distance from the lower end of the lens to the upper end of the image sensor) can be adjusted. - In the conventional camera module manufactured by the COB method, since the lens barrel and the housing are coupled through the screw portions, the screw adjustment should be performed so as to adjust a focal distance. Accordingly, foreign matters may occur during the screw adjustment. In this embodiment, however, since the
housing 42 is adjusted in a sliding manner, it is possible to minimize foreign matters. -
FIG. 5 is a cross-sectional view of acamera module 50 according to a third embodiment of the present invention. - In this embodiment, the descriptions of the same technical construction as those of the first and second embodiments will be omitted, and like reference numerals will be attached to the same components.
- The
housing 42 further includes asupport portion 42 b which extends from an inner lower end of thehousing 42 so as to come in contact with the upper end of the holder assembly. That is, thehousing 42 further includes thecylindrical support portion 42 b formed at the inner lower end thereof. Thesupport portion 42 b may be disposed on the upper end of theIR filter 34. - As the
support portion 42 b is adopted, thehousing 42 and theholder assembly 30 can be coupled more reliably. Further, when thehousing 42 is coupled, thehousing 42 can be inserted into theholder 31 without a separate height adjustment process. In other words, the height of thesupport portion 42 b is determined after a desirable focal distance is previously calculated. Then, thehousing 42 can be inserted into theholder 31 without a separate height adjustment process. Therefore, it is possible to prevent an image error caused by ‘tilting’ when the image sensor module and the housing are coupled. -
FIG. 6 is a cross-sectional view of acamera module 60 according to a fourth embodiment of the invention. - In this embodiment, the descriptions of the same technical construction as those of the first to third embodiments will be omitted, and like reference numerals will be attached to the same components.
- First, a
filter mounting portion 37 a is formed on the inner surface of a middle portion of theholder 31 of theholder assembly 30. - For the
bonding media 35, pads may be used instead of solder balls. Like the solder balls, the pads reliably bond theholder assembly 30 to themain substrate 41, while an adhesive provided on the lower ends of the pads is molten during a high-temperature reflow process. Therefore, it is possible to simplify the manufacturing process, as in the reflow process using the solder balls. - Hereinafter, a method of manufacturing a camera module according to an embodiment of the present invention will be described.
- In this embodiment, the descriptions of the same technical construction as those of the first to fourth embodiments will be omitted, and like reference numerals will be attached to the same components.
- First, a
holder assembly 30 is manufactured. Then, amain substrate 41 is bonded to theholder assembly 30 through a reflow process, and ahousing 42 is mounted on the upper end portion of theholder assembly 30. Since a general reflow process is performed at a high temperature of about 250° C., the housing formed of plastic such as PVC is mounted on theholder assembly 30 after the reflow process. - The
holder assembly 30 is manufactured by the following process. - First,
bonding media 35 for bonding themain substrate 40 through a reflow process are provided on the lower surface of aholder substrate 32 composing the lower end portion of theholder assembly 30, and animage sensor 33 is mounted on the upper surface of the holder substrate 32 (refer toFIG. 7A ) and is fixed through wire bonding (refer toFIG. 7B ). For thebonding media 35, solder balls or pads may be used. - Then, a
holder 31 formed of a ceramic material having thermal resistance is mounted on theholder substrate 32 so as to surround theimage sensor 33 wire-bonded on the holder substrate 32 (refer toFIG. 7C ). Since theholder 31 is formed of a ceramic material, it can endure high-temperature heat generated during a reflow process. - Next, a
housing mounting portion 36 on which ahousing 42 is to be mounted is provided on the upper end portion of theholder 31 along the circumferential surface of theholder 31. Further, afilter mounting portion 37 on which an IR filter is to be mounted is provided along the inner circumferential surface of the upper end portion of theholder 31. When theIR filter 34 is mounted, an adhesive such as UV bond may be used. - As the upper end portion of the
holder 31 is sealed by theIR filter 34, theIR filter 34 may serve as a cover glass for protecting theexpensive image sensor 33 from external contaminants which may occur during a variety of processes to be subsequently performed (refer toFIG. 7D ). - Before the
holder assembly 30 is bonded to themain substrate 41,passive elements 38 are provided on theholder substrate 32 so as to be positioned outside the holder 31 (refer toFIG. 7E ). Thepassive elements 38 may be provided on the upper end portion of theholder 31 as well as the holder substrate 32 (not shown). - The
holder assembly 30 constructed in such a manner is bonded to themain substrate 41 through a reflow process (refer toFIG. 7F ). At this time, since a plurality of holder assemblies can be bonded to a plurality of main substrates through one process, it is possible to simplify the manufacturing process. Further, since theholder assembly 30 is previously manufactured, it is possible to quickly respond to users' requests, thereby reducing the manufacturing time. That is because, since a proper quantity ofmain substrates 41 are bonded through the reflow process in accordance with users' requests, mass production can be achieved. - After the
holder assembly 30 and themain substrate 41 are bonded to each other, thehousing 42 is mounted on thehousing mounting portion 36 of theholder assembly 30 in a sliding manner. While thehousing 42 is slowly slid into thehousing mounting portion 36 of theholder assembly 30, fine focus adjustment is performed (refer toFIG. 7G ). Therefore, it is possible to minimize foreign matters which have occurred during the screw adjustment in the conventional screw coupling method. - According to the present invention, defects caused by foreign matters can be minimized. Further, since the holder assembly is previously manufactured, it is possible to quickly respond to users' requests. Further, since the reflow process is adopted, the manufacturing process can be simplified, and throughput can be enhanced. Further, when defects occur in the camera module, a rework operation can be easily performed, and the image sensor can be reused, which makes it possible to reduce the manufacturing cost.
- Although a few embodiments of the present general inventive concept have been shown and described, it will be appreciated by those skilled in the art that changes may be made in these embodiments without departing from the principles and spirit of the general inventive concept, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A camera module comprising:
a housing that includes one or more lenses which are sequentially fixed and coupled and of which the focus does not need to be adjusted;
a holder assembly that is coupled to a lower end portion of the housing; and
a main substrate that is coupled to a lower end portion of the holder assembly through a reflow process,
wherein the holder assembly includes a holder including a housing mounting portion that is formed on an upper end portion of the holder such that fine focus adjustment can be performed in a sliding manner when the holder assembly is coupled to the lower end portion of the housing, and a filter mounting portion that is formed in such a manner that an internal space of the holder is sealed by an IR filter, the holder being formed of a ceramic material on which a reflow process can be performed,
the IR filter is mounted on the filter mounting portion formed in the holder, and
a holder substrate is coupled to a lower end portion of the holder and includes an image sensor fixed on an upper surface thereof through wire bonding and bonding media for bonding the main substrate through a reflow process, the bonding media being provided on a lower surface of the holder substrate.
2. The camera module according to claim 1 , wherein the housing includes a support portion which extends from an inner lower end of the housing so as to come in contact with the upper end portion of the holder assembly.
3. The camera module according to claim 2 , wherein the support portion extends so as to be disposed on an upper end portion of the IR filter.
4. The camera module according to claim 1 , wherein the filter mounting portion is formed on an inner surface of the upper end portion of the holder.
5. The camera module according to claim 1 , wherein the filter mounting portion is formed on an inner surface of a middle portion of the holder.
6. The camera module according to claim 1 , further comprising:
passive elements provided on the holder substrate positioned outside the holder.
7. The camera module according to claim 1 , wherein the bonding media formed on the lower surface of the holder substrate are solder balls or pads.
Priority Applications (1)
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US12/926,317 US20110063450A1 (en) | 2008-08-06 | 2010-11-09 | Camera module |
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KR1020080077148A KR100950917B1 (en) | 2008-08-06 | 2008-08-06 | Camera module and method for manufacturing the same |
KR10-2008-0077148 | 2008-08-06 | ||
US12/289,471 US7901972B2 (en) | 2008-08-06 | 2008-10-28 | Camera module and method of manufacturing the same |
US12/926,317 US20110063450A1 (en) | 2008-08-06 | 2010-11-09 | Camera module |
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US12/289,471 Division US7901972B2 (en) | 2008-08-06 | 2008-10-28 | Camera module and method of manufacturing the same |
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US12/926,317 Abandoned US20110063450A1 (en) | 2008-08-06 | 2010-11-09 | Camera module |
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Also Published As
Publication number | Publication date |
---|---|
KR100950917B1 (en) | 2010-04-01 |
US20100034531A1 (en) | 2010-02-11 |
KR20100018405A (en) | 2010-02-17 |
US7901972B2 (en) | 2011-03-08 |
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