US20100243216A1 - Liquid-cooling device - Google Patents
Liquid-cooling device Download PDFInfo
- Publication number
- US20100243216A1 US20100243216A1 US12/475,527 US47552709A US2010243216A1 US 20100243216 A1 US20100243216 A1 US 20100243216A1 US 47552709 A US47552709 A US 47552709A US 2010243216 A1 US2010243216 A1 US 2010243216A1
- Authority
- US
- United States
- Prior art keywords
- liquid
- cavity
- heat exchanger
- cooling device
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present disclosure relates generally to cooling devices and, more particularly, to a liquid-cooling device for dissipating waste heat generated by electrical or electronic components and assemblies.
- a typical liquid cooling system comprises a heat absorbing unit for absorbing heat from a heat source, and a heat dissipating unit which defines a cavity filled with liquid.
- the liquid conducts heat exchange with the heat absorbing unit, thereby taking away the heat from the heat absorbing unit when the liquid is circulated.
- the liquid when the liquid directly flows in the cavity of the heat dissipating unit without any liquid-guiding component, the liquid only produces a smooth flowing in the cavity along inner surfaces of the heat dissipating unit.
- the liquid fails to sufficiently contact with the inner surfaces of heat dissipating unit and heat exchanger between the liquid and the inner surfaces of the heat dissipating unit is limited. Accordingly, the liquid cooling system has a lower work performance.
- FIG. 1 is an isometric, assembled view of a liquid-cooling device in accordance with a first embodiment of the present disclosure.
- FIG. 2 is a view similar to FIG. 1 , wherein a part of the liquid-cooling device is cut off for clarity.
- FIG. 3 is an exploded view of the liquid-cooling device of FIG. 1 .
- FIG. 4 is an exploded view of a liquid-cooling device in accordance with a second embodiment of the present disclosure.
- FIG. 5 is an isometric view of the liquid-cooling device of FIG. 4 , wherein a part of the liquid-cooling device is cut away for clarity.
- FIG. 6 is an isometric view of a liquid-cooling device in accordance with a third embodiment of the present disclosure, wherein a part of the liquid-cooling device is cut away for clarity.
- FIG. 7 is an exploded view of the liquid-cooling device of FIG. 6 .
- a liquid-cooling device in accordance with a first embodiment of the disclosure is especially useful in efficiently dissipating heat from a heat generating component (not shown), and more particularly to a part of the heat generating component, which is located at a lower position.
- the liquid cooling device comprises a heat exchanger 10 and a liquid-guiding component 30 engaged with the heat exchanger 10 .
- the heat exchanger 10 is made of thermally conductive material such as copper or aluminum, and substantially T-shaped in profile having a large top surface and a small bottom surface.
- the heat exchanger 10 comprises a base plate 11 having a large top surface and a heat-absorbing portion 12 protruding downwardly and perpendicularly from a center of a bottom surface of the base plate 11 .
- the base plate 11 is used for holding a pump (not shown) thereon.
- the heat-absorbing portion 12 has a column-like configuration with a rectangular cross section, although it is not limited to such configuration and cross section.
- the heat-absorbing portion 12 comprises a small bottom surface (not labeled) used for contacting the heat generating component (not shown).
- the heat-absorbing portion 12 defines a cylindrical cavity 120 in a center thereof and the base plate 11 defines an annular slot 14 surrounding and communicating with the cavity 120 .
- An annular inner sidewall defining the slot 14 is adjacent to an annular inner sidewall defining the cavity 120 .
- the slot 14 is configured for engaging the liquid-guiding component 30 .
- the cavity 120 is provided for filling the liquid therein.
- a protrusion 16 extends horizontally and inwardly from the inner sidewall defining the slot 14 , for facility of an external tool (not shown) to operate on the liquid-guiding component 30 .
- the liquid-guiding component 30 comprises a hollow cylindrical body 32 and an annular flange 34 surrounding the body 32 .
- the body 32 defines a first liquid passage 100 therethrough and an upper outlet 320 communicating with the first liquid passage 100 .
- An outer diameter of the body 32 is less than a diameter of the cavity 120 of the heat-absorbing portion 12 , whereby a second liquid passage 200 is defined between an outer sidewall of the body 32 of the liquid-guiding component 30 and an inner sidewall of the heat-absorbing portion 12 .
- a bottom end of the body 32 is spaced from a bottom of the cavity 120 , whereby the second liquid passage 200 is communicated with the first liquid passage 100 .
- the flange 34 extends horizontally and outwardly from an outer circumference of the body 32 .
- the annular flange 34 has an outer diameter similar to that of the annular slot 14 , thereby an edge of the annular flange 34 abutting against the inner sidewall of the base plate 11 around the annular slot 14 to firmly secure the liquid-guiding component 30 to the heat-absorbing portion 12 .
- the annular flange 34 defines a plurality of inlets 340 communicating with the second liquid passage 200 , and located around a circumference of the body 32 .
- the inlets 340 are ached-shape and evenly distributed in the annular flange 34 around the body 32 .
- the outlet and inlets 320 , 340 are connected to the pump (not shown) via conduits (not shown) to construct a flow circulation for the working liquid.
- the annular flange 34 defines a cutout 342 in an outer edge thereof, corresponding to the protrusion 16 of the heat exchanger 10 .
- the bottom surface of the heat-absorbing portion 12 of the heat exchanger 10 absorbs heat from the heat generating component.
- the heat in the bottom of the heat-absorbing portion 12 is upwardly transmitted to the top of the heat-absorbing portion 12 along the sidewalls of the heat-absorbing portion 12 .
- Liquid enters the second liquid passage 200 through the inlets 340 of the liquid-guiding component 30 to sufficiently contact the inner sidewalls of the heat-absorbing portion 12 and an inner surface of the bottom of the heat-absorbing portion 12 .
- the liquid then flows into the first liquid passage 100 through the bottom of the heat-absorbing portion 12 and finally leaves the body 32 of the liquid-guiding component 30 from the outlet 320 to take away the heat in the heat-absorbing portion 12 .
- the liquid-guiding component 30 guides the liquid to flow along the inner sidewalls of the heat-absorbing portion 12 towards the bottom of the heat-absorbing portion 12 in the second liquid passage 200 , the liquid can have a sufficiently contacting area with the inner sidewall of the heat-absorbing portion 12 .
- the heat in the inner sidewalls of the heat-absorbing portion 12 can be quickly taken away by the liquid, whereby heat exchange efficiency between the inner sidewalls of the heat-absorbing portion 12 and the liquid is improved to quickly cool the heat generating component attached to the bottom of the heat-absorbing portion 12 .
- the liquid cooling device comprises a heat exchanger 50 and a liquid-guiding component 40 engaging with the heat exchanger 50 .
- the heat exchanger 50 comprises a base plate 51 and a heat-absorbing portion 52 protruding downwardly and perpendicularly from the base plate 51 .
- the base plate 51 defines an annular slot 54 around the heat-absorbing portion 52 .
- the heat-absorbing portion 52 defines a plurality of annular grooves 520 in an inner sidewall along a circumference thereof, for increasing a contacting area between the liquid and the inner sidewall of the heat-absorbing portion 52 .
- the liquid-guiding component 40 comprises a hollow cylindrical body 42 defining an outlet 420 at a top end thereof.
- the first liquid passage 100 is defined through the body 42 of the liquid-guiding component 40 .
- the second liquid passage 200 is defined between an outer sidewall of the body 42 of the liquid-guiding component 40 and the inner sidewall of the heat-absorbing portion 52 .
- the fixing portion such as a fixing plate 44 extends horizontally and outwardly from an outer edge of the body 42 .
- a plurality of spaced tongues 440 extends horizontally and outwardly from an outer edge of the fixing plate 44 .
- the fixing plate 44 has a thickness smaller than a depth of the annular slot 54 and an outer diameter smaller that of the annular slot 54 , thereby defining an inlet 430 between the inner sidewall of the base plate 51 and the outer edge of the fixing plate 44 .
- a third liquid passage 300 is defined between a lower surface of the fixing plate 44 and a bottom of the annular slot 54 . The third liquid passage 300 is communicated with the inlet 430 and the second liquid passage 200 .
- the liquid firstly enters the third liquid passage 300 via the inlet 430 , flows towards the second liquid passage 200 to sufficiently contact the inner sidewalls of the heat-absorbing portion 52 , flows into the first liquid passage 100 through a bottom of an inside of the heat-absorbing portion 52 , then leaves the body 42 of the liquid-guiding component 40 from the outlet 420 to take away heat in the heat-absorbing portion 52 .
- the liquid cooling device comprises a heat exchanger 70 and a liquid-guiding component 60 engaging with the heat exchanger 70 .
- the heat exchanger 70 comprises a base plate 71 and a heat-absorbing portion 72 protruding downwardly and perpendicularly from the base plate 71 .
- the heat-absorbing portion 72 defines a plurality of annular grooves 720 in an inner sidewall along a circumference thereof, for enhancing a roughness of the inner sidewall of the heat-absorbing portion 72 and increasing a contacting area between the liquid and the inner sidewall of the heat-absorbing portion 72 .
- the liquid-guiding component 60 comprises a hollow body 62 defining an inlet 620 at a top end thereof and an annular flange 64 extending from the body 62 .
- the annular flange 64 defines a plurality of spaced outlets 640 therein around the body 62 .
- the first liquid passage 100 is defined through the body 62 of the liquid-guiding component 60 .
- the second liquid passage 200 is defined between an outer sidewall of the body 62 of the liquid-guiding component 60 and the inner sidewall of the heat-absorbing portion 72 .
- the body 62 has a cylindrical configuration with a gradually decreased cross section from top to bottom thereof, whereby the second liquid passage 200 has a cross section gradually increased from top to bottom of the heat-absorbing portion 72 .
- the body 62 of the liquid-guiding component 60 functions as a tapered nozzle, which is inserted into the heat-absorbing portion 72 to impinge the liquid onto a center of the bottom of the heat-absorbing portion 72 and increase the jet speed of the liquid in entering the second liquid passage 200 .
- the liquid firstly enters the first liquid passage 100 via the inlet 620 , travels in the second liquid passage 200 through a bottom of an inside of the heat-absorbing portion 72 , then leaves the heat-absorbing portion 72 from the outlet 640 to take away heat in the heat-absorbing portion 72 .
Abstract
Description
- 1. Technical Field
- The present disclosure relates generally to cooling devices and, more particularly, to a liquid-cooling device for dissipating waste heat generated by electrical or electronic components and assemblies.
- 2. Description of Related Art
- Nowadays, various cooling devices are used to remove heat from electrical or electronic components which generate a large amount of heat during operation. Metallic heat sinks with fins, heat exchangers utilizing phase-change, or liquid cooling devices are in most common use.
- A typical liquid cooling system comprises a heat absorbing unit for absorbing heat from a heat source, and a heat dissipating unit which defines a cavity filled with liquid. The liquid conducts heat exchange with the heat absorbing unit, thereby taking away the heat from the heat absorbing unit when the liquid is circulated. However, when the liquid directly flows in the cavity of the heat dissipating unit without any liquid-guiding component, the liquid only produces a smooth flowing in the cavity along inner surfaces of the heat dissipating unit. The liquid fails to sufficiently contact with the inner surfaces of heat dissipating unit and heat exchanger between the liquid and the inner surfaces of the heat dissipating unit is limited. Accordingly, the liquid cooling system has a lower work performance.
- What is needed, therefore, is a liquid cooling device which has a high work performance.
- Other advantages and novel features of the disclosure will become more apparent from the following detailed description of an embodiment/embodiments when taken in conjunction with the accompanying drawings.
-
FIG. 1 is an isometric, assembled view of a liquid-cooling device in accordance with a first embodiment of the present disclosure. -
FIG. 2 is a view similar toFIG. 1 , wherein a part of the liquid-cooling device is cut off for clarity. -
FIG. 3 is an exploded view of the liquid-cooling device ofFIG. 1 . -
FIG. 4 is an exploded view of a liquid-cooling device in accordance with a second embodiment of the present disclosure. -
FIG. 5 is an isometric view of the liquid-cooling device ofFIG. 4 , wherein a part of the liquid-cooling device is cut away for clarity. -
FIG. 6 is an isometric view of a liquid-cooling device in accordance with a third embodiment of the present disclosure, wherein a part of the liquid-cooling device is cut away for clarity. -
FIG. 7 is an exploded view of the liquid-cooling device ofFIG. 6 . - Referring to
FIGS. 1-3 , a liquid-cooling device in accordance with a first embodiment of the disclosure is especially useful in efficiently dissipating heat from a heat generating component (not shown), and more particularly to a part of the heat generating component, which is located at a lower position. The liquid cooling device comprises aheat exchanger 10 and a liquid-guidingcomponent 30 engaged with theheat exchanger 10. - Particularly referring to
FIGS. 2-3 , theheat exchanger 10 is made of thermally conductive material such as copper or aluminum, and substantially T-shaped in profile having a large top surface and a small bottom surface. Theheat exchanger 10 comprises abase plate 11 having a large top surface and a heat-absorbingportion 12 protruding downwardly and perpendicularly from a center of a bottom surface of thebase plate 11. Thebase plate 11 is used for holding a pump (not shown) thereon. The heat-absorbingportion 12 has a column-like configuration with a rectangular cross section, although it is not limited to such configuration and cross section. The heat-absorbingportion 12 comprises a small bottom surface (not labeled) used for contacting the heat generating component (not shown). The heat-absorbingportion 12 defines acylindrical cavity 120 in a center thereof and thebase plate 11 defines anannular slot 14 surrounding and communicating with thecavity 120. An annular inner sidewall defining theslot 14 is adjacent to an annular inner sidewall defining thecavity 120. Theslot 14 is configured for engaging the liquid-guidingcomponent 30. Thecavity 120 is provided for filling the liquid therein. Aprotrusion 16 extends horizontally and inwardly from the inner sidewall defining theslot 14, for facility of an external tool (not shown) to operate on the liquid-guidingcomponent 30. - The liquid-guiding
component 30 comprises a hollowcylindrical body 32 and anannular flange 34 surrounding thebody 32. Thebody 32 defines a firstliquid passage 100 therethrough and anupper outlet 320 communicating with the firstliquid passage 100. An outer diameter of thebody 32 is less than a diameter of thecavity 120 of the heat-absorbingportion 12, whereby a secondliquid passage 200 is defined between an outer sidewall of thebody 32 of the liquid-guidingcomponent 30 and an inner sidewall of the heat-absorbingportion 12. A bottom end of thebody 32 is spaced from a bottom of thecavity 120, whereby the secondliquid passage 200 is communicated with the firstliquid passage 100. Theflange 34 extends horizontally and outwardly from an outer circumference of thebody 32. Theannular flange 34 has an outer diameter similar to that of theannular slot 14, thereby an edge of theannular flange 34 abutting against the inner sidewall of thebase plate 11 around theannular slot 14 to firmly secure the liquid-guidingcomponent 30 to the heat-absorbingportion 12. Theannular flange 34 defines a plurality ofinlets 340 communicating with the secondliquid passage 200, and located around a circumference of thebody 32. Theinlets 340 are ached-shape and evenly distributed in theannular flange 34 around thebody 32. The outlet andinlets annular flange 34 defines acutout 342 in an outer edge thereof, corresponding to theprotrusion 16 of theheat exchanger 10. - In operation of the liquid cooling device, the bottom surface of the heat-absorbing
portion 12 of theheat exchanger 10 absorbs heat from the heat generating component. The heat in the bottom of the heat-absorbingportion 12 is upwardly transmitted to the top of the heat-absorbingportion 12 along the sidewalls of the heat-absorbingportion 12. Liquid enters the secondliquid passage 200 through theinlets 340 of the liquid-guidingcomponent 30 to sufficiently contact the inner sidewalls of the heat-absorbingportion 12 and an inner surface of the bottom of the heat-absorbingportion 12. The liquid then flows into the firstliquid passage 100 through the bottom of the heat-absorbingportion 12 and finally leaves thebody 32 of the liquid-guidingcomponent 30 from theoutlet 320 to take away the heat in the heat-absorbingportion 12. - Since the liquid-guiding
component 30 guides the liquid to flow along the inner sidewalls of the heat-absorbingportion 12 towards the bottom of the heat-absorbingportion 12 in the secondliquid passage 200, the liquid can have a sufficiently contacting area with the inner sidewall of the heat-absorbingportion 12. The heat in the inner sidewalls of the heat-absorbingportion 12 can be quickly taken away by the liquid, whereby heat exchange efficiency between the inner sidewalls of the heat-absorbingportion 12 and the liquid is improved to quickly cool the heat generating component attached to the bottom of the heat-absorbingportion 12. - Referring to
FIGS. 4-5 , a liquid-cooling device in accordance with another exemplary embodiment of the disclosure is shown. The difference between this embodiment and the previous embodiment is that the liquid cooling device comprises aheat exchanger 50 and a liquid-guidingcomponent 40 engaging with theheat exchanger 50. Theheat exchanger 50 comprises abase plate 51 and a heat-absorbingportion 52 protruding downwardly and perpendicularly from thebase plate 51. Thebase plate 51 defines anannular slot 54 around the heat-absorbingportion 52. The heat-absorbingportion 52 defines a plurality ofannular grooves 520 in an inner sidewall along a circumference thereof, for increasing a contacting area between the liquid and the inner sidewall of the heat-absorbingportion 52. The liquid-guidingcomponent 40 comprises a hollowcylindrical body 42 defining anoutlet 420 at a top end thereof. The firstliquid passage 100 is defined through thebody 42 of the liquid-guidingcomponent 40. The secondliquid passage 200 is defined between an outer sidewall of thebody 42 of the liquid-guidingcomponent 40 and the inner sidewall of the heat-absorbingportion 52. The fixing portion, such as afixing plate 44 extends horizontally and outwardly from an outer edge of thebody 42. A plurality of spacedtongues 440 extends horizontally and outwardly from an outer edge of thefixing plate 44. Thefixing plate 44 has a thickness smaller than a depth of theannular slot 54 and an outer diameter smaller that of theannular slot 54, thereby defining aninlet 430 between the inner sidewall of thebase plate 51 and the outer edge of thefixing plate 44. A thirdliquid passage 300 is defined between a lower surface of thefixing plate 44 and a bottom of theannular slot 54. The thirdliquid passage 300 is communicated with theinlet 430 and the secondliquid passage 200. - In operation, the liquid firstly enters the third
liquid passage 300 via theinlet 430, flows towards the secondliquid passage 200 to sufficiently contact the inner sidewalls of the heat-absorbingportion 52, flows into the firstliquid passage 100 through a bottom of an inside of the heat-absorbingportion 52, then leaves thebody 42 of the liquid-guidingcomponent 40 from theoutlet 420 to take away heat in the heat-absorbingportion 52. - By provision of the
annular grooves 520, a roughness of the inner sidewall of the heat-absorbingportion 52 is greatly increased, whereby turbulence is generated when the liquid flows through the inner sidewall of the heat-absorbingportion 52. Thus, the liquid can sufficiently contact the inner sidewalls of the heat-absorbingportion 52. Accordingly, the heat exchange efficiency between the heat-absorbingportion 52 and the liquid is improved. - Referring to
FIGS. 6-7 , a liquid-cooling device in accordance with a third exemplary embodiment of the disclosure is shown. The difference between this embodiment and the previous embodiment is that the liquid cooling device comprises aheat exchanger 70 and a liquid-guidingcomponent 60 engaging with theheat exchanger 70. Theheat exchanger 70 comprises abase plate 71 and a heat-absorbingportion 72 protruding downwardly and perpendicularly from thebase plate 71. The heat-absorbingportion 72 defines a plurality ofannular grooves 720 in an inner sidewall along a circumference thereof, for enhancing a roughness of the inner sidewall of the heat-absorbingportion 72 and increasing a contacting area between the liquid and the inner sidewall of the heat-absorbingportion 72. The liquid-guidingcomponent 60 comprises ahollow body 62 defining aninlet 620 at a top end thereof and anannular flange 64 extending from thebody 62. Theannular flange 64 defines a plurality of spacedoutlets 640 therein around thebody 62. The firstliquid passage 100 is defined through thebody 62 of the liquid-guidingcomponent 60. The secondliquid passage 200 is defined between an outer sidewall of thebody 62 of the liquid-guidingcomponent 60 and the inner sidewall of the heat-absorbingportion 72. Thebody 62 has a cylindrical configuration with a gradually decreased cross section from top to bottom thereof, whereby the secondliquid passage 200 has a cross section gradually increased from top to bottom of the heat-absorbingportion 72. Thebody 62 of the liquid-guidingcomponent 60 functions as a tapered nozzle, which is inserted into the heat-absorbingportion 72 to impinge the liquid onto a center of the bottom of the heat-absorbingportion 72 and increase the jet speed of the liquid in entering the secondliquid passage 200. - In operation, the liquid firstly enters the first
liquid passage 100 via theinlet 620, travels in the secondliquid passage 200 through a bottom of an inside of the heat-absorbingportion 72, then leaves the heat-absorbingportion 72 from theoutlet 640 to take away heat in the heat-absorbingportion 72. - According to the configuration of the
body 62 with a gradually decreased cross section from top to bottom of the heat-absorbingportion 72, when a jet impinges on the bottom surface of heat-absorbingportion 72, a hydrodynamic and thermal boundary layer is very quickly formed in the impingement region due to high jet acceleration and increase in pressure. Consequently, an extremely high heat transfer coefficient is obtained within the impingement region to optimize the heat exchanging efficiency of the liquid. - It is to be understood, however, that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (13)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910301137XA CN101848624B (en) | 2009-03-25 | 2009-03-25 | Liquid cooling heat radiator |
CN200910301137.X | 2009-03-25 |
Publications (1)
Publication Number | Publication Date |
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US20100243216A1 true US20100243216A1 (en) | 2010-09-30 |
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ID=42773030
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US12/475,527 Abandoned US20100243216A1 (en) | 2009-03-25 | 2009-05-31 | Liquid-cooling device |
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US (1) | US20100243216A1 (en) |
CN (1) | CN101848624B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5720712B2 (en) * | 2013-03-22 | 2015-05-20 | トヨタ自動車株式会社 | Cooler |
WO2015163097A1 (en) * | 2015-03-30 | 2015-10-29 | 株式会社小松製作所 | Cooling liquid drain structure for cases, power storage device, and construction machine |
CN112954989B (en) * | 2021-05-18 | 2021-09-10 | 四川斯艾普电子科技有限公司 | Radar liquid cooling device |
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US2028360A (en) * | 1933-06-19 | 1936-01-21 | Logan Gear Company | Pump |
US2937855A (en) * | 1958-09-11 | 1960-05-24 | Frank D Hazen | Recuperator structures |
US3283811A (en) * | 1964-09-08 | 1966-11-08 | Babcock & Wilcox Co | Spur tube heat exchanger |
US3914633A (en) * | 1972-10-28 | 1975-10-21 | Philips Corp | X-ray tube comprising a liquid-cooled anode |
US4310303A (en) * | 1980-07-11 | 1982-01-12 | W. B. Combustion, Inc. | Plug-in recuperator and method |
US4452233A (en) * | 1982-03-04 | 1984-06-05 | Goodman Jr Maurice | Solar energy collector |
US4455504A (en) * | 1981-04-02 | 1984-06-19 | Iversen Arthur H | Liquid cooled anode x-ray tubes |
US4479534A (en) * | 1981-12-07 | 1984-10-30 | The Air Preheater Company, Inc. | Transparent radiation recuperator |
US4521903A (en) * | 1983-03-09 | 1985-06-04 | Micronix Partners | High power x-ray source with improved anode cooling |
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US4750086A (en) * | 1985-12-11 | 1988-06-07 | Unisys Corporation | Apparatus for cooling integrated circuit chips with forced coolant jet |
US5228502A (en) * | 1991-09-04 | 1993-07-20 | International Business Machines Corporation | Cooling by use of multiple parallel convective surfaces |
US5264984A (en) * | 1992-04-06 | 1993-11-23 | Nec Corporation | Cooling system for a package with electronic circuit components |
US5263536A (en) * | 1991-07-19 | 1993-11-23 | Thermo Electron Technologies Corp. | Miniature heat exchanger |
US5384687A (en) * | 1992-09-30 | 1995-01-24 | Nec Corporation | Cooling structure for electronic circuit package |
US5463528A (en) * | 1992-01-22 | 1995-10-31 | Nec Corporation | Cooling structure for integrated circuits |
US6431260B1 (en) * | 2000-12-21 | 2002-08-13 | International Business Machines Corporation | Cavity plate and jet nozzle assemblies for use in cooling an electronic module, and methods of fabrication thereof |
US6580780B1 (en) * | 2000-09-07 | 2003-06-17 | Varian Medical Systems, Inc. | Cooling system for stationary anode x-ray tubes |
US20070000656A1 (en) * | 2001-08-06 | 2007-01-04 | Kabushiki Kaisha Toshiba | Cooling device for heat-generating elements |
US20070272392A1 (en) * | 2006-05-23 | 2007-11-29 | Debashis Ghosh | Impingement cooled heat sink with low pressure drop |
-
2009
- 2009-03-25 CN CN200910301137XA patent/CN101848624B/en not_active Expired - Fee Related
- 2009-05-31 US US12/475,527 patent/US20100243216A1/en not_active Abandoned
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US2028360A (en) * | 1933-06-19 | 1936-01-21 | Logan Gear Company | Pump |
US2937855A (en) * | 1958-09-11 | 1960-05-24 | Frank D Hazen | Recuperator structures |
US3283811A (en) * | 1964-09-08 | 1966-11-08 | Babcock & Wilcox Co | Spur tube heat exchanger |
US3914633A (en) * | 1972-10-28 | 1975-10-21 | Philips Corp | X-ray tube comprising a liquid-cooled anode |
US4310303A (en) * | 1980-07-11 | 1982-01-12 | W. B. Combustion, Inc. | Plug-in recuperator and method |
US4455504A (en) * | 1981-04-02 | 1984-06-19 | Iversen Arthur H | Liquid cooled anode x-ray tubes |
US4479534A (en) * | 1981-12-07 | 1984-10-30 | The Air Preheater Company, Inc. | Transparent radiation recuperator |
US4452233A (en) * | 1982-03-04 | 1984-06-05 | Goodman Jr Maurice | Solar energy collector |
US4521903A (en) * | 1983-03-09 | 1985-06-04 | Micronix Partners | High power x-ray source with improved anode cooling |
US4561040A (en) * | 1984-07-12 | 1985-12-24 | Ibm Corporation | Cooling system for VLSI circuit chips |
US4750086A (en) * | 1985-12-11 | 1988-06-07 | Unisys Corporation | Apparatus for cooling integrated circuit chips with forced coolant jet |
US5263536A (en) * | 1991-07-19 | 1993-11-23 | Thermo Electron Technologies Corp. | Miniature heat exchanger |
US5228502A (en) * | 1991-09-04 | 1993-07-20 | International Business Machines Corporation | Cooling by use of multiple parallel convective surfaces |
US5463528A (en) * | 1992-01-22 | 1995-10-31 | Nec Corporation | Cooling structure for integrated circuits |
US5264984A (en) * | 1992-04-06 | 1993-11-23 | Nec Corporation | Cooling system for a package with electronic circuit components |
US5384687A (en) * | 1992-09-30 | 1995-01-24 | Nec Corporation | Cooling structure for electronic circuit package |
US6580780B1 (en) * | 2000-09-07 | 2003-06-17 | Varian Medical Systems, Inc. | Cooling system for stationary anode x-ray tubes |
US6431260B1 (en) * | 2000-12-21 | 2002-08-13 | International Business Machines Corporation | Cavity plate and jet nozzle assemblies for use in cooling an electronic module, and methods of fabrication thereof |
US20070000656A1 (en) * | 2001-08-06 | 2007-01-04 | Kabushiki Kaisha Toshiba | Cooling device for heat-generating elements |
US20070272392A1 (en) * | 2006-05-23 | 2007-11-29 | Debashis Ghosh | Impingement cooled heat sink with low pressure drop |
Also Published As
Publication number | Publication date |
---|---|
CN101848624A (en) | 2010-09-29 |
CN101848624B (en) | 2013-07-03 |
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Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZHOU, ZHI-YONG;DING, QIAO-LI;CAO, HAI-BING;REEL/FRAME:022756/0792 Effective date: 20090520 Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZHOU, ZHI-YONG;DING, QIAO-LI;CAO, HAI-BING;REEL/FRAME:022756/0792 Effective date: 20090520 |
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