US20100264790A1

US20100264790A1 - Computer enclosure

Info

Publication number: US20100264790A1
Application number: US12/470,464
Authority: US
Inventors: Zi-Yu Zhan
Original assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2009-04-21
Filing date: 2009-05-21
Publication date: 2010-10-21
Also published as: CN101873785A

Abstract

A computer enclosure includes a side plate, an absorber plate, a heat-dissipating plate, and a number of heat pipes. The absorber plate is mounted on an inner wall of the side plate to absorb heat generated in the computer enclosure. The heat-dissipating plate is mounted on an outer wall of the side plate. The number of heat pipes is passed through the side plate to connect the absorber plate and the heat-dissipating plate, to transfer heat from the absorber plate to the heat-dissipating plate.

Description

BACKGROUND

1. Technical Field
The present disclosure relates to a computer enclosure.
2. Description of Related Art
In electronic devices, and particularly, computers, heat-generating components, such as central processing units (CPUs), usually generate heat during operation. Generally, a heat sink is mounted on a heat-generating component to dissipate the heat. However, very often, a heat sink for such a heat-generating component cannot fully satisfy the need for dissipating heat when the heat-generating component works in a highly loaded process or a high frequency mode.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic, isometric view of an exemplary embodiment of a computer enclosure.

FIG. 2 is similar to FIG. 1, but viewed from another perspective.

DETAILED DESCRIPTION

Referring to FIG. 1 and FIG. 2, an exemplary embodiment of a computer enclosure 10 includes a side plate 1 00. The side plate 100 defines a plurality of through holes 103 to dissipate heat in the computer enclosure 10.
An absorber plate 101 is mounted to an inner wall of the side plate 100 of the computer enclosure 10, adjacent to the plurality of through holes 103 to absorb heat from some electrical elements (such as a central processing unit, not shown) arranged in the computer enclosure 10. A heat-dissipating plate 102 is mounted to an outer wall of the side plate 100. A plurality of columniform heat pipes 20 is passed through the side plate 100 to connect the absorber plate 101 to the heat-dissipating plate 102. The plurality of heat pipes 20 transfers heat from the absorber plate 101 to the heat-dissipating plate 102. As a result, heat from the electrical elements can be dissipated by the absorber plate 101, the heat pipes 20, and the heat-dissipating plate 102.
The absorber plate 101 is rectangular, and a plurality of parallel wavy grooves 1010 is defined on a surface of the absorber plate 101 opposite to the side plate 100, to improve heat absorbing efficiency. The heat-dissipating plate 102 is rectangular, and a raised portion 1020 is formed on the heat-dissipating plate 102 opposite to the side plate 100, to improve heat absorbing efficiency.
It is to be understood, however, that even though numerous characteristics and advantages of the present disclosure have been set forth in the foregoing description, together with details of the structure and function of the disclosure, the disclosure is illustrative only, and changes may be made in details, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

1. A computer enclosure, comprising:

a side plate;

an absorber plate mounted on an inner wall of the side plate, operable to absorb heat generated in the computer enclosure;

a heat-dissipating plate mounted on an outer wall of the side plate; and

a plurality of heat pipes passing through the side plate to connect the absorber plate and the heat-dissipating plate, operable to transfer heat from the absorber plate to the heat-dissipating plate.

2. The computer enclosure of claim 1, wherein a plurality of parallel wavy grooves is defined in a surface of the absorber plate opposite to the side plate.

3. The computer enclosure of claim 1, wherein the absorber plate is rectangular.

4. The computer enclosure of claim 1, wherein a raised portion is mounted to a surface of the heat-dissipating plate opposite to the side plate.

5. The computer enclosure of claim 1, wherein the heat-dissipating plate is rectangular.

6. The computer enclosure of claim 1, wherein a plurality of through holes is defined in the side plate.