US20100271429A1 - Ink ejection nozzle with oscillator and shutter arrangement - Google Patents
Ink ejection nozzle with oscillator and shutter arrangement Download PDFInfo
- Publication number
- US20100271429A1 US20100271429A1 US12/832,941 US83294110A US2010271429A1 US 20100271429 A1 US20100271429 A1 US 20100271429A1 US 83294110 A US83294110 A US 83294110A US 2010271429 A1 US2010271429 A1 US 2010271429A1
- Authority
- US
- United States
- Prior art keywords
- ink
- nozzle
- ink ejection
- shutter
- nozzle chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
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- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/165—Preventing or detecting of nozzle clogging, e.g. cleaning, capping or moistening for nozzles
- B41J2/16585—Preventing or detecting of nozzle clogging, e.g. cleaning, capping or moistening for nozzles for paper-width or non-reciprocating print heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2002/041—Electromagnetic transducer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/21—Line printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2221/00—Indexing scheme relating to security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F2221/21—Indexing scheme relating to G06F21/00 and subgroups addressing additional information or applications relating to security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F2221/2129—Authenticate client device independently of the user
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N2101/00—Still video cameras
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/74—Projection arrangements for image reproduction, e.g. using eidophor
- H04N5/7416—Projection arrangements for image reproduction, e.g. using eidophor involving the use of a spatial light modulator, e.g. a light valve, controlled by a video signal
- H04N5/7458—Projection arrangements for image reproduction, e.g. using eidophor involving the use of a spatial light modulator, e.g. a light valve, controlled by a video signal the modulator being an array of deformable mirrors, e.g. digital micromirror device [DMD]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/902—Specified use of nanostructure
- Y10S977/932—Specified use of nanostructure for electronic or optoelectronic application
Abstract
An ink ejection nozzle includes an ink reservoir with an oscillator configured to oscillate ink pressure in the reservoir; a wafer assembly defining an ink supply channel in fluid communication with the ink reservoir; a nozzle chamber structure on the wafer assembly and defining a nozzle chamber in fluid communication with the ink supply channel, and an ink ejection port in fluid communication with the nozzle chamber; and a shutter positioned in the nozzle chamber and configured to shut the ink ejection port to the ejection of ink from the nozzle chamber. The shutter is moved by a thermoelastic actuator having a coiled serpentine heater.
Description
- This is a Continuation Application of U.S. application Ser. No. 11/839,541 filed on Aug. 16, 2007, which is a Continuation Application of U.S. application Ser. No. 11/525,859 filed on Sep. 25, 2006, now issued U.S. Pat. No. 7,270,399, which is a Continuation Application of U.S. application Ser. No. 11/144,804 filed Jun. 6, 2005, now granted U.S. Pat. No. 7,144,098, which is a continuation of U.S. application Ser. No. 10/693,990 filed Oct. 28, 2003, now issued as U.S. Pat. No. 6,929,352, which is a continuation of U.S. application Ser. No. 10/302,606 filed on Nov. 23, 2002, now issued U.S. Pat. No. 6,644,767, which is a Continuation of U.S. application Ser. No. 09/855,094 filed May 14, 2001, now issued U.S. Pat. No. 6,485,123 which is a Continuation-in-part of U.S. application Ser. No. 09/112,815 filed on Jul. 10, 1998, now issued U.S. Pat. No. 6,247,792, all of which is herein incorporated by reference.
- The following Australian provisional patent applications are hereby incorporated by reference. For the purposes of location and identification, US patents/patent applications identified by their US patent/patent application serial numbers are listed alongside the Australian applications from which the US patents/patent applications claim the right of priority.
-
CROSS- US PATENT/PATENT REFERENCED APPLICATION AUSTRALIAN (CLAIMING RIGHT PROVISIONAL OF PRIORITY FROM PATENT AUSTRALIAN PROVISIONAL APPLICATION NO. APPLICATION) DOCKET NO. PO7991 6,750,901 ART01US PO8505 6,476,863 ART02US PO7988 6,788,336 ART03US PO9395 6,322,181 ART04US PO8017 6,597,817 ART06US PO8014 6,227,648 ART07US PO8025 6,727,948 ART08US PO8032 6,690,419 ART09US PO7999 6,727,951 ART10US PO8030 6,196,541 ART13US PO7997 6,195,150 ART15US PO7979 6,362,868 ART16US PO7978 6,831,681 ART18US PO7982 6,431,669 ART19US PO7989 6,362,869 ART20US PO8019 6,472,052 ART21US PO7980 6,356,715 ART22US PO8018 6,894,694 ART24US PO7938 6,636,216 ART25US PO8016 6,366,693 ART26US PO8024 6,329,990 ART27US PO7939 6,459,495 ART29US PO8501 6,137,500 ART30US PO8500 6,690,416 ART31US PO7987 7,050,143 ART32US PO8022 6,398,328 ART33US PO8497 7,110,024 ART34US PO8020 6,431,704 ART38US PO8504 6,879,341 ART42US PO8000 6,415,054 ART43US PO7934 6,665,454 ART45US PO7990 6,542,645 ART46US PO8499 6,486,886 ART47US PO8502 6,381,361 ART48US PO7981 6,317,192 ART50US PO7986 6,850,274 ART51US PO7983 09/113,054 ART52US PO8026 6,646,757 ART53US PO8028 6,624,848 ART56US PO9394 6,357,135 ART57US PO9397 6,271,931 ART59US PO9398 6,353,772 ART60US PO9399 6,106,147 ART61US PO9400 6,665,008 ART62US PO9401 6,304,291 ART63US PO9403 6,305,770 ART65US PO9405 6,289,262 ART66US PP0959 6,315,200 ART68US PP1397 6,217,165 ART69US PP2370 6,786,420 DOT01US PO8003 6,350,023 Fluid01US PO8005 6,318,849 Fluid02US PO8066 6,227,652 IJ01US PO8072 6,213,588 IJ02US PO8040 6,213,589 IJ03US PO8071 6,231,163 IJ04US PO8047 6,247,795 IJ05US PO8035 6,394,581 IJ06US PO8044 6,244,691 IJ07US PO8063 6,257,704 IJ08US PO8057 6,416,168 IJ09US PO8056 6,220,694 IJ10US PO8069 6,257,705 IJ11US PO8049 6,247,794 IJ12US PO8036 6,234,610 IJ13US PO8048 6,247,793 IJ14US PO8070 6,264,306 IJ15US PO8067 6,241,342 IJ16US PO8001 6,247,792 IJ17US PO8038 6,264,307 IJ18US PO8033 6,254,220 IJ19US PO8002 6,234,611 IJ20US PO8068 6,302,528 IJ21US PO8062 6,283,582 IJ22US PO8034 6,239,821 IJ23US PO8039 6,338,547 IJ24US PO8041 6,247,796 IJ25US PO8004 6,557,977 IJ26US PO8037 6,390,603 IJ27US PO8043 6,362,843 IJ28US PO8042 6,293,653 IJ29US PO8064 6,312,107 IJ30US PO9389 6,227,653 IJ31US PO9391 6,234,609 IJ32US PP0888 6,238,040 IJ33US PP0891 6,188,415 IJ34US PP0890 6,227,654 IJ35US PP0873 6,209,989 IJ36US PP0993 6,247,791 IJ37US PP0890 6,336,710 IJ38US PP1398 6,217,153 IJ39US PP2592 6,416,167 IJ40US PP2593 6,243,113 IJ41US PP3991 6,283,581 IJ42US PP3987 6,247,790 IJ43US PP3985 6,260,953 IJ44US PP3983 6,267,469 IJ45US PO7935 6,224,780 IJM01US PO7936 6,235,212 IJM02US PO7937 6,280,643 IJM03US PO8061 6,284,147 IJM04US PO8054 6,214,244 IJM05US PO8065 6,071,750 IJM06US PO8055 6,267,905 IJM07US PO8053 6,251,298 IJM08US PO8078 6,258,285 IJM09US PO7933 6,225,138 IJM10US PO7950 6,241,904 IJM11US PO7949 6,299,786 IJM12US PO8060 6,866,789 IJM13US PO8059 6,231,773 IJM14US PO8073 6,190,931 IJM15US PO8076 6,248,249 IJM16US PO8075 6,290,862 IJM17US PO8079 6,241,906 IJM18US PO8050 6,565,762 IJM19US PO8052 6,241,905 IJM20US PO7948 6,451,216 IJM21US PO7951 6,231,772 IJM22US PO8074 6,274,056 IJM23US PO7941 6,290,861 IJM24US PO8077 6,248,248 IJM25US PO8058 6,306,671 IJM26US PO8051 6,331,258 IJM27US PO8045 6,110,754 IJM28US PO7952 6,294,101 IJM29US PO8046 6,416,679 IJM30US PO9390 6,264,849 IJM31US PO9392 6,254,793 IJM32US PP0889 6,235,211 IJM35US PP0887 6,491,833 IJM36US PP0882 6,264,850 IJM37US PP0874 6,258,284 IJM38US PP1396 6,312,615 IJM39US PP3989 6,228,668 IJM40US PP2591 6,180,427 IJM41US PP3990 6,171,875 IJM42US PP3986 6,267,904 IJM43US PP3984 6,245,247 IJM44US PP3982 6,315,914 IJM45US PP0895 6,231,148 IR01US PP0869 6,293,658 IR04US PP0887 6,614,560 IR05US PP0885 6,238,033 IR06US PP0884 6,312,070 IR10US PP0886 6,238,111 IR12US PP0877 6,378,970 IR16US PP0878 6,196,739 IR17US PP0883 6,270,182 IR19US PP0880 6,152,619 IR20US PO8006 6,087,638 MEMS02US PO8007 6,340,222 MEMS03US PO8010 6,041,600 MEMS05US PO8011 6,299,300 MEMS06US PO7947 6,067,797 MEMS07US PO7944 6,286,935 MEMS09US PO7946 6,044,646 MEMS10US PP0894 6,382,769 MEMS13US - The present invention relates to an ink jet printer for use with a pulsating pressure ink supply.
- Many different types of printing have been invented, a large number of which are presently in use. The known forms of print have a variety of methods for marking the print media with a relevant marking media. Commonly used forms of printing include offset printing, laser printing and copying devices, dot matrix type impact printers, thermal paper printers, film recorders, thermal wax printers, dye sublimation printers and ink jet printers both of the drop on demand and continuous flow type. Each type of printer has its own advantages and problems when considering cost, speed, quality, reliability, simplicity of construction and operation etc.
- In recent years, the field of ink jet printing, wherein each individual pixel of ink is derived from one or more ink nozzles has become increasingly popular primarily due to its inexpensive and versatile nature.
- Many different techniques on ink jet printing have been invented. For a survey of the field, reference is made to an article by J Moore, “Non-Impact Printing: Introduction and Historical Perspective”, Output Hard Copy Devices, Editors R Dubeck and S Sherr, pages 207-220 (1988).
- Ink Jet printers themselves come in many different types. The utilisation of a continuous stream ink in ink jet printing appears to date back to at least 1929 wherein U.S. Pat. No. 1,941,001 by Hansell discloses a simple form of continuous stream electro-static ink jet printing.
- U.S. Pat. No. 3,596,275 by Sweet also discloses a process of a continuous ink jet printing including the step wherein the ink jet stream is modulated by a high frequency electro-static field so as to cause drop separation. This technique is still used by several manufacturers including Elmjet and Scitex (see also U.S. Pat. No. 3,373,437 by Sweet et al)
- Piezoelectric ink jet printers are also one form of commonly used ink jet printing device. Piezoelectric systems are disclosed by Kyser et. al. in U.S. Pat. No. 3,946,398 (1970) which discloses a diaphragm mode of operation, by Zolten in U.S. Pat. No. 3,683,212 (1970) which discloses a squeeze mode of operation of a piezoelectric crystal, Stemme in U.S. Pat. No. 3,747,120 (1972) which discloses a bend mode of piezoelectric operation, Howkins in U.S. Pat. No. 4,459,601 which discloses a piezoelectric push mode actuation of the ink jet stream and Fischbeck in U.S. Pat. No. 4,584,590 which discloses a shear mode type of piezoelectric transducer element.
- Recently, thermal ink jet printing has become an extremely popular form of ink jet printing. The ink jet printing techniques include those disclosed by Endo et al in GB 2007162 (1979) and Vaught et al in U.S. Pat. No. 4,490,728. Both the aforementioned references disclose ink jet printing techniques rely upon the activation of an electrothermal actuator which results in the creation of a bubble in a constricted space, such as a nozzle, which thereby causes the ejection of ink from an aperture connected to the confined space onto a relevant print media. Printing devices using the electro-thermal actuator are manufactured by manufacturers such as Canon and Hewlett Packard.
- As can be seen from the foregoing, many different types of printing technologies are available. Ideally, a printing technology should have a number of desirable attributes. These include inexpensive construction and operation, high speed operation, safe and continuous long term operation etc. Each technology may have its own advantages and disadvantages in the areas of cost, speed, quality, reliability, power usage, simplicity of construction operation, durability and consumables.
- According to an aspect of the present disclosure, an ink ejection nozzle includes an ink reservoir with an oscillator configured to oscillate ink pressure in the reservoir; a wafer assembly defining an ink supply channel in fluid communication with the ink reservoir; a nozzle chamber structure on the wafer assembly and defining a nozzle chamber in fluid communication with the ink supply channel, and an ink ejection port in fluid communication with the nozzle chamber; and a shutter positioned in the nozzle chamber and configured to shut the ink ejection port to the ejection of ink from the nozzle chamber. The shutter is moved by a thermoelastic actuator having a coiled serpentine heater.
- Notwithstanding any other forms which may fall within the scope of the present invention, preferred forms of the invention will now be described, by way of example only, with reference to the accompanying drawings in which:
-
FIG. 1 is an exploded perspective view illustrating the construction of a single ink jet nozzle in accordance with the preferred embodiment; -
FIG. 2 is a perspective view, partly in section, of a single ink jet nozzle constructed in accordance with the preferred embodiment; -
FIG. 3 provides a legend of the materials indicated inFIGS. 4 to 16 ; -
FIG. 4 toFIG. 16 illustrate sectional views of the manufacturing steps in one form of construction of an ink jet printhead nozzle; and -
FIG. 17 shows a schematic, sectional end view of part of an ink jet nozzle array showing two nozzle arrangements of the array; -
FIG. 18 shows the array with ink being ejected from one of the nozzle arrangements; -
FIG. 19 shows a schematic side view of re-filling of the nozzle of the first nozzle arrangement; and -
FIG. 20 shows operation of the array preceding commencement of ink ejection from the second of the illustrated nozzle arrangements. - In the preferred embodiment, an oscillating ink reservoir pressure is used to eject ink from ejection nozzles. Each nozzle has an associated shutter which normally blocks the nozzle. The shutter is moved away from the nozzle by an actuator whenever an ink drop is to be fired.
- Turning initially to
FIG. 1 , there is illustrated in exploded perspective a singleink jet nozzle 10 as constructed in accordance with the principles of the present invention. The exploded perspective illustrates a singleink jet nozzle 10. Ideally, the nozzles are formed as an array on asilicon wafer 12. Thesilicon wafer 12 is processed so as to have two level metal CMOS circuitry which includes metal layers and glass layers 13 and which are planarised after construction. The CMOS metal layer has a reducedaperture 14 for the access of ink from the back ofsilicon wafer 12 via anink supply channel 15. - A
bottom nitride layer 16 is constructed on top of theCMOS layer 13 so as to cover, protect and passivate theCMOS layer 13 from subsequent etching processes. Subsequently, there is provided acopper heater layer 18 which is sandwiched between two polytetrafluoroethylene (PTFE) layers 19,20. Thecopper layer 18 is connected to lowerCMOS layer 13 throughvias copper layer 18 and PTFE layers 19,20 are encapsulated within nitride borders e.g. 28 andnitride top layer 29 which includes anink ejection port 30 in addition to a number of sacrificial etched access holes 32 which are of a smaller dimension than theejection port 30 and are provided for allowing access of a etchant to lower sacrificial layers thereby allowing the use of the etchant in the construction of layers, 18,19,20 and 28. - Turning now to
FIG. 2 , there is shown a cutaway perspective view of a fully constructedink jet nozzle 10. The ink jet nozzle uses an oscillating ink pressure to eject ink fromejection port 30. Each nozzle has an associatedshutter 31 which normally blocks it. Theshutter 31 is moved away from theejection port 30 by anactuator 35 whenever an ink drop is to be fired. - The
ports 30 are in communication with ink chambers which contain theactuators 35. These chambers are connected toink supply channels 15 which are etched through the silicon wafer. Theink supply channels 15 are substantially wider than theports 30, to reduce the fluidic resistance to the ink pressure wave. Theink channels 15 are connected to an ink reservoir. An ultrasonic transducer (for example, a piezoelectric transducer) is positioned in the reservoir. The transducer oscillates the ink pressure at approximately 100 KHz. The ink pressure oscillation is sufficient that ink drops would be ejected from the nozzle were it not blocked by theshutter 31. - The shutters are moved by a
thermoelastic actuator 35. The actuators are formed as a coiledserpentine copper heater 23 embedded in polytetrafluoroethylene (PTFE) 19/20. PTFE has a very high coefficient of thermal expansion (approximately 770×10−6). Thecurrent return trace 22 from theheater 23 is also embedded in thePTFE actuator 35, thecurrent return trace 22 is made wider than theheater trace 23 and is not serpentine. Therefore, it does not heat the PTFE as much as theserpentine heater 23 does. Theserpentine heater 23 is positioned along the inside edge of the PTFE coil, and the return trace is positioned on the outside edge. When actuated, the inside edge becomes hotter than the outside edge, and expands more. This results in theactuator 35 uncoiling. - The
heater layer 23 is etched in a serpentine manner both to increase its resistance, and to reduce its effective tensile strength along the length of the actuator. This is so that the low thermal expansion of the copper does not prevent the actuator from expanding according to the high thermal expansion characteristics of the PTFE. - By varying the power applied to the
actuator 35, theshutter 31 can be positioned between the fully on and fully off positions. This may be used to vary the volume of the ejected drop. Drop volume control may be used either to implement a degree of continuous tone operation, to regulate the drop volume, or both. When data signals distributed on the printhead indicate that a particular nozzle is turned on, theactuator 35 is energized, which moves theshutter 31 so that it is not blocking the ink chamber. The peak of the ink pressure variation causes the ink to be squirted out of thenozzle 30. As the ink pressure goes negative, ink is drawn back into the nozzle, causing drop break-off. Theshutter 31 is kept open until the nozzle is refilled on the next positive pressure cycle. It is then shut to prevent the ink from being withdrawn from the nozzle on the next negative pressure cycle. - Each drop ejection takes two ink pressure cycles. Preferably half of the
nozzles 10 should eject drops in one phase, and the other half of the nozzles should eject drops in the other phase. This minimises the pressure variations which occur due to a large number of nozzles being actuated. Referring toFIGS. 17 to 20 , the operation of the printhead is described in greater detail. - The printhead comprises an array of nozzle arrangements or
nozzles 10, two of which are shown as 10.1 and 10.2 inFIG. 17 . Eachnozzle arrangement 10 has a chamber 58 in which its associatedshutter 31 is arranged. - Each chamber 58 is in communication with an
ink reservoir 60 via an ink supply channel 36. An ultrasonic transducer in the form of apiezoelectric transducer 62 is arranged n theink reservoir 60. - As described above, each ink drop ejection takes two ink pressure cycles. The two ink pressure cycles are referred to as a phase. Half of the
nozzles 10 should eject ink drops 64 (FIG. 18 ) in one phase with the other half of the nozzles ejecting ink drops in the other phase. Consequently, as shown inFIG. 17 of the drawings, the shutter 31.2 of the nozzle 10.2 is in an open position while the shutter 31.1 of the nozzle 10.1 is in its closed position. It will be appreciated that the nozzle 10.2 represents all the open nozzles of the array of the printhead while the nozzle 10.1 represents all the closed nozzles of the array of the printhead. - In a first pressure cycle, the
transducer 62 is displaced in the direction ofarrows 66 imparting positive pressure to theink 57 in thereservoir 60 and, via the channels 36, the chambers 58 of thenozzles 10. Due to the fact that the shutter 31.2 of the nozzle 10.2 is open, ink in the ink ejection port 30.2 bulges outwardly as shown by themeniscus 68. After a predetermined interval, thetransducer 62 reverses direction to move in the direction ofarrows 70 as shown inFIG. 18 of the drawings. This causes necking, as shown at 72, resulting in separation of theink drop 64 due to a first negative going pressure cycle imparted to theink 57. In the second positive pressure cycle, as shown inFIG. 19 of the drawings, with the transducer moving again in the direction ofarrow 66, the positive pressure applied to the ink results in a refilling of the chamber 58.2 of the nozzle 10.2. It is to be noted that the shutter 31.2 is still in an open position with the shutter 31.1 still being in a closed position. In this cycle, no ink is ejected from either nozzle 10.1 or 10.2. Before the second negative pressure cycle, as shown inFIG. 20 of the drawings, the shutter 31.2 moves to its closed position. Then, as thetransducer 62 again moves in the direction ofarrows 70 to impart negative pressure to theink 57, a slightconcave meniscus 74 is formed at both ink ejection ports 30.1 and 30.2 However, due to the fact that both shutters 31.1 and 31.2 are closed, withdrawal of ink from the chambers 58.1 and 58.2 of the nozzles 10.1 and 10.2, respectively, is inhibited. - The amplitude of the ultrasonic transducer can be altered in response to the viscosity of the ink (which is typically affected by temperature), and the number of drops which are to be ejected in the current cycle. This amplitude adjustment can be used to maintain consistent drop size in varying environmental conditions. The drop firing rate can be around 50 KHz. The ink jet head is suitable for fabrication as a monolithic page wide printhead.
FIG. 2 shows a single nozzle of a 1600 dpi printhead in “up shooter” configuration. - Returning again to
FIG. 1 , one method of construction of the inkjet print nozzles 10 will now be described. Starting with thebottom wafer layer 12, the wafer is processed so as to addCMOS layers 13 with anaperture 14 being inserted. Thenitride layer 16 is laid down on top of the CMOS layers so as to protect them from subsequent etchings. - A thin sacrificial glass layer is then laid down on top of nitride layers 16 followed by a first PTFE layer 19, the
copper layer 18 and a second PTFE layer 20. Then a sacrificial glass layer is formed on top of the PTFE layer and etched to a depth of a few microns to form thenitride border regions 28. Next thetop layer 29 is laid down over the sacrificial layer using the mask for forming the various holes including the processing step of forming therim 40 onnozzle 30. The sacrificial glass is then dissolved away and thechannel 15 formed through the wafer by means of utilisation of high density low pressure plasma etching such as that available from Surface Technology Systems. - One form of detailed manufacturing process which can be used to fabricate monolithic ink jet printheads operating in accordance with the principles taught by the present embodiment can proceed using the following steps:
- 1. Using a double sided
polished wafer 12, complete drive transistors, data distribution, and timing circuits using a 0.5 micron, one poly, 2metal CMOS process 13. The wafer is passivated with 0.1 microns ofsilicon nitride 16. This step is shown inFIG. 4 . For clarity, these diagrams may not be to scale, and may not represent a cross section though any single plane of the nozzle.FIG. 3 is a key to representations of various materials in these manufacturing diagrams, and those of other cross referenced ink jet configurations. - 2. Etch nitride and oxide down to silicon using Mask 1. This mask defines the nozzle inlet below the shutter. This step is shown in
FIG. 5 . - 3.
Deposit 3 microns of sacrificial material 50 (e.g. aluminum or photosensitive polyimide) - 4. Planarize the sacrificial layer to a thickness of 1 micron over nitride. This step is shown in
FIG. 6 . - 5. Etch the sacrificial
layer using Mask 2. This mask defines theactuator anchor point 51. This step is shown inFIG. 7 . - 6. Deposit 1 micron of
PTFE 52. - 7. Etch the PTFE, nitride, and oxide down to second level
metal using Mask 3. This mask defines theheater vias FIG. 8 . - 8. Deposit the
heater 53, which is a 1 micron layer of a conductor with a low Young's modulus, for example aluminum or gold. - 9. Pattern the conductor using Mask 4. This step is shown in
FIG. 9 . - 10. Deposit 1 micron of
PTFE 54. - 11. Etch the PTFE down to the sacrificial layer using Mask 5. This mask defines the actuator and shutter This step is shown in
FIG. 10 . - 12. Wafer probe. All electrical connections are complete at this point, bond pads are accessible, and the chips are not yet separated.
- 13.
Deposit 3 microns ofsacrificial material 55. Planarize using CMP - 14. Etch the sacrificial material using Mask 6. This mask defines the
nozzle chamber wall 28. This step is shown inFIG. 11 . - 15.
Deposit 3 microns ofPECVD glass 56. - 16. Etch to a depth of (approx.) 1 micron using Mask 7. This mask defines the
nozzle rim 40. This step is shown inFIG. 12 . - 17. Etch down to the sacrificial layer using Mask 6. This mask defines the roof of the nozzle chamber, the
nozzle 30, and the sacrificial etch access holes 32. This step is shown inFIG. 13 . - 18. Back-etch completely through the silicon wafer (with, for example, an ASE Advanced Silicon Etcher from Surface Technology Systems) using Mask 7. This mask defines the
ink inlets 15 which are etched through the wafer. The wafer is also diced by this etch. This step is shown inFIG. 14 . - 19. Etch the sacrificial material. The nozzle chambers are cleared, the actuators freed, and the chips are separated by this etch. This step is shown in
FIG. 15 . - 20. Mount the printheads in their packaging, which may be a molded plastic former incorporating ink channels which supply the appropriate color ink to the ink inlets at the back of the wafer. The package also includes a piezoelectric actuator attached to the rear of the ink channels. The piezoelectric actuator provides the oscillating ink pressure required for the ink jet operation.
- 21. Connect the printheads to their interconnect systems. For a low profile connection with minimum disruption of airflow, TAB may be used. Wire bonding may also be used if the printer is to be operated with sufficient clearance to the paper.
- 22. Hydrophobize the front surface of the printheads.
- 23. Fill the completed printheads with
ink 57 and test them. A filled nozzle is shown inFIG. 16 . - It would be appreciated by a person skilled in the art that numerous variations and/or modifications may be made to the present invention as shown in the preferred embodiment without departing from the spirit or scope of the invention as broadly described. The present embodiment is, therefore, to be considered in all respects to be illustrative and not restrictive.
Claims (7)
- I/we claim:
- 1. An ink ejection nozzle comprising:an ink reservoir with an oscillator configured to oscillate ink pressure in the reservoir;a wafer assembly defining an ink supply channel in fluid communication with the ink reservoir;a nozzle chamber structure on the wafer assembly and defining a nozzle chamber in fluid communication with the ink supply channel, and an ink ejection port in fluid communication with the nozzle chamber; anda shutter positioned in the nozzle chamber and configured to shut the ink ejection port to the ejection of ink from the nozzle chamber, whereinthe shutter is moved by a thermoelastic actuator having a coiled serpentine heater.
- 2. An ink ejection nozzle as claimed in
claim 1 , wherein the oscillator includes an ultrasonic transducer. - 3. An ink ejection nozzle as claimed in
claim 2 , wherein the ultrasonic transducer includes a piezoelectric transducer. - 4. An ink ejection nozzle as claimed in
claim 1 , wherein the wafer assembly includes:a silicon wafer;a CMOS layer positioned on the silicon wafer; anda protective passivation layer positioned on the CMOS layer. - 5. An ink ejection nozzle as claimed in
claim 1 , wherein the heater is embedded in polytetrafluoroethylene (PTFE). - 6. An ink ejection nozzle as claimed in
claim 1 , wherein a raised nozzle rim bounds the ink ejection port.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/832,941 US20100271429A1 (en) | 1997-07-15 | 2010-07-08 | Ink ejection nozzle with oscillator and shutter arrangement |
Applications Claiming Priority (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AUPO7991 | 1997-07-15 | ||
AUPO7991A AUPO799197A0 (en) | 1997-07-15 | 1997-07-15 | Image processing method and apparatus (ART01) |
AUPO8001 | 1997-07-15 | ||
AUPO8001A AUPO800197A0 (en) | 1997-07-15 | 1997-07-15 | Image creation method and apparatus (IJ17) |
US09/112,815 US6247792B1 (en) | 1997-07-15 | 1998-07-10 | PTFE surface shooting shuttered oscillating pressure ink jet printing mechanism |
US09/855,094 US6485123B2 (en) | 1997-07-15 | 2001-05-14 | Shutter ink jet |
US10/302,606 US6644767B2 (en) | 1997-07-15 | 2002-11-23 | Ejection of ink using pulsating pressure and a movable shutter |
US10/693,990 US6929352B2 (en) | 1997-07-15 | 2003-10-28 | Inkjet printhead chip for use with a pulsating pressure ink supply |
US11/144,804 US7144098B2 (en) | 1997-07-15 | 2005-06-06 | Printer having a printhead with an inkjet printhead chip for use with a pulsating pressure ink supply |
US11/525,859 US7270399B2 (en) | 1997-07-15 | 2006-09-25 | Printhead for use with a pulsating pressure ink supply |
US11/839,541 US7753485B2 (en) | 1997-07-15 | 2007-08-16 | Ink ejection nozzle with oscillator and shutter arrangement |
US12/832,941 US20100271429A1 (en) | 1997-07-15 | 2010-07-08 | Ink ejection nozzle with oscillator and shutter arrangement |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/839,541 Continuation US7753485B2 (en) | 1997-07-15 | 2007-08-16 | Ink ejection nozzle with oscillator and shutter arrangement |
Publications (1)
Publication Number | Publication Date |
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US20100271429A1 true US20100271429A1 (en) | 2010-10-28 |
Family
ID=46257742
Family Applications (9)
Application Number | Title | Priority Date | Filing Date |
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US09/855,094 Expired - Fee Related US6485123B2 (en) | 1997-07-15 | 2001-05-14 | Shutter ink jet |
US10/302,606 Expired - Fee Related US6644767B2 (en) | 1997-07-15 | 2002-11-23 | Ejection of ink using pulsating pressure and a movable shutter |
US10/693,978 Expired - Fee Related US7147791B2 (en) | 1997-07-15 | 2003-10-28 | Method of fabricating an injket printhead chip for use with a pulsating pressure ink supply |
US10/693,990 Expired - Fee Related US6929352B2 (en) | 1997-07-15 | 2003-10-28 | Inkjet printhead chip for use with a pulsating pressure ink supply |
US11/144,804 Expired - Fee Related US7144098B2 (en) | 1997-07-15 | 2005-06-06 | Printer having a printhead with an inkjet printhead chip for use with a pulsating pressure ink supply |
US11/525,859 Expired - Fee Related US7270399B2 (en) | 1997-07-15 | 2006-09-25 | Printhead for use with a pulsating pressure ink supply |
US11/546,437 Expired - Fee Related US7341672B2 (en) | 1997-07-15 | 2006-10-12 | Method of fabricating printhead for ejecting ink supplied under pulsed pressure |
US11/839,541 Expired - Fee Related US7753485B2 (en) | 1997-07-15 | 2007-08-16 | Ink ejection nozzle with oscillator and shutter arrangement |
US12/832,941 Abandoned US20100271429A1 (en) | 1997-07-15 | 2010-07-08 | Ink ejection nozzle with oscillator and shutter arrangement |
Family Applications Before (8)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/855,094 Expired - Fee Related US6485123B2 (en) | 1997-07-15 | 2001-05-14 | Shutter ink jet |
US10/302,606 Expired - Fee Related US6644767B2 (en) | 1997-07-15 | 2002-11-23 | Ejection of ink using pulsating pressure and a movable shutter |
US10/693,978 Expired - Fee Related US7147791B2 (en) | 1997-07-15 | 2003-10-28 | Method of fabricating an injket printhead chip for use with a pulsating pressure ink supply |
US10/693,990 Expired - Fee Related US6929352B2 (en) | 1997-07-15 | 2003-10-28 | Inkjet printhead chip for use with a pulsating pressure ink supply |
US11/144,804 Expired - Fee Related US7144098B2 (en) | 1997-07-15 | 2005-06-06 | Printer having a printhead with an inkjet printhead chip for use with a pulsating pressure ink supply |
US11/525,859 Expired - Fee Related US7270399B2 (en) | 1997-07-15 | 2006-09-25 | Printhead for use with a pulsating pressure ink supply |
US11/546,437 Expired - Fee Related US7341672B2 (en) | 1997-07-15 | 2006-10-12 | Method of fabricating printhead for ejecting ink supplied under pulsed pressure |
US11/839,541 Expired - Fee Related US7753485B2 (en) | 1997-07-15 | 2007-08-16 | Ink ejection nozzle with oscillator and shutter arrangement |
Country Status (1)
Country | Link |
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US (9) | US6485123B2 (en) |
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- 2003-10-28 US US10/693,978 patent/US7147791B2/en not_active Expired - Fee Related
- 2003-10-28 US US10/693,990 patent/US6929352B2/en not_active Expired - Fee Related
-
2005
- 2005-06-06 US US11/144,804 patent/US7144098B2/en not_active Expired - Fee Related
-
2006
- 2006-09-25 US US11/525,859 patent/US7270399B2/en not_active Expired - Fee Related
- 2006-10-12 US US11/546,437 patent/US7341672B2/en not_active Expired - Fee Related
-
2007
- 2007-08-16 US US11/839,541 patent/US7753485B2/en not_active Expired - Fee Related
-
2010
- 2010-07-08 US US12/832,941 patent/US20100271429A1/en not_active Abandoned
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Also Published As
Publication number | Publication date |
---|---|
US20080303875A1 (en) | 2008-12-11 |
US20030103097A1 (en) | 2003-06-05 |
US6929352B2 (en) | 2005-08-16 |
US20010045969A1 (en) | 2001-11-29 |
US20040084405A1 (en) | 2004-05-06 |
US6644767B2 (en) | 2003-11-11 |
US7270399B2 (en) | 2007-09-18 |
US6485123B2 (en) | 2002-11-26 |
US20070029278A1 (en) | 2007-02-08 |
US7753485B2 (en) | 2010-07-13 |
US7144098B2 (en) | 2006-12-05 |
US7147791B2 (en) | 2006-12-12 |
US7341672B2 (en) | 2008-03-11 |
US20070013742A1 (en) | 2007-01-18 |
US20040227789A1 (en) | 2004-11-18 |
US20050225607A1 (en) | 2005-10-13 |
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