US20110017441A1 - Heat Sink Using Latent Heat of LED Street Light - Google Patents
Heat Sink Using Latent Heat of LED Street Light Download PDFInfo
- Publication number
- US20110017441A1 US20110017441A1 US12/788,098 US78809810A US2011017441A1 US 20110017441 A1 US20110017441 A1 US 20110017441A1 US 78809810 A US78809810 A US 78809810A US 2011017441 A1 US2011017441 A1 US 2011017441A1
- Authority
- US
- United States
- Prior art keywords
- heat sink
- upper plate
- heat
- cooling fins
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
- F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/777—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
- F21W2131/10—Outdoor lighting
- F21W2131/103—Outdoor lighting of streets or roads
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/72—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps in street lighting
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
There is provided a heat sink using latent heat of an LED street light, wherein a phase change material (PCM) is used in the heat sink to quickly and efficiently dissipate high-temperature heat which generated by LED elements when the street light using LEDs as a light source is turned on.
The heat sink using latent heat of an LED street light according to the present invention comprises: a lower plate on which a number of cooling fins protrude at equal intervals and under which an LED module is attached, the LED module having a PCB (printed circuit board) on which a number of LED elements are mounted; an upper plate on which a number of cooling fins protrude at equal intervals, the upper plate to be positioned on the lower plate; and a PCM (phase change material) filled between the upper plate and the lower plated, the PCM absorbing/dissipating thermal energy while changing from liquid to solid or from solid to liquid, wherein the cooling fins protruding on is the upper plate and the lower plate are formed, along a length direction of the heat sink.
Description
- This application claims the benefit of Korean Patent Application No. 10-s 2009-66589, filed Jul. 22, 2009, the disclosure of which is hereby incorporated herein by reference in its entirety.
- 1. Field of the Invention
- The present invention relates to a heat sink using latent heat of an light emitting diode (LED) street light, and more particularly, to a heat sink using latent heat of an LED street light, wherein a phase change material (PCM) is used in the heat sink, to quickly and efficiently dissipate high-temperature heat generated by LED elements when the street light using LEDs as a light source is turned on.
- 2. Description of the Related Art
- Street lights are a lighting system installed along a street, for the traffic safety and security of the street. Many kinds of street lights are installed depending on the installation places, such as highways, city main roads, commercial area roads, residential area roads and parks, among others. High-pressure mercury lamps, fluorescent lamps, sodium lamps and metal halide lamps are used depending on light sources. Since the international trend is toward saving energy, lights used at homes and offices and street lights have been generally replaced with the lights using LEDs which significantly reduce power consumption and maximize illumination effects.
- LEDs have high-efficiency of converting electrical power to light. However, since the light emitting regions of LEDs are formed of semiconductor devices, LEDs are relatively weak to heat, compared to the other light emitting elements, such as filaments used in incandescent lights/lamps or cathode rays used in fluorescent lights/lamps. In other words, when LEDs are used for a long time, semiconductor devices are easily degraded by thermal stress caused by heat generated by the light emitting element itself and therefore, LED performance decreases. In this regard, a heat dissipating structure to effectively lose the heat generated by LEDs is very important element in order to allow a large current to flow to LEDs.
- Street lights using LEDs have been competitively developed. In these street lights, LEDs are to increasingly output light, to increase the intensity of illumination. Thus, a current is driven at several hundreds mA which is higher than a generally driven current of 20-90 mA in existing LED lights or street lights. In this regard, dissipating heat is raised as a serious issue.
- Korean Patent Registration No. 862540 entitled “LED Lamp for Street Light” teaches one of the techniques to effectively dissipate heat generated in a street light using LEDs. The technique taught in the aforementioned document will be briefly described with reference to
FIG. 1 . A heat sink 1 comprises a first cooling part 2 and a second cooling part 3. The first cooling part 2 has a semi-cylindrical shape and is connected to an LED module. The second cooling part 3 has a cylindrical shape with one end being closed. The closed end of the second cooling part 3 is connected to the first cooling part 2, and the other end of the second cooling part 3 (which is opposite to the closed end) is connected to a socket part. A number of cooling holes 4 to dissipate heat generated by LED elements are formed on a flat surface of the first cooling part 2 connected to the LED module. One end of a spherical part of the semi-cylinder is open and a number of cooling fins are formed inside and outside. Three to five slits are formed lengthwise in the spherical part, to increase the cooling effect. In the second cooling part 3 in the cylindrical shape with the one closed end, a number of cooling fins are formed on the outer circumferential surface of the cylinder. - However, the naturally cooling fins as mentioned above cannot quickly and efficiently dissipate the heat generated by the LED elements. Consequently, the LED elements are degraded, the LED life is shortened, the power consumption increases, and the light emitting efficiency is lowered.
- Therefore, it is an object of the present invention to provide a heat sink using latent heat of an LED street light, wherein the heat sink of the street light using LEDs as a light source is separated into an upper plate and a lower plate, and a phase change material (PCM) is filled between the upper plate and the lower plate, to quickly and efficiently dissipate high-temperature heat generated by from LED elements.
- In accordance with an embodiment of the present invention, there is provided a heat sink using latent heat of an LED street light, comprising: a lower plate on which a number of cooling fins are formed so as to protrude at equal intervals and under which an LED module is attached, the LED module having a printed circuit board (PCB) on which a number of LED elements are mounted; an upper plate on which a number of cooling fins are formed so as to protrude at equal intervals, the upper plate to be positioned on the lower plate; and a phase change material (PCM) filled between the upper plate and the lower plate, the PCM absorbing or dissipating thermal energy while changing from liquid to solid or from solid to liquid, wherein the cooling fins formed so as to protrude on the upper plate and the lower plate are formed in a length direction of the heat sink.
- Preferably, the position of each of the protruding cooling fins on the upper plate is arranged between the positions of the two adjacent protruding cooling fins on the lower plate.
-
- The above and other features and advantages of the present invention will become more apparent to those of ordinary skill in the art by describing in detail a preferred embodiment thereof with reference to the attached drawings in which:
-
FIG. 1 illustrates a conventional heat sink of an LED street light; -
FIG. 2 is a perspective view of a heat sink of an LED street light according to the present invention; -
FIG. 3 is a sectional view of the heat sink ofFIG. 2 being separated; and -
FIG. 4 is a sectional view of the heat sink being connected. -
FIG. 5 is a perspective view and sectional view of the heat sink of another embodiment of an LED street light according to the present invention. - The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which a preferred embodiment of the invention is shown so that those of ordinary skill in the art can easily carry out the present invention.
- A
heat sink 10 using latent heat of an LED street light according to the present invention will be described with reference toFIGS. 2 through 5 . The most significant characteristic of theheat sink 10 is that the constituents are separated. That is, theheat sink 10 comprises: alower plate 11, anupper plate 12 and a phase change material (PCM) 13 filled between thelower plate 11 and theupper plate 12. - On the
lower plate 11, a number ofcooling fins 14 are formed to protrude in an elongated manner, along a length direction of theheat sink 10. Under thelower plate 11, anLED module 20 is attached. TheLED module 20 has a printed circuit board (PCB) 21 on which a number ofLED elements 22 are mounted. Thecooling fins 14 formed on thelower plate 11 absorb heat generated in theLED module 20 and function as a container to hold thePCM 13 filling the space between thecooling fins 14. That is, in the cooling fins 14 protruding in a number of rows, each space between the adjacent cooling fins 14 functions as the container to prevent the filled PCM 13 from moving to any one side. - The
upper plate 12 is positioned on thelower plate 11. On theupper plate 12, a number ofcooling fins 14′ are formed to protrude in an elongated manner, along the length direction of theheat sink 10. The cooling fins 14′ broaden the surface area of theupper plate 12, to broaden the heat dissipation area. - The position of each of the protruding cooling fins 14′ in a number of rows on the
upper plate 12 is arranged between the positions of the two adjacent protrudingcooling fins 14 on thelower plate 11. Preferably, each of the cooling fins 14′ may protrude at a middle position of each of the PCM 13 filled in the space between the twoadjacent cooling fins 14 on thelower plate 11, so that thecooling fins 14′ can quickly absorb the heat from thePCM 13. - The PCM 13 is filled between the
lower plate 11 and theupper plate 12. The PCM can be called a ‘latent heat storage material’. The PCM is in a liquid state when it absorbs heat, and it is in a solid state when it is cooled. As the PCM absorbs and dissipates heat within any required temperature range, it changes from solid to liquid or from liquid to solid, thereby absorbing/dissipating thermal energy. - In the heat sink 10 as structured above, the heat generated by the
LED elements 22 is firstly absorbed through thelower plate 11. After thePCM 13 absorbs the heat absorbed in thelower plate 11, theupper plate 12 absorbs the heat from thePCM 13 and dissipates the heat outside. Therefore, the heat is quickly and efficiently dissipated. The amount of thePCM 13 varies depending on the number of the LED elements. However, about 1.6˜1.8 kg PCMs are filled for a general street light, to maintain the temperature of theLED elements 22 generating heat at 60° C. or below and to maintain the high light efficiency and long life span of theLED elements 22. - The
heat sink 10 may vary depending on the shape of theLED module 20 used for the street light. However, preferably, the cross section of theheat sink 10 may be in a shape in which a middle part is higher than both end parts in a width direction of theheat sink 10. The cross section of theheat sink 10 may be in a flat shape even though it is not illustrated in the attached drawings. - The materials of the
upper plate 12 and thelower plate 11 of theheat sink 10 use metals having high heat conductivity. Taking the heat conductivity characteristic and cost into consideration, it is most preferable to use aluminum based metals. - As described above, in the heat sink using latent heat of the LED street light according to the present invention, the heat sink of the street light using LEDs as the light source is separated into the upper plate and the lower plate, and the PCM is filled between the upper plate and the lower plate. Therefore, when heat generated in the LED module is firstly dissipated through the lower plate, the PCM being in the cool solid state quickly absorbs the heat dissipated through the lower plate and changes to liquid. Then, the absorbed heat is quickly transferred to the upper state, to be secondly dissipated on the upper plate outwardly. Thus, since high-temperature heat generated by the LED elements is quickly and efficiently dissipated, the LED elements are continuously maintained so as not to reach a predetermined high temperature, thereby maintaining the high light efficiency and long life span of the LED elements.
- The invention has been described using a preferred exemplary embodiment. However, it is to be understood that the scope of the invention is not limited to the disclosed embodiment. On the contrary, the scope of the invention is intended to include various modifications and alternative arrangements within the capabilities of persons skilled in the art using presently known or future technologies and equivalents. The scope of the claims, therefore, should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
-
-
10: heat sink 11: lower plate 12: upper plate 13: phase change material (PCM) 14, 14′: cooling fins 20: LED module 21: PCB 22: LED elements
Claims (5)
1. A heat sink using latent heat of an LED street light, comprising:
a lower plate on which a number of cooling fins protrude at equal intervals and under which an LED module is attached, the LED module having a PCB (printed circuit board) on which a number of LED elements are mounted;
an upper plate on which a number of cooling fins protrude at equal intervals, the upper plate to be positioned on the lower plate; and
a PCM (phase change material) filled between the upper plate and the lower plated, the PCM absorbing/dissipating thermal energy while changing from liquid to solid or from solid to liquid,
wherein the cooling fins protruding on the upper plate and the lower plate are formed, along a length direction of the heat sink.
2. The heat sink according to claim 1 , wherein the position of each of the protruding cooling fins on the upper plate is arranged between the positions of the two adjacent protruding cooling fins on the lower plated.
3. The heat sink according to claim 1 , wherein the cross section of the heat sink is flat.
5. The heat sink according to claim 1 , wherein the material of the upper plate and the lower plate of the heat sink is aluminum.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2009-66589 | 2009-07-22 | ||
KR1020090066589A KR100946966B1 (en) | 2009-07-22 | 2009-07-22 | Radiant plate using latent heat for street light of led |
Publications (1)
Publication Number | Publication Date |
---|---|
US20110017441A1 true US20110017441A1 (en) | 2011-01-27 |
Family
ID=42183194
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/788,098 Abandoned US20110017441A1 (en) | 2009-07-22 | 2010-05-26 | Heat Sink Using Latent Heat of LED Street Light |
Country Status (2)
Country | Link |
---|---|
US (1) | US20110017441A1 (en) |
KR (1) | KR100946966B1 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102679244A (en) * | 2012-05-23 | 2012-09-19 | 安徽中晨光电科技有限公司 | Lamp body used for LED (light-emitting diode) street lamp |
CN102818206A (en) * | 2011-06-10 | 2012-12-12 | 霍尼韦尔国际公司 | Aircraft LED landing or taxi lights with thermal management |
US8593330B2 (en) | 2011-07-11 | 2013-11-26 | Honeywell International Inc. | Multichannel, multimode, multifunction L-band radio transceiver |
CN104132263A (en) * | 2011-09-13 | 2014-11-05 | 优利德电球股份有限公司 | LED lamp |
US20170158788A1 (en) * | 2014-07-09 | 2017-06-08 | Borealis Ag | Propylene random copolymer for film applications |
US20190036301A1 (en) * | 2017-07-26 | 2019-01-31 | The Boeing Company | Methods and apparatus to thermally manage heat sources using eutectic thermal control |
US11149936B2 (en) * | 2020-02-18 | 2021-10-19 | Exposure Illumination Architects, Inc. | Uniformly lit planar field of illumination |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101025207B1 (en) * | 2010-10-08 | 2011-03-31 | (주)레프코리아 | Heatsink module for led lamp and the heatsink plate for led lamp using of it |
KR101571830B1 (en) * | 2014-06-11 | 2015-11-25 | 태원전기산업(주) | LED lighting apparatus |
KR102180225B1 (en) | 2020-05-08 | 2020-11-18 | 주식회사 현대그린 | LED Street Lamp Illumination System |
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US20090262533A1 (en) * | 2008-04-16 | 2009-10-22 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Outdoor led lamp assembly |
US20100172144A1 (en) * | 2009-01-05 | 2010-07-08 | Foxconn Technology Co., Ltd. | Led illuminating device and light engine thereof |
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CN100583470C (en) * | 2006-12-15 | 2010-01-20 | 富准精密工业(深圳)有限公司 | LED radiating device combination |
-
2009
- 2009-07-22 KR KR1020090066589A patent/KR100946966B1/en not_active IP Right Cessation
-
2010
- 2010-05-26 US US12/788,098 patent/US20110017441A1/en not_active Abandoned
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US5998863A (en) * | 1996-07-19 | 1999-12-07 | Denso Corporation | Cooling apparatus boiling and condensing refrigerant |
US20020029873A1 (en) * | 2000-09-14 | 2002-03-14 | Hajime Sugito | Cooling device boiling and condensing refrigerant |
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US20090262533A1 (en) * | 2008-04-16 | 2009-10-22 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Outdoor led lamp assembly |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102818206A (en) * | 2011-06-10 | 2012-12-12 | 霍尼韦尔国际公司 | Aircraft LED landing or taxi lights with thermal management |
EP2532591A3 (en) * | 2011-06-10 | 2015-06-10 | Honeywell International Inc. | Aircraft led leanding or taxi lights with thermal management |
US8593330B2 (en) | 2011-07-11 | 2013-11-26 | Honeywell International Inc. | Multichannel, multimode, multifunction L-band radio transceiver |
CN104132263A (en) * | 2011-09-13 | 2014-11-05 | 优利德电球股份有限公司 | LED lamp |
CN102679244A (en) * | 2012-05-23 | 2012-09-19 | 安徽中晨光电科技有限公司 | Lamp body used for LED (light-emitting diode) street lamp |
US20170158788A1 (en) * | 2014-07-09 | 2017-06-08 | Borealis Ag | Propylene random copolymer for film applications |
US20190036301A1 (en) * | 2017-07-26 | 2019-01-31 | The Boeing Company | Methods and apparatus to thermally manage heat sources using eutectic thermal control |
US11149936B2 (en) * | 2020-02-18 | 2021-10-19 | Exposure Illumination Architects, Inc. | Uniformly lit planar field of illumination |
Also Published As
Publication number | Publication date |
---|---|
KR100946966B1 (en) | 2010-03-15 |
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Owner name: CSTECH CO, LTD., KOREA, REPUBLIC OF Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SHIN, HAN SHUK;CHANG, SUNG-HO;REEL/FRAME:024446/0348 Effective date: 20100506 |
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STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |