US20100230144A1 - Disk drive suspension via formation using a tie layer and product - Google Patents
Disk drive suspension via formation using a tie layer and product Download PDFInfo
- Publication number
- US20100230144A1 US20100230144A1 US11/340,298 US34029806A US2010230144A1 US 20100230144 A1 US20100230144 A1 US 20100230144A1 US 34029806 A US34029806 A US 34029806A US 2010230144 A1 US2010230144 A1 US 2010230144A1
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- United States
- Prior art keywords
- layer
- aperture
- disk drive
- stainless steel
- drive suspension
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09554—Via connected to metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/16—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation by cathodic sputtering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4076—Through-connections; Vertical interconnect access [VIA] connections by thin-film techniques
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
Abstract
Description
- This application claims the benefit of U.S. Provisional Application Ser. No. 60/715,854, filed Sep. 9, 2005.
- 1. Field of the Invention
- This invention relates to disk drive suspensions, and more particularly, to improvements in the manufacture of disk drive suspension interconnects to secure better electrical grounding of suspension components such as copper circuit layers to grounded portions of the suspension such as stainless steel layers, to enable increased numbers of copper circuit layers, and further relates to suspension products thus manufactured. In particular, a method is provided to connect the copper circuitry of a component such as a slider with the stainless steel part of the suspension interconnect using vias modified in manufacture to have better electrical connection than available heretofore. In one aspect, the invention provides optimal performance in hard disk drive sliders by improving the electrical grounding thereof through a via having a copper conductor bonded to a stainless steel layer using a tie layer of chromium and optionally a copper flash layer as well.
- 2. Description of the Related Art
- Disk drive suspension interconnects, such as Integrated Lead Suspensions (ILS) for hard disk drives typically have three layers, including a stainless steel foil that provides mechanical properties for the suspension, two or more conductive traces comprising gold plated, patterned copper conductive circuits paths that provide the electrical connection between the read/write head slider and the termination pads of the suspension, and a dielectric layer that provides electrical insulation between the stainless steel foil and the conductive traces.
- It is known to be desirable to ground various components of a disk drive suspension such as the body of the read/write head slider. One of the major challenges in the design of hard disk drive suspensions is attaining a suitable, reliable grounding connection between the conductive copper traces connected electrically to the slider and the underlying stainless steel foil layer given the limited space available to make the connection. The difficulty of bonding to stainless steel and dissimilarity of the metals (Cu, Au, SST) pose additional significant challenges to creating a reliable grounding of the slider, but reliable grounding is essential to maintaining the signal fidelity between the read/write head and amplifier.
- Among the prior art approaches to solving the slider grounding problem is creating a hole in the dielectric between the slider and the stainless steel foil, typically 25 μm deep, and filling the hole with conductive adhesive to provide an electrical connection between the slider and the stainless steel. This approach is deficient, however, since conductive adhesive connections are typified by very high interconnect resistance resultant from the passive (self-healing) nature of the stainless steel and the lack of a conductive, fully metallic bond between the steel layer and the conductive adhesive. High interconnect resistance limits the quality of the electrical connection to ground and thus slider performance dependent on a good grounding is degraded.
- Another approach to slider grounding uses a spanning lead that extends from the slider, beyond the edge of the dielectric layer and opposite the stainless steel layer where it is subsequently bent over onto the stainless steel layer and electrically and mechanically affixed there, using, typically, a conductive polymer. Spanning leads are very fragile and can be easily mis-bent during manufacture causing lowered manufacturing yields. Further, even if perfectly accomplished, the process of physically bending and adhering leads to the stainless steel suspensions is a very labor-intensive process that does not lend itself to high-volume, low-cost manufacturing, such as simultaneous gang bonding of multiple suspensions.
- In both of these prior art processes the presence of conductive adhesives can cause increased drive contamination that may adversely affect drive reliability, and their use is environmentally undesirable for workers.
- It is an object of the invention to provide in disk drive suspension interconnects a highly conductive connection between e.g. copper/gold and stainless steel components of a disk drive suspension. It is a further object to provide novel and improved methods of manufacturing disk drive suspensions having this highly conductive connection using conductive adhesive-free, metallized vias extending between the copper/gold and stainless steel components of a disk drive suspension. A further object is to ground a disk drive suspension slider to a stainless steel layer using the novel vias of the invention. Yet another object is the manufacture of disk drive suspension interconnects with stainless steel layer grounded components using vias having an improved, low resistance electrical connection. A further object comprises a metallizing modification of the vias to enhance copper/stainless steel bonding and electrical connection thereby. A further object is to facilitate addition of further circuit layers through the effective use of the invention via technology. A further object is to provide substantially planar via openings to enhance the bond-affixing of other components.
- These and other objects to become apparent hereinafter are realized in accordance with the invention method of manufacturing a disk drive suspension interconnect comprising a metal grounding layer, a metal conductive layer and an insulative layer between the metal grounding layer and the conductive metal layer, and a circuit component electrically connected to the conductive layer, that includes defining a grounding path from the circuit component and the conductive layer to the metal grounding layer through an aperture in the insulative layer, depositing a tie layer through the insulative layer onto the grounding layer in bonding relation with the ground layer, and depositing a conductor onto both the conductive metal layer and the tie layer in conductive metal layer and tie layer bonding relation, whereby the circuit component is bonded to the grounding layer by the conductor.
- In this and like embodiments, typically, the method includes selecting a stainless steel material as the grounding layer, selecting a copper material as the metal conductive layer, selecting a synthetic organic polymer as the insulative layer, such as a polyimide, selecting a copper material as the conductor, selecting a chromium material as the tie layer, depositing a seed copper material layer with the tie layer, electrodepositing a copper material layer with the seed copper material layer, and selecting a slider as the circuit component.
- The invention further provides a disk drive suspension interconnect comprising a metal grounding layer, a metal conductive layer and an insulative layer between the metal grounding layer and the conductive metal layer, and a circuit component electrically connected to the conductive layer, the insulative layer defining an aperture providing a grounding path from the circuit component and the conductive layer to the metal grounding layer, a tie layer bonded to the grounding layer within the aperture, and a conductor bonded to the grounding layer through the tie layer and to the conductive metal layer in circuit component grounding bonding relation.
- In this and like embodiments, typically, the grounding layer comprises stainless steel, the metal conductive layer comprises copper, the insulative layer comprises a synthetic organic polymer, such as a polyimide, the conductor comprises copper, the tie layer comprises chromium, there is also a seed layer comprising copper within the aperture and a copper layer electrodeposited onto the copper seed layer, and the circuit component comprises a slider.
- The invention will be further described in conjunction with the attached drawings in which:
-
FIGS. 1 through 11 are stages of a process flow according to the invention method with the via configurations modified for illustrative purposes; -
FIG. 12 is a view likeFIG. 11 , but of a more typical configuration of the via realized in accordance with the invention; -
FIG. 13 is a bottom plan view of a disk drive suspension interconnect according to the invention; and -
FIG. 14 is a top plan view thereof. - The invention provides a simpler and more economical solution than those criticized above for manufacturing suspension interconnects having a reliable electrical connection between the circuit components to be grounded and the grounding layer of a stainless steel foil by creating a metallized via between them. It is well known that there are inherent difficulties in making electrical connections to stainless steel. In the invention, however, these difficulties are avoided or obviated by using a sputtered tie layer such as chromium that can be used to attach a conductor, e.g. copper, attached to a component, e.g. a slider, to a ground such as stainless steel.
FIGS. 1-11 show the invention process flow for creating a metal via between the copper circuit and stainless steel layers on a hard disk drive suspension interconnect. - The invention provides a disk drive suspension interconnect having one or more vias connecting electrical components connected or grounded to a ground layer through an insulative layer.
- With reference to the drawings,
FIGS. 1-14 show theinterconnect 12 product and the process of forming the interconnect. The process begins inFIG. 1 with asubstrate 14 comprisingstainless steel 16 and a typically polyimide or polyester electricallyinsulative layer 18 that can be cast directly onto the stainless steel. InFIG. 2 , ahole 22 where thevia 24 is to be formed is shaped as anaperture 26 projecting not more than about 5 microns, mechanically by laser drilling, or chemically by etching, or otherwise, along with any fiducials (not shown) deemed to be needed into thepolyimide layer 18, e.g. at a wall slope of preferably about 75 degrees and ranging from about 50 to 60 degrees to about 85 to 90 degrees provided the slope is such that sputtering can be effectively performed to metallize the via. InFIG. 3 the resulting apertured laminateinsulative layer 18 is plasma or otherwise cleaned to remove any scum layer left at the bottom of the intended via 24.Hole 22 is relatively small in diameter enabling placement of several on a typically quitesmall suspension interconnect 12. - In
FIG. 4 , achromium tie layer 28 is sputtered or otherwise deposited onto theinsulative layer 18 and intoaperture 26. “Chromium” herein includes alloys of chromium in which chromium is the largest single constituent by weight. Monels are useful. Preferably acopper seed layer 32 is further added on top of thepolyimide layer 18 andseed layer 28 and down into theaperture 26 from which thevia 24 is to be made. Typically achromium tie layer 32 will be used and will be between 100 Å and 800 Å thick. Thecopper seed layer 32 when used typically will be between 500 Å and 1500 Å thick. - In
FIG. 5 , athin layer 34 of copper (including alloys of copper) is electrodeposited in those cases where subsequent high speed plating will be carried out, as the presence of a flash platedcopper layer 34 tends to build up thecopper seed layer 32 thickness and provide a copper build-up to a thickness between 1 μm and 5 μm which is desirable for high speed copper plating. - In
FIG. 6 aphotoresist layer 36 is deposited on top of the tie, seed andelectrodeposit layers - In
FIG. 7 , after reregistering, thephotoresist layer 36 is exposed and developed in amanner leaving openings 38 in the resist layer where circuit features are to be connected to ground. - In
FIG. 8 ,openings 38 in thephotoresist layer 36 are finally copper plated, e.g. to form acopper plate 42 having a thickness of about 5 to about 15 μm from which suspension interconnect conductive layer comprisingconductive traces 44 is formed. - In
FIG. 9 , thephotoresist layer 36 is stripped to expose the flash platedcopper layer 34. - In
FIG. 10 , a flash etch locally removes the exposedchromium tie layer 26,copper seed layer 28, and electrodepositedflash copper 28, where used, so that remaining thecopper circuit features 40 are electrically isolated. Suitable etchants for the etch step include potassium permanganate for the chromium tie layer and cupric chloride for the copper layers - In
FIG. 11 , thecopper features 40 are plated withgold layer 46 producing the metallized via 38 of the invention. - In
FIG. 12 , a more typical configuration of the via is depicted with like numerals to those numerals inFIGS. 1-11 for like parts. - With further reference to
FIGS. 12 and 13 ,suspension interconnect 12 comprises aflexible circuit 48 of typically asubstrate 14 comprising a stainlesssteel metal layer 16 and a cast coating of apolyimide layer 18 andconductive traces 44 formed from thecopper plate layer 42.Suspension interconnect 12 includes aflexure 50 formed from thesubstrate metal layer 16 to have aframe 52 and atongue 54 supporting aslider 60 electrically connected to the conductive traces 44 at 58. For purposes of grounding acircuit component 56 such as theslider 60 tometal layer 16, via 24 connects agrounding lead 62 extending from the slider to the via and through the metallized via to the stainlesssteel metal layer 16 which is itself grounded by means not shown. - Thus, the invention method of manufacturing a disk
drive suspension interconnect 12 comprising ametal grounding layer 16, a metal conductive layer comprisingtrace conductors 44 and an insulative layer such aspolyimide layer 18 between the metal grounding layer and the conductive metal layer, and acircuit component 58 such as aslider 60 electrically connected to the conductive layer traces, includes defining agrounding path 64 from the circuit component and the conductive layer to the metal grounding layer through anaperture 26 in the insulative layer, depositing atie layer 28 through the insulative layer onto the grounding layer in bonding relation with the grounding layer, and depositing aconductor 42 onto both the conductive metal layer and the tie layer in conductive metal layer and tie layer bonding relation, whereby the circuit component is bonded to the grounding layer by the conductor. - In a further embodiment, a disk
drive suspension interconnect 12 is provided comprising ametal grounding layer 16, a metalconductive layer 42 and aninsulative layer 18 between the metal grounding layer and the conductive metal layer, and acircuit component 58 electrically connected to the conductive layer, the insulative layer defining anaperture 26 providing agrounding path 64 from the circuit component and the conductive layer to the metal grounding layer, atie layer 28 bonded to the grounding layer within the aperture, and aconductor 42 bonded to the grounding layer through the tie layer and to the conductive metal layer in circuit component grounding bonding relation. - In the foregoing embodiments, the method further includes selecting a stainless steel material as the
grounding layer 16, selecting a copper material as the metalconductive layer 42, selecting a synthetic organic polymer as theinsulative layer 18, such as a polyimide, selecting a chromium material as thetie layer 26, depositing a seedcopper material layer 28 with the tie layer, electrodepositing acopper material layer 34 with the seed copper material layer, and selecting aslider 60 as thecircuit component 56. Copper, a copper material, chromium, a chromium material, stainless steel or a stainless steel material, etc. herein includes materials in which the named element or alloy is the largest single constituent by weight. - The invention thus provides in disk drive suspension interconnects a highly conductive connection between e.g. copper/gold and stainless steel components of a disk drive suspension, novel and improved methods of manufacturing disk drive suspension interconnects having this highly conductive connection using conductive adhesive-free, metallized vias extending between the copper/gold and stainless steel components of a disk drive suspension for grounding, in a particular case, a disk drive suspension slider to a stainless steel layer using the novel vias of the invention. The invention further provides a method for the manufacture of disk drive suspension interconnects with stainless steel layer grounded components using vias having an improved, low resistance electrical connection, specifically, metallized, modified vias to enhance copper/stainless steel bonding and electrical connection of suspension components thereby.
- The foregoing objects are thus met.
Claims (21)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/340,298 US7781679B1 (en) | 2005-09-09 | 2006-01-26 | Disk drive suspension via formation using a tie layer and product |
US11/485,912 US7829793B2 (en) | 2005-09-09 | 2006-07-13 | Additive disk drive suspension manufacturing using tie layers for vias and product thereof |
US12/540,870 US8395866B1 (en) | 2005-09-09 | 2009-08-13 | Resilient flying lead and terminus for disk drive suspension |
US12/623,983 US8553364B1 (en) | 2005-09-09 | 2009-11-23 | Low impedance, high bandwidth disk drive suspension circuit |
US14/037,154 US8982512B1 (en) | 2005-09-09 | 2013-09-25 | Low impedance, high bandwidth disk drive suspension circuit |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US71585405P | 2005-09-09 | 2005-09-09 | |
US11/340,298 US7781679B1 (en) | 2005-09-09 | 2006-01-26 | Disk drive suspension via formation using a tie layer and product |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/485,912 Continuation-In-Part US7829793B2 (en) | 2005-09-09 | 2006-07-13 | Additive disk drive suspension manufacturing using tie layers for vias and product thereof |
Publications (2)
Publication Number | Publication Date |
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US7781679B1 US7781679B1 (en) | 2010-08-24 |
US20100230144A1 true US20100230144A1 (en) | 2010-09-16 |
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US11/340,298 Active 2028-08-30 US7781679B1 (en) | 2005-09-09 | 2006-01-26 | Disk drive suspension via formation using a tie layer and product |
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US9236070B1 (en) * | 2014-08-18 | 2016-01-12 | Nitto Denko Corporation | Dual opposing cantilever pads of suspension flexure |
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